Dual frequency conversion circuit structure

Abstract

A dual-frequency conversion circuit structure includes a first transmission line, a second transmission line, and a conductive layer. The first transmission line has a first input end, a first output end, and a second output end. The second transmission line has a second input end, a third input end, a third output end, and a fourth output end. The second input end is coupled to the first output end, and the third input end is coupled to the second output end. The conductive layer is stacked with the first transmission line and the second transmission line. The conductive layer includes a first hollow pattern. The first hollow pattern overlaps the second transmission line in a top view.

Description

Technical Field

[0001] This application relates to a wireless communication circuit structure, and more particularly to a dual-frequency conversion circuit structure. Background Technology

[0002] In wireless communication systems, due to the less-than-ideal linearity of the power output stage, higher harmonics are inevitably generated at the output, causing interference to other frequency bands. Therefore, how to suppress the higher harmonics of the system within specifications to improve system performance and comply with regulations has become one of the issues of concern in this field. Summary of the Invention

[0003] This application discloses a dual-frequency conversion circuit structure, comprising a first transmission line, a second transmission line, and a conductive layer. The first transmission line has a first input terminal, a first output terminal, and a second output terminal. The second transmission line has a second input terminal, a third input terminal, a third output terminal, and a fourth output terminal. The second input terminal is coupled to the first output terminal, and the third input terminal is coupled to the second output terminal. The conductive layer is stacked on top of the first and second transmission lines. The conductive layer includes a first cutout pattern. The first cutout pattern overlaps with the second transmission line in a top view.

[0004] This application discloses a dual-frequency conversion circuit structure, comprising a first conductive layer and a second conductive layer. The second conductive layer includes a first perforated pattern. The second conductive layer and the first conductive layer are stacked and separated by a dielectric material. The first conductive layer includes a balun circuit, a filter circuit, and a coplanar stripline. The filter circuit includes a transmission line. The transmission line includes a second perforated pattern. The first perforated pattern overlaps with the transmission line in a top view, but does not overlap with the second perforated pattern in a top view. The filter circuit is coupled between the balun circuit and the coplanar stripline.

[0005] The dual-frequency conversion circuit structure of this application utilizes the perforated pattern on the transmission line and the ground conductive layer to provide higher insertion loss for the high-frequency signal portion. Compared with known technologies, the dual-frequency conversion circuit structure of this application does not use additional components, materials, or wiring area, and can improve the suppression capability for higher harmonics. Attached Figure Description

[0006] The various embodiments of this application can be best understood by reading the following description and the accompanying drawings. It should be noted that, in accordance with standard practice in the art, the various features in the figures are not drawn to scale. In fact, the dimensions of certain features may be intentionally enlarged or reduced for clarity of description.

[0007] Figure 1 This is a schematic diagram of the dual-frequency conversion circuit structure in some embodiments of this application.

[0008] Figure 2This is a schematic diagram of the first conductive layer in the dual-frequency conversion circuit structure in some embodiments of this application.

[0009] Figure 3 This is a schematic diagram of the second conductive layer in the dual-frequency conversion circuit structure in some embodiments of this application.

[0010] Figure 4 This is a partial detailed schematic diagram of the dual-frequency conversion circuit structure in some embodiments of this application.

[0011] Symbol explanation:

[0012] 10: Dual-frequency conversion circuit structure

[0013] 100: Conductive layer

[0014] 200: Conductive layer

[0015] 120: Transmission line

[0016] 140: Transmission line

[0017] 160: Transmission line

[0018] 161: First strip line

[0019] 162: Second strip

[0020] T1: Hollowed-out pattern

[0021] T2: Hollowed-out pattern

[0022] T3: Hollowed-out pattern

[0023] T4: Hollowed-out pattern

[0024] U1: Hollowed-out pattern

[0025] U2: Hollowed-out pattern

[0026] U3: Hollow Pattern

[0027] U4: Hollowed-out pattern

[0028] C1: Gap

[0029] C2: Gap

[0030] C3: Gap

[0031] C4: Gap

[0032] O1: Opening

[0033] O2: Opening

[0034] O3: Opening

[0035] O4: Opening

[0036] N1: Input terminal

[0037] N2: Output terminal

[0038] N3: Output terminal

[0039] N4: Input terminal

[0040] N5: Input terminal

[0041] N6: Output terminal

[0042] N7: Output terminal

[0043] N8: Input terminal

[0044] N9: Input terminal

[0045] SG1: First paragraph

[0046] SG2: Second paragraph

[0047] SG3: Third paragraph

[0048] SG4: Fourth paragraph Detailed Implementation

[0049] The embodiments of this application improve the dual-frequency conversion circuit in dual-frequency wireless communication to increase the circuit's ability to suppress harmonics, thereby reducing the high-order harmonics of the overall system. Figure 1 This is a schematic diagram of an embodiment of the dual-frequency conversion circuit structure 10 of this application. The dual-frequency conversion circuit structure 10 is used to receive an input signal and generate a converted signal to a power output stage (not shown in the figure). The power output stage amplifies the converted signal to an output signal according to a gain value. In some embodiments, the dual-frequency conversion circuit structure 10 is applied in a transmitter for dual-frequency wireless communication, for example, in a transmitter conforming to the IEEE 802.11a / b / g / n / ac standard.

[0050] A dual-frequency conversion circuit structure 10 is disposed on a double-layer printed circuit board. This double-layer printed circuit includes a conductive layer 100 and a conductive layer 200 stacked together and separated by a dielectric material. The conductive layer 100 is disposed on the top of the double-layer printed circuit board and includes a dual-frequency microstrip line to receive and process the input signal, then outputs the processed signal through a coplanar strip. The conductive layer 200 serves as a reference ground layer and is disposed on the bottom of the double-layer printed circuit board. Figure 1As shown, the dual-frequency microstrip line includes a balun circuit (hereinafter referred to as transmission line 120) and a filter circuit (hereinafter referred to as transmission line 140). In a further embodiment, the filter circuit is a low-pass filter. The coplanar stripline (hereinafter referred to as transmission line 160) includes a first stripline 161 and a second stripline 162.

[0051] The input terminal N1 of transmission line 120 is used to receive the input signal; the output terminals N2 and N3 of transmission line 120 are respectively connected to the input terminals N4 and N5 of transmission line 140; the output terminals N6 and N7 of transmission line 140 are respectively connected to the input terminal N8 of the first stripline 161 and the input terminal N9 of the second stripline 162. Figure 1 In the top view shown, transmission lines 120 and 140 are disposed within the area of ​​conductive layer 200 and overlap each other. The left end of transmission line 160 overlaps conductive layer 200 and extends to the right beyond the area of ​​conductive layer 200. Specifically, the first strip line 161 and the second strip line 162 extend in a direction away from transmission line 140.

[0052] To facilitate understanding of the relative arrangement of components in conductive layer 100 and conductive layer 200, Figure 2 and Figure 3 Schematic diagrams of conductive layer 100 and conductive layer 200 are shown separately.

[0053] Please refer to Figure 2 The transmission line 140 includes cutout patterns T1, T2, T3, and T4. And as... Figure 3 As shown, the conductive layer 200 comprises a single sheet of metal with perforated patterns U1, U2, U3, and U4, such as... Figure 1 As shown, the hollow patterns U1 to U4 partially overlap with the transmission line 140, but the hollow patterns U1 to U4 do not overlap with the hollow patterns T1 to T4 of the transmission line 140.

[0054] Please also refer to Figure 4 . Figure 4 A schematic diagram of transmission line 140 and cutout patterns U1 to U4 is shown. Transmission line 140 includes a first segment SG1, a second segment SG2, a third segment SG3, and a fourth segment SG4. The first segment SG1 is connected between input terminal N4 and the second segment SG2; the second segment SG2 is connected between the first segment SG1 and the output terminal N6; the third segment SG3 is connected between input terminal N5 and the fourth segment SG4; and the fourth segment SG4 is connected between the third segment SG3 and the output terminal N7. In the top view, the first segment SG1, the third segment SG3, the first stripline 161, and the second stripline 162 are arranged in parallel; the second segment SG2 and the fourth segment SG4 are arranged in parallel; the first segment SG1 and the second segment SG2 are arranged perpendicularly; and the third segment SG3 and the fourth segment SG4 are arranged perpendicularly.

[0055] The hollow pattern T1 is set in the first segment SG1; the hollow pattern T2 is set in the second segment SG2; the hollow pattern T3 is set in the third segment SG3; and the hollow pattern T4 is set in the fourth segment SG4.

[0056] In the top view, the perforated patterns T1 to T4 in the transmission line 140 are not closed perforated patterns, but are T-shaped perforated patterns with a notch. The notch C1 of perforated pattern T1 faces away from the third segment SG3; the notch C2 of perforated pattern T2 faces away from the transmission line 160; the notch C3 of perforated pattern T3 faces away from the first segment SG1; and the notch C4 of perforated pattern T4 faces away from the transmission line 160. The first segment SG1, perforated pattern T1, the second segment SG2, and perforated pattern T2 are symmetrically arranged with the third segment SG3, perforated pattern T3, the fourth segment SG4, and perforated pattern T4, respectively. In some embodiments, perforated pattern T1 and perforated pattern T3 are the same size, and perforated pattern T2 and perforated pattern T4 are the same size. In some embodiments, perforated pattern T1 and perforated pattern T2 are different sizes. In other embodiments, the directions of the notches C1 to C4 of perforated patterns T1 to T4 may be the same as those of the third segment SG1, the fourth segment SG4, and the fifth segment SG4. Figure 2 The results are different.

[0057] In the top view, the hollow pattern U1 overlaps with the first segment SG1, the hollow pattern U2 overlaps with the first segment SG2, the hollow pattern U3 overlaps with the first segment SG3, and the hollow pattern U4 overlaps with the first segment SG4. Hollow patterns U1 to U4 are closed hollow patterns, and are U-shaped hollow patterns with an opening. The first segment SG1 passes through the opening O1 of hollow pattern U1, and the opening O1 faces the input terminal N4; the second segment SG2 passes through the opening O2 of hollow pattern U2, and the opening O2 faces the output terminal N6; the third segment SG3 passes through the opening O3 of hollow pattern U3, and the opening O3 faces the input terminal N5; the fourth segment SG4 passes through the opening O4 of hollow pattern U4, and the opening O4 faces the output terminal N7. In some embodiments, hollow patterns U1 and U3 are the same size, and hollow patterns U2 and U4 are the same size. In some embodiments, hollow patterns U1 and U2 are different sizes.

[0058] In some embodiments, the dual-frequency conversion circuit structure 10 is used to suppress higher harmonics in the output signal. In other words, the dual-frequency conversion circuit structure 10 is used to increase the insertion loss in the high-frequency range. For example, when the dual-frequency conversion circuit structure 10 is used to transmit 2.4 GHz and / or 5.5 GHz signals, the higher harmonics of the signal may be between 10 and 18 GHz (e.g., 16.5 GHz, which is a third harmonic of the 5.5 GHz signal). The dual-frequency conversion circuit structure 10 utilizes the cutout design of the transmission line 140 and the conductive layer 200 to increase the stopband bandwidth of 10 to 18 GHz. In some embodiments, the dual-frequency conversion circuit structure 10 provides an insertion loss of approximately 30 dB or more for signals in the 10 to 18 GHz band.

[0059] In some embodiments, transmission line 140 and cutout patterns U1-U4 serve as low-pass filters, whose frequency response can be obtained according to the elliptic equation, Butterworth filter formula, or Chebyshev filter formula. Cutout patterns T1, U1, T2, and U2 are sequentially connected in series along the first segment SG1 and the second segment SG2 to form one path, and cutout patterns T3, U3, T4, and U4 are sequentially connected in series along the third segment SG3 and the fourth segment SG4 to form another path. These two paths are connected in parallel to form a dual-channel low-pass filter, wherein each of the cutout patterns U1-U4 and T1-T4 is considered as a band-stop filter, and each band-stop filter provides a transmission zero for the low-pass filter. These band-stop filters are connected in series to form the aforementioned low-pass filter.

[0060] The stopband bandwidth of these band-stop filters is related to the size and position of the cutout patterns U1-U4 and T1-T4. In some embodiments, the smaller the size (e.g., the area of ​​the cutout region) of the cutout patterns U1-U4, the higher the frequency of their corresponding transmission zeros. In some embodiments, the smaller the size of the cutout patterns T1-T4, the higher the frequency of their corresponding transmission zeros.

[0061] In other embodiments, the transmission line 140 does not include the cutout patterns T1 and T3.

[0062] In other embodiments, the transmission line 140 does not include the cutout patterns T2 and T4.

[0063] In other embodiments, the conductive layer 200 does not include the cutout patterns U1 and U3.

[0064] In other embodiments, the conductive layer 200 does not include the cutout patterns U2 and U4.

[0065] In some embodiments, the first segment SG1 has at least two T-shaped openwork patterns of different sizes, and the third segment SG3 has at least two T-shaped openwork patterns of different sizes. In some embodiments, the second segment SG2 has at least two T-shaped openwork patterns of different sizes, and the fourth segment SG4 has at least two T-shaped openwork patterns of different sizes. In a further embodiment, all T-shaped openwork patterns on the first segment SG1 and the second segment SG2 are of different sizes, and all T-shaped openwork patterns on the third segment SG3 and the fourth segment SG4 are of different sizes.

[0066] In some embodiments, the conductive layer 200 further includes two U-shaped perforated patterns of the same size, different from the perforated patterns U1 and U2, which overlap the first segment SG1 and the third segment SG3, respectively. In some embodiments, the conductive layer 200 further includes two identical U-shaped perforated patterns, different from the perforated patterns U3 and U4, which overlap the second segment SG2 and the fourth segment SG4, respectively. In a further embodiment, all U-shaped perforated patterns overlapping the first segment SG1 and the second segment SG2 are of different sizes, and all U-shaped perforated patterns overlapping the third segment SG3 and the fourth segment SG4 are of different sizes.

[0067] The foregoing description briefly outlines the features of certain embodiments of this application, enabling those skilled in the art to more fully understand the various implementations of this application. Those skilled in the art will readily recognize that this application can serve as a basis for designing or modifying other processes and structures to achieve the same objectives and / or advantages as the embodiments described herein. Those skilled in the art should understand that these equivalent implementations remain within the spirit and scope of this application, and various changes, substitutions, and modifications can be made without departing from the spirit and scope of this application.

Claims

1. A dual-frequency conversion circuit structure, characterized in that, Include: A first transmission line having a first input terminal, a first output terminal, and a second output terminal; and A second transmission line has a second input terminal, a third input terminal, a third output terminal, and a fourth output terminal, wherein the second input terminal is coupled to the first output terminal, the third input terminal is coupled to the second output terminal, and A conductive layer, stacked on top of the first transmission line and the second transmission line, includes: A first cutout pattern, wherein the first cutout pattern overlaps with the second transmission line in a top view. The second transmission line includes a second cutout pattern, wherein the second cutout pattern does not overlap with the first cutout pattern in the top view.

2. The dual-frequency conversion circuit structure as described in claim 1, characterized in that, The conductive layer also includes a third cutout pattern, wherein the third cutout pattern overlaps with the second transmission line in the top view and is separate from the first cutout pattern, wherein the first cutout pattern and the third cutout pattern are U-shaped patterns.

3. The dual-frequency conversion circuit structure as described in claim 2, characterized in that, The second transmission line further includes a fourth cutout pattern, wherein the first cutout pattern, the second cutout pattern, the third cutout pattern and the fourth cutout pattern do not overlap in the top view.

4. The dual-frequency conversion circuit structure as described in claim 3, characterized in that, The second and fourth cutout patterns are T-shaped patterns and are not closed cutout patterns.

5. A dual-frequency conversion circuit structure, characterized in that, Include: A first conductive layer; and A second conductive layer includes a first perforated pattern, wherein the second conductive layer is stacked on top of the first conductive layer and separated by a dielectric material. The first conductive layer includes: A balun circuit; A filter circuit includes a transmission line, wherein the transmission line includes a second cutout pattern, wherein the first cutout pattern overlaps with the transmission line in a top view and does not overlap with the second cutout pattern in the top view; and A coplanar stripline, wherein the filter circuit is coupled between the balun circuit and the coplanar stripline.

6. The dual-frequency conversion circuit structure as described in claim 5, characterized in that, The second conductive layer further includes a third cutout pattern, and the transmission line further includes a fourth cutout pattern, wherein the third cutout pattern overlaps with the transmission line in the top view, and the first cutout pattern, the second cutout pattern, the third cutout pattern and the fourth cutout pattern do not overlap with each other in the top view.

7. The dual-frequency conversion circuit structure as described in claim 6, characterized in that, The transmission line has a first segment, a second segment, a third segment, and a fourth segment, wherein the first segment is parallel to the third segment, the second segment is parallel to the fourth segment, and the first segment is perpendicular to the second segment. The first hollowed-out pattern overlaps with the first segment in the top view, and the second hollowed-out pattern is set in the first segment.

8. The dual-frequency conversion circuit structure as described in claim 7, characterized in that, The first cutout pattern is a U-shaped pattern with an opening.

9. The dual-frequency conversion circuit structure as described in claim 5, characterized in that, The second cutout pattern is a T-shaped pattern.

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