Electrostatic force microcirculation heat dissipation device

Abstract

This invention discloses an electrostatic microcirculation heat dissipation device, comprising a liquid storage tank, a base placed on the liquid storage tank in direct contact with a chip, multiple microchannels extending vertically from the base, and pairs of capacitor plates added to both sides of the microchannels. The chip is placed at the intervals of the microchannels. The microchannels are rectangular straight-through channel structures, and the channel walls are made of resin material, separating the coolant and capacitor plates within the microchannels. By applying voltage to the capacitor plates on both sides of the microchannels, the internal coolant can be driven to flow up and down and circulate within the tank. This invention eliminates the need for a traditional drive pump, relying on electrostatic force as the power source to dissipate heat from the microchip without occupying a large space. Furthermore, it operates solely on voltage, without generating current, thus significantly saving energy.

Description

Technical Field

[0001] This invention relates to the fields of chip heat dissipation and chip reliability, and is mainly applied to the heat dissipation of microchips, particularly to an electrostatic microcirculation heat dissipation device. Background Technology

[0002] Modern electronic chips are evolving towards smaller sizes and higher integration. However, while chip performance improves, it also generates more heat, causing chip temperatures to rise. The performance and reliability of electronic chips decrease significantly with increasing temperature, making chip heat dissipation technology crucial. Among this, micro-cooling technology for microchips is increasingly important. Among various developed micro-cooling technologies, microchannel heat sinks (MCHS) have attracted considerable attention due to their high convective heat transfer coefficient, compact structure, high surface area-to-volume ratio, low coolant volume, and uniform temperature. Currently, all microchannel heat sink designs include inlets and outlets, relying on an external pump to drive the coolant to flow within the microchannels to remove heat. This means that the pump needs to operate continuously to control the flow rate and pressure drop across the channels. Therefore, the presence of the pump and external coolant tank not only occupies a significant amount of space but also consumes considerable energy. To date, no micro-heat sink has been developed that can achieve liquid circulation and heat dissipation without a pump. However, with the development of microchips, such a micro-heat sink design that eliminates the need for a traditional pump is becoming increasingly necessary. Summary of the Invention

[0003] In view of the above problems, it is necessary to provide a microchannel heat dissipation device that does not rely on a drive pump and has a novel power source. The technical objective of this invention is to provide a novel electrostatic microcirculation heat dissipation device. This heat dissipation device resembles a finger-like structure, with multiple micron-sized microchannels extending from the top of a hollow box. A microchip is placed on a platform spaced between the microchannels. By applying voltage to capacitor plates on both sides of the microchannels, the internal coolant can flow up and down and circulate within the box. This invention eliminates the need for a traditional drive pump, relying on electrostatic force as the power source. It achieves heat dissipation of the microchip without occupying a large space, and operates solely on voltage without generating current, thus significantly saving energy.

[0004] The technical solution adopted in this invention is an electrostatic micro-circulation heat dissipation device, including a liquid storage tank 2, a base 3 placed on the liquid storage tank 2 and in direct contact with the chip, multiple microchannels extending vertically from the base 3, and capacitor plates 4 added in pairs on both sides of the microchannels. The chip is placed at the intervals of the microchannels. The microchannels are rectangular straight-through channel structures, and the channel walls are made of resin material to separate the coolant and capacitor plates 4 in the microchannels.

[0005] Furthermore, the base 3 has holes, and microchannels extend vertically upward from the holes on the base 3. Multiple microchannels are arranged horizontally and linearly on the base 3 according to a certain size to form a multi-finger structure.

[0006] Furthermore, the base 3 has a groove 5 reserved for placing the capacitor plate 4, which simultaneously satisfies the fixation of the microchannel and the capacitor plate 4.

[0007] Furthermore, the base 3 has a pre-reserved injection port 6 and a matching cap 7, forming a sealed environment. The injection port 6 and the cap 7 are connected to the liquid storage tank 2 using waterproof sealant or screws.

[0008] The bottom housing 2, base 3, and linearly arranged microchannels on the base 3 of the heat dissipation device are all made of insulating resin. The electrodes of the capacitor plate 4 are made of copper sheets. The area on the base 3 where the chip is placed (e.g., Figure 2 The shaded area in the image is covered with a layer of thermally conductive medium.

[0009] When an electric field is perpendicular or parallel to the interface between two dielectrics, the force acting at the interface is always perpendicular to the interface and points from the side with the larger dielectric constant to the side with the smaller dielectric constant. At the interface between two dielectrics, the electric force acting on a unit area is always perpendicular to that area, regardless of the direction of the electric field, and always points from the side with the larger dielectric constant to the side with the smaller dielectric constant. Electrostatic force can be used to move coolant vertically, thus replacing the need for a pump as the power source for coolant flow. By changing the size of the heat dissipation device and the parameters of the applied voltage, the coolant can be made to flow up and down in different channels of the device in a predetermined order, generating a velocity difference and thus creating eddies. Figure 1 The flow rate peaks in the shaded area, where the chip is placed. The higher the flow rate, the better the heat exchange effect, thus achieving the purpose of cooling the chip.

[0010] Compared with existing technologies, the above-mentioned device uses electrostatic force as a power source to drive the flow of coolant, which solves the space occupation problem of traditional drive pumps and connecting pipes. It operates on voltage and does not generate current, thus solving the energy consumption problem caused by long-term operation of drive pumps. Furthermore, the working mode of the heat dissipation device can be adjusted by controlling relevant parameters, increasing the flexibility of the device's operation. Attached Figure Description

[0011] Figure 1 This is a complete structural diagram of the heat dissipation device in a preferred embodiment of the present invention.

[0012] Figure 2 yes Figure 1 3D exploded view of the heat dissipation device.

[0013] Figure 3 yes Figure 1 Cross-sectional view of the heat dissipation device.

[0014] Figure 4 It represents the liquid flow rate results of the heat dissipation device under different parameters. Detailed Implementation

[0015] The present invention will now be further described with reference to the accompanying drawings and examples.

[0016] Figure 1 The diagram shown is a complete structural diagram of the heat dissipation device of the present invention, which is used to dissipate the heat generated by the chip located at the microchannel spacing position 1 (shaded area in the figure) during operation. Figure 2 The diagram shown is an exploded perspective view of the heat dissipation device of this invention. The device mainly includes a liquid storage tank 2 at the bottom, a base 3 that directly contacts the chip, and a base cover on top of the liquid storage tank. The base has holes of predetermined size and spacing, with each hole corresponding to a microchannel in the vertically upward direction. Multiple microchannels are arranged horizontally and linearly on the base to form a multi-finger structure. A groove 5 is pre-reserved on the base to accommodate a capacitor plate 4, simultaneously satisfying the structure of the microchannels and the fixation of the capacitor plate 4. After assembly, the heat dissipation device forms a sealed environment; therefore, a liquid injection port 6 and a matching cap 7 are provided on the base. The connection between the base 3 and the liquid storage tank 2 can be secured with waterproof sealant or screws; this device uses sealant for fixation.

[0017] The bottom casing 2, base 3, and the linearly arranged microchannels on base 3 of the heat dissipation device are all made of insulating resin, while the electrodes are made of copper sheets (purple copper). Figure 1 The area where the chip is placed on the base shown (shaded area in the figure) can be appropriately covered with a layer of thermally conductive medium to enhance heat exchange performance.

[0018] The aforementioned device can be directly welded to the capacitor plate 4 on both sides of the microchannel via thin wires. Applying voltage forms electrodes to generate electrostatic force, which drives the flow of coolant inside the device. This solves the problem of limited space for the heat dissipation device due to the small system space, avoids the space occupation of traditional drive pumps and connecting pipes, and effectively reduces energy consumption by relying solely on voltage control. Different operating modes can be achieved by controlling the voltage parameters, allowing the coolant to circulate and form eddies inside the device to adjust the heat exchange efficiency, thereby improving the heat dissipation performance and flexibility of the heat dissipation device. Figure 4 The results show the flow rate of the coolant under different parameters. The flow rate represents the heat transfer efficiency of the coolant on the upper and lower surfaces of the base 2, which also means the heat dissipation performance of the heat dissipation device.

[0019] from Figure 4 The flow rate variation trend under different parameters can be observed. To improve the heat dissipation performance of the heat sink, the channel inner diameter should be kept between 100-300 μm, the channel spacing between 1000-1200 μm, and the depth of the liquid reservoir between 1000-1200 μm. The applied voltage and operating frequency are the main influencing factors, with approximately 20V yielding the best results. By modifying the size and operating conditions of this heat sink, the thermal resistance of the chip located at position 1 can be effectively reduced by 10%-30%.

Claims

1. An electrostatic micro-circulation heat dissipation device, characterized in that: It includes a liquid storage tank (2), a base (3) placed on the liquid storage tank (2) and in direct contact with the chip, multiple microchannels extending vertically from the base (3) and capacitor plates (4) added in pairs on both sides of the microchannels, the chip being placed at the intervals of the microchannels; the microchannels are rectangular straight-through channel structures, the channel walls of the channel structure are made of resin material, separating the coolant and capacitor plates (4) in the microchannels.

2. The electrostatic micro-circulation heat dissipation device according to claim 1, characterized in that: The base (3) is provided with holes, and microchannels extend vertically upward from the holes on the base (3). Multiple microchannels are arranged horizontally and linearly on the base (3) according to a certain size to form a multi-finger structure.

3. The electrostatic micro-circulation heat dissipation device according to claim 1, characterized in that: The base (3) has a groove (5) for placing the capacitor plate (4), which satisfies the need to fix the microchannel and the capacitor plate (4).

4. The electrostatic micro-circulation heat dissipation device according to claim 1, characterized in that: The base (3) has a reserved injection port (6) and a matching size cap (7) to form a sealed environment; the connection between the base (3) and the liquid storage tank (2) is fixed with waterproof sealant or screws for the injection port (6) and the cap (7).

5. The electrostatic micro-circulation heat dissipation device according to claim 1, characterized in that: The liquid storage tank (2) at the bottom of the heat dissipation device, the base (3), and the linearly arranged microchannels on the base (3) are all made of insulating resin. The electrodes of the capacitor plate (4) are made of copper sheets, and the area on the base (3) where the chip is placed is covered with a layer of thermally conductive medium.

6. The electrostatic micro-circulation heat dissipation device according to claim 1, characterized in that: When an electric field is perpendicular or parallel to the interface between two dielectrics, the force acting at the interface is always perpendicular to the interface and points from the side with the larger dielectric constant to the side with the smaller dielectric constant. At the interface between the two dielectrics, the electric force acting on a unit area is always perpendicular to that unit area, regardless of the direction of the electric field, and always points from the side with the larger dielectric constant to the side with the smaller dielectric constant. By relying on electrostatic force to move the coolant in the vertical direction, it can replace the drive pump as the power source for coolant flow. By changing the size of the heat dissipation device and the parameters of the applied voltage, the coolant can be made to flow up and down in different channels of the device in a set order, generating a velocity difference and thus generating eddies. The flow velocity will reach a peak at the location where the chip is placed. The higher the flow velocity, the better the heat exchange effect, thus achieving the purpose of heat dissipation for the chip.

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