Porous polyurethane polishing pad and method for preparing semiconductor device using the same

Abstract

The present invention relates to the technical field of auxiliary facilities for preparing semiconductor equipment, and in particular to a porous polyurethane polishing pad and a method for preparing semiconductor devices therefrom. The surface of the small polishing pad is fixedly connected to a column, the surface of the column is sleeved with a spring, the column is inserted into the interior of a docking port, the docking port is provided on the surface of a holding box, and the surface of the holding box is provided with a positioning hole. The present invention uses the column to push the small polishing pad to move, a slide rod drives a rotating seat to pull a limiting clamp to mechanically clamp and fix the position of the column, and then a positioning rod is inserted into the interior of the positioning hole to fix the position of the slide rod, thereby achieving flexible control of the entire device, enhancing the practical performance of the entire device, and improving the effect of existing polishing pads that cannot be adjusted according to needs when polishing semiconductor workpieces, and require preparing multiple polishing pads of different sizes for backup.

Description

Technical Field

[0001] The invention relates to the technical field of auxiliary facilities for preparing semiconductor equipment, in particular to a porous polyurethane polishing pad and a method for preparing a semiconductor device therefrom. Background Art

[0002] Polishing refers to a processing method that uses mechanical, chemical or electrochemical effects to reduce the surface roughness of a workpiece to obtain a bright and smooth surface. It is a modification process on the workpiece surface using polishing tools and abrasive particles or other polishing media. Polishing pads are also called polishing leather, polishing cloth, polishing sheet, and are important auxiliary materials that determine the surface quality in chemical mechanical polishing. They can be divided into abrasive polishing pads and non-abrasive polishing pads according to whether they contain abrasives; they can be divided into polyurethane polishing pads, non-woven polishing pads and composite polishing pads according to different materials; they can be roughly divided into flat type, grid type and spiral type according to different surface structures;

[0003] During the use of existing polishing pads, when grinding different parts of the workpiece, in some cases the size of the polishing pad will be larger than the diameter that can be accommodated by a certain part of the workpiece, which will lead to the need to prepare additional polishing pads of different sizes as spares, thereby increasing the company's production costs. Summary of the Invention

[0004] The purpose of the present invention is to address the deficiencies of the prior art and provide a porous polyurethane polishing pad and a method for preparing a semiconductor device therefrom, so as to solve the problems raised in the background art.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a porous polyurethane polishing pad, comprising a large polishing pad, a small polishing pad being movably connected to the interior of the large polishing pad, a column being fixedly connected to the surface of the small polishing pad, a spring being sleeved on the surface of the column, the column being inserted into the interior of a docking interface, the docking interface being provided on the surface of a holding box, a positioning hole being provided on the surface of the holding box, a slide groove being provided on the surface of the holding box, a sliding rod being inserted into the interior of the slide groove, a socket being provided on the surface of the sliding rod, a positioning rod being inserted into the interior of the socket, the end of the sliding rod being fixedly connected to a rotating seat, the rotating seat being rotatably connected to the surface of a chassis, the surface of the chassis being fixedly connected to a limiting seat, the interior of the limiting seat being fixedly connected to a bearing, and the surface of the bearing being fixedly connected to a limiting clamp.

[0006] As a preferred technical solution of the present invention, the outer wall of the outer ring of the bearing is fixedly connected to the inside of the upper surface of the limit seat, and the inner wall of the bearing is fixedly connected to the surface end of the end fixed shaft of the limit clamp, which maximizes the control ability of the overall device and ensures the practicality of the overall device.

[0007] As a preferred technical solution of the present invention, the number of the limit seats and the limit clamps is equal, and the end of the limit clamp extends close to the center position of the circle inside the surface of the chassis, which effectively enhances the stability of each component and strengthens the support strength of the entire device.

[0008] As a preferred technical solution of the present invention, one end of the sliding rod extends out of the outer surface of the holding box through a sliding groove, and the other end is fixedly connected to the middle position of the surface of the rotating seat, which better protects the use of the entire device from being affected and enhances the practicality of operating the entire device.

[0009] As a preferred technical solution of the present invention, one end of the spring is installed on the lower surface of the top of the column, and the other end is installed at the center of the upper surface of the holding box. At the same time, the spring and the docking interface are on the same vertical line, which better enhances the balance of the overall device and effectively enhances the flexibility of use of the overall device.

[0010] As a preferred technical solution of the present invention, the small polishing pad is equal to the height of the large polishing pad. At the same time, the center of the upper surface of the small polishing pad is located at the end center of the column and is connected in a fixed manner, which further enhances the operability of the overall device and ensures its firmness and stability during use.

[0011] As a preferred technical solution of the present invention, the appearance of the rotating seat is in the shape of an "I", and the surface of the column is inserted into the inside of the center surface of the chassis, which maximizes the staff's control over the entire device, improves the experience of using the entire device, and reduces the difficulty of operating the seat for the staff.

[0012] As a preferred technical solution of the present invention, the diameter of the large polishing pad is smaller than the caliber of the holding box, and the diameter of the small polishing pad is smaller than the diameter of the large polishing pad. The kinetic energy of this part of the structure during operation is used more clearly and intuitively to connect the operation of the entire device in series, thereby enhancing the activity of the entire device.

[0013] As a preferred technical solution of the present invention, the positioning rod is installed on the left surface of the end of the sliding rod, and the diameter of the positioning rod is smaller than the diameter of the positioning hole, which effectively enhances the practical performance of the overall device and expands the dynamism of the overall device.

[0014] A porous polyurethane polishing pad and a method for preparing a semiconductor device thereof are as follows:

[0015] S1. When in use, the staff first needs to hold the handheld box to polish the surface of the semiconductor device. During the polishing process, when it is necessary to polish a smaller part of the workpiece, the staff only needs to manually press the column downward to extend the small polishing pad outward, thereby correcting the defect of the large polishing pad;

[0016] S2. When the staff presses the column downward, the top of the column compresses the spring, pushing the small polishing pad out of the inner surface of the large polishing pad. Then the staff only needs to manually slide the slide rod in the slide groove to fix the extended length of the small polishing pad;

[0017] S3. Since the end of the slide rod is mounted on the surface of the chassis, when the slide rod is moved, it drives the rotating seat to rotate on the upper surface of the chassis. The rotation of the rotating seat pushes the end of the limit clamp to move inside the center of the rotating seat, thereby clamping and fixing the surface of the column.

[0018] S4. The staff then manually pulls the positioning rod inside the socket so that the inner surface of the positioning rod is inserted into the interior of the positioning hole, and then fixes the position of the sliding rod to avoid the situation of clamping and slipping during use.

[0019] The present invention has the following beneficial effects:

[0020] The porous polyurethane polishing pad and the method for preparing semiconductor devices thereof have the advantages that the small polishing pad is pushed to move by a column, the sliding rod drives the rotating seat to pull the limiting clamp to mechanically clamp and fix the position of the column, and the positioning rod is inserted into the interior of the positioning hole to fix the position of the sliding rod, thereby achieving flexible control of the entire device, enhancing the practical performance of the entire device, and improving the effect that the size of the existing polishing pad cannot be adjusted according to needs when grinding semiconductor workpieces, and multiple polishing pads of different sizes need to be prepared for backup. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall box holding structure of the present invention;

[0022] Figure 2 For the present invention Figure 1 A schematic diagram of the structure at center A;

[0023] Figure 3 This is a schematic diagram of the column structure of the present invention;

[0024] Figure 4 This is a schematic diagram of the rotating seat structure of the present invention;

[0025] Figure 5 This is a schematic diagram of the bottom surface of the limiting clamp structure of the present invention;

[0026] Figure 6 This is a schematic diagram of the end of the sliding rod structure of the present invention.

[0027] In the figure: 1. Large polishing pad; 2. Small polishing pad; 3. Column; 4. Spring; 5. Docking port; 6. Holding box; 7. Positioning hole; 8. Slide groove; 9. Slide rod; 10. Socket; 11. Positioning rod; 12. Rotating seat; 13. Chassis; 14. Limit seat; 15. Limit fixture; 16. Bearing. DETAILED DESCRIPTION

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] See also Figure 1 In this embodiment: the porous polyurethane polishing pad includes a large polishing pad 1, which is movably connected to the small polishing pad 2 inside the large polishing pad 1, thereby enhancing the controllability of the overall device; the surface of the small polishing pad 2 is fixedly connected to a column 3, thereby enhancing the stability of each component; the surface of the column 3 is sleeved with a spring 4, thereby enhancing the flexibility of the overall device; the column 3 is inserted into the inside of the docking interface 5, thereby enhancing the use effect of the overall device; the docking interface 5 is opened on the surface of the holding box 6, thereby protecting the use of the overall device from being affected; a positioning hole 7 is opened on the surface of the holding box 6, thereby enhancing the balance of the overall device; a slide groove 8 is opened on the surface of the holding box 6, thereby enhancing the operability of the overall device; a slide rod 9 is inserted into the inside of the slide groove 8, thereby increasing the staff Regarding the controllability of the overall device, a socket 10 is provided on the surface of the slide rod 9, which enhances the practical performance of the overall device. A positioning rod 11 is inserted into the inside of the socket 10, which stabilizes the position and angle range of all structures when they operate together. The end of the slide rod 9 is fixedly connected to a rotating seat 12, which enhances the mechanical potential energy of the overall device during operation. The rotating seat 12 is rotatably connected to the surface of the chassis 13, which enhances the flexibility of the overall device. The surface of the chassis 13 is fixedly connected to a limiting seat 14, which enhances the coordination performance of the overall device during use. The inside of the limiting seat 14 is fixedly connected to a bearing 16, which enhances the fitting strength of the overall device during use. The surface of the bearing 16 is fixedly connected to a limiting clamp 15, which increases the convenience of use.

[0030] In this embodiment, the outer ring outer wall of the bearing 16 is fixedly connected to the inner surface of the upper surface of the limit seat 14, and the inner inner wall of the bearing 16 is fixedly connected to the surface end of the fixed shaft of the end of the limit clamp 15. Through the matching of the entire device during use, the various components of the entire device are run-in, and the coordination of the use of the entire device is enhanced; the number of the limit seat 14 and the limit clamp 15 is equal, and the end of the limit clamp 15 extends close to the center position of the inner surface of the chassis 13, which greatly enhances the matching strength of the entire device during use and avoids the asymmetric matching of components of the entire device during use; one end of the slide rod 9 extends out of the outer surface of the holding box 6 through the slide groove 8, and the other end is fixedly connected to the middle position of the surface of the rotating seat 12, and according to the existing structure, they jointly support the entire device, enhance the coordination performance of the entire device during use, and enhance the durability of the entire device during use; one end of the spring 4 is installed on the lower surface of the top of the column 3, and the other end is installed at the center of the upper surface of the holding box 6. At the same time, the spring 4 and the docking interface 5 are on the same vertical line, with the help of flexible control of the entire device The force is strengthened, thereby reducing the probability of failure of the entire device during use; the small polishing pad 2 is equal to the height of the large polishing pad 1, and the center of the upper surface of the small polishing pad 2 is located at the center of the end of the column 3 and is fixedly connected, which better enhances the flexibility of the entire device and ensures that it can still be used normally when it is disassembled and reinstalled; the appearance of the rotating seat 12 is in the shape of an "I", and the surface of the column 3 is inserted into the inner center surface of the chassis 13. These structures are used to perform mechanical movement together, thereby ensuring that the entire device minimizes possible failures during operation; the diameter of the large polishing pad 1 is smaller than the diameter of the holding box 6, and the diameter of the small polishing pad 2 is smaller than the diameter of the large polishing pad 1, which more effectively strengthens the mechanical potential energy of the entire device during operation and saves the force loss generated by the entire device during operation; the positioning rod 11 is installed on the left surface of the end of the sliding rod 9, and the diameter of the positioning rod 11 is smaller than the diameter of the positioning hole 7, strictly and clearly stabilizing the position and angle range of all structures when they operate together, avoiding mutual obstruction of the entire device during operation.

[0031] Implementation column 1:

[0032] A porous polyurethane polishing pad and a method for preparing a semiconductor device thereof are as follows:

[0033] S1. When in use, the operator first needs to hold the handheld box 6 to polish the surface of the semiconductor device. During the polishing process, when it is necessary to polish a smaller part of the workpiece, the operator only needs to manually press the column 3 downward to extend the small polishing pad 2 outward, thereby correcting the defect of the large polishing pad 1;

[0034] S2. When the staff presses the column 3 downward, the top of the column 3 compresses the spring 4, pushing the small polishing pad 2 out of the inner surface of the large polishing pad 1. Then the staff only needs to manually slide the slide rod 9 in the slide groove 8 to fix the extended length of the small polishing pad 2;

[0035] S3. Since the end of the slide bar 9 is mounted on the surface of the chassis 13, when the slide bar 9 is moved, the rotating seat 12 is driven to rotate on the upper surface of the chassis 13. The rotation of the rotating seat 12 pushes the end of the limiting clamp 15 to move inside the center of the rotating seat 12, thereby clamping and fixing the surface of the column 3.

[0036] S4. The staff then manually pulls the positioning rod 11 inside the socket 10 so that the inner surface of the positioning rod 11 is inserted into the positioning hole 7, and then fixes the position of the slide rod 9 to avoid the situation of clamping and slipping during use.

[0037] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A porous polyurethane polishing pad, comprising a large polishing pad (1), characterized in that: The large polishing pad (1) is movably connected to the small polishing pad (2) on its interior, the small polishing pad (2) is fixedly connected to the surface of the column (3), the surface of the column (3) is sleeved with a spring (4), the column (3) is inserted into the interior of the docking port (5), the docking port (5) is provided on the surface of the holding box (6), the surface of the holding box (6) is provided with a positioning hole (7), the surface of the holding box (6) is provided with a slide groove (8), the interior of the slide groove (8) is inserted with a slide rod ( 9), a socket (10) is provided on the surface of the slide rod (9), a positioning rod (11) is inserted into the interior of the socket (10), the end of the slide rod (9) is fixedly connected to a rotating seat (12), the rotating seat (12) is rotatably connected to the surface of the chassis (13), the surface of the chassis (13) is fixedly connected to a limiting seat (14), the interior of the limiting seat (14) is fixedly connected to a bearing (16), and the surface of the bearing (16) is fixedly connected to a limiting clamp (15).

2. The porous polyurethane polishing pad according to claim 1, characterized in that: The outer ring outer wall of the bearing (16) is fixedly connected to the inside of the upper surface of the limiting seat (14), and the inner wall of the bearing (16) is fixedly connected to the surface end of the end fixing shaft of the limiting clamp (15).

3. The porous polyurethane polishing pad according to claim 1, wherein: The number of the limiting seats (14) is equal to that of the limiting clamps (15), and the ends of the limiting clamps (15) extend close to the center of the circle inside the surface of the chassis (13).

4. The porous polyurethane polishing pad according to claim 1, wherein: One end of the slide rod (9) extends out of the outer surface of the holding box (6) through the slide groove (8), and the other end is fixedly connected to the middle position of the surface of the rotating base (12).

5. The porous polyurethane polishing pad according to claim 1, wherein: One end of the spring (4) is mounted on the lower surface of the top end of the column (3), and the other end is mounted at the center of the upper surface of the holding box (6). At the same time, the spring (4) and the docking port (5) are both on the same vertical line.

6. The porous polyurethane polishing pad according to claim 1, wherein: The small polishing pad (2) has the same height as the large polishing pad (1), and the center of the upper surface of the small polishing pad (2) is located at the end center of the column (3) and is connected in a fixed manner.

7. The porous polyurethane polishing pad according to claim 1, wherein: The rotating seat (12) has an appearance of an "I" shape, and the surface of the column (3) is inserted into the inner center surface of the chassis (13).

8. The porous polyurethane polishing pad according to claim 1, wherein: The diameter of the large polishing pad (1) is smaller than the diameter of the holding box (6), and the diameter of the small polishing pad (2) is smaller than the diameter of the large polishing pad (1).

9. The porous polyurethane polishing pad according to claim 1, wherein: The positioning rod (11) is installed on the left side surface of the end of the sliding rod (9), and the diameter of the positioning rod (11) is smaller than the diameter of the positioning hole (7).

10. The porous polyurethane polishing pad and the method for preparing a semiconductor device therefrom according to claim 1, wherein: S1. When in use, a worker first needs to hold the holding box (6) to polish the surface of the semiconductor device. During the polishing process, when a smaller part of the workpiece needs to be polished, the worker only needs to manually press the column (3) downward to extend the small polishing pad (2) outward, thereby changing the larger size of the large polishing pad (1); S2. When the staff presses the column (3) downward, the top of the column (3) presses the spring (4), pushing the small polishing pad (2) out of the inner surface of the large polishing pad (1). Then, the staff only needs to manually slide the slide rod (9) in the slide groove (8) to fix the extended length of the small polishing pad (2); S3. Since the end of the slide bar (9) is mounted on the surface of the chassis (13), when the slide bar (9) is moved, the rotating seat (12) is driven to rotate and connect on the upper surface of the chassis (13), and the rotation of the rotating seat (12) pushes the end of the limiting clamp (15) to move inside the center of the rotating seat (12), thereby clamping and fixing the surface of the column (3); S4. The staff then manually pulls the positioning rod (11) inside the socket (10) so that the inner surface of the positioning rod (11) is inserted into the interior of the positioning hole (7), and then fixes the position of the slide rod (9) to avoid the situation of clamping and slipping during use.

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