Metal colorful processing method and laser processing device

Abstract

The embodiments of the present application belong to the technical field of laser material surface processing, and relate to a method and a laser processing device for colorful metal processing. The method comprises the following steps: placing the product on a fixed fixture to fix the product; importing the graphic file to be processed, and confirming the focus and marking position according to the graphic file; setting the process parameters, controlling the picosecond laser to mark the surface of the product; and controlling the nanosecond laser to modify the marked pattern. The technical solution provided by the present application can form a micro-nano strip structure on the metal surface by picosecond laser marking and then by nanosecond laser modification to achieve color production on the metal surface. The colorful pattern will not fall off, and it has good durability and little impact on the environment. The method provided by the present application is used for colorful processing, and the processing efficiency is high. After processing, only a micro-nano stripe structure will be formed on the surface of the product without causing other damage to the product. The processing precision is high and the range is large.

Description

Technical Field

[0001] The present application relates to the technical field of laser material surface processing, and more specifically, to a metal colorful processing method and a laser processing device. Background Art

[0002] Traditional methods for applying color to metal surfaces primarily involve ink screen printing and laminating. Because these methods involve plating or coating the metal surface with other materials, durability and color fading are pressing issues. Furthermore, these methods inevitably increase costs and pose environmental risks. Summary of the Invention

[0003] The technical problem to be solved by the embodiments of the present application is that the traditional colorful processing method has poor durability and causes environmental pollution.

[0004] In order to solve the above technical problems, the present application provides a method for processing metal colorful patterns, which adopts the following technical solution. The method includes the following steps:

[0005] Place the product on a fixed fixture and fix it;

[0006] Import the graphic file to be processed and confirm the focus and marking position according to the graphic file;

[0007] Set process parameters and control the picosecond laser to mark the product surface;

[0008] Control the nanosecond laser to modify the marked pattern.

[0009] Furthermore, the picosecond laser power emitted by the picosecond laser is greater than the nanosecond laser power emitted by the nanosecond laser.

[0010] Furthermore, the step of controlling the picosecond laser to mark the surface of the product is specifically as follows: after controlling the picosecond laser to emit the picosecond laser, the picosecond laser passes through the beam combiner and the galvanometer in sequence and is projected onto the surface of the product, forming a marking pattern on the surface of the product.

[0011] Furthermore, the step of controlling the nanosecond laser to modify the marked pattern is specifically as follows: after controlling the nanosecond laser to emit nanosecond laser, the nanosecond laser passes through the beam combiner and the galvanometer in sequence and is projected to the position of the marking pattern, thereby smoothing the micro-nano stripe structure constituting the marking pattern on the surface of the product.

[0012] Furthermore, the picosecond laser power is 0.8W-2W.

[0013] Furthermore, the picosecond laser is an infrared picosecond laser with a wavelength of 1064 nm; and the nanosecond laser is an infrared nanosecond laser with a wavelength of 1064 nm.

[0014] Furthermore, the step of controlling the picosecond laser to perform laser engraving on the surface of the product also includes: controlling the dust extraction device to blow air and extract dust from the marking position.

[0015] Furthermore, before the step of placing the product on a fixing fixture and fixing the product, the process further includes:

[0016] The surface of the metal product is smoothed to obtain a metal product with a mirror surface.

[0017] Furthermore, the picosecond laser controls the filling spacing to be 0.03-0.08 mm.

[0018] In order to solve the above technical problems, an embodiment of the present application also provides a laser processing device that adopts the metal colorful processing method described in any of the above schemes for processing. The device includes a fixed fixture, a picosecond laser and a nanosecond laser. The fixed fixture is used to load the product, the picosecond laser is used to mark the surface of the product, and the nanosecond laser is used to modify the marking pattern on the product.

[0019] Compared with the prior art, the embodiments of the present application mainly have the following beneficial effects: the present application controls the picosecond laser to mark the surface of the product according to the marking pattern. During the marking process, the picosecond laser interferes with the plasma generated by the laser. The interference causes interference lines to form on the surface of the metal material, forming a micro-nano stripe structure, so that a pattern with a dazzling effect can be formed on the metal surface. The pattern is then modified by a nanosecond laser, so that a marking pattern with a more delicate dazzling effect can be obtained. The present application adopts the method of picosecond laser marking and then modification by nanosecond laser to form a micro-nano stripe structure on the metal surface to achieve color production on the metal surface. The colorful pattern will not fall off, and it has good durability and little impact on the environment. In addition, the method provided by the present application is used for colorful processing, and the processing efficiency is high. After processing, only a micro-nano stripe structure will be formed on the surface of the product without causing other damage to the product. The processing precision is high and the range is large. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the solution of the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0021] Figure 1This application provides a flowchart of a metal colorful processing method according to an embodiment;

[0022] Figure 2 This is a cross-sectional view of a micro-nano stripe structure processed by the metal colorful processing method described in one embodiment of the present application;

[0023] Figure 3 yes Figure 2 Schematic diagram of the top view of the micro-nano stripe structure shown. DETAILED DESCRIPTION

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0025] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0026] The present invention provides a method for processing metal colorful patterns. Figure 1 , the method comprises the following steps:

[0027] S200, placing the product on a fixing fixture and fixing the product;

[0028] S300, import the graphic file to be processed, and confirm the focus and marking position according to the graphic file;

[0029] S400, set process parameters and control the picosecond laser to mark the product surface;

[0030] S500: Control the nanosecond laser to modify the marked pattern.

[0031] As can be understood, this application uses the interference of laser light emitted by a picosecond laser and the plasma generated by the laser to produce a micro-nano stripe structure. This micro-nano stripe structure forms a reflective grating structure on the metal surface. Under illumination conditions, the reflected light passes through this reflective grating structure and is dispersed, thus creating a dazzling effect. After marking with the picosecond laser, a dazzling marking pattern is formed. The marked pattern is then modified with a nanosecond laser to make the micro-nano stripe structure smoother, the dazzling effect more delicate, and the visual effect of the marking pattern optimized.

[0032] Compared with the existing technology, this metal colorful processing method has at least the following technical effects:

[0033] The present application controls the picosecond laser to mark the surface of the product according to the marking pattern. During the marking process, the picosecond laser interferes with the plasma generated by the laser. The interference causes interference lines to form on the surface of the metal material, forming a micro-nano stripe structure, so that a pattern with a dazzling effect can be formed on the metal surface. The pattern is then modified by a nanosecond laser, so that a marking pattern with a more delicate dazzling effect can be obtained. The present application adopts the method of picosecond laser marking and then modification by nanosecond laser to form a micro-nano stripe structure on the metal surface to achieve color production on the metal surface. The colorful pattern will not fall off, and it has good durability and little impact on the environment. In addition, the method provided by the present application is used for colorful processing, and the processing efficiency is high. After processing, only a micro-nano stripe structure will be formed on the surface of the product without causing other damage to the product. The processing precision is high and the range is large.

[0034] In one embodiment, the picosecond laser power emitted by the picosecond laser is greater than the nanosecond laser power emitted by the nanosecond laser. In this embodiment, the picosecond laser is used to process the product surface, while the less powerful nanosecond laser is used to modify the processed pattern. This makes the micro-nano stripe structure formed on the product surface smoother, reduces diffuse reflection of light, and makes the color of the marked pattern brighter and more delicate.

[0035] In one embodiment, in step S300, controlling the picosecond laser to mark the surface of the product is specifically as follows:

[0036] After the picosecond laser is controlled to emit picosecond laser, the picosecond laser passes through the beam combiner and the galvanometer in sequence and is projected onto the surface of the product, forming a marking pattern on the surface of the product.

[0037] In step S400, the nanosecond laser is controlled to modify the marked pattern as follows:

[0038] After the nanosecond laser is controlled to emit nanosecond laser, the nanosecond laser passes through the beam combiner and the galvanometer in sequence and is projected to the position of the marking pattern, smoothing the micro-nano stripe structure constituting the marking pattern on the surface of the product.

[0039] In step S300, the process parameters are set to set the processing parameters of the picosecond laser and the nanosecond laser, respectively. The process parameters include marking speed, idle speed, Q frequency, laser power, fill spacing, and focal position. The marking speed of the picosecond laser can be set to 600-1200 mm / s. The Q frequency of the picosecond laser can be set to 400-1000 kHz. The focal position can be set to an upper defocus of 0-0.4 mm.

[0040] Specifically, in this embodiment, the picosecond laser emitted by the picosecond laser and the nanosecond laser emitted by the nanosecond laser are shaped by the same beam combiner, and then the movement of the laser on the X-axis and Y-axis is controlled by the same galvanometer, so that the two laser beams of the picosecond laser and the nanosecond laser can respectively mark and modify the same processing position on the metal surface, so as to ensure that when the nanosecond laser is used to modify the micro-nano stripe structure, the modification position of the nanosecond laser on the metal surface remains consistent with the position of the marked pattern.

[0041] In this embodiment, the processing position accuracy of the picosecond laser and the nanosecond laser is within 10 μm to avoid obvious ablation of the non-processed area to affect the processing effect.

[0042] Specifically, after completing step S300, the picosecond laser is turned off, and then step S400 is performed. That is, the picosecond laser and the nanosecond laser act on the surface of the product respectively.

[0043] In this embodiment, the picosecond laser power is 0.8 W to 2 W. Furthermore, the laser processing site position is 0 to 0.4 mm in upper focus.

[0044] In one embodiment, the picosecond laser is an infrared picosecond laser with a wavelength of 1064 nm, and the nanosecond laser is an infrared nanosecond laser with a wavelength of 1064 nm. In this embodiment, the infrared picosecond laser with a wavelength of 1064 nm emitted by the infrared picosecond laser is used to make the stripe width in the micro-nano stripe structure about 1 μm (e.g., Figures 2 to 3 As shown in the figure, the stripe width is much smaller than the spot size of the infrared picosecond laser during processing, making the marking pattern more accurate and the color effect better. The infrared nanosecond laser with a wavelength of 1064nm is used to emit infrared nanosecond laser, making the micro-nano stripe structure on the product surface smoother.

[0045] In one embodiment, step S300 further includes:

[0046] Control the dust extraction device to blow air and extract dust from the marking position.

[0047] Specifically, while controlling the picosecond laser to mark the product surface and the nanosecond laser to modify the marking pattern, the dust extraction device is simultaneously controlled to blow air and remove dust from the marking area. The interaction between the laser and the metal product surface generates a large amount of dust and particles. These dust and particles entering the processing environment can affect the laser processing effect and pose a safety hazard. Blowing away dust particles promptly during laser processing can reduce the impact of dust on laser processing power. The dust extraction device can promptly remove the blown dust, thereby reducing dust and particles in the processing environment.

[0048] In one embodiment, the metal colorful processing method further comprises the steps of:

[0049] S100: Smoothing the surface of the metal product to obtain a metal product with a mirror surface.

[0050] Specifically, the metal product is pre-treated: the surface of the metal product is smoothed to achieve a mirror effect, which can reduce the impact of the initial surface morphology on the final colorful effect.

[0051] In one embodiment, step S200 is specifically as follows:

[0052] Build a fixed jig, place the product on it, fix the product, and adjust the level of the fixed jig so that the horizontal accuracy of the product is within 0.03mm of the marking range to avoid the impact of the horizontal deviation of the product on the processing effect.

[0053] In one embodiment, step S300 is specifically as follows:

[0054] Create and edit the graphic files to be processed, import the graphic files, and confirm the focus and marking position according to the graphic files.

[0055] In one embodiment, after step S500, the following steps are further included:

[0056] Remove the product from the fixture and clean it.

[0057] Based on the aforementioned metal color processing method, an embodiment of the present application further provides a laser processing device that utilizes the aforementioned metal color processing method for processing. The laser processing device includes a fixture, a picosecond laser, and a nanosecond laser. The fixture is used to load the product, the picosecond laser is used to mark the product surface, and the nanosecond laser is used to modify the marking pattern on the product.

[0058] In one embodiment, the laser processing device further includes a beam combiner and a galvanometer, both of which are located in the optical path of the picosecond laser and the nanosecond laser, and are used to shape the picosecond laser and the nanosecond laser and change the marking position.

[0059] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below.

[0060] Example 1:

[0061] The metal colorful processing method is:

[0062] Smooth the surface of the metal product to obtain a metal product with a mirror surface. Build a fixed fixture, place the product on the fixed fixture, fix the product, and adjust the fixed fixture horizontally so that the horizontal accuracy of the product reaches within 0.03mm of the marking range. Make and edit the graphic files that need to be processed, import the graphic files, and confirm the focus and marking position according to the graphic files. Set the processing parameters of the picosecond laser and nanosecond laser, among which the processing parameters of the picosecond laser are as follows: marking speed of 600mm / s, jump speed of 2000mm / s, Q frequency of 400KHz, laser power of 0.8W, filling spacing of 0.03mm, and focus position of 0.2mm upper defocus. The laser power of the nanosecond laser is 0.5W.

[0063] The picosecond laser is controlled to emit according to the process parameters. The laser passes through a beam combiner and a galvanometer before projecting onto the product surface, forming a marking pattern. Simultaneously, a dust extraction device is controlled to blow air and remove dust from the marking area. After marking, the picosecond laser stops emitting light, and the nanosecond laser is controlled to emit nanosecond laser light. The nanosecond laser passes through the beam combiner and a galvanometer before projecting onto the marking area, smoothing the micro-nano stripe structure that forms the marking pattern on the product surface. Finally, the product is removed from the fixture and cleaned.

[0064] Example 2:

[0065] The metal colorful processing method is:

[0066] Smooth the surface of the metal product to obtain a metal product with a mirror surface. Build a fixed fixture, place the product on the fixed fixture, fix the product, and adjust the fixed fixture horizontally so that the horizontal accuracy of the product reaches within 0.03mm of the marking range. Make and edit the graphic files that need to be processed, import the graphic files, and confirm the focus and marking position according to the graphic files. Set the processing parameters of the picosecond laser and nanosecond laser, among which the processing parameters of the picosecond laser are as follows: marking speed of 1200mm / s, jump speed of 2000mm / s, Q frequency of 1000KHz, laser power of 2W, filling spacing of 0.08mm, and focus position of 0.4mm upper defocus. The laser power of the nanosecond laser is 0.8W.

[0067] The picosecond laser is controlled according to process parameters to emit a picosecond laser. The laser passes through a beam combiner and a galvanometer before projecting onto the product surface, forming a marking pattern. Simultaneously, a dust extraction device is controlled to blow air and remove dust from the marking area. After marking, the picosecond laser stops emitting light. The nanosecond laser is controlled according to process parameters to emit a nanosecond laser. The laser passes through the beam combiner and a galvanometer before projecting onto the marking area, smoothing the micro-nano stripe structure that forms the marking pattern on the product surface. Finally, the product is removed from the fixture and cleaned.

[0068] Example 3:

[0069] The metal colorful processing method is:

[0070] Smooth the surface of the metal product to obtain a metal product with a mirror surface. Build a fixed fixture, place the product on the fixed fixture, fix the product, and adjust the fixed fixture horizontally so that the horizontal accuracy of the product reaches within 0.03mm of the marking range. Make and edit the graphic files that need to be processed, import the graphic files, and confirm the focus and marking position according to the graphic files. Set the processing parameters of the picosecond laser and nanosecond laser, among which the processing parameters of the picosecond laser are as follows: marking speed of 800mm / s, jump speed of 2000mm / s, Q frequency of 600KHz, laser power of 1W, filling spacing of 0.05mm, and focus position of 0.2mm upper defocus. The laser power of the nanosecond laser is 0.8W.

[0071] The picosecond laser is controlled to emit according to the process parameters. The laser passes through a beam combiner and a galvanometer before projecting onto the product surface, forming a marking pattern. Simultaneously, a dust extraction device is controlled to blow air and remove dust from the marking area. After marking, the picosecond laser stops emitting light, and the nanosecond laser is controlled to emit nanosecond laser light. The nanosecond laser passes through the beam combiner and a galvanometer before projecting onto the marking area, smoothing the micro-nano stripe structure that forms the marking pattern on the product surface. Finally, the product is removed from the fixture and cleaned.

[0072] Obviously, the embodiments described above are only some of the embodiments of the present application, rather than all of the embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the present application specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present application.

Claims

1. A method for processing metal colorful, characterized in that: The steps include: Place the product on a fixed fixture and fix it; Import the graphic file to be processed and confirm the focus and marking position according to the graphic file; Set process parameters and control the picosecond laser to mark the product surface; Control the nanosecond laser to modify the marked pattern; During the marking process, the picosecond laser interferes with the plasma generated by the laser, thereby producing a micro-nano stripe structure on the surface of the product, so that a pattern with a colorful effect can be formed on the metal surface. The pattern is then modified by the nanosecond laser to obtain a marking pattern with a more delicate colorful effect.

2. The metal colorful processing method according to claim 1, characterized in that: The picosecond laser power emitted by the picosecond laser is greater than the nanosecond laser power emitted by the nanosecond laser.

3. The metal colorful processing method according to claim 1, characterized in that: The step of controlling the picosecond laser to mark the surface of the product is specifically as follows: after controlling the picosecond laser to emit the picosecond laser, the picosecond laser passes through the beam combiner and the galvanometer in sequence and is projected onto the surface of the product, forming a marking pattern on the surface of the product.

4. The metal colorful processing method according to claim 3, characterized in that: The step of controlling the nanosecond laser to modify the marked pattern is specifically as follows: after controlling the nanosecond laser to emit nanosecond laser, the nanosecond laser passes through the beam combiner and the galvanometer in sequence and is projected to the position of the marking pattern, thereby smoothing the micro-nano stripe structure constituting the marking pattern on the surface of the product.

5. The metal colorful processing method according to claim 2, characterized in that: The picosecond laser power is 0.8W-2W.

6. The metal colorful processing method according to claim 1, characterized in that: The picosecond laser is an infrared picosecond laser with a wavelength of 1064 nm; the nanosecond laser is an infrared nanosecond laser with a wavelength of 1064 nm.

7. The metal colorful processing method according to claim 1, characterized in that: The step of controlling the picosecond laser to perform laser engraving on the surface of the product also includes: controlling the dust extraction device to blow air and extract dust from the marking position.

8. The metal colorful processing method according to claim 1, characterized in that: Before the step of placing the product on the fixing fixture and fixing the product, the step further includes: The surface of the metal product is smoothed to obtain a metal product with a mirror surface.

9. The metal colorful processing method according to claim 1, characterized in that: The picosecond laser controls the filling spacing to be 0.03-0.08 mm.

10. A laser processing device using the metal colorful processing method according to any one of claims 1 to 9, characterized in that: It includes a fixed fixture, a picosecond laser and a nanosecond laser. The fixed fixture is used to load products, the picosecond laser is used to mark the surface of the product, and the nanosecond laser is used to modify the marking pattern on the product.

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