Conductive double-sided adhesive assembly for flat panel motherboard conduction and production process thereof

Abstract

The application relates to a conductive double-sided adhesive assembly for the conduction of a tablet mainboard and a production process thereof. The conductive double-sided adhesive assembly comprises a conductive double-sided adhesive layer sandwiched between the release surfaces of a first release film and a second release film. The conductive double-sided adhesive layer comprises X-direction conductive double-sided adhesive strips and Y-direction conductive double-sided adhesive strips which are segmented into thin strips. Through the production process combining high-speed rotary die cutting and asynchronous die cutting, a piece of conductive double-sided adhesive material tape is initially cut by asynchronous die cutting to form a first conductive double-sided adhesive strip arranged in the Y direction at intervals. Then, the X-direction conductive double-sided adhesive blocks are segmented from a second conductive double-sided adhesive material tape segmented in advance. After the X-direction conductive double-sided adhesive blocks are arranged in an interlaced manner with the Y-direction first conductive double-sided adhesive strips, the Y-direction conductive double-sided adhesive strips and the X-direction conductive double-sided adhesive strips are uniformly die cut and arranged to form the required Y-direction conductive double-sided adhesive strips and X-direction conductive double-sided adhesive strips. The generated conductive double-sided adhesive tape waste is very small, the raw materials are extremely saved, the position degree is better, the precision is higher, and the comprehensive cost is greatly reduced.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of composite materials for electronic products and die-cut production process, and particularly relates to a conductive double-sided adhesive assembly for the conduction of a tablet computer mainboard and a production process thereof. BACKGROUND

[0002] A large number of precise conductive double-sided adhesive assemblies are used in electronic products such as tablet computers. Since the main material is expensive conductive double-sided adhesive, the product may be combined with multiple conductive double-sided adhesive tapes on a whole PET release film according to specific requirements, and each conductive double-sided adhesive tape has strict position requirements. The traditional manual assembly after separate production cannot meet the market demand in terms of efficiency, and the position of the small conductive adhesive tape in the assembly is out of tolerance, and the overall pass rate is low. Moreover, a large amount of conductive adhesive tape waste is generated during the production of the conductive adhesive tape in the assembly, resulting in extremely low utilization rate of the expensive conductive adhesive tape, high overall cost of the product, and inability to meet the market requirements of saving raw materials and reducing costs. SUMMARY

[0003] The present application aims to solve the above problems and provides a conductive double-sided adhesive assembly for the conduction of a tablet computer mainboard and a production process thereof, which solves the problems of low utilization rate of raw materials, high cost, low production efficiency, poor assembly position, and low precision of the conductive double-sided adhesive assembly.

[0004] The present application is achieved by the following technical scheme: a conductive double-sided adhesive assembly for the conduction of a tablet computer mainboard, which comprises a conductive double-sided adhesive layer clamped between the release surfaces of a first release film and a second release film, the conductive double-sided adhesive layer comprises X-direction conductive double-sided adhesive strips and Y-direction conductive double-sided adhesive strips divided into strip shapes, and a double-sided adhesive block is further provided in a region without conductive double-sided adhesive at one end between the first release film and the second release film; a plurality of first positioning holes are further formed on the outer side of the Y-direction conductive double-sided adhesive strips at the length direction side edge of the first release film; a single-sided adhesive strip along the width direction is further compounded on the outer surface of the protruding part of the second release film protruding from both ends of the first release film, and a second positioning hole penetrating the second release film and the single-sided adhesive strip is further provided.

[0005] The Y-direction conductive double-sided adhesive strips are divided into two groups and distributed on both sides of the assembly unit along the length direction of the assembly and the width direction of the material belt, and the X-direction conductive double-sided adhesive strips are divided into seven groups and distributed in the range between the two groups of Y-direction conductive double-sided adhesive strips of the assembly unit along the length direction of the assembly and the width direction of the material belt.

[0006] The application also provides a production process of the conductive double-sided adhesive assembly for the conductive flat computer mainboard, which is performed by using a high-speed rotary die cutting machine and comprises the following steps:

[0007] Step a, a first bottom protection film tape is compounded under a first release film tape, the first conductive double-sided adhesive tape is intermittently cut on the first release film tape through an asynchronous die cutting roller group, the first conductive double-sided adhesive strips arranged at equal intervals are formed on the first release film tape, then the release film on the first conductive double-sided adhesive strips is removed through a first waste adhesive tape removal device, at this time, the first bottom protection film tape, the first release film tape and the first conductive double-sided adhesive strips arranged at equal intervals are sequentially arranged from bottom to top, the first release film tape runs along the X direction, and the length direction of the first conductive double-sided adhesive strips is arranged along the Y direction; in addition, three first positioning mark lines, i.e. the A1 mark line, the A2 mark line and the A3 mark line in the first release film tape are formed during the asynchronous die cutting, so as to visually position and align during the processing; Figure 4-1

[0008] Step b, a second bottom protection film tape, a first transition release film tape, a double-sided adhesive tape and a second transition release film tape are sequentially compounded from bottom to top, the double-sided adhesive tape is die cut through a first circular knife die cutting roller group, two annular contour lines are formed on the double-sided adhesive tape, the inner annular contour line cuts through the first transition release film tape, the inner annular waste is attached to the second bottom protection film tape, the outer annular contour line cuts through the double-sided adhesive tape, and a second positioning mark line, i.e. the B2 mark line in the first transition release film tape is formed, which corresponds to the A1 mark line; the second transition release film waste between the outer annular and the inner annular is removed through a second waste adhesive tape removal device, the second transition release film tape and the double-sided adhesive tape waste outside the outer annular are peeled off, the double-sided adhesive blocks arranged at equal intervals in the form of a ring are formed on the first transition release film tape, the tape is turned over through a first turnover roller, then the double-sided adhesive blocks in the form of a ring are compounded to the first release film tape and arranged to be staggered with the first conductive double-sided adhesive strips through the compounding of the first conductive double-sided adhesive strips and the first release film tape in step a from above; the second bottom protection film tape and the first transition release film tape are removed from above, at this time, the first bottom protection film tape, the first release film tape, the first conductive double-sided adhesive strips arranged at equal intervals and the double-sided adhesive blocks in the form of a ring are sequentially arranged from bottom to top;

[0009] ​Step c, peel off the film of the corresponding number of second conductive double-sided adhesive tape strips from the second conductive double-sided adhesive tape strip set, and then composite the third transition release film tape on the second conductive double-sided adhesive tape strip set. Then peel off the paper of the second conductive double-sided adhesive tape strip, and then composite the fourth transition release film tape on the second conductive double-sided adhesive tape strip. Then, through the second circular knife die roller group, the fourth transition release film waste on the X-direction conductive double-sided adhesive block and the peripheral fourth transition release film tape are removed. Then, through the third turnover roller, the composite tape is combined with the composite tape from step b, and the X-direction conductive double-sided adhesive block is arranged between the first conductive double-sided adhesive strips on the first release film tape.

[0010] At this time, the composite tape from bottom to top is: the first bottom protection film tape, the first release film tape, the first conductive double-sided adhesive strip arranged on the first release film tape, the X-direction conductive double-sided adhesive block, the circular ring-shaped double-sided adhesive block, and the third transition release film tape.

[0011] Step d, remove the third transition release film tape on the composite tape after step c, and then composite the fifth transition release film tape on the upper layer and the third bottom protection film tape on the bottom layer. Through the third circular knife die roller group, the knife edge of the die cutting conductive double-sided adhesive layer is cut through the conductive double-sided adhesive layer, forming the Y-direction conductive double-sided adhesive strip contour line on the first conductive double-sided adhesive strip and the X-direction conductive double-sided adhesive strip contour line on the X-direction conductive double-sided adhesive block. At the same time, a first positioning hole contour line is formed outside the Y-direction conductive double-sided adhesive strip contour line on one side, which penetrates the first release film tape and the first bottom protection film tape. The first positioning hole contour line is attached to the third bottom protection film tape and is removed together. At the same time, the conductive double-sided adhesive waste outside the Y-direction conductive double-sided adhesive strip contour line and the X-direction conductive double-sided adhesive strip contour line is peeled off from above, and the fifth transition release film waste inside the Y-direction conductive double-sided adhesive strip contour line and the X-direction conductive double-sided adhesive strip contour line is removed by the fifth waste adhesive tape. At this time, the tape from bottom to top is: the first bottom protection film tape, the first release film tape containing the first positioning hole, the first release film tape, the Y-direction conductive double-sided adhesive strip, the X-direction conductive double-sided adhesive strip, and the circular ring-shaped double-sided adhesive block.

[0012] Step e, the composite material tape after step d is cut by a fourth circular knife die roller group, the blades on the fourth circular knife die roller group form a first release film contour line on the first release film material tape, the waste of the first release film material tape outside the first release film contour line is removed, a second release film material tape is compounded above the material tape, a single-sided tape material tape is compounded on both side edges of the second release film material tape, a fourth bottom protection film material tape is compounded below the first bottom protection film material tape, the composite material tape is cut by a fifth circular knife die roller group, the blades of the fifth circular knife die roller group cut out the second release film material tape contour line on both side edges, and cut out the second positioning hole contour line through the single-sided tape material tape and the second release film material tape edge at the same time, the waste in the second positioning hole contour line is attached to the fourth bottom protection film material tape and removed together, the waste outside the second release film material tape contour line on both side edges is removed from above, and finally the first bottom protection film material tape is peeled off from below, and the product can be rolled with the release paper material tape.

[0013] In step a of the above production process, the cutter roller of the asynchronous cutting roller group is provided with a plurality of first straight blade and first positioning mark line blade which are parallel to the axial direction of the cutter roller; the length of each group of first straight blade is greater than the width of the first conductive double-sided adhesive tape, and the cutting depth is just enough to cut off the first conductive double-sided adhesive tape to form a first conductive double-sided adhesive strip; the cutting depth of the first positioning mark line blade is just enough to cut through the first release film material tape to form A1 mark line, A2 mark line and A3 mark line respectively.

[0014] In step b of the above production process, the cutter roller of the first circular knife die roller group is provided with a plurality of circular ring blades, wherein the cutting depth of the outer ring blade is just enough to cut through the double-sided adhesive tape, and the cutting depth of the inner ring blade is just enough to cut through the first transition release film material tape.

[0015] In step c of the above production process, the cutter roller of the second circular knife die roller group is provided with a plurality of first closed blades for cutting off the second conductive double-sided adhesive tape, each group of first closed blades is divided into two separate rectangular closed blades, and each rectangular closed blade is further provided with a plurality of intermittent blades arranged in the parallel direction of the material tape, the intermittent blades do not cut the second conductive double-sided adhesive tape and form intermittent mark lines on the third transition release film material tape.

[0016] In step d of the production process, the knife roller of the third circular knife die roller group is provided with Y-direction conductive double-sided adhesive tape contour line blades corresponding to the shape of the Y-direction conductive double-sided adhesive tape, X-direction conductive double-sided adhesive tape contour line blades corresponding to the shape of the X-direction conductive double-sided adhesive tape, and first positioning hole contour line blades corresponding to the shape of the first positioning hole; the die cutting depth of the Y-direction conductive double-sided adhesive tape contour line blades and the X-direction conductive double-sided adhesive tape contour line blades is just enough to cut through the first conductive double-sided adhesive tape and the X-direction conductive double-sided adhesive block, respectively; the die cutting depth of the first positioning hole contour line blades is just enough to cut through the first release film material belt; the knife roller of the fourth circular knife die roller group is provided with first release film contour line blades corresponding to the shape of the first release film; the die cutting range of each group of first release film contour line blades covers the die cutting range of a group of Y-direction conductive double-sided adhesive tape contour line blades, X-direction conductive double-sided adhesive tape contour line blades and first positioning hole contour line blades.

[0017] In the production process, the knife roller of the fifth circular knife die roller group is provided with second release film edge contour line blades corresponding to the edge contour line of the second release film material belt and second positioning hole contour line blades corresponding to the second positioning hole contour line; the die cutting depth of the second release film edge contour line blades is just enough to cut through the second release film material belt; and the die cutting depth of the second positioning hole contour line blades is just enough to cut through the first supporting protective film material belt.

[0018] The X-direction conductive double-sided adhesive tape and the Y-direction conductive double-sided adhesive tape in the conductive double-sided adhesive assembly are in a dispersed structure, and are produced by a production process combining high-speed rotary die cutting and asynchronous die cutting. The asynchronous die cutting preliminarily cuts a conductive double-sided adhesive material belt to form a first conductive double-sided adhesive tape arranged in a Y direction in a spaced arrangement. The second conductive double-sided adhesive material belt is segmented to form an X-direction conductive double-sided adhesive block. After the X-direction conductive double-sided adhesive block is arranged in an interlaced manner with the first conductive double-sided adhesive tape in the Y direction, the X-direction conductive double-sided adhesive block and the first conductive double-sided adhesive tape in the Y direction are uniformly die cut and waste is removed to form the required Y-direction conductive double-sided adhesive tape and X-direction conductive double-sided adhesive tape. The waste of the conductive double-sided adhesive tape is very small, only a small part of the peripheral edge of the Y-direction conductive double-sided adhesive tape and the X-direction conductive double-sided adhesive tape. Compared with the traditional processing method, the material of the conductive double-sided adhesive tape can be saved by at least 70% or more, the raw materials are extremely saved, manual assembly is not required, the position degree of the product after forming is better, the precision is higher, and the comprehensive cost is greatly reduced. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a schematic view of a single conductive double-sided adhesive assembly of the present application;

[0020] Figure 2 is a schematic view of a conductive double-sided adhesive assembly of the present application in a winding state;

[0021] Figure 3This is a production process flow chart of the conductive double-sided adhesive component of the present invention. In the figure, U represents a receiving roller that collects waste materials such as self-contained film, self-contained release paper, waste discharge tape, or bottom protective film.

[0022] Figures 4-1 to 4-6 This is a schematic diagram showing the unfolded blades on the cutter rollers of each die-cutting roller group in the production process of this invention. Detailed Implementation

[0023] The invention will be further illustrated below with reference to specific examples and accompanying drawings.

[0024] like Figure 1 , Figure 2 As shown, the conductive double-sided adhesive assembly for conductive tablet motherboards of the present invention includes a conductive double-sided adhesive layer 3 sandwiched between the release surfaces of a first release film 1 and a second release film 2. The conductive double-sided adhesive layer 3 includes X-direction conductive double-sided adhesive strips 31 and Y-direction conductive double-sided adhesive strips 32 divided into thin strips. At one end between the first release film 1 and the second release film 2, in a region without conductive double-sided adhesive, a double-sided adhesive block 4 is also provided. In this embodiment, the double-sided adhesive block 4 is annular. Several first positioning holes 101 are formed on one side edge of the first release film 1 along its length direction and on the outside of the Y-direction conductive double-sided adhesive strips 32. At both ends of the second release film 2, protruding from both ends of the first release film 1, and on the non-release surface of the protruding portion, single-sided adhesive strips 5 along the width direction are respectively bonded, and second positioning holes 201 penetrating the second release film 2 and the single-sided adhesive strips 5 are respectively provided.

[0025] In this embodiment, the Y-direction conductive double-sided adhesive strip 32 is divided into two groups, which are distributed on both sides of the component unit along the length direction of the component and the width direction of the strip, respectively. The X-direction conductive double-sided adhesive strip 31 is distributed along the length direction of the component and the width direction of the strip, and is divided into seven groups, which are distributed along the width direction of the component and the length direction of the strip in the range between the two groups of Y-direction conductive double-sided adhesive strips 32 of the component unit.

[0026] This invention also provides a manufacturing process for a conductive double-sided adhesive assembly for conductive tablet motherboards, using a high-speed rotary die-cutting machine. The manufacturing process includes the following steps:

[0027] Step a, combined Figure 3 , Figure 4-1As shown, the first bottom protection film tape T1 is compounded below the first release film tape L1, the first conductive double-sided adhesive tape S1 with release paper and release film on both sides is peeled off the release paper and cut into the first release film tape L1 by the asynchronous cutting roller group Y1, so that the first conductive double-sided adhesive tape S1 is formed on the first release film tape L1, and each first conductive double-sided adhesive tape S1 forms adjacent Y-direction conductive double-sided adhesive strips 32 in two adjacent components after subsequent cutting; then the release film on the first conductive double-sided adhesive tape S1 is removed by the first waste adhesive tape P1, and at this time, from bottom to top, the first bottom protection film tape T1, the first release film tape L1, and the first conductive double-sided adhesive tape S1 are sequentially compounded; the first release film tape L1 runs along the X direction, and the length direction of the first conductive double-sided adhesive tape S1 is arranged along the Y direction; in addition, three first positioning mark lines D101, i.e. A1, A2, and A3 mark lines in Figure 4-1 , are formed on the first release film tape L1 during asynchronous cutting, so as to visually position and align during processing;

[0028] Step b, as shown in Figure 3 , Figure 4-2 , from bottom to top, the second bottom protection film tape T2, the first transition release film tape G1, the double-sided adhesive tape J1, and the second transition release film tape G2 are sequentially compounded, and the double-sided adhesive tape J1 is cut by the first circular knife cutting roller group M1, so that a plurality of annular contour lines J101 are formed on the double-sided adhesive tape J1, the inner ring contour line cuts through the first transition release film tape G1, and the inner ring waste is attached to the second bottom protection film tape T2; the outer ring contour line cuts through the double-sided adhesive tape J1, and at the same time, a second positioning mark line D201, i.e. B1 mark line in , is formed on the first transition release film tape G1, which corresponds to the position of the A1 mark line, so as to align the position of the double-sided adhesive block 4 with the position of the first conductive double-sided adhesive tape; then the second transition release film waste between the outer ring and the inner ring is removed by the second waste adhesive tape P2, and the second transition release film tape G2 and the double-sided adhesive tape J1 waste outside the outer ring are peeled off, so that the double-sided adhesive block 4 is arranged in a ring shape on the first transition release film tape G1; the tape is flipped by the first flipping roller Z1, and then the double-sided adhesive block 4 is compounded to the first release film tape L1 from above and compounded to the first conductive double-sided adhesive tape; the second bottom protection film tape T2 and the first transition release film tape G1 are removed from above, and at this time, from bottom to top, the first bottom protection film tape T1, the first release film tape L1, the first conductive double-sided adhesive tape, and the double-sided adhesive block 4 are sequentially compounded;

[0029] Figure 3 Step c, as shown in Figure 4-3As shown, a corresponding number of multiple second conductive double-sided adhesive tape S2 is peeled off from the film and then compounded on the third transition release film tape G3, and then the second conductive double-sided adhesive tape S2 is peeled off from the paper and compounded with the fourth transition release film tape G4 above. In this embodiment, there are eight second conductive double-sided adhesive tapes S2, seven of which have a smaller width and one of which has a larger width. The film of the second conductive double-sided adhesive tape S2 is peeled off by the second waste adhesive tape P2 and then compounded on the third transition release film tape G3 after being turned by the second turning roller Z2. After the paper of the second conductive double-sided adhesive tape S2 is peeled off by the third waste adhesive tape P3, the fourth transition release film tape G4 is compounded. The fourth transition release film tape G4, the multiple second conductive double-sided adhesive tapes S2, and the third transition release film tape G3 are die cut by the second circular knife die roller group M2, and the die cutting depth cuts through the second conductive double-sided adhesive tape S2. An X-direction conductive double-sided adhesive block is formed on each second conductive double-sided adhesive tape S2, and a third positioning mark line D301, i.e., the C2 mark line in the figure, is formed on the third transition release film tape G3. The position of the third positioning mark line D301 corresponds to the position of the A2 mark line, so that the position of the X-direction conductive double-sided adhesive block corresponds to the position of the first conductive double-sided adhesive tape and the double-sided adhesive block. Then, the fourth transition release film waste on the X-direction conductive double-sided adhesive block is removed by the fourth waste adhesive tape P4, and the peripheral fourth transition release film tape G4 is removed. After being turned by the third turning roller Z3, the X-direction conductive double-sided adhesive block is compounded with the compounded tape from step b, and the X-direction conductive double-sided adhesive block arranged at intervals is located between the first conductive double-sided adhesive tapes on the first release film tape L1.

[0030] At this time, the compounded tape from bottom to top is: the first bottom protection film tape T1, the first release film tape L1, the first conductive double-sided adhesive tape arranged at intervals on the first release film tape L1, the multiple X-direction conductive double-sided adhesive blocks, the circular ring-shaped double-sided adhesive block 4, and the third transition release film tape G3.

[0031] Step d, combination Figure 3 , Figure 4-4As shown, the third transition release film tape G3 above the composite tape after step c is excluded, the fifth transition release film tape G5 is compounded on the upper layer, and the third bottom protection film tape T3 is compounded on the bottom layer. The third circular knife die roller set M3 is used for die cutting, the cutting depth of the knife edge of the die cutting conductive double-sided adhesive layer is just cut through the conductive double-sided adhesive layer, the Y-direction conductive double-sided adhesive strip contour line M301 is formed on the first conductive double-sided adhesive strip, and the X-direction conductive double-sided adhesive strip contour line M302 is formed on the X-direction conductive double-sided adhesive block; at the same time, two fourth positioning mark lines D401, namely the D3 mark line and the D4 mark line in the figure, are formed on the first release film tape L1, wherein the positioning intersection of the D3 mark line and the A3 mark line coincides, that is, the third circular knife die roller set M3 uses the A3 mark line to set the die cutting, so as to die cut the X-direction conductive double-sided adhesive strip 31 and the Y-direction conductive double-sided adhesive strip 32 at the correct position and form the D4 mark line for subsequent process setting; at the same time, a first positioning hole contour line M303 penetrating through the first release film tape L1 and the first bottom protection film tape T1 is also formed outside the Y-direction conductive double-sided adhesive strip contour line M301, the internal hole of the first positioning hole contour line M303 is attached to the third bottom protection film tape T3 and is excluded together; at the same time, the conductive double-sided adhesive waste outside the Y-direction conductive double-sided adhesive strip contour line M301 and the X-direction conductive double-sided adhesive strip contour line M302 is peeled off from above, and the fifth transition release film waste inside the Y-direction conductive double-sided adhesive strip contour line M301 and the X-direction conductive double-sided adhesive strip contour line M302 is excluded through the fifth waste adhesive tape P5 (in this embodiment, since the conductive double-sided adhesive strip is relatively small in size, a plurality of sixth transition release film tapes G6 are arranged to exclude the inner frame waste when the waste is excluded); at this time, the tape is sequentially from bottom to top: the first bottom protection film tape T1, the first release film tape L1 containing the first positioning hole 101, the first release film tape L1 having a plurality of Y-direction conductive double-sided adhesive strips 32 arranged in a thin strip shape, a plurality of X-direction conductive double-sided adhesive strips 31, and a circular ring-shaped double-sided adhesive block 4;

[0032] Step e, combination Figure 3 、 Figure 4-5 、 Figure 4-6 As shown, the composite tape after step d is die cut by the fourth circular knife die roller set M4, the knife edge on the first release film tape forms a first release film contour line M401, and a fifth positioning mark line D501 is formed on the first bottom protection film tape T1, that is Figure 4-5The E4 marker line and the E5 marker line in the first release film profile line M401, wherein the E4 marker line coincides with the positioning intersection of the D4 marker line, that is, the fourth circular knife die roller set M4 is positioned and die-cut by the D4 marker line, so that the first release film profile line M401 is in the correct position of the assembly, and the E5 marker line is used for subsequent die-cutting of the second release film ribbon L2; the first release film ribbon waste except the first release film profile line M401 is removed, the second release film ribbon L2 is compounded on the ribbon, a single-sided tape ribbon J2 is compounded on both side edges of the second release film ribbon L2, the fourth bottom protection film ribbon T4 is compounded below the first bottom protection film ribbon T1, and the fifth circular knife die roller set M5 is used for die-cutting the compounded ribbon, the fifth circular knife die roller set M5 is positioned by the E5 marker line on the first bottom protection film ribbon T1, the second release film ribbon L2 side edge profile line M501 is die-cut, the second positioning hole profile line M502 penetrating the single-sided tape ribbon J2 and the second release film ribbon L2 edge is die-cut, and the F5 marker line coincides with the intersection of the E5 marker line; the waste in the second positioning hole profile line M502 is attached to the fourth bottom protection film ribbon T4 and removed together, the waste outside the second release film ribbon L2 side edge profile line is removed from above, and finally the first bottom protection film ribbon T1 is peeled off from below, and the release paper ribbon L3 can be compounded before the product is wound.

[0033] In step a of the above production process, a plurality of first straight blade Y101 (eight groups in this embodiment) and three groups of first positioning marker line blade Y102 are arranged on the knife roller of the asynchronous die-cutting roller set Y1, the length of each group of first straight blade Y101 is greater than the width of the first conductive double-sided adhesive tape S1, and the die-cutting depth is just enough to cut off the first conductive double-sided adhesive tape S1 to form a first conductive double-sided adhesive strip; the die-cutting depth of the first positioning marker line blade Y102 is just enough to cut through the first release film ribbon L1 to form A1 marker line, A2 marker line, and A3 marker line;

[0034] In step b of the above production process, a plurality of circular ring blades R101 are arranged on the knife roller of the first circular knife die roller set M1, the number of groups corresponds to the number of groups of the first straight blade Y101, and the die-cutting positions are staggered; a second positioning marker line blade R102 corresponding to the second positioning marker line D201 is also arranged; the die-cutting depth of the outer ring blade is just enough to cut through the double-sided adhesive tape J1, and the die-cutting depth of the inner ring blade is just enough to cut through the first transition release film ribbon G1;

[0035] In step c of the production process, the cutter roll of the second circular knife die roll group M2 is provided with a plurality of first closed knife edges R201 for cutting the second conductive double-sided adhesive tape S2, the number of which corresponds to the number of the first linear knife edges Y101, and the die cutting positions are staggered with each other; the cutter roll is also provided with a third positioning mark line knife edge R202 corresponding to the third positioning mark line D301; in this embodiment, each group of first closed knife edges R201 is divided into two separate rectangular closed knife edges, and each rectangular closed knife edge is further provided with a plurality of intermittent knife edges R203 arranged in the parallel direction of the tape, which do not cut the second conductive double-sided adhesive tape S2 and form intermittent mark lines on the third transition release film tape G3, facilitating the observation of whether the conductive double-sided adhesive tape position deviates, so as to correct it in time. In this embodiment, at least one side of the X-direction conductive double-sided adhesive block formed by the eight second conductive double-sided adhesive tapes S2 is adjacent to the intermittent mark line formed by the intermittent knife edges R203, so that at least one side of each X-direction conductive double-sided adhesive block can use the intermittent mark line as a reference to judge whether the position deviates.

[0036] In step d of the production process, the cutter roll of the third circular knife die roll group M3 is provided with a plurality of Y-direction conductive double-sided adhesive tape contour line knife edges R301 corresponding to the shape of the Y-direction conductive double-sided adhesive tape 32, a plurality of X-direction conductive double-sided adhesive tape contour line knife edges R302 corresponding to the shape of the X-direction conductive double-sided adhesive tape 31, and a plurality of first positioning hole contour line knife edges R303 corresponding to the shape of the first positioning hole 101; the cutter roll is also provided with a fourth positioning mark line knife edge R304 corresponding to the fourth positioning mark line D401; the die cutting depth of the Y-direction conductive double-sided adhesive tape contour line knife edges R301 and the X-direction conductive double-sided adhesive tape contour line knife edges R302 is just enough to cut through the first conductive double-sided adhesive tape and the X-direction conductive double-sided adhesive block, respectively; the die cutting depth of the first positioning hole contour line knife edges R303 is just enough to cut through the first release film tape L1; the cutter roll of the fourth circular knife die roll group M4 is provided with a plurality of first release film contour line knife edges R401 corresponding to the shape of the first release film 1, and is also provided with a fifth positioning mark line knife edge R402 corresponding to the fifth positioning mark line D501; the die cutting range of each group of first release film contour line knife edges R401 includes the die cutting range of a group of Y-direction conductive double-sided adhesive tape contour line knife edges R301, X-direction conductive double-sided adhesive tape contour line knife edges R302 and first positioning hole contour line knife edges R303;

[0037] In the production process, the knife roller of the fifth rotary knife die roller group M5 is provided with a second release film edge contour line cutter edge R501 corresponding to a second release film strip edge contour line M501, a second positioning hole contour line cutter edge R502 corresponding to a second positioning hole contour line M502, and a sixth positioning mark line cutter edge R503 corresponding to a sixth positioning mark line D601; the die cutting depth of the second release film edge contour line cutter edge R501 is just enough to cut through the second release film strip L2, and the die cutting depth of the second positioning hole contour line cutter edge R502 is just enough to cut through the first bottom protection film strip T1.

[0038] The X-direction conductive double-sided adhesive tape and the Y-direction conductive double-sided adhesive tape in the conductive double-sided adhesive assembly are in a dispersed structure, and are produced by a production process combining high-speed rotary die cutting and asynchronous die cutting. The asynchronous die cutting is used to preliminarily cut a conductive double-sided adhesive strip to form a first conductive double-sided adhesive tape arranged in the Y direction in a spaced arrangement. The second conductive double-sided adhesive strip is segmented to form an X-direction conductive double-sided adhesive block, which is arranged in an interlaced manner with the first conductive double-sided adhesive tape arranged in the Y direction. Then, the X-direction conductive double-sided adhesive block and the first conductive double-sided adhesive tape arranged in the Y direction are uniformly die cut and waste is removed to form the required Y-direction conductive double-sided adhesive tape and X-direction conductive double-sided adhesive tape. In this way, the waste of the conductive double-sided adhesive tape is very small, only a small part of the peripheral edge of the Y-direction conductive double-sided adhesive tape and the X-direction conductive double-sided adhesive tape. Compared with the traditional processing method, the material of the conductive double-sided adhesive tape can be saved by at least 70% or more, the raw materials are extremely saved, manual assembly is not required, the position degree of the product after forming is better, the precision is higher, and the comprehensive cost is greatly reduced.

[0039] The above embodiments are only preferred embodiments of the present application, and are used to explain the present application, but not to limit the present application. Any change, replacement, combination, simplification, modification, etc. made by those skilled in the art without departing from the spirit and principle of the present application should be equivalent replacement, and should be included in the protection scope of the present application.

Claims

1. A manufacturing process for a conductive double-sided adhesive assembly for conductive use on a tablet computer motherboard, the conductive double-sided adhesive assembly comprising a conductive double-sided adhesive layer sandwiched between the release surface of a first release film and the release surface of a second release film, characterized in that: The conductive double-sided adhesive layer includes X-direction conductive double-sided adhesive strips and Y-direction conductive double-sided adhesive strips divided into thin strips; a double-sided adhesive block is also provided at one end between the first release film and the second release film, in a region without conductive double-sided adhesive; several first positioning holes are also formed on one edge of the first release film along its length direction and on the outside of the Y-direction conductive double-sided adhesive strips; at both ends of the second release film, protruding from both ends of the first release film, and on the non-release surface of the protruding portion, single-sided adhesive strips along the width direction are respectively laminated, and second positioning holes are respectively provided through the second release film and the single-sided adhesive strips; the Y-direction conductive double-sided adhesive strips are divided into two groups, distributed along the length direction of the component and the width direction of the strip on both sides of the component unit; the X-direction conductive double-sided adhesive strips are distributed along the length direction of the component and the width direction of the strip, and are divided into seven groups, distributed along the width direction of the component and the length direction of the strip in the range between the two groups of Y-direction conductive double-sided adhesive strips of the component unit; This production process, using a high-speed rotary die-cutting machine, is characterized by the following steps: Step a: A first bottom protective film strip is laminated below the first release film strip. The first conductive double-sided adhesive strip is intermittently cut onto the first release film strip by an asynchronous die-cutting roller group, forming equidistantly spaced first conductive double-sided adhesive strips on the first release film strip. Then, the release film attached to the first conductive double-sided adhesive strips is removed through a first row of waste adhesive tape. At this point, from bottom to top, the sequence is: first bottom protective film strip, first release film strip, and intermittently arranged first conductive double-sided adhesive strips. The first release film strip runs along the X direction, and the length direction of the first conductive double-sided adhesive strips is arranged along the Y direction. In step a, the cutter roller of the asynchronous die-cutting roller group is provided with a group of first straight blades and first positioning mark line blades parallel to the axial direction of the cutter roller. The length of each group of first straight blades is greater than the width of the first conductive double-sided adhesive strip, and its die-cutting depth is just enough to cut the first conductive double-sided adhesive strip to form a first conductive double-sided adhesive strip. The die-cutting depth of the first positioning mark line blades is just enough to cut through the first release film strip. Step b: From bottom to top, the second bottom protective film strip, the first transition release film strip, the double-sided adhesive strip, and the second transition release film strip are sequentially laminated. The double-sided adhesive strip is then die-cut using the first circular die-cutting roller group, forming several annular contour lines. The inner ring contour line cuts through the first transition release film strip, and the inner ring waste adheres to the second bottom protective film strip. The outer ring contour line cuts through the double-sided adhesive strip. The second row of waste adhesive strips then removes the second transition release film waste between the outer and inner rings and peels off the second transition release film strip and the double-sided adhesive strip waste outside the outer ring. The first transition release film strip has double-sided adhesive blocks arranged in a ring at intervals. After the first flipping roller flips the strip, it is combined from above with the first conductive double-sided adhesive strip and the first release film strip in step a. The ring-shaped double-sided adhesive blocks are combined onto the first release film strip and are staggered with the first conductive double-sided adhesive strip. Then the second bottom protective film strip and the first transition release film strip are removed from above. At this time, from bottom to top, the sequence is: first bottom protective film strip, first release film strip, first conductive double-sided adhesive strip arranged at intervals, and ring-shaped double-sided adhesive blocks. Step c: After peeling off the self-adhesive film from multiple second conductive double-sided adhesive strips corresponding to the number of X-direction conductive double-sided adhesive strip groups, they are laminated onto the third transition release film strip. Then, after peeling off the self-adhesive paper from the second conductive double-sided adhesive strips, a fourth transition release film strip is laminated on top of the strip. The fourth transition release film strip, multiple second conductive double-sided adhesive strips, and the third transition release film strip are then die-cut by the second circular die-cutting roller group. The die-cutting depth cuts through the second conductive double-sided adhesive strips, forming segmented X-direction conductive double-sided adhesive blocks on each second conductive double-sided adhesive strip. The waste material of the fourth transition release film on the X-direction conductive double-sided adhesive blocks is removed by the fourth waste adhesive strip, and the outer fourth transition release film strip is also removed. After being turned by the third flipping roller, it is laminated with the composite strip from step b, and the spaced X-direction conductive double-sided adhesive blocks are positioned between the first conductive double-sided adhesive strips on the first release film strip. At this point, the composite strips are arranged from bottom to top as follows: the first bottom protective film strip, the first release film strip, the first release film strip with the first conductive double-sided adhesive strip, multiple X-direction conductive double-sided adhesive blocks, the circular double-sided adhesive block, and the third transition release film strip. Step d: Remove the third transition release film strip above the composite strip after step c, then laminate the fifth transition release film strip onto the upper layer, and laminate the third bottom protective film strip onto the bottom layer. Die-cut using the third circular die-cutting roller group, wherein the die-cutting depth of the conductive double-sided adhesive layer is precisely through the conductive double-sided adhesive layer, forming a Y-direction conductive double-sided adhesive strip outline on the first conductive double-sided adhesive strip, and an X-direction conductive double-sided adhesive strip outline on the X-direction conductive double-sided adhesive block; simultaneously, a first positioning hole outline penetrating the first release film strip and the first bottom protective film strip is formed on the outer side of one side of the Y-direction conductive double-sided adhesive strip outline. The waste material inside the positioning hole outline is attached to the third bottom protective film strip and is removed along with it; at the same time, the conductive double-sided adhesive waste outside the Y-direction conductive double-sided adhesive strip outline and X-direction conductive double-sided adhesive strip outline is peeled off from above, and then the fifth transition release film waste inside the Y-direction conductive double-sided adhesive strip outline and X-direction conductive double-sided adhesive strip outline is removed through the fifth row of waste adhesive strips; at this time, the strips from bottom to top are: the first bottom protective film strip, the first release film strip containing the first positioning hole, and multiple thin strips of Y-direction conductive double-sided adhesive strips, multiple strips of X-direction conductive double-sided adhesive strips, and circular double-sided adhesive blocks arranged at intervals on the first release film strip; Step e: The composite strip after step d is die-cut by the fourth circular die-cutting roller group. The blades on the fourth circular die-cutting roller group form the first release film outline on the first release film strip. Then, the waste material of the first release film strip outside the first release film outline is removed. Then, a second release film strip is laminated on top of the strip. Then, a single-sided adhesive tape strip is laminated on each of the two sides above the second release film strip. A fourth bottom protective film strip is laminated below the first bottom protective film strip. Then, the composite strip is die-cut by the fifth circular die-cutting roller group. The blades of the fifth circular die-cutting roller group cut out the outlines of the two sides of the second release film strip. At the same time, they cut out the outlines of the second positioning holes that penetrate the edges of the single-sided adhesive tape strip and the second release film strip. The waste material inside the outlines of the second positioning holes is attached to the fourth bottom protective film strip and removed together. The waste material outside the outlines of the two sides of the second release film strip is removed from the top. Finally, the first bottom protective film strip is peeled off from the bottom. Before the product is rewound, a release paper strip is laminated.

2. The manufacturing process of the conductive double-sided adhesive assembly for conductive tablet motherboards according to claim 1, characterized in that: In step b, the first circular die-cutting roller group has an array of circular blades on its blades, wherein the die-cutting depth of the outer blades is exactly through the double-sided adhesive tape, and the die-cutting depth of the inner blades is exactly through the first transition release film tape.

3. The manufacturing process of the conductive double-sided adhesive assembly for conductive tablet motherboards according to claim 1, characterized in that: In step c, the second circular die-cutting roller group has an array of first closed blades for cutting the second conductive double-sided adhesive tape. Each set of first closed blades is divided into two separate rectangular closed blades. Each rectangular closed blade also has an array of intermittent blades arranged parallel to the tape. The intermittent blades do not die-cut the second conductive double-sided adhesive tape and form intermittent marking lines on the third transition release film tape.

4. The manufacturing process of the conductive double-sided adhesive assembly for conductive tablet motherboards according to claim 1, characterized in that: In step d, the third circular die-cutting roller group has an array of Y-direction conductive double-sided adhesive strip outline blades corresponding to the shape of the Y-direction conductive double-sided adhesive strip, X-direction conductive double-sided adhesive strip outline blades corresponding to the shape of the X-direction conductive double-sided adhesive strip, and a first positioning hole outline blade corresponding to the shape of the first positioning hole. The die-cutting depths of the Y-direction conductive double-sided adhesive strip outline blades and the X-direction conductive double-sided adhesive strip outline blades are exactly cut through the first conductive double-sided adhesive strip and the X-direction conductive double-sided adhesive block, respectively, and the die-cutting depth of the first positioning hole outline blade is exactly cut through the first release film strip. The fourth circular die-cutting roller group has an array of first release film outline blades corresponding to the shape of the first release film. The die-cutting range of each set of first release film outline blades includes the die-cutting ranges of a set of Y-direction conductive double-sided adhesive strip outline blades, X-direction conductive double-sided adhesive strip outline blades, and the first positioning hole outline blade.

5. The manufacturing process of the conductive double-sided adhesive assembly for conductive tablet motherboards according to claim 1, characterized in that: The fifth circular die-cutting roller group has a second release film edge contour line blade corresponding to the edge contour line of the second release film strip and a second positioning hole contour line blade corresponding to the contour line of the second positioning hole. The die-cutting depth of the second release film edge contour line blade just cuts through the second release film strip, and the die-cutting depth of the second positioning hole contour line blade just cuts through the first bottom protective film strip.

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