Drive platform and laser processing apparatus

Abstract

The application discloses a driving platform and a laser processing device. The driving platform is used for driving a wafer carried to rotate. The driving platform comprises a mounting table, a driven wheel, a driving wheel set and a driving member. The driven wheel is rotatably arranged on the mounting table. The driving wheel set comprises a first driving wheel and a second driving wheel. The first driving wheel and the second driving wheel are arranged at the periphery of the driven wheel in a spaced manner. The first driving wheel and the second driving wheel are engaged with the driven wheel and respectively abut against the convex teeth on different sides of the driven wheel. The driving member is in transmission connection with the driving wheel set to drive the first driving wheel and the second driving wheel to synchronously rotate forward or reversely. The application aims to realize accurate and stable loading of the wafer through the driving platform, so that the wafer is in a determined and accurate position during laser processing, and the precision of laser processing of the wafer is enhanced.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and in particular to a drive platform and a laser processing device using the drive platform. Background Technology

[0002] In recent years, with the rapid development of the optoelectronic industry, the demand for highly integrated and high-performance semiconductor wafers has been increasing, and various laser processing methods for wafers have been widely used. In the process of laser processing wafers, it is necessary to rotate or move the wafer through a transmission mechanism to adjust its processing position so that the wafer can reach a specific position for laser processing.

[0003] In traditional technologies, the transmission mechanism that carries the wafer has a backlash, such as the backlash between the driving and driven gears. This causes a mismatch between the driven and driving gears when the existing transmission mechanism starts or changes direction. In other words, the driven gear carrying the wafer will lag, which prevents the wafer from moving to the designated processing position, increasing the error in laser processing and reducing the accuracy of wafer processing. Summary of the Invention

[0004] The main objective of this invention is to provide a driving platform and laser processing equipment, which aims to achieve accurate and stable loading of wafers through the driving platform, so that the wafers are in a definite and accurate position during laser processing, thereby enhancing the precision of wafer laser processing.

[0005] To achieve the above objectives, the present invention proposes a driving platform for use in laser processing equipment, the driving platform comprising:

[0006] Installation platform;

[0007] Driven wheel, the driven wheel being rotatably mounted on the mounting platform;

[0008] A drive gear assembly, comprising a first drive gear and a second drive gear, the first drive gear and the second drive gear being spaced apart around the periphery of the driven gear, both the first drive gear and the second drive gear meshing with the driven gear and respectively abutting against different sides of the teeth of the driven gear; and

[0009] A driving component is connected to the drive wheel assembly to drive the first drive wheel and the second drive wheel to rotate synchronously forward or in reverse.

[0010] In one embodiment, the mounting platform is further provided with a mounting plate, which is disposed adjacent to the driven wheel. The first driving wheel and the second driving wheel are rotatably disposed on the same side of the mounting plate. The driving member is mounted on the side of the mounting plate opposite to the first driving wheel and is connected to the driving wheel assembly for transmission.

[0011] In one embodiment, the drive wheel assembly further includes an idler wheel system, which is located on the same side of the mounting plate as the first drive wheel and the second drive wheel, and is located between the first drive wheel and the second drive wheel. The idler wheel system, the first drive wheel, and the second drive wheel are connected by a drive belt, and the drive member is connected to the idler wheel system.

[0012] In one embodiment, the first driving wheel is provided with a first meshing part and a first transmission part, the first meshing part and the first transmission part are coaxially arranged, the first meshing part meshes with the driven wheel and abuts against one side of the tooth of the driven wheel, and the first transmission part is connected to the idler wheel system through the transmission belt;

[0013] The second driving wheel is provided with a second meshing part and a second transmission part. The second driving wheel and the second transmission part are coaxially arranged. The second meshing part meshes with the driven wheel and abuts against the other side of the tooth of the driven wheel. The second transmission part is connected to the idler wheel system through the transmission belt.

[0014] In one embodiment, the idler train includes:

[0015] A fixed gear assembly, wherein the fixed gear assembly is connected to the driven component for transmission to receive the power output by the driven component; and

[0016] The moving pulley assembly is connected to the first driving pulley, the second driving pulley, and the fixed pulley assembly via the transmission belt, and is used to adjust the tension of the transmission belt.

[0017] In one embodiment, the fixed pulley group includes a drive wheel and two adjusting wheels. The two adjusting wheels are respectively disposed on both sides of the drive wheel. The drive wheel is connected to the drive component. Both adjusting wheels are located on the outer side of the transmission belt and are used to adjust the wrap angle of the transmission belt.

[0018] In one embodiment, the mounting plate has two guide grooves adjacent to the second drive wheel, and each guide groove has a guide block that can slide along the guide groove. The drive wheel assembly includes two drive wheels, and each drive wheel is mounted on one of the guide blocks so that the drive wheel can slide along the guide groove for adjusting the tension of the transmission belt.

[0019] The present invention also proposes a laser processing device, the laser processing device comprising:

[0020] The drive platform described above;

[0021] A positioning system, wherein the positioning system is located above the drive platform and is oriented towards the drive platform; and

[0022] A laser is positioned on the other side of the drive platform relative to the positioning system. The laser emits a laser beam that passes through the drive platform to perform laser processing on the wafer.

[0023] In one embodiment, the positioning system includes:

[0024] The support arm has one end mounted on the mounting platform and the other end extending above the drive platform to form a mounting end.

[0025] A light-emitting component is mounted on the mounting end. The light-emitting component includes a housing and an optical module. The housing encloses a light-guiding cavity, and the optical module is mounted in the light-guiding cavity. The housing has a first opening and a second opening with mutually perpendicular axes. The first opening and the second opening are connected to the light-guiding cavity. The first opening faces the driving platform and is directly opposite the optical module. The direction of the axis of the second opening is parallel to the plane of the driving platform.

[0026] A positioning component is mounted on the mounting end adjacent to the light-emitting component. The positioning component includes a positioning element and a lens. One end of the lens is connected to the positioning element, and the other end of the lens is connected to the second opening, so that the axis of the lens coincides with the axis of the second opening.

[0027] In one embodiment, the optical module includes a light source and a light guide mirror. The light source is horizontally placed in the light guide cavity facing the driving platform. The light guide mirror is inclinedly disposed in the light guide cavity and located between the light source and the first opening. The light guide mirror is disposed on one side facing the first opening and the second opening.

[0028] The light source emits light, which passes through the light guide mirror and the first opening in sequence to illuminate the wafer. The wafer reflects the light, which is then reflected a second time by the light guide mirror. The light then passes through the second opening and the lens and enters the positioning element to locate the position of the wafer.

[0029] The driving platform of this invention features a mounting platform for mounting driven wheels. These driven wheels load and secure the wafer, allowing the laser processing position of the wafer to be processed to be changed by the rotation of the driven wheels. The driving wheel assembly includes a first driving wheel and a second driving wheel, both meshing with the driven wheels and spaced apart around the periphery of the driven wheels. This ensures that the first and second driving wheels rotate synchronously when the driven wheels rotate forward or backward. Furthermore, the first and second driving wheels abut against two tooth surfaces on different sides of the driven wheel's teeth. This ensures that when the driving wheel assembly starts driving the driven wheels or changes direction, the backlash between the driven wheels and the driving wheel assembly remains between the abutting tooth surfaces of the first and second driving wheels and the driven wheels. This maintains consistent movement between the driven wheels and the driving wheel assembly, eliminating backlash caused by meshing idle time and motion lag caused by the driven wheels. This driving platform can accurately position the wafer at the predetermined processing location, increasing the precision of wafer laser processing. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of the driving platform in one embodiment of the present invention;

[0032] Figure 2 This is a schematic diagram of the mounting platform and the drive wheel assembly in one embodiment of the present invention;

[0033] Figure 3 This is a schematic diagram of the active wheel assembly in one embodiment of the present invention;

[0034] Figure 4 This is a schematic diagram of the positioning system in one embodiment of the present invention;

[0035] Figure 5 This is a schematic diagram of the structure of a light-emitting component in one embodiment of the present invention;

[0036] Figure 6 This is a schematic diagram of the structure of a laser processing device in one embodiment of the present invention.

[0037] Explanation of icon numbers:

[0038]

[0039]

[0040] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0042] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0043] Meanwhile, the meaning of "and / or" or "and / or" appearing throughout the text is that it includes three options. Taking "A and / or B" as an example, it includes option A, option B, or an option that satisfies both A and B.

[0044] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0045] In recent years, with the rapid development of the optoelectronic industry, the demand for highly integrated and high-performance semiconductor wafers has been increasing, and various laser processing methods for wafers have been widely used. In the process of laser processing wafers, it is necessary to rotate or move the wafer through a transmission mechanism to adjust its processing position so that the wafer can reach a specific position for laser processing.

[0046] In traditional technologies, the transmission mechanism that carries the wafer has a backlash, such as the backlash between the driving and driven gears. This causes a mismatch between the driven and driving gears when the existing transmission mechanism starts or changes direction. In other words, the driven gear carrying the wafer will lag, which prevents the wafer from moving to the designated processing position, increasing the error in laser processing and reducing the accuracy of wafer processing.

[0047] Based on the above concepts and problems, this invention proposes a drive platform 100, which carries the wafer to be processed. By changing the processing position of the wafer, the wafer is positioned at an accurate processing station. Then, the positioning system 600 positions the wafer, and the positioned data is transmitted to a laser for laser processing. The drive platform 100 has a first driving wheel 31 and a second driving wheel 32 arranged around the driven wheel 2. This allows the first driving wheel 31 and the second driving wheel 32 to abut against the tooth surfaces on different sides of the driven wheel 2 during startup or when switching between forward and reverse rotation, eliminating backlash caused by meshing idle time and improving the accuracy of wafer laser processing.

[0048] Please refer to the reference. Figures 1 to 6 As shown, in this embodiment of the invention, the drive platform 100 is applied in a laser processing equipment 700. The drive platform 100 includes a mounting platform 1, a driven wheel 2, a drive wheel set 3, and a drive component 4. The driven wheel 2 is rotatably mounted on the mounting platform 1. The drive wheel set 3 includes a first drive wheel 31 and a second drive wheel 32. The first drive wheel 31 and the second drive wheel 32 are spaced apart around the periphery of the driven wheel 2. Both the first drive wheel 31 and the second drive wheel 32 mesh with the driven wheel 2 and abut against different sides of the convex teeth of the driven wheel 2. The drive component 4 is connected to the drive wheel set 3 for transmission, so as to drive the first drive wheel 31 and the second drive wheel 32 to rotate synchronously forward or synchronously reverse.

[0049] In this embodiment, the drive platform 100 is provided with a mounting platform 1, which is a structural support component of the drive platform 100. It is used to install and place the driven wheel 2, the drive wheel assembly 3, and the drive component 4. The mounting platform 1 can be a base, a mounting frame, or a frame, and is not limited here. One end of the mounting platform 1 is fixed, and the other end is equipped with a rotatable driven wheel 2. The driven wheel 2 is used to support and fix the wafer to be processed. A limiting plate is installed at the end of the driven wheel 2 away from the mounting platform 1. A limiting groove for placing the wafer 5 is opened in the center of the limiting plate. The position of the wafer 5 placed in the limiting groove does not change. The limiting plate is provided with an opening for laser processing on the surface of the wafer 5. The limiting plate rotates together with the driven wheel 2 to realize laser processing on a specific position on the surface of the wafer 5.

[0050] In this embodiment, as Figure 1As shown, a first driving wheel 31 and a second driving wheel 32 are also provided at intervals around the driven wheel 2. The first driving wheel 31 and the second driving wheel 32 are both engaged with the driven wheel 2 and abut against different sides of the teeth around the driven wheel 2. The first driving wheel 31 and the second driving wheel 32 are also connected by a transmission belt, so that the first driving wheel 31 and the second driving wheel 32 can move synchronously with the driven wheel 2. The driving member 4 is connected to the driving wheel group 3 to drive the first driving wheel 31 and the second driving wheel 32 to drive the driven wheel 2 to rotate synchronously forward or in reverse.

[0051] Understandably, the driven wheel 2 has protruding teeth on its periphery, and there is a tooth gap between the teeth. When the first driving wheel 31 and the second driving wheel 32 mesh with the driven wheel 2, the teeth of the first driving wheel 31 and the second driving wheel 32 cannot completely occupy the tooth gap of the driven wheel 2, and there is a gap. The two sides of the tooth gap have different sides, so that when the first driving wheel 31 or the second driving wheel 32 drives the driven wheel 2 to rotate, the tooth surface on one side of the first driving wheel 31 and the second driving wheel 32 contacts the tooth surface of the driven wheel 2, while the other side leaves a side gap. When the driving component 2 drives the drive wheel assembly 3 to rotate clockwise, that is, the first drive wheel 31 drives the driven wheel 2 to rotate, the first drive wheel 31 and the second drive wheel 32 rotate counterclockwise, and the driven wheel 2 rotates clockwise. The tooth surface of the first drive wheel 31 along the rotation direction contacts the tooth surface of the driven wheel 2 along the rotation direction, and the tooth surface of the driven wheel 2 away from the rotation direction contacts the tooth surface of the second drive wheel 32 away from the rotation direction. Thus, the side clearance between the first drive wheel 31 and the driven wheel 2 and the side clearance between the second drive wheel 32 and the driven wheel 2 exist between the first drive wheel 31 and the second drive wheel 32.

[0052] Similarly, when the driving component 2 drives the drive gear set 3 to reverse, the second drive gear 32 becomes the driving gear, driving the driven gear 2 to rotate. The tooth surfaces of the second drive gear 32 and the driven gear 2 that come into contact with each other are all on one side along the direction of gear rotation, while the tooth surfaces of the driven gear 2 and the first drive gear 31 that come into contact are all on the side away from the direction of rotation. As a result, the side clearance between the second drive gear 32 and the driven gear 2, as well as the side clearance between the first drive gear 31 and the driven gear 2, exist between the second drive gear 32 and the first drive gear 31.

[0053] Understandably, when the drive wheel assembly 3 drives the driven wheel 2 to rotate synchronously forward or in reverse, the backlash between the drive wheel assembly 3 and the driven wheel 2 always exists between the first drive wheel 31 and the second drive wheel 32. When the driven wheel 2 is started or its rotation direction is changed, the backlash remains unchanged, ensuring that the driven wheel 2 moves in a consistent manner with the drive wheel assembly. This eliminates backlash caused by backlash or idle time, thereby allowing the limiting plate carrying the wafer 5 to move accurately to the predetermined processing position, increasing the precision of wafer laser processing.

[0054] The drive platform 100 of this technical solution is provided with a mounting table 1 for mounting driven wheels 2, and the driven wheels 2 load and fix the wafer 5, so that the laser processing position of the wafer 5 to be processed is changed by the rotation of the driven wheels 2. The drive wheel assembly 3 includes a first drive wheel 31 and a second drive wheel 32. Both the first drive wheel 31 and the second drive wheel 32 are engaged with the driven wheel 2 and are spaced apart around the periphery of the driven wheel 2 to ensure that the first drive wheel 31 and the second drive wheel 32 can rotate synchronously when the driven wheel 2 rotates forward or backward. The first drive wheel 31 and the second drive wheel 32 respectively abut against two tooth surfaces on different sides of the convex teeth of the driven wheel 2. When the drive wheel assembly 3 drives the driven wheel 2 to start or change the direction of movement, the side clearance between the driven wheel 2 and the drive wheel assembly 3 is always between the abutting tooth surfaces of the first drive wheel 31 and the second drive wheel 32 and the driven wheel 2. This ensures that the driven wheel 2 and the drive wheel assembly 3 move in a consistent manner, eliminating backlash caused by meshing backlash and motion lag caused by the driven wheel 2. The drive platform 100 can be accurately positioned at the predetermined processing position of the wafer 5, increasing the accuracy of laser processing of the wafer 5.

[0055] In one embodiment, the mounting platform 1 is further provided with a mounting plate 11, which is located adjacent to the driven wheel 2. The first driving wheel 31 and the second driving wheel 32 are rotatably located on the same side of the mounting plate 11. The driving member 4 is installed on the side of the mounting plate 11 facing away from the first driving wheel 31 and is connected to the driving wheel group 3 for transmission.

[0056] In this embodiment, as Figure 1 and Figure 2 As shown, the mounting plate 11 is mounted on the mounting platform 1 and is positioned adjacent to the periphery of the driven wheel 2. The plane of the mounting plate 11 is parallel to the circumferential plane of the driven wheel 2. A driving component 4 is mounted on one side of the mounting plate 11, and a drive wheel assembly 3 is mounted on the side opposite to the driving component 4. The mounting plate 11 can be mounted on the mounting platform 1 by side mounting, with the drive wheel assembly 3 and the driving component 4 mounted on the upper and lower sides respectively; alternatively, the mounting plate 11 can be mounted on the mounting platform 1 by a mounting bracket, frame, or other structure, forming an open cavity for placing the driving component 4 or the drive wheel assembly 3. The first drive wheel 31 and the second drive wheel 32 in the drive wheel assembly 3 can both be rotatably mounted on the side of the mounting plate 11 opposite to the driving component 4, and simultaneously maintain a meshing relationship with the driven wheel 2.

[0057] Understandably, the first driving wheel 31 and the second driving wheel 32 are connected by a transmission belt to maintain synchronous meshing with the driven wheel 2 and maintain consistent motion. The driving component 4 is connected to the driving wheel set 3 by a power output shaft. The power output shaft of the driving component 4 can be directly connected to the driving wheel set 3, that is, the driving component 4 is placed vertically in a direction perpendicular to the mounting plate 11. Preferably, to save space, the power output shaft of the driving component 4 can also be placed horizontally in a direction parallel to the mounting plate 11. The horizontal power output of the driving component 4 can be converted into a vertical power output by a component that changes the transmission direction, such as a worm gear mechanism or a bevel gear structure.

[0058] In one embodiment, the drive wheel assembly 3 further includes an idler wheel system 33. The idler wheel system 33, the first drive wheel 31, and the second drive wheel 32 are all located on the same side of the mounting plate 11, and the idler wheel system 33 is located between the first drive wheel 31 and the second drive wheel 32. The idler wheel system 33, the first drive wheel 31, and the second drive wheel 32 are connected by a transmission belt, and the drive member 4 is connected to the idler wheel system 33.

[0059] In this embodiment, as Figures 1 to 3 As shown, an idler gear system 33 is provided on one side of the mounting plate 11 where the first drive wheel 31 and the second drive wheel 32 are located. The idler gear system 33 is located between the first drive wheel 31 and the second drive wheel 32 and is used to connect the transmission belt of the first drive wheel 31 and the second drive wheel 32. The belt meanders through the idler gear system 33 so as to connect the idler gear system 33, the first drive wheel 31 and the second drive wheel 32 through the transmission belt.

[0060] Understandably, the mounting plate 11 has through holes through which the output shaft of the drive component 4 passes, connecting to the idler gear system 33 for power transmission. The idler gear system 33 then transmits power to the first drive pulley 31 and the second drive pulley 32 via a transmission belt, forming a rotating unit. The idler gear system 33 is used to adjust the tension and wrap angle of the transmission belt connecting the first drive pulley 31 and the second drive pulley 32 to appropriately increase friction and improve the transmission capacity of the transmission belt. It can also change the position of the transmission belt to avoid motion interference between the transmission belt and other components of the drive platform 100.

[0061] In one embodiment, the first driving wheel 31 is provided with a first meshing part 311 and a first transmission part 312, which are coaxially arranged. The first meshing part 311 meshes with the driven wheel 2 and abuts against one side of the tooth of the driven wheel 2. The first transmission part 312 is connected to the idler gear system 33 via a transmission belt. The second driving wheel 32 is provided with a second meshing part 321 and a second transmission part 322, which are coaxially arranged. The second meshing part 321 meshes with the driven wheel 2 and abuts against the other side of the tooth of the driven wheel 2. The second transmission part 322 is connected to the idler gear system 33 via a transmission belt.

[0062] In this embodiment, as Figure 3 As shown, the first driving wheel 31 has a coaxial first engagement part 311 and a first transmission part 312, and the second driving wheel 32 has a coaxial second engagement part 321 and a second transmission part 322. The first engagement part 311 and the first transmission part 312 rotate synchronously, and the second engagement part 321 and the second transmission part 322 transmit power synchronously. Therefore, the first engagement part 311 and the first transmission part 312, as well as the second engagement part 321 and the second transmission part 322, can be fixed together by welding, integral molding, etc., or they can be movably connected together by bolt connection, screw connection, pin connection, or boss connection, etc., which is not limited here. Among them, the first engagement part 311 and the second engagement part 321 engage with the convex teeth on the periphery of the driven wheel 2, and the first engagement part 311 and the second engagement part 321 respectively abut against different sides of the convex teeth of the driven wheel 2.

[0063] Understandably, the first meshing part 311 and the second meshing part 321 abut against different sides of the convex teeth of the driven wheel 2, so that the side clearance after the first driving wheel 31 and the second driving wheel 32 mesh with the driven wheel 2 is located between the first driving wheel 31 and the second driving wheel 32. When the driving wheel group 3 drives the driven wheel 2 to rotate synchronously forward or synchronously in reverse, the position of the side clearance is always between the first driving wheel 31 and the second driving wheel 32, and will not affect the transmission of the driven wheel 2, so that the movement of the driven wheel 2 is consistent with that of the driving wheel group 3, and the motion backlash of the driven wheel 2 is eliminated.

[0064] Understandably, the transmission belt is fitted onto the first transmission part 312 and the second transmission part 322 so that the first drive pulley 31 and the second drive pulley 32 are connected by transmission; and the first transmission part 312 and the second transmission part 322 are also connected to the idler gear system 33 by transmission belt, so that the first drive pulley 31, the second drive pulley 32, the idler gear system 33 and the transmission belt together form the drive pulley group 3.

[0065] In one embodiment, the idler gear system 33 includes a fixed pulley group 331 and a moving pulley group 332. The fixed pulley group 331 is connected to the driven component 4 to receive the power output by the driven component 4. The moving pulley group 332 is connected to the first driving pulley 31, the second driving pulley 32 and the fixed pulley group 331 through a transmission belt to adjust the tension of the transmission belt.

[0066] In this embodiment, as Figure 2 and Figure 3 As shown, the idler gear system 33 includes a fixed gear group 331 with a fixed rotation axis and a movable gear group 332 with a movable rotation axis. The fixed gear group 331 and the movable gear group 332 are located on the side of the mounting plate 11 facing away from the driving member 4, and both the fixed gear group 331 and the movable gear group 332 are located between the first driving gear 31 and the second driving gear 32. Through the through hole opened in the mounting plate 11, the fixed gear group 331 is connected to the output shaft of the driving member 4 for transmission. The movable gear group 332 is located adjacent to the first driving gear 31 or the second driving gear 32. Preferably, the movable gear group 332 is located adjacent to the second driving gear 32.

[0067] Understandably, the fixed pulley assembly 331 is used to transmit the power output from the drive component 4 to the drive pulley assembly 3, and then transmits the power to the first drive pulley 31 or the second drive pulley 32 via a transmission belt to drive the driven pulley 2 to rotate synchronously forward or in reverse. The drive pulley assembly 332 can move in one direction on the mounting plate 11 to adjust the engagement angle between the adjacent first drive pulley 31 or second drive pulley 32 and the driven pulley 2, ensuring a tight abutting engagement with the driven pulley 2 to maintain transmission stability. At the same time, moving the drive pulley assembly 332 can also adjust the tension of the transmission belt and the wrap angle of the transmission belt on the first drive pulley 31 and the second drive pulley 32.

[0068] In one embodiment, the fixed pulley group 331 includes a drive pulley 3311 and two adjusting pulleys 3312. The two adjusting pulleys 3312 are respectively disposed on both sides of the drive pulley 3311. The drive pulley 3311 is connected to the drive member 4 for transmission. The two adjusting pulleys 3312 are both located on the outer side of the transmission belt and are used to adjust the wrap angle of the transmission belt.

[0069] In this embodiment, as Figure 3 As shown, the drive wheel 3311 is connected to the drive component 4 via a through hole on the mounting plate 11. Two adjusting wheels 3312 are located on both sides of the drive wheel 3311, creating a gap between the two adjusting wheels 3312 and the drive wheel 3311. The transmission belt meanders through the gap, with its outer side connected to the two adjusting wheels 3312 and its inner side connected to the drive wheel 3311. The enclosed space formed by the transmission belt is defined as the inner side, and the open space on the other side, bounded by the transmission belt, is defined as the outer side.

[0070] Understandably, the transmission belt wraps around the periphery of the first transmission section 312 on its inner side and exits from the first transmission section 312. It then connects to an adjusting wheel 3312 on its outer side, entering the gap formed between the adjusting wheel 3312 and the drive wheel 3311. The inner side of the transmission belt wraps around the periphery of the drive wheel 3311 and exits again from another adjusting wheel 3312, entering the drive wheel assembly 332. This arrangement allows for increased tension of the transmission belt through the two adjusting wheels 3312, effectively increasing the wrap angle, improving transmission capacity, and making the overall transmission smoother, thereby improving the precision of laser processing.

[0071] In one embodiment, the mounting plate 11 has two guide grooves 111 near the second drive wheel 32. Each guide groove 111 has a guide block 1111 that can slide along the guide groove 111. The drive wheel assembly 332 includes two drive wheels 3321. Each drive wheel 3321 is mounted on a guide block 1111 so that the drive wheel 3321 can slide along the guide groove 111 for adjusting the tension of the drive belt.

[0072] In this embodiment, as Figure 2 As shown, the two guide grooves 111 can be located adjacent to the second drive wheel 32 or adjacent to the first drive wheel 31, and are not limited here. The two guide grooves 111 are formed on the side of the mounting plate 11 where the drive wheel assembly 3 is located, and the two guide grooves 111 are at a certain angle. Preferably, the drive wheel assembly 332 has two drive wheels 3321 on both sides of the second drive wheel 32, and a guide block 1111 that can slide along the guide groove 111 is provided in the guide groove 111, with a drive wheel 3321 on each guide block 1111. It can be understood that the drive wheel 3321 is mounted on the guide block 1111 so that the drive wheel 3321 can slide in the guide groove 111 through the guide block 1111 to adjust the position of the drive wheel 3321. Preferably, one drive pulley 3321 is located on the outer side of the transmission belt and the other drive pulley 3321 is located on the inner side of the transmission belt, so that when the drive pulley 3321 is adjusted, the tension of the transmission belt is adjusted, and the transmission belt is adjusted to the side away from the driven pulley 2, so as to avoid motion interference between the transmission belt and the driven pulley 2.

[0073] The present invention also proposes a laser processing apparatus 700, which includes the aforementioned drive platform 100, positioning system 600, and laser. The positioning system 600 is located above the drive platform 100 and faces it. The laser is positioned on the other side of the drive platform 100 relative to the positioning system 600. The laser emits a laser beam that passes through the drive platform to perform laser processing on the wafer 5. The specific structure of the drive platform 100 is as described in the foregoing embodiments. Since this processing apparatus adopts all the technical solutions of all the foregoing embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the foregoing embodiments, which will not be elaborated further here.

[0074] Understandable, such as Figure 1 and Figure 6 As shown, the driven wheel 2 is hollow, and a limiting plate for placing and fixing the wafer 5 is provided on the driven wheel 2. The limiting plate has a limiting groove corresponding to the hollow part of the driven wheel 2, so that the wafer 5 is limited and fixed in the limiting groove. The laser is installed on the side of the mounting table 1 that is away from the positioning system 600, and is also facing the wafer 5. First, the position and shape of the wafer 5 are confirmed by the positioning system 600. Then, the positioning system 600 converts the position and shape data of the wafer 5 into circuit signal data, which is transmitted to the laser facing the lower surface of the wafer 5. Finally, the laser emits a laser beam according to the above circuit signal data. The laser beam passes through the hollow part of the driven wheel 2 to perform laser processing on the side of the wafer 5 that is away from the positioning system 600.

[0075] In one embodiment, the positioning system 600 includes a support arm 61, a light-emitting component 62, and a positioning component 63. One end of the support arm 61 is mounted on the mounting platform 1, and the other end of the support arm 61 extends above the driving platform 100 to form a mounting end 611. The light-emitting component 62 is mounted on the mounting end 611. The light-emitting component 62 includes a housing 621 and an optical module 622. The housing 621 encloses a light guide cavity 6211, and the optical module 622 is mounted in the light guide cavity 6211. The housing 621 has a first opening 6212 and a second opening 6213 with mutually perpendicular axes. The first opening 6212 and the second opening 6213 are connected to the light guide cavity 6211. The first opening 6212 is set facing the driving platform 100 and is directly opposite the optical module 622. The direction of the axis of the second opening 6213 is parallel to the plane of the driving platform 100. The positioning component 63 is installed on the mounting end 611 adjacent to the light-emitting component 62. The positioning component 63 includes a positioning member 631 and a lens 632. One end of the lens 632 is connected to the positioning member 631, and the other end of the lens 632 is connected to the second opening 6213, so that the axis of the lens 632 coincides with the axis of the second opening 6213.

[0076] In this embodiment, as Figure 4As shown, the support arm 61 is a structural support component of the positioning system 600, which can be a frame, bracket, or base, and is not limited here. One end of the support arm 61 is mounted on the mounting platform 1, and the other end extends upwards towards the drive platform 100 to form a mounting end 611. A light-emitting component 62 and a positioning component 63 are mounted on the mounting end 611, and the light-emitting component 62 and the positioning component 63 are connected. The light-emitting component 62 includes a housing 621 and an optical module 622. The housing 621 is mounted on the mounting end 611, and a hollow light-guiding cavity 6211 is formed inside it. The optical module 622 is mounted in the light-guiding cavity 6211. The housing 621 also has a first opening 6212 and a second opening 6213 that communicate with the light-guiding cavity 6211. The first opening 6212 is positioned facing the drive platform 100, and its axis is perpendicular to the plane of the drive platform 100. The axis of the second opening 6213 is perpendicular to the axis of the first opening 6212.

[0077] Understandably, the direction of the axis of the first opening 6212 coincides with the direction of the axis of the optical module 622. The optical module 622 is an optical assembly that integrates the emission, transmission, and reflection of light. The light emitted from inside the light guide cavity 6211 can be projected onto the wafer 5 of the driving platform 100 through the first opening 6212, or it can enter the positioning component 63 through the second opening 6213.

[0078] Understandably, the positioning component 63 includes a positioning element 631 and a lens 632. The two ends of the lens 632 are connected to the positioning element 631 and the second opening 6213 of the light-emitting component 62, respectively. The axis of the lens 632 coincides with the axis of the second opening 6213, allowing light emitted from the light-emitting component 62 to enter the positioning element 631 through the second opening 6213 and the lens 632. The positioning element 631 can be a laser positioning sensor, a CCD image sensor, a vision sensor, or other photoelectric sensor, and is not limited here. Preferably, the positioning element 631 can be a CCD image sensor. The positioning element 631 converts the received light into a digital signal and then transmits it to the laser, so that the laser can adjust its processing position when processing the wafer 5.

[0079] In one embodiment, the optical module 622 includes a light source 6221 and a light guide mirror 6222. The light source 6221 is horizontally placed in the light guide cavity 6211 facing the driving platform. The light guide mirror 6222 is obliquely disposed in the light guide cavity 6211 and located between the light source 6221 and the first opening 6212. The light guide mirror 6222 is disposed on the side facing the first opening 6212 and the second opening 6213. The light source 6221 emits light, which passes through the light guide mirror 6222 and the first opening 6212 in sequence and illuminates the wafer 5. The light reflected by the wafer 5 is reflected twice by the light guide mirror 6222 and passes through the second opening 6213 and the lens 632, and enters the positioning member 631 to position the wafer 5.

[0080] In this embodiment, as Figure 5 As shown, the light guide mirror 6222 is inclinedly disposed in the light guide cavity 6211, with its mirror surface facing the first opening 6212 and the second opening 6213. The light source 6221 is disposed on the side of the light guide mirror 6222 away from the first opening 6212, and the direction of the axis of the light source 6221 coincides with the direction of the axis of the first opening 6212.

[0081] Understandably, the light source 6221 is used to emit light, which passes through the light guide mirror 6222 and shines on the wafer 5 on the drive platform 100 through the first opening 6212 to illuminate the wafer 5. The illuminated wafer 5 reflects the light through the first opening 6212 into the light guide mirror 6222, and through the tilted light guide mirror 6222, reflects the light reflected by the wafer 5 into the second opening 6213, and then transmits it to the positioning member 631 through the lens 632. The positioning member 621 receives the optical signals about the position and shape of the wafer 5, converts the optical signals into digital signals, and then transmits them to the laser so that the laser can adjust the processing position when processing the wafer. Understandably, the light guide mirror 6222 in this embodiment functions as both a reflective and transmissive light source, similar to a semi-reflective mirror. It partially splits the specific light emitted by the light source 6221 in the optical module 622, using the returned light path as a feedback signal to the positioning component 63 to adjust the stability of the signal received by the positioning component 63 and ensure the normal operation of the machine vision. When light shines on the light guide mirror 6222 from above, that is, from the side of the light source 6221, the light can penetrate the light guide mirror 6222 and enter the first opening 6212. When the light reflected from the wafer 5 enters the light guide mirror 6222 from the first opening 6212, the light guide mirror 6222 can only reflect the light. By tilting the light guide mirror 6222, the reflected light is directed to enter the second opening 6213 along a direction coinciding with the axis of the second opening 6213, and then into the positioning component 631.

[0082] Understandably, by placing the light-emitting component 62 and the positioning component 63 side by side parallel to the plane of the driving platform 100, the space occupied by the positioning system 600 can be effectively saved, improving space utilization. Furthermore, the arrangement of the light-emitting component 62 allows for the alteration of the light propagation direction while ensuring light emission, effectively achieving the integration and miniaturization of the light-emitting component 62, and improving the versatility and applicability of the positioning system 600.

[0083] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made under the concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A driving platform, applied in laser processing equipment, characterized in that, The driving platform includes: Installation platform; Driven wheel, the driven wheel being rotatably mounted on the mounting platform; A drive gear assembly, comprising a first drive gear and a second drive gear, the first drive gear and the second drive gear being spaced apart around the periphery of the driven gear, both the first drive gear and the second drive gear meshing with the driven gear and respectively abutting against different sides of the teeth of the driven gear; and A driving component is connected to the drive wheel assembly to drive the first drive wheel and the second drive wheel to rotate synchronously forward or in reverse. The mounting platform is also provided with a mounting plate. The drive wheel assembly also includes an idler wheel system. The idler wheel system, the first drive wheel, and the second drive wheel are all located on the same side of the mounting plate, and the idler wheel system is located between the first drive wheel and the second drive wheel. The idler wheel system, the first drive wheel, and the second drive wheel are connected by a transmission belt. The drive component is connected to the idler wheel system. The idler gear system includes a fixed gear group and a moving gear group. The fixed gear group is connected to the driven component to receive the power output by the driven component. The moving gear group is connected to the first driving wheel, the second driving wheel and the fixed gear group through the transmission belt, and is used to adjust the tension of the transmission belt. The fixed pulley assembly includes a drive pulley and two adjusting pulleys. The two adjusting pulleys are located on both sides of the drive pulley. The drive pulley is connected to the drive component. Both adjusting pulleys are located on the outer side of the transmission belt and are used to adjust the wrap angle of the transmission belt.

2. The driving platform according to claim 1, characterized in that, The mounting plate is located adjacent to the driven wheel. The first driving wheel and the second driving wheel are rotatably located on the same side of the mounting plate. The driving component is mounted on the side of the mounting plate opposite to the first driving wheel and is connected to the driving wheel assembly for transmission.

3. The driving platform according to claim 1, characterized in that, The first driving wheel is provided with a first meshing part and a first transmission part. The first meshing part and the first transmission part are coaxially arranged. The first meshing part meshes with the driven wheel and abuts against one side of the tooth of the driven wheel. The first transmission part is connected to the idler wheel system through the transmission belt. The second driving wheel is provided with a second meshing part and a second transmission part. The second driving wheel and the second transmission part are coaxially arranged. The second meshing part meshes with the driven wheel and abuts against the other side of the tooth of the driven wheel. The second transmission part is connected to the idler wheel system through the transmission belt.

4. The driving platform according to claim 1, characterized in that, The mounting plate has two guide grooves adjacent to the second drive wheel. Each guide groove has a guide block that can slide along the guide groove. The drive wheel assembly includes two drive wheels, each of which is mounted on one of the guide blocks so that the drive wheel can slide along the guide groove to adjust the tension of the transmission belt.

5. A laser processing device, characterized in that, The laser processing equipment includes: The drive platform as described in any one of claims 1 to 4; A positioning system, wherein the positioning system is located above the drive platform and is oriented towards the drive platform; and A laser is positioned on the other side of the drive platform relative to the positioning system. The laser emits a laser beam that passes through the drive platform to perform laser processing on the wafer.

6. The laser processing equipment according to claim 5, characterized in that, The positioning system includes: The support arm has one end mounted on the mounting platform and the other end extending above the drive platform to form a mounting end. A light-emitting component is mounted on the mounting end. The light-emitting component includes a housing and an optical module. The housing encloses a light-guiding cavity, and the optical module is mounted in the light-guiding cavity. The housing has a first opening and a second opening with mutually perpendicular axes. The first opening and the second opening are connected to the light-guiding cavity. The first opening faces the driving platform and is directly opposite the optical module. The direction of the axis of the second opening is parallel to the plane of the driving platform. A positioning component is mounted on the mounting end adjacent to the light-emitting component. The positioning component includes a positioning element and a lens. One end of the lens is connected to the positioning element, and the other end of the lens is connected to the second opening, so that the axis of the lens coincides with the axis of the second opening.

7. The laser processing equipment according to claim 6, characterized in that, The optical module includes a light source and a light guide mirror. The light source is horizontally placed in the light guide cavity facing the driving platform. The light guide mirror is tilted in the light guide cavity and located between the light source and the first opening. The light guide mirror is positioned facing the first opening and the second opening. The light source emits light, which passes through the light guide mirror and the first opening in sequence to illuminate the wafer. The wafer reflects the light, which is then reflected a second time by the light guide mirror. The light then passes through the second opening and the lens and enters the positioning element to locate the position of the wafer.

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