Anti-welding CCD spot alignment method

Abstract

The application discloses a kind of anti-welding CCD welding point alignment methods, comprising the following steps: S1, 4-8mm process edge is reserved on the both sides of printed circuit board, and four tapered through holes are opened on process edge, and identification code is printed in the middle of process edge;S2, printed circuit board is placed into silk screen printing machine.The application reserves process edge on the both sides of circuit board, then four tapered through holes are opened on process edge, so as to use tapered through hole and tapered positioning block to preliminarily position circuit board, and the distance between solder joint and solder joint on circuit board can be used to correct the length of single-side widening of exposure area, avoid the situation that exposure area is too small to completely cover windowed area or exposure area is too large to cause short circuit of printed circuit board, improve the fault tolerance of exposure processing.

Description

Technical Field

[0001] This invention relates to an alignment method, specifically a solder mask CCD solder joint alignment method, belonging to the field of printed circuit board manufacturing technology. Background Technology

[0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. They are often referred to as PCBs, and their design primarily involves layout design. The main advantages of using PCBs are significantly reduced wiring and assembly errors, improved automation levels, and increased production efficiency. PCBs are classified by the number of layers: single-sided, double-sided, four-layer, six-layer, and other multi-layer PCBs. Because PCBs are not typically end products, their names are somewhat ambiguous. For example, the motherboard used in personal computers is called a motherboard, not simply a circuit board. Although motherboards contain circuit boards, they are not the same. Therefore, while related, they cannot be considered identical when assessing the industry. CCD exposure equipment is a crucial component in PCB production systems, primarily used for aligning and exposing PCBs after solder mask treatment, allowing subsequent baking and developing processes to remove the ink from the solder joints.

[0003] Traditional CCD exposure equipment typically requires manual positioning of the film and substrate, resulting in poor positioning accuracy and an inability to precisely widen the exposure area on one side. This can lead to issues such as the area being too small to fully cover the windowed area or too large, causing short circuits on the printed circuit board. To address this, a solder mask CCD solder joint alignment method is proposed. Summary of the Invention

[0004] The purpose of this invention is to provide a method for aligning solder joints in a CCD anti-soldering device, so as to solve one of the problems mentioned in the background art.

[0005] This invention is implemented by the following technical solution: a method for aligning solder joints on a CCD, comprising the following steps:

[0006] S1. Reserve a 4-8mm process edge on both sides of the printed circuit board, and open four tapered through holes on the process edge, and print the identification code in the middle of the process edge.

[0007] S2. Place the printed circuit board into the screen printing machine and use the tapered positioning blocks to position the process edges on both sides of the printed circuit board in order to perform solder resist treatment on the printed circuit board. The thickness of the solder resist ink printing is 10-15μm.

[0008] S3. Use an image acquisition device to acquire images of the printed circuit board before solder resist treatment, and transmit the acquired images to a CCD exposure device.

[0009] S4. Place the printed circuit board after solder mask treatment into the alignment platform inside the CCD exposure equipment, and then use a hydraulic drive device to squeeze both sides of the process edge so that the tapered through hole can fully fit with the tapered positioning block of the alignment platform. The pressure is 0.1-0.5MPa.

[0010] S5. Use the four built-in cameras in the CCD exposure equipment to acquire images of the printed circuit board again, so as to use the camera centering function to drive the alignment platform to center the four tapered through holes.

[0011] S6. The image acquired by the image acquisition device is segmented by the CCD exposure device, and the features of the segmented image are extracted. Then, the solder joint features on the printed circuit board are judged by using feature comparison.

[0012] S7. After the solder joint features are determined, the distance between solder joints is calculated using a CCD exposure device. Then, based on the calculation results, the single-sided widening length of the exposure area is set to 0.5-5mil.

[0013] S8. The printed circuit board is exposed using a CCD exposure device according to the widened exposure area.

[0014] As a further preferred embodiment of this technical solution: In step S1, process edges are reserved on both sides of the printed circuit board to allow for the opening of tapered through holes, thereby avoiding damage to the main body of the printed circuit board.

[0015] As a further preferred embodiment of this technical solution: In step S1, a tapered through-hole is opened on the process edge, and the tapered through-hole is subsequently used as a target to position the printed circuit board.

[0016] As a further preferred embodiment of this technical solution: In step S2, the identification code in the middle of the process edge is identified by the identification device inside the screen printing machine, and the specifications, dimensions and printing requirements of the printed circuit board are quickly determined by the screen printing machine.

[0017] As a further preferred embodiment of this technical solution: In step S2, the printed circuit board is placed on a conical positioning block inside the screen printing machine, so as to position and limit the printed circuit board by inserting the conical positioning block into the conical through hole.

[0018] As a further preferred embodiment of this technical solution: in step S3, an image acquisition device is used to acquire an image of the printed circuit board before solder resist treatment, so as to obtain a real printed circuit image.

[0019] As a further preferred embodiment of this technical solution: In step S4, the printed circuit board after solder mask treatment is placed on the alignment platform, and then the process edge is squeezed by a hydraulic drive device so that the tapered positioning block and the tapered through hole can fully contact each other to position the printed circuit board on the alignment platform, and the hydraulic drive device does not block the tapered through hole.

[0020] As a further preferred embodiment of this technical solution: In step S5, the alignment platform is driven to move by the four built-in cameras in the CCD exposure equipment using the camera centering function, so as to move the four tapered through holes of the printed circuit board to the center position of the four built-in cameras respectively, in order to further position the printed circuit board and the alignment platform.

[0021] As a further preferred embodiment of this technical solution: In step S6, the image acquired by the image acquisition device is processed by the CCD exposure device using machine vision technology to calculate the solder joint features and solder joint positions.

[0022] As a further preferred embodiment of this technical solution: In step S7, the maximum widening length of one side of the exposure area is calculated by using the distance between solder joints, and the exposure area is aligned and corrected, thus avoiding the situation where the area is too small to completely cover the window area or the printed circuit board is short-circuited due to the area being too large.

[0023] Advantages of this invention: This invention reserves process edges on both sides of the circuit board, and then opens four tapered through holes on the process edges. The tapered through holes and tapered positioning blocks are used to initially position the circuit board, and the tapered through holes can be used as positioning targets for further positioning of the circuit board. This eliminates the need for manual positioning operations, improving positioning accuracy. Furthermore, the distance between solder points on the circuit board can be used to align and correct the single-sided widening length of the exposure area, avoiding situations where the area is too small to completely cover the window area or too large to cause a short circuit on the printed circuit board, thus improving the fault tolerance of the exposure process. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a flowchart of the steps of the present invention. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Example 1

[0028] Please see Figure 1 This invention provides a technical solution: a method for aligning solder joints on a CCD, comprising the following steps:

[0029] S1. Reserve a 4mm process edge on both sides of the printed circuit board, and open four tapered through holes on the process edge. Print the identification code in the middle of the process edge.

[0030] S2. Place the printed circuit board into the screen printing machine and use the tapered positioning block to position the process edges on both sides of the printed circuit board in order to perform solder resist treatment on the printed circuit board. The thickness of the solder resist ink printing is 10μm.

[0031] S3. Use an image acquisition device to acquire images of the printed circuit board before solder resist treatment, and transmit the acquired images to a CCD exposure device.

[0032] S4. Place the printed circuit board after solder mask treatment into the alignment platform inside the CCD exposure equipment, and then use a hydraulic drive device to squeeze both sides of the process edge so that the tapered through hole can fully fit with the tapered positioning block of the alignment platform. The pressure is 0.1MPa.

[0033] S5. Use the four built-in cameras in the CCD exposure equipment to acquire images of the printed circuit board again, so as to use the camera centering function to drive the alignment platform to center the four tapered through holes.

[0034] S6. The image acquired by the image acquisition device is segmented by the CCD exposure device, and the features of the segmented image are extracted. Then, the solder joint features on the printed circuit board are judged by using feature comparison.

[0035] S7. After the solder joint features are determined, the distance between solder joints is calculated using a CCD exposure device. Then, based on the calculation results, the single-sided widening length of the exposure area is set to 0.5 mil.

[0036] S8. The printed circuit board is exposed using a CCD exposure device according to the widened exposure area.

[0037] In this embodiment, specifically: in S1, by reserving process edges on both sides of the printed circuit board to open tapered through holes, damage to the main body of the printed circuit board is avoided; in S1, by opening tapered through holes on the process edges, the tapered through holes are subsequently used as targets to position the printed circuit board; by reserving process edges on both sides of the circuit board, and then opening four tapered through holes on the process edges, the tapered through holes and tapered positioning blocks are used to initially position the circuit board.

[0038] In this embodiment, specifically: In S2, the identification code in the middle of the process edge is identified by the identification device inside the screen printing machine, and the specifications, dimensions and printing requirements of the printed circuit board are quickly determined by the screen printing machine; the identification code is read by the identification device to obtain the specifications, dimensions and printing requirements of the printed circuit board; In S2, the printed circuit board is placed on the conical positioning block inside the screen printing machine, and the conical positioning block is inserted into the conical through hole to position and limit the printed circuit board; the printed circuit board is treated with solder resist ink printing by the screen printing machine.

[0039] In this embodiment, specifically: in S3, an image acquisition device is used to acquire an image of the printed circuit board before solder resist treatment in order to obtain a real printed circuit image; an image acquisition device is used to acquire an image of the printed circuit board before solder resist treatment.

[0040] In this embodiment, specifically: in S4, the printed circuit board after solder mask treatment is placed on the alignment platform, and then the process edge is squeezed by the hydraulic drive device so that the tapered positioning block and the tapered through hole can fully contact each other to position the printed circuit board on the alignment platform, and the hydraulic drive device does not block the tapered through hole; by squeezing the process edge of the printed circuit board by the hydraulic drive device, the tapered positioning block and the tapered through hole are made to fit together.

[0041] In this embodiment, specifically: in S5, the alignment platform is driven to move by the four built-in cameras in the CCD exposure equipment using the camera centering function, so as to move the four tapered through holes of the printed circuit board to the center position of the four built-in cameras respectively, in order to further position the printed circuit board and the alignment platform; by using the tapered through holes as positioning targets, the circuit board is further positioned.

[0042] In this embodiment, specifically: in S6, the image acquired by the image acquisition device is processed by the CCD exposure device using machine vision technology to calculate the solder joint features and solder joint positions; the image acquired by the image acquisition device is segmented by the CCD exposure device, and then features are extracted from the segmented image; then the image features stored in the feature library are compared with the extracted features to determine the image features.

[0043] In this embodiment, specifically: in S7, the maximum single-sided widening length of the exposure area is calculated by utilizing the distance between solder joints, and the exposure area is aligned and corrected. This avoids the situation where the area is too small to completely cover the window area or the area is too large to cause a short circuit on the printed circuit board. By utilizing the distance between solder joints on the circuit board to align and correct the single-sided widening length of the exposure area, the situation where the area is too small to completely cover the window area or the area is too large to cause a short circuit on the printed circuit board is avoided, thus improving the fault tolerance rate of the exposure process.

[0044] Example 2

[0045] Please see Figure 1 This invention provides a technical solution: a method for aligning solder joints on a CCD, comprising the following steps:

[0046] S1. Reserve a 6mm process edge on both sides of the printed circuit board, and open four tapered through holes on the process edge, and print the identification code in the middle of the process edge.

[0047] S2. Place the printed circuit board into the screen printing machine and use the tapered positioning block to position the process edges on both sides of the printed circuit board in order to perform solder resist treatment on the printed circuit board. The thickness of the solder resist ink printing is 12μm.

[0048] S3. Use an image acquisition device to acquire images of the printed circuit board before solder resist treatment, and transmit the acquired images to a CCD exposure device.

[0049] S4. Place the printed circuit board after solder mask treatment into the alignment platform inside the CCD exposure equipment, and then use a hydraulic drive device to squeeze both sides of the process edge so that the tapered through hole can fully fit with the tapered positioning block of the alignment platform. The pressure is 0.25MPa.

[0050] S5. Use the four built-in cameras in the CCD exposure equipment to acquire images of the printed circuit board again, so as to use the camera centering function to drive the alignment platform to center the four tapered through holes.

[0051] S6. The image acquired by the image acquisition device is segmented by the CCD exposure device, and the features of the segmented image are extracted. Then, the solder joint features on the printed circuit board are judged by using feature comparison.

[0052] S7. After the solder joint features are determined, the distance between solder joints is calculated using a CCD exposure device. Then, based on the calculation results, the single-sided widening length of the exposure area is set to 3mil.

[0053] S8. The printed circuit board is exposed using a CCD exposure device according to the widened exposure area.

[0054] In this embodiment, specifically: in S1, by reserving process edges on both sides of the printed circuit board to open tapered through holes, damage to the main body of the printed circuit board is avoided; in S1, by opening tapered through holes on the process edges, the tapered through holes are subsequently used as targets to position the printed circuit board; by reserving process edges on both sides of the circuit board, and then opening four tapered through holes on the process edges, the tapered through holes and tapered positioning blocks are used to initially position the circuit board.

[0055] In this embodiment, specifically: In S2, the identification code in the middle of the process edge is identified by the identification device inside the screen printing machine, and the specifications, dimensions and printing requirements of the printed circuit board are quickly determined by the screen printing machine; the identification code is read by the identification device to obtain the specifications, dimensions and printing requirements of the printed circuit board; In S2, the printed circuit board is placed on the conical positioning block inside the screen printing machine, and the conical positioning block is inserted into the conical through hole to position and limit the printed circuit board; the printed circuit board is treated with solder resist ink printing by the screen printing machine.

[0056] In this embodiment, specifically: in S3, an image acquisition device is used to acquire an image of the printed circuit board before solder resist treatment in order to obtain a real printed circuit image; an image acquisition device is used to acquire an image of the printed circuit board before solder resist treatment.

[0057] In this embodiment, specifically: in S4, the printed circuit board after solder mask treatment is placed on the alignment platform, and then the process edge is squeezed by the hydraulic drive device so that the tapered positioning block and the tapered through hole can fully contact each other to position the printed circuit board on the alignment platform, and the hydraulic drive device does not block the tapered through hole; by squeezing the process edge of the printed circuit board by the hydraulic drive device, the tapered positioning block and the tapered through hole are made to fit together.

[0058] In this embodiment, specifically: in S5, the alignment platform is driven to move by the four built-in cameras in the CCD exposure equipment using the camera centering function, so as to move the four tapered through holes of the printed circuit board to the center position of the four built-in cameras respectively, in order to further position the printed circuit board and the alignment platform; by using the tapered through holes as positioning targets, the circuit board is further positioned.

[0059] In this embodiment, specifically: in S6, the image acquired by the image acquisition device is processed by the CCD exposure device using machine vision technology to calculate the solder joint features and solder joint positions; the image acquired by the image acquisition device is segmented by the CCD exposure device, and then features are extracted from the segmented image; then the image features stored in the feature library are compared with the extracted features to determine the image features.

[0060] In this embodiment, specifically: in S7, the maximum single-sided widening length of the exposure area is calculated by utilizing the distance between solder joints, and the exposure area is aligned and corrected. This avoids the situation where the area is too small to completely cover the window area or the area is too large to cause a short circuit on the printed circuit board. By utilizing the distance between solder joints on the circuit board to align and correct the single-sided widening length of the exposure area, the situation where the area is too small to completely cover the window area or the area is too large to cause a short circuit on the printed circuit board is avoided, thus improving the fault tolerance rate of the exposure process.

[0061] Example 3

[0062] Please see Figure 1 This invention provides a technical solution: a method for aligning solder joints on a CCD, comprising the following steps:

[0063] S1. Reserve an 8mm process edge on both sides of the printed circuit board, and open four tapered through holes on the process edge, and print the identification code in the middle of the process edge.

[0064] S2. Place the printed circuit board into the screen printing machine and use the tapered positioning block to position the process edges on both sides of the printed circuit board in order to perform solder resist treatment on the printed circuit board. The thickness of the solder resist ink printing is 15μm.

[0065] S3. Use an image acquisition device to acquire images of the printed circuit board before solder resist treatment, and transmit the acquired images to a CCD exposure device.

[0066] S4. Place the printed circuit board after solder mask treatment into the alignment platform inside the CCD exposure equipment, and then use a hydraulic drive device to squeeze both sides of the process edge so that the tapered through hole can fully fit with the tapered positioning block of the alignment platform. The pressure is 0.5MPa.

[0067] S5. Use the four built-in cameras in the CCD exposure equipment to acquire images of the printed circuit board again, so as to use the camera centering function to drive the alignment platform to center the four tapered through holes.

[0068] S6. The image acquired by the image acquisition device is segmented by the CCD exposure device, and the features of the segmented image are extracted. Then, the solder joint features on the printed circuit board are judged by using feature comparison.

[0069] S7. After the solder joint features are determined, the distance between solder joints is calculated using a CCD exposure device. Then, based on the calculation results, the single-sided widening length of the exposure area is set to 5mil.

[0070] S8. The printed circuit board is exposed using a CCD exposure device according to the widened exposure area.

[0071] In this embodiment, specifically: in S1, by reserving process edges on both sides of the printed circuit board to open tapered through holes, damage to the main body of the printed circuit board is avoided; in S1, by opening tapered through holes on the process edges, the tapered through holes are subsequently used as targets to position the printed circuit board; by reserving process edges on both sides of the circuit board, and then opening four tapered through holes on the process edges, the tapered through holes and tapered positioning blocks are used to initially position the circuit board.

[0072] In this embodiment, specifically: In S2, the identification code in the middle of the process edge is identified by the identification device inside the screen printing machine, and the specifications, dimensions and printing requirements of the printed circuit board are quickly determined by the screen printing machine; the identification code is read by the identification device to obtain the specifications, dimensions and printing requirements of the printed circuit board; In S2, the printed circuit board is placed on the conical positioning block inside the screen printing machine, and the conical positioning block is inserted into the conical through hole to position and limit the printed circuit board; the printed circuit board is treated with solder resist ink printing by the screen printing machine.

[0073] In this embodiment, specifically: in S3, an image acquisition device is used to acquire an image of the printed circuit board before solder resist treatment in order to obtain a real printed circuit image; an image acquisition device is used to acquire an image of the printed circuit board before solder resist treatment.

[0074] In this embodiment, specifically: in S4, the printed circuit board after solder mask treatment is placed on the alignment platform, and then the process edge is squeezed by the hydraulic drive device so that the tapered positioning block and the tapered through hole can fully contact each other to position the printed circuit board on the alignment platform, and the hydraulic drive device does not block the tapered through hole; by squeezing the process edge of the printed circuit board by the hydraulic drive device, the tapered positioning block and the tapered through hole are made to fit together.

[0075] In this embodiment, specifically: in S5, the alignment platform is driven to move by the four built-in cameras in the CCD exposure equipment using the camera centering function, so as to move the four tapered through holes of the printed circuit board to the center position of the four built-in cameras respectively, in order to further position the printed circuit board and the alignment platform; by using the tapered through holes as positioning targets, the circuit board is further positioned.

[0076] In this embodiment, specifically: in S6, the image acquired by the image acquisition device is processed by the CCD exposure device using machine vision technology to calculate the solder joint features and solder joint positions; the image acquired by the image acquisition device is segmented by the CCD exposure device, and then features are extracted from the segmented image; then the image features stored in the feature library are compared with the extracted features to determine the image features.

[0077] In this embodiment, specifically: in S7, the maximum single-sided widening length of the exposure area is calculated by utilizing the distance between solder joints, and the exposure area is aligned and corrected. This avoids the situation where the area is too small to completely cover the window area or the area is too large to cause a short circuit on the printed circuit board. By utilizing the distance between solder joints on the circuit board to align and correct the single-sided widening length of the exposure area, the situation where the area is too small to completely cover the window area or the area is too large to cause a short circuit on the printed circuit board is avoided, thus improving the fault tolerance rate of the exposure process.

[0078] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for aligning solder joints on a CCD, characterized in that, Includes the following steps: S1. Reserve a 4-8mm process edge on both sides of the printed circuit board, and open four tapered through holes on the process edge, and print the identification code in the middle of the process edge. S2. Place the printed circuit board into the screen printing machine and use the tapered positioning blocks to position the process edges on both sides of the printed circuit board in order to perform solder resist treatment on the printed circuit board. The thickness of the solder resist ink printing is 10-15μm. S3. Use an image acquisition device to acquire images of the printed circuit board before solder resist treatment, and transmit the acquired images to a CCD exposure device. S4. Place the printed circuit board after solder mask treatment into the alignment platform inside the CCD exposure equipment, and then use a hydraulic drive device to squeeze both sides of the process edge so that the tapered through hole can fully fit with the tapered positioning block of the alignment platform. The pressure is 0.1-0.5MPa. S5. Use the four built-in cameras in the CCD exposure equipment to acquire images of the printed circuit board again, so as to use the camera centering function to drive the alignment platform to center the four tapered through holes. S6. The image acquired by the image acquisition device is segmented by the CCD exposure device, and the features of the segmented image are extracted. Then, the solder joint features on the printed circuit board are judged by using feature comparison. S7. After the solder joint features are determined, the distance between solder joints is calculated using a CCD exposure device. Then, based on the calculation results, the single-sided widening length of the exposure area is set to 0.5-5mil. S8. The printed circuit board is exposed using a CCD exposure device according to the widened exposure area.

2. The method for aligning CCD solder joints according to claim 1, characterized in that: In step S1, process edges are reserved on both sides of the printed circuit board to facilitate the opening of tapered through holes.

3. The method for aligning CCD solder joints according to claim 1, characterized in that: In S1, a tapered through-hole is opened on the process edge, and the tapered through-hole is then used as a target to position the printed circuit board.

4. The method for aligning CCD solder joints according to claim 3, characterized in that: In step S2, the identification code in the middle of the process edge is identified by the identification equipment in the screen printing machine, and the specifications, size and printing requirements of the printed circuit board are quickly determined by the screen printing machine.

5. The method for aligning CCD solder joints according to claim 4, characterized in that: In step S2, the printed circuit board is placed on a conical positioning block inside the screen printing machine, so as to position and limit the printed circuit board by inserting the conical positioning block into the conical through hole.

6. The method for aligning CCD solder joints according to claim 1, characterized in that: In step S3, an image acquisition device is used to acquire an image of the printed circuit board before solder resist treatment in order to obtain a real printed circuit image.

7. The method for aligning CCD solder joints according to claim 1, characterized in that: In step S4, the printed circuit board after solder mask treatment is placed on the alignment platform, and then the process edge is squeezed by the hydraulic drive device so that the tapered positioning block can fully contact the tapered through hole to position the printed circuit board on the alignment platform, and the hydraulic drive device does not block the tapered through hole.

8. The method for aligning CCD solder joints according to claim 1, characterized in that: In step S5, the alignment platform is driven to move by the four built-in cameras in the CCD exposure equipment using the camera centering function, so as to move the four tapered through holes of the printed circuit board to the center position of the four built-in cameras respectively, in order to further position the printed circuit board and the alignment platform.

9. The method for aligning CCD solder joints according to claim 1, characterized in that: In step S6, the image acquired by the image acquisition device is processed by the CCD exposure device using machine vision technology to calculate the solder joint features and solder joint positions.

10. A method for aligning solder joints in a CCD anti-soldering device according to claim 1, characterized in that: In step S7, the maximum widening length of one side of the exposure area is calculated by using the distance between solder joints, and the exposure area is aligned and corrected.

Images