A wafer stable cleaning device and cleaning method

Abstract

The present invention provides a wafer stable cleaning device and cleaning method, comprising a cleaning installation platform, a cleaning component is installed on the upper end of the cleaning installation platform, a conveying component is arranged on the upper end of the cleaning installation platform, the conveying component is located on one side of the cleaning component, the cleaning component is two groups arranged oppositely, the cleaning component comprises a cleaning installation sleeve, the inner wall of the cleaning installation sleeve is provided with a first cleaning installation part and a second cleaning installation part, the first cleaning installation part comprises a first cleaning installation plate, the first cleaning installation plate is disc-shaped, and the outer wall of the first cleaning installation plate is fixedly connected with a first cleaning component. The invention can effectively limit the wafer, and by cleaning the inner and outer circles of the wafer in turn, the wafer is ensured to be in a stable state, thereby improving the efficiency and effect of wafer cleaning.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production and processing equipment, and in particular to a wafer stable cleaning device and a cleaning method. Background Art

[0002] Wafers are important raw materials for manufacturing various semiconductor components. After cutting, wafers need to undergo processing operations such as polishing, etching, and developing. The wafer surface needs to be cleaned between the operation steps to remove metal particles and organic pollution on the wafer surface. Common wafer cleaning methods include mechanical wiping, ultrasonic cleaning, rotary spraying, etc.

[0003] Among them, mechanical scrubbing of wafers is the most widely used, and there are also relevant researches in the field of mechanical cleaning of wafers in China; for example, patent literature: A wafer cleaning method and a wafer post-processing device (CN111146116A), which respectively scrubs the front and back sides of the wafer with a first cleaning brush and a second cleaning brush, supports the wafer with a driving mechanism and a supporting roller, and drives the wafer to rotate to realize the cleaning process of the rotating wafer; however, in the above-mentioned cleaning equipment, cleaning the outer wall of the wafer with a drum-shaped cleaning brush will lead to inconsistent cleaning effects on the surface of the wafer, and the edge of the wafer needs to be repeatedly cleaned to achieve the predetermined cleaning effect, and the cleaning efficiency is low; and because the wafer itself is small in size, the wafer stability is poor when the wafer is driven to rotate by the supporting roller, which can easily cause the wafer to be damaged during the cleaning process. Since the supporting roller and the wafer are in point contact, stress is concentrated, and the edge of the wafer is more likely to be damaged. Summary of the invention

[0004] In response to the above problems, the present invention provides a wafer stable cleaning device and cleaning method, which can effectively limit the wafer, and by cleaning the inner and outer circles of the wafer in turn, ensure that the wafer is in a stable state, thereby improving the efficiency and effect of wafer cleaning.

[0005] To solve the above problems, the technical solution adopted by the present invention is:

[0006] A wafer stable cleaning device comprises a cleaning installation platform, a cleaning component is installed at the upper end of the cleaning installation platform, a conveying component is arranged at the upper end of the cleaning installation platform, the conveying component is located on one side of the cleaning component, and the cleaning component is two groups arranged opposite to each other, the cleaning component comprises a cleaning installation sleeve, the inner wall of the cleaning installation sleeve is provided with a first cleaning installation part and a second cleaning installation part, the first cleaning installation part comprises a first cleaning installation plate, the first cleaning installation plate is disc-shaped, and the outer wall of the first cleaning installation plate is fixedly connected with a first cleaning component, the first cleaning installation part also comprises a first driving component for controlling the rotation of the first cleaning installation plate, the second cleaning installation part comprises a second cleaning installation plate, the second cleaning installation plate is annular, and the outer wall of the second cleaning installation plate is fixedly connected with a second cleaning component, the second cleaning installation component also comprises a second driving component for controlling the rotation of the second cleaning installation plate, the outer wall of the first cleaning installation plate is provided with a first supporting component, and the outer wall of the second cleaning installation plate is provided with a second supporting component, and a linear control device is arranged at the upper end of the cleaning installation platform for controlling the linear movement of the two cleaning components.

[0007] Preferably, the transport assembly includes a first transport mechanism, the first transport mechanism includes a mounting base, a transport joint is provided at the upper end of the mounting base, a rotating joint is installed at the movable end of the transport joint, and an adsorption module is fixedly installed at the rotating end of the rotating joint.

[0008] Preferably, a second conveying mechanism and a third conveying mechanism are installed on the upper end of the cleaning installation platform, and the second conveying mechanism and the third conveying mechanism are respectively located on both sides of the first conveying mechanism.

[0009] Preferably, the first cleaning component and the second cleaning component are both cleaning strips, and flexible cleaning protrusions are fixedly connected to the surfaces of the cleaning strips. The cleaning strips are planar spiral-shaped and extend from the inside toward the outside.

[0010] Preferably, there is a predetermined gap between the first cleaning mounting plate and the second cleaning mounting plate, the end of the first cleaning strip extends toward the gap and is provided with an interference portion, and the filter portion is elastically connected to the first cleaning strip via an elastic member.

[0011] Preferably, a plurality of first negative pressure ports are opened on the surface of the first cleaning mounting plate, and a plurality of second negative pressure ports are opened on the surface of the second cleaning mounting plate. The first negative pressure ports and the second negative pressure ports are distributed along the spiral direction of the corresponding cleaning strips, and the first negative pressure ports and the second negative pressure ports are respectively connected to external negative pressure devices.

[0012] Preferably, the first support assembly and the second support assembly each include a plurality of telescopic rods, the side walls of the first cleaning mounting plate and the second cleaning mounting plate are respectively provided with accommodating openings for accommodating the telescopic rods, and the telescopic ends of the telescopic rods are fixedly mounted with support parts.

[0013] Preferably, the linear control device includes a control mounting base plate, the upper end of the control mounting base plate is slidably connected to an electric slider, the electric slider and the cleaning assembly are detachably fixedly connected via an installation workpiece, and the linear control device and the first support assembly and the second support assembly are controlled by a central processing unit.

[0014] A wafer stable cleaning method, step 1, loading before cleaning: controlling the wafer to move to a predetermined position by a first transport mechanism, that is, the wafer is located between two cleaning surfaces of two cleaning components;

[0015] Step 2: Fix the inner ring once: control the first support assembly to extend to achieve the limit fixation of the inner ring of the wafer; after the wafer is limit fixed, control the first transport mechanism to retract and reset; continue to control the linear control device and the first support assembly to ensure that there is a predetermined distance between the second cleaning component and the wafer surface;

[0016] Step 3: Cleaning the outer ring: The second cleaning mounting part is controlled to rotate by the second driving assembly to clean the outer ring of the wafer;

[0017] Step 4: Inner ring cleaning: After the outer ring cleaning in step 3 is completed, the second support assembly is controlled to extend to fix the outer ring of the wafer; after the outer ring is fixed, the first support assembly is controlled to retract and reset, and the first cleaning mounting part is controlled to rotate through the first driving assembly to complete the cleaning of the inner ring of the wafer;

[0018] Step 5, secondary fixation of the inner ring: after the inner ring is cleaned in step 4, the first support assembly is controlled to extend to achieve a second limit fixation of the inner ring of the wafer; after the inner ring of the wafer is fixed, the second support assembly is controlled to shrink and separate from the wafer surface;

[0019] Step 6, unloading after cleaning: control the adsorption module to extend into one side of the wafer to complete the limiting and fixing of the wafer; after the limiting and fixing of the adsorption module is completed, control the first support assembly to shrink and reset, and complete the unloading of the wafer through the first transport mechanism.

[0020] Preferably, in step three, the second driving component controls the second cleaning installation part to rotate toward the first direction, and in step four, the first driving component controls the first cleaning installation part to rotate toward the second direction.

[0021] The beneficial effects of the present invention are:

[0022] 1. By setting up two cleaning components, the wafer in a vertical state can be clamped to ensure the stability of the wafer in a fixed state, avoid cleaning the wafer in a moving state, and avoid damage to the wafer; and the inner and outer circles of the wafer surface are cleaned in turn through the first cleaning installation part and the second cleaning installation part. The wafer is cleaned in a static and fixed state, which ensures the cleaning effect and cleaning efficiency while ensuring the stability of wafer cleaning and improving the quality of the finished product.

[0023] 2. A spiral cleaning bar is respectively arranged on the outer wall of the first cleaning installation part and the second cleaning installation part. The spiral cleaning bar can clean various positions on the wafer surface multiple times during the rotation process, and the spiral cleaning bar can generate a tangential force during the rotation process, which intersects with the traditional roller type or linear type. The cleaning effect is better, and the particles generated by cleaning are sucked away in time by the negative pressure, and the cleaning effect is better.

[0024] 3. By respectively controlling the cleaning bars on the surfaces of the first cleaning installation part and the second cleaning installation part to rotate in different directions, the corresponding cleaning bars can push the particulate matter on the first side toward the second side during the rotation process, thereby reducing the overflow of particulate matter in the subsequent cleaning process and further improving the cleaning effect on the wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0026] Figure 2 It is a schematic diagram of the top view structure of the present invention;

[0027] Figure 3 It is a schematic diagram of the cleaning component of the present invention;

[0028] Figure 4 For the present invention Figure 3 Schematic diagram of the main structure;

[0029] Figure 5 For the present invention Figure 3 Schematic diagram of the side structure.

[0030] In the figure: 1. cleaning and installation platform; 2. second conveying mechanism; 3. first conveying mechanism; 301. adsorption module; 302. rotating joint; 303. conveying joint; 304. mounting base; 4. third conveying mechanism; 5. cleaning assembly; 501. cleaning and installation sleeve; 502. mounting workpiece; 6. wafer; 7. linear control device; 701. control installation base plate; 702. electric slider; 8. first cleaning installation part; 801. first cleaning installation plate; 802. first cleaning component; 803. first negative pressure port; 804. first support assembly; 9. second cleaning installation part; 901. second cleaning installation plate; 902. second cleaning component; 903. second negative pressure port; 904. second support assembly. DETAILED DESCRIPTION

[0031] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0032] Reference Figure 1 - Figure 5 , a wafer stable cleaning device comprises a cleaning installation platform 1, a cleaning component 5 is installed on the upper end of the cleaning installation platform 1, a conveying component is arranged on the upper end of the cleaning installation platform 1, the conveying component is located on one side of the cleaning component 5, and the cleaning components 5 are two groups arranged oppositely. During the wafer cleaning process, the wafer stored in the material box is conveyed between the two cleaning components 5 by the conveying component, and the two cleaning components 5 are located on both sides of the wafer. The cleaning component 5 can clamp and limit the wafer from both sides, and realize the cleaning process of the wafer after clamping and limiting; it should be noted here that during the wafer cleaning process, the cleaning component 5 can fix the wafer, and the wafer itself will not be displaced during the cleaning process, thereby improving the stability of the wafer during the cleaning process; compared with the traditional wafer cleaning method, the cleaning stability and cleaning effect of this method are better.

[0033] Please refer to the attached Figure 3 - Attachment Figure 5 ; The cleaning component 5 includes a cleaning installation sleeve 501, and the inner wall of the cleaning installation sleeve 501 is provided with a first cleaning installation part 8 and a second cleaning installation part 9. During the wafer cleaning process, the first cleaning installation part 8 can correspond to the position of the inner wall of the wafer, and can clean the middle area of ​​the wafer. The second cleaning installation part 9 is located outside the first cleaning installation part 8, and can clean the outer edge position of the second cleaning installation part 9. The wafer is alternately limited and fixed by the first cleaning installation part 8 and the second cleaning installation part 9, so as to realize the fixed limit of the wafer to ensure a stable cleaning process of the wafer.

[0034] The first cleaning installation part 8 includes a first cleaning installation plate 801, which is disc-shaped, and a first cleaning component 802 is fixedly connected to the outer wall of the first cleaning installation plate 801. The first cleaning installation part 8 also includes a first driving component for controlling the rotation of the first cleaning installation plate 801, wherein the disc-shaped first cleaning installation plate 801 can clean the middle area of ​​the wafer during the rotation process; the second cleaning installation part 9 includes a second cleaning installation plate 901, which is annular, and the second cleaning installation plate 901 is sleeved on the outer side of the first cleaning installation plate 801 and the axes of the two are consistent, and the outer wall of the second cleaning installation plate 901 is fixedly connected to the second cleaning component 90 2. The second cleaning mounting component 9 also includes a second driving component for controlling the rotation of the second cleaning mounting plate 901. The annular cleaning component can clean the edge of the wafer during the rotation, wherein the protruding first cleaning component 802 completes the cleaning of the wafer surface during the movement; the above-mentioned first driving component and the second driving component can both adopt common electric control devices or air control devices; and the first cleaning mounting plate 801 and the second cleaning mounting plate 901 are detachably fixedly connected to the above-mentioned rotating end, and the first cleaning mounting plate 801 and the second cleaning mounting plate 901 adapted thereto can be replaced according to the different sizes of the wafers, so as to complete the adaptive cleaning of wafers of different sizes.

[0035] Please refer to the attached Figure 3 And attached Figure 4 ; The first cleaning installation plate 801 is provided with a first support assembly 804 on its outer wall, and the second cleaning installation plate 901 is provided with a second support assembly 904 on its outer wall. The first support assembly 804 and the second support assembly 904 are extended when in working state, and the two groups of support assemblies can clamp and limit the wafer from both sides to complete the fixing process; the two work alternately to complete the alternating cleaning of the inner and outer circles of the wafer, thereby ensuring the stability and efficiency of wafer cleaning; and a linear control device 7 is provided at the upper end of the cleaning installation platform 1 for controlling the linear movement of the two cleaning assemblies 5. The linear control device 7 can control the linear movement of the two cleaning assemblies 5, so that the two cleaning assemblies 5 can be close to or away from the working surface, thereby ensuring the stability of the wafer loading and unloading process and the wafer limiting and fixing.

[0036] By using the above scheme to clean the wafer, the wafer can be limited and fixed in turn by the first support component 804 and the second support component 904 to ensure its stability in the vertical state; and the inner and outer circles of the wafer can be rotationally cleaned in turn. Compared with traditional roller brush cleaning or plate cleaning, through the above cleaning method, the cleaning components move consistently on the wafer surface, ensuring the consistency of the wafer surface cleaning effect, and there is no need to adjust the wafer to different positions; there is no need to adjust the position of the wafer during the cleaning process to ensure the stability of the wafer; and it has a better cleaning effect on the wafer and a faster cleaning efficiency.

[0037] Please refer to the attached Figure 1 And attached Figure 2 ; Wherein the transport assembly includes a first transport mechanism 3, the first transport mechanism 3 includes a mounting base 304, a transport joint 303 is arranged on the upper end of the mounting base 304, a rotating joint 302 is installed on the movable end of the transport joint 303, and an adsorption module 301 is installed and fixed on the rotating end of the rotating joint 302, wherein the adsorption module 301 is composed of an arc-shaped mounting plate and a suction cup, and the suction cup is distributed in a plurality of arcs along the edge of the mounting plate, and the suction cup is externally connected to a negative pressure pipe, and the edge of the wafer can be limited and fixed by the mounting plate and the suction cup, and the wafer can be controlled to rotate to a vertical state under the action of the rotating joint 302, so as to enter between the two cleaning components 5 to complete the cleaning process; the above-mentioned rotating joint 302 and the transport joint 303 can both adopt common joint machinery, and the rotating joint 302 can be controlled to be in different positions through the transport joint 303 to complete the loading and unloading of wafers.

[0038] A second conveying mechanism 2 and a third conveying mechanism 4 are installed on the upper end of the cleaning installation platform 1, and the second conveying mechanism 2 and the third conveying mechanism 4 are respectively located on both sides of the first conveying mechanism 3, wherein the second conveying mechanism 2 and the third conveying mechanism 4 can refer to the first conveying mechanism 3, and adopt common conveying machinery, which is an existing machinery and is not described again here; the second conveying mechanism 2 can be used to unload the wafers in the material box, and the third conveying mechanism 4 can be used to process the wafers on the surface of the first conveying mechanism 3, and the wafers are fully automatically unloaded, processed and cleaned, thereby improving the cleaning efficiency.

[0039] For details, please refer to the attached Figure 4; The first cleaning component 802 and the second cleaning component 902 are both cleaning strips, and flexible cleaning protrusions are fixedly connected to the surface of the cleaning strips. The cleaning strips are planar spirals and extend from the inside to the outside. The flexible cleaning protrusions can be selected as wool brushes, and their surfaces have an interference portion to complete flexible cleaning of the wafer surface; and the first cleaning component 802 and the second cleaning component 902 are set in a spiral state, and the surfaces of their bolts can clean the wafer multiple times during the rotation process, and the cleaned particles and debris can fall into the gaps between the spiral cleaning strips and be collected, thereby improving the cleaning efficiency, which is not available in the rolling brush state and straight line cleaning methods; and the cleaning strip in the spiral state can exert a tangential force on the wafer surface during the rotation process, and the force will rotate with the rotation of the cleaning strip. Compared with the traditional single-direction cleaning, the cleaning effect is better, the cleaning efficiency is improved, and the time consumed for cleaning is reduced.

[0040] There is a predetermined gap between the first cleaning mounting plate 801 and the second cleaning mounting plate 901, the end of the first cleaning strip extends toward the gap and is provided with an interference portion, the filter portion is elastically connected to the first cleaning strip through an elastic member, wherein the filter portion can be provided to deeply clean the connection portion between the first cleaning mounting portion 8 and the second cleaning mounting portion 9, thereby ensuring the cleaning effect of the connection portion between the two; Figure 4 For example, the interference is set at the inner end of the cleaning bar on the surface of the first cleaning mounting part 8. When the second cleaning mounting part 9 is rotating, the interference portion can interact with the inner cleaning bar, and the interference portion can move along the surface of the second cleaning bar to smoothly complete the cleaning process. A wedge-shaped smooth curved surface can be set at the corresponding positions of the first cleaning bar and the second cleaning bar, which will not cause wear and tear, avoid excessive friction and produce excessive debris, and ensure the cleanliness of the wafer surface; the elastic part can be selected as an elastic sheet metal, which is used to connect the interference portion and the cleaning bar to avoid rigid collision between the two and extend the service life of the components.

[0041] In order to achieve timely cleaning of debris generated during the cleaning process, a plurality of first negative pressure ports 803 are opened on the surface of the first cleaning mounting plate 801, and a plurality of second negative pressure ports 903 are opened on the surface of the second cleaning mounting plate 901. The first negative pressure ports 803 and the second negative pressure ports 903 are distributed along the spiral direction of the corresponding cleaning strips. The first negative pressure ports 803 and the second negative pressure ports 903 are respectively connected to external negative pressure devices, and the negative pressure devices can quickly suck away the particulate dust generated during the cleaning process to avoid being retained in the gaps between the cleaning strips, thereby further improving the cleaning effect on the wafer. It should be noted here that a rotating sealing connector can be provided between the rotating second cleaning mounting plate 901 and the fixed base to ensure the sealing of the rotating connection, to ensure that the negative pressure can function normally, and to ensure a normal dust collection effect. The above-mentioned rotating sealing connector is an existing component and has not been improved here and will not be described in detail.

[0042] Please refer to the attached Figure 3 And attached Figure 4 ; As an optional support method, the first support component 804 and the second support component 904 both include a plurality of telescopic rods, and the side walls of the first cleaning mounting plate 801 and the second cleaning mounting plate 901 are respectively provided with accommodating openings for accommodating the telescopic rods, and the telescopic ends of the telescopic rods are fixedly installed with support parts. The telescopic rods can be selected to be electrically controlled or pneumatically controlled to control the extension of their telescopic ends, and the wafers can be clamped and limited by the support parts at the ends to ensure the clamping effect; wherein the accommodating openings are also distributed along the direction of the cleaning strips, and the accommodating openings on the surfaces of the two cleaning components 5 are in the same position, and when the support parts act on the surface of the wafer, the two can relatively ensure the stability of the clamping; compared with the traditional roller support, the limiting effect is better and more stable; and an adsorption suction cup can be provided at the end of the support part to further ensure the stability of the support limit.

[0043] The linear control device 7 includes a control installation base plate 701, and an electric slider 702 is slidably connected to the upper end of the control installation base plate 701. The electric slider 702 and the cleaning component 5 are detachably fixedly connected by installing the workpiece 502. The linear control device 7 and the first support component 804 and the second support component 904 are controlled by the central processing unit. The central processing unit coordinates and controls the sliding of the linear control device 7 and the extension and retraction of the first support component 804 and the second support component 904 to realize an intelligent automatic control process, realize automatic control of the equipment, and improve work efficiency.

[0044] Reference Figure 1 - Figure 5A stable wafer cleaning method, step 1, loading before cleaning: the wafer is controlled to move to a predetermined position by a first transport mechanism 3, that is, the wafer is located between two cleaning surfaces of two cleaning components 5, wherein the two cleaning components 5 can completely cover the wafer surface, and their axis positions are consistent with the axis position of the wafer, which can ensure the subsequent efficient and stable wafer cleaning.

[0045] Step 2, fix the inner ring once: control the first support assembly 804 to extend to achieve the limit fixation of the inner ring of the wafer; after the wafer is limited and fixed, control the first transport mechanism 3 to retract and reset; continue to control the linear control device 7 and the first support assembly 804 to allow a predetermined distance between the second cleaning component 902 and the wafer surface; wherein the predetermined distance is determined according to the length and flexibility of the flexible cleaning protrusion to ensure sufficient cleaning effect.

[0046] Step 3, outer ring cleaning: The second driving component controls the second cleaning installation part 9 to rotate to complete the cleaning of the outer ring of the wafer. During the rotation of the second cleaning installation part 9, the cleaning strips on its surface can complete the efficient cleaning of the outer ring, and the particles and dust between the gaps of the cleaning strips can be sucked away through the second negative pressure port 903 on the outside, thereby improving the cleaning effect.

[0047] Step 4, inner ring cleaning: After the outer ring is cleaned in step 3, control the second support assembly 904 to extend to fix the outer ring of the wafer; after the outer ring is limited and fixed, control the first support assembly 804 to shrink and reset, and control the first cleaning mounting part 8 to rotate through the first driving assembly to complete the cleaning of the inner ring of the wafer. As above, the inner ring of the wafer is cleaned by the cleaning strip during the rotation process, and the first negative pressure port 803 can absorb particulate matter to ensure the cleaning effect.

[0048] Step 5, secondary fixation of the inner ring: After the inner ring is cleaned in step 4, the first support assembly 804 is controlled to extend to achieve re-limited fixation of the inner ring of the wafer; after the inner ring of the wafer is fixed, the second support assembly 904 is controlled to shrink and separate from the wafer surface. At this time, the whole is restored to the initial state of loading and fixing. At this time, there is no restriction on the outer edge of the wafer, which is convenient for the subsequent unloading process.

[0049] Step six, unloading after cleaning: control the adsorption module 301 to extend into one side of the wafer to complete the limiting and fixing of the wafer; after the limiting and fixing of the module to be adsorbed 301 is completed, control the first support assembly 804 to shrink and reset, and complete the unloading of the wafer through the first conveying mechanism 3, and the module to be adsorbed 301 at the end adsorbs and limits the wafer, and realizes the unloading and transportation through the third conveying mechanism 4 at the end.

[0050] Please refer to the attached Figure 4; In step three, the second driving component controls the second cleaning installation part 9 to rotate in the first direction, that is, counterclockwise. The spiral state shown in the accompanying drawing can push the particulate matter on the inside to move toward the outside during the rotation process to prevent it from entering the inner circle, thereby ensuring the overall cleanliness; in step four, the first driving component controls the first cleaning installation part 8 to rotate in the second direction, that is, clockwise. As above, the cleaning bar rotating clockwise on the inside can push the particulate matter on the outside to move toward the inside to prevent it from being thrown out of the outer circle, thereby ensuring the overall cleanliness.

[0051] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer stable cleaning device, comprising a cleaning installation platform (1), a cleaning assembly (5) being installed on the upper end of the cleaning installation platform (1), a transport assembly being arranged on the upper end of the cleaning installation platform (1), the transport assembly being located on one side of the cleaning assembly (5), and characterized in that: The cleaning assembly (5) is composed of two groups arranged opposite to each other. The cleaning assembly (5) comprises a cleaning installation sleeve (501). The inner wall of the cleaning installation sleeve (501) is provided with a first cleaning installation part (8) and a second cleaning installation part (9). The first cleaning installation part (8) comprises a first cleaning installation plate (801). The first cleaning installation plate (801) is disc-shaped. The outer wall of the first cleaning installation plate (801) is fixedly connected with a first cleaning component (802). The first cleaning installation part (8) also comprises a first driving component for controlling the rotation of the first cleaning installation plate (801). The second cleaning installation part (9 ) comprises a second cleaning installation plate (901), the second cleaning installation plate (901) is annular, the outer wall of the second cleaning installation plate (901) is fixedly connected with a second cleaning component (902), the second cleaning installation part (9) further comprises a second driving component for controlling the rotation of the second cleaning installation plate (901), the outer wall of the first cleaning installation plate (801) is provided with a first supporting component (804), the outer wall of the second cleaning installation plate (901) is provided with a second supporting component (904), and the upper end of the cleaning installation platform (1) is provided with a linear control device (7) for controlling the linear movement of the two cleaning components (5); The first cleaning component (802) and the second cleaning component (902) are both cleaning strips, with flexible cleaning protrusions fixedly connected to the surface of the cleaning strips, the cleaning strips are planar spiral-shaped and extend from the inside toward the outside; There is a predetermined gap between the first cleaning installation plate (801) and the second cleaning installation plate (901), the end of the first cleaning strip extends in the direction of the gap and is provided with an interference portion, and the interference portion is elastically connected to the first cleaning strip via an elastic member; The first support assembly (804) and the second support assembly (904) both comprise a plurality of telescopic rods, and the side walls of the first cleaning installation plate (801) and the second cleaning installation plate (901) are respectively provided with accommodating openings for accommodating the telescopic rods, and the telescopic ends of the telescopic rods are fixedly mounted with support parts.

2. A wafer stable cleaning device according to claim 1, characterized in that: The transport assembly comprises a first transport mechanism (3), the first transport mechanism (3) comprises a mounting base (304), a transport joint (303) is arranged at the upper end of the mounting base (304), a rotating joint (302) is installed at the movable end of the transport joint (303), and an adsorption module (301) is fixedly installed at the rotating end of the rotating joint (302).

3. A wafer stable cleaning device according to claim 2, characterized in that: A second conveying mechanism (2) and a third conveying mechanism (4) are installed on the upper end of the cleaning and installation platform (1); the second conveying mechanism (2) and the third conveying mechanism (4) are respectively located on both sides of the first conveying mechanism (3).

4. The wafer stable cleaning device according to claim 1, characterized in that: The surface of the first cleaning installation plate (801) is provided with a plurality of first negative pressure ports (803), and the surface of the second cleaning installation plate (901) is provided with a plurality of second negative pressure ports (903). The first negative pressure ports (803) and the second negative pressure ports (903) are both distributed along the spiral direction of the corresponding cleaning strips, and the first negative pressure ports (803) and the second negative pressure ports (903) are respectively connected to external negative pressure devices.

5. The wafer stable cleaning device according to claim 1, characterized in that: The linear control device (7) comprises a control mounting base plate (701), the upper end of the control mounting base plate (701) is slidably connected to an electric slider (702), the electric slider (702) and the cleaning component (5) are detachably fixedly connected via a mounting workpiece (502), and the linear control device (7) and the first support component (804) and the second support component (904) are controlled by a central processing unit.

6. A wafer stable cleaning method, characterized in that: The steps include: Step 1: Loading before cleaning: Controlling the wafer to move to a predetermined position through the first transport mechanism, that is, the wafer is located between two cleaning surfaces of two cleaning components; Step 2: Fix the inner ring once: control the first support assembly to extend to achieve the limit fixation of the inner ring of the wafer; after the wafer is limit fixed, control the first transport mechanism to retract and reset; continue to control the linear control device and the first support assembly to ensure that there is a predetermined distance between the second cleaning component and the wafer surface; Step 3: Cleaning the outer ring: The second cleaning mounting part is controlled to rotate by the second driving assembly to clean the outer ring of the wafer; Step 4: Inner ring cleaning: After the outer ring cleaning in step 3 is completed, the second support assembly is controlled to extend to fix the outer ring of the wafer; after the outer ring is fixed, the first support assembly is controlled to retract and reset, and the first cleaning mounting part is controlled to rotate through the first driving assembly to complete the cleaning of the inner ring of the wafer; Step 5, secondary fixation of the inner ring: after the inner ring is cleaned in step 4, the first support assembly is controlled to extend to achieve a second limit fixation of the inner ring of the wafer; after the inner ring of the wafer is fixed, the second support assembly is controlled to shrink and separate from the wafer surface; Step 6, unloading after cleaning: control the adsorption module to extend into one side of the wafer to complete the limiting and fixing of the wafer; after the limiting and fixing of the adsorption module is completed, control the first support assembly to shrink and reset, and complete the unloading of the wafer through the first transport mechanism.

7. A wafer stable cleaning method according to claim 6, characterized in that: In step three, the second driving component controls the second cleaning installation part to rotate toward the first direction, and in step four, the first driving component controls the first cleaning installation part to rotate toward the second direction.

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