Lamination detection method and device for display panel

Abstract

The present disclosure relates to the technical field of electronic devices, and in particular to a display panel bonding detection method and device. A display panel bonding detection method is applied to an electronic device, and the method comprises: obtaining detection information of a preset key position on the display panel corresponding to a detection type based on the detection type; and in response to the detection information of the preset key position satisfying a preset condition corresponding to the detection type, determining that the detection type passes the detection. In the present disclosure, the display panel can be subjected to bonding detection in multiple dimensions, thereby improving the bonding detection effect.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, specifically to a method and apparatus for detecting the bonding of a display panel. Background Technology

[0002] During the manufacturing process of a display screen, a cover glass lamination (CG Lami) process is performed. This process involves bonding a cover glass and a panel together to form the display screen. Simulation testing is required during the lamination process to verify whether the display screen meets the lamination design requirements and to provide feedback for optimizing the lamination fixture design. Summary of the Invention

[0003] To improve the bonding detection effect of display panels, this disclosure provides a method, apparatus, electronic device, and storage medium for bonding detection of display panels.

[0004] In a first aspect, embodiments of this disclosure provide a method for detecting the bonding of a display panel, applied to an electronic device, the method comprising:

[0005] Based on the detection type, obtain the detection information of the preset key position on the display panel corresponding to the detection type;

[0006] In response to the detection information at the preset key location satisfying the preset conditions corresponding to the detection type, it is determined that the detection type has passed.

[0007] In some embodiments, when the detection type is an adhesion detection of the edge region of the display panel, the step of obtaining detection information of a preset key position on the display panel corresponding to the detection type based on the detection type includes:

[0008] Obtain a first stress value at at least one edge key point on the display panel, and a second stress value in a preset area near the edge of the display panel; the stress value represents the magnitude of the compressive stress on the display panel during the bonding process;

[0009] The detection information is determined based on the first stress value and the second stress value.

[0010] In some implementations, the process of determining whether the detection information at the preset key location satisfies preset conditions corresponding to the detection type includes:

[0011] In response to the fact that the difference between the first stress value and the second stress value is not less than a first preset threshold, it is determined that the detection information meets the preset conditions corresponding to the detection type.

[0012] In some embodiments, obtaining the second stress value includes:

[0013] Obtain the stress values ​​of at least two key points in the preset region;

[0014] The maximum stress value among the stress values ​​of the at least two key points is determined to be the second stress value; or, the average stress value of the at least two key points is determined to be the second stress value.

[0015] In some embodiments, when the detection type is the bonding sequence detection of the bending area of ​​the display panel, the step of obtaining detection information of a preset key position on the display panel corresponding to the detection type based on the detection type includes:

[0016] Obtain a third stress value in a preset area near the edge of the display panel in the bending region, and determine the detection information based on the third stress value;

[0017] And / or,

[0018] The area of ​​a preset region near the edge of the display panel in the bending region is obtained, and the detection information is determined based on the area.

[0019] In some implementations, the process of determining whether the detection information at the preset key location satisfies preset conditions corresponding to the detection type includes:

[0020] In response to the third pressure value being not less than the second preset threshold, and / or in response to the area being not greater than the third preset threshold, it is determined that the detection information satisfies the preset condition corresponding to the detection type.

[0021] In some embodiments, when the detection type is a bonding detection of the opening area of ​​the display panel, the step of obtaining detection information of a preset key position on the display panel corresponding to the detection type based on the detection type includes:

[0022] Obtain the stress values ​​of at least one set of key points on the display panel near the edge of the opening area; the set of key points includes two key points located on opposite sides of the opening area;

[0023] The detection information is determined based on the stress values ​​of at least one set of key points.

[0024] In some implementations, the process of determining whether the detection information at the preset key location satisfies preset conditions corresponding to the detection type includes:

[0025] In response to the fact that the difference in stress values ​​between two key points in the at least one set of key points is not greater than a fourth preset threshold, it is determined that the detection information meets the preset conditions corresponding to the detection type.

[0026] In some embodiments, the method described in this disclosure further includes:

[0027] In response to the detection information at the preset key location not meeting the preset conditions corresponding to the detection type, a detection result corresponding to the detection type is generated;

[0028] The compensation parameters for the bonding fixture are determined based on the test results; the bonding fixture is used to bond the display panel.

[0029] The fitting fixture is adjusted according to the compensation parameters.

[0030] Secondly, this disclosure provides a display panel bonding detection device for use in electronic devices, the device comprising:

[0031] The acquisition module is configured to acquire detection information of a preset key position on the display panel corresponding to the detection type based on the detection type;

[0032] The first determining module is configured to determine that the detection type has passed in response to the detection information at the preset key location satisfying the preset conditions corresponding to the detection type.

[0033] In some embodiments, when the detection type is adhesion detection of the edge region of the display panel, the acquisition module is specifically configured to:

[0034] Obtain a first stress value at at least one edge key point on the display panel, and a second stress value in a preset area near the edge of the display panel; the stress value represents the magnitude of the compressive stress on the display panel during the bonding process;

[0035] The detection information is determined based on the first stress value and the second stress value.

[0036] In some implementations, the first determining module is specifically configured as follows:

[0037] In response to the fact that the difference between the first stress value and the second stress value is not less than a first preset threshold, it is determined that the detection information meets the preset conditions corresponding to the detection type.

[0038] In some implementations, the acquisition module is specifically configured as follows:

[0039] Obtain the stress values ​​of at least two key points in the preset region;

[0040] The maximum stress value among the stress values ​​of the at least two key points is determined to be the second stress value; or, the average stress value of the at least two key points is determined to be the second stress value.

[0041] In some embodiments, when the detection type is the bonding sequence detection of the bending area of ​​the display panel, the acquisition module is specifically configured as follows:

[0042] Obtain a third stress value in a preset area near the edge of the display panel in the bending region, and determine the detection information based on the third stress value;

[0043] And / or,

[0044] The area of ​​a preset region near the edge of the display panel in the bending region is obtained, and the detection information is determined based on the area.

[0045] In some implementations, the first determining module is specifically configured as follows:

[0046] In response to the third pressure value being not less than the second preset threshold, and / or in response to the area being not greater than the third preset threshold, it is determined that the detection information satisfies the preset condition corresponding to the detection type.

[0047] In some embodiments, when the detection type is an adhesion detection of the opening area of ​​the display panel, the acquisition module is specifically configured to:

[0048] Obtain the stress values ​​of at least one set of key points on the display panel near the edge of the opening area; the set of key points includes two key points located on opposite sides of the opening area;

[0049] The detection information is determined based on the stress values ​​of at least one set of key points.

[0050] In some implementations, the first determining module is specifically configured as follows:

[0051] In response to the fact that the difference in stress values ​​between two key points in the at least one set of key points is not greater than a fourth preset threshold, it is determined that the detection information meets the preset conditions corresponding to the detection type.

[0052] In some embodiments, the apparatus described in this disclosure further includes:

[0053] The generation module is configured to generate a detection result corresponding to the detection type in response to the detection information at the preset key position not meeting the preset conditions corresponding to the detection type.

[0054] The second determining module is configured to determine compensation parameters for the bonding fixture based on the detection results; the bonding fixture is used to bond the display panel.

[0055] The adjustment module is configured to adjust the parameters of the fitting fixture according to the compensation parameters.

[0056] Thirdly, embodiments of this disclosure provide an electronic device, including:

[0057] Processor; and

[0058] The memory stores computer instructions that can be read by the processor, and when the computer instructions are read, the processor executes the method according to any embodiment of the first aspect.

[0059] Fourthly, embodiments of this disclosure provide a storage medium for storing computer-readable instructions for causing a computer to perform the method according to any embodiment of the first aspect.

[0060] The bonding detection method for display panels disclosed herein is applied to electronic devices. It includes acquiring detection information at preset key locations on the display panel corresponding to a detection type, and determining that the detection type has passed in response to the detection information at the preset key locations satisfying preset conditions corresponding to the detection type. In this embodiment, bonding detection can be performed on the display panel from multiple dimensions, improving the bonding detection effect. Furthermore, corresponding detection methods are established for different detection types, thereby specifically locating defect types existing in the bonding process, facilitating subsequent targeted optimization design of the bonding process. Attached Figure Description

[0061] To more clearly illustrate the technical solutions in the specific embodiments of this disclosure or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0062] Figure 1 This is a schematic diagram of the display panel bonding process according to some embodiments of this disclosure.

[0063] Figure 2 This is a flowchart of a bonding detection method according to some embodiments of this disclosure.

[0064] Figure 3 This is a schematic diagram illustrating the principle of bending area fitting according to some embodiments of this disclosure.

[0065] Figure 4 This is a schematic diagram of the structure of the display panel according to some embodiments of this disclosure.

[0066] Figure 5 This is a flowchart of a bonding detection method according to some embodiments of this disclosure.

[0067] Figure 6 This is a flowchart of a bonding detection method according to some embodiments of this disclosure.

[0068] Figure 7 This is a flowchart of a bonding detection method according to some embodiments of this disclosure.

[0069] Figure 8 This is a flowchart of a bonding detection method according to some embodiments of this disclosure.

[0070] Figure 9 This is a flowchart of a bonding detection method according to some embodiments of this disclosure.

[0071] Figure 10 This is a flowchart of a bonding detection method according to some embodiments of this disclosure.

[0072] Figure 11 This is a structural block diagram of the bonding detection device according to some embodiments of this disclosure.

[0073] Figure 12 This is a structural block diagram of the bonding detection device according to some embodiments of this disclosure.

[0074] Figure 13 This is a structural block diagram of an electronic device suitable for implementing the bonding detection method of this disclosure. Detailed Implementation

[0075] The technical solutions of this disclosure will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure. Furthermore, the technical features involved in the different embodiments of this disclosure described below can be combined with each other as long as they do not conflict with each other.

[0076] With the development of smart electronic devices, screens have become one of the most important components of these devices. During the manufacturing process of the display panel, a cover plate bonding process (Lami) is performed. A Lami Pad is a bonding fixture used to bond the cover plate and the panel; the bonding is achieved by squeezing and expanding the Lami Pad.

[0077] Figure 1A schematic diagram illustrating the principle of the display panel bonding process is shown. (For example...) Figure 1 As shown, the display panel includes a cover plate 100 and a panel 200. The cover plate 100 is generally a glass cover plate, which can be a curved cover plate with bent areas on both sides or a flat cover plate; this disclosure does not limit this. The panel 200 is a screen display layer, which can be, for example, an AMOLED (Active-matrix organic light-emitting diode) component. An adhesive layer can be provided between the panel 200 and the cover plate 100 to achieve bonding. The bonding fixture 300 is a Lami Pad, which is used to press the panel 200 and the cover plate 100 to achieve bonding of the display panel. The design effect of the bonding fixture 300 directly affects the bonding effect of the display panel.

[0078] After completing the design of the bonding fixture 300, in order to ensure the bonding effect of the display panel and guarantee product yield, it is necessary to use electronic equipment such as computers to simulate and test the display panel bonded by the bonding fixture 300. The test results can determine whether the display panel meets the bonding design requirements, and can also provide feedback to guide the optimization of the bonding fixture 300.

[0079] Based on the above scenario, this disclosure provides a method, apparatus, electronic device, and storage medium for bonding and testing display panels, aiming to establish standardized testing of various performance indicators of display panels. This can accurately locate the types of defects existing in the bonding process and facilitate subsequent targeted optimization of bonding fixtures.

[0080] In a first aspect, the present disclosure provides a method for detecting the bonding of a display panel. The example method of the present disclosure can be applied to electronic devices such as computers and servers.

[0081] like Figure 2 As shown, in some embodiments, the display panel bonding detection method of this disclosure includes:

[0082] S210. Obtain detection information of preset key positions on the display panel corresponding to the detection type based on the detection type.

[0083] S220. In response to the detection information at the preset key position satisfying the preset conditions corresponding to the detection type, the detection type is determined to be passed.

[0084] Specifically, for the bonding inspection of display panels, a CTQ (Critical-To-Quality) model for display panel bonding inspection can be established in advance. This CTQ model includes multiple inspection types for display panels, the inspection information required for each inspection type, and the preset conditions corresponding to each inspection type.

[0085] The detection type indicates multiple detection dimensions of the display panel. For example, the detection type may include: bonding detection of the edge area of ​​the display panel, bonding sequence detection of the bent area of ​​the display panel, and bonding detection of the opening area of ​​the display panel.

[0086] For each detection type, it is necessary to obtain the detection information required for that type. The detection information represents the information of the preset key positions corresponding to the detection type. For example, in one example, the detection type is the bonding detection of the edge area of ​​the display panel. The detection information can be the stress value of the key points of the edge of the display panel, and the key points of the edge are the preset key positions.

[0087] Preset conditions represent the judgment logic corresponding to each detection type. This judgment logic can be executed based on the detection information to determine whether the preset conditions corresponding to that detection type are met. For example, in one example, the detection type still takes the bonding detection of the edge area of ​​the display panel as an example. The preset condition could be: whether the difference in stress values ​​between two preset edge key points is greater than a specific value. If so, it means that the detection information meets the preset conditions, that is, the edge area bonding detection passes. If not, it means that the detection information does not meet the preset conditions, that is, the edge area bonding detection fails.

[0088] Based on the above description, in some implementations, the pre-established CTQ detection model can be as shown in Table 1 below:

[0089] Table 1

[0090] Detection type Detection information Pre-set condition Type 1 Information 1 Condition 1 Type 2 Information 2 Condition 2 Type 3 Information 3 Condition 3 … … …

[0091] As can be seen from Table 1 above, the bonding detection method of this embodiment can perform detection for at least one detection type, and each detection type has its own detection logic.

[0092] Therefore, based on the pre-established detection model, when performing bonding detection on the display panel, the embodiments of this disclosure can obtain detection information corresponding to each detection type, as well as preset conditions corresponding to each detection type.

[0093] After obtaining the detection information and corresponding preset conditions, it can be determined whether the preset conditions are met based on the detection information. If yes, it means that the detection type of the display panel has passed. If no, it means that the detection type of the display panel has failed and there is a defect in that detection type.

[0094] For example, as shown in Table 1 above, when performing Type 1 detection, specific parameter values ​​can be obtained based on the information categories included in Information 1. These parameter values ​​represent the detection information for Type 1 detection. Then, it is determined whether Condition 1 is met based on the parameter values. If yes, it means the display panel has passed the Type 1 detection. If no, it means the display panel has failed the Type 1 detection.

[0095] In some implementations, each test type can be performed sequentially, and the display panel test is considered complete if all test types pass. If any test type fails, the display panel is determined to have a defect.

[0096] As described above, this embodiment of the present disclosure allows for multi-dimensional bonding inspection of the display panel, improving the bonding inspection effect. Furthermore, by establishing corresponding inspection methods for different inspection types, the types of defects existing in the bonding process can be specifically identified, facilitating subsequent targeted optimization of the bonding process design.

[0097] With the increasing popularity of full-screen devices, more and more smart devices are adopting full-screen screen designs. Taking smartphones as an example, some phones place the front-facing camera in a punch-hole area of ​​the screen to increase the screen-to-body ratio, thus requiring a corresponding opening area on the display panel. In addition, more and more electronic devices are adopting curved screen designs on the sides, requiring corresponding bending areas on both sides of the display panel in the width direction.

[0098] Based on the above scenario, in some embodiments of this disclosure, the detection type may include at least one of the following three types:

[0099] 1) Adhesion detection of the edge area of ​​the display panel.

[0100] Compared to other areas, the edge areas of a display panel are more prone to air bubbles during the bonding process, resulting in poor edge bonding and affecting product yield. Therefore, in some embodiments of this disclosure, bonding detection of the display panel edge areas can be included as one type of detection.

[0101] 2) Inspection of the bonding sequence of the bending area of ​​the display panel.

[0102] like Figure 3As shown, for the bent areas 110 on both sides of the display panel, during the bonding process, they need to be bonded sequentially from the inside to the edge, that is, in the order of "①-②-③-④" shown in the figure. However, if the bonding fixture 300 is not designed properly, the edge area may be bonded to the inside before the edge area during the bonding process of the bent area 110, which may result in the compressive stress in some parts of the bent area 110 not meeting the requirements, causing air bubbles. Therefore, in some embodiments of this disclosure, the bonding sequence detection of the bent area of ​​the display panel can be used as one of the detection types.

[0103] 3) Fitting test of the opening area of ​​the display panel.

[0104] like Figure 4 As shown, the display panel has an opening area 120. Because the opening area 120 has material removal holes, uneven stress is prone to occur during the bonding process, affecting product yield. Therefore, in some embodiments of this disclosure, bonding detection of the opening area of ​​the display panel can be used as one type of detection.

[0105] For each of the above-mentioned detection types, there are their own preset conditions and detection information, which will be explained in detail below.

[0106] like Figure 5 As shown, in some embodiments, when the detection type is adhesion detection of the edge area of ​​the display panel, the detection method of this disclosure includes:

[0107] S510: Obtain a first stress value at at least one edge key point on the display panel, and a second stress value in a preset area near the edge of the display panel.

[0108] S520. Determine the detection information based on the first stress value and the second stress value.

[0109] Specifically, in this embodiment of the present disclosure, the basic principle of bonding detection of the edge area is as follows: when the bonding of the edge area of ​​the display panel meets the design requirements, the compressive stress at the key edge point should be greater than the compressive stress at the inner edge position.

[0110] Based on this principle, when performing edge region fitting detection, the first stress value of at least one edge key point and the second stress value of a preset area near the edge can be obtained.

[0111] like Figure 4 As shown, edge key points refer to the detection points at the edge of the display panel, such as points B, D, E, F, and G in the figure. Preset areas represent areas close to the edge and located inside the edge, such as area A and area K.

[0112] It is worth noting that during the simulation testing of the display panel, the simulation program can output a stress sensing map of the entire display panel. This map represents the compressive stress distribution at various locations during the panel bonding process, and different colors are output for different stress distributions, thus revealing different stress distribution areas. In this embodiment, the first stress value of each edge key point can be obtained based on the stress sensing map.

[0113] In some implementations, the preset region is a low-stress region near the edge and located inside the edge. The low-stress region near the edge can be obtained based on the aforementioned stress sensing map, and this low-stress region is used as the preset region.

[0114] In one example, such as Figure 4 As shown, region A is determined to be a low-stress region based on the stress induction map, and thus region A is used as a preset region. Since the preset region has a certain coverage area, the second stress value can be determined as the stress value of that region.

[0115] like Figure 6 As shown, in some embodiments, the process of determining the second stress value in the detection method of this disclosure includes:

[0116] S511-1. Obtain the stress values ​​of at least two key points in the preset area.

[0117] S511-2. Determine the stress value of the largest among at least two key points as the second stress value.

[0118] Specifically, multiple key points can be determined from a preset area. Based on the aforementioned stress sensing map, the stress value corresponding to each key point can be determined, thus obtaining multiple stress values. The maximum stress value among the multiple stress values ​​is determined as the second stress value.

[0119] It is worth noting that in some implementations, since the preset area is a low-stress area, the maximum stress value in this area is used as the second stress value. Based on the aforementioned principle, it is known that the first stress value of the edge key point should be greater than the second stress value, so using the maximum stress value as the second stress value can further improve the fit detection effect of the edge area.

[0120] like Figure 7 As shown, in some embodiments, the process of determining the second stress value in the detection method of this disclosure includes:

[0121] S512-1. Obtain the stress values ​​of at least two key points in the preset area.

[0122] S512-2, Determine the average stress value of at least two key points as the second stress value.

[0123] Specifically, multiple key points can be determined from a preset area. Based on the aforementioned stress sensing map, the stress value corresponding to each key point can be determined, thereby obtaining multiple stress values. Then, the average stress value is calculated based on the multiple stress values, and the average stress value is determined as the second stress value.

[0124] It is understood that the second stress value of the preset region can also be determined in other ways, and is not limited to the above example, which will not be elaborated in this disclosure.

[0125] After obtaining the first stress value of the edge key point and the second stress value of the preset area, the first stress value and the second stress value can be used as detection information.

[0126] S530, in response to the difference between the first stress value and the second stress value not being less than the first preset threshold, determine that the detection information meets the preset conditions corresponding to the detection type.

[0127] Based on the aforementioned principles, it is known that during the bonding process, the first stress value should not be less than the second stress value. Therefore, a first preset threshold can be set based on the specific implementation scenario, and the difference between the first and second stress values ​​is compared with this first preset threshold. If the difference is less than the first preset threshold, it indicates that the stress at the edge of the display panel is low, resulting in poor bonding and possibly the presence of air bubbles. Thus, the preset conditions are not met, and this test type fails. If the difference is not less than the first preset threshold, it indicates that the stress at the edge of the display panel is high, and the bonding effect meets the requirements. Thus, the preset conditions are met, and this test type passes.

[0128] In one example, such as Figure 4 As shown, the first stress value of edge key point G is F. G The second stress value of the preset region A is determined to be F through the aforementioned implementation method. A The first preset threshold is a. Therefore, when F... G -F A When F ≥ a, the detection information is determined to meet the preset conditions. G -F A When <a, it is determined that the detection information does not meet the preset conditions.

[0129] Of course, it is understood that the above example only shows one edge key point G. In other implementations, multiple edge key points can be selected, for example... Figure 4 For points B, E, F, etc., as shown, the above process can be performed sequentially for each edge key point, and this disclosure will not elaborate further.

[0130] As can be seen from the above, in this embodiment of the present disclosure, the bonding effect of the edge area of ​​the display panel can be accurately detected based on the stress value of the edge key points and the preset area.

[0131] like Figure 8 As shown, in some embodiments, when the detection type is to detect the bonding sequence of the bent area of ​​the display panel, the detection method of this disclosure includes:

[0132] S810: Obtain the third stress value and / or area of ​​a preset area near the edge of the display panel in the bending region, and determine the detection information based on the third stress value and / or area.

[0133] S820, in response to the third pressure value not being less than the second preset threshold, and / or in response to the area not being greater than the third preset threshold, determine that the detection information meets the preset conditions corresponding to the detection type.

[0134] Specifically, in this embodiment of the invention, the basic principle of detecting the bonding sequence of the bending area is: when the bonding sequence of the bending area is accurate, there should be no large areas of low stress in the bending area, that is, no air bubbles will be generated.

[0135] Therefore, the detection information in this embodiment may include two aspects: 1) the stress value of a preset area near the edge of the bending region, the stress value should not be less than the required standard; 2) the area of ​​the preset area, the area should not exceed the required standard. Based on this principle, when performing bending region bonding sequence detection, the third stress value and / or area of ​​the preset area can be obtained.

[0136] In some implementations, the preset region can be a low-stress region near the edge, and the process of determining the third stress value can be the same as described above. Figure 6 , Figure 7 The implementation methods are readily applicable to those skilled in the art and will not be elaborated further. Furthermore, as described above, during the simulation testing of the display panel, the simulation program can output a stress-sensing map of the entire display panel, from which the area of ​​the preset region can be obtained.

[0137] After obtaining the third stress value and / or area of ​​the preset region, the third stress value and / or area can be used as detection information.

[0138] Based on the aforementioned principles, in this embodiment of the disclosure, when the detection information includes a third stress value, a second preset threshold can be set based on the specific implementation scenario, and the third stress value is compared with the second preset threshold. If the third stress value is less than the second preset threshold, it indicates that the bonding stress in the bending area is small, and the bonding effect is poor. This may be due to an incorrect bonding sequence caused by bonding the edges first, thus determining that the preset conditions are not met, and this detection type fails. If the third stress value is not less than the second preset threshold, it indicates that the bonding stress in the bending area meets the requirements, and the bonding sequence in the bending area is correct, thus determining that the preset conditions are met, and this detection type passes.

[0139] If the detection information includes the area of ​​a preset region, a third preset threshold can be set based on the specific implementation scenario. The area of ​​the preset region is then compared with the third preset threshold. If the area is greater than the third preset threshold, it indicates that the bonding effect of the bending area is poor, possibly due to an incorrect bonding sequence caused by bonding the edges first. Therefore, the preset conditions are not met, and this test type fails. If the area is not greater than the third preset threshold, it indicates that the bonding stress of the bending area meets the requirements, and the bonding sequence of the bending area is correct. Therefore, the preset conditions are met, and this test type passes.

[0140] When the detection information includes both the third stress value and the area of ​​the preset region, a second preset threshold and a third preset threshold can be set separately based on the specific implementation method. The third stress value is compared with the second preset threshold, and the area of ​​the preset region is compared with the third preset threshold. If the third stress value is not less than the second preset threshold and the area is not greater than the third preset threshold, it indicates that the bonding stress of the bending area meets the requirements and the bonding sequence of the bending area is correct, thus determining that the preset conditions are met and this detection type passes. If the third stress value is less than the second preset threshold, or the area is greater than the third preset threshold, it indicates that the bonding effect of the bending area is poor, possibly due to incorrect bonding sequence caused by bonding the edges first, thus determining that the preset conditions are not met and this detection type fails.

[0141] In one example, such as Figure 4 As shown, the third stress value of the preset region K is F. K The area is S K The second preset threshold is b, and the third preset threshold is c. Therefore, when F... K ≥b and S K When F ≤ c, the detection information is determined to meet the preset conditions. And when F K <b or S K When the value is greater than c, it is determined that the detection information does not meet the preset conditions.

[0142] As can be seen from the above, in this embodiment of the present disclosure, the bonding sequence of the bending area of ​​the display panel can be accurately detected based on the stress value and area of ​​the preset region.

[0143] like Figure 9 As shown, in some embodiments, when the detection type is adhesion detection of the opening area of ​​the display panel, the detection method of this disclosure includes:

[0144] S910. Obtain the stress values ​​of at least one set of key points on the display panel near the edge of the opening area.

[0145] S920. Determine the detection information based on the stress values ​​of at least one set of key points.

[0146] Specifically, in this embodiment of the disclosure, the basic principle of the bonding detection of the opening area is: when the opening area of ​​the display panel meets the bonding design requirements, the force around the opening area should be uniform.

[0147] Based on this principle, when performing bonding tests on the opening area, at least one set of stress values ​​at key points can be obtained. A set of key points includes two key points located on opposite sides of the opening area. For example... Figure 4 As shown, points H and J are key points on both sides of the edge of the opening region 120, and points H and J are located on both sides of the opening region 120, thus forming a set of key points. Through the aforementioned implementation method, the stress value of each key point can be obtained, thereby determining the stress value of each set of key points as detection information.

[0148] S930. In response to the fact that the difference in stress values ​​between two key points in at least one set of key points is not greater than a fourth preset threshold, it is determined that the detection information meets the preset conditions corresponding to the detection type.

[0149] Based on the aforementioned principles, it is known that during the bonding process, the uniformity of stress in the opening area should be ensured, meaning the difference between any two key points in a set of key points should be minimal. Therefore, a fourth preset threshold can be set based on the specific implementation scenario. The difference in stress values ​​between any two key points in a set of key points is compared to this fourth preset threshold. If the difference is greater than the fourth preset threshold, it indicates uneven stress distribution on both sides of the opening area, resulting in poor bonding performance. Thus, the preset conditions are not met, and this test type fails. If the difference is not greater than the fourth preset threshold, it indicates uniform stress distribution on both sides of the opening area, and the bonding performance meets the requirements. Thus, the preset conditions are met, and this test type passes.

[0150] In one example, a set of key points includes key points H and J, and the stress value of key point H is F. H The stress value at key point J is F. J The fourth preset threshold is d. Therefore, when |F H -F J When | ≤ d, the detection information is determined to meet the preset conditions. And when | F H -F J When |>d, it is determined that the detection information does not meet the preset conditions.

[0151] Of course, it is understood that the above example only shows one set of key points. In other implementations, multiple sets of key points can be selected, and the above process can be performed on each set of key points in sequence. This disclosure will not elaborate further on this.

[0152] As can be seen from the above, in this embodiment of the present disclosure, the bonding effect of the opening area of ​​the display panel can be accurately detected based on the stress value of the key points in the opening area.

[0153] It is worth noting that the preset thresholds in the above embodiments can be set according to specific implementation scenarios, and this disclosure does not impose any limitations on them. For example, in an exemplary embodiment, the first preset threshold a = 0.15 MPa, the second preset threshold b = 0.15 MPa, and the third preset threshold c = 2 * 5 mm 2 The fourth preset threshold is d = 0.25 MPa.

[0154] In some implementations, based on the above-described process, bonding tests can be performed on various testing types of the display panel to determine whether each testing type has passed. If all testing types pass, it indicates that the bonding process of the display panel meets the process requirements. If any testing type fails, it indicates that the bonding process of the display panel does not meet the process requirements, and the bonding fixture needs to be optimized and adjusted.

[0155] like Figure 10 As shown, in some embodiments, the detection method of this disclosure further includes:

[0156] S1010. In response to the fact that the detection information at the preset key position does not meet the preset conditions corresponding to the detection type, a detection result corresponding to the detection type is generated.

[0157] Specifically, when a certain type of detection fails, a corresponding detection result can be generated, which may include the difference between the detection information and the preset threshold.

[0158] S1020. Determine the compensation parameters for the fitting fixture based on the test results.

[0159] Specifically, the bonding fixture is the Lami Pad used to bond the display panel in the aforementioned embodiments. As mentioned above, the display panel's failure to pass the inspection indicates a need for design optimization of the bonding fixture. Therefore, compensation parameters for the bonding fixture can be determined based on the inspection results. The compensation parameters represent the numerical compensation applied to the original parameters of the bonding fixture.

[0160] S1030. Adjust the parameters of the fitting fixture according to the compensation parameters.

[0161] Specifically, after determining the compensation parameters, the bonding fixture can be adjusted and optimized to obtain a bonding fixture that meets the bonding process requirements.

[0162] In some implementations, when the bonding sequence detection of the bending area fails, the width of the bonding fixture and / or the radius of curvature of the upper surface can be adjusted by compensation parameters.

[0163] In some implementations, when the edge region fails the fitting test, the width of the fitting fixture, the radius of curvature of the upper surface, and the radius of curvature of the side surface can be adjusted by compensation parameters.

[0164] In some implementations, when the fit test of the opening area fails, the side slot size of the fitting fixture can be adjusted by using compensation parameters.

[0165] As described above, this embodiment allows for multi-dimensional bonding inspection of the display panel, improving the bonding inspection effect. Furthermore, corresponding inspection methods are established for different inspection types to specifically locate defect types present during the bonding process. Additionally, feedback from the inspection results guides the optimized design of the bonding fixture, improving the precision and efficiency of the bonding process.

[0166] Secondly, this disclosure provides a display panel bonding detection device, which can be applied to electronic devices such as computers and servers.

[0167] like Figure 11 As shown, in some embodiments, the display panel bonding detection device of this disclosure includes:

[0168] The acquisition module 10 is configured to acquire detection information of a preset key position on the display panel corresponding to the detection type based on the detection type;

[0169] The first determining module 20 is configured to determine that the detection type has passed in response to the detection information at the preset key position satisfying the preset conditions corresponding to the detection type.

[0170] As described above, this embodiment of the present disclosure allows for multi-dimensional bonding inspection of the display panel, improving the bonding inspection effect. Furthermore, by establishing corresponding inspection methods for different inspection types, the types of defects existing in the bonding process can be specifically identified, facilitating subsequent targeted optimization of the bonding process design.

[0171] In some embodiments, when the detection type is adhesion detection of the edge region of the display panel, the acquisition module 10 is specifically configured to:

[0172] Obtain a first stress value at at least one edge key point on the display panel, and a second stress value in a preset area near the edge of the display panel; the stress value represents the magnitude of the compressive stress on the display panel during the bonding process;

[0173] The detection information is determined based on the first stress value and the second stress value.

[0174] In some implementations, the first determining module 20 is specifically configured as follows:

[0175] In response to the fact that the difference between the first stress value and the second stress value is not less than a first preset threshold, it is determined that the detection information meets the preset conditions corresponding to the detection type.

[0176] In some embodiments, the acquisition module 10 is specifically configured as follows:

[0177] Obtain the stress values ​​of at least two key points in the preset region;

[0178] The maximum stress value among the stress values ​​of the at least two key points is determined to be the second stress value; or, the average stress value of the at least two key points is determined to be the second stress value.

[0179] In some embodiments, when the detection type is the bonding sequence detection of the bending area of ​​the display panel, the acquisition module 10 is specifically configured to:

[0180] Obtain a third stress value in a preset area near the edge of the display panel in the bending region, and determine the detection information based on the third stress value;

[0181] And / or,

[0182] The area of ​​a preset region near the edge of the display panel in the bending region is obtained, and the detection information is determined based on the area.

[0183] In some implementations, the first determining module 20 is specifically configured as follows:

[0184] In response to the third pressure value being not less than the second preset threshold, and / or in response to the area being not greater than the third preset threshold, it is determined that the detection information satisfies the preset condition corresponding to the detection type.

[0185] In some embodiments, when the detection type is an adhesion detection of the opening area of ​​the display panel, the acquisition module 10 is specifically configured to:

[0186] Obtain the stress values ​​of at least one set of key points on the display panel near the edge of the opening area; the set of key points includes two key points located on opposite sides of the opening area;

[0187] The detection information is determined based on the stress values ​​of at least one set of key points.

[0188] In some implementations, the first determining module 20 is specifically configured as follows:

[0189] In response to the fact that the difference in stress values ​​between two key points in the at least one set of key points is not greater than a fourth preset threshold, it is determined that the detection information meets the preset conditions corresponding to the detection type.

[0190] like Figure 12 As shown, in some embodiments, the apparatus described in this disclosure further includes:

[0191] The generation module 30 is configured to generate a detection result corresponding to the detection type in response to the detection information at the preset key position not meeting the preset conditions corresponding to the detection type.

[0192] The second determining module 40 is configured to determine compensation parameters for the bonding fixture based on the detection results; the bonding fixture is used to bond the display panel.

[0193] The adjustment module 50 is configured to adjust the parameters of the fitting fixture according to the compensation parameters.

[0194] As described above, this embodiment allows for multi-dimensional bonding inspection of the display panel, improving the bonding inspection effect. Furthermore, corresponding inspection methods are established for different inspection types to specifically locate defect types present during the bonding process. Additionally, feedback from the inspection results guides the optimized design of the bonding fixture, improving the precision and efficiency of the bonding process.

[0195] Thirdly, embodiments of this disclosure provide an electronic device, including:

[0196] Processor; and

[0197] The memory stores computer instructions that can be read by the processor, and when the computer instructions are read, the processor executes the method according to any embodiment of the first aspect.

[0198] Fourthly, embodiments of this disclosure provide a storage medium for storing computer-readable instructions for causing a computer to perform the method according to any embodiment of the first aspect.

[0199] Specifically, Figure 13 A schematic diagram of the structure of a computer system 600 suitable for implementing the methods of this disclosure is shown. Figure 13 The system shown can implement the corresponding functions of the aforementioned processor and storage medium.

[0200] like Figure 13As shown, the computer system 600 includes a processor 601, which can perform various appropriate actions and processes according to a program stored in memory 602 or a program loaded into memory 602 from storage section 608. Memory 602 also stores various programs and data required for the operation of system 600. Processor 601 and memory 602 are connected to each other via bus 604. Input / output (I / O) interface 605 is also connected to bus 604.

[0201] The following components are connected to I / O interface 605: an input section 606 including a keyboard, mouse, etc.; an output section 607 including a cathode ray tube (CRT), liquid crystal display (LCD), etc., and speakers, etc.; a storage section 608 including a hard disk, etc.; and a communication section 609 including a network interface card such as a LAN card, modem, etc. The communication section 609 performs communication processing via a network such as the Internet. A drive 610 is also connected to I / O interface 605 as needed. A removable medium 611, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., is installed on drive 610 as needed so that computer programs read from it can be installed into storage section 608 as needed.

[0202] In particular, according to embodiments of this disclosure, the above-described method process can be implemented as a computer software program. For example, embodiments of this disclosure include a computer program product comprising a computer program tangibly embodied on a machine-readable medium, the computer program containing program code for performing the above-described methods. In such embodiments, the computer program can be downloaded and installed from a network via communication section 609, and / or installed from removable medium 611.

[0203] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code, which contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0204] Obviously, the above embodiments are merely examples for clear illustration and are not intended to limit the embodiments. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all embodiments here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this disclosure.

Claims

1. A method for detecting the bonding of a display panel, characterized in that, Applied to electronic devices, the display panel includes a cover plate and a display layer. The bonding detection method is used to detect the bonding condition between the cover plate and the display layer. The method includes: Obtain a stress sensing map of the display panel, the stress sensing map representing the compressive stress distribution at various locations during the bonding process of the display panel; Based on the detection type, a preset key position corresponding to the detection type is determined on the display panel, and the detection information of the preset key position is determined based on the stress sensing map. The preset key position refers to the bonding position between the cover plate and the display layer, and the detection information includes the stress value of the preset key position. If the detection information at the preset key location satisfies the preset conditions corresponding to the detection type, it is determined that the detection type has passed. The detection types include at least one of the following: bonding detection for the edge area of ​​the display panel; bonding sequence detection for the bent area of ​​the display panel; and bonding detection for the opening area of ​​the display panel.

2. The method according to claim 1, characterized in that, When the detection type is the bonding detection of the edge area of ​​the display panel, the step of determining a preset key position on the display panel corresponding to the detection type based on the detection type, and determining the detection information of the preset key position based on the stress sensing map, includes: Based on the stress sensing map, a first stress value is obtained at at least one edge key point on the display panel, and a second stress value is obtained in a preset area near the edge of the display panel; the stress value represents the magnitude of the compressive stress of the display panel during the bonding process; The detection information is determined based on the first stress value and the second stress value.

3. The method according to claim 2, characterized in that, The process of determining whether the detection information at the preset key location meets the preset conditions corresponding to the detection type includes: In response to the fact that the difference between the first stress value and the second stress value is not less than a first preset threshold, it is determined that the detection information meets the preset conditions corresponding to the detection type.

4. The method according to claim 2, characterized in that, Obtaining the second stress value includes: Obtain the stress values ​​of at least two key points in the preset region; The maximum stress value among the stress values ​​of the at least two key points is determined to be the second stress value; or, the average stress value of the at least two key points is determined to be the second stress value.

5. The method according to claim 1, characterized in that, In the case where the detection type is the bonding sequence detection of the bending area of ​​the display panel, the step of determining a preset key position on the display panel corresponding to the detection type based on the detection type, and determining the detection information of the preset key position based on the stress sensing map, includes: Based on the stress sensing map, a third stress value is obtained in a preset area near the edge of the display panel in the bending region, and the detection information is determined based on the third stress value; And / or, Based on the stress sensing map, the area of ​​a preset area near the edge of the display panel in the bending region is obtained, and the detection information is determined based on the area.

6. The method according to claim 5, characterized in that, The process of determining whether the detection information at the preset key location meets the preset conditions corresponding to the detection type includes: In response to the third stress value being not less than the second preset threshold, and / or in response to the area being not greater than the third preset threshold, it is determined that the detection information satisfies the preset condition corresponding to the detection type.

7. The method according to claim 1, characterized in that, When the detection type is a bonding detection of the opening area of ​​the display panel, the step of determining a preset key position on the display panel corresponding to the detection type based on the detection type, and determining the detection information of the preset key position based on the stress sensing map, includes: Based on the stress sensing map, obtain the stress values ​​of at least one set of key points on the display panel near the edge of the opening area; the set of key points includes two key points located on opposite sides of the opening area; The detection information is determined based on the stress values ​​of at least one set of key points.

8. The method according to claim 7, characterized in that, The process of determining whether the detection information at the preset key location meets the preset conditions corresponding to the detection type includes: In response to the fact that the difference in stress values ​​between two key points in the at least one set of key points is not greater than a fourth preset threshold, it is determined that the detection information meets the preset conditions corresponding to the detection type.

9. The method according to any one of claims 1 to 8, characterized in that, Also includes: In response to the detection information at the preset key location not meeting the preset conditions corresponding to the detection type, a detection result corresponding to the detection type is generated; The compensation parameters for the bonding fixture are determined based on the test results; the bonding fixture is used to bond the display panel. The fitting fixture is adjusted according to the compensation parameters.

10. A device for detecting the bonding of a display panel, characterized in that, Applied to electronic devices, the display panel includes a cover plate and a display layer. The bonding detection device is used to detect the bonding between the cover plate and the display layer. The device includes: The acquisition module is configured to acquire a stress sensing map of the display panel, the stress sensing map representing the compressive stress distribution at various locations during the bonding process of the display panel, determine a preset key location on the display panel corresponding to the detection type based on the detection type, and determine the detection information of the preset key location based on the stress sensing map, the preset key location referring to the bonding position between the cover plate and the display layer, and the detection information including the stress value of the preset key location. The first determining module is configured to determine that the detection type has passed in response to the detection information at the preset key location satisfying a preset condition corresponding to the detection type; The detection types include at least one of the following: bonding detection for the edge area of ​​the display panel; bonding sequence detection for the bent area of ​​the display panel; and bonding detection for the opening area of ​​the display panel.

11. The apparatus according to claim 10, characterized in that, Also includes: The generation module is configured to generate a detection result corresponding to the detection type in response to the detection information at the preset key position not meeting the preset conditions corresponding to the detection type. The second determining module is configured to determine compensation parameters for the bonding fixture based on the detection results; the bonding fixture is used to bond the display panel. The adjustment module is configured to adjust the parameters of the fitting fixture according to the compensation parameters.

12. An electronic device, characterized in that, include: processor; as well as The memory stores computer instructions that can be read by the processor, and when the computer instructions are read, the processor executes the method according to any one of claims 1 to 9.

13. A storage medium, characterized in that, Used to store computer-readable instructions for causing a computer to perform the method according to any one of claims 1 to 9.

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