Method of reducing thermal damage with cooling medium in conjunction with laser processing array

Abstract

The application provides a method for reducing thermal damage of a cooling medium and a laser processing array. The method can reduce or even avoid the formation of a thermal damage area of the laser processing, improve the processing quality, and particularly can improve the density of an array structure, and obtain a ceramic product containing a high-integration array structure.

Description

Technical Field

[0001] This invention belongs to the field of laser processing technology, and specifically relates to a method for reducing thermal damage by using a cooling medium in conjunction with a laser processing array. Background Technology

[0002] As an indispensable basic material in electronic devices, the processing quality of ceramic array structures directly affects product performance, and traditional machining methods are no longer sufficient to meet manufacturing demands. Laser processing technology, due to its non-contact processing characteristics, eliminates tool wear and can focus high energy on the material removal area, making it particularly suitable for processing hard and brittle ceramic materials. Today's manufacturing industry is rapidly developing towards the micro- and nano-scale, placing higher demands on the spacing of array structures. However, the thermal effect of lasers can cause thermal damage to the material, significantly limiting the processing effectiveness of micro-array structures.

[0003] In the prior art, patent CN202010394274.9 proposes a picosecond laser galvanometer scanning drilling system and method for multi-hole array ceramic substrates. The system uses a galvanometer beam to precisely drill holes layer by layer in the ceramic substrate, and then moves the workpiece to the next processing position to continue processing until the processing is completed.

[0004] However, using existing laser technology to process array structures will create thermal damage zones in the materials. Especially when processing highly integrated array structures, the thermal damage zones can cover almost the entire processing surface. This not only reduces the processing quality of the array structure, but also negatively affects the material properties, seriously hindering the development of highly integrated ceramic electronic devices. Summary of the Invention

[0005] In view of this, the present invention aims to propose a method for reducing thermal damage by using a cooling medium in conjunction with a laser processing array. By using liquid, solid or other media for cooling in conjunction with laser processing, the formation of thermal damage areas during laser processing can be reduced or even avoided, thereby improving processing quality. In particular, it can increase the density of the array structure and obtain ceramic finished products containing highly integrated array structures.

[0006] The technical solution of this invention is as follows:

[0007] A method for reducing thermal damage using a cooling medium-assisted laser processing array includes the following steps:

[0008] The ceramic to be processed is fixed on a fixture, the fixture is fixed in a container, and the container is fixed on an ultra-precision motion platform;

[0009] The ultra-precision motion platform is moved, the processing area is selected, and the laser beam is activated and focused onto the material surface. This is the current laser processing area. After processing is completed, the current laser processing area is the laser-processed area. The ultra-precision motion platform is moved again, and the laser beam's position is now the laser-to-process area.

[0010] The nozzle is activated and moved above the laser-processed area, injecting liquid at an angle of 10° to 90° into the area to clean away molten material and improve processing quality; this is the liquid-filled area. Once the laser-processed area is full, liquid injection is stopped, and cooling liquid is then injected into the liquid-filled area through the nozzle to rapidly solidify the injected liquid, creating a cooling protection zone for the laser-processed area. This reduces or even prevents thermal damage to surrounding laser-processed areas in this zone. Simultaneously, the laser beam acts on the ceramic surface, and the area to be processed becomes the current laser-processed area. The cooling protection zone also cools the area to be processed, reducing or even preventing thermal damage during subsequent laser processing. After processing, the area currently being processed is the laser-processed area.

[0011] It should be noted that the cooling medium in this invention achieves cooling by connecting the liquid to the solid through solidification, and by connecting the solid to the gas through liquefaction and then vaporization.

[0012] Continue moving the ultra-precision motion platform. At this point, the laser beam will be applied to the next laser processing area. Turn on and move the nozzle, and repeat the above liquid and cooling liquid injection steps to protect the previously laser-processed area with the cooling medium.

[0013] Meanwhile, the laser beam continues to act on the ceramic surface in the laser-processed area and the laser-processed area. For the solid formed by the solidification of the injected liquid in the aforementioned laser-processed area, as the subsequent structure is processed, the solid gradually liquefies into liquid and then evaporates into gas, thereby carrying away the heat transferred from the laser-processed area. The cooling protection zone formed in the laser-processed area reduces or even avoids the formation of thermal damage zones in the surrounding laser processing areas. Since the thermal damage zones formed in the surrounding laser processing areas will spread to the laser-processed area with the cooling protection zone, the cooling protection zone gradually heats up and can continue to protect the area through liquefaction and evaporation.

[0014] Once all the required structures have been fabricated, a ceramic product containing a highly integrated array structure can be obtained.

[0015] The innovation of this invention lies in the following: After laser processing of the current area, liquid injection washes away residual molten material and slag, and also serves a cooling function. Once the injected liquid solidifies, the area is protected by cooling. During processing of the surrounding area, the cooling protection zone gradually heats up and continues to protect the area through liquefaction and evaporation, thus limiting the thermal damage zone caused by the laser and ensuring processing quality. This improves the integration of the array structure. This cycle allows for the creation of a highly integrated array structure. Particularly with cooling protection, the structure surrounding the processed area can use a higher-power laser beam to improve processing efficiency, because the thermal damage zone formed during laser processing will not affect the processed area. Simultaneously, the cooling protection zone can also cool the area to be processed by the laser, reducing or even preventing subsequent laser processing from causing thermal damage to that area, thus ensuring processing quality.

[0016] In this invention, the laser processing array includes an ultra-precision motion platform, the ultra-precision motion platform is provided with a container, the container is provided with a clamp, and the clamp is used to fix the ceramic material to be processed;

[0017] It also includes a laser, a beam expander, a reflector, and a focusing lens arranged in sequence. The laser is used to emit a laser beam, which is then applied to the surface of the ceramic material to be processed by passing through the beam expander, the reflector, and the focusing lens in sequence.

[0018] It also includes a nozzle facing the surface of the ceramic material to be processed;

[0019] The ceramic material to be processed is divided into the laser current processing area, the laser processing area, the laser processed area, the liquid-filled area, and the solid-filled area according to the processing position.

[0020] In this invention, the laser-processed area filled with liquid carries away the heat transferred from the laser-processed area, forming a cooling protection zone, which can reduce or even avoid the thermal damage to this area caused by subsequent hole processing.

[0021] The laser processing array of this invention is flexible and scalable, and can be customized and adjusted according to different processing needs. It provides a high-precision, high-efficiency processing technology for the electronics field, and can be used for applications such as precise circuit board cutting, micro-soldering, and encapsulation hole processing. Furthermore, the ultra-precision motion platform moves along any one of the X, Y, and Z axes. In this invention, the ultra-precision motion platform is a device for achieving multi-axis precise positioning and control. It consists of three mutually perpendicular axes (X, Y, and Z axes), each equipped with a driver and sensor, enabling the platform to move in three directions.

[0022] The ultra-precision motion platform used in this invention features high accuracy and stability, making it suitable for laser processing. Its advantages include: 1. High precision: The ultra-precision motion platform possesses extremely high positioning accuracy and repeatability. By using precise linear guides, high-resolution sensors, and precise control algorithms, sub-micron or even nanometer-level motion control can be achieved; 2. High rigidity: To maintain stable motion and vibration resistance, the platform typically employs a robust structural design and is manufactured using high-rigidity materials. This helps reduce the interference of external vibrations on the system, improving its stability and accuracy; 3. High-speed motion: By employing fast-response drivers and control systems, rapid and accurate positioning and movement can be achieved; 4. Multi-axis coordination: The ultra-precision motion platform can achieve coordinated motion between multiple axes. Through precise coordinate transformation and motion synchronization algorithms, complex machining and operational tasks can be accomplished.

[0023] Furthermore, the cooling medium includes any one of liquid, solid, or gas, wherein the liquid is water, liquid alcohol, or liquid nitrogen, the solid is ice or solid alcohol, and the gas is water vapor, gaseous alcohol, or nitrogen.

[0024] In particular, the cooling medium in this invention includes the transformation of its different physical states, including liquid-solid, liquid-gas, and solid-gas transformations.

[0025] In this invention, the cooling medium has the following functions during processing: 1. Temperature control: The cooling medium can absorb and remove the heat generated during laser processing, effectively controlling the temperature of the workpiece and equipment. By maintaining an appropriate temperature range, damage, deformation, or poor processing results caused by overheating of the material can be avoided; 2. Material protection: The cooling medium can reduce the surface temperature of the material and reduce the heat-affected zone, thereby avoiding or mitigating changes, oxidation, or loss of the material caused by heat; 3. Improved processing quality: The cooling medium can rapidly cool the workpiece, reducing the heat-affected zone and enabling more refined and precise laser processing; 4. Laser stability: Effective cooling can also improve the efficiency and stability of laser processing, extend its lifespan, and reduce power fluctuations or instability caused by temperature changes.

[0026] Furthermore, the nozzle can spray either liquid or gas.

[0027] Furthermore, the array structure can be a circular hole, square hole, U-shaped groove, V-shaped groove, or other structure. The array structures used in this invention include, but are not limited to, the following: 1. Lattice shape: A lattice-shaped laser array consists of a series of equally spaced laser dots. This structure can provide high power density and energy focusing, suitable for applications requiring high energy density for cutting, drilling, or surface modification; 2. Linear array shape: A linear array laser array consists of one or more parallel laser lines. This structure is suitable for applications requiring continuous processing in a certain direction; 3. Matrix shape: A matrix-shaped laser array consists of multiple rows and columns of laser dots or lines. This structure can provide a larger processing range and flexibility, suitable for applications requiring precise processing on a two-dimensional plane; 4. Circular array: Circular array laser dots or lines are arranged in a ring. This structure is often used for applications requiring contour processing or special shape requirements. This invention can achieve higher processing efficiency, accuracy, and adaptability to different shape processing tasks by adjusting the structure of the laser array according to specific processing needs and objectives.

[0028] Furthermore, the spacing of the array structure is 20 μm to 1 mm, and the cooling protection zone is larger than the thermal damage zone, ranging from 50 μm to 1 mm. In this invention, the parameter ranges are set based on the following: a spacing of 20 μm in the array structure is equivalent to or slightly larger than the diameter of the laser focusing spot, which maximizes the density of the array structure; while a spacing of 1 mm is a common size in the industry. Correspondingly, the cooling protection zone is slightly larger than the spacing of the array structure.

[0029] Furthermore, the laser beam emitted by the laser is applied to the material surface through a beam expander, a reflector, and a focusing lens.

[0030] Furthermore, the laser beam has a pulse width of 200 fs to 10 ns, a wavelength of 355 nm to 1064 nm, a power of 1 W to 50 W, a repetition frequency of 50 kHz to 200 kHz, and a scanning speed of 50 mm / s to 500 mm / s.

[0031] Furthermore, the ceramic includes any one of silicon carbide, silicon nitride, alumina, and zirconium oxide, enabling various applications in the field of electronic devices, specifically including but not limited to the following: 1. PCB processing: Ceramic substrates are commonly used in the manufacture of printed circuit boards (PCBs). Lasers can be used for processing steps such as circuit etching, hole drilling, and wire trimming on ceramic substrates; 2. Sensor manufacturing: Ceramic materials play an important role in sensor manufacturing. Lasers can be used for precision cutting, drilling, and modification of ceramic sensor elements to provide higher sensitivity, accuracy, and reliability; 3. Optoelectronic devices: Ceramic materials play an important role in optoelectronic devices (such as laser diodes, fiber optic connectors, etc.). Laser processing can be used for the encapsulation, precision cutting, and microstructure processing of ceramic materials, thereby improving the performance and reliability of the devices; 4. BGA (Ball Grid Array): In integrated circuit packaging, ball grid array (BGA) packaging using ceramic substrates provides high thermal stability and reliability. Lasers can be used for surface treatment, hole processing, and spherical bonding processes of ceramic substrates; 5. Ceramic capacitor manufacturing: Ceramic materials are often used in the manufacture of capacitors. Laser processing can be used for edge trimming, drilling, and welding of ceramic capacitors to ensure their performance and reliability.

[0032] Compared with existing technologies, this invention employs a cooling medium-assisted laser processing array structure. It utilizes liquid or solid media for cooling and laser processing, dividing the material into a current laser processing area, a laser-processed area, and a laser-to-be-processed area. Liquid is injected into the laser-processed area, followed by the injection of cooling liquid, causing the liquid to solidify and forming a cooling protection zone. This reduces or even prevents thermal damage to the area from subsequent laser processing from surrounding areas. Simultaneously, the cooling protection zone also cools the laser-to-be-processed area, reducing or even preventing thermal damage from subsequent laser processing. In particular, thermal damage from surrounding laser processing areas can spread to the laser processing area within the cooling protection zone; as the cooling protection zone gradually heats up, it can continue to protect the area through liquefaction and evaporation. This significantly improves the integration of the array structure and greatly enhances processing quality.

[0033] This invention utilizes liquid or solid media for cooling in conjunction with laser processing to reduce or even eliminate the formation of thermal damage zones during laser processing, thereby improving processing quality. In particular, it can increase the density of the array structure, resulting in ceramic finished products with highly integrated array structures. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of a cooling medium-assisted laser processing array structure according to an embodiment of the present invention;

[0035] Figure 2 This is a schematic diagram of the current laser processing area and the area to be processed according to an embodiment of the present invention;

[0036] Figure 3 This is a schematic diagram of a liquid-filled laser-processed area and a laser-to-process area according to an embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram of the solid-filled laser-processed area and the laser-currently-processed area according to an embodiment of the present invention;

[0038] Figure 5 This is a schematic diagram of multiple liquid-filled laser-processed areas and the laser-currently-processed area according to an embodiment of the present invention;

[0039] Figure 6 This is a schematic diagram of the laser-processed area, the solid-filled area, and the laser-currently-processed area according to an embodiment of the present invention;

[0040] Figure 7 This is a schematic diagram of the laser-processed area and the liquid-filled area according to an embodiment of the present invention;

[0041] Figure 8 This is a schematic diagram of a laser processing array structure according to an embodiment of the present invention;

[0042] Figure 9 This is a front view of a laser processing array structure according to an embodiment of the present invention;

[0043] Figure 10 This is a front view of the proportional laser processing array structure of the present invention;

[0044] The numbers in the diagram are explained as follows: 1-Laser, 2-Beam expander, 3-Reflector, 4-Focusing lens, 5-Laser beam, 6-Current laser processing area, 7-Laser processing area, 8-Ceramic, 9-Jig, 10-Ultra-precision motion platform, 11-Container, 12-Laser processed area, 13-Liquid filling area, 14-Solid filling area, 15-Nozzle, 16-Cooling protection zone, 17-Thermal damage area. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example

[0046] A method for reducing thermal damage using a cooling medium-assisted laser processing array includes the following steps: A silicon carbide ceramic 8 to be processed is fixed on a fixture 9, which is then fixed in a container 11, which is fixed on an ultra-precision motion platform 10. The ultra-precision motion platform 10 is moved, a hole processing area is selected, and a laser beam 5 with a pulse width of 10 ps and a wavelength of 1030 nm is emitted from a laser 1. After focusing, the beam acts on the surface of the silicon carbide ceramic 8 with a power of 5 W, a repetition frequency of 100 kHz, and a scanning speed of 200 mm / s. This is the current laser processing area 6. After hole processing is completed, the current laser processing area 6 is the laser-processed area 12. The ultra-precision motion platform 10 is moved, and the laser beam 5 is now positioned at the laser processing area 7. A nozzle 15 is activated and moved above the laser-processed area 12, and water is injected into the laser-processed area 12 at a 90° angle. This is the liquid-filled area 13. After water fills the laser-processed area 12, water injection is stopped, and liquid nitrogen is injected into the liquid-filled area 13 through the nozzle to rapidly freeze the injected water into ice. Simultaneously, the laser beam 5 acts on the surface of the silicon carbide ceramic 8, and the laser-processed area 7 becomes the laser-processed area 6. After hole processing is completed, the laser-processed area 6 becomes the laser-processed area 12. The ultra-precision motion platform 10 continues to move, and the laser beam 5 now acts on the next laser-processed area 7. The nozzle 15 is activated and moved, and the above water and liquid nitrogen injection steps are repeated to protect the previous laser-processed area 12 with a cooling medium. Meanwhile, the laser beam 5 continues to act on the surface of the silicon carbide ceramic 8 in both the laser-processed area 7 and the laser-processed area 6. The ice formed by the solidification of injected water in the aforementioned laser-processed area 12 gradually melts into water and then evaporates into water vapor as subsequent hole processing progresses. By carrying away the heat transferred from the laser-processed area 6, the thermal damage to this area caused by subsequent hole processing can be reduced or even avoided. Once all the required holes are processed, a silicon carbide ceramic 8 with a heat damage area of ​​<20 μm, an array hole spacing of <15 μm, an array hole diameter of <30 μm, no slag, no microcracks, and a highly integrated array hole structure can be obtained. Example

[0047] A method for reducing thermal damage using a cooling medium-assisted laser processing array includes the following steps: A zirconia ceramic 8 to be processed is fixed on a fixture 9, which is then fixed in a container 11, which is fixed on an ultra-precision motion platform 10. The ultra-precision motion platform 10 is moved, a groove processing area is selected, and a laser beam 5 with a pulse width of 800 fs and a wavelength of 1064 nm is emitted from a laser 1. After focusing, the beam acts on the surface of the zirconia ceramic 8 with a power of 3 W, a repetition frequency of 80 kHz, and a scanning speed of 350 mm / s. This is the current laser processing area 6. After the groove processing is completed, the current laser processing area 6 is the laser-processed area 12. The ultra-precision motion platform 10 is moved, and the laser beam 5 is now positioned at the laser processing area 7. A nozzle 15 is activated and moved above the laser-processed area 12, and liquid alcohol is injected into the laser-processed area 12 at a 45° angle. This is the liquid-filled area 13. After the liquid alcohol fills the laser-processed area 12, the liquid alcohol injection is stopped, and liquid nitrogen is injected into the liquid-filled area 13 through nozzle 15 to rapidly solidify the injected liquid alcohol into solid alcohol. Simultaneously, the laser beam 5 acts on the surface of the zirconia ceramic 8, and the laser-processed area 7 becomes the laser-processed area 6. After the tank processing is completed, the laser-processed area 6 becomes the laser-processed area 12. The ultra-precision motion platform 10 continues to move, and the laser beam 5 now acts on the next laser-processed area 7. The nozzle 15 is activated and moved, and the above liquid alcohol and liquid nitrogen injection steps are repeated to protect the previous laser-processed area 12 with a cooling medium. Meanwhile, the laser beam 5 continues to act on the surface of the zirconia ceramic 8 in both the laser-processed area 7 and the laser-processed area 6. For the solid alcohol formed by the solidification of the injected liquid alcohol in the aforementioned laser-processed area 12, as subsequent tank processing progresses, the solid alcohol gradually melts into liquid alcohol and then evaporates into gaseous alcohol. By carrying away the heat transferred from the laser-processed area 6, the thermal damage to this area caused by subsequent tank processing can be reduced or even avoided. Once all the required slots are processed, zirconia ceramic 8 with a heat damage area of ​​<10 μm, a slot spacing of <10 μm, a slot width of <25 μm, no slag, no microcracks, and a highly integrated slot structure can be obtained. Example

[0048] A method for reducing thermal damage using a cooling medium-assisted laser processing array includes the following steps: A silicon nitride ceramic 8 to be processed is fixed on a fixture 9, which is then fixed in a container 11, which is fixed on an ultra-precision motion platform 10. The ultra-precision motion platform 10 is moved, a hole processing area is selected, and a laser beam 5 with a pulse width of 6 ns and a wavelength of 1064 nm is emitted from a laser 1. After focusing, the beam acts on the surface of the silicon nitride ceramic 8 with a power of 10 W, a repetition frequency of 150 kHz, and a scanning speed of 200 mm / s. This is the current laser processing area 6. After hole processing is completed, the current laser processing area 6 is the laser-processed area 12. The ultra-precision motion platform 10 is moved, and the laser beam 5 is now positioned at the laser processing area 7. A nozzle 15 is activated and moved above the laser-processed area 12, and liquid alcohol is injected into the laser-processed area 12 at a 70° angle. This is the liquid-filled area 13. After the liquid alcohol fills the laser-processed area 12, the liquid alcohol injection is stopped, and liquid nitrogen is injected into the liquid-filled area 13 through nozzle 15 to rapidly solidify the injected liquid alcohol into solid alcohol. Simultaneously, the laser beam 5 acts on the surface of the silicon nitride ceramic 8, and the laser-processed area 7 becomes the laser-processed area 6. After the hole processing is completed, the laser-processed area 6 becomes the laser-processed area 12. The ultra-precision motion platform 10 continues to move, and the laser beam 5 now acts on the next laser-processed area 7. The nozzle 15 is activated and moved, and the above liquid alcohol and liquid nitrogen injection steps are repeated to protect the previous laser-processed area 12 with a cooling medium. Meanwhile, the laser beam 5 continues to act on the surface of the silicon nitride ceramic 8 in both the laser-processed area 7 and the laser-processed area 6. The solid alcohol formed by the solidification of the injected liquid alcohol in the aforementioned laser-processed area 12 gradually melts into liquid alcohol and then evaporates into gaseous alcohol as subsequent hole processing progresses. By carrying away the heat transferred from the laser-processed area 6, the thermal damage to this area caused by subsequent hole processing can be reduced or even avoided. Once all the required holes have been processed, a silicon nitride ceramic 8 with a thermal damage area of ​​<8 μm, an array hole spacing of <10 μm, an array hole diameter of <20 μm, no slag, no microcracks, and a highly integrated array hole structure can be obtained. Example

[0049] This embodiment provides a laser processing array applied to the methods of embodiments 1-3. The laser processing array includes an ultra-precision motion platform 10, the ultra-precision motion platform 10 is provided with a container 11, and a clamp 9 is provided inside the container 11. The clamp 9 is used to fix the ceramic material 8 to be processed.

[0050] It also includes a laser 1, a beam expander 2, a reflector 3, and a focusing lens 4 arranged in sequence. The laser 1 is used to emit a laser beam 5, which passes through the beam expander 2, the reflector 3, and the focusing lens 4 in sequence to act on the surface of the ceramic material 8 to be processed.

[0051] It also includes a nozzle 15, which faces the surface of the ceramic material 8 to be processed;

[0052] The ceramic material 8 to be processed is divided into the laser current processing area 6, the laser processing area 7, the laser processed area 12, the liquid filling area 13, and the solid filling area 14 according to the processing position.

[0053] In this invention, the laser-processed area 12 filled with liquid carries away the heat transferred from the laser-processed area 6, forming a cooling protection zone 16, which can reduce or even avoid the thermal damage to this area caused by subsequent hole processing.

[0054] Comparative Example

[0055] A method for processing an array structure using laser includes the following steps: A silicon nitride ceramic 8 to be processed is fixed on a fixture 9, which is fixed in a container 11, which is fixed on an ultra-precision motion platform 10. The ultra-precision motion platform 10 is moved, a hole processing area is selected, and a laser beam 5 with a pulse width of 6 ns and a wavelength of 1064 nm is emitted from a laser 1. After focusing, the beam acts on the surface of the silicon nitride ceramic 8 with a power of 10 W, a repetition frequency of 150 kHz, and a scanning speed of 200 mm / s. This is the current laser processing area 6. After hole processing is completed, the current laser processing area 6 becomes the laser-processed area 12. The ultra-precision motion platform 10 is moved again, and the laser beam 5 is now applied to the laser processing area 7. Subsequently, the laser beam 5 acts on the surface of the silicon nitride ceramic 8, and the laser processing area 7 becomes the current laser processing area 6. After hole processing is completed, the current laser processing area 6 becomes the laser-processed area 12. The ultra-precision motion platform 10 is moved again, and the laser beam 5 is now applied to the next laser processing area 7. Subsequently, laser beam 5 continues to act on the surface of silicon nitride ceramic 8 in the laser-to-be-processed area 7 and the laser-currently-processed area 6. Once all the required holes are processed, silicon nitride ceramic 8 with an array hole structure is obtained. However, due to the lack of a cooling medium, a significant thermal damage zone 17 exists around the laser-processed area 12 on the surface of silicon nitride ceramic 8. This thermal damage zone is >150 μm, which can cause fractures or collapses between holes when processing highly integrated array hole structures, severely affecting the processing quality and material properties of the array hole structure. At this point, the obtained array hole spacing is >300 μm and the array hole diameter is >100 μm.

[0056] Compared with existing comparative processing methods, the embodiments of this invention, by employing a cooling medium-assisted laser processing array structure, can form a cooling protection zone 16 around the laser-processed area 12. This reduces or even prevents the formation of a thermal damage zone 17 in the surrounding laser-processed area, while also significantly suppressing the thermal damage zone 17 formed in the current laser-processed area 6. Since the thermal damage zone 17 formed in the surrounding laser-processed area will diffuse to the laser-processed area 12 with the cooling protection zone 16, the gradually increasing temperature of the cooling protection zone 16 can continue to protect the area through liquefaction and evaporation. The silicon nitride ceramic product obtained by this method not only has high array structure processing quality but also high integration, demonstrating significant advantages.

[0057] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0058] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that can be understood by those skilled in the art. It should be noted that any technical features not described in detail in this invention can be implemented using any existing technology.

Claims

1. A method for reducing thermal damage using a cooling medium-assisted laser processing array, characterized in that, Includes the following steps: The ceramic to be processed is fixed on a fixture, the fixture is fixed in a container, and the container is fixed on an ultra-precision motion platform; The ultra-precision motion platform is moved, the processing area is selected, and the laser beam is activated and focused onto the material surface. This is the current laser processing area. After processing is completed, the current laser processing area is the laser-processed area. The ultra-precision motion platform is moved again, and the laser beam's position is now the laser-to-process area. Turn on and move the nozzle above the laser-processed area, and inject liquid into the laser-processed area at a 10°~90° angle. This is the liquid filling area. After the liquid fills the laser-processed area, the liquid injection is stopped, and then cooling liquid is injected into the liquid-filled area through the nozzle to form a cooling protection zone in the laser-processed area; at the same time, the laser beam acts on the ceramic surface, and the area to be processed by the laser becomes the current laser processing area; after processing is completed, the current laser processing area is the laser-processed area. Continue moving the ultra-precision motion platform. At this point, the laser beam will be applied to the next laser processing area. Turn on and move the nozzle, and repeat the above liquid and cooling liquid injection steps to protect the previously laser-processed area with the cooling medium. Meanwhile, the laser beam continues to act on the ceramic surface in the laser processing area and the laser processing area; for the solid formed by the solidification of the injected liquid in the aforementioned laser-processed area, as the subsequent structure is processed, the solid gradually liquefies into liquid and then evaporates into gas to cool down; Once all the required structures have been fabricated, a ceramic product containing a highly integrated array structure can be obtained.

2. The method for reducing thermal damage using a cooling medium-assisted laser processing array according to claim 1, characterized in that, The ultra-precision motion platform moves along any one of the X-axis, Y-axis, or Z-axis.

3. The method for reducing thermal damage using a cooling medium-assisted laser processing array according to claim 1, characterized in that, The cooling medium includes any one of liquid, solid, or gas, wherein the liquid is water, liquid alcohol, or liquid nitrogen, the solid is ice or solid alcohol, and the gas is water vapor, gaseous alcohol, or nitrogen.

4. The method for reducing thermal damage using a cooling medium-assisted laser processing array according to claim 1, characterized in that, The array structure is a round hole, a square hole, a U-shaped groove, a V-shaped groove, or other structures.

5. The method for reducing thermal damage using a cooling medium-assisted laser processing array according to claim 1, characterized in that, The array structure has a spacing of 20 μm to 1 mm, and the cooling protection zone is larger than the thermal damage zone, ranging from 50 μm to 1 mm.

6. The method for reducing thermal damage using a cooling medium-assisted laser processing array according to claim 1, characterized in that, The laser beam has a pulse width of 200 fs to 10 ns, a wavelength of 355 nm to 1064 nm, a power of 1 W to 50 W, a repetition frequency of 50 kHz to 200 kHz, and a scanning speed of 50 mm / s to 500 mm / s.

7. The method for reducing thermal damage using a cooling medium-assisted laser processing array according to claim 1, characterized in that, The ceramic includes any one of silicon carbide, silicon nitride, alumina, and zirconium oxide.

8. A method for reducing thermal damage using a cooling medium-assisted laser processing array according to any one of claims 1-7, characterized in that, The laser processing array includes an ultra-precision motion platform, which has a container and a fixture inside the container for fixing the ceramic material to be processed. It also includes a laser, a beam expander, a reflector, and a focusing lens arranged in sequence. The laser is used to emit a laser beam, which is then applied to the surface of the ceramic material to be processed by passing through the beam expander, the reflector, and the focusing lens in sequence. It also includes a nozzle facing the surface of the ceramic material to be processed; The ceramic material to be processed is divided into the laser current processing area, the laser processing area, the laser processed area, the liquid-filled area, and the solid-filled area according to the processing position.

9. The method for reducing thermal damage using a cooling medium-assisted laser processing array according to claim 8, characterized in that, The laser-processed area, after being filled with liquid, forms a cooling protection zone by removing the heat transferred from the laser-processed area.

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