An intelligent card packaging apparatus

Abstract

The application relates to the technical field of smart card production, in particular to a smart card packaging equipment, which comprises a rack, a conveying belt for conveying cards to be processed arranged on the rack, clamping and positioning devices for placing the cards to be processed, the clamping and positioning devices being arranged at intervals along the conveying direction of the conveying belt, and a hot-pressing device matched with the clamping and positioning devices and located above the clamping and positioning devices, wherein the hot-pressing device comprises a fixed plate, the upper end of the fixed plate is connected with a pressing plate above the fixed plate through a plurality of struts, and the upper end of the pressing plate is connected with external lifting equipment. The setting of the buffer air cylinder and the first spring can buffer the impact force when the hot-pressing head contacts the card to be processed, so that the problem of high defective product rate caused by the damage of the chip due to the excessive impact force during the contact moment is avoided.

Description

Technical Field

[0001] The invention relates to the field of smart card manufacturing technology, specifically to a smart card packaging device. Background Technology

[0002] Currently, smart card chip packaging equipment involves two processes: hot pressing and cold pressing. When the smart card reaches the hot pressing stage, a clamping and positioning device driven by a cylinder is located below the smart card to clamp and position the card. After positioning, a hot pressing head above the smart card containing the module chip presses down on the module chip, heating it to a set high temperature. At this point, the high-temperature module chip melts the surrounding material of the smart card, thus completing the smart card packaging.

[0003] However, the existing hot press head does not provide sufficient buffering when it moves down to press against the chip surface, resulting in excessive instantaneous pressure on the chip surface, which in turn damages the chip and increases the defect rate. Therefore, improvements are needed. Summary of the Invention

[0004] Technical problems to be solved

[0005] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a smart card packaging device that can effectively solve the problem that the existing hot pressing head does not provide enough buffer when it moves down to press against the chip surface, resulting in excessive instantaneous pressure on the chip surface, which in turn leads to chip damage and increased defect rate.

[0006] Technical solution

[0007] To achieve the above objectives, the invention is implemented through the following technical solution:

[0008] The invention provides a smart card packaging device, including a frame on which a conveyor belt for conveying cards to be processed is provided;

[0009] A clamping and positioning device is used to place the card to be processed. There are multiple clamping and positioning devices, which are arranged at intervals along the conveyor belt conveying direction.

[0010] A hot pressing device is provided, which is matched with and located above a clamping and positioning device. The hot pressing device includes a fixed plate, the upper end of which is connected to a pressure plate above it via multiple support columns. The upper end of the pressure plate is connected to an external lifting device. A buffer cylinder is provided in the middle of the fixed plate, penetrating the fixed plate. The buffer cylinder is arranged downwards, and the lower end of its piston rod is connected to a hot pressing head. A heating module is provided inside the piston rod above the hot pressing head. A first spring is fitted around the piston rod of the buffer cylinder between the fixed plate and the hot pressing head.

[0011] In use, the card to be processed is moved to the clamping and positioning device by an external handling device and fixed. Then, the conveyor belt moves the clamping and positioning device and the card to be processed directly below the hot pressing device. The external lifting device moves the hot pressing device downward, which in turn moves the hot pressing head downward and heats it using a heating module. When the hot pressing head contacts the card to be processed, it is first subjected to the reaction force of the card to overcome the pressure of the rodless chamber of the buffer cylinder to achieve buffering upward movement. This buffers the impact force at the moment of contact between the hot pressing head and the card to be processed, avoiding excessive impact force at the moment of contact that could damage the chip and increase the defect rate. The first spring is also provided to absorb the impact energy through compression, thereby achieving further buffering. In addition, the buffer cylinder and the first spring ensure that sufficient pressure is applied to the card to be processed during hot pressing, using the reaction force of the rodless chamber of the buffer cylinder and the elastic force of the spring. This prevents insufficient pressure during hot pressing, which could lead to poor chip-card slot engagement and thus avoid defects in packaging quality.

[0012] Furthermore, the buffer cylinder is equipped with an inflation nozzle that communicates with its rodless chamber. This inflation nozzle allows for inflation of the rodless chamber of the buffer cylinder, enabling pre-setting of the pre-pressure. This, in turn, allows adjustment of the holding pressure during chip packaging, ensuring that the pressures of different parts of the chip package are matched.

[0013] Furthermore, the clamping and positioning device includes a boss, the upper end of which is provided with a placement groove for placing the card to be processed, and the lower end of the hot pressing head is provided with a groove that matches the boss. The boss and groove design allows for positioning of the chip to be processed from both sides, preventing misalignment that could lead to a high defect rate in the packaging process. It also limits the horizontal movement of the hot pressing head, ensuring accuracy during the hot pressing process.

[0014] Furthermore, the bottom of the placement slot is provided with multiple spaced strip-shaped airbags, each containing a heat-volatile liquid. The airbags and the heat-volatile liquid provide further cushioning, reducing impact and preventing damage to the chip being processed. The heat-volatile liquid also increases the pressure within the airbags during hot-pressing, further increasing the holding pressure and ensuring effective encapsulation. Simultaneously, the heat-volatile liquid continues to absorb heat and vaporize during and after hot-pressing, cooling the chip and reducing cooling time. The inflated airbags also facilitate the removal of the processed chip from the placement slot, ensuring improved efficiency for subsequent processes.

[0015] Furthermore, downwardly inclined spring tabs are provided on both sides of the boss, and top cylinders are provided inside both sides of the boss. The push rods inside the top cylinders abut against the inner sides of the spring tabs. A pressure equalization chamber is provided inside the boss, and the pressure equalization chamber is connected to each strip-shaped airbag through multiple second connecting pipes. The pressure equalization chamber is connected to the rodless chambers of the two top cylinders through first connecting pipes. By setting the spring tabs, when the hot press head moves downward, the inner wall of its groove can squeeze the spring tabs, thereby squeezing the push rods and causing them to retract into the top cylinders, thereby increasing the pressure in the rodless chambers of the top cylinders and in the airbags, further improving the holding pressure, and avoiding the problem of poor packaging effect due to insufficient holding pressure. At the same time, due to the setting of the pressure equalization chamber, the pressure in each airbag can be made the same, avoiding the problem of uneven chip pressure caused by different airbag pressures.

[0016] Furthermore, symmetrical second pressure blocks are fixed on the lower end face of the fixing plate, and each of the second pressure blocks has a first pressure block at its lower end. The upper end of each first pressure block has a groove that slides against the side wall of the second pressure block. A guide rod is fixedly installed at the lower end of each second pressure block, and a second spring is fitted over the guide rod. The two ends of the second spring are fixedly connected to the lower end of the second pressure block and the bottom of the groove, respectively. A second guide hole communicating with the groove is provided at the lower end of each first pressure block, and first guide holes matching the second guide hole are provided on both sides of the hot press head. The arrangement of the first pressure block, second pressure block, guide rod, and second spring enhances the guiding effect while further buffering, thereby ensuring the accuracy of the hot press sealing.

[0017] Furthermore, the boss is provided with a clearance groove that matches the first guide hole. An infrared sensor is installed on the inner wall of the clearance groove, with its opening direction away from the boss and facing the boss. An infrared generator matching the infrared sensor is installed outside the frame. By using the infrared sensor and infrared generator, after the guide rod passes through the first and second guide holes and enters the clearance groove, the guide rod blocks the infrared sensor's detection, thus alerting the hot pressing head to the hot pressing position. This facilitates control of the external lifting equipment to stop its descent and subsequent hot pressing timing and other operations, improving the automation level of the chip packaging production line.

[0018] Beneficial effects

[0019] The technical solution provided by the invention has the following advantages compared with known public technologies:

[0020] The invention, through the configuration of a buffer cylinder and a first spring, can buffer the impact force at the moment of contact between the hot press head and the card to be processed, avoiding excessive impact force at the moment of contact that could damage the chip and thus increase the defect rate. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0022] Figure 1 A three-dimensional diagram of the invention;

[0023] Figure 2 A perspective view of the clamping and positioning device and the hot pressing device in the invention;

[0024] Figure 3 This is a cross-sectional view of the hot pressing device in the invention;

[0025] Figure 4 This is a cross-sectional view of the clamping and positioning device in the invention.

[0026] The labels in the diagram represent: 1. Conveyor belt; 2. Clamping and positioning device; 21. Boss; 22. Placement groove; 23. Strip-shaped airbag; 24. Clearance groove; 25. Photosensor; 26. Spring; 3. Hot pressing device; 31. Fixing plate; 32. Support column; 33. Pressure plate; 34. Buffer cylinder; 35. First spring; 36. Hot pressing head; 37. First guide hole; 38. Heating module; 39. Inflation nozzle; 4. First pressure block; 41. Slide groove; 42. Second pressure block; 43. Guide rod; 44. Second spring; 45. Second guide hole; 5. Top cylinder; 51. Top rod; 52. First connecting pipe; 53. Pressure equalization chamber; 54. Second connecting pipe. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the invention clearer, the technical solutions of the embodiments of the invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the invention, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0028] The invention will be further described below with reference to embodiments.

[0029] Example:

[0030] like Figures 1-4 As shown, a smart card packaging device includes a frame, on which a conveyor belt for conveying cards to be processed is provided;

[0031] Clamping and positioning device 2 is used to place the card to be processed. There are multiple clamping and positioning devices 2, which are arranged at intervals along the conveying direction of the conveyor belt 1.

[0032] A hot pressing device 3 is matched with and located above the clamping and positioning device 2. The hot pressing device 3 includes a fixed plate 31. The upper end of the fixed plate 31 is connected to a pressure plate 33 above it through multiple support columns 32. The upper end of the pressure plate 33 is connected to an external lifting device. A buffer cylinder 34 is provided in the middle of the fixed plate 31, which is arranged downward and the lower end of its piston rod is connected to the hot pressing head 36. A heating module 38 is provided in the piston rod above the hot pressing head 36. A first spring 35 is fitted on the piston rod of the buffer cylinder 34 between the fixed plate 31 and the hot pressing head 36.

[0033] In use, the card to be processed is moved to the clamping and positioning device 2 by an external handling device and fixed. Then, the conveyor belt moves the clamping and positioning device 2 and the card to be processed to directly below the hot pressing device 3. The external lifting device moves the hot pressing device 3 downward, thereby causing the hot pressing head 36 to move downward and be heated by the heating module 38. When the hot pressing head 36 contacts the card to be processed, the hot pressing head 36 is first subjected to the reaction force of the card to be processed, which overcomes the pressure of the rodless chamber of the buffer cylinder 34 to achieve buffering upward movement, thereby mitigating the impact of the hot pressing head 36 at the moment of contact with the card. The system uses a buffer cylinder 34 to prevent excessive impact force during contact, which could damage the chip and increase the defect rate. The first spring 35 is also used to absorb impact energy through compression, further buffering the chip. In addition, the buffer cylinder 34 and the first spring 35 can apply sufficient pressure to the card under processing during hot pressing by using the reaction force of the rodless cavity of the buffer cylinder 34 and the elastic force of the spring. This prevents the chip from not fitting properly into the slot due to insufficient pressure during hot pressing, thus avoiding defects such as poor packaging quality.

[0034] Furthermore, the buffer cylinder 34 is provided with an inflation nozzle 39 communicating with its rodless cavity. The inflation nozzle 39 allows for inflation of the rodless cavity of the buffer cylinder 34, thereby pre-setting the pre-pressure. This enables adjustment of the holding pressure during chip packaging, ensuring that the pressures of different parts of the chip package are matched.

[0035] Furthermore, the clamping and positioning device 2 includes a boss 21, the upper end of which is provided with a placement groove 22 for placing the card to be processed, and the lower end of the hot pressing head 36 is provided with a groove that matches the boss 21. The boss 21 and the groove allow for positioning of the chip to be processed from both sides, preventing misalignment that could lead to a high defect rate in the packaging process. They also limit the horizontal movement of the hot pressing head 36, ensuring accuracy during the hot pressing process.

[0036] Furthermore, the bottom of the placement groove 22 is provided with multiple spaced strip-shaped airbags 23, each containing a heat-volatile liquid. The airbags and the heat-volatile liquid further buffer the impact, ensuring reduced force and preventing damage to the chip being processed. The heat-volatile liquid also increases the pressure within the airbags during hot-pressing, further increasing the holding pressure and ensuring effective encapsulation. Simultaneously, the heat-volatile liquid continuously absorbs heat and vaporizes during and after hot-pressing, cooling the chip and reducing cooling time. The bulging airbags also facilitate the removal of the processed chip from the placement groove 22, ensuring improved efficiency for subsequent processes.

[0037] Furthermore, the boss 21 is provided with downwardly inclined spring pieces 26 on both sides, and top cylinders 5 are provided inside the boss 21 on both sides. The push rod 51 inside the top cylinder 5 abuts against the inner side of the spring piece 26. The boss 21 is provided with a pressure equalization chamber 53, which is connected to each strip-shaped air bag 23 through multiple second connecting pipes 54. The pressure equalization chamber 53 is connected to the rodless chamber of the two top cylinders 5 through first connecting pipes 52. By setting the spring piece 26, when the hot pressing head 36 moves down, its groove inner wall can squeeze the spring piece 26, thereby squeezing the push rod 51 and causing it to retract into the top cylinder 5, thereby increasing the pressure in the rodless chamber of the top cylinder 5 and in the air bag, further improving the holding pressure and avoiding the problem of poor packaging effect due to insufficient holding pressure; at the same time, due to the setting of the pressure equalization chamber 53, the pressure in each air bag can be the same, avoiding the problem of uneven chip pressure caused by different air bag pressures.

[0038] Furthermore, symmetrical second pressure blocks 42 are fixed on the lower end surface of the fixing plate 31. Each of the second pressure blocks 42 has a first pressure block 4 at its lower end. The upper end of each first pressure block 4 has a sliding groove 41 that slides against the side wall of the second pressure block 42. A guide rod 43 is fixedly installed at the lower end of each second pressure block 42. A second spring 44 is fitted over the guide rod 43, and both ends of the second spring 44 are fixedly connected to the lower end of the second pressure block 42 and the bottom of the sliding groove 41, respectively. A second guide hole 45 communicating with the sliding groove 41 is provided at the lower end of each first pressure block 4. First guide holes 37 matching the second guide holes 45 are provided on both sides of the hot press head 36. The arrangement of the first pressure block 4, second pressure block 42, guide rod 43, and second spring 44 further enhances the guiding effect while providing additional cushioning, thereby ensuring the accuracy of the hot press sealing.

[0039] Furthermore, the boss 21 is provided with a clearance groove 24 that matches the first guide hole 37. An infrared sensor is provided on the inner wall of the clearance groove 24, which is located away from the boss 21 and faces the boss 21. An infrared generator matching the infrared sensor is provided outside the frame. By setting the infrared sensor and the infrared generator, after the guide rod 43 passes through the first guide hole 37 and the second guide hole 45 and enters the clearance groove 24, the guide rod 43 can block the infrared sensor from sensing, thereby reminding the hot pressing head 36 to reach the hot pressing position. This facilitates the control of the external lifting equipment to stop moving down and subsequent operations such as hot pressing timing, improving the automation level of the chip packaging production line.

[0040] The above embodiments are only used to illustrate the technical solutions of the invention, and are not intended to limit it. Although the invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the invention.

Claims

1. A smart card packaging device, characterized in that, Includes a frame, on which a conveyor belt is provided for conveying cards to be processed; A clamping and positioning device is used to place the card to be processed. There are multiple clamping and positioning devices, which are arranged at intervals along the conveyor belt conveying direction. A hot pressing device is provided, which is matched with and located above a clamping and positioning device. The hot pressing device includes a fixed plate, the upper end of which is connected to a pressure plate above it via multiple support columns. The upper end of the pressure plate is connected to an external lifting device. A buffer cylinder is provided in the middle of the fixed plate, penetrating the fixed plate. The buffer cylinder is arranged downwards, and the lower end of its piston rod is connected to a hot pressing head. A heating module is provided inside the piston rod above the hot pressing head. A first spring is fitted around the piston rod of the buffer cylinder between the fixed plate and the hot pressing head. An air inlet is provided on the buffer cylinder, communicating with its rodless chamber. The clamping and positioning device includes a boss, with a placement groove for placing the card to be processed at the upper end of the boss, and a groove matching the boss at the lower end of the hot press head; multiple spaced strip-shaped airbags are arranged at the bottom of the placement groove, and each airbag contains a heat-volatile liquid; downwardly inclined spring pieces are arranged on both sides of the boss, and top cylinders are arranged on both sides of the boss, with the top rods in the top cylinders abutting against the inner side of the spring pieces; a pressure equalization chamber is arranged in the boss, which is connected to each strip-shaped airbag through multiple second connecting pipes, and the pressure equalization chamber is connected to the rodless chambers of the two top cylinders through first connecting pipes.

2. The smart card packaging device according to claim 1, characterized in that, The lower end face of the fixed plate is symmetrically fixed with second pressure blocks, and the lower end of each of the second pressure blocks is provided with a first pressure block. The upper end of the first pressure block is provided with a sliding groove that slides with the side wall of the second pressure block. The lower end of the second pressure block is fixedly provided with a guide rod, and the guide rod is fitted with a second spring. The two ends of the second spring are respectively fixedly connected to the lower end of the second pressure block and the bottom of the sliding groove. The lower end of the first pressure block is provided with a second guide hole that communicates with the sliding groove. The two sides of the hot press head are provided with first guide holes that match the second guide hole.

3. The smart card packaging device according to claim 2, characterized in that, The boss is provided with a clearance groove that matches the first guide hole. The opening of the clearance groove is away from the boss and an infrared sensor is provided on the inner wall of the side facing the boss. An infrared generator that matches the infrared sensor is provided outside the frame.

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