Method for the production of a skin-wood based electronic sensing floor

Abstract

The application discloses a preparation method of a leather-wood-based electronic sensing floor, and specifically comprises the following steps: mixing gelatin and deionized water, adding KH570, adjusting pH with hydrochloric acid to obtain modified gelatin; adding chitosan to an FeCl3 aqueous solution to obtain a chitosan-iron complex; dissolving the modified gelatin in water, mixing the modified gelatin with the chitosan-iron complex, and adding MXene for ultrasonic dispersion; adding polyethylene glycol diacrylate and ammonium persulfate to obtain a sensing adhesive layer precursor solution; hollowing the inside of a silica gel pad, placing the silica gel pad between a leather and a wood board, placing two copper wires on the two sides of the silica gel pad, injecting the sensing adhesive layer precursor solution into the inside of the silica gel pad, clamping the leather and the wood board, heating and polymerizing, taking out the silica gel pad, and obtaining the leather-wood-based electronic sensing floor. The electronic sensing floor prepared by the application has excellent stability, durability, strain and pressure sensing properties; in addition, the preparation method has simple preparation process, simple operation process and mild conditions.

Description

Technical Field

[0001] This invention belongs to the field of sensor material preparation technology, specifically relating to a method for preparing a leather-wood based electronic sensor floor. Background Technology

[0002] The fabrication of resistive pressure sensing floors often involves coating a conductive material onto a substrate. This coating method requires additional curing agents and organic solvents, is complex, and has poor environmental friendliness. Furthermore, uneven distribution of the conductive material hinders the construction of conductive pathways within the sensor, affecting the sensitivity, response range, and stability of the smart electronic floor. Therefore, achieving large-scale fabrication of low-cost, high-sensitivity, and durable electronic floors through the selection of sensing layer materials and structural design remains a significant challenge.

[0003] Gelatin, a collagen protein widely found in animal skin, tendons, and bones, is a product of partial hydrolysis of collagen. Its molecular chains contain numerous active functional groups, exhibiting advantages such as water solubility and reversible gelation, making it an excellent biomaterial for constructing hydrogel adhesives. The conductive active layer in electronic flooring needs to adhere tightly to the substrate surface to function effectively. Furthermore, the conductive active layer of electronic flooring needs to withstand damage under complex stress environments, thus self-healing properties are crucial. Hydrogel adhesives prepared with gelatin as a matrix interact with the surface of the adhered substrate through covalent bonds, hydrophobic association, ionic bonds, electrostatics, and chelation, providing necessary protection for the conductive active layer of resistive pressure sensors. Simultaneously, the dynamic covalent and non-covalent bonds within the gelatin-based hydrogel adhesive contribute to its excellent self-healing properties. Summary of the Invention

[0004] The purpose of this invention is to provide a method for preparing a leather-wood based electronic sensing floor, which has good stability, pressure sensing and self-healing properties.

[0005] The technical solution adopted in this invention is a method for preparing a leather-wood based electronic sensing floor, which is implemented according to the following steps:

[0006] Step 1: Mix gelatin and deionized water, heat to completely dissolve the gelatin to obtain a gelatin solution, add KH570, and adjust the pH of the solution to 2-4 with hydrochloric acid to obtain modified gelatin;

[0007] Step 2: Add chitosan to FeCl3 aqueous solution and dissolve it completely at 55℃-65℃ to obtain chitosan-iron complex;

[0008] Step 3: Dissolve the modified gelatin in water, then mix it with the chitosan-iron complex, add MXene and ultrasonically disperse it; then add polyethylene glycol diacrylate and ammonium persulfate, mix evenly, and obtain the sensor adhesive layer precursor solution;

[0009] Step 4: Hollow out the inside of the silicone pad and place it between the leather and the wood. Place two copper wires symmetrically on both sides of the silicone pad. Inject the sensor adhesive layer precursor solution into the silicone pad. Clamp the leather and the wood with clips and heat to polymerize. After the reaction is complete, remove the silicone pad to obtain the leather-wood based electronic sensing floor.

[0010] The invention is further characterized in that,

[0011] In step 1, the mass concentration of the gelatin solution is 5-20%.

[0012] In step 2, the concentration of the FeCl3 aqueous solution is 0.05-0.5 mol / L.

[0013] In step 3, the sensor adhesive layer precursor solution comprises the following substances by mass percentage: 5-25% modified gelatin, 2-15% chitosan-iron complex, 0.1-1.5% MXene, 5-20% polyethylene glycol diacrylate, 0.01-0.1% ammonium persulfate, and the balance being water, with the total of the above components being 100%.

[0014] In step 4, the leather can be any one of PVC leather, PU leather, cow leather, or sheep leather; the thickness of the leather is 0.6mm-2mm, and the thickness of the wooden board is 1.5mm-15mm.

[0015] The thickness of electronic flooring ranges from 4.1mm to 27mm.

[0016] In step 4, the polymerization reaction temperature is 55℃-70℃, and the reaction time is 2h-7h.

[0017] The beneficial effects of this invention are:

[0018] (1) The sensing adhesive layer in the electronic sensing floor prepared by the present invention can self-repair after damage under complex stress environment and under large stress or pressure, thus extending the service life.

[0019] (2) The electronic sensing floor prepared by the present invention has excellent stability, durability, strain and pressure sensing, and can accurately track the posture, movement and collision of the human body above the floor; in addition, the preparation process of the present invention is simple, the operation process is convenient, the conditions are mild, which is conducive to mass production. Attached Figure Description

[0020] Figure 1 This is a diagram showing the adhesion strength of the sensing adhesive layer to leather and wood in Embodiment 1 of the present invention.

[0021] Figure 2 This is a self-healing diagram of the sensing adhesive layer in Embodiment 1 of the present invention;

[0022] Figure 3 This is a diagram illustrating the fabrication process of the electronic sensing floor according to Embodiment 1 of the present invention;

[0023] Figure 4 This is a photograph of the electronic sensing floor according to Embodiment 1 of the present invention;

[0024] Figure 5 This is a photograph of the electronic sensing floor according to Embodiment 1 of the present invention.

[0025] Figure 6 A graph showing the real-time resistance change of a person walking on the electronically sensed floor of Example 1;

[0026] Figure 7 A graph showing the real-time resistance change of a person running on the electronically sensed floor of Example 1;

[0027] Figure 8 A graph showing the real-time resistance change of a person jumping on the electronic sensing floor of Example 1. Detailed Implementation

[0028] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0029] The preparation method of the leather-wood based electronic sensing floor of the present invention is carried out according to the following steps:

[0030] Step 1: Mix gelatin and deionized water, heat to dissolve the gelatin, and after the gelatin is completely dissolved, a gelatin solution is obtained. Add KH570 and adjust the pH of the solution to 2-4 with hydrochloric acid to hydrolyze KH570 and cause it to undergo a condensation reaction with the gelatin to obtain modified gelatin.

[0031] The mass concentration of the gelatin solution is 5-20%;

[0032] Step 2: Add chitosan to FeCl3 aqueous solution and dissolve it completely at 55-65℃ to obtain chitosan-iron complex;

[0033] The concentration of FeCl3 aqueous solution is 0.05-0.5 mol / L;

[0034] Step 3: Dissolve the modified gelatin in water, then mix it with the chitosan-iron complex, add MXene and ultrasonically disperse it; then add polyethylene glycol diacrylate and initiator ammonium persulfate, mix evenly, and obtain the sensor adhesive layer precursor solution;

[0035] The sensor adhesive layer precursor solution comprises the following substances by mass percentage: 5-25% modified gelatin, 2-15% chitosan-iron complex, 0.1-1.5% MXene, 5-20% polyethylene glycol diacrylate, 0.01-0.1% ammonium persulfate, and the balance being water, with the total of the above components being 100%.

[0036] Step 4: Hollow out the inside of the silicone pad and place it between the leather and the wood. Place two copper wires symmetrically on both sides of the silicone pad. Inject the sensing adhesive layer precursor solution into the silicone pad. Use clamps to clamp the leather and the wood to prevent leakage. Finally, heat to polymerize. After the reaction is complete, remove the silicone pad to obtain the leather-wood based electronic sensing floor.

[0037] The leather can be any one of PVC leather, PU leather, cow leather, or sheep leather;

[0038] The thickness of the leather is 0.6mm-2mm, and the thickness of the wood is 1.5mm-15mm;

[0039] The thickness of electronic flooring ranges from 4.1mm to 27mm.

[0040] The polymerization reaction temperature is 55-70℃, and the reaction time is 2-7h.

[0041] Example 1

[0042] Weigh 5g of gelatin and 95g of deionized water and add them to a three-necked flask. Heat the flask to dissolve the gelatin. After the gelatin is completely dissolved, add 1mL of KH570. Adjust the pH to 2 with hydrochloric acid to hydrolyze the KH570 and allow it to undergo a condensation reaction with the gelatin to obtain modified gelatin.

[0043] Prepare a 0.04 mol / L FeCl3 aqueous solution, add 0.3 g chitosan, and dissolve it completely at 60 °C to obtain a chitosan-iron complex solution;

[0044] Weigh 5g of modified gelatin and dissolve it in deionized water. Mix it with chitosan-iron complex solution and add 50mg of MXene for ultrasonic dispersion. Then add 2g of polyethylene glycol diacrylate and 8mg of ammonium persulfate and mix well to obtain the sensor adhesive layer precursor solution.

[0045] A rectangular silicone pad was hollowed out in the middle and placed between leather and wood to form a mold. Two copper wires, extending beyond the mold, were symmetrically placed on both sides of the hollow area of ​​the silicone pad. The precursor solution for the sensing adhesive layer was injected into the hollow area of ​​the silicone pad, and the mold was clamped to prevent leakage. Finally, the reaction was carried out at 55°C for 5 hours. After the reaction was completed, the silicone pad was removed, yielding the electronic sensing floor.

[0046] Two copper wires in the electronic floor are connected to an electrochemical workstation for real-time motion monitoring. Figure 1This is a diagram showing the adhesion strength of the sensing adhesive layer to leather and wood in Example 1. The sensing adhesive layer needs to be tightly attached to the substrate surface to make the signal transmission of the smart electronic floor more accurate. Figure 2 The self-healing properties of the sensing adhesive layer in Example 1 are shown in the figure. The self-healing performance enables the sensing adhesive layer to withstand complex stress environments, greatly extending the service life of the electronic floor. Figure 3 The process described in Example 1 is the preparation process of the electronic sensing floor. Figure 4 The image shows a physical photograph of an electronic sensing floor, which was assembled using simple adhesive bonding to create an electronic sensing floor with a sandwich structure. Figure 5 These are actual photos of the electronic sensing floor in Example 1. Figure 6-8 This is a real-time resistance change graph of a person walking, running, and jumping on the electronic floor. By connecting two copper wires of the electronic floor to an electrochemical workstation, walking, jumping, and running on the electronic floor produce different electrical signals, exhibiting the expected repeatable and regular electrical signals. This confirms that the electronic floor can accurately track people's daily activities.

[0047] Example 2

[0048] Weigh 10g of gelatin and 90g of deionized water and add them to a three-necked flask. Heat the flask to dissolve the gelatin. After the gelatin is completely dissolved, add 2mL of KH570. Adjust the pH to 2.5 with hydrochloric acid to hydrolyze the KH570 and cause it to condense with the gelatin to obtain modified gelatin.

[0049] Prepare a 0.03 mol / L FeCl3 aqueous solution, add 0.4 g chitosan, and dissolve it completely at 60 °C to obtain a chitosan-iron complex solution;

[0050] Weigh 4g of modified gelatin and dissolve it in deionized water. Mix it with chitosan-iron complex solution and add 25mg of MXene for ultrasonic dispersion. Then add 2.5g of polyethylene glycol diacrylate and 8mg of ammonium persulfate and mix well to obtain the sensor adhesive layer precursor solution.

[0051] A rectangular silicone pad was hollowed out in the middle and placed between leather and wood to form a mold. Two copper wires, extending beyond the mold, were symmetrically placed on both sides of the hollow area of ​​the silicone pad. The precursor solution for the sensing adhesive layer was injected into the hollow area of ​​the silicone pad, and the mold was clamped to prevent leakage. The reaction was carried out at 60°C for 4 hours. After the reaction was completed, the rubber pad was removed, yielding the electronic sensing floor.

[0052] Example 3

[0053] Weigh 15g of gelatin and 85g of deionized water and add them to a three-necked flask. Heat the flask to dissolve the gelatin. After the gelatin is completely dissolved, add 3mL of KH570. Adjust the pH to 2 with hydrochloric acid to hydrolyze the KH570 and allow it to undergo a condensation reaction with the gelatin to obtain modified gelatin.

[0054] Step (2) Prepare a 0.02 mol / L FeCl3 aqueous solution, add 0.35 g chitosan, and dissolve it completely at 60 °C to obtain a chitosan-iron complex solution;

[0055] Weigh 3g of modified gelatin and dissolve it in deionized water. Mix it with chitosan-iron complex solution and add 100mg of MXene for ultrasonic dispersion. Then add 3g of polyethylene glycol diacrylate and 10mg of ammonium persulfate and mix well to obtain the sensor adhesive layer precursor solution.

[0056] The precursor solution for the sensing adhesive layer was injected into a mold consisting of leather, rubber pads, and wooden boards. Two copper foils were then partially immersed in the two sides of the precursor solution for the sensing adhesive layer. The mixture was reacted at 65°C for 3 hours. After the reaction was completed, the rubber pads were removed to obtain the intelligent electronic sensing floor.

[0057] Example 4

[0058] Weigh 10g of gelatin and 90g of deionized water and add them to a three-necked flask. Heat the flask to dissolve the gelatin. After the gelatin is completely dissolved, add 1mL of KH570. Adjust the pH to 3 with hydrochloric acid to hydrolyze the KH570 and allow it to undergo a condensation reaction with the gelatin to obtain modified gelatin.

[0059] Prepare a 0.05 mol / L FeCl3 aqueous solution, add 0.2 g chitosan, and dissolve it completely at 60 °C to obtain a chitosan-iron complex solution;

[0060] 2.5g of modified gelatin was dissolved in deionized water and mixed with chitosan-iron complex solution. 10mg of MXene was added and ultrasonically dispersed. Then, 2g of polyethylene glycol diacrylate and 7mg of ammonium persulfate were added and mixed evenly to obtain the sensor adhesive layer precursor solution.

[0061] A rectangular silicone pad was hollowed out in the middle and placed between leather and wood to form a mold. Two copper wires, extending beyond the mold, were symmetrically placed on both sides of the hollow area of ​​the silicone pad. The precursor solution for the sensing adhesive layer was injected into the hollow area of ​​the silicone pad, and the mold was clamped to prevent leakage. The reaction was carried out at 70°C for 2 hours. After the reaction was completed, the rubber pad was removed, yielding the intelligent electronic sensing floor.

[0062] Example 5

[0063] Weigh 5g of gelatin and 95g of deionized water and add them to a three-necked flask. Heat the flask to dissolve the gelatin. After the gelatin is completely dissolved, add 1.5mL of KH570. Adjust the pH to 4 with hydrochloric acid to hydrolyze the KH570 and allow it to undergo a condensation reaction with the gelatin to obtain modified gelatin.

[0064] Prepare a 0.01 mol / L FeCl3 aqueous solution, add 0.15 g chitosan, and dissolve it completely at 60 °C to obtain a chitosan-iron complex solution;

[0065] Weigh 2.5g of modified gelatin and dissolve it in deionized water. Mix it with chitosan-iron complex solution and add 100mg of MXene for ultrasonic dispersion. Then add 3g of polyethylene glycol diacrylate and 5mg of ammonium persulfate and mix well to obtain the sensor adhesive layer precursor solution.

[0066] A rectangular silicone pad was hollowed out in the middle and placed between leather and wood to form a mold. Two copper wires, extending beyond the mold, were symmetrically placed on both sides of the hollow area of ​​the silicone pad. The precursor solution for the sensing adhesive layer was injected into the hollow area of ​​the silicone pad, and the mold was clamped to prevent leakage. The reaction was carried out at 65°C for 2 hours. After the reaction was completed, the rubber pad was removed, yielding the electronic sensing floor.

Claims

1. A method for preparing a leather-wood based electronic sensing floor, characterized in that, The specific steps are as follows: Step 1: Mix gelatin and deionized water, heat to completely dissolve the gelatin to obtain a gelatin solution, add KH570, and adjust the pH of the solution to 2-4 with hydrochloric acid to obtain modified gelatin; Step 2: Add chitosan to FeCl3 aqueous solution and dissolve it completely at 55℃-65℃ to obtain chitosan-iron complex; Step 3: Dissolve the modified gelatin in water, then mix it with the chitosan-iron complex, and add MXene for ultrasonic dispersion; Then polyethylene glycol diacrylate and ammonium persulfate were added and mixed evenly to obtain the sensor adhesive layer precursor solution. Step 4: Hollow out the inside of the silicone pad and place it between the leather and the wood. Place two copper wires symmetrically on both sides of the silicone pad. Inject the sensor adhesive layer precursor solution into the silicone pad. Clamp the leather and the wood with clips and heat to polymerize. After the reaction is complete, remove the silicone pad to obtain the leather-wood based electronic sensing floor.

2. The method for preparing the leather-wood based electronic sensing floor according to claim 1, characterized in that, In step 1, the mass concentration of the gelatin solution is 5-20%.

3. The method for preparing the leather-wood based electronic sensing floor according to claim 1, characterized in that, In step 2, the concentration of the FeCl3 aqueous solution is 0.05-0.5 mol / L.

4. The method for preparing the leather-wood based electronic sensing floor according to claim 1, characterized in that, In step 3, the sensing adhesive layer precursor solution comprises the following substances by mass percentage: 5-25% modified gelatin, 2-15% chitosan-iron complex, 0.1-1.5% MXene, 5-20% polyethylene glycol diacrylate, 0.01-0.1% ammonium persulfate, and the balance being water, with the total of the above components being 100%.

5. The method for preparing the leather-wood based electronic sensing floor according to claim 1, characterized in that, In step 4, the leather is any one of PVC leather, PU leather, cow leather, or sheep leather; the thickness of the leather is 0.6mm-2mm, the thickness of the wooden board is 1.5mm-15mm, and the thickness of the electronic floor is 4.1mm-27mm.

6. The method for preparing the leather-wood based electronic sensing floor according to claim 1, characterized in that, In step 4, the polymerization reaction temperature is 55℃-70℃, and the reaction time is 2h-7h.

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