Circuit boards and electronic devices

Abstract

Embodiments of the present invention provide a circuit board and an electronic device, relating to the field of electronic device technology. The circuit board includes a first surface and a second surface disposed opposite to each other. The first surface includes a mounting area and a thermally conductive area spaced apart. The mounting area is used to mount electronic devices; the thermally conductive area has a first thermally conductive layer. An internal wiring layer is provided on the circuit board for electrical connection with the electronic devices; the wiring layer is connected to the first thermally conductive layer. The circuit board has a large thermally conductive area and high thermal conductivity, and can transfer heat from inside the circuit board to the surface of the circuit board, improving heat dissipation efficiency and temperature uniformity.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, and more specifically, to a circuit board and an electronic device. Background Technology

[0002] To achieve greater functionality, existing electronic products are integrating an increasing number of chips, resulting in higher chip density and consequently higher power consumption and heat generation. Therefore, the requirements for heat dissipation in electronic products are becoming increasingly stringent.

[0003] Currently, most chip heat dissipation methods involve mounting the chip on a PCB (Printed Circuit Board), which is then mounted on a structural component. Heat from the chip's top surface is transferred to the structural component, and then dissipated into the environment via air cooling or natural heat dissipation. This method addresses the heat dissipation needs of most chips. However, this method has the following drawbacks: if the chip's junction thermal resistance is high, heat from the junction cannot be transferred to the chip's top surface or dissipated through the structural component. A large amount of heat will concentrate on the junction or be transferred to the PCB through solder joints, resulting in locally high temperatures on the PCB and poor overall temperature uniformity. Summary of the Invention

[0004] The present invention aims to provide, for example, a circuit board and an electronic device that can improve the temperature uniformity of the circuit board and increase heat dissipation efficiency.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] In a first aspect, the present invention provides a circuit board, the circuit board including a first surface and a second surface disposed opposite to each other, the first surface including a mounting area and a thermally conductive area disposed at intervals, the mounting area being used to mount electronic devices; the thermally conductive area being provided with a first thermally conductive layer;

[0007] The circuit board has an internal circuit layer for electrical connection with the electronic device; the circuit layer is connected to the first thermal conductive layer.

[0008] In an optional embodiment, a second thermally conductive layer is provided at the edges of both the first surface and the second surface.

[0009] In an optional embodiment, the second thermally conductive layer is electrically connected to the circuit layer, and / or the first thermally conductive layer is connected to the second thermally conductive layer of the first surface.

[0010] In an optional embodiment, the circuit board includes a substrate, in which the circuit layer and a third thermally conductive layer are provided, the third thermally conductive layer and the circuit layer are connected, and the third thermally conductive layer is connected to the first thermally conductive layer and / or the second thermally conductive layer respectively.

[0011] In an optional embodiment, the first thermally conductive layer, the second thermally conductive layer, and the third thermally conductive layer are each made of copper.

[0012] In an optional embodiment, the circuit layer is connected to the first thermally conductive layer via a via, and / or the circuit layer is connected to the second thermally conductive layer via a via.

[0013] In an optional embodiment, a heat sink is attached to the second surface.

[0014] In a second aspect, the present invention provides an electronic device, including a structural component, electronic devices, and a circuit board as described in any of the foregoing embodiments, wherein the electronic devices are mounted on the circuit board, the circuit board is mounted on the structural component, and a first thermally conductive layer is in contact with the structural component.

[0015] In an optional embodiment, an interface layer is further included, which is disposed between the electronic device and the structural component.

[0016] In an optional embodiment, the structural component is provided with a boss, which is respectively disposed opposite to the first thermally conductive layer and the second thermally conductive layer of the first surface. When the circuit board and the structural component are connected, the boss abuts against the first thermally conductive layer and the second thermally conductive layer respectively.

[0017] In an optional embodiment, a fan and a baffle plate are also included, the fan and the baffle plate being located on the side of the structure away from the circuit board.

[0018] The beneficial effects of the embodiments of the present invention include, for example:

[0019] The circuit board provided in this embodiment of the invention has a first thermally conductive layer on its first surface, which increases the surface heat dissipation area and improves heat transfer efficiency. The first thermally conductive layer is connected to the internal circuit layer, which can conduct internal heat to the surface for heat dissipation. The high thermal conductivity effectively ensures the temperature uniformity of the entire circuit board.

[0020] The electronic device provided in this embodiment of the invention includes the circuit board described above. Electronic devices are mounted on the circuit board, and the circuit board is mounted on a structural component. The heat generated by the electronic devices can be transferred to the structural component through the circuit board, which facilitates rapid heat dissipation of the electronic devices, ensures the temperature uniformity of the entire circuit board, and meets the heat dissipation requirements of the electronic device during operation. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A first-view structural schematic diagram of a circuit board mounting electronic device provided in an embodiment of the present invention;

[0023] Figure 2 A second-view structural schematic diagram of a circuit board mounting electronic device provided in an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the second surface of the circuit board provided in an embodiment of the present invention;

[0025] Figure 4 A first-view structural schematic diagram of an electronic device provided in an embodiment of the present invention;

[0026] Figure 5 for Figure 4 Cross-sectional structure of AA;

[0027] Figure 6 This is a schematic diagram of a structural component of an electronic device provided in an embodiment of the present invention.

[0028] Icons: 100 - Circuit board; 110 - First surface; 111 - Thermal conductive area; 120 - Second surface; 121 - Heat sink; 130 - First thermal conductive layer; 140 - Second thermal conductive layer; 150 - First mounting hole; 200 - Electronic equipment; 210 - Structural component; 211 - Boss; 213 - Second mounting hole; 215 - Fastener; 220 - Electronic device; 230 - Interface layer; 240 - Fan; 250 - Baffle. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0031] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0032] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0033] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0034] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.

[0035] Please refer to Figures 1 to 3 This embodiment provides a circuit board 100 for mounting chips or other electronic devices 220. The circuit board 100 facilitates heat dissipation from the chips or other electronic devices 220, improves heat dissipation efficiency, and ensures good temperature uniformity throughout the entire circuit board 100.

[0036] The circuit board 100 includes a first surface 110 and a second surface 120 disposed opposite to each other. The first surface 110 includes a mounting area and a thermally conductive area 111 disposed at intervals. The mounting area is used to mount electronic devices 220. The thermally conductive area 111 is provided with a first thermally conductive layer 130. The first thermally conductive layer 130 facilitates the transfer of heat from inside the circuit board 100 to the surface of the circuit board 100, resulting in higher thermal conductivity. It is understood that the circuit board 100 has an internal wiring layer for electrical connection with the electronic devices 220. The wiring layer is connected to the first thermally conductive layer 130, which can conduct heat from inside the circuit board 100 to the surface of the circuit board 100, thereby improving heat dissipation efficiency.

[0037] In this embodiment, the electronic device 220 is described using a chip as an example. The chip is mounted on the mounting area of ​​the circuit board 100. It can be understood that multiple chips are mounted on a single circuit board 100 simultaneously, i.e., multiple mounting areas are provided, spaced apart, and each mounting area mounts one or more chips. Optionally, one chip is mounted in one mounting area. A heat-conducting area 111 is formed at the intervals between the multiple mounting areas. In this way, a large area of ​​heat-conducting area 111 is formed on the first surface 110 of the circuit board 100, which can effectively improve the heat dissipation area and heat dissipation efficiency, ensuring good temperature uniformity of the circuit board 100 as a whole.

[0038] It is understandable that the shape and number of heat-conducting zones 111 can be flexibly set according to actual conditions, such as... Figure 1 There are multiple heat-conducting areas 111, each roughly arranged in a cross shape. Optionally, the multiple cross-shaped heat-conducting areas 111 can be interconnected or spaced apart. Of course, it is not limited to this; the heat-conducting areas 111 can also be arranged in a straight line along the length or width of the circuit board 100. Alternatively, they can be distributed in a grid pattern along different directions, without specific limitations. The heat-conducting areas 111 can partially or completely form the first heat-conducting layer 130, that is, the first heat-conducting layer 130 can be square, circular, elliptical, or other arbitrary shapes.

[0039] Optionally, the circuit board 100 is rectangular, and a second thermally conductive layer 140 is provided at the edges of the first surface 110 and the edges of the second surface 120 of the circuit board 100. That is, the second thermally conductive layer 140 is provided at all four edges of the circuit board 100. In this embodiment, both the first thermally conductive layer 130 and the second thermally conductive layer 140 are made of copper, for example, by electroplating a copper layer onto the surface of the circuit board 100. Copper has a relatively high thermal conductivity, which can quickly and effectively transfer heat to the entire circuit board 100, preventing a large temperature difference across the entire circuit board 100 due to high local chip power consumption, thereby reducing the temperature difference across the entire circuit board 100 and ensuring the temperature uniformity of the entire circuit board 100. Of course, in other embodiments, the first thermally conductive layer 130 and the second thermally conductive layer 140 can also achieve heat dissipation by attaching thermally conductive sheets or applying thermally conductive coatings, etc., which are not specifically limited here.

[0040] It should be noted that the surface of the existing circuit board 100 is mostly covered with a green paint layer. The green paint layer can be replaced with a copper layer as the first thermal conductive layer 130 to improve the thermal conductivity of the circuit board 100.

[0041] Optionally, the first thermally conductive layer 130 and the second thermally conductive layer 140 of the first surface 110 are connected. In this embodiment, the first thermally conductive layer 130 is a cross-shaped copper layer, and the second thermally conductive layer 140 is a copper layer disposed at the edge of the circuit board 100. The cross-shaped copper layer and the copper layer at the edge of the circuit board 100 can be interconnected to increase the heat dissipation area. Of course, the first thermally conductive layer 130 and the second thermally conductive layer 140 of the first surface 110 can also be disposed alternately, which is not specifically limited here.

[0042] The second thermally conductive layer 140 is electrically connected to the circuit layer, and / or the first thermally conductive layer 130 is connected to the second thermally conductive layer 140 of the first surface 110. In this embodiment, the circuit board 100 has an internal circuit layer made of copper, and the circuit layer is connected to the first thermally conductive layer 130 vias. That is, the internal circuit layer of the circuit board 100 and the surface first thermally conductive layer 130 are electrically connected. With this configuration, the heat generated when the chip is working is transferred to the internal circuit layer through the solder joints between the chip and the circuit board 100, and then transferred from the internal circuit layer to the surface first thermally conductive layer 130 for heat dissipation. This not only facilitates the conduction and heat dissipation of the surface of the circuit board 100, but also facilitates the conduction of heat from inside the circuit board 100 to the surface, improving heat dissipation efficiency. Furthermore, it helps to achieve temperature uniformity across the entire circuit board 100, preventing localized overheating.

[0043] Similarly, the circuit layer and the second thermally conductive layer 140 are connected via vias. Heat inside the circuit board 100 can be transferred to the surface of the second thermally conductive layer 140 through the vias, and then dissipated by the second thermally conductive layer 140. It can be understood that if the first thermally conductive layer 130 and the second thermally conductive layer 140 are connected, then at least one of the first thermally conductive layer 130 and the second thermally conductive layer 140 can be connected to the internal circuit layer.

[0044] In some embodiments, the second thermally conductive layer 140 of the first surface 110 and the thermally conductive layer of the second surface 120 can also be connected by vias, which facilitates the conduction of heat from the circuit board 100 to the two surfaces, thereby improving heat dissipation efficiency and temperature uniformity.

[0045] Optionally, the circuit board 100 includes a substrate, in which a circuit layer and a third thermally conductive layer are provided. The third thermally conductive layer is connected to the circuit layer, and is connected to the first thermally conductive layer 130 and / or the second thermally conductive layer 140 respectively. The third thermally conductive layer is made of copper, that is, a copper layer is laid in the area of ​​the substrate where no circuit layer is provided, increasing the proportion of copper in the circuit board 100. This helps to improve the overall thermal conductivity of the circuit board 100, accelerates the heat dissipation of the circuit board 100, and improves the temperature uniformity of the entire circuit board 100. It can be understood that the third thermally conductive layer is connected to the first thermally conductive layer 130 and the second thermally conductive layer 140 respectively, so as to conduct heat inside the circuit board 100 to the surface. The third thermally conductive layer can be directly connected to the first thermally conductive layer 130 or the second thermally conductive layer 140 through vias, or it can be connected to the first thermally conductive layer 130 or the second thermally conductive layer 140 through internal circuit layers.

[0046] It should be noted that in this embodiment, the circuit layer, the first thermal conductive layer 130, the second thermal conductive layer 140 and the third thermal conductive layer are all made of copper, which has the same material and high thermal conductivity, which is beneficial to improving the thermal conductivity of the circuit board 100 and achieving the overall temperature uniformity of the circuit board 100.

[0047] Optionally, a heat sink 121 is attached to the second surface 120 of the circuit board 100. In this embodiment, the heat sink 121 is a radial patch, which can quickly conduct heat from the second surface 120 of the circuit board 100 to the air. The shape and size of the heat sink 121 can be flexibly set according to actual conditions. In this embodiment, there are multiple heat sinks 121, arranged in a matrix of multiple rows and columns, or arranged in a ring array, or the heat sink 121 is integrally attached to the second surface 120. No specific limitation is made here. The heat sink 121 can be square, rhomboid, triangular, circular, elliptical, or any polygon.

[0048] Combination Figures 4 to 6 An electronic device 200 provided in this embodiment of the invention includes a structural component 210, an electronic device 220, and the aforementioned circuit board 100. The electronic device 220 is mounted on the circuit board 100, and the circuit board 100 is mounted on the structural component 210. The electronic device 220 is located between the circuit board 100 and the structural component 210 so that the heat from the electronic device 220 and the heat from the circuit board 100 can be quickly conducted to the structural component 210.

[0049] Optionally, the circuit board 100 has a first mounting hole 150 on its edge, and the structural component 210 has a second mounting hole 213 opposite to the first mounting hole 150. Fasteners such as screws 215 can pass through the first mounting hole 150 and the second mounting hole 213 to achieve a fixed connection between the circuit board 100 and the structural component 210. Of course, the circuit board 100 and the structural component 210 can also be connected by snap-fit, adhesive, riveting, or other bonding methods; no specific limitations are made here.

[0050] It is easy to understand that the structural component 210 is provided with a boss 211, which is respectively disposed opposite to the first thermally conductive layer 130 and the second thermally conductive layer 140 of the first surface 110. When the circuit board 100 and the structural component 210 are connected, the first thermally conductive layer 130 and the second thermally conductive layer 140 abut against the boss 211 on the structural component 210. That is, the first thermally conductive layer 130 contacts the boss 211, and the second thermally conductive layer 140 contacts the boss 211. In this way, the contact area between the circuit board 100 and the structural component 210 can be increased, which is beneficial for transferring the heat of the circuit board 100 to the structural component 210. The heat dissipation area is large and the heat dissipation efficiency is high, which is conducive to the rapid cooling of the circuit board 100 and the reduction of the overall temperature difference of the circuit board 100.

[0051] Optionally, the electronic device 200 further includes an interface layer 230 disposed between the chip and the structural component 210. Heat from the top surface of the chip is transferred to the structural component 210 through the interface layer 230. The top surface of the chip refers to the surface of the chip away from the circuit board 100. The interface layer 230 can be made of an interface material, such as a thermal pad, thermal adhesive, or thermal paste, which facilitates the transfer of heat from the chip to the structural component 210, resulting in high heat transfer efficiency. Of course, in some embodiments, the interface layer 230 can also be disposed between the first thermally conductive layer 130 and the boss 211, or between the second thermally conductive layer 140 and the boss 211; no specific limitation is made here.

[0052] In this embodiment, the electronic device 200 further includes a fan 240 and a baffle plate 250, which are located on the side of the structural component 210 away from the circuit board 100. The fan 240 drives the airflow around the structural component 210, accelerating the dissipation of heat from the structural component 210 into the air and improving the heat exchange efficiency between the structural component 210 and the air. The baffle plate 250 limits the direction of the airflow from the fan 240 to achieve air cooling of the entire structural component 210 and improve heat dissipation efficiency. Optionally, the structural component 210 may have multiple heat dissipation slots or through holes, which can accelerate the cooling of the structural component 210, improve heat dissipation efficiency, and at the same time, help reduce the weight of the entire structural component 210.

[0053] The heat dissipation working principle of the circuit board 100 and electronic device 200 provided in this embodiment is as follows:

[0054] When the chip operates, it generates heat. Part of this heat is transferred through the interface layer 230 to the structural component 210 for heat dissipation. Another part of the heat is transferred through the solder joint between the chip and the circuit board 100 to the internal circuit layer, and then conducted from the internal circuit layer to the first thermally conductive layer 130 and the second thermally conductive layer 140 on the surface. The heat on the surface of the circuit board 100 is then conducted through the first thermally conductive layer 130 and the second thermally conductive layer 140 to the structural component 210 for heat dissipation. A third thermally conductive layer is also laid inside the circuit board 100, which facilitates rapid heat transfer from the inside of the circuit board 100 to the surface of the circuit board 100, improving the overall thermal conductivity of the circuit board 100. The structural component 210 is air-cooled by a fan 240, accelerating heat exchange between the structural component 210 and the surrounding air, thereby achieving rapid heat dissipation of the chip and ensuring good temperature uniformity of the entire circuit board 100. This circuit board 100 can also achieve good heat dissipation for chips with high junction-case thermal resistance, meeting their heat dissipation requirements during operation.

[0055] In summary, the embodiments of the present invention provide a circuit board 100 and an electronic device 200, which have the following beneficial effects:

[0056] The surface of the circuit board 100 is provided with a first thermally conductive layer 130 and a second thermally conductive layer 140, i.e., it has a large area of ​​copper layer, resulting in high thermal conductivity. Furthermore, the first thermally conductive layer 130 and the internal circuitry layer of the circuit board 100 are connected by vias, which facilitates the conduction of heat from inside the circuit board 100 to its surface, thereby improving heat dissipation efficiency and ensuring good temperature uniformity of the entire circuit board 100. In addition, a large area of ​​copper layer is also laid inside the circuit board 100 in areas where no circuitry layer is located, serving as a third thermally conductive layer. This further facilitates the conduction of heat from inside the circuit board 100 to its surface, improving the overall thermal conductivity of the circuit board 100 and ensuring overall temperature uniformity.

[0057] The electronic device 200 includes the aforementioned circuit board 100, which can not only improve the heat dissipation efficiency of ordinary chips, but also improve the heat dissipation efficiency of chips with high junction thermal resistance, thus improving the heat dissipation performance of the electronic device 200.

[0058] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A circuit board, characterized in that, The circuit board includes a first surface and a second surface disposed opposite to each other. The first surface includes a mounting area and a thermally conductive area disposed at intervals. The mounting area is used to mount electronic devices. The thermally conductive area is formed at the intervals of the plurality of mounting areas. The thermally conductive area is provided with a first thermally conductive layer. The circuit board has a circuit layer and a third thermal conductive layer inside. The circuit layer is used for electrical connection with the electronic device. The third thermal conductive layer is located in the area of ​​the circuit board where the circuit layer is not located. A second thermally conductive layer is provided at the edges of both the first surface and the second surface; the first thermally conductive layer and the second thermally conductive layer are connected. At least one of the first thermally conductive layer and the second thermally conductive layer is connected to the third thermally conductive layer; The circuit layer is connected to the first thermally conductive layer.

2. The circuit board according to claim 1, characterized in that, The first thermally conductive layer is connected to the second thermally conductive layer of the first surface.

3. The circuit board according to claim 1, characterized in that, The second thermally conductive layer is electrically connected to the circuit layer.

4. The circuit board according to claim 1, characterized in that, The circuit board includes a substrate, in which the circuit layer and the third thermal conductive layer are provided, and the third thermal conductive layer and the circuit layer are connected.

5. The circuit board according to claim 1, characterized in that, The first thermally conductive layer, the second thermally conductive layer, and the third thermally conductive layer are all made of copper.

6. The circuit board according to claim 1, characterized in that, The circuit layer is connected to the first thermally conductive layer via a via, and / or the circuit layer is connected to the second thermally conductive layer via a via.

7. The circuit board according to any one of claims 1 to 6, characterized in that, The second surface is covered with a heat sink.

8. An electronic device, characterized in that, It includes a structural component, electronic devices, and a circuit board as described in any one of claims 1 to 7, wherein the electronic devices are mounted on the circuit board, the circuit board is mounted on the structural component, and the first thermally conductive layer is in contact with the structural component.

9. The electronic device according to claim 8, characterized in that, It also includes an interface layer, which is disposed between the electronic device and the structural component.

10. The electronic device according to claim 8, characterized in that, The structural component is provided with a boss, which is respectively disposed opposite to the first thermal conductive layer and the second thermal conductive layer of the first surface. When the circuit board and the structural component are connected, the boss abuts against the first thermal conductive layer and the second thermal conductive layer respectively.

11. The electronic device according to claim 8, characterized in that, It also includes a fan and a baffle plate, which are located on the side of the structure away from the circuit board.

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