A carrier glass forming simulation device
By designing the carrier glass forming simulation device, real-time monitoring and measuring the forming process, the problem of the inability to intuitively reflect the flow state of the glass liquid in the prior art is solved, real-time monitoring of the impact of flow fluctuations on the thickness slope is achieved, and production efficiency is improved.
Patent Information
- Application Number
- CN202211684624.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-12-27
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2042-12-27
AI Technical Summary
In the processing and production of plate carrier glass, the prior art is difficult to intuitively reflect the flow state and process of glass liquid in the molding mold, resulting in the inability to effectively monitor the impact of flow fluctuations on the thickness slope of plate carrier glass, which is time-consuming and wasteful resources.
A plate-carrying glass forming simulation device is designed, including the main structure, molding mold, material injection device, recycling device, monitoring device, thickness measurement device and support top structure. Through real-time monitoring and measurement, the impact of molding and wetting process and flow fluctuations on the thickness slope is intuitively displayed.
The test of the carrier glass forming process is realized, and the impact of flow fluctuations on the thickness slope is monitored in real time, saving time and resources, and improving production efficiency.
Smart Images

Figure CN115862456B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of carrier glass production, in particular to a carrier glass molding simulation device. Background Art
[0002] In the production of carrier glass, carrier glass molding is a very important link. After being stirred and adjusted in the channel, the glass liquid enters the molding mold, flows out from the guide groove of the molding mold, and is formed into carrier glass after being edged and shaped. The flow state of the glass liquid in the molding mold and the average thickness and thickness slope of the carrier glass directly affect the stress, sag, BOW type and other qualities of the carrier glass. The temperature of the glass liquid in the molding mold reaches about 1300℃, which cannot intuitively reflect the flow state and process of the glass liquid in the molding mold.
[0003] In the existing production process, the effect of flow fluctuation on the thickness slope of the carrier glass can only be tested at the end of the production line, which is not only time-consuming but also wastes a lot of manpower and material resources. Summary of the invention
[0004] The purpose of the present invention is to solve the problems existing in the above-mentioned background technology and to provide a carrier glass forming simulation device.
[0005] To achieve the above object, the present invention provides the following technical solutions:
[0006] A carrier glass forming simulation device comprises a main structure, a forming mold, a material injection device, a recovery device, a monitoring device, a thickness measuring device and a supporting top structure; wherein the forming mold is located above the main structure, wherein the material injection device is located at one side of the main structure, wherein the recovery device is located below the main structure, wherein the monitoring device is located above the forming mold, wherein the thickness measuring device is located on the main structure, and wherein the supporting top structure is located at one side of the main structure;
[0007] The main structure is composed of a main frame, a remote bracket, a monitoring device bearing rod, a feed end bracket and a thickness gauge bearing rod; the main frame is vertically arranged, the remote bracket and the feed end bracket are respectively fixed to the top of the main frame, the monitoring device bearing rod is fixed to the top of the remote bracket and the feed end bracket, and the thickness gauge bearing rod is horizontally fixed between the main frame;
[0008] The molding die is composed of a distal end, a proximal end, a guide weir, a die tip, a distal confluence plate, a proximal confluence plate, a distal confluence tip, a proximal confluence tip and a buffer hopper; the distal end and the proximal end are respectively arranged at two ends of the molding die, the guide weir is arranged above the molding die, the die tip is arranged below the molding die, the proximal confluence plate is arranged at the proximal end, the distal confluence plate is arranged at the distal end, the distal confluence tip is arranged at the bottom of the distal end, the proximal confluence tip is arranged at the bottom of the proximal end, and the buffer hopper is docked at the proximal end;
[0009] The material injection device is composed of a feeding motor, a lifting pipe 1, a lifting pipe 2 and a discharge port; the lifting pipe 1 and the lifting pipe 2 are respectively connected to the upper and lower parts of the feeding motor, and the discharge port is opened on the lifting pipe 2;
[0010] The recycling device is composed of a receiving hopper and materials; the materials are located in the receiving hopper;
[0011] The supporting top structure is composed of an adjusting screw, a screw base and a screw head; the screw base is fixed on the main frame, the adjusting screw is assembled on the screw base, and the screw head is fixed on the top of the adjusting screw.
[0012] Preferably, the main frame is made of ordinary carbon steel, and the outside of the frame is sealed with a transparent acrylic plate.
[0013] Preferably, the upper surface of the molding die is inclined, and the inclination angle is 10°-15°, which gradually decreases from the proximal end to the distal end.
[0014] Preferably, the distal end and the proximal end are both baffle mechanisms.
[0015] Preferably, the material is silicone oil.
[0016] Preferably, a ball valve is provided in the buffer hopper.
[0017] Preferably, the monitoring device is provided at three locations, all of which are high-definition monitoring equipment, respectively located at the proximal end, the middle end and the distal end of the molding die.
[0018] Preferably, the thickness measuring device adopts a liquid laser thickness gauge, which is slidably mounted on a track and driven by a servo motor.
[0019] Preferably, the top of the lead screw is butted against the distal end of the forming die, and the inclination angle of the forming die can be changed by adjusting the lead screw, and the inclination angle range is 0°-10°.
[0020] Compared with the prior art, the present invention has the following beneficial effects:
[0021] The present invention is a carrier glass forming simulation device, which realizes the test of the carrier glass forming process, intuitively reflects the influence of the forming wetting process and the glass liquid flow fluctuation on the forming thickness slope, saves and archives data, and conducts experiments in real time, saving time, labor and resources. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;
[0023] Figure 2 for Figure 1 Schematic diagram of the structure of the forming mold.
[0024] In the figure: 1-main frame; 2-remote bracket; 3-monitoring device bearing rod; 4-feed end bracket; 5-thickness gauge bearing rod; 6-remote end; 7-proximal end; 8-diversion weir; 9-mold tip; 10-remote manifold; 11-proximal manifold; 12-remote manifold tip; 13-proximal manifold tip; 14-buffer hopper; 141-ball valve; 15-feeding motor; 16-lifting pipe 1; 17-lifting pipe 2; 18-discharge port; 19 receiving hopper; 20-material; 21-high-definition monitoring equipment; 22-liquid laser thickness gauge; 23-adjusting screw; 24-screw base; 25-screw top. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0026] Please refer to Figure 1-2 , the present invention provides a technical solution:
[0027] A carrier glass forming simulation device comprises a main structure, a forming mold, a material injection device, a recovery device, a monitoring device, a thickness measuring device and a supporting top structure; wherein the forming mold is located above the main structure, wherein the material injection device is located at one side of the main structure, wherein the recovery device is located below the main structure, wherein the monitoring device is located above the forming mold, wherein the thickness measuring device is located on the main structure, and wherein the supporting top structure is located at one side of the main structure;
[0028] The main structure is composed of a main frame 1, a remote bracket 2, a monitoring device bearing rod 3, a feed end bracket 4 and a thickness gauge bearing rod 5; the main frame 1 is vertically arranged, the remote bracket 2 and the feed end bracket 4 are respectively fixed to the top of the main frame 1, the monitoring device bearing rod 3 is fixed to the top of the remote bracket 2 and the feed end bracket 4, and the thickness gauge bearing rod 5 is horizontally fixed between the main frame 1;
[0029] The molding die is composed of a distal end 6, a proximal end 7, a guide weir 8, a die tip 9, a distal collector plate 10, a proximal collector plate 11, a distal collector tip 12, a proximal collector tip 13 and a buffer hopper 14; the distal end 6 and the proximal end 7 are respectively arranged at the two ends of the molding die, the guide weir 8 is arranged above the molding die, the die tip 9 is arranged below the molding die, the proximal collector plate 11 is arranged at the proximal end 7, the distal collector plate 10 is arranged at the distal end 6, the distal collector tip 12 is arranged at the bottom of the distal end 6, the proximal collector tip 13 is arranged at the bottom of the proximal end 7, and the buffer hopper 14 is docked at the proximal end 7;
[0030] The material injection device is composed of a feeding motor 15, a lifting pipe 16, a lifting pipe 2 17 and a discharge port 18; the lifting pipe 16 and the lifting pipe 2 17 are respectively connected to the upper and lower parts of the feeding motor 15, and the discharge port 18 is opened on the lifting pipe 2 17;
[0031] The recycling device is composed of a receiving hopper 19 and a material 20; the material 20 is located in the receiving hopper 19;
[0032] The supporting structure is composed of an adjusting screw 23, a screw base 24 and a screw head 25; the screw base 24 is fixed on the main frame 1, the adjusting screw 23 is assembled on the screw base 24, and the screw head 25 is fixed on the top of the adjusting screw 23.
[0033] The main frame 1 is made of ordinary carbon steel, and the outer side of the frame is sealed with a transparent acrylic plate.
[0034] The upper surface of the molding die is inclined, and the inclination angle is 10°-15°, and gradually decreases from the proximal end 7 to the distal end 6.
[0035] The distal end 6 and the proximal end 7 are both baffle mechanisms.
[0036] The material 20 is made of silicone oil.
[0037] A ball valve 141 is disposed in the buffer hopper 14 .
[0038] The monitoring device is provided at three locations, all of which are high-definition monitoring devices 21, respectively located at the proximal end, the middle end and the distal end of the molding die.
[0039] The thickness measuring device adopts a liquid laser thickness gauge 22, which is slidably mounted on a track and driven by a servo motor.
[0040] The lead screw head 25 is butted against the distal end 6 of the forming die. The inclination angle of the forming die can be changed by adjusting the lead screw 23, and the inclination angle range is 0°-10°.
[0041] Working principle of the present invention:
[0042] The material 20 enters the molding die from the proximal end 7 , and under the action of the diversion weir 8 , the material 20 flows out from the distal end 6 . As the material 20 fills the diversion groove, the material 20 begins to flow out from both sides of the diversion weir 8 and merges into one stream at the die tip 9 .
[0043] Among them, the material is 10000Pa.s25℃ silicone oil for molding simulation test. Silicone oil is less affected by ambient temperature, and changes in ambient temperature will not cause changes in silicone oil viscosity.
[0044] 130 kg of silicone oil is pre-injected into the buffer hopper 14, the ball valve 141 is opened, and the silicone oil begins to be injected from the feed port. At this time, the monitoring device 21 is turned on to record the flow process of the silicone oil in real time. Under the action of the distal manifold 10, the silicone oil flows out from the distal end and converges to the proximal manifold tip and the mold tip 9.
[0045] By adjusting the lead screw 23 and raising the angle of the molding die, the silicone oil accelerates to move toward the proximal end due to the dual effects of increasing the amount of silicone oil injected into the mold and raising the angle. Under the blocking effect of the proximal manifold 11 and the guide weir 8, the silicone oil gradually fills the molding die.
[0046] After the mold is filled with silicone oil, it flows out from both sides of the diversion weir 8, merges into one stream at the mold tip 9, flows into the receiving hopper 19, and is recycled and reused, thus completing the wetting process of the molding mold.
[0047] Through on-site observation and video monitoring, possible problems in the wetting process can be discovered at any time and production line improvements can be proposed.
[0048] The ball valve 141 is adjusted to control the amount of silicone oil injected, and the angle of the molding die is adjusted to 0° by adjusting the lead screw 23 .
[0049] The feeding motor 15 is started, and the silicone oil flows from the receiving hopper 19 through the lifting pipe 16 and the lifting pipe 2 17 from the discharge port 18 into the buffer hopper 14, thereby realizing the circulation of the silicone oil.
[0050] By controlling the frequency of the feeding motor 15 and adjusting the amount of silicone oil injected, the influence of the flow rate increasing or decreasing and changing rapidly on the slope of the molding thickness is observed, which is recorded and saved through the monitoring device 21, and the silicone oil flow thickness is monitored through the liquid laser thickness gauge 22.
[0051] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.
Claims
1. A carrier glass forming simulation device, characterized in that: It includes a main structure, a forming die, a material injection device, a recovery device, a monitoring device, a thickness measuring device and a supporting top structure; The forming die is located above the main structure, the material injection device is located at one side of the main structure, the recovery device is located below the main structure, the monitoring device is located above the forming die, the thickness measuring device is located on the main structure, and the supporting structure is located at one side of the main structure; The main structure is composed of a main frame (1), a remote bracket (2), a monitoring device bearing rod (3), a feed end bracket (4) and a thickness gauge bearing rod (5); the main frame (1) is arranged vertically, the remote bracket (2) and the feed end bracket (4) are respectively fixed to the top of the main frame (1), the monitoring device bearing rod (3) is fixed to the top of the remote bracket (2) and the feed end bracket (4), and the thickness gauge bearing rod (5) is horizontally fixed between the main frame (1); The molding die is composed of a distal end (6), a proximal end (7), a guide weir (8), a die tip (9), a distal collector plate (10), a proximal collector plate (11), a distal collector tip (12), a proximal collector tip (13) and a buffer hopper (14); the distal end (6) and the proximal end (7) are respectively arranged at two ends of the molding die, the guide weir (8) is arranged above the molding die, the die tip (9) is arranged below the molding die, the proximal collector plate (11) is arranged at the proximal end (7), the distal collector plate (10) is arranged at the distal end (6), the distal collector tip (12) is arranged at the bottom of the distal end (6), the proximal collector tip (13) is arranged at the bottom of the proximal end (7), and the buffer hopper (14) is connected to the proximal end (7); The material injection device is composed of a feeding motor (15), a lifting pipe 1 (16), a lifting pipe 2 (17) and a discharge port (18); the lifting pipe 1 (16) and the lifting pipe 2 (17) are respectively connected to the upper and lower parts of the feeding motor (15), and the discharge port (18) is opened on the lifting pipe 2 (17); The recycling device is composed of a material receiving hopper (19) and a material (20); the material (20) is located in the material receiving hopper (19); The supporting structure is composed of an adjusting screw (23), a screw base (24) and a screw head (25); the screw base (24) is fixed to the main frame (1), the adjusting screw (23) is assembled on the screw base (24), and the screw head (25) is fixed to the top of the adjusting screw (23); The lifting pipe 1 (16) connected to one end of the feeding motor (15) extends into the receiving hopper (19), and the lifting pipe 2 (17) connected to the other end extends into the buffer hopper (14); The upper surface of the molding die is inclined, and its inclination angle is 10°-15°, and gradually decreases from the proximal end (7) to the distal end (6).
2. The carrier glass forming simulation device according to claim 1, characterized in that: The main frame (1) is made of ordinary carbon steel, and the outer side of the frame is sealed with a transparent acrylic plate.
3. The carrier glass forming simulation device according to claim 1, characterized in that: The distal end (6) and the proximal end (7) are both baffle mechanisms.
4. The carrier glass forming simulation device according to claim 1, characterized in that: The material (20) is silicone oil.
5. The carrier glass forming simulation device according to claim 1, characterized in that: A ball valve (141) is provided in the buffer hopper (14).
6. The carrier glass forming simulation device according to claim 1, characterized in that: The monitoring device is provided at three locations, all of which are high-definition monitoring devices (21), and are located at the proximal end, the middle end, and the distal end of the molding die, respectively.
7. The carrier glass forming simulation device according to claim 1, characterized in that: The thickness measuring device adopts a liquid laser thickness gauge (22), which is slidably mounted on a track and driven by a servo motor.
8. The carrier glass forming simulation device according to claim 1, characterized in that: The lead screw head (25) is butted against the distal end (6) of the forming die, and the inclination angle of the forming die can be changed by adjusting the lead screw (23), wherein the inclination angle ranges from 0° to 10°.
Citation Information
Patent Citations
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CN105731766A
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CN106710421A