An electrostatic protection circuit and electrostatic protection panel for a TFT panel of electronic paper

Abstract

The application provides an electrostatic protection circuit and electrostatic protection panel of TFT panel of electronic paper, which comprises a ring-shaped damage detection line layer and a ring-shaped common line layer with openings arranged at the outer edge of the TFT panel, the TFT panel comprises a substrate and an insulating layer, the damage detection line layer and the common line layer are arranged between the substrate and the insulating layer, and the electrostatic protection circuit further comprises a ring-shaped electrostatic protection line layer with an opening and a first metal line layer, the electrostatic protection line layer is arranged at the outer edge of the upper end of the insulating layer, the first metal line layer is arranged between the substrate and the insulating layer, the first metal line layer is arranged below the electrostatic protection line layer, the first metal line layer and the electrostatic protection line layer form a capacitor, and the electrostatic protection line layer is arranged outside the damage detection line layer. In the application, the electrostatic protection line layer and the first metal line layer form a capacitor to absorb static electricity and prevent static electricity from breaking the common line layer and the damage detection line layer; the electrostatic protection line layer absorbs static electricity above the TFT panel, and the damage detection line layer absorbs static electricity inside the TFT panel, so that static electricity can be comprehensively absorbed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic paper, in particular to an electronic paper TFT panel electrostatic protection circuit and an electrostatic protection panel. BACKGROUND

[0002] Electronic paper ink screen display has the characteristics of ultra-low power consumption, low frequency display and power saving, and has a wide application market in price tags, education tablets and bus stop boards.

[0003] With the large-scale production of electronic paper modules, yield improvement and quality control contribute significantly to cost optimization. At present, there are ESD damage quality problems in the production process, which leads to cost loss. By improving the electrostatic protection capability of the TFT glass panel, the ESD damage loss in the module production process can be effectively reduced. The existing electrostatic protection design of the TFT panel is shown in Figure 1 As shown in the figure, the non-display area of the TFT panel 1 is composed of a common line layer 3 and a damage detection line layer 2.

[0004] Among them, the traditional TFT panel includes a substrate, an insulating layer, a TFT and a pixel electrode arranged in turn from bottom to top, the insulating layer is arranged on the substrate, the gate of the TFT is arranged between the substrate and the insulating layer, the source, the drain and the semiconductor of the TFT are arranged in the insulating layer, and the ITO pixel electrode is arranged above the insulating layer. The common line layer in the existing electrostatic protection design is arranged between the substrate and the insulating layer, and the damage detection line layer is also arranged between the substrate and the insulating layer.

[0005] In order to improve the production efficiency of electronic paper, in the traditional technology, a plurality of electronic papers are batched on a large panel, and then each electronic paper is cut and separated after the electronic paper is made. In the cutting and separating process, static electricity will be generated at the cutting position, and the spacing between adjacent electronic papers is small, so the static electricity will be absorbed by the common line layer and the damage detection line layer.

[0006] However, when batched, there are many electronic papers on the panel, so several times of cutting are required, which leads to frequent generation of static electricity. Under the influence of frequent static electricity, static breakdown is prone to occur between the common line layer and the damage detection line layer, resulting in failure of the entire electronic paper product. SUMMARY

[0007] The technical problem to be solved by the present application is to provide an electronic paper TFT panel electrostatic protection circuit and an electrostatic protection circuit panel, which solves the problem of static breakdown between the common line layer and the damage detection line layer in the prior art.

[0008] The technical scheme adopted by the present application to solve the above problems is: an electrostatic protection circuit of a TFT panel of electronic paper, comprising a ring-shaped damage detection line layer and a ring-shaped common line layer provided with openings at the outer edge of the TFT panel, the TFT panel comprising a substrate and an insulating layer provided on the substrate, the damage detection line layer and the common line layer are both provided between the substrate and the insulating layer, one side of the openings of the damage detection line layer and the common line layer is provided with a driving IC and an FPC, the damage detection line layer is electrically connected with the ground end of the driving IC and the FPC, the common line layer is electrically connected with the FPC, further comprising a ring-shaped electrostatic protection line layer and a first metal line layer provided with openings, the openings of the electrostatic protection line layer and the first metal line layer are both directed to the side of the driving IC and the FPC, the electrostatic protection line layer is provided at the outer edge of the upper end of the insulating layer, the first metal line layer is provided between the substrate and the insulating layer, and the first metal line layer is provided below the electrostatic protection line layer, the first metal line layer and the electrostatic protection line layer form a capacitor, and the electrostatic protection line layer is provided outside the damage detection line layer.

[0009] Compared with the prior art, the present application has the advantages that: by providing the electrostatic protection line layer and the first metal line layer to form a capacitor, the absorption of static electricity is realized, and the static electricity is prevented from breaking through the common line layer and the damage detection line layer; the electrostatic protection line layer absorbs the static electricity above the TFT panel, and the damage detection line layer absorbs the static electricity inside the TFT panel, so that the static electricity in various places can be effectively absorbed, and the influence of static electricity on the TFT in the TFT panel is prevented; the electrostatic protection line layer is provided at the outermost side, so that all components in the TFT panel can be protected in the largest range, and static electricity interference is prevented.

[0010] Preferably, the first metal line layer is formed by a plurality of metal units arranged in sequence.

[0011] The technical effects achieved by the technical scheme are: by the plurality of metal units, a plurality of capacitors can be formed with the electrostatic protection line layer, so that the storage of static electricity is better realized, and static electricity is absorbed in time.

[0012] Preferably, the distance between the electrostatic protection line layer and the outer edge of the TFT panel is 50-1000 μm.

[0013] The technical effects achieved by the technical scheme are: the electrostatic protection line layer is provided close to the outer edge of the TFT panel, so that static electricity in the cutting process can be absorbed in time when cutting each electronic paper.

[0014] Preferably, further comprising a ring-shaped second metal line layer provided with an opening, the opening of the second metal line layer is directed to the side of the driving IC and the FPC, the second metal line layer is provided in the insulating layer, and the second metal line layer is provided above the first metal line layer, and the insulating layer is provided with a via hole for electrically connecting the second metal line layer and the electrostatic protection line layer.

[0015] The technical effects achieved by the technical scheme are as follows: the second metal wire layer is arranged in the insulating layer, which is closer to the first metal wire layer, so that the capacitor formed by the second metal wire layer and the first metal wire layer can better absorb static electricity.

[0016] Preferably, the static protection wire layer is provided with a pointed discharge part at the position of each corner of the TFT panel.

[0017] The technical effects achieved by the technical scheme are as follows: the static electricity absorbed can be discharged through the pointed discharge part, and the pointed discharge part is arranged at the position of each corner of the TFT panel, which can provide a larger space position and is far away from the electronic components in the TFT panel, so that the electronic components in the TFT panel are effectively prevented from being affected by the pointed discharge.

[0018] Preferably, the pointed discharge part comprises a first discharge sheet and a second discharge sheet, one end of the static protection wire layer at the disconnected position is electrically connected to the first discharge sheet, the other end of the static protection wire layer at the disconnected position is electrically connected to the second discharge sheet, the first discharge sheet and the second discharge sheet have a gap therebetween, the first discharge sheet is provided with a plurality of first discharge tips on the side facing the gap, the second discharge sheet is provided with a plurality of second discharge tips on the side facing the gap, and the plurality of first discharge tips are oppositely arranged with the plurality of second discharge tips.

[0019] The technical effects achieved by the technical scheme are as follows: one end of the static protection wire layer at the disconnected position is electrically connected to the first discharge sheet and the second discharge sheet, so that the static electricity is discharged on the static protection wire layer; the plurality of oppositely arranged discharge tips can discharge the static electricity, so that the static electricity does not affect the inner damage detection wire layer and the common wire layer.

[0020] Preferably, the pointed discharge part comprises a third discharge sheet and a fourth discharge sheet, both ends of the static protection wire layer at the disconnected position are electrically connected to the third discharge sheet, the third discharge sheet and the fourth discharge sheet have a gap therebetween, the third discharge sheet and the fourth discharge sheet are both in a zigzag shape on the side facing the gap, the end of the zigzag shape of the third discharge sheet forms a plurality of third discharge tips, the end of the zigzag shape of the fourth discharge sheet forms a plurality of fourth discharge tips, and the plurality of third discharge tips are oppositely arranged with the plurality of fourth discharge tips.

[0021] The technical effects achieved by the technical scheme are as follows: one of the two discharge sheets is electrically connected to the static protection wire layer, and the other discharge sheet discharges the static electricity, so that the static electricity can be discharged in time; the plurality of oppositely arranged discharge tips can discharge the static electricity, so that the static electricity does not affect the inner damage detection wire layer and the common wire layer.

[0022] Preferably, the wave crests of the plurality of third discharge tips are arranged opposite to the wave troughs of the plurality of fourth discharge tips.

[0023] The technical effects achieved by the technical scheme are that the wave crests of the two discharge tips are arranged opposite to the wave troughs, so that the static electricity released by the wave crests of the third discharge tips can be maximally and comprehensively absorbed by the wave troughs of the fourth discharge tips, and static electricity release is achieved.

[0024] The present application also adopts another technical scheme to solve the above problems: an electrostatic protection panel includes a plurality of matrix-arranged TFT panels, the TFT panels are provided with TFT panel electrostatic protection circuits of electronic paper, and the electrostatic protection wire layers on any two adjacent TFT panels are electrically connected.

[0025] Compared with the prior art, the present application has the advantages that when each electronic paper on the electrostatic protection panel is cut, the electrostatic protection wire layers electrically connected to each other can release static electricity to the entire electrostatic protection panel, so that static electricity release is achieved more quickly, and each electronic paper can avoid static breakdown.

[0026] Preferably, the electrostatic protection wire layers between adjacent TFT panels are electrically connected through a meander line.

[0027] The technical effects achieved by the technical scheme are that the meander line arrangement improves the overall anti-static ability; at the same time, in the multi-layer design of the TFT panel of electronic paper, the meandering of the meander line can lengthen the capacitance capacity formed with the first metal wire layer, and improve the static electricity absorption capacity. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 The electrostatic protection circuit on the TFT panel of electronic paper in the prior art;

[0029] Figure 2 The structure schematic diagram of the TFT panel electrostatic protection circuit of electronic paper in the first embodiment of the present application;

[0030] Figure 3 The structure schematic diagram of the TFT panel electrostatic protection circuit of electronic paper in the first embodiment of the present application; Figure 2 The sectional view along the cutting line A-A direction in the present application;

[0031] Figure 4 The sectional view along the cutting line B-B direction in the present application; Figure 2 The sectional view along the cutting line B-B direction in the present application;

[0032] Figure 5 The structure enlarged schematic diagram of the tip discharge part at C in the present application; Figure 2 The structure enlarged schematic diagram of the tip discharge part at C in the present application;

[0033] Figure 6 The structure enlarged schematic diagram of the tip discharge part at C in the present application;Figure 2 An enlarged schematic diagram of another structure of the tip discharge section at point C;

[0034] Figure 7 This is a cross-sectional view of the four corners of the TFT panel in a second embodiment of the electrostatic protection circuit for an electronic paper TFT panel according to the present invention.

[0035] Figure 8 This is a schematic diagram of the structure of an electrostatic protection panel according to the present invention;

[0036] Figure 9 This is a schematic diagram of the serpentine structure of an electrostatic protection panel according to the present invention.

[0037] Explanation of reference numerals in the attached figures: 1-TFT panel; 11-Driver IC; 12-FPC; 13-Substrate; 14-Insulating layer; 141-First insulating layer; 142-Second insulating layer; 2-Damage inspection line layer; 3-Common line layer; 4-Electrostatic discharge protection line layer; 5-First metal line layer; 6-Second metal line layer; 61-Via; 7-Tip discharge section; 71-First discharge plate; 711-First discharge tip; 72-Second discharge plate; 721-Second discharge tip; 73-Third discharge plate; 731-Third discharge tip; 74-Fourth discharge plate; 741-Fourth discharge tip; 8-Serpentine line. Detailed Implementation

[0038] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0039] Example 1

[0040] like Figures 2 to 6 As shown, this embodiment relates to an electrostatic discharge protection circuit for an electronic paper TFT panel, including an annular defect detection line layer 2 and an annular common line layer 3 with an opening disposed at the outer edge of the TFT panel 1. The TFT panel 1 includes a substrate 13 and an insulating layer 14 disposed on the substrate 13. The defect detection line layer 2 and the common line layer 3 are both disposed between the substrate 13 and the insulating layer 14. A driver IC 11 and an FPC 12 are disposed on one side of the opening of the defect detection line layer 2 and the common line layer 3. The defect detection line layer 2 is electrically connected to the ground terminal of the driver IC 11 and the FPC 12, and the common line layer 3 is electrically connected to the FPC 12.

[0041] The TFT panel static electricity protection circuit of the electronic paper further comprises a ring-shaped static electricity protection line layer 4 with an opening and a first metal line layer 5, the openings of the static electricity protection line layer 4 and the first metal line layer 5 are both towards the side of the driving IC 11 and the FPC 12, the static electricity protection line layer 4 is arranged at the outer edge of the upper end of the insulating layer 14, the first metal line layer 5 is arranged between the substrate 13 and the insulating layer 14, and the first metal line layer 5 is arranged below the static electricity protection line layer 4, and the first metal line layer 5 and the static electricity protection line layer 4 form a capacitor.

[0042] The static electricity protection line layer 4 and the first metal line layer 5 are arranged to form a capacitor, thereby absorbing static electricity and preventing static electricity from breaking the common line layer 3 and the damage detection line layer 2; the static electricity protection line layer 4 absorbs static electricity above the TFT panel 1, and the damage detection line layer 2 absorbs static electricity inside the TFT panel 1, thereby effectively absorbing static electricity from all places and preventing static electricity from affecting the TFT inside the TFT panel 1.

[0043] In the embodiment, the static electricity protection line layer 4 is arranged outside the damage detection line layer 2.

[0044] Arranging the static electricity protection line layer 4 at the outermost side can protect all components inside the TFT panel 1 from static electricity interference.

[0045] The first metal line layer 5 is composed of multiple metal units arranged in sequence.

[0046] The multiple metal units can form multiple capacitors with the static electricity protection line layer 4, thereby better storing static electricity and absorbing static electricity in time.

[0047] In the embodiment, the distance between the static electricity protection line layer 4 and the outer edge of the TFT panel 1 is 50-1000 μm.

[0048] Arranging the static electricity protection line layer 4 close to the outer edge of the TFT panel 1 can absorb static electricity in the cutting process in time when cutting each electronic paper.

[0049] In the embodiment, the steps for manufacturing the entire TFT panel 1 are as follows:

[0050] S1, manufacturing a plurality of gate layers of TFTs on the middle display area of the substrate 13, and arranging corresponding common layers beside each gate layer of TFT; manufacturing a common line layer 3 with an opening on the outer edge non-display area of the substrate 13, and manufacturing a driving IC 11 and an FPC 12 at the opening;

[0051] S2, make the damage detection line layer 2 on the substrate 13 outside the public line layer 3, and then make the first metal line layer 5 outside the damage detection line layer 2;

[0052] S3, cover the first insulating layer 141 in the insulating layer 14 on the first metal line layer 5, the damage detection line layer 2, the public line layer 3, the gate layer of each TFT and the public level layer of the entire substrate 13;

[0053] S4, make the semiconductor layer, the source layer and the drain layer corresponding to each TFT above the first insulating layer 141 corresponding to the gate of each TFT; in this step, a public line layer 3 can also be arranged on the first insulating layer 141 above the public line layer 3;

[0054] S5, cover the second insulating layer 142 in the insulating layer 14 on the entire TFT panel 1;

[0055] S6, make the electrostatic protection line layer 4 on the second insulating layer 142 above the first metal line layer 5, and make the ITO pixel electrode layer on the source layer or the drain layer of each TFT.

[0056] As described above, the main focus is on the making of the first metal line layer 5 and the electrostatic protection line layer 4. Among them, for the making of TFT, the public level layer lead wire of each TFT is led to the public line layer 3, and then the gate layer and the source layer (or the drain layer) are led to the driving IC 11, and the driving IC 11 is electrically connected with the FPC 12, and the entire making process is the prior art, so only the structure of each layer is described, and the circuit connection is not described.

[0057] In this application, the electrostatic protection line layer 4 is disconnected at the four corner positions of the TFT panel 1 and provided with a sharp discharge part 7, and the two ends of the electrostatic protection line layer 4 at the disconnected position are electrically connected with the sharp discharge part 7.

[0058] Through the sharp discharge part 7, the absorbed static electricity can be discharged through the sharp discharge, and at the same time, it is arranged at the four corner positions of the TFT panel 1, which can provide a larger space position and is far away from the electronic components in the TFT panel 1, so as to effectively prevent the influence on the electronic components in the TFT panel 1 when the sharp discharge occurs.

[0059] Among them, the sharp discharge part 7 includes a first discharge sheet 71 and a second discharge sheet 72, the first discharge sheet 71 is electrically connected with one end of the electrostatic protection line layer 4 at the disconnected position, the second discharge sheet 72 is electrically connected with the other end of the electrostatic protection line layer 4 at the disconnected position, and the first discharge sheet 71 and the second discharge sheet 72 have a gap therebetween, the first discharge sheet 71 is provided with a plurality of first discharge sharp ends 711 towards one side of the gap, the second discharge sheet 72 is provided with a plurality of second discharge sharp ends 721 towards one side of the gap, and the plurality of first discharge sharp ends 711 and the plurality of second discharge sharp ends 721 are oppositely arranged.

[0060] Two discharge plates are electrically connected to one end of the electrostatic discharge protection layer 4 at the break point, so that the entire static electricity is released on the electrostatic discharge protection layer 4; the static electricity is released through multiple opposing discharge tips to prevent the static electricity from affecting the inner damage inspection layer 2 and the common layer 3.

[0061] Furthermore, the tip discharge section 7 may also include a third discharge sheet 73 and a fourth discharge sheet 74. Both ends of the electrostatic protection layer 4 at the break point are electrically connected to the third discharge sheet 73. There is a gap between the third discharge sheet 73 and the fourth discharge sheet 74. The third discharge sheet 73 and the fourth discharge sheet 74 are both zigzag-shaped with multiple line segments facing the gap. Multiple third discharge tips 731 are formed at the zigzag end of the third discharge sheet 73, and multiple fourth discharge tips 741 are formed at the zigzag end of the fourth discharge sheet 74. The multiple third discharge tips 731 and the multiple fourth discharge tips 741 are arranged opposite to each other.

[0062] One of the two discharge pads is electrically connected to the electrostatic discharge protection layer 4, and the other discharge pad is used for electrostatic discharge to guide the static electricity away in a timely manner. The electrostatic discharge is achieved through multiple opposing discharge tips, which prevents the static electricity from affecting the inner damage inspection layer 2 and the common layer 3.

[0063] In this process, the peaks of multiple third discharge tips 731 are set opposite to the troughs of multiple fourth discharge tips 741.

[0064] The peaks and troughs of the two discharge tips are set opposite each other, so that the static electricity released through the peak of the third discharge tip 731 can be absorbed by the trough of the fourth discharge tip 741 to the maximum extent, thus realizing static electricity release.

[0065] Example 2

[0066] like Figure 7 As shown, this embodiment relates to an electrostatic discharge protection circuit for an electronic paper TFT panel. This embodiment is basically the same as the first embodiment, except that: in this embodiment, an annular second metal line layer 6 with an opening is also included. The opening of the second metal line layer 6 faces the driving IC 11 and FPC 12. The second metal line layer 6 is disposed in the insulating layer 14 and is disposed above the first metal line layer 5. The insulating layer 14 is provided with a via 61 for electrically connecting the second metal line layer 6 and the electrostatic discharge protection line layer 4.

[0067] By providing a second metal wire layer 6 within the insulating layer 14, the distance between it and the first metal wire layer 5 is made closer, thereby enabling the capacitor formed by the second metal wire layer 6 and the first metal wire layer 5 to better absorb static electricity.

[0068] In the whole TFT panel 1, in the step S5 of the embodiment one, further comprising: making the second metal line layer 6 in the second insulating layer 142 of the insulating layer 14. Then in step S6, further comprising making the via 61 for electrically connecting the second metal line layer 6 and the static protection line layer 4 in the second insulating layer 142.

[0069] Embodiment three

[0070] Referring to Figures 8 to 9 As shown in the figure, the embodiment relates to a static protection panel, comprising a plurality of TFT panels 1 arranged in a matrix, and the TFT panel 1 is provided with a TFT panel static protection circuit of electronic paper, and the static protection line layers 4 on any two adjacent TFT panels 1 are electrically connected.

[0071] When cutting each electronic paper on the static protection panel, the static electricity can be released to the whole static protection panel through the mutually electrically connected static protection line layers 4, the static electricity release can be faster, and each electronic paper can be prevented from static breakdown.

[0072] Among them, the static protection line layers 4 between the adjacent TFT panels 1 are electrically connected through the serpentine 8.

[0073] The serpentine 8 is a special curve that bends back and forth, and is a common wiring method in the wiring process. Through the bending wiring setting of the serpentine 8, the overall anti-static ability is improved; at the same time, in the multi-layer design of the TFT panel 1 of the electronic paper, the tortuosity of the serpentine 8 can lengthen the capacitance capacity formed with the first metal line layer 5, and improve the static electricity absorption capacity.

[0074] The beneficial effects of the present application are: by setting the static protection line layer 4 and the first metal line layer 5, a capacitor is formed to realize the absorption of static electricity and prevent static breakdown of the common line layer 3 and the damage detection line layer 2; the static protection line layer 4 absorbs the static electricity above the TFT panel 1, and the damage detection line layer 2 absorbs the static electricity inside the TFT panel 1, which can effectively absorb the static electricity in each place and prevent the static electricity from affecting the TFT in the TFT panel 1.

[0075] The above description shows and describes several preferred embodiments of the present application, but as previously described, it should be understood that the present application is not limited to the forms disclosed herein, and should not be considered as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the inventive concept described herein by the above teaching or related art or knowledge. The modifications and changes made by those skilled in the art without departing from the spirit and scope of the present application shall fall within the protection scope of the appended claims of the present application.

[0076] Although the present disclosure is disclosed as above, the protection scope of the present disclosure is not limited to this. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure, and these changes and modifications will fall within the protection scope of the present disclosure.

Claims

1. An electrostatic discharge protection circuit for an electronic paper TFT panel, comprising an annular defect detection line layer (2) and an annular common line layer (3) having an opening at the outer edge of a TFT panel (1), wherein the TFT panel (1) comprises a substrate (13) and an insulating layer (14) disposed on the substrate (13), the defect detection line layer (2) and the common line layer (3) are both disposed between the substrate (13) and the insulating layer (14), a driving IC (11) and an FPC (12) are provided on one side of the opening of the defect detection line layer (2) and the common line layer (3), the defect detection line layer (2) is electrically connected to the ground terminal of the driving IC (11) and the FPC (12), and the common line layer (3) is electrically connected to the FPC (12), characterized in that: It also includes an annular electrostatic discharge protection layer (4) with an opening and a first metal line layer (5). The openings of the electrostatic discharge protection layer (4) and the first metal line layer (5) are both facing the side of the driving IC (11) and FPC (12). The electrostatic discharge protection layer (4) is disposed at the upper outer edge of the insulating layer (14). The first metal line layer (5) is disposed between the substrate (13) and the insulating layer (14) and is disposed below the electrostatic discharge protection layer (4). The first metal line layer (5) and the electrostatic discharge protection layer (4) constitute a capacitor. The electrostatic discharge protection layer (4) is disposed outside the damage inspection line layer (2).

2. The electrostatic discharge protection circuit for a TFT panel of electronic paper according to claim 1, characterized in that: The first metal wire layer (5) is composed of multiple metal units arranged at intervals.

3. The electrostatic discharge protection circuit for a TFT panel of electronic paper according to claim 1, characterized in that: The distance between the electrostatic protection layer (4) and the outer edge of the TFT panel (1) is 50-1000 μm.

4. The electrostatic discharge protection circuit for a TFT panel of electronic paper according to claim 1, characterized in that: It also includes an annular second metal wire layer (6) with an opening facing the side of the driver IC (11) and FPC (12). The second metal wire layer (6) is disposed in the insulating layer (14) and is disposed above the first metal wire layer (5). The insulating layer (14) is provided with a via (61) for electrically connecting the second metal wire layer (6) and the electrostatic discharge protection wire layer (4).

5. The electrostatic discharge protection circuit for a TFT panel of electronic paper according to any one of claims 1 to 4, characterized in that: The electrostatic protection layer (4) is provided with a tip discharge section (7) at each of the four corners of the TFT panel (1), and both ends of the electrostatic protection layer (4) at the break point are electrically connected to the tip discharge section (7).

6. The electrostatic discharge protection circuit for a TFT panel of electronic paper according to claim 5, characterized in that: The tip discharge section (7) includes a first discharge plate (71) and a second discharge plate (72). The first discharge plate (71) is electrically connected to one end of the electrostatic protection line layer (4) at the break point, and the second discharge plate (72) is electrically connected to the other end of the electrostatic protection line layer (4) at the break point. There is a gap between the first discharge plate (71) and the second discharge plate (72). The first discharge plate (71) has a plurality of first discharge tips (711) facing the gap side, and the second discharge plate (72) has a plurality of second discharge tips (721) facing the gap side. The plurality of first discharge tips (711) and the plurality of second discharge tips (721) are arranged opposite to each other.

7. The electrostatic discharge protection circuit for a TFT panel of electronic paper according to claim 5, characterized in that: The tip discharge section (7) includes a third discharge plate (73) and a fourth discharge plate (74). Both ends of the electrostatic protection layer (4) at the break point are electrically connected to the third discharge plate (73). There is a gap between the third discharge plate (73) and the fourth discharge plate (74). The third discharge plate (73) and the fourth discharge plate (74) are both zigzag-shaped with multiple line segments facing the gap. Multiple third discharge tips (731) are formed at the zigzag end of the third discharge plate (73), and multiple fourth discharge tips (741) are formed at the zigzag end of the fourth discharge plate (74). The multiple third discharge tips (731) and the multiple fourth discharge tips (741) are arranged opposite to each other.

8. The electrostatic discharge protection circuit for a TFT panel of electronic paper according to claim 7, characterized in that: The peaks of the plurality of third discharge tips (731) are arranged opposite to the troughs of the plurality of fourth discharge tips (741).

9. An electrostatic protection panel, characterized in that: It includes several TFT panels (1) arranged in a matrix, and the TFT panels (1) are provided with electrostatic discharge protection circuits for electronic paper according to any one of claims 1 to 8, and the electrostatic discharge protection line layers (4) on any two adjacent TFT panels (1) are electrically connected.

10. An electrostatic protection panel according to claim 9, characterized in that: The electrostatic discharge protection line layer (4) between adjacent TFT panels (1) is electrically connected by a serpentine line (8).

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