Image sensor chip and spectrum recognition device

Abstract

The present invention discloses an image sensor chip and a spectrum recognition device. It belongs to the field of spectrum recognition technology. The chip structure is sequentially distributed into a light modulation layer, an image sensing layer and a signal processing circuit layer. The light modulation layer is composed of a number of modulation units, each of which is a transparent cylinder placed on the image sensing layer as a resonant cavity, and all the modulation units are evenly arranged in an array; the image sensing layer is composed of photoelectric sensing units; the signal processing circuit layer is connected below the image sensing layer and is electrically connected to each photoelectric sensing unit. The chip and the device, based on the chip unit array, identify and obtain the measured value and spectral response on the detector within the working angle of 0°-30°, obtain the spectral characteristic response function, and can realize the accurate identification of the incident light when actually measuring the spectrum information of the object imaging, and propose a new spectral imaging method to solve the problem that the existing spectral imaging equipment is expensive and cannot be miniaturized.

Description

Technical Field

[0001] The present invention belongs to the technical field of spectrum recognition, and in particular relates to an image sensor chip and a spectrum recognition device. Background Art

[0002] Spectral imaging technology is a technology that uses single or multiple spectral channels to collect and process spectral data, display images, and analyze and interpret them. It can identify substances and analyze their chemical composition, and has important theoretical and practical significance. At present, this technology is widely used in health care, scientific research, agricultural production, resource exploration, disaster warning, authenticity detection and other fields, and has become an important technical means for human space exploration.

[0003] Spectroscopic analysis is one of the most widely used analytical tools in scientific research and industry. Although laboratory benchtop spectrometer systems offer the highest resolution and spectral range, their miniaturization is essential for applications where portability is critical or field measurements must be performed. As an indispensable precision detection instrument in modern society, spectroscopic instruments are widely used in environmental monitoring, food testing, biomedicine and other fields. Based on the increasing number of projects that need to be detected in modern society and the different detection environments, there is an increasing demand for on-site detection and miniaturization of spectroscopic instruments. Traditional benchtop spectrometers usually rely on a combination of large optical dispersion devices, long optical path lengths, detector arrays and movable parts, all of which hinder their miniaturization.

[0004] In the prior art, there are devices that use traditional planar FP resonant cavities to modulate light to obtain the spectrum of an object. However, this technology can only measure a limited number of spectral bands and has problems such as excessive light energy loss. Summary of the invention

[0005] In view of this, the purpose of the present invention is to provide an image sensor chip and a spectrum recognition device, which solves the problem of greatly reducing the loss of light energy during the modulation process of the incident light, and is conducive to improving the accuracy and stability of spectrum recognition.

[0006] The first object of the present invention is achieved through the following technical scheme: an image sensor chip, comprising a light modulation layer, an image sensing layer, and a signal processing circuit layer; the light modulation layer comprises a plurality of modulation units, the image sensing layer comprises a plurality of photoelectric sensing units, the modulation unit and the photoelectric sensing unit correspond one to one or a single modulation unit corresponds to multiple photoelectric sensing units; the signal processing circuit layer is connected under the image sensing layer, and is electrically connected to each of the photoelectric sensing units, respectively.

[0007] Preferably, the modulation unit is a transparent cylinder arranged along the surface of the light modulation layer as a resonant cavity, and each transparent cylinder is arranged into a two-dimensional graphic structure with a specific arrangement rule.

[0008] Preferably, the transparent cylinders in the same two-dimensional graphic structure are arranged in an array, the transparent cylinders have the same structure, and the cross-section of the transparent cylinders is circular.

[0009] Preferably, the image sensing layer is a CMOS chip or a CCD chip.

[0010] Preferably, the CMOS chip adopts a black and white sensor chip or a color sensor chip, and the CCD chip adopts a black and white sensor chip or a color sensor chip.

[0011] Preferably, the plurality of photoelectric sensing units of the image sensing layer are arranged in a matrix.

[0012] Preferably, the image sensor chip further includes a filter layer located above the light modulation layer.

[0013] Preferably, the projection of the filter layer completely covers the light modulation layer.

[0014] Preferably, the filter layer is a filter.

[0015] The second object of the present invention is achieved through the following technical solution: a spectrum recognition device, comprising: an optical lens with a rotatable angle and the image sensor chip as described above, wherein the image sensor chip is arranged on one side of the optical lens, and the optical lens is used to focus the object and emit incident light into the image sensor chip; the image sensor chip is used to receive the incident light from the optical lens and optically modulate the incident light to obtain all corresponding resonance intensity information within the rotation angle range.

[0016] Compared with the prior art, the present invention has the following advantages:

[0017] 1. In the image sensor chip described in the present invention, the light modulation layer uses a transparent column as a resonant cavity. Different from the traditional planar resonant cavity, a cylindrical cavity is used. The incident light hits the side wall of the cavity and is totally reflected. When scanning at different angles, there will not be much loss of light energy, which is beneficial to improve the accuracy of spectral recognition.

[0018] 2. In the image sensor chip described in the present invention, a CMOS chip or a CCD chip is used as an image sensing layer, which ensures the stability of the device and greatly promotes the miniaturization of object imaging devices such as imaging spectrometers.

[0019] 3. It has the characteristics of low cost, small size, light weight and stable performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of an image sensor chip provided in an embodiment.

[0021] Figure 2 A schematic diagram of the working state of the spectral imaging device provided in the embodiment.

[0022] Figure 3 A schematic diagram of the structure of the light modulation layer provided in the embodiment from a top view.

[0023] Figure 4 A schematic structural diagram of the stereoscopic viewing angle of the light modulation layer provided in an embodiment.

[0024] Figure 5 A schematic diagram of the structure of the image sensing layer from a top-down perspective provided in an embodiment.

[0025] Figure 6 A schematic structural diagram of the stereoscopic viewing angle of the image sensing layer provided in an embodiment.

[0026] Figure 7 A schematic diagram of the angle adjustment process of the spectrum recognition device provided in the embodiment.

[0027] Figure 8 1 is a characteristic curve of the spectrum transmitted through the resonant cavity when the angle is 0° and 30° during the angle adjustment process of the embodiment.

[0028] In the figure, 1, image sensor chip; 1a, filter layer; 1b, light modulation layer; 1b1, first substrate; 1b2, modulation unit; 1c, image sensor layer; 1c1, second substrate; 1c2, photoelectric sensing unit; 1d, signal processing circuit layer; 2, optical lens. DETAILED DESCRIPTION

[0029] The technical scheme of the present invention will be further described in detail below in conjunction with specific embodiments. It should be understood that the following embodiments are only exemplary descriptions and explanations of the present invention and should not be construed as limiting the scope of protection of the present invention. All technologies implemented based on the above content of the present invention are included in the scope that the present invention is intended to protect. Example 1

[0030] like Figure 1 As shown, the image sensor chip 1 of this embodiment includes a filter layer 1a, a light modulation layer 1b, an image sensor layer 1c, and a signal processing circuit layer 1d.

[0031] The light modulation layer 1b is located below the filter layer 1a, and the light modulation layer 1b includes a first substrate 1b1 and a plurality of modulation units 1b2 disposed on the first substrate 1b1. The modulation unit 1b2 is a transparent cylinder arranged on the surface of the substrate. A plurality of transparent cylinders are arranged into a two-dimensional graphic structure with a specific arrangement rule. For example, in this embodiment, a plurality of transparent cylinders are arranged into a square array. The transparent cylinders in the same two-dimensional graphic structure are arranged in an array, and the structure of each transparent cylinder is the same, and the cross-section of the transparent cylinder is circular. It should be noted that in other optional embodiments of the present invention, a plurality of transparent cylinders can also be arranged into circular, triangular, and other arrays.

[0032] The transparent cylinder is used as a resonant cavity. The refractive index of each resonant cavity is higher than that of general materials, and it can be used as a separate light modulation structure. Therefore, when the incident light enters the resonant cavity, it is totally reflected on the side wall of the cavity. When the incident light scans at different angles, there will not be much loss of light energy.

[0033] The filter layer 1a is a filter, which is arranged at the top. The projection of the filter layer 1a can completely cover the array composed of transparent columns.

[0034] The image sensing layer 1c is arranged below the light modulation layer 1b and is formed by a CMOS chip. It includes a second substrate 1c1 and a plurality of photoelectric sensing units 1c2 arranged on the second substrate 1c1, and the plurality of photoelectric sensing units 1c2 are arranged in a matrix. The modulation units 1b2 on the light modulation layer 1b correspond one to one with the photoelectric sensing units 1c2, or a single modulation unit 1b2 corresponds to a plurality of photoelectric sensing units 1c2. It should be pointed out that the CMOS chip can be a black and white sensor chip or a color sensor chip, which can be selected according to actual needs. The image sensing layer 1c formed by the CMOS chip is thin in volume and light in weight, has low power consumption during use, stable performance, and has good impact and vibration resistance; and it has high sensitivity, low noise, and fast response speed. After the image is processed, the deformation of the image is small and no residual phase will appear.

[0035] The signal processing circuit layer 1d is connected to the bottom of the image sensing layer 1c and is electrically connected to each photoelectric sensing unit 1c2. Example 2

[0036] The structures of this embodiment and embodiment 1 are roughly the same, except that in this embodiment, the image sensing layer 1c is formed by a CCD chip, which has a higher integration level, a faster image acquisition speed, and a better imaging effect.

[0037] It can be understood that the image sensor chip 1 provided in the above embodiments can replace the complex and precise spectroscopic elements and excessive image sensors in the existing spectral recognition equipment, and the transparent cylinder acts as a resonant cavity to replace the traditional planar resonant cavity, and the modulation unit 1b2 and the sensing unit are used to modulate the incident light of the object and sense the resonance intensity respectively, and then the spectral characteristics are reconstructed through the algorithm, thereby realizing an accurate spectral recognition process, and can perform spectral imaging without the need for gratings, prisms, reflectors or other similar spatial spectroscopic elements, so that the object imaging and recognition equipment has the advantages of high measurement accuracy, good portability, simple operation, stable performance, low manufacturing cost, etc. Example 3

[0038] This embodiment provides a spectrum recognition device, which mainly includes an optical lens 2 with a rotatable angle and an image sensor chip 1 provided in the above embodiment, and the image sensor chip 1 is arranged on one side of the optical lens 2. The rotation angle of the optical lens 2 is 0-30°, and the optical lens 2 is used to focus the object and inject the incident light into the image sensor chip 1; the image sensor chip 1 is used to receive the incident light from the optical lens 2 and optically modulate the incident light to obtain all the corresponding resonance intensity information within the rotation angle range. Figure 2 As shown, the principle is that by changing the rotation angle of the optical lens 2 and the central axis of the resonant cavity, the incident angle of the incident light entering the resonant cavity is changed, and the device can scan from 0°-30°. After scanning, the image sensor chip 1 records the corresponding data, and finally performs the functions of spectral restoration and imaging.

[0039] Specifically, Figure 7 As shown in the figure, it specifically shows the propagation optical path diagram of the light in the resonant cavity of the optical modulation layer 1b when the light is incident at an angle of 0° and 30°. The different incident angles make the optical path of the light through the resonant cavity different, which is equivalent to the different lengths of the resonant cavity. The spectral characteristics of the light passing through the resonant cavity are different. The spectral characteristic curve is shown in Figure 8 As shown, the left figure is the spectrum curve passing through the resonant cavity at 0°, and the right figure is the spectrum curve passing through the resonant cavity at 30°.

[0040] By collecting the incident light and received light intensity data within the working angle, the spectral characteristic response function can be reconstructed using the algorithm, and finally the spectrum within a certain range can be measured. When actually measuring the spectrum information of the object imaging, the spectral characteristic response function can be used to reversely realize the accurate identification of the incident light, thus solving the problem that the existing spectral identification equipment is expensive and cannot be miniaturized.

[0041] It can be understood that rotating the incident angle is equivalent to changing the cavity length of the resonant cavity, and the range of the rotation angle can directly affect the rank of the spectral characteristic response system function matrix. The wider the range, the more accurate the actual spectral restoration result. However, the larger the angle, the higher the hardware requirements, so it cannot be increased indefinitely.

[0042] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. An image sensor chip, comprising a light modulation layer (1b), an image sensor layer (1c), and a signal processing circuit layer (1d); characterized in that: The light modulation layer (1b) includes a plurality of modulation units (1b2), the image sensing layer (1c) includes a plurality of photoelectric sensing units (1c2), the modulation units (1b2) and the photoelectric sensing units (1c2) correspond one to one, or a single modulation unit (1b2) corresponds to a plurality of photoelectric sensing units (1c2); the signal processing circuit layer (1d) is connected below the image sensing layer (1c) and is electrically connected to each of the photoelectric sensing units (1c2), the light modulation layer (1b) includes a first substrate (1b1) and a plurality of modulation units (1b2) arranged on the first substrate (1b1), the modulation units (1b2) are transparent columns arranged along the surface of the light modulation layer (1b) as resonant cavities, each of the transparent columns is arranged into a two-dimensional graphic structure with a specific arrangement rule, the transparent columns constitute a separate light modulation structure, and when incident light enters the resonant cavity, total reflection occurs on the cavity side wall of the resonant cavity.

2. The image sensor chip according to claim 1, characterized in that: The transparent columns in the same two-dimensional graphic structure are arranged in an array, the transparent columns have the same structure, and the cross-section of the transparent columns is circular.

3. An image sensor chip according to claim 1 or 2, characterized in that: The image sensing layer (1c) is a CMOS chip or a CCD chip.

4. The image sensor chip according to claim 3, characterized in that: The CMOS chip adopts a black-and-white sensor chip or a color sensor chip, and the CCD chip adopts a black-and-white sensor chip or a color sensor chip.

5. An image sensor chip according to claim 1 or 2, characterized in that: The plurality of photoelectric sensing units (1c2) of the image sensing layer (1c) are arranged in a matrix.

6. An image sensor chip according to claim 1 or 2, characterized in that: The image sensor chip (1) also includes a filter layer (1a) located above the light modulation layer (1b).

7. The image sensor chip according to claim 6, characterized in that: The projection of the filter layer (1a) completely covers the light modulation layer (1b).

8. The image sensor chip according to claim 6, characterized in that: The filter layer (1a) is a filter.

9. A spectrum recognition device, comprising: An optical lens (2) capable of rotating at an angle and an image sensor chip (1) according to any one of claims 1 to 8, wherein the image sensor chip (1) is arranged on one side of the optical lens (2), and the optical lens (2) is used to focus an image and emit incident light into the image sensor chip (1); the image sensor chip (1) is used to receive incident light from the optical lens (2) and optically modulate the incident light to obtain all corresponding resonance intensity information within the rotation angle range.

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