Semiconductor test module with temperature measurement assembly

Abstract

The present application relates to a semiconductor test module with a temperature measuring assembly, comprising a cavity, a temperature measuring assembly, a test tray and a needle measuring assembly. The temperature measuring assembly is accommodated in the cavity, comprising a hollow base, a plurality of hollow columns and a guide plate, each hollow column is respectively provided with a column temperature sensing unit and is fixed on the hollow base, and the guide plate is provided with at least one guide plate temperature sensing unit and is fixed on the hollow base. The test tray is carried on the cavity, and the needle measuring assembly is located above the test tray, comprising a test base, a test tray, a needle measuring seat and a probe. By using the present application, in addition to the problem of the temperature sensor signal line being broken or the sensing value being abnormal due to long-term reciprocating pulling in the conventional technology, the generation of flocculation flow can be reduced, the temperature balance in the cavity can be maintained, and the temperature change of the test tray can be accurately measured.

Description

Technical Field

[0001] This invention relates to a semiconductor test module with a temperature measurement component, and more particularly to a semiconductor test module with a temperature measurement component suitable for semiconductor device testing operations. Background Technology

[0002] In conventional technology, the test environment during the voltage testing of semiconductor devices can generally be adjusted and controlled in terms of temperature and humidity. In the past, the practice was mostly to embed a temperature sensor in the floating head of the probe assembly, which could be used to sense the temperature distribution of the semiconductor device carrier.

[0003] However, the temperature sensor inside the floating head also moves up and down with the floating head. The external temperature sensor signal line is easily stretched and displaced due to long-term reciprocating motion, often causing abnormal temperature measurements and signal line breakage. Furthermore, the temperature and humidity at each test point in a floating design are difficult to control within a controlled range, making comprehensive monitoring impossible. This can easily lead to slight errors in the testing environment for each semiconductor component, resulting in inaccurate test information.

[0004] Driven by this, and in the spirit of active invention, the inventors sought a semiconductor test module with temperature measurement components that could solve the above problems. After several research and experiments, they finally completed this invention.

[0005] Public content

[0006] The main objective of this invention is to provide a semiconductor test module with a temperature measurement component. By installing a temperature measurement component inside the cavity, in addition to improving the problem of temperature sensor signal lines breaking or abnormal sensing values ​​due to long-term repeated pulling in conventional technology, it can also reduce the generation of turbulence, maintain the temperature uniformity inside the cavity, and accurately measure the temperature change of the test tray.

[0007] To achieve the above objectives, the semiconductor testing module with a temperature measurement component of the present invention includes a cavity, a temperature measurement component, a test tray, and a probe component. The temperature measurement component is housed within the cavity and includes a hollow base, multiple hollow cylinders, and a guide plate. Each hollow cylinder has a cylinder temperature sensing unit passing through it and is fixed to the hollow base. The guide plate has at least one guide plate temperature sensing unit passing through it and is fixed to the hollow base. The test tray is supported on the cavity and is used to house multiple semiconductor devices. The probe component is located above the test tray and includes a test base, a test tray, a test probe holder, and probes, used to acquire test information from the multiple semiconductor devices.

[0008] The aforementioned column temperature sensing unit and at least one guide plate temperature sensing unit can be a thermistor, which is a type of sensor resistor. The material used is usually ceramic or polymer, and the resistance value changes with temperature. Therefore, the measured temperature can be calculated by measuring the resistance value.

[0009] The bottom surface of the hollow base can be formed with a slot to guide airflow of specific temperature and humidity into the slot.

[0010] The hollow base mentioned above includes an opening that is connected to a slot. The opening is used to guide airflow with a specific temperature and humidity into the slot.

[0011] The hollow base can be provided with multiple threaded holes with interconnected slots. Each hollow cylinder and each cylinder temperature sensing unit correspond to multiple semiconductor elements to measure the temperature of the multiple semiconductor elements.

[0012] The hollow base can be provided with multiple interconnected slotted screw holes. Each hollow column and each column temperature sensing unit corresponds to the test tray to measure the temperature distribution of the test tray.

[0013] The aforementioned guide plate can be screwed onto the hollow base; the hollow column can have a bolt portion for locking onto the hollow base. In this way, users can adjust the position or number of hollow columns, or replace guide plates of different specifications, to meet customized needs according to different test conditions.

[0014] The aforementioned guide plate and the test tray may have a gap to guide airflow of specific temperature and humidity to multiple semiconductor components on the test tray.

[0015] The temperature measuring component described above may have a support on each side. An airtight ring or an elastic layer is provided between the support and the cavity to ensure that the airflow cannot flow through the gap between the support and the cavity of the hollow base, thereby guiding the airflow in and out of the hollow column and the slot of the hollow base.

[0016] Furthermore, another semiconductor testing module with temperature measurement components according to the present invention includes a cavity, multiple temperature measurement components, a test tray, and a probe assembly. The cavity has at least one partition. Multiple temperature measurement components are housed within the cavity, each temperature measurement component being spaced apart by the partition and including a hollow base, multiple hollow cylinders, and a guide plate. Each hollow cylinder has a cylinder temperature sensing unit passing through it and is fixed to the hollow base, and the guide plate has at least one guide plate temperature sensing unit passing through it and is fixed to the hollow base. The test tray is supported on the cavity and is used to house multiple semiconductor devices. The probe assembly is located above the test tray and includes a test base, a test tray, a test probe holder, and a probe, used to acquire test information from the multiple semiconductor devices.

[0017] The aforementioned cavity and partition can form an opening to guide airflow with specific temperature and humidity into and out of multiple temperature measurement components.

[0018] Through the two designs described above, this invention maintains the temperature balance within the cavity, accurately measures the temperature change of the test tray, and ensures that the relative humidity error within the cavity can be controlled within 1%. This allows microelectromechanical system (MEMS) components such as pressure gauges or hygrometers to be tested in a stable environment, thereby improving the accuracy of the test.

[0019] The above overview and the following detailed description are illustrative in nature and are intended to further illustrate the claims of this invention. Other objects and advantages of this invention will be set forth in the following description and illustrations. Attached Figure Description

[0020] Figure 1 This is a cross-sectional view of a semiconductor test module with a temperature measurement component according to the first embodiment of the present invention.

[0021] Figure 2 This is a perspective view of the temperature measuring component according to the first embodiment of the present invention.

[0022] Figure 3 This is a partially enlarged view of the temperature measurement component according to the first embodiment of the present invention.

[0023] Figure 4 This is a schematic diagram of the three-dimensional airflow field of a semiconductor testing module with a temperature measurement component according to the first embodiment of the present invention.

[0024] Figure 5A and Figure 5B This is a cross-sectional schematic diagram of the airflow field of a semiconductor test module with a temperature measurement component according to the first embodiment of the present invention.

[0025] Figure 6A and Figure 6B This is a cross-sectional view of a semiconductor test module with a temperature measurement component according to a second embodiment of the present invention.

[0026] Figure 7 This is a cross-sectional view of a semiconductor test module with a temperature measurement component according to a third embodiment of the present invention.

[0027] Figure 8 This is a perspective view of a semiconductor testing module with a temperature measurement component according to the fourth embodiment of the present invention.

[0028] Figure 9 This is a cross-sectional view of a semiconductor test module with a temperature measurement component according to the fourth embodiment of the present invention.

[0029] Figure 10This is a top-view schematic diagram of the airflow field of a semiconductor test module with a temperature measurement component according to the fourth embodiment of the present invention.

[0030] Figure 11 This is a cross-sectional schematic diagram of the airflow field of a semiconductor test module with a temperature measurement component according to the fourth embodiment of the present invention.

[0031] Figure 12 This is a perspective view of the temperature measuring component according to the fifth embodiment of the present invention.

[0032] Figure 13A and Figure 13B This is a cross-sectional view of a semiconductor test module with a temperature measurement component according to the fifth embodiment of the present invention.

[0033] Explanation of reference numerals in the attached figures

[0034] 1a-1g: Semiconductor Test Module

[0035] 2, 2e: Cavity

[0036] 21: Partition

[0037] 21A: Through port

[0038] 211: Air Inlet

[0039] 222: Exhaust port

[0040] 3, 3d, 3e, 3e', 3f, 3g: Temperature measurement components

[0041] 31, 31': Hollow base

[0042] 310: Opening

[0043] 31A: Airtight Ring

[0044] 31B: Elastic layer

[0045] 311: Screw hole

[0046] 312: Guide port

[0047] 32: Hollow cylinder

[0048] 320: Bolt section

[0049] 321: Column Temperature Sensing Unit

[0050] 33, 33d: Guide plate

[0051] 331: Guide plate temperature sensing unit

[0052] 34: Support section

[0053] 35: Grooving

[0054] 4: Test carrier disk

[0055] 40: Storage Area

[0056] 41: Semiconductor components

[0057] 5: Probe assembly

[0058] 51: Test Base

[0059] 52: Test carrier board

[0060] 53: Needle probe socket

[0061] 54: Probe

[0062] D1, D2: Spacing Detailed Implementation

[0063] Please see Figures 1 to 5B The figures show a cross-sectional view, a perspective view, a partial enlarged view, a schematic diagram of the three-dimensional airflow field of the semiconductor testing module, and a cross-sectional airflow field schematic diagram of the semiconductor testing module, respectively, according to the first embodiment of the present invention. The figures illustrate a semiconductor testing module 1a with a temperature measurement component, comprising a cavity 2, a temperature measurement component 3, a test tray 4, and a probe component 5. The temperature measurement component 3 is housed within the accommodating space formed by the cavity 2, and includes a hollow base 31, multiple hollow cylinders 32, and a guide plate 33. In this embodiment, each hollow cylinder 32 has a bolt portion 320, which is locked onto a screw hole 311 of the hollow base 31, and each cylinder has a cylinder temperature sensing unit 321. This cylinder temperature sensing unit 321 is a thermistor, a type of sensor resistor, typically made of ceramic or polymer. Its resistance value changes with temperature, so the measured temperature can be calculated by measuring the resistance value. The guide plate 33 is screwed onto the hollow base 31 and has multiple guide plate temperature sensing units 331. Each guide plate temperature sensing unit 331 is also a thermistor, and its resistance value changes with the temperature. Therefore, the measured temperature can be calculated by measuring the resistance value.

[0064] Furthermore, the test tray 4 is supported on the cavity 2 and has multiple accommodating areas 40 for accommodating multiple semiconductor devices 41. The cylindrical temperature sensing unit 321 and the guide plate temperature sensing unit 331 are both located close to the test tray 4 to obtain temperature changes around the semiconductor devices 41. The probe assembly 5 is located above the test tray 4 and includes a test base 51 and a test plate 52 disposed within the test base 51. The test plate 52 is connected to a probe holder 53 and a probe 54 inserted within the probe holder 53 to obtain test information of the multiple semiconductor devices 41. A gap D1 exists between the guide plate 33 and the test tray 4 to guide airflow of specific temperature and humidity to the multiple semiconductor devices 41 on the test tray 4. Furthermore, please refer to... Figure 4 The hollow base 31 of the temperature measuring component 3 has support portions 34 on both sides, preventing airflow from flowing through the support portions 34 of the hollow base 31, and guiding the airflow into a slot 35 of the hollow base 31. In this way, the airflow can pass through multiple hollow columns 32 on the temperature measuring component 3 and the slot 35 below the hollow base 31 at the same time, so that the airflow with specific temperature and humidity can be convected and conducted to both ends of the column temperature sensing unit 321 and the guide plate temperature sensing unit 331, reducing the transient temperature difference between the two ends of the multiple column temperature sensing units 321 and the guide plate temperature sensing unit 331, thereby improving the accuracy of temperature measurement.

[0065] When airflow with specific temperature and humidity is input into cavity 2, since the airflow is input through air inlet 221 and discharged through air outlet 222, the airflow will form a unidirectional flow in cavity 2. First, the airflow enters the area between air inlet 221 and guide plate 33, and then the airflow begins to diffuse and flow. Guide plate 33 can be used to prevent most of the airflow from directly passing through cavity 2. The airflow is guided to test tray 4 and its multiple semiconductor components 41, thereby making the temperature and humidity of the airflow between test tray 4 and hollow base 31 uniform and stable, accelerating the stabilization of the test environment of semiconductor component 41, and making the test results of semiconductor component 41 highly accurate.

[0066] In addition, please refer to the following: Figure 5AThe hollow base 31 includes an opening 310, which is located on one side of the hollow base 31 and adjacent to the cavity 2. The opening 310 communicates with a slot 35 below the hollow base 31. A gap exists between the other side of the hollow base 31 and the cavity 2, forming a guide port 312. Because the airflow intake from the opening 310 is relatively large, the opening 310 can guide the airflow into the slot 35, making the opening 310 an intake end. The airflow flows from the opening 310 side of the hollow base 31 to the guide port 312 between the hollow base 31 and the cavity 2. Furthermore, the support portions 34 on both sides of the slot 35 are tightly connected to the cavity 2, preventing airflow from overflowing from both ends of the support portions 34. This ensures that the airflow entering the slot 35 has a fixed direction. Also, because the size of the guide port 312 between the hollow base 31 and the cavity 2 is smaller than the opening... 310, and the airflow flows out from the opening 310 through the guide port 312 at one end of the slot 35, presenting a stable flow direction, reducing the irregular disturbance of airflow in the cavity 2, maintaining good dynamic circulation of airflow in the cavity 2, thereby reducing the measurement error caused by temperature difference between the column temperature sensing unit 321 and the guide plate temperature sensing unit 331, and providing most of the airflow to the multiple semiconductor elements 41 on the test tray 4, so that the temperature and humidity of the multiple semiconductor elements 41 are maintained in a stable state.

[0067] Please refer to the following: Figure 5B In another preferred embodiment of the present invention, the hollow base 31' has no opening. When airflow enters between the hollow base 31 and the test tray 4, since the guide ports 312 between the two sides of the hollow base 31' and the cavity 2 are the same size, the airflow through the guide ports 312 on both sides is the same. The guide ports 312 on both sides can guide the airflow into the slots 35 at both ends, so that the transient temperature difference between the slot area 35 below the hollow base 31' and the area of ​​the multiple hollow pillars 32 and guide plates 33 above the hollow base 31' will not be too large, thus avoiding affecting the accuracy of temperature measurement of the pillar temperature sensing unit 321 and the guide plate temperature sensing unit 331, keeping the detection environment of the semiconductor element 41 in a stable state, thereby reducing the factors of measurement error of the semiconductor element 41.

[0068] Please see Figure 6A up Figure 6B These are cross-sectional views of a semiconductor test module with a temperature measurement component according to the second embodiment of the present invention. Figure 6A As shown in the figure, a semiconductor test module 1b is presented, wherein an airtight ring 31A can be added between the support 34 of the temperature measurement component 3 and the cavity 2; as Figure 6BAs shown in the figure, a semiconductor test module 1c is presented. An elastic layer 31B can be added between the support part 34 of the temperature measurement component 3 and the cavity 2 to ensure that the support part 34 of the hollow base 31 and the cavity 2 are tightly connected, so that the airflow cannot flow through the gap between the support part 34 of the hollow base 31 and the cavity 2, thereby guiding the airflow to enter and exit the hollow column 32 and the slot 35 of the hollow base 31 from a fixed direction. Furthermore, when the probe assembly 5 presses down on the test tray 4 to perform electrical testing, the airtight ring 31A or elastic layer 31B between the temperature measurement assembly 3 below the test tray 4 and the cavity 2 can provide the cylindrical temperature sensing unit 321 inserted in the hollow cylindrical body 32 and the guide plate temperature sensing unit 331 inserted in the guide plate 33 to adaptively float and press against the test tray 4 and the semiconductor element 41. The test tray 4 provides a pressure to contact the cylindrical temperature sensing unit 321 and the guide plate temperature sensing unit 331 and stay for a predetermined time, so that the multiple cylindrical temperature sensing units 321 and the guide plate temperature sensing units 331 can accurately measure the surface temperature of the test tray 4 and the semiconductor element 41 under test.

[0069] Please see Figure 7 This is a cross-sectional view of a semiconductor testing module with a temperature measurement component according to a third embodiment of the present invention. The figure also shows another semiconductor testing module 1d with a temperature measurement component, whose basic structure is the same as that of the first embodiment. The difference lies in that the temperature measurement component 3d in this embodiment can use guide plates 33d of different heights depending on the product's testing requirements. For example, when the thickness of different types of semiconductor elements 41 is large, a predetermined distance must still be maintained between the guide plate 33d and the test tray 4 or the semiconductor element 41 to prevent interference between the guide plate 33d and the test tray 4 or the semiconductor element 41, thereby blocking the movement of airflow or reducing the airflow volume, affecting the temperature or humidity conditions of the test tray 4 or the semiconductor element 41. Therefore, there is another gap D2 between the guide plate 33d and the test tray 4 to guide airflow of specific temperature and humidity to multiple semiconductor elements 41 on the test tray 4. The length of the gap D2 can be designed to be greater than the gap D1, increasing the airflow through the gap D2, further enabling the thicker semiconductor element 41 to achieve rapid heating or cooling.

[0070] Please see Figures 8 to 9 These are perspective and cross-sectional views of a semiconductor test module with temperature measurement components according to the fourth embodiment of the present invention. The figures show another semiconductor test module 1e with temperature measurement components, whose basic architecture is the same as the first embodiment. The difference is that the cavity 2e of this embodiment has a partition 21 and uses two sets of temperature measurement components 3e and 3e'. The partition 21 is used to separate the two sets of temperature measurement components 3e and 3e', but the number is not limited to the above; it can also be two partitions 21 with three sets of temperature measurement components, and so on.

[0071] Please refer to the following: Figure 10 and Figure 11 These are schematic diagrams, respectively, of the top view and cross-sectional view of the airflow field of the semiconductor test module with temperature measurement components according to the fourth embodiment of the present invention. In this embodiment, two temperature measurement components 3e and 3e' are respectively separated by partitions 21 and housed in a cavity 2e. The cavity 2e includes an air inlet 221 and an exhaust outlet 222, wherein the air inlet 221 and the exhaust outlet 222 are respectively disposed on opposite sides of the cavity 2e. The air inlet 221 is used to provide airflow with specific temperature and humidity, while the exhaust outlet 222 has the ability to draw in gas, and is used to guide and recover the airflow provided by the air inlet 221, so that the airflow generates a pressure difference in the cavity 2e and forms an airflow direction from the air inlet 221 to the exhaust outlet 222.

[0072] When the airflow enters through the air inlet 221 of the cavity 2e, it flows through the area of ​​the temperature measuring component 3e. At this time, because the support part 34 of the hollow base 31 of the temperature measuring component 3e is tightly connected to the cavity 2e, or an airtight ring 31A or elastic layer 31B is set between the support part 34 and the cavity 2e, the airflow can only pass through the area between the hollow base 31 and the test tray 4 and the slot 35 of the hollow base 31 respectively. After the airflow enters the cavity 2e, it first flows and diffuses between the air inlet 221 and the guide plate 33, and the airflow simultaneously enters the slot 35. When the flow rate of the airflow entering the cavity 2e reaches a certain amount, the airflow then flows along the distance D1 between the guide plate 33 and the test tray 4, allowing the airflow to enter the area on the other side of the guide plate 33 and flow towards the partition 21; then, the airflow is obstructed by the partition 21. Therefore, the airflow needs to enter the area of ​​the temperature measuring component 3e' through the opening 21A below the partition 21. The opening 21A can be, for example, a gap formed between the partition 21 and the cavity 2e, or an opening on the partition 21 adjacent to the cavity 2e. The airflow passes through the area of ​​the temperature measuring component 3e' in the same manner as the temperature measuring component 3e, and finally exits through the exhaust port 222 of the cavity 2e. The design of the opening 21A of the partition 21 and the spacing D1 of the guide plate 33 allows the airflow to generate a specific flow path, reducing turbulence and stagnation. Furthermore, when the airflow passes through the opening 21A and spacing D1 at different heights, the airflow velocity increases due to the narrow gap between the opening 21A and spacing D1, thus quickly guiding the airflow to the temperature measuring components 3e and 3e'. In this way, the partition 21 effectively prevents the mutual influence of transient temperatures between different temperature measuring components 3e and 3e', providing an accurate test temperature and humidity environment.

[0073] According to the spirit of the present invention, after airflow with a specific temperature and humidity enters the cavity 2e, a humidity detector is used to detect the humidity value of the cavity 2e. For example, the humidity value is detected in the range of 5%-95%. After the airflow reaches a stable state, the humidity value at each point is detected. After detection, the error of the relative humidity value at each point in the cavity 2e is less than 1%. It can be seen that the structural design of the cavity 2e can ensure that the airflow is uniform in the cavity 2e, and can maintain the cavity 2e in a stable state with a specific temperature and humidity, thereby reducing the test error of the semiconductor device 41 caused by the environmental conditions and improving the accuracy of the test.

[0074] Please see Figure 12 , Figure 13A and Figure 13B These are, respectively, a perspective view of the temperature measurement component and a cross-sectional view of the semiconductor testing module according to the fifth embodiment of the present invention. Figure 12 As shown, in this embodiment, the temperature measurement component 3f has multiple screw holes 311 extending into the slot 35 of the hollow base 31. The positions of the multiple screw holes 311 can correspond to the multiple semiconductor elements 41 placed in the test tray 4 on the semiconductor test module 1f; or, the positions of the multiple screw holes 311 can correspond to the test tray 4 on the semiconductor test module 1g, so that the cylindrical temperature sensing unit 321 in the hollow cylinder 32 can selectively measure the temperature of the test tray 4 or the semiconductor element 41. Figure 13A As shown, the cylindrical temperature sensing unit 321 of the temperature measurement assembly 3f can be flexibly mounted on the semiconductor element 41 on the corresponding test tray 4 as needed to measure the temperature change of the semiconductor element 41. Furthermore... Figure 13B As shown, the column temperature sensing units 321 of the temperature measurement component 3g are arranged in an array in a specific area corresponding to the test tray 4 to measure the temperature change of the test tray 4. In this way, users can adjust the position or number of hollow columns, or replace guide plates of different specifications, according to different test conditions to meet customized temperature measurement needs; or when the column temperature sensing unit 321 or the guide plate temperature sensing unit 331 needs maintenance or replacement, the hollow column 32 and column temperature sensing unit 321 or the guide plate 33 and guide plate temperature sensing unit 331 can be directly replaced, offering the advantage of fast maintenance time.

[0075] Through the above embodiments, in addition to improving the problem of temperature sensor signal lines breaking or abnormal sensing values ​​due to long-term repeated pulling in conventional technology, the present invention can also reduce the generation of turbulence, maintain the temperature balance in the cavity, accurately measure the temperature change of the test tray, and ensure that the relative humidity error value in the cavity can be controlled within 1%. This allows microelectromechanical system components such as pressure gauges or hygrometers to be tested in a stable environment, improving the accuracy of the test.

[0076] The above embodiments are merely illustrative examples for ease of explanation. The scope of the claims of this invention should be determined by the claims themselves, and not limited to the above embodiments.

Claims

1. A semiconductor test module with a temperature measurement component, characterized in that, Including: One cavity; A temperature measuring component is housed in the cavity and includes a hollow base, a plurality of hollow cylinders and a guide plate. Each hollow cylinder is provided with a cylinder temperature sensing unit and is fixed on the hollow base. The guide plate is provided with at least one guide plate temperature sensing unit and is fixed on the hollow base. A test tray, supported on the cavity, is used to house multiple semiconductor devices; as well as A probe assembly, located above the test carrier, includes a test base, a test carrier plate connected to the test base, a probe socket connected to the test carrier plate, and multiple probes disposed on the probe socket to obtain test information of the multiple semiconductor devices.

2. The semiconductor test module with temperature measurement component according to claim 1, characterized in that, The column temperature sensing unit and the at least one guide plate temperature sensing unit are thermistors.

3. The semiconductor test module with temperature measurement components according to claim 1, characterized in that, The bottom surface of the hollow base has a slot to guide airflow with specific temperature and humidity into the slot.

4. The semiconductor test module with temperature measurement components according to claim 3, characterized in that, The hollow base includes an opening that communicates with the slot, and the opening is used to guide airflow with a specific temperature and humidity into the slot.

5. The semiconductor test module with a temperature measurement component according to claim 3, characterized in that, The hollow base has multiple screw holes that connect to the slot. Each hollow cylinder and each cylinder temperature sensing unit correspond to the multiple semiconductor elements to measure the temperature of the multiple semiconductor elements.

6. The semiconductor test module with a temperature measurement component according to claim 3, characterized in that, The hollow base has multiple screw holes that connect to the slot. Each hollow cylinder and each cylinder temperature sensing unit correspond to the test tray to measure the temperature distribution of the test tray.

7. The semiconductor test module with temperature measurement components according to claim 1, characterized in that, The guide plate is screwed onto the hollow base.

8. The semiconductor test module with a temperature measurement component according to claim 1, characterized in that, The hollow column has a bolt portion for fastening to the hollow base.

9. The semiconductor test module with a temperature measurement component according to claim 1, characterized in that, The guide plate has a gap with the test tray to guide airflow with specific temperature and humidity to the multiple semiconductor elements on the test tray.

10. The semiconductor test module with a temperature measurement component according to claim 1, characterized in that, The temperature measuring component has a support on each side, and an airtight ring or an elastic layer is provided between the support and the cavity.

11. A semiconductor test module with a temperature measurement component, characterized in that, Including: A cavity having at least one partition; Multiple temperature measuring components are housed in the cavity. Each temperature measuring component is separated by the partition and includes a hollow base, multiple hollow columns and a guide plate. Each hollow column is provided with a column temperature sensing unit and fixed on the hollow base. The guide plate is provided with at least one guide plate temperature sensing unit and fixed on the hollow base. A test tray, supported on the cavity, is used to house multiple semiconductor devices; as well as A probe testing assembly is located above the test carrier. The probe testing assembly includes a test base, a test carrier connected to the test base, a probe holder connected to the test carrier, and multiple probes disposed on the probe holder to obtain test information of the multiple semiconductor devices.

12. The semiconductor test module with a temperature measurement component according to claim 11, characterized in that, The cavity and the partition form an opening to guide airflow with specific temperature and humidity into and out of the multiple temperature measuring components.

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