Tire and tire sensor

Abstract

In an example, a vehicle tire includes a tread portion, a sidewall portion, and a sensor module for estimating one or more parameters of the tire. The sensor module includes a detector patch including one or more capacitors, each of the capacitors having an electrostatic capacity that is variable due at least to a deformation of each capacitor. The sensor module also includes an electronics unit connected to each capacitor and configured to control the sensor module. The detector patch is adhered to an inner side of at least one of the tread portion or the sidewall portion. At least one of the capacitors is located on the inner side of at least one of the tread portion or the sidewall portion. The electronics unit is configured to estimate at least one of the parameters based on the electrostatic capacity of each capacitor.

Description

[0001] Inventors: T. Ohmte, B. Delos Santos, M.J. McKathryn, J. Pollelli, S. Susa, C.A. Ottley, J.K. Jonas, C.D. Eisinger, N.C. Briggs.

[0002] Cross-references to related applications

[0003] This application claims the interests and priorities of U.S. Provisional Application No. 62 / 979,882, filed February 21, 2020; U.S. Provisional Application No. 63 / 015,368, filed April 24, 2020; U.S. Provisional Application No. 63 / 054,817, filed August 14, 2020; U.S. Provisional Application No. 63 / 058,098, filed July 29, 2020; and U.S. Provisional Application No. 63 / 118,561, filed November 25, 2020, the entire disclosure of which is incorporated herein by reference. Technical Field

[0004] This disclosure relates to a capacitive tire sensor and methods for manufacturing and using the same. Background Technology

[0005] Unless otherwise stated herein, the materials described herein are not prior art for the purposes of the claims of this application, and are not acknowledged as prior art by virtue of being included in this section.

[0006] Current tire sensors use an accelerometer in a single package attached to a point on the tire to measure acceleration in multiple dimensions. The measured acceleration is then used as input to formulas that estimate quantities such as contact length, slip angle, longitudinal force, lateral force, vertical force (i.e., vehicle load), slip portion of the contact patch, and road classification. This approach is indirect, and the accelerometer output is significantly affected by noise. This results in less accurate and more time-consuming calculations. This limitation becomes even more apparent when this method is used to derive properties related to road conditions (e.g., dry, wet, snowy, rough) and tire conditions (e.g., tread wear).

[0007] To address these issues, capacitive tire sensors have been described (see U.S. Patent Nos. 7,121,145; 7,543,491; 7,880,600). In addition, compliant multi-region angular displacement and strain sensors have been described (e.g., U.S. Patent Nos. 9,874,431, 9,612,102, 9,476,692, 9,222,764, and 8,941,281).

[0008] Therefore, a tire sensor capable of providing information about multiple tire parameters is needed. Consequently, a tire sensor capable of providing information about strain and flexural stress across the entire area of ​​the tire under operational loads is required. Such a sensor system can be used to implement a more comprehensive sensor system for use in conjunction with vehicles equipped with pneumatic tires. Summary of the Invention

[0009] In one example embodiment, a vehicle tire includes a tread portion, a sidewall portion, and a sensor module for estimating one or more parameters of the tire. The sensor module may include a detector patch having one or more capacitors, each capacitor having a capacitance that varies at least due to deformation of each capacitor. The sensor module may also include an electronic unit connected to each capacitor and configured to control the sensor module. The detector patch is adhered to the inside of at least one of the tread portion or the sidewall portion. At least one capacitor is located on the inside of the tread portion or the sidewall portion. The electronic unit is configured to estimate at least one parameter based on the capacitance of each capacitor.

[0010] These and other embodiments are described in more detail below. Attached Figure Description

[0011] Figure 1 It is a cross-sectional view of a portion of a tire, which has an example sensor module for estimating one or more parameters of the tire;

[0012] Figures 2A to 2B This is a schematic diagram of another example sensor module;

[0013] Figure 3 It can be included in Figures 2A to 2B A schematic diagram of an example energy generation circuit in a sensor module;

[0014] Figures 4A to 4B Another example sensor module is illustrated;

[0015] Figure 5A This is a circuit diagram of part of another example sensor module;

[0016] Figure 5B This is a circuit diagram of part of another example sensor module;

[0017] Figure 6A This is a schematic diagram of an example detector patch that can be included in a sensor module;

[0018] Figure 6B Is included Figure 6A A top view of the signal electrode layer in the detector patch;

[0019] Figures 7A to 7DIncludes a top view of other example signal electrode layers that may be included in the detector patch;

[0020] Figure 8A This is a schematic illustration of another example detector patch that can be included in a sensor module;

[0021] Figures 8B to 8D They are Figure 8A A top view of the first electrode layer, signal electrode layer, and dielectric layer of the detector patch;

[0022] Figure 9A This is a schematic illustration of another example detector patch that can be included in a sensor module;

[0023] Figures 9B to 9H They are Figure 9A A top view of the detector patch comprising the second dielectric capping layer, the second electrode layer, the dielectric layer, the signal electrode layer, the dielectric layer, the first electrode layer, and the first dielectric capping layer;

[0024] Figure 10A and Figure 10B Each is a schematic illustration of a portion of an example electrode layer that may be included in a detector patch;

[0025] Figure 11A and Figure 11B The illustration shows a schematic diagram of another example signal electrode layer with a foldable sensor region;

[0026] Figure 12 This is a schematic illustration of another example sensor module implemented as a multi-region angular displacement sensor;

[0027] Figure 13 This is a schematic diagram of an example PCB interface that can be included in the electrode layer;

[0028] Figures 14A to 14C An example bending sensor is illustrated;

[0029] Figure 15 Another example of a bending sensor is illustrated;

[0030] Figure 16A and Figure 16B A cross-sectional view of a vehicle tire having one or more attached sensor modules;

[0031] Figures 17A to 17D The diagram illustrates some of the forces that a vehicle's tires may experience when the vehicle is in operation.

[0032] Figure 18 This is a flowchart of an example method for estimating one or more parameters of a tire;

[0033] Figure 19This is a flowchart of an example method for forming a detector patch;

[0034] Figures 20A to 20C This includes the computer model of tire stress and its location generated in Example 1; and

[0035] Figure 21 The diagram illustrates a block diagram of an example computing system that can be used to perform or direct the performance of one or more of the operations described herein.

[0036] These operations are all arranged according to at least one embodiment described herein. Detailed Implementation

[0037] This disclosure describes a sensor module, a vehicle tire having the sensor module, and methods of manufacturing and using such a sensor module. The sensor module can be used to measure or estimate one or more tire parameters of the vehicle tire to which it is attached. The sensor module may include a detector patch having one or more capacitors, each capacitor having a capacitance that varies at least due to deformation of each capacitor. The sensor module may include an electronic unit connected to each capacitor and configured to control the sensor module. The detector patch may be adhered to the inside of at least one of a tread portion or a sidewall portion of the vehicle tire. At least one capacitor may be located on the inside of the tread portion or the sidewall portion. The electronic unit may be configured to estimate at least one parameter based on the capacitance of each capacitor.

[0038] As used in this article, “pílán” means close to or in actual contact with.

[0039] As used in this article, "interlocking" means inserting or sealing between at least two things that have a different texture or property.

[0040] As used in this article, "flexible" means that it can be bent.

[0041] As used in this article, "extendable" means that it can be stretched or extended.

[0042] As used in this article, "expandable" means that it can be stretched or spread out in one or more directions.

[0043] As used in this article, "deformable" means capable of changing shape.

[0044] As used herein, “sheet-like” means composed of or arranged in thin layers of different material compositions.

[0045] As used in this article, “layering” means being composed of or arranged in layers.

[0046] As used in this article, “close proximity” means being close to or set as adjacent.

[0047] The term "sidewall" is a term known in the art, referring to the portion of a tire that extends from the wheel / rim (to which the tire is attached / mounted) to the shoulder portion of the tire.

[0048] The term "shoulder" is a term known in the art, referring to the transition portion of a tire that connects the sidewall portion of the tire to the tread portion of the tire.

[0049] The term "tread" is a term known in the art and refers to the portion of a tire that comes into contact with the road surface. The tread can be a thick rubber, or a rubber / compound compound, configured to provide an adequate level of traction that does not wear out too quickly.

[0050] The term "contact imprint" refers to the portion of a tire that is in contact with the road at a given moment.

[0051] In some embodiments, a tire sensor is described that can provide real-time information on strain and / or bending of the entire or multiple regions of the tire.

[0052] Figure 1 This is a cross-sectional view of a portion of a tire 100 arranged according to at least one embodiment described herein, the tire 100 having an example sensor module 102 for estimating one or more parameters of the tire 100. In some embodiments, the tire 100 is a tubeless tire having a tire carcass 104 having an inner surface 106, the tire 100 forming an hermetically sealed seal with a wheel 108 to define a reservoir 110 for receiving gas (typically air) therein. The tire carcass 104 may have a tire bead 112 that interacts with the wheel 108 to form an hermetically sealed seal. In some embodiments, the tire 100 is used with an inner tube disposed within the reservoir 110 to retain gas, such as air, in which case the tire 100 does not need to form an hermetically sealed seal with the wheel 108. The tire carcass 104 may include a tread portion 114, a shoulder portion 116, and a sidewall portion 118.

[0053] The sensor module 102 may be disposed on the inner surface 106 of the tire 100, on the outer surface of the inner tube disposed within the storage tank 110 when the tire 100 is implemented together with the inner tube, or at other suitable locations. The sensor module 102 typically includes a detector patch 120 and an electronics unit 122 connected to the detector patch 120. The sensor module 102 may additionally include or be coupled to a power source 124. For example, the electronics unit 122 may be coupled to the power source 124 to obtain power for operation.

[0054] The detector patch 120 may include one or more sensor regions 126A, 126B, and / or 126C (collectively referred to below as "sensor region 126" or generally as "sensor region 126"). Each sensor region 126 may include one or more capacitors. The detector patch 120 may be applied to or coupled to the inner surface 106 such that one or more sensor regions 126 are disposed on, disposed close to, or disposed adjacent to the tread portion 114, shoulder portion 116, and / or sidewall portion 118. For example, as Figure 1 As illustrated, sensor region 126A is disposed on tread portion 114, disposed close to tread portion 114, or disposed adjacent to tread portion 114; sensor region 126B is disposed on shoulder portion 116, disposed close to shoulder portion 116, or disposed adjacent to shoulder portion 116; and sensor region 126C is disposed on sidewall portion 118, disposed close to sidewall portion 118, or disposed adjacent to sidewall portion 118. In some embodiments, "adjacent" can be within 1 mm, 5 mm, 10 mm, 25 mm, or 100 mm of the tread portion 114, shoulder portion 116, or sidewall portion 118 of the tire 100. Alternatively or additionally, the detector patch 120 may be adhered to the inside of the tread portion 114 (e.g., on the inner surface 106), the inside of the shoulder portion 116 (e.g., on the inner surface 106), and / or the inside of the sidewall portion 118 (e.g., on the inner surface 106).

[0055] exist Figure 1 In this design, each sensor region 126 is depicted as being located inside a single portion of the tread portion 114, shoulder portion 116, or sidewall portion 118. Alternatively or additionally, one or more sensor regions 126 may be located inside two or more of the tread portion 114, shoulder portion 116, or sidewall portion 118. For example, at least one sensor region 126 may be elongated and may extend across the inside of at least two of the tread portion 114, shoulder portion 116, or sidewall portion 118.

[0056] Electronic unit 122 in Figure 1The sensor is depicted as being inside the tread portion 114, but more generally may be located anywhere on or coupled to the tire 100, wheel 108, detector patch 120, and / or power supply 124. In some embodiments, the electronic unit 122 includes one or more printed circuit boards (PCBs), one or more voltage and / or current measurement circuits, a transmitter, a receiver, a transceiver, or other components. The electronic unit 122 may be configured to measure one or more parameters of the sensor region 122 or the capacitor therein, estimate one or more tire parameters based on the measurement results, transmit the estimated tire parameters to another system or device, and / or transmit the measurement results to another system or device to perform the estimation of one or more tire parameters.

[0057] The power source 124 may include one or more batteries, energy generation circuitry, a receiver coil and circuitry for an inductive charging unit, or other power sources.

[0058] Figure 1 This includes arbitrarily defined X, Y, and Z coordinate axes, arranged such that the X-axis is aligned with the longitudinal direction (e.g., the direction of movement when the tire 100 rolls forward or backward without any sideslip), the Y-axis is aligned with the lateral direction (e.g., a direction orthogonal to the longitudinal direction and horizontal), and the Z-axis is aligned with the vertical direction, which is orthogonal to both the longitudinal and lateral directions. The X, Y, and Z coordinate axes may also be referred to as the roll axis, pitch axis, and yaw axis, respectively.

[0059] When a vehicle, including one or more tires such as tire 100, turns, it has a tendency to roll, for example, rotating about an X-axis or a roll axis. For instance, as a car moves through a turn, the center of gravity of the tire 100 on the inside of the turn (hereinafter referred to as "inner tire 100"), or more specifically, the inner tire 100, tends to rise through the turn, while the center of gravity of the tire 100 on the outside of the turn (hereinafter referred to as "outer tire 100"), or more specifically, the outer tire 100, tends to lower. This can cause the centers of gravity of the inner tire 100 and the outer tire to be at different points. Figure 1 It moves in the XZ plane.

[0060] When a vehicle accelerates or decelerates, it tends to rotate about its Y-axis or pitch axis. For example, when a rear-wheel-drive car accelerates forward, the center of gravity of the front of the car, and therefore the front tires 100, or more specifically, the front tires, tends to rise. When the car moves forward and decelerates or brakes, the center of gravity of the front of the car, and therefore the front tires 100, or more specifically, the front tires, tends to lower. This may result in the center of gravity of the front tires 100 being at... Figure 1The vehicle moves within the YZ plane. Furthermore, the vertical force on the tire 100 can vary, for example, with vehicle acceleration and deceleration. For instance, the downward vertical force on the front tire 100 may be lower during acceleration and higher during deceleration compared to moving forward at a constant speed.

[0061] When a vehicle is struck from the side by another vehicle in front of or behind its center of gravity, it tends to rotate about its Z-axis or yaw axis. For example, if a vehicle is struck from the side by another vehicle behind its center of gravity, and assuming... Figure 1 If the positive X direction is the direction the vehicle is facing, then there is a tendency for the rear tire 100 to move laterally in the negative Y direction and a tendency for the front tire 100 to move laterally in the positive Y direction. This may cause the front tire 100 to... Figure 1 It moves in the XY plane.

[0062] The vertical, longitudinal, and / or lateral forces on the vehicle's tires 100 and / or other parameters of the tires 100 (such as strain, deflection, bending, etc.) can vary under these and other conditions. The embodiments described herein may use one or more sensor modules 102 on one or more tires 100 of the vehicle to estimate these tire parameters. The combination of these measured tire parameters may include a set of leading indicators of pitch, roll, and yaw sensed by the vehicle's suspension system. Using these leading indicators should reduce response hysteresis in active or semi-active suspension systems.

[0063] In some embodiments, one or more capacitors included in the sensor region 126 of the sensor module 102 may be layered and / or sheet-like. Alternatively or additionally, one or more capacitors may be flexible, stretchable, expandable, and / or deformable. The flexibility, stretchability, expandability, and / or deformability of one or more capacitors may be at least partially elastic. For example, a capacitor may be elastically deformable if it is capable of undergoing shape changes under stress or force, wherein the shape changes are reversible after the stress or force is removed.

[0064] In some embodiments, one or more capacitors may include unidirectional or multidirectional expandable or extendable capacitors. As used herein, multidirectional expandable or extendable means that the capacitor can expand or extend in multiple directions relative to its first position on the inner surface 106 of the tire 100. In some embodiments, the capacitor may expand or extend in response to longitudinal, lateral, or vertical forces, or combinations thereof. The capacitor may be positioned at the first position on the inner surface 106 and may move or expand from the first position to a second relative position due to the expansion of the tire 100 relative to the first position under applied forces.

[0065] In some embodiments, one or more capacitors and / or detector patches 120 can be constrained to stretch only in a single dimension by appropriate addition and / or orientation of elements in sensor module 102. For example, an anisotropic member can be added to detector patch 120, which restricts deformation along the Y-axis but not along the X-axis. This can amplify the X-axis deformation signal from detector patch 120 and attenuate the Y-axis deformation signal. The anisotropic member can be any layer in the stack of detector patches 120, including adhesives. As another example, the added member can continue to allow bending but restrict stretching. This could be a case where the added member itself is flexible but has limited stretchability.

[0066] One or more capacitors included in the sensor region 126 of the sensor module 102 may be elongated; that is, the length of one or more capacitors may exceed their width. In some embodiments where the detector patch 120 includes multiple capacitors, the capacitors include a first capacitor and a second capacitor and / or multiple sensor regions 126, the first and second capacitors or the first and second sensor regions 126 may be arranged such that the length of the second capacitor or the second sensor region 126 is aligned within ±5°, 10°, 15°, 20° or 30° of the length of the first capacitor or the first sensor region 126, or aligned within ±5°, 10°, 15°, 20° or 30° in a direction orthogonal to the length of the first capacitor or the first sensor region 126. In some embodiments, the first and second capacitors and / or the first and second sensor regions 126 may be linearly aligned. In some embodiments, the multiple capacitors and / or sensor regions 126 of the detector patch 120 may be arranged in a radially parallel plane (e.g., Figure 1 In the XY plane.

[0067] Figures 2A to 2B This is a schematic diagram of another example sensor module 200 arranged according to at least one embodiment described herein. The sensor module 200 may include... Figure 1 The sensor module 102 is included Figure 1 In sensor module 102, or corresponding to Figure 1 The sensor module 102. For example, Figure 1 The sensor module 102 can have the same as Figures 2A to 2B The sensor module 200 has the same, similar or different composition and / or configuration.

[0068] like Figures 2A to 2B As illustrated, the sensor module 200 typically includes a detector patch 202, an electronics unit 204, and an optional power supply 206. The electronics unit 204 is connected to the detector patch 202 and the power supply 206. The detector patch 202, the electronics unit 204, and the power supply 206 may each include... Figure 1 The detector patch 120, the electronic unit 122, and the power supply 124 are included. Figure 1 In the detector patch 120, electronic unit 122 and power supply 124, or corresponding to Figure 1 The detector patch 120, the electronic unit 122, and the power supply 124.

[0069] Detector patch 202 may include mounting surface 208. Figure 2B ) and one or more sensor areas 210 ( Figure 2B Mounting surface 208 can be configured to attach to the surface of a tire or other object, and / or may include the lower or bottom surface of the detector patch 202. Figure 2B Alternatively or additionally, mounting surface 208 may include adhesive 212 disposed thereon. Figure 2B The detector patch 202 is adhered to the desired location inside the tire cavity or outside the inner tube of the tire. The adhesive 212 may include a thermoplastic adhesive or other suitable adhesive.

[0070] Sensor region 210 may typically include a capacitor. In some embodiments, the capacitor and / or sensor region 210 may be flexible, stretchable, expandable, deformable, layered, and / or sheet-like. Alternatively or additionally, sensor region 210 may be at least partially covered, bound, and / or surrounded by one or more protective layers 214 that are part of detector patch 202. Protective layer 214 may include an elastomeric material, such as silicone.

[0071] The power source 206 may include a battery, an energy generation circuit, an energy harvesting system (EHS) module, a dielectric elastomer generating material, a piezoelectric generating material, and / or a receiver coil and circuit for an inductive charging unit.

[0072] Electronic unit 204 can be connected via one or more corresponding electrical connectors 216. Figure 2B Electronic unit 204 communicates electrically with each of detector patch 202 and power supply 206. Alternatively or additionally, electronic unit 204 and power supply 206 may be mechanically coupled together by epoxy resin and / or may be disposed in a housing or encapsulant 218 mechanically coupled to detector patch 202. Figure 2BThe housing or encapsulant 218 may be an electrical, thermal, and / or mechanical insulator. For example, the housing or encapsulant 218 may include a damping material such as a platinum silicone flexible foam, specific examples of which include SOMA FOAMA 25. In another embodiment, the housing 218 may be supported by a vibration isolator mounted on the mounting surface 208. The vibration isolator may be or include a spring mechanism, a patterned grid of vibration dampers, microgrids, etc. The vibration isolator may be made of molded rubber, metal, or a composite thereof. In another embodiment, the power generating element (e.g., a dielectric elastomer generating material and / or a piezoelectric generating material) may be actuated by cyclic deformation of the vibration isolator.

[0073] In some embodiments, and as Figure 2A As illustrated, the electronic unit 204 may include a controller 220, a memory 222, and / or a communication module 224. The controller 220 may be operatively coupled to each of the memory 222 and the communication module 224, and is generally configured to control the operation of the sensor module 200. For example, the electronic unit 204 and the controller 220 may specifically be configured to perform or control the execution of operations including charging each capacitor of the sensor module 200, calculating the change in capacitance of each capacitor based on the amount of discharge charge during the discharge of each capacitor, and / or estimating at least one tire parameter based on the capacitance and / or the change in capacitance. In some embodiments, the controller 220 may estimate, compare, and / or otherwise analyze one or more tire parameters. These tire parameters may include one or more of the following: tire internal pressure, strain, angular displacement, temperature, inflation pressure (too low and too high), friction, slippage portion of the contact patch, road classification, uneven tire load, camber imbalance, vehicle load, individual tire balance, suspension anomalies, tire anomalies (cracks, delamination, punctures), tread wear and tire thickness, tire strain, rapid acceleration, rapid cornering, rapid braking, slip angle, slip ratio, camber effect, longitudinal force, longitudinal acceleration, longitudinal velocity, lateral force, lateral acceleration, lateral velocity, torque about the longitudinal axis, torque about the lateral axis, torque about the vertical axis, and / or tire rotational speed. In some embodiments, controller 220 estimates tire rotational speed and road classification and uses them to modulate the sampling frequency. This can save energy in some cases while providing sufficient data to calculate safety parameters, such as road classifications that include high-speed slippage. For example, when controller 220 detects a wet road, it may increase the sampling rate to allow human drivers or autonomous vehicles to respond more quickly.

[0074] In some embodiments where the sensor module 200 includes multiple sensor regions 210, the controller 220 may selectively receive data from any or all of the sensor regions 210 or portions thereof. This can facilitate tire parameter analysis when the tire is in motion and / or under cornering stress. Alternatively or additionally, this can enable the self-test of the sensor module 200 to identify when one or more sensor regions 210 or the entire sensor module 200 or a portion thereof should be replaced. The memory 222 may store data generated by the sensor regions 210 (e.g., raw measurement data or signals), data generated by the controller 220 (e.g., calculated capacitance or capacitance changes, or estimated tire parameters), and / or other data.

[0075] Incorporating computing elements within the sensor (e.g., controller 220) can reduce the amount of raw data, such as strain and angular displacement data, that can be sent to external or remote devices. This can reduce memory and energy consumption for wireless transmission to external or remote devices and can lower feedback latency. In some embodiments, each tire of the vehicle includes one or more sensor modules 200, and each of the sensor modules 200 can transmit its data to the vehicle's onboard computer, which remains a remote device relative to each sensor module 200 when in the same vehicle. The onboard computer can generate alerts or other notifications to the driver of the vehicle based on data received from the sensor modules 200, store the data, perform further processing on the data, report the data to a fleet or vehicle management system, or perform other operations on, utilize, or based on the data. In some embodiments, each sensor module 200 can be connected (e.g., networked) to an external or remote system or device in a local area network (LAN), intranet, extranet, or the Internet. The external or remote system or device can operate as a server or client machine in a client-server network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. Each sensor module 200 may include or communicate with a personal computer (PC), tablet PC, set-top box (STB), personal digital assistant (PDA), cellular phone, network device, server, network router, switch or bridge, vehicle circuitry, vehicle computer, or any machine capable of executing a set of instructions (sequential or otherwise) (which specify the actions to be taken by the sensor module 200). The controller 220 and communication module 224 may include asset-side active tracking circuitry for asset tracking.

[0076] In some embodiments, when sensor region 210 rotates out of contact with or outside the contact mark of the tire to which sensor module 200 is attached, controller 220 may selectively reduce the sampling frequency of at least one sensor region 210. In some embodiments, the sampling frequency may be increased proportionally to the tire rotation speed. In some embodiments, controller 220 may selectively utilize capacitive outputs from sensor regions 210 at specific locations to determine or estimate spatial displacement, angular displacement, or other tire parameters of selected tire portions.

[0077] Controller 220 may include any suitable dedicated or general-purpose computer, computing entity, or processing apparatus comprising various computer hardware or software modules, and may be configured to execute instructions stored on any suitable computer-readable storage medium. For example, processor 220 may include a processor, microprocessor, microcontroller, digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or any other digital or analog circuit configured to interpret and / or execute computer-executable instructions and / or process data. Although illustrated as a single controller 220, controller 220 may include any number of controllers configured to individually or collectively perform or direct the execution of any number of operations described in this disclosure. In some embodiments, controller 220 may include a separate or integrated AI chip, which may serve as a hub for sensor fusion.

[0078] In some embodiments, controller 220 may be configured to interpret and / or execute computer-executable instructions and / or process data stored in memory 222 and / or other data storage areas. In some embodiments, controller 220 may fetch computer-executable instructions from persistent data storage areas and load the computer-executable instructions into non-persistent storage areas such as memory 222. After the computer-executable instructions are loaded into memory 222, controller 220 may execute these computer-executable instructions.

[0079] Memory 222 may include a computer-readable storage medium for carrying or having computer-executable instructions or data structures stored thereon. Such a computer-readable storage medium may include any available medium accessible by a general-purpose or special-purpose computer, such as controller 220. As examples, such a computer-readable storage medium may include tangible or non-transitory computer-readable storage media, including random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory devices (e.g., solid-state memory devices), or any other storage medium that can be used to carry or store specific program code in the form of computer-executable instructions or data structures and is accessible by a general-purpose or special-purpose computer. Combinations of the foregoing may also be included within the scope of computer-readable storage media. Computer-executable instructions may include, for example, instructions and data configured to cause controller 220 to perform or control the performance of a specific operation or set of operations.

[0080] The communication module 224 may include one or more circuits or devices configured to facilitate communication between the sensor module 200 and one or more external or remote devices. In some embodiments, such circuits or devices may include a transmitter, a receiver, a transceiver, and / or an antenna. For example, the communication module 224 may include one or more wireless chips to conduct wireless communication using any proprietary or standards-based wireless protocol, examples of which include the IEEE 802.11 standard (e.g., WiFi), Bluetooth, Zigbee, etc.

[0081] In some embodiments, sensor module 200 further includes a microphone. The microphone may be included in a semiconductor chip, which may also include, for example, a controller 220. In some embodiments, the microphone may determine pressure. In some embodiments, tire strain measurements determined from sensor region 210 may be compared with pressure determined from the microphone to dynamically improve processor pressure determination. In some embodiments, outputs from at least one and / or all or any one of each wheel of the vehicle may be compared to each wheel to detect potential suspension problems. In some embodiments, input from the microphone may be fused with input from detector patch 202 to improve the accuracy of the road classification algorithm.

[0082] In some embodiments, the final result calculated by sensor module 200 can be transmitted to an end-user receiver. In some embodiments, the end-user receiver can be a smartphone. In some embodiments, the end-user receiver can be a cloud server. In some embodiments, the end-user receiver can be the vehicle itself. In some embodiments, the output can be sent to a processing unit of the vehicle that can modify vehicle motion, for example, by slowing the vehicle when the overall tire strain level reaches certain thresholds. In some embodiments, the output can be sent to a data logger within the vehicle. In some embodiments, the data logger can be part of an onboard computer that compares tire outputs and extracts parameters related to all tires, such as comparing tire wear patterns and recommending specific tire rotation patterns. In some embodiments, if power supply 206 has a battery or charge level below a threshold, the onboard computer can instruct a specific controller unit 220 corresponding to sensor module 200 to reduce sampling and / or reduce the data transmission rate from sensor module 200. For compensation, the onboard computer can use data from neighboring tires to extrapolate overall information. In some embodiments, the output can be sent to an indicator light to indicate the achievement of a given threshold parameter.

[0083] Figure 3 This is a schematic diagram of an example energy generation circuit 300 arranged according to at least one embodiment described herein. The energy generation circuit 300 may include... Figures 2A to 2B The power supply 206 is included Figures 2A to 2B In power supply 206, or corresponding to Figures 2A to 2B Power supply 206. For example. Figures 2A to 2B The power supply 206 may include Figure 3 Some or all of the energy generation circuits 300.

[0084] The energy generation circuit 300 may include a power generation element 302, an EHS module 304, an energy storage circuit 306, and / or a battery 308. The EHS module 304 may be electrically coupled to the power generation element 302, the energy storage circuit 306, and / or the battery 308.

[0085] The power generating element 302 may include a dielectric generating material, a piezoelectric generating material, or other materials, systems, or devices that generate electricity when subjected to motion, mechanical stress, or other inputs or combinations thereof. In some embodiments, the deflection of a portion of the power generating element 302, such as that implemented as a piezoelectric flexible membrane, and / or a detector patch having such a material, can generate a charge on the surface of the power generating element 302. Suitable materials for the power generating element 302 may include, for example, silicone polymers and charge generating materials, such as lead zirconate titanate. In some embodiments, the silicone polymer may include 50 to 90% by weight of the charge generating material. In some embodiments, the power generating element 302 may be positioned close to the tread portion, shoulder portion, and / or sidewall portion of a tire.

[0086] In some embodiments, the EHS module 304 collects capacitive discharge and / or current generated by the power generation element 302. The EHS module 304 may include a bridge rectifier, a voltage regulator, and / or an energy buffer capacitor to collect the output of the power generation element 302 and generate an electrical output compatible with the corresponding sensor module and / or vehicle electronics. After accumulating the output above a threshold level, the EHS module 304 may discharge and send the accumulated output to the energy storage circuit 306. In some embodiments, not all energy accumulated by the energy buffer capacitor is sent to the energy storage circuit 306; some of this energy may be redirected back for use in the electronics unit 204.

[0087] In some embodiments, the energy storage circuit 306 includes a battery charging integrated circuit (IC) and / or a direct electrical connection to a storage source (e.g., a rechargeable battery 308). Such as Figures 2A to 2B Electronic units such as electronic unit 204 can draw operating power from battery 308.

[0088] Figures 4A to 4B The illustration shows another example sensor module 400 arranged according to at least one embodiment described herein. Specifically, Figure 4A This is a top view of sensor module 400, and Figure 4B It is sensor module 400 in Figure 4A The cross-sectional view in section 4B-4B. Sensor module 400 may include, be included in, or correspond to other sensor modules herein. For example, Figure 1 Sensor module 102 and / or Figures 2A to 2B The sensor module 200 can have the same as Figures 4A to 4B The sensor modules 400 have the same, similar, or different configurations.

[0089] like Figures 4A to 4BAs illustrated, sensor module 400 typically includes detector patch 402, electronics unit 404, and optional power supply 406, with electronics unit 404 connected to detector patch 402 and power supply 406. Detector patch 402, electronics unit 404, and power supply 406 may respectively include other detector patches, electronics units, and power supplies described herein; be included in other detector patches, electronics units, and power supplies described herein; or correspond to other detector patches, electronics units, and power supplies described herein.

[0090] like Figure 4A As illustrated, the detector patch 402 may include two sensor regions 408 and 410, each of which is electrically coupled to the electronic unit 404 via corresponding electrical traces 412 and 414. Each of the sensor regions 408 and 410 may include a capacitor having a capacitance that varies due to deformation of the capacitor.

[0091] like Figure 4B As illustrated, the electronic unit 204 and the power supply 206 can be mechanically coupled together via epoxy resin and / or disposed within a housing or encapsulant 416 mechanically coupled to the detector patch 402. The housing or encapsulant 416 can be an electrical, thermal, and / or mechanical insulator. For example, the housing or encapsulant 416 can comprise a vibration-damping material such as platinum silicone flexible foam, specific examples of which include SOMA FOAMA 25.

[0092] like Figure 4B As further illustrated, electronic unit 404 may include a PCB 418, on which one or more circuits are formed or coupled. Alternatively or additionally, PCB 418 may include or be coupled thereto one or more voltage and / or current measurement circuits, transmitters, receivers, transceivers, or other components. Similar to other electronic units described herein, electronic unit 404 may be configured to measure one or more parameters of the capacitors in sensor regions 408, 410 or therein, estimate one or more tire parameters based on the measurement results, transmit the estimated tire parameters to another system or device, and / or transmit the measurement results to another system or device to perform the estimation of one or more tire parameters.

[0093] Figure 5A This is a circuit diagram of a portion of another example sensor module 500 arranged according to at least one embodiment described herein. Sensor module 500 may include, be included in, or correspond to other sensor modules described herein. For example, any of the sensor modules described herein may have the same characteristics as... Figure 5A The sensor modules 500 have the same, similar, or different configurations.

[0094] Figure 5A The depicted sensor module 500 includes a detector patch 502 and a portion of an electronics unit 504. The detector patch 502 includes a sensor region 506 with a capacitor 508. The capacitor 508 has a variable capacitance or variable capacitive capacitance C that varies at least due to deformation of the capacitor 508. 传感器 In some embodiments, the capacitance C of capacitor 508 传感器 The resistance varies between 50 and 500 picofarads (pF). Capacitor 508 is electrically coupled to electronic unit 504 via trace 510. Sensor region 506, alone or in combination with trace 510, may have a variable internal resistance R. 内阻 .

[0095] Figure 5A The illustrated electronic unit 504 includes various circuit elements that can be formed on, for example, a PCB (such as...). Figure 4B On or coupled to the PCB 418. More specifically, the electronic unit 504 may include a measurement node 512 having a resistor R 放电 The discharge resistor 514 has a capacitance C 缓 The buffer capacitor 516 and node 518 are used for buffering. Node 518 can be coupled to a controller (such as...). Figure 2A The digital output pin of the controller 220) can be used as... Figure 5A It is included as part of the electronic unit 504.

[0096] Typically, the capacitance of capacitor 508 can be measured by charging and discharging it. Capacitor 508 can be charged with direct current (DC) or alternating current (AC).

[0097] Measurements using an AC excitation source can yield complex impedance calculations. Complex impedance can be calculated using combinations of operational amplifiers and instrumentation amplifiers, programmable gate arrays (PGAs), analog-to-digital converters (ADCs), and discrete Fourier transforms (DFTs). For complex impedance-based measurements from AC excitation sources, the combined hardware and computational power requirements of the DFT can consume a considerable amount of power. An example single-chip solution for measuring complex impedance from an AC excitation source exhibits a typical current consumption of 10 mA.

[0098] In some embodiments described herein, digital charge integration is used to directly measure the charge stored on a capacitive sensor (such as capacitor 508). This technique is explained below.

[0099] According to Equation 1, capacitance (c) or electrostatic capacity is defined as the amount of charge stored (Q) divided by the charging voltage (V):

[0100] c = Q / V Equation 1

[0101] If the charging voltage is known and the total charge is calculated, the capacitance can be measured. Figure 5A The diagram illustrates a circuit for measuring the total charge on capacitor 508 according to this technology.

[0102] exist Figure 5A In the circuit, capacitor 508 has a variable capacitance C 传感器 and variable internal resistance R 内阻 They are all strain-dependent. Figure 5A The circuitry can, for example, be supplied via node 518 from a controller (such as... Figure 2A The controller 220) is driven by a DC square wave 520. Figure 5A In the DC square wave 520, the maximum charging voltage (Vcc) and discharge to ground (Gnd) are specified. The charging current is transmitted via the charging current (i). 充电 The capacitor 508 is charged, and the charging current can be indirectly measured via the voltage drop across the discharge resistor 514 according to Equation 2:

[0103] i 充电 =(Vcc–V 测量 ) / R 放电 Equation 2

[0104] In equation 2, V 测量 The voltage at measurement node 512 can be measured by a voltage measurement circuit of electronic unit 504 that can be coupled to measurement node 512. In some embodiments, V 测量 The analog input pins of the controller provided to the electronic unit 504.

[0105] The total charge on capacitor 508 can be obtained by numerically integrating the measured current across discharge resistor 514 using the trapezoidal rule, for example, according to Equation 3:

[0106]

[0107] The capacitance or electrostatic capacitance of capacitor 508 can then be calculated (e.g., by the controller of electronic unit 504) using the total charge and charging voltage (e.g., using Equation 1).

[0108] In contrast to traditional complex impedance measurements, using digital charge integration to determine the capacitance or capacitive properties of capacitor 508 eliminates the computationally complex operations of DFT and sophisticated analog instrumentation. This results in a significant reduction in power consumption compared to traditional complex impedance measurements when using digital charge integration to determine capacitance or capacitive properties.

[0109] Figure 5BThis is a circuit diagram of a portion of another example sensor module 522 arranged according to at least one embodiment described herein. Sensor module 522 may include, be included in, or correspond to other sensor modules described herein. For example, any of the sensor modules described herein may have the same characteristics as... Figure 5B The sensor module 522 has the same, similar, or different configuration. Furthermore, similar to... Figure 5A Sensor module 500, Figure 5B The sensor module 522 can be charged and discharged by DC or AC, and in some embodiments it can be adapted to determine capacitance or electrostatic capacity using digital charge integration.

[0110] Figure 5B The depicted sensor module 522 includes a detector patch 524 and a portion of an electronics unit 526. The detector patch 502 can be implemented as a curved sensor with two sensor regions, each sensor region having capacitors 528, 530 (stacked on top of each other). Each of the capacitors 528, 530 has a variable capacitance C1 or C2 that varies at least due to deformation of the capacitors 528, 530. In some embodiments, the capacitance C of each of the capacitors 528, 530 is... 传感器 The capacitance varies between approximately 100 and 700 pF. Each of capacitors 528 and 530 is electrically coupled to the input / output pin 536 of electronic unit 526 via corresponding front-end resistors 532 and 534. Each of the front-end resistors 532 and 534 may have a resistance of 330 kΩ or other suitable resistance.

[0111] Figure 5B The illustrated electronic unit 526 includes various circuit elements that can be formed on, for example, a PCB (such as...). Figure 4B The electronic unit 526 may be located on or coupled to the PCB 418. As shown, the electronic unit 526 may include a controller 538, such as a SAML21 or ATSAML21 microcontroller supplied by Microchip Technology, or other suitable controllers.

[0112] The controller 536 may include three operational amplifiers. The operational amplifiers can be configured via software to form an instrumentation amplifier with programmable gain without using external components or routing. Figure 5B The analog front end of the sensor module 522 may include: two resistors 532 and 534 with respective resistors R1 and R2; a detector patch 524 implemented as a bending sensor (e.g., 400); an operational amplifier (such as the SAML21 operational amplifier); and a digital-to-analog converter (DAC) (such as the SAML21DAC).

[0113] Front-end resistors 532 and 534 convert the current supplied through input / output pin 536 (to charge capacitors 528 and 530 in the bending sensor) into a voltage, and the instrumentation amplifier of controller 538 converts the differential signal from the bending sensor into a single-ended voltage. The output of the instrumentation amplifier is internally routed to the ADC of controller 538, for example, via node 540. The ADC performs digital integration by accumulating samples from the output of the instrumentation amplifier.

[0114] Figure 6A This is a schematic diagram of an example detector patch 600 arranged according to at least one embodiment described herein. Detector patch 600 may include, be included in, or correspond to other detector patches described herein. For example, any of the detector patches described herein may have the same characteristics as... Figure 6A The detector patch 600 has the same, similar or different configuration.

[0115] Typically, the detector patch 600 may include one or more electrode layers and interpolation dielectric layers, each of which may have a Young's modulus of 0.1 gigapascals (GPa) or less. In other embodiments, one or more of the layers may have a Young's modulus greater than 0.1 GPa. As shown, the detector patch 600 includes a first electrode layer 602, a signal electrode layer 604, a second electrode layer 606, and interpolation dielectric layers 608 and 610 disposed therebetween. In some embodiments, the detector patch 600 may additionally include one or more dielectric capping layers, such as a first dielectric capping layer 612 and a second dielectric capping layer 614.

[0116] Each of the first electrode layer 602 and the second electrode layer 606 may include an elastomeric substrate or layer, such as silicone resin, wherein conductive particles (e.g., nanoparticles, such as carbon black, nickel nanoribbons, silver nanoparticles, graphene nanosheets, graphene oxide, etc.) are integrated. The conductive particles in the first electrode layer 602 and the second electrode layer 606 may be continuously distributed throughout the respective elastomeric substrate or layer and / or may be arranged on or therein in the form of shaded lines or mesh patterns or structures.

[0117] Each of dielectric layers 608 and 610 may include an elastomeric material, such as silicone. In some embodiments, one or both of dielectric layers 608 and 610 may have some conductive material integrated therein, depending in particular on the expected or desired amount of the dielectric constant, etc.

[0118] The signal electrode layer 604 may include an elastomeric material, such as silicone resin. In some embodiments, the signal electrode layer 604 includes one or more sensor regions 616 of conductive material disposed in or on the signal electrode layer 604. For example, the sensor region 616 may include conductive particles (e.g., nanoparticles, such as carbon black, nickel nanoribbons, silver nanoparticles, graphene nanosheets, graphene oxide, etc.) within the signal electrode layer 604. Although not explicitly stated in the original text... Figure 6A As illustrated in the figure, however, the signal electrode layer 604 may additionally include one or more electrical traces, each configured to electrically couple a corresponding one in the sensor region 616 to an electronic unit in the sensor module (in which the detector patch 600 is implemented).

[0119] Each of the first dielectric capping layer 612 and the second dielectric capping layer 614 may include an elastomeric material, such as silicone resin. The first dielectric capping layer 612 may cover the first electrode layer 602 to prevent undesirable contact between the first electrode layer 602 and other objects, surfaces, etc., and / or to electrically insulate the first electrode layer 602. The second dielectric capping layer 614 may cover the second electrode layer 606 to prevent undesirable contact between the second electrode layer 606 and other objects, surfaces, etc., and / or to electrically insulate the second electrode layer 606.

[0120] In some embodiments, one or both of the first electrode layer 602 and the second electrode layer 606 may be coupled to the ground of the corresponding sensor module and may therefore be referred to as a ground electrode or ground electrode layer. When both the first electrode layer 602 and the second electrode layer 606 are ground electrode layers, each of the sensor regions 616 may form a different capacitor or be part of a different capacitor with respect to the first electrode layer 602 and the second electrode layer 606. In this and other embodiments, each capacitor may include two nodes or terminals. One node or terminal may include the corresponding sensor region 616, while the other node or terminal may include the first electrode layer 602 and the second electrode layer 606. When both the first electrode layer 602 and the second electrode layer 606 are coupled to the ground, the node or terminal including the first electrode layer 602 and the second electrode layer 606 may form a Faraday cage at least partially surrounding the node including a given sensor region 616.

[0121] Figure 6B It is arranged according to at least one embodiment described herein. Figure 6A This is a top view of the signal electrode layer 604. The signal electrode layer 604 may include, be included in, or correspond to other signal electrode layers herein. As shown, the signal electrode layer 604 includes various sensor regions 616. For simplicity, in... Figure 6B Only some of them are marked in the text.

[0122] The signal electrode layer 604 additionally includes electrical traces 618 that electrically couple the sensor region 616 to the terminal region 620 of the signal electrode layer 604. For simplicity, in Figure 6B Only some of the electrical traces 618 are marked. Each of the electrical traces 618 may include conductive material disposed in or on the signal electrode layer 604. For example, the electrical trace 618 may include conductive particles (e.g., nanoparticles, such as carbon black, nickel nanoribbons, silver nanoparticles, graphene nanosheets, graphene oxide, etc.) within the signal electrode layer 604. Each of the electrical traces 618 may terminate within the terminal region 620 to electrically couple to a corresponding electronic unit.

[0123] In some embodiments, sensor regions 616 may be located in pairs within the signal electrode layer 604, wherein each pair of sensor regions 616 is arranged or aligned orthogonally or substantially orthogonally to each other (e.g., within an orthogonal range of + / - 5, 10, 15, 20, 25, or 30 degrees). That is, the length or principal axis of one of the pair of sensor regions 616 may be aligned orthogonally or substantially orthogonally to the length or principal axis of the other sensor region 616 in the pair. Orthogonal alignment can result in the paired sensor regions 616 generally forming an L-shape, T-shape, or other suitable shape. In some embodiments, the orthogonal orientation of the sensor regions 616 within each pair of sensor regions 616 can facilitate the simultaneous measurement of orthogonal strain and angular displacement.

[0124] Combination Reference Figures 6A to 6B Each of the first electrode layer 602, the second electrode layer 606, the dielectric layer 608, 610, and the dielectric capping layers 612, 614 may have the same characteristics as... Figure 6B The signal electrode layer 604 has the same or similar coverage area. In other embodiments, the various layers of the detector patch may have, as shown in the following... Figures 7A to 7D Other coverage areas or outlines described.

[0125] Figures 7A to 7D The diagram includes a top view of other example signal electrode layers 700A, 700B, 700C, 700D arranged according to at least one embodiment described herein and which may be included in a detector patch. Each of the signal electrode layers 700A, 700B, 700C, 700D and / or the detector patch may include, be included in, or correspond to the other signal electrode layers and / or detector patches described herein.

[0126] like Figures 7A to 7DAs illustrated, each of the signal electrode layers 700A, 700B, 700C, and 700D includes one or more sensor regions 702 and traces 704 in or on an elastomeric material layer 706 (such as silicone resin). For simplicity, in Figures 7A to 7D Only some of the sensor regions 702 and traces 704 are marked. Each of the sensor regions 702 and traces 704 may include conductive material disposed in or on the signal electrode layers 700A, 700B, 700C, and 700D. For example, each of the sensor regions 702 and traces 704 may include conductive particles (e.g., nanoparticles, such as carbon black, nickel nanoribbons, silver nanoparticles, graphene nanosheets, graphene oxide, etc.) within the signal electrode layers 700A, 700B, 700C, and 700D.

[0127] Electrical traces 704 can electrically couple sensor region 702 to terminal regions 708 of signal electrode layers 700A, 700B, 700C, and 700D. Each of the electrical traces 704 can terminate within terminal region 708 to electrically couple to the corresponding electronic unit.

[0128] The shape, number, and / or arrangement of the sensor region 702, trace 704, and / or terminal region 708 in signal electrode layers 700A, 700B, 700C, 700D, or other signal electrode layers herein can have any suitable or desired configuration. For example, refer to Figure 7A and Figure 7B Signal electrode layers 700A and 700B each include two sensor regions 702 of unequal length, which are longitudinally aligned with each other. The terminal region 708 of signal electrode layer 700A is located at one end of signal electrode layer 700A, while the terminal region 708 of signal electrode layer 700B is located on one side of signal electrode layer 700B.

[0129] refer to Figure 7C and Figure 7D The signal electrode layers 700C and 700D each include five sensor regions 702, including one sensor region 702 at each end aligned with the length of the signal electrode layers 700C and 700D, and three sensor regions 702 between the two ends orthogonally aligned with the length of the signal electrode layers 700C and 700D.

[0130] The signal electrode layers 700C and 700D may additionally include one or more power-generating materials 710, which in Figure 7C and Figure 7D The example is illustrated at each of the two ends. One or more electrical traces can electrically couple the power generating material 710 to each other and / or to the terminal regions 708 of the signal electrode layers 700C, 700D, to electrically couple to the corresponding electronic units.

[0131] The terminal region 708 of the signal electrode layer 700C is located at one end of the signal electrode layer 700C, while the terminal region 708 of the signal electrode layer 700D is located on one side of the signal electrode layer 700D.

[0132] Figure 8A This is a schematic illustration of another example detector patch 800 arranged according to at least one embodiment described herein. Detector patch 800 may include, be included in, or correspond to other detector patches described herein. For example, any of the detector patches described herein may have the same characteristics as... Figure 8A The detector patch has the same, similar or different configuration as the 800.

[0133] Typically, the detector patch 800 may include one or more electrode layers and an interpolation dielectric layer, each of which may have a Young's modulus of 0.1 GPa or less. In other embodiments, one or more of the layers may have a Young's modulus greater than 0.1 GPa. As shown, the detector patch 800 includes a first electrode layer 802, a signal electrode layer 804, and an interpolation dielectric layer 806 disposed therebetween. Optionally, the detector patch 800 may also include a peripheral electrode 807. Figures 8B to 8D Each is arranged according to at least one embodiment described herein. Figure 8A A top view of the first electrode layer 802, signal electrode layer 804, and dielectric layer 806 of the detector patch 800.

[0134] Combination Reference Figure 8A and Figure 8B The first electrode layer 802 may include an elastomeric substrate or layer, such as silicone resin, wherein conductive particles (e.g., nanoparticles, such as carbon black, nickel nanoribbons, silver nanoparticles, graphene nanosheets, graphene oxide, etc.) are integrated. The conductive particles in the first electrode layer 802 may be continuously distributed throughout the elastomeric substrate or layer and / or may be arranged on or within it in the form of shaded lines or a mesh pattern or structure. The first electrode layer 802 may also include a PCB interface 808 and one or more conductive trace pads 810 for attaching traces, PCBs, or other electronic devices of corresponding electronic units of the sensor module (where the detector patch 800 is implemented) for operation and control of the detector patch 800.

[0135] Combination Reference Figure 8A and Figure 8CThe signal electrode layer 804 may include an elastomeric material (such as silicon), wherein the conductive material is limited to the peripheral electrode 807, one or more sensor regions 812, and one or more electrical traces 814. The peripheral electrode 807, sensor regions 812, and / or electrical traces 814 may include conductive particles (e.g., nanoparticles, such as carbon black, nickel nanoribbons, silver nanoparticles, graphene nanosheets, graphene oxide, etc.) on or in the signal electrode layer 804. For example, the sensor region 812 may be printed on the elastomeric material of the signal electrode layer 804. The electrical trace 814 may terminate at a patch region 816 aligned with the trace pad 810 of the first electrode layer 802, providing an electrical connection point for the electrical trace 814. As shown, embodiments of the signal electrode layer 804 may include a peripheral electrode 807 electrically connected to the first electrode layer 802 to provide electrical isolation, particularly for the entire detector patch 800. In this and other embodiments, the first electrode layer 802 and the peripheral electrode 807 may form a Faraday cage that at least partially surrounds the signal electrode layer 804.

[0136] Combination Reference Figure 8A and Figure 8D The dielectric layer 806 may include an elastomeric material, such as silicone. In some embodiments, the dielectric layer 806 may have some conductive material integrated therein, depending in particular on the expected or desired amount of the dielectric constant, etc. In some embodiments, the dielectric layer 806 may also include a patch region 818 to cover at least a portion of the PCB interface 808 of the first electrode layer 802. For example, the patch region 818 may cover the PCB interface 808 up to the trace pad 810 of the PCB interface 808.

[0137] In some embodiments, the first electrode layer 802 may be coupled to the ground of the corresponding sensor module and may therefore be referred to as a ground electrode or ground electrode layer. Each of the sensor regions 812 may form a different capacitor with or be part of a different capacitor with the first electrode layer 802. In this and other embodiments, each capacitor may include two nodes or terminals. One node or terminal may include the corresponding sensor region 812, while the other node or terminal may include the first electrode layer 802 and the peripheral electrode 807. The node or terminal including the first electrode layer 802 and the peripheral electrode 807 may form a Faraday cage at least partially surrounding the node including a given sensor region 812.

[0138] Figure 9A This is a schematic illustration of another example detector patch 900 arranged according to at least one embodiment described herein. Detector patch 900 may include, be included in, or correspond to other detector patches described herein. For example, any of the detector patches described herein may have the same characteristics as... Figure 9A The detector patch 900 has the same, similar or different configuration.

[0139] Typically, the detector patch 900 may include one or more electrode layers and interpolation dielectric layers, each of which may have a Young's modulus of 0.1 GPa or less. In other embodiments, one or more of the layers may have a Young's modulus greater than 0.1 GPa. As shown, the detector patch 900 includes a first electrode layer 902, a signal electrode layer 904, a second electrode layer 906, and interpolation dielectric layers 908 and 910 disposed therebetween. Optionally, the detector patch 900 may also include a peripheral electrode 912 and / or one or more dielectric capping layers, such as a first dielectric capping layer 914 and a second dielectric capping layer 916. Although in Figure 9A The diagram shows that the peripheral electrode 912 is in contact with the signal electrode layer 904, but the sensor area and / or traces of the signal electrode layer 904 may be electrically insulated from the peripheral electrode 912. Figures 9B to 9H These are top views of a second dielectric cover layer 916, a second electrode layer 906, a dielectric layer 910, a signal electrode layer 904, a dielectric layer 908, a first electrode layer 902, and a first dielectric cover layer 914 arranged according to at least one embodiment described herein.

[0140] Combination Reference Figure 9A , Figure 9C and Figure 9G Each of the first electrode layer 902 and the second electrode layer 906 may include an elastomeric substrate or layer, such as silicone resin, wherein conductive particles (e.g., nanoparticles, such as carbon black, nickel nanoribbons, silver nanoparticles, graphene nanosheets, graphene oxide, etc.) are integrated. The conductive particles in each of the first electrode layer 902 and the second electrode layer 906 may be continuously distributed throughout the elastomeric substrate or layer and / or may be arranged thereon or therein in the form of shaded lines or mesh patterns or structures.

[0141] refer to Figure 9C The second electrode layer 906 may also include a PCB interface 918 and one or more conductive trace pads 920 for attaching the traces, PCB, or other electronic components of the corresponding electronic unit of the sensor module (in which the detector patch 900 is implemented) for operation and control of the detector patch 900.

[0142] refer to Figure 9G The first electrode layer 902 may also include a patch area 922 to provide, in particular, mechanical strength to the connection area (e.g., PCB interface 918) of the detector patch 900 for the trace pad 920.

[0143] Combination Reference Figure 9A and Figure 9EThe signal electrode layer 904 may include an elastomeric material (such as silicone resin), wherein the conductive material is limited to the peripheral electrode 912, one or more sensor regions 924, and one or more electrical traces 926. The peripheral electrode 912, sensor regions 924, and / or electrical traces 926 may include conductive particles (e.g., nanoparticles, such as carbon black, nickel nanoribbons, silver nanoparticles, graphene nanosheets, graphene oxide, etc.) on or within the signal electrode layer 904. For example, the sensor region 924 may be printed on the elastomeric material of the signal electrode layer 904. The electrical trace 926 may terminate at a patch region 928 aligned with the trace pad 920 of the second electrode layer 906, providing an electrical connection point for the electrical trace 926. As shown, embodiments of the signal electrode layer 904 may include a peripheral electrode 912 electrically connected to the first electrode layer 902 and the second electrode layer 906 to provide electrical isolation, particularly for the entire detector patch 900. In this embodiment and other embodiments, the first electrode layer 902, the second electrode layer 906, and the peripheral electrode 907 may form a Faraday cage that at least partially surrounds the signal electrode layer 904.

[0144] Combination Reference Figure 9A , Figure 9D and Figure 9F Each of the dielectric layers 908 and 910 may include an elastomeric material (such as silicone) configured to electrically insulate the signal electrode layer 904 from the first electrode layer 902 and the second electrode layer 906. In some embodiments, and particularly depending on the expected or desired amount of the dielectric constant, one or both of the dielectric layers 908 and 910 may have some conductive material integrated therein. As disclosed herein, although not drawn strictly to scale, the size of each of the dielectric layers 908 and 910 and the signal electrode layer 904 may be set slightly smaller than the first electrode layer 902 and the second electrode layer 906 to expose the peripheral edges of the first electrode layer 902 and the second electrode layer 906 and allow electrical contact with the peripheral electrode 912.

[0145] In some embodiments, each of the dielectric layers 908 and 910 may further include bonding pad regions 930 and 932, respectively. Bonding pad regions 930 and 932 may cover at least a portion of the PCB interface 918 of the second electrode layer 906. For example, bonding pad regions 930 and 932 may cover the PCB interface 918 up to the trace pad 920 of the PCB interface 918.

[0146] Combination Reference Figure 9A , Figure 9B and Figure 9HEach of the first dielectric capping layer 914 and the second dielectric capping layer 916 may include an elastomeric material, such as silicone resin. The first dielectric capping layer 914 may cover the first electrode layer 902 to prevent undesirable contact between the first electrode layer 902 and other objects, surfaces, etc., and / or to electrically insulate the first electrode layer 902. The second dielectric capping layer 916 may cover the second electrode layer 906 to prevent undesirable contact between the second electrode layer 906 and other objects, surfaces, etc., and / or to electrically insulate the second electrode layer 906.

[0147] refer to Figure 9B In some embodiments, the second dielectric overlay 916 may be sized to cover the second electrode layer 906 and may be larger than the second electrode layer 906. Alternatively or additionally, the second dielectric overlay 916 may include a patch region 934 to cover the PCB interface 918 of the second electrode layer 906 up to the trace pad 920.

[0148] refer to Figure 9H In some embodiments, the first dielectric overlay 914 may be sized to cover the first electrode layer 902 and may be larger than the first electrode layer 902. Alternatively or additionally, the first dielectric overlay 914 may include a patch region 936 to support or provide mechanical strength to a connection region (e.g., PCB interface 918) of the detector patch 900 for the trace pad 920.

[0149] In some embodiments, one or both of the first electrode layer 902 and the second electrode layer 906 may be coupled to the ground of the corresponding sensor module and may therefore be referred to as a ground electrode or ground electrode layer. When both the first electrode layer 902 and the second electrode layer 906 are ground electrodes, each of the sensor regions 924 may form a different capacitor or be part of a different capacitor with the first electrode layer 902 and the second electrode layer 906. In this and other embodiments, each capacitor may include two nodes or terminals. One node or terminal may include the corresponding sensor region 924, while the other node or terminal may include the first electrode layer 902, the second electrode layer 906, and the peripheral electrode 912. When both the first electrode layer 902 and the second electrode layer 906, and the peripheral electrode 912 are coupled to the ground, the node or terminal including the first electrode layer 902, the second electrode layer 906, and the peripheral electrode 912 may form a Faraday cage substantially surrounding the node including a given sensor region 616.

[0150] Figures 9A to 9H The detector patch 900 is illustrated as a three-electrode stack. Figures 9A to 9HThe three-electrode stack can be extended to more or fewer electrode layers. Similarly, more or fewer sensor regions 924 and traces 926 can be used in other configurations and shapes.

[0151] The detector patches 600, 800, 900, and other detector patches described herein are examples of flexible sensor systems or portions thereof, which may include distributed sensor regions and corresponding electrical connections (e.g., traces) of varying lengths. Variations in length can lead to correlated variations in the fundamental capacitance level of the sensor region, which can be problematic and, additionally, difficult to compensate for in electronic circuitry such as the electronic units described herein. Such sensor systems or portions thereof may also experience mechanical crosstalk in regions where trace deflection and / or strain cause erroneous capacitance signals. Crosstalk from traces can be significant in regions with relatively large surface areas coupled to a ground electrode. According to some embodiments herein, the ground electrode may be formed with shaded lines or a mesh structure to, for example, reduce crosstalk. An example of such a ground electrode is described with reference to Figure 10.

[0152] Figure 10A and Figure 10B Each of the above is a schematic illustration of a portion of an example electrode layer 1000A, 1000B (hereinafter collectively referred to as "electrode layer 1000" or generally referred to as "electrode layer 1000") arranged according to at least one embodiment described herein. Each electrode layer 1000 may include, be included in, or correspond to other electrode layers herein. For example, either the first electrode layer or the second electrode layer herein may have the same characteristics as... Figures 10A to 10B The electrode layers 1000 have the same, similar or different configurations.

[0153] like Figure 10A and Figure 10BAs illustrated, each electrode layer 1000 includes partially open, checkered, shaded, or mesh-like patterns or structures 1002A, 1002B (hereinafter collectively referred to as "mesh structure 1002" or generally "mesh structure 1002") of conductive material, such as carbon nanotubes, silver nanoparticles, other conductive particles, etc., in or on an elastomeric substrate (such as silicone). In some embodiments, the mesh structure 1002 can be printed on the elastomeric substrate, for example, via additive printing or 3D printing. In some embodiments, the mesh structure 1002 can be formed as a continuous layer of conductive material on the elastomeric substrate and then selectively etched to remove conductive material in selected locations and form a mesh structure 1002 with pores or gaps. In some embodiments, and compared to electrode layers with solid or continuously plated metal, the mesh structure 1002 can provide similar electrical shielding for capacitive sensors due to the reduced surface area of ​​the traces coupled to the electrode layer 1000, wherein stray capacitance from the traces (e.g., trace 926) is reduced. This configuration can result in fewer error signals generated by strain and / or deflection in the traces. The reduction in error signals can be proportional to the amount or percentage of the non-metallic surface area of ​​the electrode 1000, for example, to the amount or percentage of gaps or open spaces in the mesh structure 1002. Therefore, the embodiments described herein can, in particular, vary the amount or percentage of open spaces in the mesh structure 1002 according to the signal frequency to be shielded, the width of the traces, and / or other criteria. Generally, wider traces can generate more error signals (mechanical crosstalk), and for those embodiments, a more open mesh structure 1002 (i.e., larger open spaces) can also reduce crosstalk.

[0154] Figure 10A and Figure 10B The diagram further illustrates sensor regions 1004 of the signal electrode layer, which can be spaced above or below the electrode layer 1000 via dielectric layers. Each sensor region 1004 forms a different capacitor with or is part of a different capacitor with the electrode layer 1000.

[0155] In some embodiments, the mesh structure 1002 is arranged in a grid. (Reference) Figure 10A The mesh of the mesh structure 1002A may include intersecting conductive material lines aligned parallel or substantially parallel to the edges of the electrode layer 1000A, such that the open space defined by the intersecting lines is also arranged linearly and parallel to the edges of the electrode layer 1000A. For example, a first subgroup of conductive material lines may be parallel to the vertical edges of the electrode layer 1000A (in... Figure 10A The conductive material lines are aligned and spaced apart from each other in orientation, while the second subgroup of conductive material lines can be parallel to the horizontal edge of the electrode layer 1000A (in the direction of the electrode layer). Figure 10AThe lines are aligned and spaced apart from each other (in terms of orientation). In this arrangement, the first subgroup of lines intersects the second subgroup of lines orthogonally or substantially orthogonally. The open space formed by the lines of this arrangement comprises a generally rectangular open space aligned with vertical and horizontal lines.

[0156] Other alignments are also possible. For example, reference... Figure 10B The mesh of the mesh structure 1002B may include intersecting conductive material lines, which are positioned relative to the vertical direction (in... Figure 10B The orientation is aligned at ±45°, so that the open space defined by the intersecting lines is also linear and arranged at ±45° relative to the vertical. For example, the first subgroup of conductive material lines can be relative to... Figure 10B The vertical lines are aligned at approximately 45° and spaced apart from each other, while the second subgroup of conductive material lines can be positioned relative to each other. Figure 10B The vertical lines are aligned at -45° and spaced apart from each other. In this arrangement, the first subgroup of lines intersects the second subgroup of lines orthogonally or substantially orthogonally. The open space formed by the lines of this arrangement comprises a generally rectangular open space aligned diagonally at +45° or -45° relative to the vertical direction.

[0157] Other alignments are still possible for the mesh of the mesh structure 1000. For example, intersecting conductive material lines may intersect at angles other than 90°. Alternatively or additionally, these lines may have vertical or horizontal edges that are not parallel to the electrode layer 1000, or edges that are not parallel to the vertical direction (in... Figure 10A and Figure 10B The lines are aligned at ±45° (in terms of orientation). In some embodiments, the open space formed by the arrangement of intersecting lines may have a shape other than a rectangle. In some embodiments, the lines aligned in a given direction may have a substantially equal interval from one line to the next, or they may have unequal or variable intervals from one line to the next.

[0158] In some embodiments, the mesh of the mesh structure 1000 may be formed by non-linearly intersecting conductive material shapes, such as interconnected perforated rings, as open spaces having hexagonal or other shapes, open spaces having circles, or a honeycomb pattern having any suitably arranged conductive material and open spaces.

[0159] In some embodiments, the density of conductive material and / or open spaces is uniform throughout the mesh structure 1000. In some embodiments, the density of conductive material and / or open spaces is not uniform throughout the mesh structure 1000. For example, open spaces may be relatively more dense in regions not directly above or below the traces and / or sensor regions 1004 (e.g., a larger ratio of open spaces to conductive material), and relatively less dense in regions directly above or below the traces and / or sensor regions 1004 (e.g., a smaller ratio of open spaces to conductive material).

[0160] A specific configuration of the mesh structure 1000 in any given implementation can be selected to reduce crosstalk or to change or optimize one or more other parameters. Aspects of the configuration of the mesh structure 1000 that can be selected or modified may include one or more of the following: line width, line spacing, line alignment, open space shape, open space density (or the opposite conductive material density), uniformity (or lack thereof) of open space density (or the opposite conductive material density), or other suitable aspects.

[0161] Figure 11A and Figure 11B The illustration shows a schematic diagram of another example signal electrode layer 1100 arranged according to at least one embodiment described herein, having a foldable sensor region 1102. The signal electrode layer 1100 may include, be included in, or correspond to other signal electrodes 1100 described herein. For example, any of the signal electrode layers described herein may have a... Figure 11A and Figure 11B The signal electrode layers 1100 have the same, similar, or different configurations. Figure 11A This is a top view of the signal electrode layer 1100 before the foldable sensor region 1102. Figure 11B This is a top-down perspective view after folding the foldable sensor area 1102.

[0162] The signal electrode layer 1100 may include an elastomeric material (such as silicone resin), wherein the conductive material is limited to one or more foldable sensor regions 1102, one or more sensor regions 1104, and one or more electrical traces 1106. The foldable sensor regions 1102, sensor regions 1104, and / or electrical traces 1106 may include conductive particles (e.g., nanoparticles, such as carbon black, nickel nanoribbons, silver nanoparticles, graphene nanosheets, graphene oxide, etc.) on or within the signal electrode layer 1100. The electrical traces 1106 may terminate at a patch region 1108 for connection to a corresponding electronic unit, PCB, or other electronic device for operation and control of a corresponding detector patch or sensor module (where the signal electrode layer 110 is implemented).

[0163] The foldable sensor region 1102 may include a gradually narrowing region intended to become a fold point or fold line 1110, such as Figure 11A As indicated. The foldable sensor region 1102 can be configured to fold over the top of the sensor region 1104, such that they are positioned on top of the sensor region 1104, as shown. Figure 11B As illustrated. The signal electrode 1100 may include more or fewer sensor areas 1104 or foldable sensor areas 1102, sensor areas 1104 or foldable sensor areas 1102 of other shapes, sensor areas 1104 or foldable sensor areas 1102 in other locations, fold lines 1110 in other placements, or other configurations.

[0164] When manufacturing or forming the signal electrode layer 1100, an intercalator 1112 may be placed on or above each sensor region 1104 before folding the foldable sensor region 1102. Figure 11B For simplicity, in Figure 11B Only one intercalator 1112 is labeled. Each intercalator 1112 may include a dielectric layer or the like composed of an elastomeric material (such as silicone) configured to electrically insulate the foldable sensor region 1102 from the sensor region 1104. In some embodiments, depending particularly on the expected or desired amount of the dielectric constant, the intercalator 1112 may have some conductive material integrated therein. In some embodiments, the intercalator 1112 may include a separate component positioned before folding the foldable sensor region 1102, or it may be an additively manufactured layer (e.g., a 3D-printed layer) formed on top of the signal electrode layer 1100. Other configurations and manufacturing processes are also possible.

[0165] like Figure 11BAs illustrated, after the interpolator 1112 is placed, the foldable sensor region 1102 can be folded on each fold line 1110 to position each of the foldable sensor regions 1102 as spaced apart from and on top of or above a corresponding one of the sensor regions 1104. Each stack of sensor region 1104, interpolator 1112, and foldable sensor region 1102 can form a corresponding multimode sensor region 1114. When combined with one or more other electrode layers and / or dielectric layers to form a detector patch (such as those described herein), each sensor region 1104 and foldable sensor region 1102 within a given multimode sensor region 1114 can form a different capacitor or be part of a different capacitor with one or more of the electrode layers. For example, sensor region 1104 of a given multimode sensor region 1114 can form a first capacitor or be part of a first capacitor together with one or more electrode layers, while foldable sensor region 1102 of a given multimode sensor region 114 can form a second capacitor or be part of a second capacitor together with one or more electrode layers. The first and second capacitors formed by the sensor region 1104 and the foldable sensor region 1102 of each multi-mode sensor region 1114 can be referred to as a pair of capacitors or capacitor pair.

[0166] For example Figure 11B As schematically shown, a portion of each trace 1106 in one of the fold lines 1110 can be similarly folded, leaving a large portion of the corresponding trace 1106 in the main or principal plane of the signal electrode layer 1100 (e.g., the folded portion of the signal electrode layer 1100). Since all or substantially all of the traces 1106 to the multimode sensor region 1114 are located in substantially the same plane (e.g., the plane of the signal electrode layer 1100), the associated signal measurement electronics (not shown) can subtract the common-mode signal between each pair of capacitors in each multimode sensor region 1114. This arrangement can particularly result in embodiments that have a higher common-mode rejection ratio from the paired capacitors, because all or substantially all of their respective traces 1106 are located in substantially the same plane, and, upon subtracting the common-mode signal, the remaining differential signal generated from the capacitor pair can be entirely or substantially attributed to the difference in bending of the capacitors in the pair.

[0167] In some embodiments, the folded electrical traces 1106 can be freely folded, meaning they can be bent to form loops. In some embodiments, the folded electrical traces 1106 can be mechanically or otherwise attached to the signal electrode layer 1100, or can be formed using an embedded configuration. Furthermore, although Figure 11BThe illustration shows a single interpolator 1112 positioned between each pair of sensor regions 1104 and the foldable sensor region 1102, but in other embodiments, each pair of sensor regions 1104 and the foldable sensor region 1102 may have two or more interpolators positioned therebetween.

[0168] Figure 12 This is a schematic illustration of another example sensor module 1200 implemented as a multi-region angular displacement sensor, arranged according to at least one embodiment described herein. As shown, the sensor module 1200 may include... Figures 9A to 9H Several examples of detector patches 900 are provided, which are coupled together via one or more elastomer connectors 1202 to form a sensor module 1200. The sensor module 1200 may additionally include one or more electronic units, one or more power supplies, or other components, devices, or systems. Further disclosure regarding the construction, operation, and implementation of such angular displacement sensors can be found in U.S. Patent No. 10,551,917, the entire contents of which are incorporated herein by reference.

[0169] Figure 13 This is a schematic diagram of an example PCB interface 1300 arranged according to at least one embodiment described herein. PCB interface 1300 may include, be included in, or correspond to other PCB interfaces described herein. For example, any of the PCB interfaces described herein may have the same characteristics as... Figure 13 The PCB interface has the same, similar or different configuration as the 1300.

[0170] In some embodiments, the PCB interface 1300 is placed or formed on a layer of the detector patch (such as a first electrode layer 902 or a second electrode layer 906) to provide connection and mounting points for electronic units of a corresponding sensor module (such as a PCB for such electronic units). The PCB interface 1300 may include conductive portions printed with conductive nanoparticles, such as carbon black, nickel nanoribbons, silver nanoparticles, graphene nanosheets, graphene oxide, etc. For example, Figure 13 The PCB interface 1300 may include trace pads 1302 printed with silver nanoparticle ink or other conductive materials.

[0171] Some of the sensor modules and / or detector patches described herein can be implemented as or include bending sensors. Figures 14A to 14CAn example bending sensor 1400 arranged according to at least one embodiment described herein is illustrated. The bending sensor 1400 may include, be included in, or correspond to other bending sensors, detector patches, and / or sensor modules described herein. For example, any of the detector patches described herein may have a... Figures 14A to 14C The same, similar or different configurations of the bending sensor 1400.

[0172] The bending sensor 1400 can typically have an elongated configuration, with its length exceeding its width and height. Figure 14A It is a cross-sectional view of the bending sensor 1400 in a plane parallel to the length and height of the bending sensor 1400. Figure 14B It is a cross-sectional view of the bending sensor 1400 in a plane parallel to the width and height of the bending sensor 1400. Figure 14C The diagram illustrates the operating theory of the bending sensor 1400.

[0173] The bending sensor 1400 can typically be configured to... Figure 14A Bending in the plane to measure Figure 14A The bending sensor 1400 can typically include various layers, electrodes, sensor regions, and / or traces (e.g., detector patch 900) arranged to form a capacitive sensor consisting of a first capacitor 1402 and a second capacitor 1404, or stacked on top of each other. The first capacitor 1402 may be positioned on one side (e.g., above) of the center 1406 of the bending sensor 1400, while the second capacitor 1404 may be positioned on the opposite side (e.g., below) of the center 1406.

[0174] In some embodiments, the bending sensor 1400 may be made of a layered medical-grade silicone elastomer doped with conductive and non-conductive fillers, thereby giving them similar mechanical properties and operating temperatures to other silicone elastomer products.

[0175] In some embodiments, the bending sensor 1400 can measure angular displacement via differential capacitance measurement. This suppresses common-mode signals such as temperature fluctuations, strain, and noise, thereby providing high-fidelity angular displacement measurement.

[0176] In some embodiments, differential capacitance can be measured using extremely low sampling power, with a power consumption of less than 100 microamps (μA) at 1.8 volts (V). Unlike some other bending sensor technologies, the signal can remain highly stable over time without drifting, contributing to high reliability and accuracy.

[0177] The bending sensor 1400 can be customized to include multiple channels and spatially distinct "bending pixels," can have arbitrary dimensions and varying stiffness, can be fabricated as non-extendable or directly integrated into flexural circuitry, and / or can be configured to measure bending orthogonal planes. As used herein, a "bending pixel" can refer to a set of paired stacked capacitors with output differential capacitance indicating angular displacement localized to the bending pixel. For example, by segmenting each of the first capacitor 1402 and the second capacitor 1404 along their length to form a plurality of linearly aligned first capacitors (the plurality of linearly aligned first capacitors being spaced apart from the plurality of linearly aligned second capacitors 1404 across a center 1406), each pair of stacked first and second capacitors forms a bending pixel, which can be configured to output differential capacitance indicating angular displacement localized to the bending pixel.

[0178] In some embodiments, capacitors 1402, 1404 may be offset from center 1406 (e.g., one offset to each side of center 1406) and may extend over the entire length or substantially the entire length of bending sensor 1402, wherein differential capacitance is measured between the two offset capacitors. Figure 1 Because the output is differential, common-mode signals such as tensile strain can be suppressed. Therefore, even if common-mode tensile strain, common-mode compressive strain, or even a mixture of both are superimposed on top of the bending strain, soft angular displacement sensors such as the Bending Sensor 1400 can measure the bending angle accurately.

[0179] refer to Figure 14C The output of the bending sensor 1400 can be the angular displacement Δθ calculated from the vectors V1 and V2 defined by the ends of the bending sensor 1400. Figure 14C Additionally, a detailed cross-sectional view 1408 of the bent portion 1410 of the bending sensor 1400 is included. As illustrated in view 1408, the first capacitor 1402 on the inner side of the bend can withstand compressive strain ε. c The second capacitor 1404 on the outer side of the bend can withstand tensile strain ε. t Compared to the unbent or unstrained state, in Figure 14C In the illustrated bending state, strain can alter the capacitance of capacitors 1402 and 1404 in relative directions (e.g., one can increase while the other decreases), which can result in an increase in the differential capacitance of the two capacitors 1402 and 1404. The differential capacitance measurement result can be linearly proportional to the total angular displacement of the bending sensor 1400. As used herein, the total angular displacement can refer to the angle between vectors V1 and V2.

[0180] Soft angular displacement sensors, such as the bending sensor 1400, possess path-independent characteristics, meaning that additional bending has a limited impact on the sensor output. This characteristic likely stems from the fact that capacitors (e.g., the first capacitor 1402 and the second capacitor 1404) extend along or substantially along the length of the bending sensor 1400. Consequently, the total amount of bending is integrated along the length, effectively eliminating the additional bending path. This also means that the location of the bending can occur anywhere along the length of the bending sensor 1400.

[0181] Figures 14A to 14C A uniaxial bending sensor 1400 is described. The operating principle of the bending sensor 1400 can be extended to biaxial bending sensors (such as...). Figure 15 (As shown in the diagram). Figure 15 The illustration shows another example of a bending sensor 1500 arranged according to at least one embodiment described herein. The bending sensor 1500 may include, be included in, or correspond to other bending sensors, detector patches, and / or sensor modules described herein. For example, any of the detector patches described herein may have a similar design to... Figure 15 The same, similar or different configurations of the bending sensor 1500.

[0182] The bending sensor 1500 can typically have an elongated configuration, with its length exceeding its width and / or height, roughly similar to... Figures 14A to 14C The bending sensor 1400. Figure 15 This is a cross-sectional view of the bending sensor 1500 in a plane parallel to its width and height. As shown, the bending sensor 1500 includes a first pair of capacitors 1502, 1504 and a second pair of capacitors 1506, 1508. Each of the capacitors 1502, 1504, 1506, 1508 may extend all or substantially all of the length of the bending sensor 1500 (e.g., in...). Figure 15 (In-plane and out-of-plane). The first differential signal from the first paired capacitors 1502, 1504 can measure the bending sensor 1500 in vertical alignment and in / out. Figure 15 The angular displacement in the plane of the plane. The second differential signal from the second pair of capacitors 1506 and 1508 can measure the bending sensor 1500 in horizontal alignment and in / out. Figure 15 Angular displacement in the plane of the plane.

[0183] Figure 16A and Figure 16B Cross-sectional views of vehicle tires 1600A, 1600B having one or more attached sensor modules arranged according to at least one embodiment described herein. Figure 16Aand Figure 16B The illustrations show various example arrangements of the sensor modules on vehicle tires 1600A and 1600B. Other arrangements are also possible.

[0184] In more detail, Figure 16A This is a cross-sectional view of a vehicle tire 1600A with one or more sensor modules, including... Figures 6A to 6B Examples of detector patches 600. Detector patches 600 (with individual or shared electronic units and / or power supplies) may be distributed on the inner surface 1602 of a vehicle tire 1600A having a tire bead 1604, a tread portion 1608, a shoulder portion 1610, and a sidewall portion 1612. Sensor modules and their sensor areas 616 ( Figure 6A and Figure 6B The detector patch 600 may be positioned close to, or disposed on, the inner surface 1602 of one or more of the sidewall portion 1612, shoulder portion 1610, and / or tread portion 1608. In some embodiments, the detector patch 600 may be distributed around the circumference of the vehicle tire 1600A at intervals of 15°, 30°, 60°, 90°, 120°, and / or 180°, or have some other distribution.

[0185] Figure 16B This is a cross-sectional view of a vehicle tire 1600B having one or more sensor modules, including multiple examples of detector patches 1614, each of which has Figures 7A to 7D The detector patches 1614 (with individual or shared electronic units and / or power supplies) may be distributed on the inner surface 1616 of the vehicle tire 1600B having a tire bead 1618, a tread portion 1620, a shoulder portion 1622, and a sidewall portion 1624. The detector patches 1614 and their sensor areas may be positioned close to, and / or disposed on, the inner surface 1616 of one or more of the sidewall portion 1624, the shoulder portion 1622, and / or the tread portion 1620. In some embodiments, the detector patches 1614 may be distributed around the circumference of the vehicle tire 1600B at intervals of 15°, 30°, 60°, 90°, 120°, and / or 180°, or have some other distribution.

[0186] Figures 17A to 17D The illustrations show some of the forces that vehicle tires 1700 may experience when the vehicle is in operation, arranged according to at least some embodiments described herein. Figure 17B and Figure 17CAdditional illustrations show an example placement of sensor modules 1702, 1704 and / or their detector patches on the inner surface of vehicle tire 1700. Figure 17D The illustration shows the vehicle tire 1700 in a stationary state 1706 and in a state of use 1708.

[0187] When the vehicle tire 1700 is mounted on the wheel / rim and moves forward and turns, the forces applied to the vehicle tire 1700 can be as shown in the figure. The contact mark of the vehicle tire 1700 on the road surface may be subjected to forces due to the outward displacement of the wheel and a portion of the vehicle tire 1700 (while the contact mark remains in contact with the road surface). The force Fy along the Y-axis may affect the spatial displacement Y along the Y-axis of the vehicle tire 1700 / wheel. At least one force vector applied to the structure of the vehicle tire 1700 can cause deformation of the tread portion, shoulder portion, and / or sidewall portion of the vehicle tire 1700.

[0188] refer to Figure 17D Tire displacement angle A iu Angle A can be relative to, for example, the sidewall portion when at rest. ar (exist Figure 17D The static state (described as vertical in 1706) is used to determine this. For example... Figure 17D As shown, the physical position of a portion of the vehicle tire 1700 or a portion thereof when stationary can be compared with the physical position of the same tire portion in use or in motion. In some embodiments, tire parameters thus determined may include those from a first stationary position (e.g., Y1). ar and / or Y2 ar (At the position on the Y-axis, laterally inward along the tire rotation axis) to the second real-time position (e.g., Y1). iu and / or Y2 iu The physical displacement of the tire portion generates a strain sensor output. In some embodiments, "stationary" or a stationary state 1706 may be when the vehicle tire 1700 is not rotating. In some embodiments, "stationary" may be when the vehicle with the attached tire 1700 is stationary but under load (e.g., supported by all the tires of the vehicle). In some embodiments, "in use" may be when the vehicle tire 1700 is rotating. In some embodiments, "in use" may be when the vehicle with the attached tire is in motion, for example, when the vehicle is turning, accelerating, decelerating, and / or moving at a constant speed. In some embodiments, sensor modules 1702, 1704 may be disposed on the sidewall portion of the vehicle tire 1700, and the tire parameters determined according to embodiments herein may include angle A from the first stationary tire sidewall portion. ar To the second real-time tire sidewall portion angle A iu The angular displacement of the sidewall portion generates the output of the strain sensor.

[0189] In some embodiments, a method for determining tire strain is described. The method may include calibrating the aforementioned sensor module by determining a reference capacitive sensor amplitude output having known tire physical parameters. In some embodiments, the method may include receiving a capacitive sensor amplitude output generated by actual (e.g., real-time) tire parameters (e.g., changes in tire sidewall displacement angle, physical displacement of tire portions, or other deformations). In some embodiments, the method may include determining tire strain by associating the received strain sensor amplitude with a determined specific strain sensor amplitude output having known tire physical parameters.

[0190] In some embodiments, a method for measuring the overall deformation of a vehicle tire is described. The method may include measuring strain applied to the tread and shoulder portions of the tire by one or more sensor modules, the one or more sensor modules being positioned close to, and / or disposed on, the inner surfaces of the shoulder and / or tread portions of the vehicle tire. In some embodiments, the method may include measuring strain and angular displacement applied to one or more sidewall portions of the vehicle tire by one or more sensor modules. In some embodiments, the method may include determining the overall deformation of the tire by comparing the static capacitive output of one or more sensor modules with the capacitive output under strain of the one or more sensor modules.

[0191] In some embodiments, a method for detecting sidewall tire wear and / or tire abnormalities is described. The method may include measuring strain applied to a first portion and a second portion of a sidewall portion using one or more sensor modules, such as physical deformation or movement from a first position (e.g., a stationary or first time position) to a second position (e.g., a position in motion and / or a second time position). In some embodiments, the method may include comparing the strain or angular displacement of the first and second portions of the sidewall portion, such as physical deformation or movement from a first position (e.g., a stationary or first time position) to a second position (e.g., a position in motion and / or a second time position). In some embodiments, the method may include determining whether the capacitive output difference between the measured strains exceeds a given threshold.

[0192] Figure 18 This is a flowchart of an example method 1800 for estimating one or more parameters of a tire, arranged according to at least one embodiment described herein. Method 1800 may be performed or controlled, wholly or in part, by the sensor module, electronic unit, etc., described herein. Method 1800 may include one or more of blocks 1802, 1804, and / or 1806.

[0193] At block 1802, method 1800 may include charging each of one or more capacitors of the detector patch. The capacitors may be charged by DC or AC. Block 1802 may be followed by block 1804.

[0194] At block 1804, method 1800 may include determining the capacitance of each capacitor, the differential capacitance of a pair of capacitors, or the variation in capacitance of each capacitor. In some embodiments, block 1804 may include: impedance buffering the voltage of each capacitor; sampling the voltage via an ADC, wherein the value of the ADC output is proportional to the strain; and applying a calibration coefficient. Block 1804 may be followed by block 1806.

[0195] At box 1806, method 1800 may include estimating one or more parameters based on or using determined capacitance, differential capacitance, or capacitance variation. Box 1806 may include applying machine learning algorithms to track characteristics of tire deformation waveforms to estimate at least one of tire tread wear, load, or traction.

[0196] In some embodiments, prior to determination and estimation, method 1800 may further include calibrating each capacitor, including determining a reference output for each capacitor having known tire physical parameters.

[0197] In some embodiments, method 1800 may further include receiving the output of each capacitor having unknown tire physical parameters. In this example, the estimation at block 1806 may include comparing a reference output having known tire physical parameters with an output for unknown tire physical parameters.

[0198] In some embodiments, method 1800 may further include attaching a detector patch to a tire, wherein the length of a first capacitor of one or more capacitors is aligned within ±30 degrees in the tire's direction of travel or within ±30 degrees in a direction perpendicular to the tire's direction of travel. The first capacitor has a length and a width, and the length may exceed the width.

[0199] In some embodiments, method 1800 may further include attaching a detector patch to the tire, wherein each capacitor is located near at least one of the group consisting of the tire tread, tire shoulder, and tire sidewall.

[0200] In some embodiments, method 1800 may further include generating energy in an energy generation circuit coupled to the detector patch to charge each capacitor.

[0201] Figure 19This is a flowchart of an example method 1900 for forming a detector patch arranged according to at least one embodiment described herein. Method 1900 may include one or more of blocks 1902 and / or 1904. In some embodiments, method 1900 or variations thereof may be used to form one or more of detector patches 600, 800, 900 or other detector patches described herein.

[0202] At block 1902, method 1900 may include forming a signal electrode layer, such as any one of signal electrode layers 604, 700A to 700D, 804, 904, and 1100. Block 1902 may include forming an elastomeric material layer, such as silicone. The elastomeric material layer may be formed by additive printing or other methods. Block 1902 may include forming a first sensor region on the elastomeric material layer in a first portion of the elastomeric material layer. Block 1902 may include placing an interposer on the first sensor region. Block 1902 may include forming a second sensor region on the elastomeric material layer in a second portion of the elastomeric material layer. Each of the first and second sensor regions may include one or more conductive materials and / or may be formed by additive printing of conductive ink or other suitable processes or materials. Block 1902 may include folding the elastomeric material layer to position the second portion on the first portion, wherein the second sensor region is aligned with the first sensor region and separated from the first sensor region by the interposer. The signal electrode layer may include a folded layer of elastomeric material, wherein the aligned first and second sensor regions are separated by an interpolator. Box 1902 may be followed by box 1904.

[0203] At block 1904, method 1900 may include forming a ground electrode layer spaced apart from a signal electrode layer by a dielectric layer. The ground electrode layer may include, for example, any of first electrode layers 602, 802, 902, second electrode layers 606, 906, or other electrode layers described herein. Block 1904 may include forming another elastomeric material layer and forming a conductive mesh structure on the elastomeric material layer.

[0204] In some embodiments, the elastomeric material layer may include an electronic connection region, such as PCB interfaces 808, 918, 1300, or any other PCB interface or electronic connection region described herein. Method 1900 may also include, prior to folding: forming a first trace on the elastomeric material layer that electrically couples a first sensor region to a first pad in the electronic connection region; and forming a second trace on the elastomeric material layer that electrically couples a second sensor region to a second pad in the electronic connection region. Each of the first and second traces may include one or more conductive materials.

[0205] In some embodiments, method 1900 may further include forming a Faraday cage substantially surrounding the signal electrode layer. In this and other embodiments, the ground electrode layer may include a first ground electrode layer (such as any of first electrode layers 602, 802, 902), the dielectric layer may include a first dielectric layer formed on the first ground electrode layer (such as dielectric layers 608, 806, 908), the signal electrode layer may be formed on the first dielectric layer, and forming the Faraday cage may include: forming a second ground electrode layer (such as second electrode layers 606, 906) over the signal electrode layer and spaced apart from the signal electrode layer by a second dielectric layer (such as dielectric layers 610, 910); and forming peripheral electrodes (such as peripheral electrodes 807, 912) substantially surrounding the first dielectric layer, the signal electrode layer, and the second dielectric layer. The peripheral electrodes may electrically couple the first ground electrode layer to the second ground electrode layer.

[0206] In some embodiments, the ground electrode layer may include a first ground electrode layer (such as any of first electrode layers 602, 802, 902), the dielectric layer may include a first dielectric layer (such as dielectric layer 608, 806, 908) formed on the first ground electrode layer, and the signal electrode layer may be formed on the first dielectric layer. In this and other embodiments, method 1900 may further include: forming a first dielectric capping layer (such as first dielectric capping layer 914) prior to forming the first ground electrode layer, wherein the first ground electrode layer is formed on the first dielectric capping layer; forming a second dielectric layer (such as dielectric layer 910) on the signal electrode layer; forming a peripheral electrode (such as peripheral electrode 912) substantially surrounding the first dielectric layer, the signal electrode layer, and the second dielectric layer, wherein the peripheral electrode is electrically coupled to the first ground electrode layer; forming a second ground electrode layer (such as second electrode layer 906) on the second dielectric layer and electrically coupling it to the peripheral electrode and the first ground electrode layer; and forming a second dielectric capping layer (such as second dielectric capping layer 916) on the second ground electrode layer.

[0207] Example

[0208] Example 1: Identifying High-Stress Tire Regions

[0209] Figures 20A to 20C This includes a computer model of the tire stresses and their locations generated in this example, arranged according to at least one embodiment described herein. In this example, a 205 / R15 radial tire is mounted on a tire stress system and inflated to approximately 31 pounds per square inch (psi). The tire stresses applied to various locations on the tire are measured by various sensor modules, such as those described herein, with sensor areas distributed at various locations on the inner side of the tire. The measurement results are received by a laptop computer equipped with the ANSYS 19.2 software module. The resulting measurement results are processed and generated as shown below. Figures 20A to 20CThe illustrated images show areas of different stresses depicted with different shading, and high-stress areas in the tread and sidewall (2002 and 2004) indicate tire deformation greater than 10.0 mm. Figure 20A In this context, "CP" indicates the contact mark between the tire and the road surface, and "RC" indicates the radial compression of the tire when it is stationary on the road surface. In this example, RC is measured to be approximately 16 mm. The placement of high-stress areas (such as 2002 and 2004) of the sensor area, dielectric generating material, and / or piezoelectric generating material can increase and / or maximize the magnitude of displacement applied to the individual sensor areas, dielectric generating material, and / or piezoelectric generating material.

[0210] Example 2A: Formation of a laminated detector patch

[0211] To manufacture substantially as disclosed in U.S. Patent Nos. 8,941,281, 9,476,692, and 9,874,431 using the same or similar techniques and / or materials. Figure 6A and Figure 6B An embodiment of the layer is depicted. In this embodiment, eighteen sensor regions 616 (36 channels) are formed / fabricated, but more generally, the number of sensor regions 616 fabricated can be determined as needed. Furthermore, the size of the detector patch 600 is set such that two sensor regions 616 are located at each of the four outer corners of the substantially H-shaped detector patch 600 (see [link to relevant documentation]). Figure 6B The coverage area is placed on the inside of the sidewall of the tire, and two sensor areas 616 located at each of the four inner corners of the substantially H-shaped detector patch 600 are placed on the inside of the shoulder of the tire, and two sensor areas 616 arranged in a T-shape in the middle of the substantially H-shaped detector patch 600 are placed on the inside of the tread of the tire.

[0212] Example 2B: Formation of a laminated detector patch

[0213] To manufacture substantially as disclosed in U.S. Patent Nos. 8,941,281, 9,476,692, and 9,874,431 using the same or similar techniques and / or materials. Figure 6A The depiction has Figure 7AThis embodiment describes a layer covering the signal electrode layer 700A. In this embodiment, two sensor regions 702 (4 channels) are formed / fabricated in the detector patch. Since the number of sensor regions 702 is reduced compared to Example 2A, multiplexing circuitry is not required. Furthermore, in this embodiment, in the non-sensor region, the first and second electrode layers, serving as ground electrodes, include a conductive mesh structure with cross-shading lines at approximately 45° relative to the longitudinal axis of the detector patch. The mesh structure is disposed on the corresponding elastomer layer by depositing conductive ink on the corresponding elastomer layer. The shorter of the two sensor regions 702 corresponds to a position placed on the tire sidewall, while the longer of the two sensor regions 702 corresponds to a position placed on the tire tread.

[0214] Example 3: Formation of a Sensor System

[0215] Connect the detector patch as described in Example 1 to a 9-volt battery and Bluetooth communication circuitry, including an RF antenna. Mount the tire on a rolling resistance machine and inflate it to approximately 31 PSI. View the raw data output on a laptop computer. An additional AI chip can be connected to analyze the aforementioned raw data output.

[0216] Example 4: Formation of an energy generation system

[0217] The detector patch constructed as in Example 1 is electrically connected to an energy generation circuit (e.g., on the inner surface of a portion of a car tire). The energy generation circuit includes a 3-inch × 5-inch piezoelectric generating film and an energy harvesting and storage module that provides strain storage and, upon reaching a given threshold, discharges the accumulated charge to an electrically connected Imprint Energy (Alameda, CA, USA) zinc polymer battery.

[0218] Example 5: Strain and Displacement Testing

[0219] Sensor modules with detector patches, as described in Examples 1 and 2A above, are inserted into the inner surface of a Goodyear R205 / 15 radial tire. Some sensor areas are correspondingly positioned on the inner sidewall of the tire, some on the inner shoulder of the tire, and some on the inner tread of the tire. The sensor modules are bonded in place using an adhesive compound and allowed to cure at room temperature for 24 hours. The resulting tire and the attached sensor modules are mounted on a rolling resistance machine. Each sensor area transmits raw data in the form of capacitive discharge, which is viewed on a laptop computer with a Bluetooth receiver. The resistance applied by the rolling resistance machine is varied, and the corresponding changes in data are recorded.

[0220] Example 6 Energy Generation

[0221] Position the energy generation circuit (such as energy generation circuit 300) and attach it to a portion of the tire. Measure the voltage when the tire, with the attached power generation element (in this example, a piezoelectric film), is manually deformed.

[0222] Figure 21 A block diagram of an example computing system 2102 that can be used to perform or direct the performance of one or more operations described herein is illustrated. The electronic units described herein may include or be implemented as computing system 2102 or a portion thereof. Computing system 2102 may include processor 2104, memory 2106, and data storage area 2108. Processor 2104, memory 2106, and data storage area 2108 may be communicatively coupled.

[0223] Typically, processor 2104 may include any suitable special-purpose or general-purpose computer, computing entity, or processing apparatus comprising various computer hardware or software modules, and may be configured to execute instructions stored on any suitable computer-readable storage medium. For example, processor 2104 may include a microprocessor, microcontroller, DSP, ASIC, FPGA, or any other digital or analog circuit configured to interpret and / or execute computer-executable instructions and / or process data. Although illustrated as a single processor, processor 2104 may include any number of processors configured to perform or direct the execution of any number of operations described in this disclosure, individually or collectively.

[0224] In some embodiments, processor 2104 may be configured to interpret and / or execute computer-executable instructions and / or process data stored in memory 2106, data storage area 2108, or both. In some embodiments, processor 2104 may fetch computer-executable instructions from data storage area 2108 and load the computer-executable instructions into memory 2106. After the computer-executable instructions are loaded into memory 2106, processor 2104 may execute these computer-executable instructions.

[0225] Memory 2106 and data storage area 2108 may include a computer-readable storage medium for carrying or having computer-executable instructions or data structures stored thereon. Such a computer-readable storage medium may include any available medium accessible by a general-purpose or special-purpose computer, such as processor 2104. By way of example and not limitation, such a computer-readable storage medium may include tangible or non-transitory computer-readable storage media, including RAM, ROM, electrically powered EEPROM, read-only optical disc storage (CD-ROM) or other optical disc storage, magnetic disk storage or other magnetic storage devices, flash memory devices (e.g., solid-state storage devices), or any other storage medium that can be used to carry or store specific program code in the form of computer-executable instructions or data structures and is accessible by a general-purpose or special-purpose computer. Combinations of the foregoing may also be included within the scope of computer-readable storage media. Computer-executable instructions may include, for example, instructions and data configured to cause processor 2104 to perform a specific operation or group of operations.

[0226] For the processes and / or methods disclosed herein, the functions performed within the processes and methods may be implemented in different orders, as indicated by the context. Furthermore, the steps and operations outlined are provided only as examples, and some of the steps and operations may be optional, combined into fewer steps and operations, or extended into additional steps and operations.

[0227] This disclosure may sometimes illustrate different components that are contained within or connected to different other components. The architecture depicted is merely exemplary, and many other architectures can be implemented to achieve the same or similar functionality.

[0228] Unless otherwise indicated, all figures representing amounts, properties (such as molecular weight), reaction conditions, etc., of components used in this specification and claims should, in all cases, be understood to be modified by the term "about". Therefore, unless indicated to the contrary, the numerical parameters set forth in this specification and appended claims are approximate values ​​that may vary depending on the desired properties sought. To a minimum, and without attempting to limit the application of the equivalence principle to the scope of the claims, each numerical parameter should be interpreted at least according to the number of significant figures reported and by applying general rounding techniques.

[0229] The terminology used in this disclosure and the appended embodiments (e.g., the body of the appended embodiments) is generally intended to be “open” terms (e.g., the term “including” should be interpreted as “including but not limited to”, the term “having” should be interpreted as “having at least”, the term “includes” should be interpreted as “including but not limited to”, etc.). Furthermore, if a specific number of elements is introduced, this can be interpreted as meaning at least the number listed, as indicated by the context (e.g., a simple enumeration of “two enumerations” without other modifiers means at least two of two or more enumerations). Any extractive words and / or phrases presenting two or more alternative terms as used in this disclosure should be understood to envision the possibility of including one, any, or both of the terms. For example, the phrase “A or B” should be understood to include the possibility of “A” or “B” or “A and B”.

[0230] The terms “a,” “an,” “the,” and similar designations used in the context of describing this disclosure (particularly in the context of the following embodiments) should be construed as encompassing both the singular and plural, unless otherwise indicated herein or clearly contradicted by the context. The use of any and all instances or exemplary language (e.g., “such as”) provided herein is intended only to better illustrate this disclosure and does not constitute a limitation on the scope of any embodiment. No language in this specification should be construed as indicating any non-specificational element essential to the practice of this disclosure.

[0231] The grouping of alternative elements or embodiments disclosed herein should not be construed as limiting. Each member of a group may be referred to and embodied individually or in any combination with other members of that group or other elements found herein. For convenience and / or patentability reasons, it is contemplated that one or more members of a group may be included in or removed from the group. When any such inclusion or removal occurs, this specification is deemed to contain the modified group to satisfy the full written description of the Markusi group used in the appended embodiments.

[0232] This document describes certain embodiments, including the best mode known to the inventors for carrying out this disclosure. Of course, variations of these described embodiments will become apparent to those skilled in the art after reading the foregoing description. The inventors expect those skilled in the art to appropriately employ such variations, and the inventors intend to practice this disclosure in ways other than those specifically described herein. Therefore, the embodiments include all modifications and equivalents permitted by applicable law of the subject matter listed in the embodiments. Furthermore, unless otherwise indicated herein or clearly contradicted by the context, any combination of the foregoing elements in all their possible variations is contemplated.

[0233] Finally, it should be understood that the embodiments disclosed herein are illustrative of the principles of the embodiments. Other modifications may be made within the scope of the embodiments. Therefore, alternative embodiments may be utilized based on the teachings herein, as examples rather than limitations. Thus, the embodiments are not precisely limited to the embodiments shown and described.

[0234] A. A vehicle tire, comprising:

[0235] Tread portion;

[0236] Side wall portion; and

[0237] A sensor module for estimating one or more parameters of the tire, the sensor module comprising:

[0238] A detector patch comprising one or more capacitors, each of the one or more capacitors having a capacitance that varies at least due to deformation of each capacitor; and

[0239] An electronic unit, connected to each capacitor and configured to control the sensor module;

[0240] in:

[0241] The detector patch is adhered to the inside of at least one of the tread portion or the sidewall portion;

[0242] At least one of the capacitors is located on at least one of the inner side of the tread portion and the inner side of the sidewall portion; and

[0243] The electronic unit is configured to estimate at least one of the parameters based on the capacitance of each capacitor.

[0244] B. The vehicle tire according to claim A, wherein the electronic unit is located on the inner side of the tread portion or the sidewall portion.

[0245] C. The vehicle tire according to claim A or B, wherein the capacitor is stacked in two or more layers or one layer in the thickness direction of the detector patch.

[0246] D. The vehicle tire according to any one of claims A to C, wherein each capacitor comprises at least a portion of each of three electrode layers, and two of the electrode layers are grounded.

[0247] E. The vehicle tire according to claim D, wherein the grounding electrode layer has a conductive mesh structure.

[0248] F. The vehicle tire according to claim D, wherein:

[0249] The detector patch also includes peripheral electrodes coupled between the ground electrode layers;

[0250] The signal electrode layer of the three electrode layers is positioned between the ground electrode layers; and

[0251] The ground electrode layer and the peripheral electrode essentially encapsulate the signal electrode layer and form a Faraday cage substantially surrounding the signal electrode layer.

[0252] F. The vehicle tire according to claim D, wherein the three electrode layers are attached to the electronic unit by a conductive adhesive.

[0253] H. The vehicle tire according to any of the preceding claims, wherein each capacitor is charged by direct current, and the change in the capacitance of each capacitor is calculated based on the amount of discharged charge.

[0254] I. The vehicle tire according to any of the preceding claims, wherein:

[0255] The first capacitor of the one or more capacitors has a length and a width;

[0256] The length exceeds the width;

[0257] J. The vehicle tire according to claim 1, wherein: when the sensor module is attached to the tire, the length of the first capacitor is aligned within positive or negative 30 degrees in the tire's direction of travel or within positive or negative 30 degrees in a direction perpendicular to the tire's direction of travel.

[0258] K. The vehicle tire according to any one of claims 1 to J, wherein the one or more capacitors comprise at least a first capacitor and a second capacitor.

[0259] L. The vehicle tire according to claim K, wherein the main axis direction of the first capacitor is oriented in a direction different from the main axis direction of the second capacitor.

[0260] M. The vehicle tire according to claim K, wherein the main axis direction of the first capacitor is orthogonally oriented to the main axis direction of the second capacitor.

[0261] N. The vehicle tire according to any of the preceding claims, wherein the detector patch comprises a plurality of stacked layers, each of the stacked layers having a Young's modulus of 0.1 GPa or less.

[0262] O. The vehicle tire according to any of the preceding claims, wherein the sensor module includes a bending sensor module.

[0263] P. The vehicle tire according to any of the preceding claims, wherein the one or more capacitors of the detector patch include a first capacitor and a second capacitor stacked on the first capacitor in the thickness direction of the detector patch.

[0264] Q. The vehicle tire according to any of the preceding claims, wherein each of the capacitors includes a first node, the first node being substantially encapsulated within and electrically isolated from a second node, the second node forming a Faraday cage substantially surrounding the first node.

[0265] R. The vehicle tire according to any of the preceding claims, wherein the detector patch further comprises:

[0266] First grounding electrode layer;

[0267] The first dielectric layer coupled to the first ground electrode layer;

[0268] A signal electrode layer that is coupled to the first dielectric layer opposite to the first ground electrode layer;

[0269] A second dielectric layer coupled to the signal electrode opposite to the first dielectric layer;

[0270] A second ground electrode layer coupled to the second dielectric layer opposite to the signal electrode layer; and

[0271] The peripheral electrode is electrically coupled between the periphery of the first ground electrode layer and the periphery of the second ground electrode layer, and the signal electrode layer is electrically isolated from the peripheral electrode.

[0272] S. The vehicle tire according to claim R, wherein:

[0273] The one or more capacitors of the detector patch include a first capacitor;

[0274] The signal electrode layer of the detector patch includes a first sensor region of conductive material; and

[0275] The first sensor region and a first portion of the first ground electrode layer and the second ground electrode layer form the first capacitor. The first portions of the first ground electrode layer and the second ground electrode layer are separated from the first sensor region through the first dielectric layer and the second dielectric layer, respectively.

[0276] T. The vehicle tire according to claim R, wherein:

[0277] The one or more capacitors of the detector patch further include a second capacitor;

[0278] The signal electrode layer of the detector patch further includes a second sensor region made of conductive material;

[0279] The first sensor region and the second sensor region are electrically isolated from each other within the signal electrode layer; and

[0280] The second sensor region and the second portion of the first ground electrode layer and the second ground electrode layer form the second capacitor. The second portion of the first ground electrode layer and the second ground electrode layer are separated from the second sensor region through the first dielectric layer and the second dielectric layer, respectively.

[0281] U. The vehicle tire according to any of the preceding claims further includes a power source, wherein the power source includes an energy generation circuit.

[0282] V. A method for estimating one or more parameters of a tire, the method comprising:

[0283] Charge each of one or more capacitors in the detector patch;

[0284] Determine the capacitance of each capacitor, the differential capacitance of a pair of capacitors, or the variation in capacitance of each capacitor; and

[0285] At least one of the parameters is estimated based on the determined capacitance, differential capacitance, or change in capacitance.

[0286] W. The method according to claim V, wherein:

[0287] The determination includes: impedance buffering the voltage of each capacitor; sampling the voltage via an analog-to-digital converter (ADC), wherein the value of the ADC output is proportional to the strain; and applying a calibration coefficient; and

[0288] The estimation includes applying machine learning algorithms to track the characteristics of tire deformation waveforms in order to estimate at least one of tread wear, load, or traction.

[0289] X. The method according to claim V or W further includes calibrating each capacitor prior to the determination and the estimation, including determining a reference output for each capacitor having known tire physical parameters.

[0290] Y. The method of claim X further comprises receiving the output of each capacitor having unknown tire physical parameters, wherein the estimation comprises comparing the reference output having the known tire physical parameters with the output for the unknown tire physical parameters.

[0291] Z. The method according to any one of claims V to Y, further comprising attaching the detector patch to the tire, wherein the length of the first capacitor of the one or more capacitors is aligned within a positive or negative 30 degrees in the direction of travel of the tire or within a positive or negative 30 degrees in a direction perpendicular to the direction of travel of the tire, wherein the first capacitor has the length and width, and the length exceeds the width.

[0292] AA. The method according to any one of claims V to Z further comprises attaching the detector patch to the tire, wherein each capacitor is located near at least one of the group consisting of the tire tread, the tire shoulder, and the tire sidewall.

[0293] BB. The method according to any one of claims V to AA further comprises generating energy in an energy generation circuit coupled to the detector patch to charge each capacitor.

[0294] CC. A detector patch comprising:

[0295] First grounding electrode layer;

[0296] The first dielectric layer coupled to the first ground electrode layer;

[0297] A signal electrode layer that is coupled to the first dielectric layer opposite to the first ground electrode layer;

[0298] A second dielectric layer coupled to the signal electrode opposite to the first dielectric layer;

[0299] A second ground electrode layer coupled to the second dielectric layer opposite to the signal electrode layer; and

[0300] The peripheral electrode is electrically coupled between the periphery of the first ground electrode layer and the periphery of the second ground electrode layer, and the signal electrode layer is electrically isolated from the peripheral electrode.

[0301] DD. The detector patch according to claim CC, wherein at least one of the first ground electrode layer, the signal electrode layer and the second ground electrode layer comprises an elastomeric material, wherein a conductive material is integrated therein or on it.

[0302] EE. The detector patch according to claim CC or DD, wherein at least one of the first ground electrode layer, the signal electrode layer and the second ground electrode layer comprises a conductive mesh structure.

[0303] FF. The detector patch according to any one of claims CC to EE, wherein each of the first ground electrode layer, the first dielectric layer, the signal electrode layer, the second dielectric layer and the second ground electrode layer comprises a Young's modulus of 0.1 GPa or less.

[0304] GG. Detector patch according to any one of claims CC to EE, wherein:

[0305] The signal electrode layer comprises a first sensor region of conductive material and a second sensor region of conductive material; and

[0306] The first sensor region and the second sensor region are electrically isolated from each other within the signal electrode layer.

[0307] HH. The detector patch according to claim GG, wherein:

[0308] The first sensor region and a first portion of the first ground electrode layer and the second ground electrode layer form a first capacitor, and the first portions of the first ground electrode layer and the second ground electrode layer are respectively separated from the first sensor region through the first dielectric layer and the second dielectric layer; and

[0309] The second sensor region and the second portion of the first ground electrode layer and the second ground electrode layer form a second capacitor. The second portion of the first ground electrode layer and the second ground electrode layer are separated from the second sensor region through the first dielectric layer and the second dielectric layer, respectively.

[0310] II. The detector patch according to any one of claims C to HH, wherein the first ground electrode layer, the second ground electrode layer and the peripheral electrode form a Faraday cage substantially surrounding the signal electrode layer.

[0311] JJ. A method for forming a detector patch, the method comprising:

[0312] Forming a signal electrode layer includes:

[0313] Forming an elastomer material layer;

[0314] A first sensor region is formed on the elastomeric material layer in a first portion of the elastomeric material layer;

[0315] Place the interpolator on the first sensor area;

[0316] A second sensor region is formed on the elastomeric material layer in a second portion thereof, wherein each of the first sensor region and the second sensor region comprises one or more conductive materials; and

[0317] Folding the elastomeric material layer to position the second portion on the first portion, wherein the second sensor region is aligned with the first sensor region and separated from the first sensor region by the intercalator, wherein the signal electrode layer comprises the folded elastomeric material layer, wherein the aligned first and second sensor regions are separated by the intercalator; and

[0318] A ground electrode layer is formed, which is spaced apart from the signal electrode layer by a dielectric layer.

[0319] KK. The method according to claim JJ, wherein the elastomeric material layer includes electronically connected regions, and the method further comprises prior to the folding:

[0320] A first trace is formed on the elastomeric material layer, the first trace electrically coupling the first sensor region to a first electrical pad in the electronic connection region; and

[0321] A second trace is formed on the elastomeric material layer, the second trace electrically coupling the second sensor region to a second electrical pad in the electronic connection region;

[0322] Each of the first trace and the second trace comprises one or more conductive materials.

[0323] LL. The method according to claim JJ or KK further comprises forming a Faraday cage substantially surrounding the signal electrode layer.

[0324] MM. The method according to claim LL, wherein the ground electrode layer comprises a first ground electrode layer, the dielectric layer comprises a first dielectric layer formed on the first ground electrode layer, the signal electrode layer is formed on the first dielectric layer, and forming the Faraday cage comprises:

[0325] A second ground electrode layer is formed above the signal electrode layer and spaced apart from the signal electrode layer by a second dielectric layer; and

[0326] A peripheral electrode is formed substantially surrounding the first dielectric layer, the signal electrode layer, and the second dielectric layer, and electrically coupling the first ground electrode layer to the second ground electrode layer.

[0327] NN. The method according to any one of claims JJ to MM, wherein the ground electrode layer comprises a first ground electrode layer, the dielectric layer comprises a first dielectric layer formed on the first ground electrode layer, and the signal electrode layer is formed on the first dielectric layer, the method further comprising:

[0328] A first dielectric capping layer is formed before the first ground electrode layer is formed, wherein the first ground electrode layer is formed on the first dielectric capping layer;

[0329] A second dielectric layer is formed on the signal electrode layer;

[0330] A peripheral electrode is formed substantially around the first dielectric layer, the signal electrode layer, and the second dielectric layer, wherein the peripheral electrode is electrically coupled to the first ground electrode layer;

[0331] A second ground electrode layer is formed on the second dielectric layer and electrically coupled to the peripheral electrode and the first ground electrode layer; and

[0332] A second dielectric capping layer is formed on the second ground electrode layer.

[0333] OO. The method according to any one of claims JJ to NN, wherein forming the ground electrode layer comprises forming another elastomeric material layer and forming a conductive mesh structure on the other elastomeric material layer.

Claims

1. A vehicle tire, comprising: Tread portion; Side wall portion; and A sensor module used to estimate one or more parameters of the tire. The sensor module includes: A detector patch comprising one or more capacitors, each of the one or more capacitors having a capacitance that varies at least due to deformation of each capacitor; and An electronic unit, connected to each capacitor and configured to control the sensor module. in: The detector patch is adhered to the inside of at least one of the tread portion or the sidewall portion. At least one of the capacitors is located on the inner side of at least one of the tread portion or the sidewall portion, and The electronic unit is configured to estimate at least one of the parameters based on the capacitance of each capacitor. The first capacitor of the one or more capacitors has a length and a width, wherein the length exceeds the width. The one or more capacitors include at least a first capacitor and a second capacitor. The principal axis of the first capacitor is oriented in a direction different from that of the second capacitor, or the principal axis of the first capacitor is oriented orthogonally to the principal axis of the second capacitor. The first capacitor and the second capacitor are configured to be separate from each other, and The one or more capacitors are flexible, expandable, extendable and / or deformable. The detector patch includes a bending sensor, which comprises a first pair of capacitors and a second pair of capacitors. A first differential signal from the first pair of capacitors measures the angular displacement of the bending sensor in a first direction, and a second differential signal from the second pair of capacitors measures the angular displacement of the bending sensor in a second direction different from the first direction.

2. The vehicle tire according to claim 1, wherein, The electronic unit is located on the inner side of the tread portion or the sidewall portion.

3. The vehicle tire according to claim 1, wherein, The capacitors are stacked in two or more layers or one layer in the thickness direction of the detector patch.

4. The vehicle tire according to claim 1, wherein, Each capacitor contains at least a portion of each of three electrode layers, and two of the electrode layers are grounded.

5. The vehicle tire according to claim 4, wherein, The grounding electrode layer has a conductive mesh structure.

6. The vehicle tire according to claim 4, wherein: The detector patch also includes peripheral electrodes coupled between the ground electrode layers; The signal electrode layer of the three electrode layers is positioned between the ground electrode layers; and The ground electrode layer and the peripheral electrode essentially encapsulate the signal electrode layer and form a Faraday cage substantially surrounding the signal electrode layer.

7. The vehicle tire according to claim 4, wherein, The three electrode layers are attached to the electronic unit using a conductive adhesive.

8. The vehicle tire according to claim 1, wherein, Each capacitor is charged by direct current, and the change in capacitance of each capacitor is calculated based on the amount of discharged charge.

9. The vehicle tire according to claim 1, wherein: When the sensor module is attached to the tire, the length of the first capacitor is aligned within ±30 degrees of the tire's direction of travel or within ±30 degrees of the direction perpendicular to the tire's direction of travel.

Images