Temperature control method, system, device and storage medium for an electric soldering iron

By judging the soldering head connection signal and working mode, and combining the number of welds, materials and models, the temperature of the soldering iron is dynamically adjusted, which solves the problems of low heating efficiency and temperature mismatch of the soldering iron, and realizes rapid heating and energy-saving soldering.

CN115815733BActive Publication Date: 2026-05-12SHENZHEN AIXUN INTELLIGENT HARDWARE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN AIXUN INTELLIGENT HARDWARE CO LTD
Filing Date
2022-11-24
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

Existing soldering irons suffer from energy waste and soldering temperature mismatch due to the need for reheating or maintaining high temperatures for extended periods during use.

Method used

By judging the soldering head connection signal and the working mode of the soldering iron, the temperature of the soldering iron is dynamically adjusted to the sleep temperature or the preset heating temperature, and precise temperature control is achieved by combining the number of soldering operations, materials and soldering head model.

Benefits of technology

It enables rapid heating and temperature matching of the soldering iron under different soldering conditions, reducing energy waste and protecting circuit boards and components.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the field of temperature control, in particular to a temperature control method, system and device of an electric soldering iron and a storage medium, the method comprising the following steps: judging whether a welding head connection signal is received; if the welding head connection signal is received, judging whether the electric soldering iron is in a dormant mode; if the electric soldering iron is in the dormant mode, judging whether a dormant temperature can be acquired; if the dormant temperature can be acquired, controlling the electric soldering iron to heat to the dormant temperature based on the dormant temperature; if the electric soldering iron is not in the dormant mode, acquiring a preset heating temperature; and controlling the electric soldering iron to heat based on the preset heating temperature. Different temperatures can be set according to the current state of the electric soldering iron, the dormant temperature is kept when the electric soldering iron is in the dormant mode, that is, not used at present but used next time, so that the electric soldering iron can be quickly heated when used, and the electric soldering iron is directly heated to the preset heating temperature when not in the dormant mode, thereby facilitating welding.
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Description

Technical Field

[0001] This application relates to the field of temperature control, and in particular to a method, system, device and storage medium for temperature control of an electric soldering iron. Background Technology

[0002] Circuit boards play a crucial role in various electronic devices. With the increasing demands for diversification, miniaturization, and lightweighting in complete products, SMT (Surface Mount Technology) manufacturing has enabled the production of various types of circuit boards, including multilayer boards, flexible boards, rigid-flex boards, HDI / BUM substrates, and IC packages. The various components on the circuit board are soldered onto it using a soldering iron, and different circuit boards may require different soldering temperatures.

[0003] In related technologies, there are two main methods for heating soldering irons: one is a fixed temperature, where the soldering iron heats up to a fixed temperature after being plugged in; the other is a selectable setting, where different settings correspond to different heating temperatures. When not in use, the soldering iron is turned off or placed on a platform at the set heating temperature.

[0004] Regarding the aforementioned technologies, the soldering iron itself requires a certain amount of time to heat up. If the soldering iron is turned off and then used again in a short time, it needs to be reheated or placed on the platform at the heating temperature. Running at a high temperature will waste electricity. Summary of the Invention

[0005] In order to control the temperature of an electric soldering iron according to its usage, this application provides a method, system, device and storage medium for controlling the temperature of an electric soldering iron.

[0006] The temperature control method, system, device, and storage medium for an electric soldering iron provided in this application adopt the following technical solution:

[0007] A method for controlling the temperature of a soldering iron, comprising:

[0008] Determine whether a welding head connection signal has been received;

[0009] If a soldering head connection signal is received, determine whether the soldering iron is in sleep mode;

[0010] If the soldering iron is in sleep mode, determine whether the sleep temperature can be obtained;

[0011] If the sleep temperature can be obtained, the soldering iron can be heated to the sleep temperature based on the sleep temperature;

[0012] If the soldering iron is not in sleep mode, the preset heating temperature will be obtained;

[0013] The heating of the soldering iron is controlled based on the preset heating temperature.

[0014] By adopting the above technical solution, the soldering iron can automatically select the soldering tip according to the component being soldered. It determines whether to insert the soldering tip based on whether it receives a soldering tip connection signal. If inserted, it checks if the soldering iron is in sleep mode. In sleep mode, if a sleep temperature is set, the soldering iron will maintain the heating temperature at the sleep temperature to quickly reach the required temperature when needed. If it is in working mode, it will acquire the preset heating temperature and raise the soldering iron to that temperature. Different temperatures can be set according to the current state of the soldering iron. In sleep mode (i.e., when not currently in use but about to be used), the sleep temperature is maintained for rapid heating upon use. When not in sleep mode, the temperature is directly raised to the preset heating temperature for easy soldering.

[0015] Optionally, determining whether the hibernation temperature can be obtained includes:

[0016] Obtain the quantity to be welded;

[0017] Determine if the quantity to be welded is greater than the preset quantity;

[0018] If the number of items to be welded is greater than the preset number, the sleep temperature can be obtained;

[0019] If the number of welds is less than the preset number, the sleep temperature cannot be obtained.

[0020] By adopting the above technical solution, whether the soldering iron enters sleep mode depends on the number of circuit boards to be soldered. If only a small number of circuit boards are to be soldered, then there is no need to keep it in sleep mode after the soldering is completed, and the soldering iron can be turned off. However, if there are many circuit boards to be soldered, and the soldering personnel may leave briefly in the middle of the soldering process, the soldering iron will still be kept running at the sleep temperature. When it is necessary to continue soldering later, it can be heated to the required temperature as quickly as possible.

[0021] Optionally, obtaining the preset heating temperature includes:

[0022] Obtain the material to be welded;

[0023] Based on the material to be welded, match it with the welding material database to determine if a match can be found.

[0024] If a matching material to be welded can be found, the heating temperature of the material to be welded stored in the welding material library is used as the preset heating temperature.

[0025] By adopting the above technical solution, different circuit boards or components require different soldering iron temperatures when soldering. If the soldering iron temperature is incorrect during soldering, it may damage the circuit board or components. Therefore, different preset heating temperatures need to be selected according to different materials to be soldered. The preset heating temperature is obtained by matching the materials to be soldered in the soldering material database.

[0026] Optionally, if the material to be soldered cannot be matched, obtain the lowest temperature of the soldering iron;

[0027] Heat the soldering iron to the lowest possible temperature.

[0028] Determine whether the lowest temperature is sufficient to melt the material to be welded;

[0029] If the minimum temperature cannot melt the material to be welded, the heating temperature is increased until the material to be welded melts, and the target temperature at which the material to be welded melts is taken as the preset heating temperature.

[0030] By adopting the above technical solution, if the preset temperature of the material to be soldered is not found in the preset material database, high-temperature soldering may damage the circuit board. Therefore, the soldering iron is heated to the lowest possible temperature. If the lowest temperature cannot melt the material to be soldered, the heating temperature is increased until the material to be soldered can be melted, and the temperature at which the material to be soldered is melted is set as the preset heating temperature for that material. When soldering a new circuit board, the melting point is found by continuously increasing the temperature, protecting the circuit board from damage.

[0031] Optionally, determining whether a welding head connection signal has been received includes:

[0032] Obtain the welding head model;

[0033] Match the welding head model with the preset models to determine if the welding head model exists in the preset models;

[0034] If the welding head model exists in the preset models, the welding head connection signal can be received;

[0035] If the welding head model is not among the preset models, the welding head connection signal cannot be received.

[0036] By adopting the above technical solution, when the soldering tip is inserted into the soldering iron, the soldering iron can identify the soldering tip model. If the soldering tip model is within the preset range, it indicates that the currently inserted soldering tip is compatible with the soldering iron, and a soldering tip connection signal is sent. If the soldering tip model is not within the preset range, the soldering tip connection signal cannot be received. This prevents the insertion of incompatible or inferior soldering tips into the soldering iron, which could damage the soldering iron during use.

[0037] Optionally, after controlling the soldering iron to heat up to the sleep temperature, the following steps are included:

[0038] Obtain the duration of the hibernation temperature;

[0039] Determine if the duration of the hibernation temperature exceeds the preset time;

[0040] If the duration of the sleep temperature exceeds the preset time, the soldering iron will be turned off.

[0041] By adopting the above technical solution, when the soldering iron is in sleep mode, it is because the soldering personnel have to leave temporarily and place the soldering tip on the placement platform. However, if the sleep temperature is maintained for a long time, that is, the duration of the sleep temperature is longer than the preset time, it indicates that the person may leave for an extended period of time. For safety reasons, the soldering iron should be turned off.

[0042] Optionally, controlling the heating of the soldering iron based on a preset heating temperature includes:

[0043] Based on the welding head model, obtain the welding head operating current;

[0044] Based on the working current of the soldering head, the soldering iron is controlled to heat the soldering head, and the temperature of the soldering head is obtained as the target temperature.

[0045] Determine if the target temperature is greater than the preset heating temperature;

[0046] If the target temperature is higher than the preset heating temperature, the working current of the soldering head will be reduced to heat the soldering iron.

[0047] If the target temperature is lower than the preset heating temperature, the working current of the welding head will be increased to heat the soldering iron.

[0048] If the target temperature is equal to the preset temperature, the soldering head operating current remains constant to heat the soldering iron.

[0049] By adopting the above technical solution, when the soldering iron is working, the temperature of the soldering head is determined by the magnitude of the current. When heating the soldering head, if the target temperature is higher than the preset temperature, the working current is reduced; if the target temperature is lower than the preset temperature, the working current is increased, so that the temperature of the soldering head is always kept near the preset heating temperature, so as to solder the circuit board at a stable temperature.

[0050] Secondly, this application provides a temperature control system for an electric soldering iron.

[0051] A temperature control system for a soldering iron, comprising:

[0052] The first judgment module is used to determine whether a welding head connection signal has been received.

[0053] The second judgment module is used to determine whether the soldering iron is in sleep mode if a soldering head connection signal is received.

[0054] The third judgment module is used to determine whether the sleep temperature can be obtained if the soldering iron is in sleep mode;

[0055] The heating module is used to control the soldering iron to heat up to the sleep temperature if the sleep temperature can be obtained.

[0056] The acquisition module is used to acquire the preset heating temperature if the soldering iron is not in sleep mode;

[0057] The control module is used to control the heating of the soldering iron based on a preset heating temperature.

[0058] By adopting the above technical solution, the first judgment module determines whether the soldering iron has received the soldering head connection signal. The first judgment module is connected to the second judgment module. When the second judgment module receives the soldering head connection signal, it determines whether the soldering iron is in sleep mode. The second judgment module is connected to the third judgment module. The third judgment module determines whether the sleep temperature can be obtained. The third judgment module is connected to the heating module. The heating module controls the soldering iron to heat to the sleep temperature based on the sleep temperature. The heating module is connected to the acquisition module. When the soldering iron is not in sleep mode, the acquisition module acquires the preset heating temperature. The acquisition module is connected to the control module. The control module controls the soldering iron to heat based on the preset heating temperature. Different temperatures can be set according to the current state of the soldering iron. In sleep mode (i.e., when it is not currently in use but will be used later), the sleep temperature is maintained so that it can be quickly heated up when used. When it is not in sleep mode, it directly heats up to the preset temperature for easy soldering.

[0059] Thirdly, this application provides a terminal device, which adopts the following technical solution:

[0060] A terminal device includes a memory and a processor. The memory stores a computer program that can run on the processor. When the processor loads and executes the computer program, it employs any of the methods described above.

[0061] By adopting the above technical solution, a computer program is generated by the above method and stored in a memory for loading and execution by a processor. Thus, a terminal device is made based on the memory and processor, which is convenient to use.

[0062] Fourthly, this application provides a computer-readable storage medium, which adopts the following technical solution:

[0063] A computer-readable storage medium storing a computer program, wherein the computer program, when loaded and executed by a processor, employs the aforementioned method for temperature control of a soldering iron.

[0064] By adopting the above technical solution, a computer program is generated by the temperature control method of the above-mentioned soldering iron and stored in a computer-readable storage medium for loading and execution by the processor. The computer-readable storage medium facilitates the reading and storage of the computer program.

[0065] In summary, this application includes at least one of the following beneficial technical effects:

[0066] The soldering iron can automatically select the soldering tip based on the component being soldered. It determines whether to insert the tip by receiving a connection signal. If inserted, it checks if the soldering iron is in sleep mode. In sleep mode, if a sleep temperature is set, the soldering iron will maintain the heating temperature up to the sleep temperature for quick heating when needed. If it's in working mode, it will acquire the preset heating temperature and raise the temperature to that level. Different temperatures can be set based on the soldering iron's current state. In sleep mode (when not currently in use but about to be used), it maintains the sleep temperature for rapid heating upon use; otherwise, it directly raises the temperature to the preset temperature for easy soldering. Attached Figure Description

[0067] Figure 1 This is a flowchart illustrating one embodiment of a temperature control method for a soldering iron according to an example of this application.

[0068] Figure 2 This is a flowchart illustrating one embodiment of a temperature control method for a soldering iron according to an example of this application.

[0069] Figure 3 This is a flowchart illustrating one embodiment of a temperature control method for a soldering iron according to an example of this application.

[0070] Figure 4 This is a flowchart illustrating one embodiment of a temperature control method for a soldering iron according to an example of this application.

[0071] Figure 5 This is a flowchart illustrating one embodiment of a temperature control method for a soldering iron according to an example of this application.

[0072] Figure 6 This is a flowchart illustrating one embodiment of a temperature control method for a soldering iron according to an example of this application.

[0073] Figure 7 This is a flowchart illustrating one embodiment of a temperature control method for a soldering iron according to an example of this application.

[0074] Figure 8 This is a system block diagram of a temperature control system for a soldering iron according to an embodiment of this application.

[0075] Explanation of reference numerals in the attached figures:

[0076] 1. First judgment module; 2. Second judgment module; 3. Third judgment module; 4. Heating module; 5. Acquisition module; 6. Control module. Detailed Implementation

[0077] The present application will be further described in detail below with reference to all the accompanying drawings.

[0078] This application discloses a method for temperature control of a soldering iron, referring to... Figure 1 ,include:

[0079] S100: Determine whether a welding head connection signal has been received.

[0080] Specifically, the soldering head connection signal is used to determine whether the soldering head is inserted into the soldering iron. Under normal circumstances, the soldering head connection signal can be received when the soldering head is inserted into the soldering iron, and the soldering head connection signal will not be received when the soldering head is not inserted into the soldering iron.

[0081] If the welding head connection signal is not received, no action will be taken.

[0082] S110. If a soldering head connection signal is received, determine whether the soldering iron is in sleep mode.

[0083] Specifically, sleep mode is a state in which the soldering iron operates at low power, and the soldering tip will maintain a certain temperature, which is lower than the temperature during normal soldering.

[0084] S120. If the soldering iron is in sleep mode, determine whether the sleep temperature can be obtained.

[0085] Specifically, the sleep temperature is the heating temperature of the soldering tip when the soldering iron is in sleep mode. Operating at the sleep temperature when not in use can reduce energy consumption.

[0086] S130. If the sleep temperature can be obtained, control the soldering iron to heat up to the sleep temperature based on the sleep temperature.

[0087] S140. If the soldering iron is not in sleep mode, obtain the preset heating temperature.

[0088] Specifically, the preset heating temperature is the heating temperature of the welding head set according to different welding materials. For example, if the welding temperature of material A is 260 degrees and that of material B is 270 degrees, then 260 degrees is the preset heating temperature of material A.

[0089] S150: Controls the heating of the soldering iron based on a preset heating temperature.

[0090] The implementation principle of this method is as follows: The soldering iron can automatically select the soldering tip according to the component being soldered. It determines whether to insert the soldering tip based on whether it receives a soldering tip connection signal. If the soldering iron is inserted, it checks if the soldering iron is in sleep mode. In sleep mode, if a sleep temperature is set, the soldering iron will maintain the heating temperature at the sleep temperature so that it can quickly heat to the required temperature when needed. If it is not in sleep mode but in working mode, it acquires the preset heating temperature and raises the temperature of the soldering iron to the preset temperature. Different temperatures can be set according to the current state of the soldering iron. In sleep mode (i.e., when it is not currently in use but will be used later), the sleep temperature is maintained so that it can quickly heat up when needed. When not in sleep mode, the temperature is directly raised to the preset heating temperature for easy soldering.

[0091] In one embodiment of this example, such as Figure 2 As shown, step S120, which determines whether the hibernation temperature can be obtained, includes:

[0092] S200, Obtain the quantity to be welded.

[0093] Specifically, the number of circuit boards to be soldered is the number of circuit boards that need to be soldered next, and the number of circuit boards to be soldered can be manually entered by the soldering personnel.

[0094] S210. Determine whether the quantity to be welded is greater than the preset quantity.

[0095] Specifically, the preset quantity is the minimum number of soldering operations required to determine whether the soldering iron should enter sleep mode. If the number of soldering operations exceeds the preset quantity, it enters sleep mode; otherwise, it does not. When the number of soldering operations exceeds the preset quantity, since there are many circuit boards to be soldered, this serves two purposes: first, to allow the soldering iron to rest if the soldering time is too long; and second, to prevent the soldering operator from leaving midway through the process. When the number of soldering operations exceeds the preset quantity, step S220 is executed; otherwise, step S230 is executed.

[0096] S220. If the number of items to be welded is greater than the preset number, the sleep temperature can be obtained.

[0097] S230. If the number of welds is less than the preset number, the sleep temperature cannot be obtained.

[0098] The implementation principle of this method is as follows: Whether the soldering iron enters sleep mode depends on the number of circuit boards to be soldered. If only a small number of circuit boards are to be soldered, there is no need to keep it in sleep mode after the soldering is completed, and the soldering iron can be turned off. However, if there are many circuit boards to be soldered, and the soldering personnel may leave briefly during the soldering process, the soldering iron will still be kept running at the sleep temperature. When soldering needs to continue later, it can be heated to the required temperature as quickly as possible.

[0099] In one embodiment of this example, such as Figure 3 As shown, step S140, which involves obtaining the preset heating temperature, includes:

[0100] S300, Obtain the material to be welded.

[0101] Specifically, the material to be soldered is the model of the circuit board to be soldered. Depending on the material of the circuit board or the size of the solder pads, the required soldering temperature will also vary.

[0102] S310. Based on the material to be welded, match the welding material database to determine whether a matching material can be found.

[0103] Specifically, the welding material database contains preset heating temperatures for different materials to be welded. It includes preset heating temperatures for all previously welded materials and materials to be welded with known heating temperatures. Whether a material can be matched with the next material to be welded is determined within the welding material database, and step S320 is executed.

[0104] S320. If a material to be welded can be matched, the heating temperature of the material to be welded stored in the welding material library is used as the preset heating temperature.

[0105] Specifically, the heating temperature of the material to be welded will be obtained from the preset database and used as the preset heating temperature of the material. For example, if material A is to be welded and the preset heating temperature of material A in the welding material database is 260 degrees, then 260 degrees will be used as the preset heating temperature of material A.

[0106] The implementation principle of this embodiment is as follows: different circuit boards or components require different soldering iron temperatures when soldering. If the soldering iron temperature is incorrect during soldering, it may damage the circuit board or components. Therefore, different preset heating temperatures need to be selected according to different materials to be soldered. The preset heating temperature is obtained by matching the materials to be soldered in the soldering material database.

[0107] In one embodiment of this example, such as Figure 4As shown, step S140, which involves obtaining the preset heating temperature, includes:

[0108] S400: If the material to be soldered cannot be matched, obtain the lowest temperature of the soldering iron.

[0109] Specifically, the minimum temperature of a soldering iron is the temperature of the soldering tip when the soldering iron is running at its lowest power. The minimum power refers to the lowest operating power under normal soldering conditions.

[0110] S410: Heats the soldering iron based on the lowest possible temperature.

[0111] Specifically, heating the soldering iron to the lowest possible temperature can prevent overheating and damage to the circuit board when the material to be soldered is unknown.

[0112] S420. Determine whether the lowest temperature is sufficient to melt the material to be welded.

[0113] Specifically, when soldering at the lowest temperature, the lowest temperature may not reach the melting point of the circuit board due to the different materials. Therefore, it is necessary to continuously increase the heating temperature. Whether melting has occurred can be determined by installing a pressure sensor on the soldering head. When the material is not melting, it is hard and the soldering head will be under pressure from the person. However, at the moment of melting, the pressure on the soldering head will decrease instantly because the material softens. This will detect that the material to be soldered has melted.

[0114] S430. If the minimum temperature cannot melt the material to be welded, increase the heating temperature until the material to be welded melts, and use the target temperature at which the material to be welded melts as the preset heating temperature.

[0115] Specifically, the target temperature is the temperature at which the material to be welded melts, which is the temperature of the welding head when the pressure sensor suddenly decreases. After measuring the heating temperature, the measured heating temperature is also stored in the welding material database for future use.

[0116] The implementation principle of this method is as follows: If the preset temperature of the material to be soldered is not found in the preset material database, high-temperature soldering may damage the circuit board. Therefore, the soldering iron is heated to the lowest possible temperature. If the lowest temperature cannot melt the material to be soldered, the heating temperature is increased until the material to be soldered can be melted. The temperature at which the material to be soldered is melted is then used as the preset heating temperature for that material. When soldering a new circuit board, the melting point is found by continuously increasing the temperature, thus protecting the circuit board from damage.

[0117] In one embodiment of this example, such as Figure 5 As shown, step S100, i.e., whether a welding head connection signal is received, includes:

[0118] S500, obtain the welding head model.

[0119] Specifically, soldering irons from different brands use different soldering tips, and even if the connection interface is the same, the operating current may differ. Soldering irons of the same brand may require different sized soldering tips due to differences in soldering temperature or soldering size.

[0120] S510. Match the welding head model with the preset model to determine if the welding head model exists in the preset model.

[0121] Specifically, the compatible soldering tip models for a given brand of soldering iron are known. The preset models represent all compatible soldering tip models for that brand of soldering iron. If the model of the soldering tip currently inserted is among the preset models, it means that the current soldering tip model can be used. If the soldering tip model is incompatible with the soldering iron, not only may the soldering tip's operating temperature not meet the requirements, but the soldering iron may also be damaged. If the soldering tip model is among the preset models, proceed to step S520; otherwise, proceed to step S530.

[0122] S520. If the welding head model exists in the preset models, the welding head connection signal can be received.

[0123] S530. If the welding head model does not exist in the preset models, the welding head connection signal cannot be received.

[0124] The implementation principle of this method is as follows: When the soldering tip is inserted into the soldering iron, the soldering iron can identify the soldering tip model. If the soldering tip model is within the preset range, it indicates that the currently inserted soldering tip is compatible with the soldering iron, and a soldering tip connection signal is sent. If the soldering tip model is not within the preset range, the soldering tip connection signal cannot be received. This prevents the insertion of incompatible or inferior soldering tips into the soldering iron, which could damage the soldering iron during use.

[0125] In one embodiment of this example, such as Figure 6 As shown, step S130, which involves controlling the soldering iron to heat up to the sleep temperature, includes:

[0126] S600, obtain the duration of the hibernation temperature.

[0127] Specifically, the duration of the sleep temperature is the time from when the soldering iron enters sleep mode until now.

[0128] S610. Determine whether the duration of the hibernation temperature is greater than the preset time.

[0129] Specifically, the preset time is the longest allowed duration of the sleep temperature. If the duration exceeds the preset time, it indicates that the soldering personnel may have left for an extended period due to an emergency. For safety reasons, the soldering iron should be turned off when no one is present, and step S620 should be executed.

[0130] S620. If the duration of the sleep temperature exceeds the preset time, the soldering iron will be turned off.

[0131] If the duration of the hibernation temperature is not greater than the preset time, no action will be taken.

[0132] The implementation principle of this method is as follows: When the soldering iron is in sleep mode, it is because the soldering personnel have to leave temporarily and place the soldering tip on the placement platform. However, if the sleep temperature is maintained for a long time, that is, the duration of the sleep temperature is longer than the preset time, it indicates that the person may leave for an extended period of time. For safety reasons, the soldering iron is turned off.

[0133] In one embodiment of this example, such as Figure 6 As shown, step S150, which controls the heating of the soldering iron based on a preset heating temperature, includes:

[0134] S700: Obtain the welding head operating current based on the welding head model.

[0135] Specifically, after determining the preset heating temperature, the welding head operating current required to heat the welding head to the preset temperature is determined based on the preset input temperature. The welding head operating current can be obtained from the parameters provided by the manufacturer, including the current at which the welding head can be heated to what temperature.

[0136] S710: Based on the working current of the soldering head, control the soldering iron to heat the soldering head, and obtain the temperature of the soldering head as the target temperature.

[0137] Specifically, the target temperature is the actual temperature of the welding head after the working current is applied.

[0138] S720: Determine whether the target temperature is greater than the preset heating temperature.

[0139] S730: If the target temperature is higher than the preset heating temperature, the working current of the soldering head will be reduced to heat the soldering iron.

[0140] S740. If the target temperature is lower than the preset heating temperature, the working current of the soldering head will be increased to heat the soldering iron.

[0141] S750 If the target temperature is equal to the preset temperature, the soldering head operating current remains unchanged to heat the soldering iron.

[0142] Specifically, when the target temperature is higher than the preset temperature, it indicates that the current temperature of the welding head is too high and the operating current needs to be reduced. When the target temperature is lower than the preset temperature, it indicates that the operating current of the welding head is too low and needs to be increased. When the target temperature is equal to the preset temperature, the operating current should not be adjusted. By using negative feedback adjustment to control the temperature of the welding head, the temperature of the welding head can always be kept near the required temperature, making the temperature control more precise.

[0143] The implementation principle of this embodiment is as follows: When the soldering iron is working, the temperature of the soldering head is determined by the magnitude of the current. When heating the soldering head, if the target temperature is greater than the preset temperature, the working current is reduced; if the target temperature is less than the preset temperature, the working current is increased, so that the temperature of the soldering head is always kept near the preset heating temperature, so as to solder the circuit board at a stable temperature.

[0144] Secondly, this application provides a temperature control system for an electric soldering iron.

[0145] A temperature control system for a soldering iron, comprising:

[0146] The first judgment module 1 is used to determine whether a welding head connection signal has been received;

[0147] The second judgment module 2 is used to determine whether the soldering iron is in sleep mode if a soldering head connection signal is received.

[0148] The third judgment module 3 is used to determine whether the sleep temperature can be obtained if the soldering iron is in sleep mode;

[0149] Heating module 4 is used to control the soldering iron to heat up to the sleep temperature if the sleep temperature can be obtained.

[0150] Module 5 is used to obtain the preset heating temperature if the soldering iron is not in sleep mode;

[0151] Control module 6 is used to control the heating of the soldering iron based on a preset heating temperature.

[0152] The implementation principle of this embodiment is as follows: First judgment module 1 determines whether a soldering head connection signal has been received. First judgment module 1 is connected to second judgment module 2. When second judgment module 2 receives the soldering head connection signal, it determines whether the soldering iron is in sleep mode. Second judgment module 2 is connected to third judgment module 3. Third judgment module 3 determines whether the sleep temperature can be obtained. Third judgment module 3 is connected to heating module 4. Heating module 4 controls the soldering iron to heat to the sleep temperature based on the sleep temperature. Heating module 4 is connected to acquisition module 5. Acquisition module 5 acquires the preset heating temperature when not in sleep mode. Acquisition module 5 is connected to control module 6. Control module 6 controls the soldering iron to heat based on the preset heating temperature. Different temperatures can be set according to the current state of the soldering iron. In sleep mode (i.e., when not currently in use but about to be used), the sleep temperature is maintained so that it can be quickly heated up when used. When not in sleep mode, the temperature is directly raised to the preset temperature for easy soldering.

[0153] This application also discloses a terminal device, including a memory and a processor. The memory stores a computer program that can run on the processor. When the processor loads and executes the computer program, a temperature control method for an electric soldering iron is used.

[0154] The terminal device can be a computer device such as a desktop computer, a laptop computer, or a cloud server. The terminal device includes, but is not limited to, a processor and a memory. For example, the terminal device may also include input / output devices, network access devices, and buses.

[0155] The processor can be a central processing unit (CPU). Of course, depending on the actual use, it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), off-the-shelf programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor, etc., and this application does not limit it.

[0156] The memory can be an internal storage unit of the terminal device, such as a hard disk or RAM of the terminal device, or an external storage device of the terminal device, such as a plug-in hard disk, smart memory card (SMC), secure digital card (SD), or flash memory card (FC) equipped on the terminal device. Furthermore, the memory can be a combination of internal storage units and external storage devices of the terminal device. The memory is used to store computer programs and other programs and data required by the terminal device. The memory can also be used to temporarily store data that has been output or will be output. This application does not limit this.

[0157] In this terminal device, the temperature control method for an electric soldering iron in the above embodiment is stored in the memory of the terminal device and loaded and executed on the processor of the terminal device for convenient use.

[0158] This application also discloses a computer-readable storage medium, which stores a computer program, wherein when the computer program is executed by a processor, it employs a temperature control method for an electric soldering iron as described in the above embodiments.

[0159] The computer program can be stored in a computer-readable medium. The computer program includes computer program code, which can be in the form of source code, object code, executable file, or certain middleware. The computer-readable medium includes any entity or device capable of carrying computer program code, recording media, USB flash drive, portable hard drive, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the computer-readable medium includes, but is not limited to, the above-mentioned components.

[0160] The above-described method for controlling the temperature of a soldering iron is stored in the computer-readable storage medium and loaded and executed on the processor to facilitate the storage and application of the method.

[0161] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A method for temperature control of a soldering iron, characterized in that, include: Determine whether a welding head connection signal has been received; If a soldering head connection signal is received, determine whether the soldering iron is in sleep mode; If the soldering iron is in sleep mode, determine whether the sleep temperature can be obtained; If the sleep temperature can be obtained, the soldering iron can be controlled to heat up to the sleep temperature based on the sleep temperature; If the soldering iron is not in the sleep mode, then the preset heating temperature is obtained; The soldering iron is heated based on the preset heating temperature. Obtain the quantity to be welded; Determine whether the number of items to be welded is greater than the preset number; If the number of items to be welded is greater than the preset number, the dormancy temperature can be obtained; If the number of welds is less than the preset number, the dormancy temperature cannot be obtained.

2. The temperature control method for a soldering iron according to claim 1, characterized in that, The process of obtaining the preset heating temperature includes: Obtain the material to be welded; Based on the material to be welded, the welding material database is matched to determine whether the material to be welded can be matched. If the material to be welded can be matched, the heating temperature of the material to be welded stored in the welding material library is used as the preset heating temperature.

3. The temperature control method for a soldering iron according to claim 2, characterized in that, Also includes: If the material to be soldered cannot be matched, obtain the lowest temperature of the soldering iron; The soldering iron is heated based on the aforementioned minimum temperature; Determine whether the minimum temperature is sufficient to melt the material to be welded; If the minimum temperature cannot melt the material to be welded, the heating temperature is increased until the material to be welded melts, and the target temperature at which the material to be welded melts is taken as the preset heating temperature.

4. The temperature control method for a soldering iron according to claim 1, characterized in that, The determination of whether a welding head connection signal has been received includes: Obtain the welding head model; The welding head model is matched with a preset model to determine whether the welding head model exists in the preset model. If the welding head model exists in the preset models, a welding head connection signal can be received; If the welding head model does not exist in the preset models, the welding head connection signal cannot be received.

5. The temperature control method for a soldering iron according to claim 1, characterized in that, The process of controlling the soldering iron to heat to the dormancy temperature includes: Obtain the duration of the hibernation temperature; Determine whether the duration of the sleep temperature exceeds a preset time; If the duration of the sleep temperature exceeds the preset time, the soldering iron will be turned off.

6. The temperature control method for a soldering iron according to claim 1, characterized in that, The step of controlling the heating of the soldering iron based on the preset heating temperature includes: Based on the welding head model, obtain the welding head operating current; Based on the working current of the welding head, the soldering iron is controlled to heat the welding head, and the temperature of the welding head is obtained as the target temperature. Determine whether the target temperature is greater than the preset heating temperature; If the target temperature is greater than the preset heating temperature, the working current of the welding head is reduced to heat the soldering iron. If the target temperature is lower than the preset heating temperature, the working current of the welding head is increased to heat the soldering iron. If the target temperature is equal to the preset temperature, the working current of the soldering head is kept constant to heat the soldering iron.

7. A temperature control system for a soldering iron, applied to the temperature control method for a soldering iron according to any one of claims 1-6, characterized in that, include: The first judgment module (1) is used to determine whether a welding head connection signal has been received; The second judgment module (2) is used to determine whether the soldering iron is in sleep mode if a soldering head connection signal is received. The third judgment module (3) is used to determine whether the sleep temperature can be obtained if the soldering iron is in the sleep mode. Heating module (4) is used to control the soldering iron to heat to the sleep temperature if the sleep temperature can be obtained; The acquisition module (5) is used to acquire the preset heating temperature if the soldering iron is not in the sleep mode; The control module (6) is used to control the heating of the soldering iron based on the preset heating temperature.

8. A terminal device, comprising a memory and a processor, characterized in that, The memory stores a computer program that can run on a processor, and when the processor loads and executes the computer program, it employs the method of any one of claims 1 to 6.

9. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is loaded and executed by the processor, it employs the method described in any one of claims 1 to 6.