Suction cup and chuck

Abstract

The application provides a chuck and a chuck, and relates to the technical field of semiconductor testing equipment. The chuck utilizes a plurality of annular partitioning portions arranged concentrically to divide a first cavity in a main body into a plurality of second cavities, and a vacuum pipe is arranged corresponding to each second cavity, so that independent control of the vacuum degree of each second cavity can be achieved. According to the chuck provided by the application, a reinforcing portion is arranged on the part of the adsorption wall for adsorbing an object corresponding to each second cavity, so that deformation and warping of the adsorption wall after bearing high-temperature heating can be avoided. Through the annular partitioning portion and the reinforcing portion, the rigidity of the adsorption wall is improved, so that deformation and warping do not occur, and in turn, vacuum leakage is avoided. Meanwhile, combined with independent control of the vacuum degree of each second cavity, the vacuum degree of each second cavity can be adjusted according to the actual application, which can further avoid the occurrence of poor adhesion of the chuck to the object, and is also conducive to avoiding vacuum leakage.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing equipment technology, and in particular to a suction cup and chuck. Background Technology

[0002] A chuck is primarily used to hold wafers or chips and to heat them to meet various process requirements. During wafer or chip testing, the wafer or chip is placed on the chuck surface and vacuum-adhesive is used to fix it in place. Subsequently, probes make good and stable contact with the wafer / chip to complete the accurate measurement of various electrical performance parameters.

[0003] Temperature uniformity and thermal deformation are crucial design parameters for chucks. Higher temperature uniformity leads to greater accuracy in wafer / chip testing and better consistency in test results. Currently, a major problem with chucks is low temperature uniformity, resulting in inaccurate process parameter measurements. Furthermore, uneven temperature distribution causes varying degrees of thermal deformation across different areas of the chuck, leading to surface warping. This can easily damage thin wafers or chips, resulting in unnecessary cost increases and significantly reduced equipment reliability.

[0004] Furthermore, chuck deformation at high temperatures can easily cause vacuum leaks, leading to unstable vacuum levels. When the chuck holds a wafer / chip, unstable vacuum levels can easily cause the wafer or chip to not hold securely, resulting in slight displacement and inaccurate or significantly off-target test results. Simultaneously, loose wafer or chip holding can easily damage probes or shorten their lifespan, increasing equipment operating costs and reducing equipment reliability. Summary of the Invention

[0005] In view of this, this application provides a suction cup and a chuck, with the aim of solving the above-mentioned technical problems.

[0006] In a first aspect, this application provides a suction cup, the suction cup comprising:

[0007] The main body includes a first cavity disposed inside the main body, an adsorption wall, and a plurality of holes disposed in the adsorption wall, the plurality of holes communicating with the first cavity;

[0008] Multiple annular partitions are concentrically disposed inside the cavity, and the multiple annular partitions divide the first cavity into multiple second cavities arranged radially along the annular partitions;

[0009] Multiple reinforcing parts are provided one-to-one with each portion of the adsorption wall corresponding to each of the second cavities;

[0010] Multiple vacuum pipes are connected to each of the second cavities in a one-to-one correspondence.

[0011] Preferably, each reinforcing part includes a plurality of protrusions arranged around the center of the annular partition, the plurality of protrusions being evenly distributed along the circumference of the annular partition.

[0012] Preferably, each of the protrusions is formed in an arc shape, the plurality of protrusions are circular, and the circle is concentrically arranged with the annular partition.

[0013] Preferably, the main body includes a top cover and a base, and the main body includes the adsorption wall;

[0014] The base and the top cover each include a plurality of annular protrusions, and the other part of the base and the top cover each includes a plurality of annular grooves corresponding to the plurality of annular protrusions. A portion of each annular protrusion is located within a corresponding annular groove. The main body also includes a heat insulation layer that fills the annular grooves. The heat insulation layer connects each annular protrusion with its corresponding annular groove to form the plurality of annular partitions.

[0015] Preferably, the plurality of holes include a plurality of hole strips, each of the hole strips includes a plurality of holes arranged at intervals, each of the hole strips passes through the center of the annular partition, each of the hole strips includes holes corresponding to the location of each of the second cavities, and the plurality of hole strips are arranged at equal central angles in the circumferential direction.

[0016] Secondly, this application provides a chuck, which includes the suction cup described above.

[0017] Preferably, the chuck further includes a heating plate and an insulating plate, and the suction cup, the insulating plate and the heating plate are stacked in sequence, with the heating plate used to heat the suction cup.

[0018] Preferably, the chuck further includes a heating plate disposed below the suction cup, the heating plate being used to heat the suction cup;

[0019] The chuck further includes a sensor connected to the heating plate, which is configured to obtain the temperature of the adsorption wall in a temperature-compensated manner.

[0020] Preferably, the chuck further includes a heating plate disposed below the suction cup, the heating plate being used to heat the suction cup;

[0021] The heating plate includes a plate body and a plurality of heating elements. The plurality of heating elements are arranged radially at intervals along the annular partition on the plate body. The arrangement density of at least some of the heating elements located on the radially outer side is greater than the arrangement density of the heating elements located on the radially inner side.

[0022] Preferably, the chuck further includes a heating plate disposed below the suction cup, the heating plate being used to heat the suction cup;

[0023] The chuck further includes an adjusting plate, an adjusting seat, and multiple set screws. The adjusting plate and the adjusting seat are sequentially arranged below the heating plate and are engaged with each other. The multiple set screws are screwed onto the adjusting seat and support the adjusting plate.

[0024] According to the suction cup provided in this application, a first cavity within the main body is divided into multiple second cavities using multiple concentrically arranged annular partitions, and a vacuum channel is provided for each second cavity, thereby enabling independent control of the vacuum level of each second cavity. The suction cup also provides reinforcing portions on the portion of the adsorption wall used to adsorb objects corresponding to each second cavity, thereby preventing deformation and warping of the adsorption wall after being subjected to high-temperature heating. In other words, the suction cup provided in this application, through the annular partitions and reinforcing portions, enhances the rigidity of the adsorption wall, preventing deformation and warping that could lead to vacuum leakage. Furthermore, combined with independent control of the vacuum level of each second cavity, the vacuum level of each second cavity can be adjusted according to the actual application, further preventing poor adhesion between the suction cup and the object, and also helping to avoid vacuum leakage.

[0025] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A schematic bottom view of the top cover of a suction cup provided according to a first aspect of an embodiment of this application is shown;

[0028] Figure 2 An exploded view of a chuck provided according to a second aspect of an embodiment of this application is shown;

[0029] Figure 3 A schematic diagram showing a flowchart of a method for manufacturing a suction cup according to a first aspect of an embodiment of this application is illustrated.

[0030] Figure label:

[0031] 10-Top cover; 12-Annular partition; 14-Reinforcing part; 16-Vacuum pipe; 18-Vacuum connector;

[0032] 20-Suction cup; 30-Insulating plate; 40-Heating plate; 41-Sensor; 50-Adjusting plate; 60-Adjusting base; 70-Housing shell. Detailed Implementation

[0033] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0034] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0035] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0037] According to a first aspect of the embodiments of this application, a suction cup 20 is provided, which is described below in conjunction with... Figure 1 and Figure 2 The structure and working principle of suction cup 20 are described in detail.

[0038] In this embodiment, the suction cup 20 includes a main body, a plurality of annular partitions 12, a plurality of reinforcing parts 14, and a plurality of vacuum channels 16. The main body includes a first cavity disposed within the main body, an adsorption wall, and a plurality of holes disposed on the adsorption wall, the holes communicating with the first cavity. The plurality of annular partitions 12 are concentrically disposed within the cavity, dividing the first cavity into a plurality of second cavities arranged radially along the annular partitions 12. The plurality of reinforcing parts 14 are correspondingly disposed on portions of the adsorption wall corresponding to each of the second cavities, and the plurality of vacuum channels 16 are correspondingly communicated with each of the second cavities.

[0039] Thus, according to the suction cup 20 provided in the first aspect of the present application, a plurality of concentrically arranged annular partitions 12 divide the first cavity within the main body into a plurality of second cavities, and a vacuum channel 16 is provided for each second cavity, thereby enabling independent control of the vacuum level of each second cavity. According to the suction cup 20 provided in the first aspect of the present application, a reinforcing portion 14 is also provided on the portion of the adsorption wall used for adsorbing objects corresponding to each second cavity, thereby preventing deformation and warping of the adsorption wall after being subjected to high-temperature heating. In other words, according to the suction cup 20 provided in the first aspect of the present application, the rigidity of the adsorption wall is improved through the annular partitions 12 and the reinforcing portions 14, thereby preventing deformation and warping, which could lead to vacuum leakage. Simultaneously, combined with the independent control of the vacuum level of each second cavity, the vacuum level of each second cavity can be adjusted according to the actual application, which further avoids poor adhesion between the suction cup 20 and the object, and also helps to prevent vacuum leakage.

[0040] According to the suction cup 20 provided in the first aspect of the present application, even under uneven heating conditions, the suction cup 20 in this embodiment can still avoid deformation and warping due to its higher stiffness than that of suction cups 20 in the prior art. Furthermore, the independent zone control of the suction cup 20 can also enable the adsorption of objects of different sizes.

[0041] In one embodiment, the adsorption wall can be the upper wall of the main body. In another embodiment, the main body can be formed into a cylindrical shape, and the first cavity inside it can be a cylindrical cavity. Further, in another embodiment, the diameters of the plurality of annular partitions 12 increase sequentially. That is, for two adjacent annular partitions 12, the diameter of the annular partition 12 located on the radially outer side is larger than that of the annular partition 12 located on the radially inner side.

[0042] As an example, in an embodiment, four annular partitions 12 can be provided, each annular partition 12 being respectively connected to the upper wall (i.e., the aforementioned adsorption wall) and the lower wall of the first cavity of the main body. Figure 1 As shown, a cylindrical first second cavity is formed by the smallest annular partition 12. Then, a radially outward-facing second annular partition 12, together with the inner smallest annular partition 12, forms an annular second second cavity. Next, a radially outward-facing third annular partition 12, together with the radially outward-facing second annular partition 12, forms an annular third second cavity. Finally, a radially outward-facing fourth annular partition 12, together with the radially outward-facing third annular partition 12, forms an annular fourth second cavity. With four second cavities, the adsorption of shards, 4-inch, 6-inch, and 8-inch wafers can be achieved through independent control of each zone.

[0043] In this embodiment, each reinforcing part 14 may include a plurality of protrusions arranged around the center of the annular partition 12, and the plurality of protrusions may be evenly distributed along the circumference of the annular partition 12. In this embodiment, the spaced-apart protrusions help to increase the distribution area of ​​the reinforcing part 14, while the even distribution of the plurality of protrusions along the circumference of the annular partition 12 makes the rigidity of the main body relatively uniform, which can further avoid deformation and warping during high-temperature heating.

[0044] In an embodiment, each protrusion may be arc-shaped, and the plurality of protrusions included in each reinforcing portion 14 may be concentrically arranged with the annular partition 12. In this embodiment, such arc-shaped protrusions are more conducive to achieving relatively uniform rigidity of the main body, thereby further preventing deformation and warping during high-temperature heating. Figure 1 As shown, as an example, the central angle corresponding to each arc-shaped protrusion can be 90°, meaning that each reinforcing part 14 can include four arc-shaped protrusions. However, this is not a limitation; the central angles corresponding to multiple arc-shaped protrusions can be equal, and the number is not limited to four.

[0045] Furthermore, in the embodiments, the shape of the protrusion is not limited to an arc shape, but can also be, for example, a straight shape. For example, multiple straight protrusions are arranged around the center of the annular partition 12. The fact that multiple straight protrusions are evenly distributed along the circumference of the annular partition 12 means that the center of the pattern formed by the multiple straight protrusions is the center of the annular partition 12.

[0046] In an embodiment, the main body may include an upper cover 10 and a base, and the main body may include an adsorption wall. Among them, one of the base and the upper cover 10 (such as the upper cover 10) may include a plurality of annular protrusions, and the other of the base and the upper cover 10 (such as the base) may include a plurality of annular grooves corresponding one-to-one to the plurality of annular protrusions, and a part of each annular protrusion is located in the corresponding annular groove. The main body may further include a heat insulation layer, and the heat insulation layer is filled in the annular groove. The heat insulation layer may connect each annular protrusion to the corresponding annular groove to form a plurality of annular partition parts 12.

[0047] That is to say, in the embodiment, each annular partition part 12 includes an annular protrusion provided on one of the above and a heat insulation layer filled in the annular groove corresponding to the annular protrusion. In the embodiment, as an example, the heat insulation layer may be a high-temperature resistant sealant. In the embodiment, the upper wall of the main body is the upper wall of the upper cover 10, that is, the adsorption wall, and the lower wall of the main body is the lower wall of the base. Here, the annular protrusions are provided on the adsorption wall, and the annular grooves are provided on the lower wall of the base. In addition, in the embodiment, the edge of the annular partition part 12 of the upper cover 10 located at the outermost side in the radial direction may be used to connect with the base, for example, by positioning pins, and then the upper cover 10 and the base may be welded externally to form an integral body.

[0048] In the embodiment, as Figure 1 shown, a vacuum pipeline 16 may be opened on the upper cover 10. In the embodiment, the vacuum pipeline 16 extends inside the upper cover 10. For each vacuum pipeline 16, one end of the vacuum pipeline 16 is exposed on the side of the upper cover 10, and the other end extends to the area where the corresponding second cavity is located, and then communicates with the corresponding second cavity through a through hole. In the embodiment, the outer end of the vacuum pipeline 16 may be connected to a vacuum joint 18, so as to externally connect a negative pressure device.

[0049] In the embodiment, the plurality of hole parts may include a plurality of hole bands. Each hole band may include a plurality of hole parts arranged at intervals. Each hole band may pass through the center of the annular partition part 12. Each hole band may include hole parts corresponding to the positions where each second cavity is located respectively. The plurality of hole bands may be arranged at equal central angles in the circumferential direction. In this way, the plurality of hole parts arranged in this way are more uniform, and further can ensure that when an adsorbed object, such as a wafer and a chip, is placed above, the adsorption force is more uniform. In the embodiment, the hole parts may be micro holes suitable for adsorbing wafers and chips. The number of hole bands may be, for example, 4. That is to say, the central angle clamped by two adjacent hole bands is 45°, and the arrangement of these hole bands is in a "rice" shape. In the embodiment, as an example, one hole band may be provided with 3, 8, 8, and 2 hole parts respectively in four second cavities arranged from the inside to the outside.

[0050] According to a second aspect of the embodiments of this application, a chuck is provided, which includes the suction cup 20 as described above, and also includes the beneficial effects described above, which will not be repeated here.

[0051] In the embodiments, see Figure 2 The chuck may also include a heating plate 40 and an insulating plate 30. The suction cup 20, the insulating plate 30, and the heating plate 40 are stacked sequentially, with the heating plate 40 used to heat the suction cup 20. In this embodiment, the insulating plate 30 is used to prevent the heating plate 40 from making electrical contact with the suction cup 20. Also, as an example, the insulating plate 30 may be made of a thermally conductive material and is attached to the outer side of the lower wall of the suction cup 20, thereby facilitating uniform heating of the suction cup 20 by the heating plate 40.

[0052] In this embodiment, a heating plate 40 is disposed below the suction cup 20, and an insulating plate 30 is disposed between the heating plate 40 and the suction cup 20. The chuck may also include a sensor 41, which can be connected to the heating plate 40. The sensor 41 can be configured to obtain the temperature of the adsorption wall in a temperature-compensated manner; specifically, it is the temperature of the upper plane of the adsorption wall used to adsorb wafers and chips, thereby providing a basis for performance testing of the wafers and chips. As an example, in this embodiment, the heating plate 40 can be configured to provide a heating capacity from room temperature (e.g., 25°C) to 400°C.

[0053] In this embodiment, the heating plate 40 may include a plate body and a plurality of heating elements. The plurality of heating elements may be arranged radially at intervals along the annular partition 12 on the plate body. The arrangement density of at least some of the heating elements located on the radially outer side is greater than the arrangement density of the heating elements located on the radially inner side. The heating elements may be, for example, resistance wires. A portion of the resistance wires from the radially inner side may be evenly distributed, for example, the distance between the resistance wires is 1 mm. The outer ring of resistance wires on the radially outer side may be arranged with increased density to ensure that the heating plate 40 heats uniformly and with low noise.

[0054] Furthermore, in this embodiment, the chuck may also include an adjusting plate 50, an adjusting seat 60, and multiple set screws. The adjusting plate 50 and the adjusting seat 60 may be sequentially arranged below the heating plate 40, and the adjusting plate 50 and the adjusting seat 60 may be engaged with each other to prevent the adjusting plate 50 from rotating relative to the adjusting seat 60. The multiple set screws may be screwed onto the adjusting seat 60, and the multiple set screws may support the adjusting plate 50. The set screws are nuts, and there may be three or more of them. By screwing the set screws, their extension lengths are adjusted, thereby adjusting the adjusting plate 50 for fine-tuning and ensuring the flatness of the suction cup 20. In this embodiment, the chuck may also include a housing 70, and the suction cup 20, the insulating plate 30, the heating plate 40, the adjusting plate 50, and the adjusting seat 60 may be disposed within the housing 70.

[0055] This application also proposes a manufacturing process for the segmented suction cup 20 used to manufacture the aforementioned suction cup 20, such as... Figure 3 As shown, the manufacturing process is specifically as follows: rough milling the outer contours of the upper cover 10 and the base by a milling machine, leaving machining allowance; performing fine machining on a CNC machining center, leaving grinding allowance; laser drilling holes in the upper cover 10 and machining deep holes in the base; evenly applying high-temperature glue to the positioning hole seat grooves of the upper cover 10 and the base and bonding them; fixing the positions of the upper cover 10 and the base with positioning pins and waiting for the glue to cure; performing thickness profile welding and aging treatment; grinding the upper and lower surfaces after welding to meet the machining accuracy requirements and trimming the welds of the thickness profile; ultrasonic cleaning the surface residues and then performing surface treatment; storing in the warehouse after the indexes such as accuracy, flatness, and parallelism are inspected and found to be correct. This manufacturing process can prevent vacuum leakage at high temperatures and avoid errors caused by vacuum leakage during testing.

[0056] In the embodiment, the chuck includes a suction cup 20, an insulating plate 30, a heating plate 40, a sensor 41, a leveling plate 50, a heat-insulating base, and a heat-insulating shell 70, etc. This heating chuck has the heating ability to heat the wafer / chip from room temperature to 400°C, and a heat-conducting medium is filled between the heating plate 40 and the suction cup 20 to ensure temperature uniformity. The chuck uses a PT100 platinum resistance to collect temperature data, with high temperature control accuracy. The surface of the suction cup 20 adopts independent vacuum control in different regions, and can adsorb scraps, 4-inch, 6-inch, and 8-inch wafers. The heating plate 40 is arranged with resistance wires, and the distance between the resistance wires is 1 mm. The outer ring resistance wires are arranged in a denser manner to ensure uniform heating of the heating plate 40 and low noise. There are leveling head screws arranged on the heat-insulating base, and these leveling head screws are connected to the leveling plate 50. The surface of the chuck can be finely leveled through the leveling plate 50, thereby ensuring the flatness of the chuck surface.

[0057] The connection method of the chuck is as follows: first, the suction cup 20 and the insulating plate 30 are connected by tapered countersunk M3 screws, and the bottom directly penetrates the heat-insulating base and the heating plate 40 with M4 screws and is connected to the insulating plate 30. Among them, the sensor 41 is not placed in the heating plate 40, and the surface temperature of the chuck is obtained by using a temperature compensation method.

[0058] In the embodiment, the suction cup 20 is composed of two parts, namely the suction cup 20 cover plate and the suction cup 20 base. The suction cup 20 is divided into four independent regions, and each region is controlled separately, including scraps, 4 inches, 6 inches, and 8 inches. There are reinforcing ribs separately arranged to prevent high temperature between different regions, which improves the stiffness of the suction cup 20 and makes it not easily deformed and warped after being heated, ensuring the flatness of the surface of the suction cup 20. The method of partitioning the suction cup 20 is to seal it with high-temperature resistant sealant on the partition boundary line. The sealant is poured into the groove and connected to the boss of the upper cover 10, and the method of external welding is used. There are micropores arranged on the suction cup 20 cover plate, and the micropores are distributed in a "rice" shape to ensure more uniform adsorption force when the wafer / chip is placed above. The base of this high-temperature chuck is designed with leveling screw holes, and the surface of the chuck can be leveled by the magnitude of the screw fastening force.

[0059] In this embodiment, the high-temperature chuck is a core device for the probe station to provide high temperatures during wafer / chip testing. Temperature uniformity and vacuum leakage at high temperatures are key challenges in its fabrication. The high-temperature chuck is primarily used in probe stations, mounted on a four-dimensional motion stage, to provide high temperatures for wafer / chip testing. The high-temperature chuck and suction cup fabrication process designed in this application ensures consistent temperature and high temperature control accuracy, preventing vacuum leakage at high temperatures and thus guaranteeing reliable suction cup adhesion during testing. In the suction cup design of this application, a layer of high-temperature adhesive is uniformly applied between the suction cup cover and the suction cup base during fabrication. This adhesive maintains high sealing and adhesion at high temperatures, ensuring firm and reliable suction cup adhesion in different zones and preventing vacuum fluctuations between zones that could lead to insufficient vacuum levels. This application improves the reliability of the high-temperature chuck, ensures consistent test results, and avoids testing errors.

[0060] The above are merely preferred embodiments of this application and do not limit the scope of protection of this application. Any equivalent structural transformations made based on the innovative concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A suction cup, characterized in that, The suction cup includes: The main body includes a first cavity disposed inside the main body, an adsorption wall, and a plurality of holes disposed in the adsorption wall, the plurality of holes communicating with the first cavity; Multiple annular partitions are concentrically disposed inside the cavity, and the multiple annular partitions divide the first cavity into multiple second cavities arranged radially along the annular partitions; Multiple reinforcing parts are provided one-to-one with each portion of the adsorption wall corresponding to each of the second cavities; Multiple vacuum pipes, each of which is connected to each of the second cavities in a corresponding manner; The main body includes an upper cover and a base, and the main body includes the adsorption wall; The base and the top cover each include a plurality of annular protrusions, and the other part of the base and the top cover each includes a plurality of annular grooves corresponding to the plurality of annular protrusions. A portion of each annular protrusion is located in the corresponding annular groove. The main body also includes a heat insulation layer, which fills the annular grooves. The heat insulation layer connects each annular protrusion to the corresponding annular groove to form the plurality of annular partitions. Each of the aforementioned annular partitions includes an annular protrusion disposed thereon and a heat insulation layer filled in an annular groove corresponding to the annular protrusion.

2. The suction cup according to claim 1, characterized in that, Each reinforcing part includes a plurality of protrusions arranged around the center of the annular partition, the plurality of protrusions being evenly distributed along the circumference of the annular partition.

3. The suction cup according to claim 2, characterized in that, Each of the protrusions is formed in an arc shape, and the plurality of protrusions are concentric with the annular partition.

4. The suction cup according to claim 1, characterized in that, The plurality of holes include a plurality of hole strips, each of the hole strips including a plurality of holes arranged at intervals, each of the hole strips passing through the center of the annular partition, each of the hole strips including holes corresponding to the location of each of the second cavities, and the plurality of hole strips being arranged at equal central angles in the circumferential direction.

5. A chuck, characterized in that, The chuck includes a suction cup as claimed in any one of claims 1 to 4.

6. The chuck according to claim 5, characterized in that, The chuck also includes a heating plate and an insulating plate. The suction cup, the insulating plate, and the heating plate are stacked in sequence, and the heating plate is used to heat the suction cup.

7. The chuck according to claim 5, characterized in that, The chuck also includes a heating plate, which is disposed below the suction cup and is used to heat the suction cup. The chuck also includes a sensor connected to the heating plate, which is configured to obtain the temperature of the adsorption wall in a temperature-compensated manner.

8. The chuck according to claim 5, characterized in that, The chuck also includes a heating plate, which is disposed below the suction cup and is used to heat the suction cup. The heating plate includes a plate body and a plurality of heating elements. The plurality of heating elements are arranged radially at intervals along the annular partition on the plate body. The arrangement density of at least some of the heating elements located on the radially outer side is greater than the arrangement density of the heating elements located on the radially inner side.

9. The chuck according to claim 5, characterized in that, The chuck also includes a heating plate, which is disposed below the suction cup and is used to heat the suction cup. The chuck further includes an adjusting plate, an adjusting seat, and multiple set screws. The adjusting plate and the adjusting seat are sequentially arranged below the heating plate and are engaged with each other. The multiple set screws are screwed onto the adjusting seat and support the adjusting plate.

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