A packaging structure and a manufacturing method thereof

Abstract

The application discloses a packaging structure and a manufacturing method thereof, and relates to the technical field of packaging. The packaging structure comprises the following steps: manufacturing a preset number of metal columns, wherein the metal column comprises a first end and a second end; manufacturing a preset number of anti-glue-overflow rings; welding the first end of each metal column to a to-be-packaged substrate, and installing each anti-glue-overflow ring on the second end of the metal column; placing the to-be-packaged substrate with the metal column in a packaging mold, so that the lower surface of each anti-glue-overflow ring is attached to the packaging mold, and the welding part of the second end is exposed from the packaging mold; injecting packaging material into the packaging mold to form a packaging structure; the lower surface of the anti-glue-overflow ring is closely attached to the inner wall of the packaging mold, the gap between the metal column and the metal hole of the packaging mold can be completely shielded, and the overflow of the packaging material can be effectively prevented when the packaging material is injected.

Description

Technical Field

[0001] This invention relates to the field of packaging technology, and in particular to a packaging structure and its manufacturing method. Background Technology

[0002] With the continuous development of science and technology, more and more electronic devices are being widely used in people's lives and work, bringing great convenience to people's daily lives and work.

[0003] Electronic devices primarily rely on circuit boards with various electronic components soldered onto them to achieve their preset functions. With the continuous advancement of integrated circuits, circuit boards are becoming increasingly integrated and powerful, while their size is shrinking. In some special applications, it is necessary to encapsulate these circuit boards to protect them. In existing technologies, copper pillars are first soldered onto preset pads on the circuit board. Then, the circuit board with the soldered copper pillars is placed in a molding die, allowing the copper pillars to pass through pre-drilled holes in the die. Molding compound is then injected into the die to encapsulate the circuit board. However, due to process precision limitations, the inner diameter of the copper pillar holes in the die often deviates from the diameter of the copper pillars themselves. Gaps exist as the copper pillars pass through these holes, leading to excess compound during encapsulation. Summary of the Invention

[0004] Therefore, it is necessary to provide a packaging structure and its manufacturing method to address the above-mentioned technical problems, so as to solve the problem that there will be gaps when the copper pillars pass through the copper pillar holes on the mold during the existing packaging process, which will lead to glue overflow during molding.

[0005] In a first aspect, embodiments of the present invention provide a method for manufacturing a packaging structure, comprising:

[0006] A predetermined number of metal columns are manufactured, each metal column comprising a first end and a second end;

[0007] Prepare the predetermined number of anti-overflow rubber rings;

[0008] The first end of each of the metal pillars is welded to the substrate to be packaged, and the anti-overflow rubber rings are correspondingly inserted and installed on the second end of the metal pillars.

[0009] The substrate to be packaged, with metal pillars welded to it, is placed inside the packaging mold, so that the lower surface of each of the anti-overflow rubber rings is in contact with the packaging mold, and the welding part of the second end of the packaging mold is exposed.

[0010] Encapsulation material is injected into the encapsulation mold to form a substrate encapsulation structure.

[0011] The above solution has the following beneficial effects:

[0012] The method for manufacturing the packaging structure of the present invention involves welding one end of a metal pillar into a metal hole in a substrate, and setting an anti-overflow rubber ring at the second end of the metal pillar. After the metal pillar passes through the packaging mold, the lower surface of the anti-overflow rubber ring is tightly fitted with the inner wall of the packaging mold, which can completely cover the gap between the metal pillar and the metal hole of the packaging mold, and effectively prevent overflow when the packaging material is injected.

[0013] Optionally, placing the substrate to be packaged, to which metal pillars are welded, into the packaging mold, such that the lower surfaces of each of the anti-overflow rubber rings are in contact with the packaging mold, and the welding portion of the second end of the packaging mold is exposed, includes:

[0014] The metal column also includes a middle section, which connects the first end and the second end;

[0015] The substrate to be packaged, with the metal pillars welded on it, is placed inside the packaging mold, so that the second end of each metal pillar protrudes beyond a predetermined length of the packaging mold, forming a welding portion at the second end. The upper surface of each anti-overflow rubber ring is attached to the lower surface of the middle portion, and the lower surface of each anti-overflow rubber ring is attached to the inner wall of the packaging mold.

[0016] Optionally, the process of manufacturing a predetermined number of metal pillars includes:

[0017] Obtain the inner diameter of the metal hole in the substrate to be packaged, and fabricate the metal pillar such that the diameter of the first end of the metal pillar is equal to the inner diameter of the metal hole in the substrate to be packaged, and the diameter of the second end of the metal pillar is a preset value.

[0018] Optionally, manufacturing the preset number of anti-overflow rubber rings includes:

[0019] Obtain the diameter of the second end, reduce the diameter of the second end by a preset threshold to obtain the manufacturing inner diameter of the anti-overflow rubber ring; determine the manufacturing outer diameter of the anti-overflow rubber ring based on the diameter of the middle part, and manufacture the anti-overflow rubber ring based on the manufacturing inner diameter and the manufacturing outer diameter.

[0020] Secondly, embodiments of the present invention provide a packaging structure, including:

[0021] A plastic-encapsulated structure, wherein a substrate is encapsulated within the plastic-encapsulated structure, and a predetermined number of metal pillars are welded onto the substrate, wherein the metal pillars include a first end and a second end;

[0022] The first end is welded to the substrate, and the second end is provided with an anti-overflow rubber ring. The lower surface of the anti-overflow rubber ring is attached to the lower surface of the encapsulation structure, and the welded portion of the encapsulation structure is exposed at the second end.

[0023] The above solution has the following beneficial effects:

[0024] The encapsulation structure of the present invention involves welding one end of a metal pillar into a metal hole in a substrate, and providing an anti-overflow rubber ring at the second end of the metal pillar. The lower surface of the anti-overflow rubber ring is in contact with the surface of the encapsulation structure, and the metal pillar is exposed through the anti-overflow rubber ring, so that the part of the welding part that contacts the encapsulation structure is flat and smooth, with no residual encapsulation material.

[0025] Optionally, the metal column further includes a middle section, and the first end, the middle section and the second end are connected in sequence to form a stepped metal column.

[0026] Optionally, the stepped metal column is a three-step metal column, and the diameter of the middle part is larger than the diameter of the first end and the second end.

[0027] Optionally, the stepped metal column is a four-step metal column, and the middle part includes a first middle part and a second middle part. The diameter of the first middle part is larger than the diameter of the first end, and the diameter of the second middle part is larger than the diameter of the first middle part.

[0028] Optionally, the stepped metal column is a five-step metal column, and the middle part includes a first middle part, a second middle part, and a third middle part connected in sequence. The diameter of the first middle part is larger than the diameter of the first end, the diameter of the third middle part is larger than the diameter of the second end, and the diameter of the second middle part is smaller than the diameters of the first middle part and the third middle part.

[0029] Optionally, the inner diameter of the anti-overflow rubber ring is the same as the diameter of the second end. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of a method for manufacturing an encapsulation structure according to one embodiment of the present invention;

[0032] Figure 2-1 This is a schematic diagram of the structure of the first type of metal column provided in one embodiment of the present invention;

[0033] Figure 2-2 This is a schematic diagram of the structure of the second type of metal column provided in one embodiment of the present invention;

[0034] Figure 2-3This is a schematic diagram of the structure of the third type of metal column provided in one embodiment of the present invention;

[0035] Figure 2-4 This is a schematic diagram of the structure of the fourth type of metal column provided in one embodiment of the present invention;

[0036] Figure 2-5 This is a schematic diagram of the structure of the fifth type of metal column provided in one embodiment of the present invention;

[0037] Figure 3-1 This is a top view schematic diagram of the anti-overflow rubber ring structure provided in one embodiment of the present invention;

[0038] Figure 3-2 This is a side view schematic diagram of the anti-overflow rubber ring structure provided in one embodiment of the present invention;

[0039] Figure 4-1 This is a schematic diagram of the anti-overflow rubber ring installed on a metal column according to one embodiment of the present invention;

[0040] Figure 4-2 This is a schematic diagram of the structure of a substrate provided in one embodiment of the present invention;

[0041] Figure 4-3 This is a schematic diagram of a metal pillar welded onto a substrate according to an embodiment of the present invention;

[0042] Figure 5 This is a schematic diagram of another metal pillar welded onto a substrate according to one embodiment of the present invention;

[0043] Figure 6 This is a schematic diagram of placing a substrate inside a packaging mold according to an embodiment of the present invention;

[0044] Figure 7 This is a schematic diagram of a packaging structure provided in one embodiment of the present invention;

[0045] Figure 8 This is a schematic diagram of another packaging structure provided in one embodiment of the present invention;

[0046] The symbols are explained as follows:

[0047] 1. Metal pillar; 11. First end; 12. Second end; 121. Welding part; 13. Middle part; 131. First middle part; 132. Second middle part; 133. Third middle part; 2. Anti-overflow rubber ring; 3. Substrate; 31. Metal hole; 32. Integrated chip; 33. Inductor core; 34. Surface mount component; 4. Packaging mold; 5. Plastic encapsulation structure. Detailed Implementation

[0048] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are some embodiments of the present invention, but not all embodiments.

[0049] In one embodiment, a method such as Figure 1 The method for fabricating the shown packaging structure includes the following steps:

[0050] Step S100: Make a preset number of metal pillars, each metal pillar including a first end and a second end.

[0051] For substrate packaging, conductive structures are needed to bring out the lines on the substrate to facilitate connection with external circuits. In this embodiment, the substrate can be a packaging substrate or a printed circuit board (PCB).

[0052] In one example, a method for making such Figure 2-1 The method for manufacturing the metal pillar 1 shown is as follows:

[0053] Step S101: Obtain the inner diameter of the metal hole in the substrate to be packaged, and make the first end of the metal pillar so that the diameter of the first end of the metal pillar is equal to the inner diameter of the metal hole in the substrate to be packaged.

[0054] The inner diameter of the metal hole in the substrate to be tested can be obtained by measurement. Based on the inner diameter of the metal hole in the substrate to be tested, one end of a metal pillar with a diameter equal to that of the middle part 13 is mechanically cut to obtain a first end 11 with a diameter equal to that of the inner diameter of the metal hole in the substrate to be tested. The length of the first end 11 can be set according to the thickness of the substrate to be packaged. By making a first end with the same diameter as the inner diameter of the metal hole in the substrate to be packaged, the first end of the metal pillar can be welded into the metal hole in the substrate.

[0055] Step S102: Obtain the inner diameter of the metal hole in the packaging mold, and make the second end of the metal pillar so that the diameter of the second end is less than or equal to the inner diameter of the metal hole in the packaging mold.

[0056] The inner diameter of the metal hole in the packaging mold can be obtained by measurement. Using the inner diameter of the metal hole in the packaging mold as a reference, the other end of the metal column with the diameter of the middle part 13 is mechanically cut to obtain a second end with a preset diameter. This preset value is less than or equal to the inner diameter of the metal hole in the packaging mold, so that the second end can pass smoothly through the metal hole in the packaging mold.

[0057] After the first end 11 and the second end 12 are made, the remaining part in the middle is the middle part 13 of the metal pillar 1. At this point, the metal pillar 1 is completed. The number of metal pillars 1 made depends on the number of metal holes designed on the substrate to be packaged.

[0058] In this embodiment, the first end 11 and the second end 12 of the metal column can be made by first making a mold for casting the metal column 1 according to the design dimensions of the metal column, and then making the metal column 1 by casting; the preferred material for the metal column 1 is copper.

[0059] In one example, a method for making such Figure 2-2 The method for manufacturing the metal pillar 1 shown, the method for manufacturing the first end 11 and the second end 12 of the metal pillar 1 is the same as... Figure 2-1 The method of making metal pillar 1 is the same.

[0060] After the first end 11 and the second end 12 are made, a portion of the middle portion 13 adjacent to the first end 11 is cut to make the first middle portion 131 of the middle portion 13. The remaining portion of the middle portion 13 is the second middle portion 132. The diameter of the first middle portion 131 is larger than the diameter of the first end 11, and the diameter of the first middle portion 131 is smaller than the diameter of the second middle portion 132.

[0061] This method can also be used to create, for example Figure 2-3 and Figure 2-4 The metal pillar 1 shown is made Figure 2-3 Metal pillar 1 and its manufacturing Figure 2-2 The difference in the metal pillar 1 is that the lengths of the first intermediate portion 131 and the second intermediate portion 132 are different; manufacturing Figure 2-4 Metal pillar 1 and its manufacturing Figure 2-2 The difference in the metal column 1 is that the lengths of the first intermediate portion 131 and the second intermediate portion 132 are different, and the diameter of the second end portion 12 is smaller than that of the first intermediate portion 131. Figure 2-2 The diameter of the second end 12; both metal pillars can serve as conductive structures for the substrate to be packaged.

[0062] In one example, a method for making such Figure 2-5 The method for manufacturing the metal pillar 1 shown, the method for manufacturing the first end 11 and the second end 12 of the metal pillar 1 is the same as... Figure 2-2 The method of making metal pillar 1 is the same.

[0063] After the first end 11 and the second end 12 are fabricated, a portion of the middle portion 13 adjacent to the first end 11 is cut to form the first middle portion 131 of the middle portion 13. Then, a portion of the remaining middle portion 13 adjacent to the first middle portion 131 is cut to form the third middle portion 133 of the middle portion 13. The remaining portion of the middle portion 13 is the second middle portion 132. The diameter of the third middle portion 133 is smaller than the diameter of the first middle portion 131, and the diameter of the first middle portion 131 is smaller than the diameter of the second middle portion 132. The metal pillar 1 can also serve as a conductive structure for the substrate to be packaged.

[0064] The methods for manufacturing various metal pillars with different structures provided in this embodiment can adapt to packaging molds with different structures, thus facilitating the packaging of substrates.

[0065] Step S200: Make a preset number of anti-overflow rubber rings.

[0066] After creating the preset number of metal pillars, you need to create, for example... Figure 3-1 The anti-overflow rubber ring 2 shown is installed in conjunction with the metal column, and its manufacturing method is as follows:

[0067] Step S201: Obtain the diameter of the second end of the metal column.

[0068] In step S100, after the metal column is fabricated, the diameter of the second end of the metal column can be obtained by measurement.

[0069] Step S202: Reduce the diameter of the second end of the metal column by a preset threshold to obtain the inner diameter of the anti-overflow rubber ring; determine the outer diameter of the anti-overflow rubber ring based on the diameter of the middle part, and manufacture the anti-overflow rubber ring based on the inner diameter and the outer diameter.

[0070] To ensure the manufactured anti-overflow rubber ring 2 fits tightly onto the second end 12 of the metal pillar, the diameter of the second end of the metal pillar needs to be reduced by a preset threshold as the inner diameter of the anti-overflow rubber ring 2. This results in an inner diameter slightly smaller than the diameter of the second end 12 of the metal pillar, allowing for a tight fit. The outer diameter of the anti-overflow rubber ring can be determined based on the diameter of the middle portion 13. The outer diameter of the anti-overflow rubber ring 2 must be larger than the inner diameter of the metal hole in the packaging mold, ensuring the anti-overflow rubber ring 2 completely covers the metal hole in the packaging mold. Figure 3-2 As shown, the thickness of the anti-overflow rubber ring is determined by the distance between the middle part 13 of the metal pillar and the inner wall of the packaging mold. The thickness of the anti-overflow rubber ring 2 needs to be less than the distance between the middle part 13 of the metal pillar and the inner wall of the packaging mold.

[0071] The anti-overflow rubber ring 2 can also be made by creating a mold according to its size, and then making the anti-overflow rubber ring 2 using the mold. Alternatively, it can be made by 3D printing or laser engraving. The material used for the anti-overflow rubber ring 2 is the same as the material used for the molding substrate. Other flexible insulating materials, such as plastic materials, can also be selected.

[0072] Step S300: Weld the first end of each metal pillar to the substrate to be packaged, and install each anti-overflow rubber ring on the second end of the metal pillar accordingly.

[0073] See Figure 4-1 The prepared anti-overflow rubber ring 2 is fitted onto the second end 12 of the metal column 1, so that the upper surface of the anti-overflow rubber ring 2 is in contact with the lower surface of the middle part 13 of the metal column 1.

[0074] See Figure 4-2 Various electronic components, such as integrated chips 32, inductor cores 33 and surface mount components 34, are soldered to both sides of the substrate 3 to form a double-sided substrate; alternatively, they can be soldered to one side of the substrate 3 to form a single-sided substrate.

[0075] See Figure 4-3 The first end 11 of the metal post 1 with the anti-overflow rubber ring 2 is inserted into the metal hole 31 of the substrate 3, and the first end 11 of the metal post 1 is soldered to the metal hole 31 of the substrate 3 by soldering.

[0076] See one example. Figure 5 Alternatively, the metal post 1 without the anti-overflow rubber ring 2 can be welded to the substrate 3 first, and then the anti-overflow rubber ring 2 can be installed, which can achieve the same effect as the above installation method.

[0077] Step S400: Place the substrate to be packaged, with the metal pillars welded on it, into the packaging mold, so that the lower surface of each anti-overflow rubber ring is in contact with the packaging mold, and the welding part of the second end of the packaging mold is exposed.

[0078] See Figure 6 The substrate to be packaged, with the metal pillars welded on it, is placed in the packaging mold 4. The lower surface of each anti-overflow rubber ring 2 needs to be tightly fitted to the inner wall of the packaging mold 4, and the upper surface of the anti-overflow rubber ring 2 needs to be tightly fitted to the lower surface of the middle part 13 of the metal pillar 1. The second end 12 of the metal pillar 1 passes through the metal hole of the anti-overflow rubber ring 2 and the packaging mold 4, and the second end 12 of the metal pillar 1 of the preset length is exposed, which is the welding part 121, used to connect with the external circuit.

[0079] In this embodiment, since there are no gaps on the upper and lower surfaces of the anti-overflow rubber ring 2, even if the diameter of the second end of the metal pillar 1 is smaller than the diameter of the metal hole of the packaging mold 4, no overflow will occur when liquid packaging material is injected into the packaging mold.

[0080] Step S500: Inject packaging material into the packaging mold to form a packaging structure.

[0081] After the above steps, the substrate 3 with the metal pillar 1 welded on it is placed in the packaging mold 4, and then the liquid packaging material is injected into the packaging mold 4. After the packaging material cools down, the substrate packaging structure is formed.

[0082] The packaging structure manufacturing method of this embodiment involves welding one end of a metal pillar into a metal hole in a substrate, and setting an anti-overflow rubber ring at the second end of the metal pillar. After the metal pillar passes through the packaging mold, the lower surface of the anti-overflow rubber ring is tightly fitted with the inner wall of the packaging mold, and the upper surface is fitted with the lower surface of the middle part of the metal pillar. This can completely cover the gap between the metal pillar and the metal hole of the packaging mold, and effectively prevent overflow when the packaging material is injected.

[0083] In one embodiment, a method such as Figure 7 The encapsulation structure shown includes: a substrate 3, metal pillars 1, an anti-overflow rubber ring 2, and a molding structure 5. The molding structure 5 encapsulates the substrate 3, and a predetermined number of metal pillars 1 are welded onto the substrate 3. Each metal pillar 1 includes a first end 11 and a second end 12.

[0084] In this embodiment, the first end 11 is welded to the substrate 3, and the second end 12 is provided with an anti-overflow rubber ring 2. The lower surface of the anti-overflow rubber ring 2 is attached to the surface of the encapsulation structure 5, and the encapsulation structure 5 exposes the welding part 121 of the second end 12.

[0085] In this embodiment, the substrate can be a packaging substrate or a printed circuit board (PCB).

[0086] In this embodiment of the encapsulation structure, one end of the metal pillar is welded into the metal hole of the substrate, and an anti-overflow rubber ring is provided at the second end of the metal pillar. The lower surface of the anti-overflow rubber ring is attached to the surface of the plastic encapsulation structure. The metal pillar is exposed through the anti-overflow rubber ring, so that the part of the welded part that contacts the plastic encapsulation structure is flat and smooth, without any residual encapsulation material.

[0087] In one embodiment, a method such as Figure 8 The packaging structure shown is similar to... Figure 7 The difference in the packaging structure is that electronic components, such as integrated chips 32, inductor cores 33 and surface mount components 34, are soldered onto the substrate 3 of the packaging structure; the inner diameter of the anti-overflow rubber ring is the same as the diameter of the second end.

[0088] The metal column 1 also includes a middle part 13, wherein the first end 11, the middle part 13 and the second end 12 are connected in sequence to form a stepped metal column.

[0089] See Figure 2-1 The stepped metal column is a three-step metal column, and the diameter of the middle part 13 is larger than the diameter of the first end 11 and the second end 12.

[0090] See one example. Figure 2-2 or Figure 2-3 The stepped metal column is a four-step metal column. The middle part 13 includes a first middle part 131 and a second middle part 132. The diameter of the first middle part 131 is larger than the diameter of the first end 11, and the diameter of the second middle part 132 is larger than the diameter of the first middle part 131.

[0091] See one example. Figure 2-4 The stepped metal column is a four-step metal column. The middle part 13 includes a first middle part 131 and a second middle part 132. The diameter of the first middle part 131 is larger than the diameter of the first end 11, the diameter of the second middle part 132 is larger than the diameter of the first middle part 131, and the diameter of the second end 12 is smaller than the diameter of the first end 11.

[0092] See one example. Figure 2-5 The stepped metal column is a five-step metal column. The middle part 13 includes a first middle part 131, a third middle part 133, and a second middle part 132 connected in sequence. The diameter of the first middle part 131 is larger than the diameter of the first end 11, the diameter of the second middle part 132 is larger than the diameter of the first middle part 131, and the diameter of the third middle part 133 is smaller than the diameter of the first middle part 131 and the second middle part 132.

[0093] The packaging structure of this embodiment provides a variety of metal pillars with different structures, all of which can realize the connection between the substrate and the external circuit. Moreover, the various metal pillars with different structures can adapt to packaging molds with different structures, making the substrate packaging more flexible.

[0094] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for manufacturing an encapsulation structure, characterized in that, include: A predetermined number of metal columns are manufactured, each metal column comprising a first end and a second end; Prepare the predetermined number of anti-overflow rubber rings; The first end of each of the metal pillars is welded to the substrate to be packaged, and the anti-overflow rubber rings are correspondingly inserted and installed on the second end of the metal pillars. The substrate to be packaged, with metal pillars welded to it, is placed inside the packaging mold, so that the lower surface of each of the anti-overflow rubber rings is in contact with the packaging mold, and the welding part of the second end of the packaging mold is exposed. Injecting encapsulation material into the encapsulation mold to form an encapsulation structure; The step of placing the substrate to be packaged, to which metal pillars are welded, into the packaging mold, such that the lower surfaces of each of the anti-overflow rubber rings are in contact with the packaging mold, and the welding portion of the packaging mold exposed at the second end includes: The metal column also includes a middle section, which connects the first end and the second end; The substrate to be packaged, with the metal pillars welded on it, is placed inside the packaging mold, so that the second end of each metal pillar protrudes beyond a predetermined length of the packaging mold, forming a welding part at the second end, so that the upper surface of each anti-overflow rubber ring is attached to the lower surface of the middle part, and the lower surface of each anti-overflow rubber ring is attached to the inner wall of the packaging mold. Making the predetermined number of anti-overflow rubber rings includes: Obtain the diameter of the second end, reduce the diameter of the second end by a preset threshold to obtain the manufacturing inner diameter of the anti-overflow rubber ring; determine the manufacturing outer diameter of the anti-overflow rubber ring according to the diameter of the middle part, and manufacture the anti-overflow rubber ring according to the manufacturing inner diameter and the manufacturing outer diameter; The thickness of the anti-overflow rubber ring is less than the distance between the middle part of the metal pillar and the inner wall of the packaging mold.

2. The method for manufacturing the packaging structure according to claim 1, characterized in that, The process of producing a predetermined number of metal pillars includes: Obtain the inner diameter of the metal hole in the substrate to be packaged, and fabricate the metal pillar such that the diameter of the first end of the metal pillar is equal to the inner diameter of the metal hole in the substrate to be packaged, and the diameter of the second end of the metal pillar is a preset value.

3. A packaging structure, characterized in that, include: A plastic-encapsulated structure, wherein a substrate is encapsulated within the plastic-encapsulated structure, and a predetermined number of metal pillars are welded onto the substrate, wherein the metal pillars include a first end and a second end; The first end is welded to the substrate, and the second end is provided with an anti-overflow rubber ring. The lower surface of the anti-overflow rubber ring is attached to the lower surface of the encapsulation structure, and the encapsulation structure exposes the welded portion of the second end. The metal column also includes a middle section, and the first end, the middle section and the second end are connected in sequence to form a stepped metal column; The anti-overflow rubber ring is manufactured as follows: Obtain the diameter of the second end, reduce the diameter of the second end by a preset threshold to obtain the manufacturing inner diameter of the anti-overflow rubber ring; determine the manufacturing outer diameter of the anti-overflow rubber ring according to the diameter of the middle part, and manufacture the anti-overflow rubber ring according to the manufacturing inner diameter and the manufacturing outer diameter; The thickness of the anti-overflow rubber ring is less than the distance between the middle part of the metal pillar and the inner wall of the packaging mold.

4. The packaging structure according to claim 3, characterized in that, The stepped metal column is a three-step metal column, and the diameter of the middle part is larger than the diameter of the first end and the second end.

5. The packaging structure according to claim 3, characterized in that, The stepped metal column is a four-step metal column. The middle part includes a first middle part and a second middle part. The diameter of the first middle part is larger than the diameter of the first end, and the diameter of the second middle part is larger than the diameter of the first middle part.

6. The packaging structure according to claim 3, characterized in that, The stepped metal column is a five-step metal column. The middle part includes a first middle part, a second middle part, and a third middle part connected in sequence. The diameter of the first middle part is larger than the diameter of the first end, the diameter of the third middle part is larger than the diameter of the second end, and the diameter of the second middle part is smaller than the diameters of the first middle part and the third middle part.

7. The packaging structure according to claim 3, characterized in that, The inner diameter of the anti-overflow rubber ring is the same as the diameter of the second end.

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