Frame plate, chip packaging structure processing method and chip electroplating structure

Abstract

The application discloses a frame plate, a processing method of a chip packaging structure and a chip electroplating structure. The frame plate has a packaging main body matching part and a side rib matching part. The side rib matching part is used for matching with a packaging body with a reserved side rib and is used for supporting and limiting the side rib. Compared with the prior art, the frame plate of the application is additionally provided with the side rib matching part. The side rib matching part can match with the packaging body with the reserved side rib, and a stable supporting structure is formed between the side rib matching part and the side rib of the packaging body. When processing, the stress condition of the packaging body is better, and the workability can be effectively improved.

Description

Technical Field

[0001] This invention relates to the field of circuit packaging technology, specifically to a method for processing chip packaging structures and a chip electroplating structure. Background Technology

[0002] Existing chip packaging structures include a frame, a chip, a silicon steel sheet, and a molding compound. The silicon steel sheet is U-shaped and used to hold the frame and chip together with adhesive. The molding compound encapsulates the silicon steel sheet, chip, and frame. In existing packaging fabrication methods, the chips used are pre-removed (with edge ribs removed). When the chip is mated with the frame board, the stress area is singular, resulting in poor workability. Summary of the Invention

[0003] To address the aforementioned problems, this invention proposes a chip packaging structure processing method and a chip electroplating structure.

[0004] The technical solution adopted in this invention is as follows:

[0005] A frame plate for processing a chip packaging structure, the frame plate having a packaging body mating part and an edge rib mating part, the edge rib mating part being used to mate with a chip that retains edge ribs, for supporting and defining the edge ribs.

[0006] Compared to existing frame plates, the frame plate of this application is additionally provided with a side rib mating part. The side rib mating part can cooperate with the encapsulation body that retains the side ribs to form a stable support structure with the side ribs of the encapsulation body. During processing, the encapsulation body is better subjected to stress, which can effectively improve workability.

[0007] In one embodiment of the present invention, the edge reinforcement mating part is a groove provided on the frame plate, and the groove is used for the edge reinforcement to be embedded.

[0008] In one embodiment of the present invention, the edge reinforcement mating part is a notch provided on the frame plate, the side wall of the notch has a blocking block, the notch is used for the edge reinforcement to be embedded, and the blocking block is used for supporting the edge reinforcement.

[0009] In one embodiment of the present invention, the frame plate is provided with reinforcing ribs.

[0010] Adding reinforcing ribs can improve the overall strength of the frame panel and facilitate the operation of the process.

[0011] This application also discloses a method for fabricating a chip packaging structure, including:

[0012] A package with retained edge ribs is provided, the package having a package body, a conductor extending outward from the package body, and edge ribs connected to the conductor;

[0013] A frame plate is provided, the frame plate having an encapsulation body mating part and an edge rib mating part;

[0014] Provide fixing plates;

[0015] The encapsulation body is placed on the frame plate, wherein the edge rib mating part mates with the edge rib, the edge rib mating part supports and defines the edge rib, the encapsulation body is close to or tightly attached to the encapsulation body mating part, the fixing piece simultaneously covers the encapsulation body and the encapsulation body mating part, and the fixing piece, the encapsulation body and the encapsulation body mating part are bonded together by curing adhesive;

[0016] A molding compound is formed by covering the outer side of the fixing sheet, the package body, the mating part of the package body, and the conductor near the package body;

[0017] Conductive adhesive is placed between the edge reinforcement mating part and the edge reinforcement to make the conductor conductive to connect with the frame plate;

[0018] The frame plate and the package body are electroplated together;

[0019] The electroplated frame plate and package body are cut or cut and bent to obtain at least one chip package structure.

[0020] In existing chip packaging methods, the package is first electroplated and then molded with a frame plate, resulting in a poor appearance of the plating layer. In the method described in this application, the package retains edge ribs, and the frame plate has additional edge rib mating parts. These mating parts engage with the edge ribs of the package to form a stable support structure. During processing, the package experiences better stress distribution, effectively improving workability and resulting in better molded packages. After the molded package is processed, conductive adhesive is used to electrically connect the conductor to the frame plate, facilitating subsequent electroplating operations. Compared to existing methods, this application improves the appearance of the plating layer and the overall operational stability of the chip packaging structure.

[0021] In this application, the coverage is not limited to full coverage, but can also be partial coverage.

[0022] In one embodiment of the present invention, the edge reinforcement is provided with an anti-reverse structure.

[0023] In one embodiment of the present invention, the anti-reverse structure is a positioning groove or positioning block eccentrically disposed on the side rib.

[0024] By setting up an anti-reverse structure, the package can be effectively prevented from being installed backwards.

[0025] In one embodiment of the present invention, there are multiple and equal numbers of the encapsulation body mating parts and the edge rib mating parts, and the multiple encapsulation body mating parts and the multiple edge rib mating parts are mated one-to-one.

[0026] In one embodiment of the present invention, the fixing piece is U-shaped and forms a limiting groove, and the packaging body and the mating part of the packaging body are both embedded in the limiting groove.

[0027] In one embodiment of the present invention, the fixing sheet is a silicon steel sheet.

[0028] In one embodiment of the present invention, the fixing piece, the encapsulation body and the encapsulation body mating part are fixed by an assembly fixture, and then the fixing piece, the encapsulation body and the encapsulation body mating part are joined together by a curing adhesive.

[0029] In one embodiment of the present invention, the curing adhesive is disposed between the mating part of the fixing sheet and the encapsulation body, between the fixing sheet and the encapsulation body, and between the mating part of the encapsulation body and the encapsulation body.

[0030] This application also discloses a chip electroplating structure, including a package body, a frame plate, a fixing sheet, a curing adhesive, a conductive adhesive, and a molding compound;

[0031] The encapsulation body is an encapsulation body with retained edge ribs, and the encapsulation body has an encapsulation body, a conductor extending outward from the encapsulation body, and edge ribs connected to the conductor.

[0032] The frame plate has a main encapsulation part and a side rib part;

[0033] The encapsulation body is disposed on the frame plate, wherein the edge rib mating part mates with the edge rib of the encapsulation body to support and limit the edge rib, the encapsulation body is close to or tightly attached to the encapsulation body mating part, the fixing piece simultaneously covers the encapsulation body and the encapsulation body mating part, and the curing adhesive is disposed between the fixing piece and the encapsulation body mating part, between the fixing piece and the encapsulation body, and between the encapsulation body mating part and the encapsulation body, so that the fixing piece, the encapsulation body, and the encapsulation body mating part are joined together;

[0034] The molding compound covers the outer side of the fixing sheet, the encapsulation body, the mating part of the encapsulation body, and the conductive part near the encapsulation body;

[0035] The conductive adhesive is disposed between the mating part of the edge rib and the edge rib to enable electrical connection between the conductor and the frame plate.

[0036] The beneficial effects of the present invention are as follows: Compared with the existing frame plate, the frame plate of this application is additionally provided with a side rib mating part. The side rib mating part can cooperate with the encapsulation body that retains the side ribs to form a stable support structure with the side ribs of the encapsulation body. During processing, the encapsulation body is subjected to better stress, which can effectively improve workability. Attached Figure Description

[0037] Figure 1 This is a partial structural diagram of the frame panel;

[0038] Figure 2 This is a schematic diagram of the chip;

[0039] Figure 3 This is a schematic diagram showing the plastic encapsulation formed by covering the outer side of the fixing sheet, the encapsulation body, the mating part of the encapsulation body, and the conductor near the encapsulation body;

[0040] Figure 4 yes Figure 3 Sectional view of AA;

[0041] Figure 5 yes Figure 3 BB section view;

[0042] Figure 6 This is a schematic diagram of the chip electroplating structure;

[0043] Figure 7 This is a front view of the chip packaging structure;

[0044] Figure 8 This is a side view of the chip package structure.

[0045] The labels for the attached figures are as follows:

[0046] 1. Chip packaging structure; 2. Package body; 21. Package main body; 22. Conductor; 23. Edge rib; 231. Anti-reverse structure; 3. Frame plate; 31. Package main body mating part; 32. Edge rib mating part; 321. Notch; 322. Blocking block; 33. Reinforcing rib; 34. Frame; 4. Fixing piece; 41. Limiting groove; 5. Curing adhesive; 6. Conductive adhesive; 7. Molded body. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0048] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0049] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0050] The present invention will now be described in detail with reference to the accompanying drawings.

[0051] This embodiment discloses a method for fabricating a chip packaging structure, including:

[0052] See Figure 2 A package 2 with retaining edge ribs 23 is provided. The package 2 has a package body 21, a conductor 22 extending outward from the package body 21, and edge ribs 23 connected to the conductor 22.

[0053] See Figure 1 A frame plate 3 is provided, which has a main body mating part 31 and a side rib mating part 32.

[0054] See Figure 4 Provide 4 fixing pieces;

[0055] See Figure 3 , 4 6. The encapsulation body 2 is placed on the frame plate 3, wherein the side rib mating part 32 mates with the side rib 23, the side rib mating part 32 supports and limits the position of the side rib 23, the encapsulation body 21 is close to or tightly attached to the encapsulation body mating part 31, the fixing piece 4 simultaneously covers the encapsulation body 21 and the encapsulation body mating part 31, and the fixing piece 4, the encapsulation body 21 and the encapsulation body mating part 31 are joined together by the curing adhesive 5;

[0056] See Figure 3 , 4 And 6, a plastic encapsulation 7 is formed by covering the outer side of the fixing piece 4, the encapsulation body 21, the encapsulation body mating part 31 and the conductor 22 near the encapsulation body 21;

[0057] See Figure 6 As shown, conductive adhesive 6 is provided between the side rib mating part 32 and the side rib 23 to make the conductor 22 connected to the frame plate 3 for conductivity, and then the encapsulation body 2 and the frame plate 3 are electroplated together.

[0058] See Figure 7 and 8 The electroplated frame plate 3 and the package body 2 are cut and bent to obtain at least one chip package structure 1.

[0059] In existing chip packaging structure processing methods, the package 2 is first electroplated and then molded with the frame plate 3. This processing method results in a poor appearance of the plating layer. In the processing method of this application, the package 2 retains the edge ribs 23, and the frame plate 3 is additionally provided with edge rib mating parts 32. The edge rib mating parts 32 can cooperate with the edge ribs 23 of the package 2 to form a stable support structure. During processing, the package 2 is better subjected to stress, which can effectively improve workability and better process the molded package 7. After the molded package 7 is processed, the conductive body 22 is connected to the frame plate 3 by conductive adhesive 6 to conduct electricity, which facilitates subsequent electroplating operations. Compared with the existing methods, this application improves the appearance of the plating layer of the chip packaging structure 1 and the overall stability of the operation.

[0060] like Figure 7 and 8 As shown, the packaging body mating part 31 cut from the frame plate 3 is bent to form the frame 34 of the chip packaging structure 1.

[0061] In practical applications, the chip packaging structure 1 can be obtained directly after cutting without bending and shaping.

[0062] like Figure 1 and 5 As shown, in this embodiment, the edge reinforcement mating part 32 is a notch 321 provided on the frame plate 3. The side wall of the notch 321 has a blocking block 322. The blocking block 322 extends inward from the bottom side wall of the notch 321. The notch 321 is used for the edge reinforcement 23 to be embedded, and the blocking block 322 is used to support the edge reinforcement 23.

[0063] In other embodiments, the edge reinforcement mating part 32 may also be a groove provided on the frame plate 3, the groove being used for the edge reinforcement 23 to be embedded.

[0064] like Figure 1 As shown, in this embodiment, the frame plate 3 is provided with reinforcing ribs 33. By providing reinforcing ribs 33, the overall strength of the frame plate 3 can be improved, which facilitates the process operation.

[0065] like Figure 2As shown, in this embodiment, an anti-reverse structure 231 is provided on the side rib 23. The anti-reverse structure 231 is a positioning groove or positioning block eccentrically provided on the side rib 23. By providing the anti-reverse structure 231, the encapsulation body 2 can be effectively prevented from being installed backwards.

[0066] like Figure 1 As shown, in this embodiment, there are multiple and the same number of both the encapsulation body mating part 31 and the edge rib mating part 32, and the multiple encapsulation body mating parts 31 and the multiple edge rib mating parts 32 are mated in a one-to-one correspondence.

[0067] like Figure 4 As shown, in this embodiment, the fixing piece 4 is U-shaped and forms a limiting groove 41. The packaging body 21 and the packaging body mating part 31 are both embedded in the limiting groove 41.

[0068] In this embodiment, the fixing piece 4 is a silicon steel sheet. In other embodiments, the fixing piece 4 may also be made of other materials that meet the encapsulation requirements of the package 2.

[0069] In this embodiment, preferably, the fixing piece 4, the packaging body 21 and the packaging body mating part 31 are fixed by the assembly fixture, and then the fixing piece 4, the packaging body 21 and the packaging body mating part 31 are joined together by the curing adhesive 5.

[0070] like Figure 4 As shown, in this embodiment, the curing adhesive 5 is disposed between the fixing piece 4 and the encapsulation body mating part 31, between the fixing piece 4 and the encapsulation body 21, and between the encapsulation body mating part 31 and the encapsulation body 21. Any two of the fixing piece 4, the encapsulation body mating part 31, and the encapsulation body 21 can be connected by the curing adhesive 5, and this arrangement of the curing adhesive 5 results in better bonding.

[0071] The above description is merely a preferred embodiment of the present invention and does not limit the scope of patent protection of the present invention. Any equivalent structural transformations made based on the description and drawings of the present invention, whether directly or indirectly applied to other related technical fields, are similarly included within the scope of protection of the present invention.

Claims

1. A frame board for processing chip packaging structures, the frame board having a packaging body mating portion, characterized in that, The frame plate also has a side rib mating part, which is used to mate with the encapsulation body that retains the side rib, for supporting and defining the side rib; The edge reinforcement mating part is a groove provided on the frame plate, the groove being used for the edge reinforcement to be embedded; or, the edge reinforcement mating part is a notch provided on the frame plate, the side wall of the notch having a blocking block, the notch being used for the edge reinforcement to be embedded, and the blocking block being used for supporting the edge reinforcement.

2. The frame plate as described in claim 1, characterized in that, The frame plate is provided with reinforcing ribs.

3. A method for fabricating a chip packaging structure, characterized in that, include: A package with retained edge ribs is provided, the package having a package body, a conductor extending outward from the package body, and edge ribs connected to the conductor; A frame plate is provided, the frame plate having an encapsulation body mating part and an edge rib mating part; Provide fixing plates; The encapsulation body is placed on the frame plate, wherein the edge rib mating part mates with the edge rib, the edge rib mating part supports and defines the edge rib, the encapsulation body is close to or tightly attached to the encapsulation body mating part, the fixing piece simultaneously covers the encapsulation body and the encapsulation body mating part, and the fixing piece, the encapsulation body and the encapsulation body mating part are bonded together by curing adhesive; A molding compound is formed by covering the outer side of the fixing sheet, the package body, the mating part of the package body, and the conductor near the package body; Conductive adhesive is placed between the edge reinforcement mating part and the edge reinforcement to make the conductor conductive to connect with the frame plate; The frame plate and the package body are electroplated together; The electroplated frame plate and package body are cut or cut and bent to obtain at least one chip package structure.

4. The processing method of the chip packaging structure as described in claim 3, characterized in that, The edge reinforcement is equipped with an anti-reverse structure.

5. The method for processing the chip packaging structure as described in claim 4, characterized in that, The anti-reverse structure is a positioning groove or positioning block eccentrically set on the side reinforcement.

6. The method for processing the chip packaging structure as described in claim 3, characterized in that, The encapsulation body mating part and the edge rib mating part are both multiple and the same in number, and the multiple encapsulation body mating parts and the multiple edge rib mating parts are matched one-to-one.

7. The method for processing the chip packaging structure as described in claim 3, characterized in that, The fixing piece is U-shaped and forms a limiting groove. The packaging body and the mating part of the packaging body are both embedded in the limiting groove.

8. The method for processing the chip packaging structure as described in claim 7, characterized in that, The fixing plate is a silicon steel sheet.

9. The method for processing the chip packaging structure as described in claim 3, characterized in that, The fixing piece, the encapsulation body, and the mating part of the encapsulation body are fixed by the assembly fixture, and then the fixing piece, the encapsulation body, and the mating part of the encapsulation body are joined together by the curing adhesive.

10. The method for processing the chip packaging structure as described in claim 3, characterized in that, The curing adhesive is disposed between the mating part of the fixing sheet and the encapsulation body, between the fixing sheet and the encapsulation body, and between the mating part of the encapsulation body and the encapsulation body.

11. A chip electroplating structure, characterized in that, Includes the encapsulation body, frame plate, fixing plate, curing adhesive, conductive adhesive, and molding compound; The encapsulation body is an encapsulation body with retained edge ribs, and the encapsulation body has an encapsulation body, a conductor extending outward from the encapsulation body, and edge ribs connected to the conductor. The frame plate has a main encapsulation part and a side rib part; The encapsulation body is disposed on the frame plate, wherein the edge rib mating part mates with the edge rib of the encapsulation body to support and limit the edge rib, the encapsulation body is close to or tightly attached to the encapsulation body mating part, the fixing piece simultaneously covers the encapsulation body and the encapsulation body mating part, and the curing adhesive is disposed between the fixing piece and the encapsulation body mating part, between the fixing piece and the encapsulation body, and between the encapsulation body mating part and the encapsulation body, so that the fixing piece, the encapsulation body, and the encapsulation body mating part are joined together; The molding compound covers the outer side of the fixing sheet, the encapsulation body, the mating part of the encapsulation body, and the conductive part near the encapsulation body; The conductive adhesive is disposed between the mating part of the edge rib and the edge rib to enable the conductor to be electrically connected to the frame plate; The frame plate and the package are electroplated together.

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