Server and cabinet

Abstract

Embodiments of the present application provide a server and a cabinet, and relate to the technical field of computers, and are used to improve the heat dissipation effect of the server. The server comprises a circuit board, at least two functional modules located on the circuit board, and a wind guide cover. The at least two functional modules comprise a first functional module and a second functional module. The wind guide cover is located on one side of the circuit board, and is configured to guide the airflow moving from a first end of the circuit board to a second end of the circuit board. The wind guide cover comprises a first cover body and a second cover body. The first cover body and the circuit board jointly form a first containing cavity, and the first functional module and the second functional module are located in the first containing cavity. The first cover body and the second cover body jointly form a second containing cavity. The second containing cavity is in communication with the first containing cavity through a first opening; wherein the airflow entering the first containing cavity from the second containing cavity is configured to dissipate heat for the second functional module.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of computer, and particularly relate to a server and a cabinet. BACKGROUND

[0002] A server is a kind of computer, which is a high-performance computer providing various services for client computers in a network. Under the control of an operating system, the server provides external devices (such as hard disks, printers, etc.) connected thereto to client sites on a network for sharing, and can also provide centralized computing, information publishing, and data management services for network users.

[0003] Due to the rapid development of artificial intelligence services, cloud computing services, virtualization services, high-performance computing services, and big data processing services, the requirements of businesses on server performance have also increased dramatically. While improving the data processing speed and operation speed of each functional module in the server to meet the requirements of businesses on server performance, the heat generated by the functional modules also increases significantly, which poses a severe challenge to the heat dissipation capacity of the server.

[0004] Therefore, there is an urgent need for a solution that can improve the heat dissipation effect of a server. SUMMARY

[0005] Embodiments of the present application provide a server and a cabinet, which can improve the heat dissipation effect of the server.

[0006] To achieve the above-mentioned purpose, embodiments of the present application adopt the following technical solutions:

[0007] In a first aspect, a server is provided. The server includes a circuit board, at least two functional modules located on the circuit board, and an air duct. The at least two functional modules include a first functional module and a second functional module, and the first functional module and the second functional module are sequentially and spaced apart in a first direction from a first end of the circuit board to a second end of the circuit board. The air duct is located on one side of the circuit board, and the air duct is configured to guide an airflow moving from the first end of the circuit board to the second end of the circuit board. The air duct includes a first cover and a second cover. The first cover and the circuit board together form a first containing cavity, and the first functional module and the second functional module are located in the first containing cavity. The second cover is located on a side of the first cover away from the circuit board, and the first cover and the second cover together form a second containing cavity. The first cover further has a first opening penetrating the first cover, and the second containing cavity is in communication with the first containing cavity through the first opening; wherein the airflow entering the first containing cavity from the second containing cavity is configured to dissipate heat from the second functional module.

[0008] The server provided by the embodiment of the present application can form a second containing cavity by cooperation of the second cover body and the first cover body, and make the airflow in the second containing cavity enter the first containing cavity through the first opening to dissipate heat for the second functional module, so that the temperature of the airflow contacting the second functional module can be reduced, the heat dissipation effect for the second functional module can be improved, and the overall heat dissipation effect of the server can be improved.

[0009] In some embodiments, a projection profile of the first opening on the circuit board is located between a projection of the first functional module on the circuit board and a projection of the second functional module on the circuit board.

[0010] In the embodiment, the airflow in the second containing cavity entering the first containing cavity from the first opening can dissipate heat for the entire second functional module during movement towards the second end of the mainboard, so that the heat dissipation effect for the second functional module can be improved.

[0011] In some embodiments, a projection profile of the first opening on the circuit board overlaps with a projection of the second functional module on the circuit board.

[0012] In the embodiment, the airflow in the second containing cavity entering the first containing cavity from the first opening can dissipate heat for at least part of the second functional module during movement towards the second end of the mainboard, so that the heat dissipation effect for the second functional module can be improved.

[0013] In some embodiments, the first cover body is provided with a plurality of first openings, and the plurality of first openings are arranged in an array.

[0014] In the embodiment, the airflow in the second containing cavity enters the first containing cavity through the plurality of first openings, so that the airflow can enter the first containing cavity in a dispersed and uniform manner, and the uniformity of heat dissipation for the second functional module can be improved.

[0015] In some embodiments, the second cover body comprises a wind deflector. The wind deflector is located on a side of the first opening close to the second end. A projection of the wind deflector on the circuit board overlaps with a projection of the second functional module on the circuit board, or the projection of the wind deflector on the circuit board is located between the projection of the first functional module on the circuit board and the projection of the second functional module on the circuit board.

[0016] The wind deflector is configured to block the airflow in the second containing cavity from continuing to move towards the second end of the mainboard in the second containing cavity, so that the blocked airflow enters the first containing cavity from the first opening, the efficiency of the airflow in the second containing cavity entering the first containing cavity is improved, and the heat dissipation effect for the second functional module is further improved.

[0017] The front projection of the wind shield on the main board overlaps with the front projection of the second functional module on the main board. In this way, the first opening on the first side of the wind shield is ensured to be on the first side of at least part of the second functional module. The airflow from the second accommodating cavity into the first accommodating cavity through the first opening cools at least part of the second functional module, ensuring the cooling effect on the second functional module.

[0018] The front projection of the wind shield on the main board is between the front projection of the first functional module on the main board and the front projection of the second functional module on the main board. In this way, the first opening on the first side of the wind shield is ensured to be on the first side of the second functional module, so that the airflow from the second accommodating cavity into the first accommodating cavity through the first opening cools the entire second functional module, ensuring the cooling effect on the second functional module.

[0019] In some embodiments, the server further includes a functional board card. The functional board card is located on the side of the wind shield close to the second end. A second opening is formed on the wind shield.

[0020] In this embodiment, the second accommodating cavity can communicate with the functional board card through the second opening, so that the airflow in the second accommodating cavity can pass through the second opening to cool the functional board card, improving the operating performance of the functional board card.

[0021] In some embodiments, the first functional module includes a plurality of first processors arranged at intervals in the second direction, and a first memory module located on both sides of each first processor in the second direction. The second functional module includes a plurality of second processors arranged at intervals in the second direction, and a second memory module located on both sides of each second processor in the second direction. The first processor is oppositely arranged with at least part of the second memory module, and / or the second processor is oppositely arranged with at least part of the first memory module. The first direction intersects the second direction.

[0022] In this embodiment, by at least partially misaligning the first functional module and the second functional module, the temperature of the airflow contacting the second functional module can be reduced, thereby improving the cooling effect on the second functional module.

[0023] In some embodiments, the server further includes a heat sink. The heat sink is located in the first accommodating cavity and on the side of the functional module away from the circuit board. The heat sink is configured to cool the functional module.

[0024] The airflow in the first accommodating cavity cools each functional module while also cooling the heat sink of the functional module. Similarly, the airflow in the second accommodating cavity cools the functional module while also cooling the heat sink of the functional module.

[0025] In this way, the airflow inside the air duct cools the heat sink, which can reduce the temperature of the heat sink and further improve the heat dissipation effect of the heat sink on the functional module.

[0026] In some embodiments, the server further comprises a fan module. The fan module is located at one side of the air duct close to the first end. The fan module is configured to respectively deliver airflow to the first accommodating cavity and the second accommodating cavity.

[0027] The fan module can continuously provide cool air outside the server to the first accommodating cavity and the second accommodating cavity, maintain the airflow inside the first accommodating cavity and the second accommodating cavity at a lower temperature, and thus improve the heat dissipation effect on the functional module.

[0028] In a second aspect, a cabinet is provided. The cabinet comprises a power supply and a server. The server is coupled to the power supply; wherein the server is as in any of the above embodiments.

[0029] The technical effects of the second aspect can refer to the technical effects of the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 FIG. 1 is a structural schematic diagram of a cabinet according to some embodiments;

[0031] Figure 2 FIG. 2 is a perspective structural schematic diagram of a server according to some embodiments;

[0032] Figure 3A FIG. 3 is a structural schematic diagram of a mainboard in a server according to some embodiments;

[0033] Figure 3B FIG. 4 is a structural schematic diagram of a mainboard in a server according to some embodiments;

[0034] Figure 4 FIG. 5 is a structural schematic diagram of an air duct in a server according to some embodiments;

[0035] Figure 5 FIG. 6 is a structural schematic diagram of an air duct in a server according to some embodiments;

[0036] Figure 6 FIG. 7 is a perspective structural schematic diagram of a server according to some embodiments;

[0037] Figure 7 FIG. 8 is a structural schematic diagram of an air duct in a server according to some embodiments;

[0038] Figure 8A FIG. 9 is a structural schematic diagram of a mainboard in a server according to some embodiments;

[0039] Figure 8B Another schematic diagram of a motherboard in a server is provided according to some embodiments. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be described below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of them.

[0041] The technical solutions in some embodiments of the present application will be described below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments provided in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0042] Hereinafter, the terms "first" and "second" are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0043] In describing some embodiments, "connection", "connection" and their derivatives can be used. For example, the term "connection" can be used to describe some embodiments to indicate that two or more components have direct or indirect physical contact with each other. For example, A and B are connected, which means that A and B are connected, or A and B are connected through other components. In addition, the term "coupling" can be an electrical connection mode for signal transmission.

[0044] "A, B and C at least one of them" has the same meaning as "at least one of A, B or C", which includes the following combinations of A, B and C: only A, only B, only C, combination of A and B, combination of A and C, combination of B and C, and combination of A, B and C.

[0045] "A and / or B" includes the following three combinations: only A, only B, and combination of A and B.

[0046] As used herein, "about", "approximately" or "approximately" includes the stated value and the average value within the acceptable deviation range of the specific value, wherein the acceptable deviation range is determined by the person skilled in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system).

[0047] As used herein, "parallel," "perpendicular," "equal" include the recited condition and conditions approximating the recited condition within an acceptable deviation range, as determined by one of ordinary skill in the art taking into account the measurement being discussed and the error associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and near parallel, where near parallel can have an acceptable deviation range of, for example, 5° or less; "perpendicular" includes absolute perpendicular and near perpendicular, where near perpendicular can also have an acceptable deviation range of, for example, 5° or less. "Equal" includes absolute equality and near equality, where near equality can have an acceptable deviation range of, for example, less than or equal to 5% of either of the two quantities being compared.

[0048] Embodiments of the present application provide a cabinet. As shown in Figure 1 The cabinet 1000 includes a power supply 200 and a server 100. The power supply 200 receives an alternating current (AC) signal provided by an external AC power supply and converts the AC signal to a direct current (DC) signal and outputs the DC signal. The server 100 receives the DC signal provided by the power supply and operates.

[0049] One cabinet 1000 can include at least one server 100. In the case where the number of servers 100 in one cabinet 1000 is multiple, the multiple servers 100 in one cabinet 1000 can be arranged in layers.

[0050] The multiple servers 100 in the same cabinet 1000 can be coupled to each other through a cable or a wireless communication module (such as a Bluetooth module or a WIFI module) to transmit data signals and realize data flow between different servers 100 in one cabinet 1000. The multiple servers 100 between different cabinets 1000 can also be coupled to each other through a cable or a wireless communication module to transmit data signals and realize data flow between different cabinets 1000. Thus, the multiple servers 100 in multiple cabinets 1000 can cooperate and operate together to perform large computation projects.

[0051] The server 100 can be a server device of a network provider or a content provider.

[0052] Based on the shape of the server, the server can be a rack server, a blade server, or a tower server, which is not limited here. For the convenience of subsequent description, the rack server is taken as an example for subsequent description.

[0053] Rack servers can be installed in server racks. Rack servers typically come in various form factors, such as 1U, 2U, 3U, 4U, 5U, 6U, and 8U standard rack servers. The rack has mounting spaces to accommodate different form factors, and it also has screw holes for securing the rack server. Screws pass through these holes to fix the server to the rack, thus defining the installation location for each rack server.

[0054] The server provided in this application embodiment may include a casing, a motherboard disposed within the casing, and multiple functional modules. These functional modules may include a central processing unit (CPU), a graphics processing unit (GPU), a memory module, a heat dissipation module, an input / output (I / O) module, an adapter board module, a power supply module, a hard disk module, etc. Each functional module can be electrically connected to the motherboard or via cables to perform its respective function, thereby enabling the server as a whole to function. The following describes some structural aspects of the server 100.

[0055] like Figure 2 As shown, the outer casing 110 can be made of plastic or metal. The interior of the outer casing 110 has a receiving space to accommodate multiple functional modules such as the motherboard 120, CPU 130, and memory module 140. The outer casing 110 defines the installation position of each functional module inside the server 100, while protecting the functional modules within the receiving space from external damage.

[0056] In some examples, server 100 can be a rectangular server, and housing 110 can be a rectangular housing. Housing 110 may include a bottom cover and a top cover disposed opposite each other, and a frame 111 connecting the bottom cover and the top cover respectively. The bottom cover, top cover, and frame 111 may enclose a closed or open receiving space. In addition, housing 110 may have multiple positioning holes, which can be used to fix each functional module within the receiving space of housing 110 and define the installation position of the functional module.

[0057] The motherboard 120 is one of the most critical components of the server 100. Positioning holes can be provided on the motherboard 120, which, along with the positioning holes on the bottom cover of the casing, allow the motherboard 120 to be securely mounted to the bottom cover.

[0058] The mainboard 120 can provide multiple slots, and the mainboard 120 is internally provided with circuit traces coupled with the slots. After the functional modules are inserted into the slots, the multiple functional modules cooperating with the slots can utilize the circuit traces in the mainboard 120 to realize the coupling between the functional modules and realize the signal interaction between the functional modules.

[0059] For example, the mainboard 120 is provided with a CPU slot and a memory slot. The pins of the CPU 130 are inserted into the CPU slot to be mounted on the mainboard 120, and the pins of the memory module 140 are inserted into the memory slot to be mounted on the mainboard 120. The CPU 130 and the memory module 140 can be arranged at a distance from each other, coupled through the circuit traces in the mainboard 120, and realize the signal interaction between the CPU 130 and the memory module 140. Of course, in other embodiments, the mainboard 120 can not have the CPU slot, and the CPU 130 can be directly mounted on the surface of the mainboard 120.

[0060] In the embodiments of the present application, the number of CPUs on the mainboard 120 is at least two. For example, as shown in FIG. 1, the mainboard 120 is provided with a CPU-1 and a CPU-2, and the CPU-1 and the CPU-2 are located on different columns (directions parallel to the second direction Y) of the mainboard 120. For another example, as shown in FIG. 2, the mainboard 120 is provided with a CPU-3, a CPU-4, a CPU-5 and a CPU-6, wherein the CPU-3 and the CPU-5 are located on the same column of the mainboard 120, and the CPU-4 and the CPU-6 are located on another column of the mainboard 120. The CPU-3 and the CPU-4 can be located on the same row (directions parallel to the first direction X) of the mainboard 120, or can not be located on the same row, which is not limited herein. Figure 3A Figure 3B

[0061] In addition, as shown in FIG. 1 and FIG. 2, each CPU is provided with a memory module 140 on both sides in the second direction Y. The CPUs and the memory modules 140 in the same column are alternately arranged along the second direction Y. Figure 3A Figure 3B

[0062] In some examples, the mainboard 120 can also have other slots, such as a south bridge chip slot, a GPU slot, a hard disk slot, an integrated sound card slot, an integrated network card slot, etc. The CPU 130 can also utilize the mainboard 120 to perform signal interaction with the functional modules such as the south bridge chip, the GPU, the hard disk module, the integrated sound card, the integrated network card, etc.

[0063] ​​​​In other examples, the motherboard 120 may also integrate expansion slots such as a Peripheral Component Interconnect Express (PCIE) slot. PCIE is a point-to-point dual-channel high-bandwidth peripheral interconnect, where each connected device has its own dedicated channel bandwidth and does not share the bus bandwidth. PCIE has the advantage of high data transfer rates, which can improve the signal interaction efficiency of two functional modules coupled through PCIE, thereby improving the efficiency of data interaction within the server.

[0064] The CPU130 is the processing core of the server 100. The CPU130 may include at least an arithmetic logic unit (ALU), a register unit, and a control unit. The ALU is primarily responsible for performing logical operations, such as shift operations and other logical operations. It can also perform fixed-point or floating-point arithmetic operations, address calculations, and translations, making it a multi-functional processing unit. The register unit is used to temporarily store instructions, data, and addresses. The control unit analyzes instructions and issues corresponding control signals.

[0065] like Figure 2 and Figure 4 As shown, server 100 may also include fan module 160. Fan module 160 may be located on the first side of motherboard 120. Understandably, motherboard 120, CPU 130 and memory module 140 are all located on the second side of fan module 160.

[0066] The fan module 160 can be coupled to the motherboard 120 to obtain operating voltage. The fan module 160 can use air cooling to dissipate heat from the inside of the server. The fan module 160 can include multiple fans, which can be arranged close to each other or distributed. Among them, the multiple fans close to each other can be arranged side by side or stacked, which is not limited here.

[0067] Because of the large size of the fan, the size of the fan module 160 in the server is larger than the size of the CPU 130 in the direction perpendicular to the motherboard 120 (third direction Z).

[0068] like Figure 4 As shown, server 100 may further include an air duct 170. The air duct 170 may be located on one side of the circuit board and cover at least a portion of the circuit board and some functional modules on the circuit board. The air vent of the air duct 170 near the first end of the circuit board is an air inlet, and the air vent of the air duct 170 near the second end of the circuit board is an air outlet. The air duct 170 is configured to guide the airflow from the first end of the circuit board to the second end of the circuit board, thereby increasing the airflow through the functional modules and improving the heat dissipation effect on the functional modules.

[0069] Exemplarily, the circuit board can include a mainboard 120, and the functional module on the circuit board can include a CPU 130 on the mainboard 120. The air deflector 170 can be located at one side of the mainboard 120 and cover at least part of the mainboard 120 and the CPU 130 on the mainboard 120. The air deflector 170 is configured to guide the air flow moving from the first end of the mainboard 120 to the second end of the mainboard 120, so as to increase the air volume flowing through the CPU and improve the heat dissipation effect on the CPU. For ease of understanding, the following will be described by taking the circuit board including the mainboard 120 and the functional module including the CPU (130) as an example, but this should not be regarded as a limitation on the solutions of the present application. Figure 4 Exemplarily, the circuit board can include a mainboard 120, and the functional module on the circuit board can include a CPU 130 on the mainboard 120. The air deflector 170 can be located at one side of the mainboard 120 and cover at least part of the mainboard 120 and the CPU 130 on the mainboard 120. The air deflector 170 is configured to guide the air flow moving from the first end of the mainboard 120 to the second end of the mainboard 120, so as to increase the air volume flowing through the CPU and improve the heat dissipation effect on the CPU. For ease of understanding, the following will be described by taking the circuit board including the mainboard 120 and the functional module including the CPU (130) as an example, but this should not be regarded as a limitation on the solutions of the present application.

[0070] As shown in Figure 4 , the air deflector 170 can include a first cover body 171. The first cover body 171 can jointly define a first accommodating cavity Q1 with the mainboard 120. Exemplarily, the first cover body 171 and the mainboard 120 jointly define a rectangular accommodating cavity.

[0071] In some examples, as shown in Figure 3A , the first functional module includes the CPU-1, and the second functional module includes the CPU-2. The first accommodating cavity can accommodate the CPU-1 and the CPU-2 on the mainboard 120. In other examples, as shown in Figure 3B , the first functional module includes the CPU-3 and the CPU-5 located in the same row in the second direction, and the second functional module includes the CPU-4 and the CPU-6 located in the same row in the second direction. The first accommodating cavity can accommodate the CPU-3, the CPU-5, the CPU-4 and the CPU-6 on the mainboard 120.

[0072] As shown in Figure 4 , the air deflector 170 can further include a second cover body 172. The second cover body 172 is located at the side of the first cover body 171 away from the circuit board, and the second cover body 172 and the first cover body 171 jointly define a second accommodating cavity Q2. Exemplarily, the second cover body 172 and the first cover body 171 jointly define a rectangular accommodating cavity.

[0073] In some examples, as shown in Figure 4 and Figure 5 , the size of the second cover body 172 in the first direction X can be smaller than the size of the first cover body 171 in the first direction X. In other examples, the size of the second cover body 172 in the first direction X can be equal to or greater than the size of the first cover body 171 in the first direction X. Similarly, the volume of the second accommodating cavity can be smaller than, equal to or greater than the volume of the first accommodating cavity, which is not limited here.

[0074] The first cover 171 is provided with a first opening H1 penetrating the first cover 171 at a position for forming the second accommodating cavity together with the second cover 172. The first opening H1 communicates the first accommodating cavity Q1 and the second accommodating cavity Q2, so that the airflow in the second accommodating cavity Q2 can enter the first accommodating cavity Q1 through the first opening H1 to cool the second functional module.

[0075] The second accommodating cavity Q2 is free of the functional module generating heat, so the airflow entering the first accommodating cavity Q1 from the second accommodating cavity Q2 keeps a low temperature, and the airflow at a low temperature contacts the second functional module to cool the second functional module, thereby improving the cooling effect of the second functional module and the overall cooling effect of the server.

[0076] The airflow in the first accommodating cavity Q1 and the second accommodating cavity Q2 can be provided by the fan module 160 at the first end of the mainboard 120, and the fan module 160 blows the cold air from the outside of the server to the second end of the mainboard from the first end of the mainboard. Therefore, the airflow in the first accommodating cavity Q1 and the second accommodating cavity Q2 moves from the first end of the circuit board to the second end of the circuit board, and the airflow entering the first accommodating cavity Q1 from the second accommodating cavity Q2 also moves to the second end of the circuit board.

[0077] The fan module 160 can continuously provide the cold air from the outside of the server to the first accommodating cavity Q1 and the second accommodating cavity Q2, and keep the airflow inside the first accommodating cavity Q1 and the second accommodating cavity Q2 at a low temperature, thereby improving the cooling effect of the functional module.

[0078] In some schemes, the airflow in the first accommodating cavity moves from the first end of the circuit board to the second end of the circuit board. Since the first functional module is located on the side of the second functional module close to the first end of the circuit board, the airflow in the first accommodating cavity contacts the first functional module first to cool the first functional module, and then contacts the second functional module to cool the second functional module. However, since the airflow in the first accommodating cavity absorbs the heat generated by the first functional module first and then contacts the second functional module, the temperature of the airflow contacting the second functional module is high, which reduces the cooling effect of the second functional module and causes the overall cooling effect of the server to be poor.

[0079] The server provided by the embodiments of the present application can form the second accommodating cavity Q2 by cooperation of the second cover 172 and the first cover 171, and make the airflow in the second accommodating cavity Q2 enter the first accommodating cavity Q1 through the first opening H1 to cool the second functional module, thereby reducing the temperature of the airflow contacting the second functional module, improving the cooling effect of the second functional module, and further improving the overall cooling effect of the server.

[0080] Exemplarily, as shown in FIG. 1, the first opening H1 is located between the first functional module and the second functional module on the mainboard 120. Figure 3B Exemplarily, as shown in FIG. 1, the first opening H1 is located between the first functional module and the second functional module on the mainboard 120.

[0081] In some embodiments, the edge of the air duct 170 in the second direction Y can be fixedly installed with the frame 111 of the shell, so that the air duct 170 is stably retained on one side of the mainboard 120.

[0082] In the case of fixed installation of the air duct 170 with the frame 111, the air duct 170 has a supporting force. Therefore, some functional modules can also be installed on the air duct 170. Exemplarily, a functional module with small heat dissipation, such as an electrophoresis device, can be installed in the second accommodating cavity Q2, so as to optimize the spatial design of the installation position of the functional module in the server while keeping the airflow temperature in the second accommodating cavity Q2 low.

[0083] In some embodiments, as shown in FIG. 1, the first opening H1 is located between the first functional module and the second functional module on the mainboard 120. Figure 4

[0084] In this way, the airflow from the first opening H1 into the first accommodating cavity Q1 of the second accommodating cavity Q2 can dissipate heat for the entire second functional module during the movement towards the second end of the mainboard 120, thereby improving the heat dissipation effect for the second functional module.

[0085] In some embodiments, as shown in FIG. 1, the first opening H1 is located between the first functional module and the second functional module on the mainboard 120. Figure 5

[0086] In this way, the airflow from the first opening H1 into the first accommodating cavity Q1 of the second accommodating cavity Q2 can dissipate heat for at least part of the second functional module during the movement towards the second end of the mainboard 120, thereby improving the heat dissipation effect for the second functional module.

[0087] In some embodiments, as shown in FIG. 1, the first opening H1 is located between the first functional module and the second functional module on the mainboard 120. Figure 6 ​​As shown, the first cover body 171 is provided with a plurality of first openings H1 arranged in an array. The airflow in the second accommodating cavity Q2 enters the first accommodating cavity Q1 through the plurality of first openings H1, so that the airflow can enter the first accommodating cavity Q1 in a dispersed and uniform manner, improving the uniformity of heat dissipation for the second functional module.

[0088] In addition, the plurality of first openings H1 have a small caliber, which can prevent objects in the second accommodating cavity Q2 from passing through the first openings H1 and damaging the mainboard 120 and the CPU on the mainboard.

[0089] In some examples, the shape of the first opening H1 can be at least one of a rectangle, a circle, an ellipse, a regular pentagon, a regular hexagon, and a triangle. The plurality of first openings H1 arranged in an array can include first openings of one shape or first openings of multiple shapes.

[0090] In some embodiments, as shown in Figure 4 and Figure 5 The second cover body 172 further includes a wind deflector 1721. The wind deflector 1721 is located on the side of the first opening H1 close to the second end.

[0091] The wind deflector 1721 is configured to block the airflow in the second accommodating cavity Q2 from moving further in the second accommodating cavity Q2 towards the second end of the mainboard 120, so that the blocked airflow enters the first accommodating cavity Q1 from the first opening H1, improving the efficiency of the airflow in the second accommodating cavity Q2 entering the first accommodating cavity Q1, and further improving the heat dissipation effect of the second functional module.

[0092] In some examples, the orthographic projection of the wind deflector 1721 on the mainboard 120 overlaps with the orthographic projection of the second functional module on the mainboard 120. In this way, it can be ensured that the first opening H1 located on the first side of the wind deflector 1721 is located on the first side of at least part of the second functional module, so that the airflow in the second accommodating cavity Q2 entering the first accommodating cavity Q1 from the first opening H1 can dissipate heat for at least part of the second functional module, ensuring the heat dissipation effect of the second functional module.

[0093] In other examples, the orthographic projection of the wind deflector 1721 on the mainboard 120 is located between the orthographic projection of the first functional module on the mainboard 120 and the orthographic projection of the second functional module on the mainboard 120. In this way, it can be ensured that the first opening H1 located on the first side of the wind deflector 1721 is located on the first side of the second functional module, so that the airflow in the second accommodating cavity Q2 entering the first accommodating cavity Q1 from the first opening H1 can dissipate heat for the entire second functional module, ensuring the heat dissipation effect of the second functional module.

[0094] The wind shield 1721 can be arranged perpendicularly to the main board 120, or can have a certain inclination with the plane where the main board 120 is arranged, which is not limited here.

[0095] In some embodiments, as shown in Figure 2 and Figure 7 , the I / O module 150 is located on one side of the wind shield 1721 close to the second end of the main board 120. The I / O module includes a riser card coupled with the main board 120, and a function board card 151 plugged into an expansion slot on the riser card. The function board card 151 communicates with the main board 120 to expand the functions of the server. During the operation of the function board card 151, the function board card 151 will generate heat.

[0096] To this end, as shown in Figure 6 and Figure 7 , a second opening H2 can also be formed on the wind shield 1721. The second accommodating cavity Q2 can communicate with the function board card 151 in the I / O module through the second opening H2, so that the airflow in the second accommodating cavity Q2 can pass through the second opening H2 to cool the function board card 151 in the I / O module, and improve the operation performance of the function board card 151.

[0097] As shown in Figure 6 , the number of second openings H2 formed on the wind shield 1721 can be multiple, and the multiple second openings H2 are arranged in an array. The airflow of the second accommodating cavity Q2 blows to the function board card through the multiple second openings H2, so that the airflow can disperse and uniformly cool the function board card.

[0098] It should be noted that, in order to show the structure and position of the first opening H1 and the second opening H2, Figure 6 only the wind shield 1721 is shown in the second cover body 172.

[0099] In some examples, the shape of the second opening H2 can be at least one of a rectangle, a circle, an ellipse, a regular pentagon, a regular hexagon, and a triangle. The multiple second openings H2 arranged in an array can include second openings of one shape, or can include second openings of multiple shapes.

[0100] The shape of the first opening H1 and the shape of the second opening H2 can be the same or different; similarly, the opening area of the first opening H1 and the opening area of the second opening H2 can be the same or different; the present application does not limit this.

[0101] In some embodiments, the server 100 further includes a heat sink 180. The heat sink 180 is configured to cool the function module. For example, as shown in Figure 4 , Figure 5 and Figure 7As shown, each CPU on the mainboard 120 is configured with a heat sink 180. The heat sink 180 is located in the first accommodating cavity Q1 and on the side of the CPU away from the mainboard 120.

[0102] The size of the heat sink 180 in the direction perpendicular to the mainboard 120 is greater than the size of the CPU in the direction perpendicular to the mainboard 120, which can increase the heat dissipation area of the heat sink 180 to dissipate heat from the CPU.

[0103] On this basis, the airflow in the first accommodating cavity Q1 body can dissipate heat from the CPU and the heat sink 180 of the CPU at the same time. Similarly, the airflow in the second accommodating cavity Q2 body can dissipate heat from the CPU and the heat sink 180 of the CPU at the same time.

[0104] In this way, the airflow inside the air baffle 170 dissipates heat from the heat sink 180, which can reduce the temperature of the heat sink 180 and further improve the heat dissipation effect of the heat sink 180 on the CPU.

[0105] In some embodiments, as shown in Figure 3A and Figure 3B , the first functional module and the second functional module are oppositely arranged. For example, as shown in Figure 3A , CPU-1 and CPU-2 are oppositely arranged. At this time, the high-temperature airflow after dissipating heat from CPU-1 directly blows to CPU-2, causing the problem of poor heat dissipation effect on CPU-2. Similarly, as shown in Figure 3B , CPU-3 and CPU-4 are oppositely arranged, and CPU-5 and CPU-6 are oppositely arranged. At this time, the high-temperature airflow after dissipating heat from CPU-3 directly blows to CPU-4, and the high-temperature airflow after dissipating heat from CPU-5 directly blows to CPU-6, causing the problem of poor heat dissipation effect on CPU-4 and CPU-6.

[0106] In some embodiments, as shown in Figure 8A and Figure 8B , in the first direction X, the first functional module and the second functional module are at least partially misaligned. For example, in the first direction X, the first functional module and the second functional module are partially misaligned; or, in the first direction X, the first functional module and the second functional module are completely misaligned.

[0107] Taking the complete misalignment of the first functional module and the second functional module as an example: as shown in Figure 8AAs shown, CPU-1 and CPU-2 are completely staggered, for example, CPU-2 is not opposite to CPU-1, but opposite to the memory module on the side of CPU-1. At this time, the air flow to CPU-2 includes the air flow mainly for cooling the memory module. Since the heat generation temperature of the memory module is lower than that of CPU-1, the temperature of the air flow for cooling the memory module is lower than that of the air flow for cooling CPU-1. Therefore, compared with Figure 3A in terms of, the temperature of the air flow to CPU-2 can be reduced, and the cooling effect on CPU-2 can be improved.

[0108] For example, the first functional module and the second functional module are partially staggered: as shown, Figure 8B CPU-3 and CPU-4 are at least partially staggered, for example, CPU-4 is opposite to part of CPU-3 and opposite to the memory module on the side of CPU-3. At this time, the air flow to CPU-4 includes part of the air flow for cooling CPU-3 and part of the air flow for cooling the memory module. Since the heat generation temperature of the memory module is lower than that of CPU-3, the temperature of the air flow for cooling the memory module is lower than that of the air flow for cooling CPU-3. Therefore, compared with Figure 3B in terms of, the temperature of the air flow to CPU-4 can be reduced, and the cooling effect on CPU-4 can be improved. Similarly, CPU-5 and CPU-6 are partially staggered, and the cooling effect on CPU-6 can also be improved. The principle is the same and will not be repeated here.

[0109] Therefore, by at least partially staggering the first functional module and the second functional module, the temperature of the air flow contacting the second functional module can be reduced, thereby improving the cooling effect of the second functional module.

[0110] On this basis, in some examples, in the second direction Y, the first cover body 171 and the second cover body 172 can also be partially staggered, so that the first accommodating cavity Q1 and the second accommodating cavity Q2 are partially staggered.

[0111] In addition, in some examples, the first opening H1 can be in the same row as the second functional module. For example, in the case where CPU-2 is not opposite to CPU-1, but opposite to the memory module on the side of CPU-1, the first opening H1 can be located between CPU-2 and the memory module. In this way, the low-temperature air flow entering the first accommodating cavity Q1 from the first opening H1 can directly and sufficiently cool the second functional module, thereby improving the cooling effect of the second functional module.

[0112] In summary, the server provided by the embodiment of the present application can form a second containing cavity Q2 by cooperation of the second cover body 172 and the first cover body 171, and make the airflow in the second containing cavity Q2 enter the first containing cavity Q1 through the first opening H1 to dissipate heat for the second functional module, so as to reduce the temperature of the airflow contacting the second functional module, improve the heat dissipation effect of the second functional module, and further improve the overall heat dissipation effect of the server.

[0113] The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any change or replacement within the technical scope disclosed by the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A server, characterized by The server comprises: a circuit board, and at least two functional modules located on the circuit board; the at least two functional modules comprise a first functional module and a second functional module, the first functional module and the second functional module are sequentially and spaced apart from each other in a first direction from a first end of the circuit board to a second end of the circuit board; an air duct located on one side of the circuit board; configured to guide the air flow moving from the first end of the circuit board to the second end of the circuit board; the air duct comprises: a first cover body, which cooperates with the circuit board to form a first containing cavity, and the first functional module and the second functional module are located in the first containing cavity; a second cover body located on the side of the first cover body away from the circuit board, and the first cover body and the second cover body cooperatively form a second containing cavity; the first cover body is also provided with a first opening penetrating through the first cover body, and the second containing cavity is in communication with the first containing cavity through the first opening; wherein the air flow entering the first containing cavity from the second containing cavity is configured to dissipate heat from the second functional module.

2. The server of claim 1, wherein, The orthographic projection of the first opening on the circuit board is located between the orthographic projection of the first functional module on the circuit board and the orthographic projection of the second functional module on the circuit board.

3. The server of claim 1, wherein, The orthographic projection of the first opening on the circuit board overlaps with the orthographic projection of the second functional module on the circuit board.

4. The server according to any one of claims 1 to 3, characterized in that, The first cover body is provided with a plurality of first openings, and the plurality of first openings are arranged in an array.

5. The server of any one of claims 1-4, wherein, The second cover body comprises a baffle, and the baffle is located on the side of the first opening close to the second end; the orthographic projection of the baffle on the circuit board overlaps with the orthographic projection of the second functional module on the circuit board; or, the orthographic projection of the baffle on the circuit board is located between the orthographic projection of the first functional module on the circuit board and the orthographic projection of the second functional module on the circuit board.

6. The server of claim 5, wherein, The server further comprises a functional board card, and the functional board card is located on the side of the baffle close to the second end; a second opening is formed in the baffle.

7. The server of any one of claims 1-6, wherein, The first functional module comprises a plurality of first processors arranged in a second direction, and a first memory module located on both sides of each first processor in the second direction; the second functional module comprises a plurality of second processors arranged in the second direction, and a second memory module located on both sides of each second processor in the second direction; the first processor is oppositely arranged with at least part of the second memory module, and / or the second processor is oppositely arranged with at least part of the first memory module; the first direction intersects with the second direction.

8. The server of any one of claims 1-7, wherein, Further comprising a heat sink, the heat sink is located in the first containing cavity and on the side of the functional module away from the circuit board; the heat sink is configured to dissipate heat from the functional module.

9. The server of any one of claims 1-8, wherein, Further comprising a fan module; The fan module is located on one side of the air deflector close to the first end; the fan module is configured to respectively deliver airflow to the first accommodating cavity and the second accommodating cavity.

10. A cabinet, characterized by The server is coupled with the power supply; wherein the server is the server as claimed in any one of claims 1-9.

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