Display panel, preparation method thereof and display device

Abstract

This application discloses a display panel and its manufacturing method, as well as a display device. By adding a first thermally conductive material to the region corresponding to the first primary color light-emitting unit in the first film layer on the side of the light-emitting unit away from the substrate, a first thermally conductive area is formed. This utilizes the first thermally conductive material to effectively conduct the heat emitted by the first primary color light-emitting unit out of the first primary color light-emitting unit, enhancing heat dissipation of the first primary color light-emitting unit and achieving point-to-point heat dissipation compensation for the first primary color light-emitting unit. This avoids the accumulation of heat emitted by the first primary color light-emitting unit, which could affect the luminous efficiency, stability, and lifespan of the first primary color light-emitting unit, thereby improving the performance of the display panel. Furthermore, the particle size of the first thermally conductive material is smaller than the wavelength of the first primary color visible light emitted by the first primary color light-emitting unit, thus allowing the first primary color visible light emitted by the first primary color light-emitting unit to pass through the first thermally conductive area without being affected by the added first thermally conductive material.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and its manufacturing method, and a display device. Background Technology

[0002] For display panels, the light-emitting units generate heat during operation. As the light-emitting units continue to work, the heat they emit also increases. If this heat continues to accumulate, it will not only affect the luminous efficiency and stability of the light-emitting units, but also lead to a shorter lifespan for the light-emitting units, thus affecting the performance of the display panel. Summary of the Invention

[0003] To address the aforementioned technical problems, embodiments of this application provide a display panel that enhances heat dissipation from the light-emitting units within the display panel, thereby improving the performance of the display panel.

[0004] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0005] A display panel, comprising:

[0006] substrate;

[0007] A light-emitting unit located on one side of a substrate, the light-emitting unit includes a first primary color light-emitting unit, the first primary color light-emitting unit being used to emit first primary color visible light;

[0008] A first film layer is located on the side of the light-emitting unit away from the substrate. The first film layer includes a first thermally conductive region, which is correspondingly disposed with the first primary color light-emitting unit. The first thermally conductive region includes a first thermally conductive material, which is used to conduct heat emitted by the first primary color light-emitting unit. The particle size of the first thermally conductive material is smaller than the wavelength of the first primary color visible light.

[0009] A method for manufacturing a display panel, comprising:

[0010] Provide a substrate;

[0011] A light-emitting unit is formed on one side of the substrate. The light-emitting unit includes a first primary color light-emitting unit, which is used to emit first primary color visible light.

[0012] A first film layer is formed on the side of the light-emitting unit away from the substrate. The first film layer includes a first thermally conductive region, which is disposed corresponding to the first primary color light-emitting unit. The first thermally conductive region includes a first thermally conductive material, which is used to conduct heat emitted by the first primary color light-emitting unit. The particle size of the first thermally conductive material is smaller than the wavelength of the first primary color visible light.

[0013] A display device includes the aforementioned display panel.

[0014] Compared with existing technologies, the above technical solution has the following advantages:

[0015] The display panel provided in this application embodiment forms a first thermally conductive area by adding a first thermally conductive material to the area corresponding to the first primary color light-emitting unit in the first film layer on the side of the light-emitting unit away from the substrate. This effectively conducts the heat emitted by the first primary color light-emitting unit out of the first primary color light-emitting unit, enhancing heat dissipation of the first primary color light-emitting unit and achieving point-to-point heat dissipation compensation for the first primary color light-emitting unit. This avoids the accumulation of heat emitted by the first primary color light-emitting unit, which could affect the luminous efficiency, stability, and lifespan of the first primary color light-emitting unit, thereby improving the performance of the display panel. Furthermore, the particle size of the first thermally conductive material is smaller than the wavelength of the first primary color visible light emitted by the first primary color light-emitting unit, allowing the first primary color visible light emitted by the first primary color light-emitting unit to pass through the first thermally conductive area without being affected by the added first thermally conductive material. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0018] Figure 2 This is a schematic diagram showing the conduction of heat emitted by the first primary color light-emitting unit through the first heat-conducting area in the display panel provided in the embodiments of this application.

[0019] Figure 3 This is a schematic diagram of the heat conduction path when the first heat conduction material in the first heat conduction area of ​​the display panel provided in the embodiments of this application simultaneously includes boron nitride quantum dot material and boron nitride nanopowder;

[0020] Figure 4 This is a schematic diagram of another structure of the display panel provided in an embodiment of this application;

[0021] Figure 5 This is another structural schematic diagram of the display panel provided in the embodiments of this application;

[0022] Figure 6 This is a schematic diagram illustrating another structural design of the display panel provided in an embodiment of this application;

[0023] Figure 7 This is another structural schematic diagram of the display panel provided in the embodiments of this application;

[0024] Figure 8 This is a schematic flowchart illustrating the method for manufacturing a display panel according to an embodiment of this application.

[0025] Figures 9(a)-9(c) A schematic diagram of the structure corresponding to each process step in the method for manufacturing a display panel provided in the embodiments of this application;

[0026] Figure 10 A schematic flowchart illustrating the preparation process of an optical adhesive containing boron nitride quantum dot material of a predetermined particle size, in the method for preparing a display panel provided in this application embodiment;

[0027] Figure 11 This is a schematic diagram of the structure of the display device provided in the embodiment of this application. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0030] Secondly, this application provides a detailed description in conjunction with schematic diagrams. When detailing the embodiments of this application, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this application. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0031] As described in the background section, the light-emitting units of the display panel generate heat during operation. As the light-emitting units continue to work, the heat emitted by the light-emitting units also increases. If this heat continues to accumulate, it will not only affect the luminous efficiency and stability of the light-emitting units, but also lead to a shorter lifespan of the light-emitting units, thus affecting the performance of the display panel.

[0032] In view of this, embodiments of this application provide a display panel, Figure 1 This application provides a schematic diagram of the structure of a display panel according to an embodiment of the present application. Figure 1 As shown, the display panel includes:

[0033] substrate 10;

[0034] The light-emitting unit 20 is located on one side of the substrate 10. The light-emitting unit 20 includes a first primary color light-emitting unit 21, which is used to emit first primary color visible light.

[0035] A first film layer 30 is located on the side of the light-emitting unit 20 facing away from the substrate 10. The first film layer 30 includes a first thermally conductive region 31, which is correspondingly disposed with the first primary color light-emitting unit 21. Figure 1 A partially enlarged schematic diagram of the first heat-conducting region 31 is also shown, such as... Figure 1 As shown, the first heat-conducting region 31 includes a first heat-conducting material 310, which is used to conduct heat emitted by the first primary color light-emitting unit 21. The particle size of the first heat-conducting material 310 is smaller than the wavelength of the first primary color visible light.

[0036] In the embodiments of this application, the first primary color visible light can be any one of red light, green light and blue light. This application does not limit the specific type of primary color visible light, but it depends on the specific circumstances.

[0037] Figure 2 The diagram further illustrates the conduction of heat emitted by the first primary color light-emitting unit 21 through the first heat-conducting region 31. The arrows in the diagram represent the direction of heat conduction from the first primary color light-emitting unit 21. Figure 3 As can be seen in this embodiment, by adding a first thermally conductive material 310 to the region (i.e., the first thermally conductive region 31) of the first film layer 30 on the side of the light-emitting unit 20 away from the substrate 10 corresponding to the first primary color light-emitting unit 21, the heat emitted by the first primary color light-emitting unit 21 is effectively conducted out of the first primary color light-emitting unit 21 by the first thermally conductive material 310, thereby achieving point-to-point heat dissipation compensation for the first primary color light-emitting unit 21 and avoiding the impact on the luminous efficiency, stability and lifespan of the first primary color light-emitting unit 21 due to the accumulation of heat emitted by the first primary color light-emitting unit 21.

[0038] Specifically, according to the heat conduction path theory, as the amount of the first heat conduction material 310 added to the first heat conduction zone 31 increases, the first heat conduction material forms multiple "island structures" in the first heat conduction zone 31, and heat conduction paths are formed between different "island structures". Different heat conduction paths are interconnected, thereby effectively conducting the heat emitted by the first primary color light-emitting unit 21.

[0039] It is understood that the first thermally conductive material 310 added to the first thermally conductive region 31 cannot affect the transmission of the first primary color visible light emitted by the first primary color light-emitting unit 21, that is, it cannot affect the optical effect of the first primary color light-emitting unit 21. Therefore, in the embodiments of this application, the particle size of the first thermally conductive material 310 is smaller than the wavelength of the first primary color visible light, thereby allowing the first primary color visible light emitted by the first primary color light-emitting unit 21 to pass through the first thermally conductive region 31 without being affected by the added first thermally conductive material 310.

[0040] Therefore, the display panel provided in this application embodiment forms a first thermally conductive area 31 by adding a first thermally conductive material 310 to the area corresponding to the first primary color light-emitting unit 21 in the first film layer 30 on the side of the light-emitting unit 20 away from the substrate 10. This effectively conducts the heat emitted by the first primary color light-emitting unit 21 out of the first primary color light-emitting unit 21 using the first thermally conductive material 310, thereby enhancing the heat dissipation of the first primary color light-emitting unit 21 and achieving point-to-point heat dissipation compensation for the first primary color light-emitting unit 21. This avoids the luminous efficiency, stability, and lifespan of the first primary color light-emitting unit 21 being affected by the accumulation of heat emitted by the first primary color light-emitting unit 21, thus improving the performance of the display panel. Furthermore, the particle size of the first thermally conductive material 310 is smaller than the wavelength of the first primary color visible light emitted by the first primary color light-emitting unit 21, thereby allowing the first primary color visible light emitted by the first primary color light-emitting unit 21 to pass through the first thermally conductive area 31 without being affected by the added first thermally conductive material.

[0041] In this embodiment, the first heat-conducting area 31 is correspondingly arranged with the first primary color light-emitting unit 21. The manner in which the first heat-conducting area 31 and the first primary color light-emitting unit 21 are correspondingly arranged will be described below.

[0042] Optionally, in one embodiment of this application, such as Figure 1 As shown, the orthographic projection of the first heat-conducting area 31 onto the plane of the substrate 10 at least partially overlaps with the orthographic projection of the first primary color light-emitting unit 21 onto the plane of the substrate 10. Therefore, for the portion where the orthographic projections of the first heat-conducting area 31 and the first primary color light-emitting unit 21 onto the plane of the substrate 10 overlap, the heat emitted by the first primary color light-emitting unit 21 can be transferred to the first heat-conducting area 31 more quickly and be conducted away by the first heat-conducting material 310 in the first heat-conducting area 31.

[0043] Therefore, the more the orthographic projection of the first heat-conducting area 31 on the plane of the substrate 10 overlaps with the orthographic projection of the first primary color light-emitting unit 21 on the plane of the substrate 10, the better the heat dissipation effect on the first primary color light-emitting unit 21. Thus, in a further optional embodiment of this application, the orthographic projection of the first heat-conducting area 31 on the plane of the substrate 10 covers the orthographic projection of the first primary color light-emitting unit 21 on the plane of the substrate 10, thereby utilizing the first heat-conducting material 310 in the first heat-conducting area 31 to conduct away the heat emitted by the first primary color light-emitting unit 21 more and faster.

[0044] Of course, for the portion where the orthographic projections of the first heat-conducting area 31 and the first primary color light-emitting unit 21 on the plane of the substrate 10 do not overlap, the heat emitted by the first primary color light-emitting unit 21 can also be appropriately transferred to the first heat-conducting area 31 and conducted away by the first heat-conducting material 310 in the first heat-conducting area 31. Therefore, optionally, in another embodiment of this application, the orthographic projection of the first heat-conducting area 31 on the plane of the substrate 10 surrounds the orthographic projection of the first primary color light-emitting unit 21 on the plane of the substrate 10. That is, in this embodiment, the orthographic projection of the first heat-conducting area 31 on the plane of the substrate 10 and the orthographic projection of the first primary color light-emitting unit 21 on the plane of the substrate 10 do not overlap, but are arranged around the orthographic projection of the first primary color light-emitting unit 21 on the plane of the substrate 10. Thus, while using the first heat-conducting material 310 in the first heat-conducting area 31 to conduct away the heat emitted by the first primary color light-emitting unit 21, the heat dissipated by the first primary color light-emitting unit 21 to other light-emitting units around it is reduced, thereby reducing the impact of the heat dissipated by the first primary color light-emitting unit 21 on other light-emitting units around it.

[0045] Optionally, in another embodiment of this application, the orthographic projection of the first heat-conducting area 31 onto the plane of the substrate 10 may also be located on both sides of the orthographic projection of the first primary color light-emitting unit 21 onto the plane of the substrate 10 along the first direction, where the first direction is parallel to the plane of the substrate 10. That is, in this embodiment, the orthographic projection of the first heat-conducting area 31 onto the plane of the substrate 10 does not overlap with the orthographic projection of the first primary color light-emitting unit 21 onto the plane of the substrate 10, but is located on both sides of the orthographic projection of the first primary color light-emitting unit 21 onto the plane of the substrate 10 along the first direction. This reduces the heat dissipated by the first primary color light-emitting unit 21 along the first direction while using the first heat-conducting material in the first heat-conducting area 31 to conduct the heat emitted by the first primary color light-emitting unit 21 away.

[0046] It should be noted that the reference Figure 1As shown, since there is a gap between the first primary color light-emitting unit 21 and other light-emitting units, the orthographic projection of the first heat-conducting area 31 on the plane of the substrate 10 can surround the orthographic projection of the first primary color light-emitting unit 21 on the plane of the substrate 10, or it can be located on both sides of the orthographic projection of the first primary color light-emitting unit 21 on the plane of the substrate 10 along the first direction, or it can have other corresponding arrangement methods that do not overlap with the orthographic projection of the first primary color light-emitting unit 21 on the plane of the substrate 10, depending on the specific situation.

[0047] Therefore, in this embodiment, the corresponding arrangement of the first heat-conducting area 31 and the first primary color light-emitting unit 21 means that at least part of the heat emitted by the first primary color light-emitting unit 21 can be transferred to the first heat-conducting area 31 and conducted out by the first heat-conducting material 310 in the first heat-conducting area 31. Thus, the orthographic projection of the first heat-conducting area 31 on the plane of the substrate 10 and the orthographic projection of the first primary color light-emitting unit 21 on the plane of the substrate 10 can partially overlap, completely overlap, or not overlap. However, the orthographic projection of the first heat-conducting area 31 on the plane of the substrate 10 should be at least close to the orthographic projection of the first primary color light-emitting unit 21 on the plane of the substrate 10, so that at least part of the heat emitted by the first primary color light-emitting unit 21 can be transferred to the first heat-conducting area 31 and conducted out by the first heat-conducting material 310 in the first heat-conducting area 31.

[0048] In this embodiment, the first film layer 30 is located on the side of the light-emitting unit 20 facing away from the substrate 10, that is, on the side of the first primary color light-emitting unit 21 facing away from the substrate 10. Optionally, in one embodiment of this application, such as... Figure 1 As shown, the first film layer 30 is in direct contact with the first primary color light-emitting unit 21, so that the first thermally conductive area 31, in which the first thermally conductive material 310 is added, can be in direct contact with the first primary color light-emitting unit 21, thereby enabling the heat emitted by the first primary color light-emitting unit 21 to be conducted out faster and in greater quantities using the first thermally conductive material 310 in the first thermally conductive area 31.

[0049] Of course, optionally, in other embodiments of this application, reference is made to Figure 2 As shown, the first film layer 30 may not be in direct contact with the first primary color light-emitting unit 21. In this case, the heat emitted by the first primary color light-emitting unit 21 needs to be transferred through the intermediate film layer between the first primary color light-emitting unit 21 and the first film layer 30 to the first heat-conducting area 31 in the first film layer 30, and then the first heat-conducting material 310 in the first heat-conducting area 31 conducts the received heat out.

[0050] It is understandable that direct contact between the first film layer 30 and the first primary color light-emitting unit 21 is more conducive to heat dissipation of the first primary color light-emitting unit 21 than indirect contact. However, compared with the prior art which only uses external heat dissipation devices to dissipate heat from the display panel, even if the first film layer 30 and the first primary color light-emitting unit 21 are not in direct contact, the first thermally conductive area 31 of the first film layer 30, which contains the first thermally conductive material 310, can still conduct some of the heat emitted by the first primary color light-emitting unit 21, thereby enhancing heat dissipation of the first primary color light-emitting unit 21 and improving the performance of the display panel.

[0051] In this embodiment, to ensure that the first thermally conductive material 310 added to the first thermally conductive region 31 does not affect the transmission of the first primary color visible light emitted by the first primary color light-emitting unit 21, the particle size of the first thermally conductive material 310 must be smaller than the wavelength of the first primary color visible light. Since the first primary color visible light can be red, green, blue, or other visible light, optionally, in one embodiment of this application, the particle size of the first thermally conductive material is smaller than the wavelength of visible light. Specifically, the wavelength range of visible light is 390nm-780nm. Therefore, the particle size of the first thermally conductive material is smaller than 390nm so that when the first primary color visible light is red, green, or blue, it can all pass through the first thermally conductive region 31 to which the first thermally conductive material 310 is added.

[0052] Based on the above embodiments, optionally, in one embodiment of this application, the first thermally conductive material 310 is a quantum dot material, and the emission fluorescence wavelength of the first thermally conductive material 310 is less than or greater than the wavelength of the first primary color visible light.

[0053] It should be noted that the particle size of quantum dot materials is typically 2nm-10nm, much smaller than the wavelength of visible light, thus allowing the first primary color visible light emitted by the first primary color emitting unit 21 to pass through the first thermally conductive region 31. Furthermore, according to the thermal conductivity path theory, when a small amount of the first thermally conductive material 310 is added to the first thermally conductive region 31, the "island structure" formed by the first thermally conductive material 310 is dispersed and does not form a thermal conductivity path. When the amount of the first thermally conductive material 310 added to the first thermally conductive region 31 is further increased, different thermal conductivity paths interpenetrate, thereby enabling rapid heat conduction. Therefore, because the particle size of quantum dot materials is very small, adding a small amount of quantum dot material to the first thermally conductive region 31 is sufficient to construct a thermal conductivity path.

[0054] It should also be noted that, considering that quantum dot materials will fluoresce when excited by incident light within a certain wavelength range, if the quantum dot material added to the first thermally conductive region 31 is excited by the first primary color visible light emitted by the first primary color light-emitting unit 21 and fluoresces, it will affect the display. Therefore, the quantum dot material added to the first thermally conductive region 31 cannot be excited by the first primary color visible light emitted by the first primary color light-emitting unit 21 and fluoresce. The wavelength of the incident light that excites the quantum dot material to fluoresce is the emission fluorescence wavelength of the quantum dot material. Therefore, in this embodiment, the emission fluorescence wavelength of the first thermally conductive material 310 is less than or greater than (but not equal to) the wavelength of the first primary color visible light.

[0055] For example, a red LED light-emitting unit is typically an AlGaAs chip, emitting red light with a wavelength of 660nm. Therefore, the emission wavelength of the first thermally conductive material 310 added to the first thermally conductive region 31 corresponding to the red LED light-emitting unit only needs to be a wavelength other than 660nm. This ensures that the first thermally conductive material 310 added to the first thermally conductive region 31 corresponding to the red LED light-emitting unit will not fluoresce under the excitation of the red light emitted by the red LED light-emitting unit, thus not affecting the optical effect of the red LED light-emitting unit. In reality, the red light emitted by the red LED light-emitting unit is around 660nm, for example, in the range of 640nm-680nm. Therefore, the emission wavelength of the first thermally conductive material 310 added to the first thermally conductive region 31 corresponding to the red LED light-emitting unit only needs to be less than 640nm or greater than 680nm.

[0056] Optionally, in another embodiment of this application, the first thermally conductive material 310 may also be a non-fluorescent material. In this case, since the first thermally conductive material 310 added to the first thermally conductive region 31 will not generate fluorescence under the excitation of the first primary color visible light emitted by the first primary color light-emitting unit 21, and the particle size of the first thermally conductive material 310 is smaller than the wavelength of visible light, it will not affect the first primary color visible light emitted by the first primary color light-emitting unit 21, and will not affect the optical effect of the first primary color light-emitting unit.

[0057] As we know, with the development of semiconductor technology, LED display technology is also developing towards miniaturization and matrixing. Mini LED, Nano LED or Micro LED are widely used in display panels due to their advantages such as small size, high luminous efficiency and low energy consumption. Therefore, optionally, in one embodiment of this application, the first primary color light-emitting unit 21 is an LED light-emitting unit, specifically a Mini LED light-emitting unit, a Micro LED light-emitting unit or a Nano LED light-emitting unit.

[0058] In this embodiment, the first primary color light-emitting unit 21 may be an LED light-emitting unit that directly emits first primary color visible light, or it may include a first light-emitting element and a first light conversion unit. The first light conversion unit is used to convert the light emitted by the first light-emitting element into first primary color visible light. For example, the first light-emitting unit is a blue LED or an ultraviolet LED. The first light conversion unit includes quantum dot material. Then, the light emitted by the first light-emitting unit is incident on the quantum dot material in the first light conversion unit, which excites the quantum dot material in the first light conversion unit to convert the incident light into first primary color visible light and emit it.

[0059] The inventors discovered that in micro-light-emitting display panels based on red, green, and blue (RGB) LEDs, the luminous efficiency of red LEDs decreases significantly with increasing temperature, exhibiting poor thermal stability. For example, when the temperature rises from 25°C to 85°C, the luminous efficiency of red LEDs decreases by 75%, while the luminous efficiency of green and blue LEDs decreases by 15% and 3%, respectively. This is because red LEDs are typically GaAs chips, which have low luminous efficiency. Furthermore, as temperature increases, red LEDs generate more non-radiative recombination, leading to a decrease in the radiative / non-radiative ratio, thus causing a significant reduction in luminous efficiency with increasing temperature.

[0060] It is evident that among the RGB LEDs, red LEDs are more temperature-dependent and more prone to non-radiative recombination, resulting in a significant decrease in luminous efficiency as temperature increases. Consequently, as the RGB LEDs continue to operate, the luminous efficiency of red LEDs differs considerably from that of green and blue LEDs, leading to poor brightness uniformity in the micro-light-emitting display panel and affecting its display performance.

[0061] Based on this, optionally, in one embodiment of this application, the first primary color visible light is red light. That is, in this embodiment, a first thermally conductive material 310 is added to the first thermally conductive area 31 corresponding to the first primary color light-emitting unit 21 that emits red light. The first thermally conductive material 310 is used to effectively conduct the heat emitted by the red LED light-emitting unit, perform pixel-level heat dissipation compensation for the red LED light-emitting unit, improve the heat dissipation capacity of the red LED light-emitting unit, balance the luminous efficiency of the three RGB LEDs under continuous operation and high temperature, improve the overall thermal stability of the three RGB LEDs, improve the brightness uniformity of the micro light-emitting display panel, and improve the display effect.

[0062] As mentioned above, the red LED light-emitting unit is usually a GaAs chip, which emits red light with a wavelength of around 660nm, such as within the range of 640nm-680nm. In order to effectively conduct away the heat emitted by the red LED light-emitting unit without affecting the red light emitted by the red LED light-emitting unit, optionally, in one embodiment of this application, the first thermally conductive material 310 includes one or more of boron nitride quantum dot materials, carbon quantum dot materials, monodisperse nanodiamond particles, boron nitride nanopowder, and alumina nanopowder.

[0063] Specifically, boron nitride quantum dot materials have a particle size of approximately 3 nm, much smaller than the wavelength of visible light. Furthermore, the fluorescence emission wavelength of boron nitride quantum dot materials is primarily in the 400 nm-550 nm range, outside the 640 nm-680 nm range emitted by red LED light-emitting units. This means they will not be excited by the red light emitted by the red LED light-emitting unit and will not affect its optical performance. Simultaneously, the particle size of boron nitride quantum dot materials is only around 3 nm; therefore, adding a small amount of boron nitride quantum dot material to the first heat-conducting region 31 is sufficient to establish a heat conduction path. Moreover, boron nitride quantum dot materials possess excellent heat dissipation properties, effectively conducting away the heat emitted by the red LED light-emitting unit.

[0064] Carbon quantum dot materials have a particle size of less than 10nm, which is much smaller than the wavelength of visible light. Therefore, adding a small amount of carbon quantum dot material to the first heat conduction zone can also establish a heat conduction path. Furthermore, the emission fluorescence wavelength of carbon quantum dot materials is mainly in the range of 400nm-550nm, which is not in the range of 640nm-680nm emitted by the red LED light-emitting unit, and will not affect the optical effect of the red LED light-emitting unit.

[0065] Monodisperse nanodiamond particles have a particle size in the range of 5nm-10nm. Therefore, adding a small amount of monodisperse nanodiamond particles to the first heat-conducting zone can also establish a heat-conducting path. Furthermore, monodisperse nanodiamond particles are non-fluorescent materials, meaning they will not fluoresce under the excitation of red light emitted by the red LED light-emitting unit, and will not affect the optical effect of the red LED light-emitting unit.

[0066] Boron nitride nanoparticles have a particle size of less than 150 nm, which is smaller than the wavelength of visible light, and are non-fluorescent materials. It should be noted that although both boron nitride quantum dots and boron nitride nanoparticles are boron nitride materials, their properties differ due to their different particle sizes. However, both boron nitride quantum dots and boron nitride nanoparticles possess the excellent heat dissipation properties of boron nitride, effectively conducting away the heat emitted by the red LED light-emitting unit without affecting its optical performance.

[0067] Alumina nanoparticles, with a particle size of less than 50nm (smaller than the wavelength of visible light) and being a non-fluorescent material, can effectively conduct away the heat emitted by the red LED light-emitting unit without affecting its optical performance.

[0068] It should be noted that, in this embodiment, the first thermally conductive material 310 can be any one of boron nitride quantum dot material, carbon quantum dot material, monodisperse nanodiamond particles, boron nitride nanopowder, and alumina nanopowder, or a combination of two or more of these materials. For example, Figure 3 The diagram shows a heat conduction path when the first heat conduction material 310 in the first heat conduction zone 31 simultaneously includes boron nitride quantum dot material 311 and boron nitride nanopowder 312. The solid lines in the diagram represent the heat conduction path.

[0069] Optionally, in one embodiment of this application, for a red LED light-emitting unit, the first film layer 30 is an optical adhesive layer, and the first thermally conductive material 310 added to the first thermally conductive region 31 corresponding to the red LED light-emitting unit in the first film layer 30 is a boron nitride quantum dot material, and the weight ratio of the first thermally conductive material in the first thermally conductive region 31 ranges from 0.5% to 3.0%, including the endpoint value.

[0070] In this embodiment, boron nitride quantum dot material is added to the first thermally conductive area 31 corresponding to the red LED light-emitting unit in the optical adhesive layer. That is, the material is added at the pixel level in the optical adhesive layer according to the position of the red LED light-emitting unit. The high thermal conductivity of the boron nitride quantum dot material effectively conducts the heat emitted by the red LED light-emitting unit away, thereby achieving point-to-point heat dissipation compensation for the red LED light-emitting unit, improving the thermal stability of the red LED light-emitting unit, balancing the luminous efficiency of the three RGB LEDs under continuous operation and high temperature, improving the overall thermal stability of the three RGB LEDs, improving the brightness uniformity of the micro-light-emitting display panel, and improving the display effect.

[0071] Furthermore, in this embodiment, the first film layer 30 is an optical adhesive layer. Since the optical adhesive layer can be directly bonded to the red LED light-emitting unit, the distance from which the heat emitted by the red LED light-emitting unit is transferred to the first heat-conducting area 31 can be reduced, thereby reducing the thermal resistance of air or other film layers. At the same time, the first heat-conducting area 31 can cover the red LED light-emitting unit in a direction perpendicular to the plane of the substrate, thereby increasing the heat dissipation area and enhancing the heat dissipation capacity of the first heat-conducting material in the first heat-conducting area 31 for the red LED light-emitting unit.

[0072] It should be noted that if the first film layer portion corresponding to the first thermal conductive region 31 is set to 100 parts by weight, then the boron nitride quantum dot material in the first thermal conductive region 31 is 0.5-3.0 parts by weight, and the optical adhesive in the first thermal conductive region 31 is 97-99.5 parts by weight. On the one hand, this ensures that the boron nitride quantum dot material in the first thermal conductive region 31 is sufficient to form a thermal conductive path, and on the other hand, it prevents the weight ratio of the boron nitride quantum dot material in the first thermal conductive region 31 from being too large, which would affect the light transmittance of the first thermal conductive region 31.

[0073] The above embodiment describes adding a first thermally conductive material 310 to the first film layer region (i.e., the first thermally conductive region 31) corresponding to the first primary color light-emitting unit 21 in the display panel to conduct the heat emitted by the first primary color light-emitting unit 21. In addition to the first primary color light-emitting unit 21, the display panel also includes light-emitting units of other primary colors. As mentioned above, when the temperature rises, not only does the luminous efficiency of the red LED light-emitting unit decrease significantly, but the luminous efficiency of the green LED and blue LED also decreases to varying degrees.

[0074] Accordingly, optionally, in one embodiment of this application, such as Figure 4 As shown, the light-emitting unit also includes a second primary color light-emitting unit 22, which is used to emit second primary color visible light. The wavelength of the second primary color visible light is different from the wavelength of the first primary color visible light.

[0075] The display panel also includes a second film layer 40 located on the side of the light-emitting unit 20 away from the substrate 10. The second film layer 40 includes a second heat-conducting region 41, which is correspondingly disposed with the second primary color light-emitting unit 22. The second heat-conducting region 41 includes a second heat-conducting material 410, which is used to conduct heat emitted by the second primary color light-emitting unit 22. The particle size of the second heat-conducting material 410 is smaller than the wavelength of the second primary color visible light.

[0076] In this embodiment, the first primary color light-emitting unit can be a red LED light-emitting unit, and the second primary color light-emitting unit can be a green LED light-emitting unit or a blue LED light-emitting unit. This allows for the addition of a first thermally conductive material 310 at a fixed point on the first film layer 30 corresponding to the first primary color light-emitting unit 21 to conduct heat emitted by the first primary color light-emitting unit 21. Furthermore, a second thermally conductive material 410 is added at a fixed point on the second film layer 40 corresponding to the second primary color light-emitting unit 22 to conduct heat emitted by the second primary color light-emitting unit 22. This enhances heat dissipation for both the first and second primary color light-emitting units and improves the overall thermal stability of the light-emitting unit.

[0077] In this embodiment, optionally, such as Figure 5As shown, the first film layer 30 and the second film layer 40 are the same film layer. For example, the first film layer 30 and the second film layer 40 are both optical adhesive layers. However, this application does not limit this. The first film layer 30 and the second film layer 40 can also be different film layers, depending on the specific situation.

[0078] In this embodiment, optionally, the first thermally conductive material 310 and the second thermally conductive material 410 are the same thermally conductive material. For example, both the first thermally conductive material 310 and the second thermally conductive material 410 are non-fluorescent materials or both are quantum dot materials. However, this application does not limit this. The first thermally conductive material 310 and the second thermally conductive material 410 can also be different thermally conductive materials. For example, the first thermally conductive material 310 is a quantum dot material, and the emission fluorescence wavelength of the first thermally conductive material 310 is less than or greater than (not equal to) the wavelength of the first primary color visible light. The second thermally conductive material 410 is a non-fluorescent material. Specifically, for example, the first primary color light-emitting unit 21 is a red LED light-emitting unit, and the first thermally conductive material 310... 0 is boron nitride quantum dot material, which utilizes the excellent heat dissipation performance of boron nitride quantum dot material itself to compensate for heat dissipation of red LED light-emitting unit without affecting the optical effect of red LED light-emitting unit. The second primary color light-emitting unit 22 is a green LED light-emitting unit or a blue LED light-emitting unit. The second thermal conductive material 410 is a non-fluorescent material such as monodisperse nanodiamond particles, boron nitride nanopowder or alumina nanoparticles, which utilizes non-fluorescent materials such as monodisperse nanodiamond particles, boron nitride nanopowder or alumina nanoparticles to compensate for heat dissipation of green LED light-emitting unit or blue LED light-emitting unit without affecting the optical effect of green LED light-emitting unit or blue LED light-emitting unit.

[0079] It should be noted that green and blue LEDs are typically GaN chips, with green light having a wavelength range of 500nm-560nm and blue light a wavelength range of 450nm-480nm. Boron nitride quantum dot and carbon quantum dot materials emit fluorescence primarily in the 400nm-550nm range. Therefore, boron nitride and carbon quantum dot materials will emit blue-green light when excited by green or blue light. Consequently, it is not suitable to add boron nitride or carbon quantum dot materials as a second thermal conductive material 410 to the second film layer 40 corresponding to the green and blue LED light-emitting units, as this would affect their optical performance. Instead, non-fluorescent materials such as monodisperse nanodiamond particles, boron nitride nanopowder, or alumina nanoparticles can be added to compensate for heat dissipation in the green and blue LED light-emitting units without affecting their optical performance.

[0080] Further, optionally, in one embodiment of this application, such as Figure 6As shown, the display panel also includes a third primary color light-emitting unit 23, which is used to emit third primary color visible light. The wavelength of the third primary color visible light is different from the wavelength of the first primary color visible light and also different from the wavelength of the second primary color visible light.

[0081] The display panel also includes a third film layer 50 located on the side of the light-emitting unit 20 away from the substrate 10. The third film layer 50 includes a third heat-conducting region 51, which is correspondingly disposed with the third primary color light-emitting unit 23. The third heat-conducting region 51 includes a third heat-conducting material 510, which is used to conduct heat emitted by the third primary color light-emitting unit 23. The particle size of the third heat-conducting material 510 is smaller than the wavelength of the third primary color visible light.

[0082] In this embodiment, the first primary color light-emitting unit 21 can be a red LED light-emitting unit, the second primary color light-emitting unit 22 can be a green LED light-emitting unit, and the third primary color light-emitting unit 23 can be a blue LED light-emitting unit. Thus, thermally conductive materials are added to the film layers corresponding to the three primary color light-emitting units, respectively, to conduct the heat emitted by the three primary color light-emitting units, thereby enhancing the heat dissipation of the three primary color light-emitting units and improving the overall thermal stability of the light-emitting units.

[0083] In this embodiment, optionally, such as Figure 7 As shown, the first film layer 30, the second film layer 40, and the third film layer 50 are all the same film layer. For example, the first film layer 30, the second film layer 40, and the third film layer 50 are all optical adhesive layers. However, this application does not limit this. There may be two different film layers among the first film layer 30, the second film layer 40, and the third film layer 50, or the first film layer 30, the second film layer 40, and the third film layer 50 may be different from each other, depending on the specific circumstances.

[0084] In this embodiment, optionally, the first thermally conductive material 310, the second thermally conductive material 410, and the third thermally conductive material 510 are all the same thermally conductive material. For example, the first thermally conductive material 310, the second thermally conductive material 410, and the third thermally conductive material 510 are all non-fluorescent materials, or all are quantum dot materials. However, this application does not limit this. At least two of the first thermally conductive material 310, the second thermally conductive material 410, and the third thermally conductive material 510 are different thermally conductive materials. For example, the first thermally conductive material 310 is a quantum dot material, and the emission fluorescence wavelength of the first thermally conductive material 310 is less than or greater than (not equal to) the wavelength of the first primary color visible light. The second thermally conductive material 410 and the third thermally conductive material 510 are both non-fluorescent materials. Specifically, for example, the first primary color light-emitting unit 21 is a red LED. The light-emitting unit has a first thermally conductive material 310 made of boron nitride quantum dot material, which utilizes the excellent heat dissipation performance of boron nitride quantum dots to compensate for the heat dissipation of the red LED light-emitting unit without affecting the optical effect of the red LED light-emitting unit. The second primary color light-emitting unit 22 is a green LED light-emitting unit, and the third primary color light-emitting unit 23 is a blue LED light-emitting unit. The second thermally conductive material 410 and the third thermally conductive material 510 are non-fluorescent materials such as monodisperse nanodiamond particles, boron nitride nanopowder, or alumina nanoparticles, which utilize non-fluorescent materials such as monodisperse nanodiamond particles, boron nitride nanopowder, or alumina nanoparticles to compensate for the heat dissipation of the green and blue LED light-emitting units without affecting the optical effect of the green and blue LED light-emitting units.

[0085] It should be noted that in the above embodiments, as Figure 1 , Figures 4-7 As shown, a driving circuit layer 11 is also provided between the substrate 10 and the light-emitting unit 20, and a protective glass / film 12 is located on the side of the light-emitting unit 20 away from the substrate 10.

[0086] This application also provides a method for manufacturing a display panel, such as... Figure 8 As shown, the method includes:

[0087] S100: Reference Figure 1 As shown, a substrate 10 is provided;

[0088] S200: Reference Figure 1 As shown, a light-emitting unit 20 is formed on one side of the substrate 10. The light-emitting unit 20 includes a first primary color light-emitting unit 21, which is used to emit first primary color visible light.

[0089] S300: Reference Figure 1As shown, a first film layer 30 is formed on the side of the light-emitting unit 20 away from the substrate 10. The first film layer 30 includes a first thermally conductive region 31, which is correspondingly disposed with the first primary color light-emitting unit 21. The first thermally conductive region 31 includes a first thermally conductive material 310, which is used to conduct heat emitted by the first primary color light-emitting unit 21. The particle size of the first thermally conductive material 310 is smaller than the wavelength of the first primary color visible light.

[0090] In practical applications, prior to step S200, the method further includes:

[0091] S400: A drive circuit layer 11 is formed on one side of the substrate 10.

[0092] Subsequently, in step S200, a light-emitting unit 20 is formed on the side of the driving circuit layer 11 away from the substrate 10.

[0093] In the display panel manufacturing method provided in this application embodiment, a first thermally conductive region 31 is formed by adding a first thermally conductive material 310 to the region corresponding to the first primary color light-emitting unit 21 in the first film layer 30 on the side of the light-emitting unit 20 away from the substrate 10. The first thermally conductive material 310 effectively conducts the heat emitted by the first primary color light-emitting unit 21 out of the first primary color light-emitting unit 21, enhances the heat dissipation of the first primary color light-emitting unit 21, realizes fixed-point heat dissipation compensation for the first primary color light-emitting unit 21, avoids the accumulation of heat emitted by the first primary color light-emitting unit 21 from affecting the luminous efficiency, stability and lifespan of the first primary color light-emitting unit 21, and improves the performance of the display panel. Furthermore, the particle size of the first thermally conductive material 310 is smaller than the wavelength of the first primary color visible light emitted by the first primary color light-emitting unit 21, thereby allowing the first primary color visible light emitted by the first primary color light-emitting unit 21 to pass through the first thermally conductive region 31 without being affected by the added first thermally conductive material.

[0094] Optionally, in one embodiment of this application, forming a first film layer 30 on the side of the light-emitting unit 20 facing away from the substrate 10 includes:

[0095] As shown in FIG9(a), the light-emitting unit 20 is shielded from the other areas on the side away from the substrate 10 except for the first preset area CC. A first film layer portion with added first thermal conductive material is formed on the first preset area CC on the side away from the substrate 10 of the light-emitting unit 20. Then, as shown in FIG9(c), the first preset area CC on the side away from the substrate 10 of the light-emitting unit 20 is shielded again. A first film layer portion without added first thermal conductive material is formed on the other areas on the side away from the substrate 10 of the light-emitting unit 20 except for the first preset area CC. Thus, a first film layer 30 is formed on the side away from the substrate 10 of the light-emitting unit 20.

[0096] Alternatively, as shown in FIG9(b), the first preset area CC of the light-emitting unit 20 away from the substrate 10 is blocked, and a first film layer portion without the first thermally conductive material is formed on the other areas of the light-emitting unit 20 away from the substrate 10 except for the first preset area CC. Then, as shown in FIG9(c), the other areas of the light-emitting unit 20 away from the substrate 10 except for the first preset area CC are blocked again, and a first film layer portion with the first thermally conductive material is formed on the first preset area CC of the light-emitting unit 20 away from the substrate 10, thereby forming a first film layer 30 on the side of the light-emitting unit 20 away from the substrate 10.

[0097] The first thermally conductive region 31 is the first thermally conductive area 31 in which a first film layer of the first thermally conductive material is added to the first preset region CC.

[0098] The formation process of the first thermally conductive region 31 is described below, using red light as the primary color (visible light), boron nitride quantum dot material as the first thermally conductive material 310, and optical adhesive layer 30. Specifically, the formation process of the first thermally conductive region 31 includes:

[0099] Using an optical adhesive with boron nitride quantum dot material pre-added to it, an optical adhesive layer with boron nitride quantum dot material added is formed on the first preset region CC of the light-emitting unit 20 on the side opposite to the substrate 10, as the first heat-conducting region 31.

[0100] Among them, such as Figure 10 As shown, the preparation process of the optical adhesive with pre-added boron nitride quantum dot material of a predetermined particle size includes:

[0101] S10: Dissolve hexagonal boron nitride (h-BN) powder in an organic solvent according to a first preset ratio to form a mixed solution.

[0102] Optionally, the organic solvent is N,N-dimethylformamide (DMF), and the first preset ratio is 1 gh of hexagonal boron nitride (h-BN) powder dissolved in 100 ml of N,N-dimethylformamide (DMF).

[0103] It should be noted that hexagonal boron nitride (h-BN) powder is relatively stable and remains in powder form in the organic solvent N,N-dimethylformamide (DMF).

[0104] S20: Perform liquid-phase ultrasonic treatment on the mixed solution for a first preset time to perform the first step of stripping the hexagonal boron nitride powder.

[0105] Specifically, the mixed solution can be subjected to liquid-phase ultrasonic treatment at room temperature for 1 hour to perform the first step of exfoliation of the hexagonal boron nitride powder, thereby reducing the particle size of the hexagonal boron nitride powder.

[0106] S30: The mixed solution after liquid-phase ultrasonic treatment is subjected to a solvothermal reaction at a preset temperature for a second preset time to perform a second step of stripping the hexagonal boron nitride powder.

[0107] Specifically, the mixed solution after liquid-phase ultrasonic treatment is subjected to a solvothermal reaction at 200°C for 24 hours to perform a second-step exfoliation of the hexagonal boron nitride powder, thereby further reducing the particle size of the hexagonal boron nitride powder.

[0108] S40: The mixed solution after solvothermal reaction is centrifuged, filtered, and dried to obtain boron nitride quantum dot materials with a preset particle size.

[0109] Since the hexagonal boron nitride powder is exfoliated in N,N-dimethylformamide organic solvent through two steps of liquid-phase ultrasonic treatment and solvothermal reaction, the mixed solution after the solvothermal reaction is centrifuged, filtered and dried to evaporate the N,N-dimethylformamide organic solvent, resulting in boron nitride quantum dot materials with an average particle size of 3 nm and uniform size.

[0110] S50: Add boron nitride quantum dot material with a preset particle size to the optical adhesive according to a second preset ratio to obtain an optical adhesive with boron nitride quantum dot material with a preset particle size.

[0111] Optionally, in the first thermally conductive region 31, the weight ratio range of the first thermally conductive material 310 (corresponding to the second preset ratio) is 0.5%-3.0%, including the endpoint values. Specifically, if the first film layer portion corresponding to the first thermally conductive region 31 is set to 100 parts by weight, then the boron nitride quantum dot material in the first thermally conductive region 31 is 0.5-3.0 parts by weight, and the optical adhesive in the first thermally conductive region 31 is 97-99.5 parts by weight. This ensures that the boron nitride quantum dot material in the first thermally conductive region 31 is sufficient to form a thermally conductive path, and also prevents the weight ratio of the boron nitride quantum dot material in the first thermally conductive region 31 from being too large, which would affect the light transmittance of the first thermally conductive region 31.

[0112] In this embodiment, boron nitride quantum dot material is added to the first thermally conductive area 31 corresponding to the red LED light-emitting unit in the optical adhesive layer. That is, the material is added at the pixel level in the optical adhesive layer according to the position of the red LED light-emitting unit. The high thermal conductivity of the boron nitride quantum dot material effectively conducts the heat emitted by the red LED light-emitting unit away, thereby achieving point-to-point heat dissipation compensation for the red LED light-emitting unit, improving the thermal stability of the red LED light-emitting unit, balancing the luminous efficiency of the three RGB LEDs under continuous operation and high temperature, improving the overall thermal stability of the three RGB LEDs, improving the brightness uniformity of the micro-light-emitting display panel, and improving the display effect.

[0113] Furthermore, in this embodiment, the first film layer 30 is an optical adhesive layer. Since the optical adhesive layer can be directly bonded to the red LED light-emitting unit, the distance from which the heat emitted by the red LED light-emitting unit is transferred to the first heat-conducting area 31 can be reduced, thereby reducing the thermal resistance of air or other film layers. At the same time, the first heat-conducting area 31 can cover the red LED light-emitting unit in a direction perpendicular to the plane of the substrate, thereby increasing the heat dissipation area and enhancing the heat dissipation capacity of the first heat-conducting material in the first heat-conducting area 31 for the red LED light-emitting unit.

[0114] Based on any of the above embodiments, optionally, in one embodiment of this application, such as Figure 4 As shown, the light-emitting unit 20 also includes a second primary color light-emitting unit 22, which is used to emit second primary color visible light. The wavelength of the second primary color visible light is different from the wavelength of the first primary color visible light.

[0115] The methods for manufacturing display panels also include:

[0116] S500: Reference Figure 4 As shown, a second film layer 40 is formed on the side of the light-emitting unit 20 away from the substrate 10. The second film layer 40 includes a second thermally conductive region 41, which is correspondingly disposed with the second primary color light-emitting unit 22. The second thermally conductive region 41 includes a second thermally conductive material 410, which is used to conduct heat emitted by the second primary color light-emitting unit 22. The particle size of the second thermally conductive material 410 is smaller than the wavelength of the second primary color visible light.

[0117] In this embodiment, the first primary color light-emitting unit can be a red LED light-emitting unit, and the second primary color light-emitting unit can be a green LED light-emitting unit or a blue LED light-emitting unit. This allows for the addition of a first thermally conductive material 310 at a fixed point on the first film layer 30 corresponding to the first primary color light-emitting unit 21 to conduct heat emitted by the first primary color light-emitting unit 21. Furthermore, a second thermally conductive material 410 is added at a fixed point on the second film layer 40 corresponding to the second primary color light-emitting unit 22 to conduct heat emitted by the second primary color light-emitting unit 22. This enhances heat dissipation for both the first and second primary color light-emitting units and improves the overall thermal stability of the light-emitting unit.

[0118] In this embodiment, optionally, such as Figure 5 As shown, the first film layer 30 and the second film layer 40 are the same film layer. For example, the first film layer 30 and the second film layer 40 are both optical adhesive layers. However, this application does not limit this. The first film layer 30 and the second film layer 40 can also be different film layers, depending on the specific situation.

[0119] In this embodiment, optionally, the first thermally conductive material 310 and the second thermally conductive material 410 are the same thermally conductive material. For example, both the first thermally conductive material 310 and the second thermally conductive material 410 are non-fluorescent materials or both are quantum dot materials. However, this application does not limit this. The first thermally conductive material 310 and the second thermally conductive material 410 can also be different thermally conductive materials. For example, the first thermally conductive material 310 is a quantum dot material, and the emission fluorescence wavelength of the first thermally conductive material 310 is less than or greater than (not equal to) the wavelength of the first primary color visible light. The second thermally conductive material 410 is a non-fluorescent material. Specifically, for example, the first primary color light-emitting unit 21 is a red LED light-emitting unit, and the first thermally conductive material 310... 0 is boron nitride quantum dot material, which utilizes the excellent heat dissipation performance of boron nitride quantum dot material itself to compensate for heat dissipation of red LED light-emitting unit without affecting the optical effect of red LED light-emitting unit. The second primary color light-emitting unit 22 is a green LED light-emitting unit or a blue LED light-emitting unit. The second thermal conductive material 410 is a non-fluorescent material such as monodisperse nanodiamond particles, boron nitride nanopowder or alumina nanoparticles, which utilizes non-fluorescent materials such as monodisperse nanodiamond particles, boron nitride nanopowder or alumina nanoparticles to compensate for heat dissipation of green LED light-emitting unit or blue LED light-emitting unit without affecting the optical effect of green LED light-emitting unit or blue LED light-emitting unit.

[0120] Further, optionally, in one embodiment of this application, such as Figure 6 As shown, the display panel also includes a third primary color light-emitting unit 23, which is used to emit third primary color visible light. The wavelength of the third primary color visible light is different from the wavelength of the first primary color visible light and also different from the wavelength of the second primary color visible light.

[0121] The methods for manufacturing display panels also include:

[0122] S600: Reference Figure 6 As shown, a third film layer 50 is formed on the side of the light-emitting unit 20 away from the substrate 10. The third film layer 50 includes a third heat-conducting region 51, which is correspondingly disposed with the third primary color light-emitting unit 23. The third heat-conducting region 51 includes a third heat-conducting material 510, which is used to conduct heat emitted by the third primary color light-emitting unit 23. The particle size of the third heat-conducting material 510 is smaller than the wavelength of the third primary color visible light.

[0123] In this embodiment, the first primary color light-emitting unit 21 can be a red LED light-emitting unit, the second primary color light-emitting unit 22 can be a green LED light-emitting unit, and the third primary color light-emitting unit 23 can be a blue LED light-emitting unit. Thus, thermally conductive materials are added to the film layers corresponding to the three primary color light-emitting units, respectively, to conduct the heat emitted by the three primary color light-emitting units, thereby enhancing the heat dissipation of the three primary color light-emitting units and improving the overall thermal stability of the light-emitting units.

[0124] In this embodiment, optionally, such as Figure 7 As shown, the first film layer 30, the second film layer 40, and the third film layer 50 are all the same film layer. For example, the first film layer 30, the second film layer 40, and the third film layer 50 are all optical adhesive layers. However, this application does not limit this. There may be two different film layers among the first film layer 30, the second film layer 40, and the third film layer 50, or the first film layer 30, the second film layer 40, and the third film layer 50 may be different from each other, depending on the specific circumstances.

[0125] In this embodiment, optionally, the first thermally conductive material 310, the second thermally conductive material 410, and the third thermally conductive material 510 are all the same thermally conductive material. For example, the first thermally conductive material 310, the second thermally conductive material 410, and the third thermally conductive material 510 are all non-fluorescent materials, or all are quantum dot materials. However, this application does not limit this. At least two of the first thermally conductive material 310, the second thermally conductive material 410, and the third thermally conductive material 510 are different thermally conductive materials. For example, the first thermally conductive material 310 is a quantum dot material, and the emission fluorescence wavelength of the first thermally conductive material 310 is less than or greater than (not equal to) the wavelength of the first primary color visible light. The second thermally conductive material 410 and the third thermally conductive material 510 are both non-fluorescent materials. Specifically, for example, the first primary color light-emitting unit 21 is a red LED. The light-emitting unit has a first thermally conductive material 310 made of boron nitride quantum dot material, which utilizes the excellent heat dissipation performance of boron nitride quantum dots to compensate for the heat dissipation of the red LED light-emitting unit without affecting the optical effect of the red LED light-emitting unit. The second primary color light-emitting unit 22 is a green LED light-emitting unit, and the third primary color light-emitting unit 23 is a blue LED light-emitting unit. The second thermally conductive material 410 and the third thermally conductive material 510 are non-fluorescent materials such as monodisperse nanodiamond particles, boron nitride nanopowder, or alumina nanoparticles, which utilize non-fluorescent materials such as monodisperse nanodiamond particles, boron nitride nanopowder, or alumina nanoparticles to compensate for the heat dissipation of the green and blue LED light-emitting units without affecting the optical effect of the green and blue LED light-emitting units.

[0126] In practical applications, the manufacturing method of this display panel also includes:

[0127] S700: A protective glass / film 12 is formed on the side of the light-emitting unit 20 away from the substrate 10.

[0128] It should be noted that the display panel prepared by the method provided in the embodiments of this application is the same as the display panel provided in the foregoing embodiments. Since the display panel has been described in detail in the foregoing embodiments, it will not be repeated here.

[0129] This application also provides a display device, such as... Figure 11 As shown, the display device 100 includes the display panel 200 provided in any of the above embodiments. Since the display panel has been described in detail in the foregoing embodiments, it will not be repeated here. The display device can be any electronic device with display functionality, such as a touch screen, mobile phone, tablet computer, laptop computer, e-reader, or television.

[0130] In summary, the display panel and its manufacturing method and display device provided in this application form a first thermally conductive area by adding a first thermally conductive material to the area corresponding to the first primary color light-emitting unit in the first film layer on the side of the light-emitting unit away from the substrate. This effectively conducts the heat emitted by the first primary color light-emitting unit out of the first primary color light-emitting unit, enhancing heat dissipation of the first primary color light-emitting unit and achieving point-to-point heat dissipation compensation for the first primary color light-emitting unit. This avoids the accumulation of heat emitted by the first primary color light-emitting unit, which could affect the luminous efficiency, stability, and lifespan of the first primary color light-emitting unit, thereby improving the performance of the display panel. Furthermore, the particle size of the first thermally conductive material is smaller than the wavelength of the first primary color visible light emitted by the first primary color light-emitting unit, allowing the first primary color visible light emitted by the first primary color light-emitting unit to pass through the first thermally conductive area without being affected by the added first thermally conductive material.

[0131] The various parts of this manual are described in a combination of parallel and progressive methods. Each part focuses on the differences between the other parts, and the same or similar parts can be referred to each other.

[0132] The features described above regarding the disclosed embodiments can be substituted or combined with each other to enable those skilled in the art to implement or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized by, include: substrate; A light-emitting unit located on one side of the substrate, the light-emitting unit including a first primary color light-emitting unit, the first primary color light-emitting unit being used to emit first primary color visible light; A first film layer located on the side of the light-emitting unit away from the substrate, the first film layer includes a first thermally conductive region, the first thermally conductive region is correspondingly disposed with the first primary color light-emitting unit, the first thermally conductive region includes a first thermally conductive material, the first thermally conductive material is used to conduct heat emitted by the first primary color light-emitting unit, and the particle size of the first thermally conductive material is smaller than the wavelength of the first primary color visible light; The light-emitting unit further includes a second primary color light-emitting unit, which is used to emit a second primary color visible light, the wavelength of which is different from the wavelength of the first primary color visible light; The display panel further includes a second film layer located on the side of the light-emitting unit away from the substrate. The second film layer includes a second thermally conductive area, which is correspondingly disposed with the second primary color light-emitting unit. The second thermally conductive area includes a second thermally conductive material, which is used to conduct heat emitted by the second primary color light-emitting unit. The particle size of the second thermally conductive material is smaller than the wavelength of the second primary color visible light. The first primary color visible light is red light, the first thermally conductive material is a quantum dot material, and the emission fluorescence wavelength of the first thermally conductive material is less than or greater than the wavelength of the first primary color visible light. The second primary color visible light is green or blue light, and the second thermally conductive material is a non-fluorescent material.

2. The display panel of claim 1, wherein, The orthographic projection of the first heat-conducting area onto the plane of the substrate at least partially overlaps with the orthographic projection of the first primary color light-emitting unit onto the plane of the substrate.

3. The display panel of claim 2, wherein, The orthographic projection of the first heat-conducting area onto the plane of the substrate covers the orthographic projection of the first primary color light-emitting unit onto the plane of the substrate.

4. The display panel of claim 1, wherein, The first film layer is in direct contact with the first primary color light-emitting unit.

5. The display panel of claim 1, wherein, The particle size of the first thermally conductive material is smaller than the wavelength of visible light.

6. The display panel of claim 1, wherein, The first thermally conductive material includes one or both of boron nitride quantum dot materials and carbon quantum dot materials; The second thermally conductive material includes one or more of monodisperse nanodiamond particles, boron nitride nanopowder, and alumina nanopowder.

7. The display panel of claim 1, wherein, The first thermally conductive material is boron nitride quantum dot material, and the first film layer is an optical adhesive layer; In the first thermally conductive region, the weight percentage of the first thermally conductive material ranges from 0.5% to 3.0%, including the endpoint values.

8. The display panel of claim 1, wherein, The first film layer and the second film layer are the same film layer.

9. The display panel of claim 1, wherein, The first primary color light-emitting unit is an LED light-emitting unit.

10. A method for manufacturing a display panel, characterized by, include: Provide a substrate; A light-emitting unit is formed on one side of the substrate. The light-emitting unit includes a first primary color light-emitting unit, which is used to emit first primary color visible light. A first film layer is formed on the side of the light-emitting unit away from the substrate. The first film layer includes a first thermally conductive region, which is correspondingly disposed with the first primary color light-emitting unit. The first thermally conductive region includes a first thermally conductive material, which is used to conduct heat emitted by the first primary color light-emitting unit. The particle size of the first thermally conductive material is smaller than the wavelength of the first primary color visible light. The first primary color visible light is red light. The first thermally conductive material is a quantum dot material, and the emission fluorescence wavelength of the first thermally conductive material is smaller than or larger than the wavelength of the first primary color visible light. The light-emitting unit further includes a second primary color light-emitting unit, which is used to emit a second primary color visible light, the wavelength of which is different from the wavelength of the first primary color visible light; The method for manufacturing the display panel further includes: A second film layer is formed on the side of the light-emitting unit away from the substrate. The second film layer includes a second thermally conductive region, which is correspondingly disposed with the second primary color light-emitting unit. The second thermally conductive region includes a second thermally conductive material, which is used to conduct heat emitted by the second primary color light-emitting unit. The particle size of the second thermally conductive material is smaller than the wavelength of the second primary color visible light. The second primary color visible light is green light or blue light, and the second thermally conductive material is a non-fluorescent material.

11. The method of manufacturing a display panel according to claim 10, wherein, The formation of a first film layer on the side of the light-emitting unit away from the substrate includes: The light-emitting unit is shielded from the area other than the first preset area on the side away from the substrate. A first film layer portion with added first thermally conductive material is formed on the first preset area on the side away from the substrate. Then the first preset area on the side away from the substrate is shielded again. A first film layer portion without added first thermally conductive material is formed on the area other than the first preset area on the side away from the substrate, thereby forming a first film layer on the side away from the substrate. Alternatively, the first preset area of ​​the light-emitting unit away from the substrate is blocked, and a first film layer portion without the first thermally conductive material is formed on the other areas of the light-emitting unit away from the substrate, excluding the first preset area. Then, the other areas of the light-emitting unit away from the substrate, excluding the first preset area, are blocked, and a first film layer portion with the first thermally conductive material is formed on the first preset area of ​​the light-emitting unit away from the substrate, thereby forming a first film layer on the side of the light-emitting unit away from the substrate. The first thermally conductive region is defined as the first film layer on which the first thermally conductive material is added.

12. The method for manufacturing a display panel according to claim 11, characterized in that, The first thermally conductive material is boron nitride quantum dot material, and the formation process of the first thermally conductive region includes: Using an optical adhesive with boron nitride quantum dot material pre-added to it, an optical adhesive layer with boron nitride quantum dot material added is formed on a first predetermined area on the side of the light-emitting unit away from the substrate, which serves as the first heat-conducting area; The preparation process of the optical adhesive, which pre-adds boron nitride quantum dot material with a predetermined particle size, includes: Hexagonal boron nitride powder is dissolved in an organic solvent at a first preset ratio to form a mixed solution; The mixed solution is subjected to liquid-phase ultrasonic treatment for a first preset time to perform the first step of peeling off the hexagonal boron nitride powder; The mixed solution after liquid-phase ultrasonic treatment is subjected to a solvothermal reaction at a preset temperature for a second preset time to perform a second step of peeling off the hexagonal boron nitride powder. The mixed solution after solvothermal reaction was centrifuged, filtered, and dried to obtain boron nitride quantum dot materials with a predetermined particle size; Boron nitride quantum dot material with a preset particle size is added to the optical adhesive in a second preset ratio to obtain an optical adhesive with added boron nitride quantum dot material of the preset particle size.

13. A display device comprising: Includes the display panel as described in any one of claims 1-9.

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