A terminal device, a mainboard antenna support and a preparation method thereof

Abstract

The embodiment of the present application discloses a mainboard antenna support. The mainboard antenna support is generally arranged in the shell of a terminal device, and is mainly used for realizing the functions of arranging an antenna circuit, fixedly connecting a mainboard, and crimping a BTB connector. The mainboard antenna support comprises a metal frame part and a plastic part, and the metal frame part and the plastic part can be fixedly connected. Opposite surfaces of the plastic part are respectively provided with an antenna circuit and a feed part, and the processing technology of the antenna circuit and the feed part is one or more of a spraying process, a printing process, and a 3D printing process. The process of the mainboard antenna support is relatively short, the yield of the product can be improved, there is no preparation process with strong pollution, and the harm to the environment and the health of workers can be reduced. The embodiment of the present application further provides a terminal device and a preparation method of the mainboard antenna support.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of terminal equipment, and in particular to a terminal device, a mainboard antenna support and a preparation method thereof. BACKGROUND

[0002] A terminal device in the form of a mobile phone or the like is mainly composed of a display screen, a mainboard, a mainboard antenna support and the like, wherein the mainboard antenna support comprises a metal frame part and a plastic part, the plastic part and the metal frame part form an integrated structure through an in-film injection molding process, and the plastic part is further provided with an antenna circuit.

[0003] At present, the forming process of the antenna circuit is mainly the LDS (Laser Direct Structuring, i.e. laser direct structuring technology) process. However, due to the forming characteristics of the LDS process, the forming material of the plastic part must be modified plastic containing an organic metal compound, which in turn results in a relatively high cost. Moreover, the LDS process needs to go through procedures such as laser engraving, cleaning with corrosive solutions such as strong acid and strong alkali, and chemical copper plating, so that the whole process of the mainboard antenna support is relatively long, and too many process steps will also lead to a relatively low yield of the product. At the same time, since the LDS process must go through cleaning with corrosive solutions such as strong acid and strong alkali, the metal frame part needs to be made of corrosion-resistant stainless steel material, or at least needs to be coated with a corrosion-resistant masking coating, but this will result in an increase in the manufacturing cost of the mainboard antenna support or a longer manufacturing process.

[0004] Therefore, how to provide a solution to at least overcome some of the above-mentioned defects is still a technical problem to be solved by those skilled in the art. SUMMARY

[0005] Embodiments of the present application provide a terminal device, a mainboard antenna support and a preparation method thereof. The preparation method of the mainboard antenna support has a relatively short process, which is conducive to ensuring the yield of the product, and there is no cleaning process with corrosive solutions such as strong acid and strong alkali, and no chemical copper plating process and other processes with strong pollution, which can also reduce the harm to the environment and the health of the on-site workers during the preparation of the mainboard antenna support.

[0006] The first aspect of the embodiment of the present application provides a preparation method of a mainboard antenna support, the mainboard antenna support comprising a metal frame part and a plastic part, the preparation method comprising the following steps: step S1, configuring the metal frame part; step S2, configuring plastic material, and integrally injection molding the plastic part on the metal frame part with the metal frame part as the base, so that the plastic part and the metal frame part can be fixedly connected as a whole; and step S3, processing an antenna circuit and a feeding part on opposite surfaces of the plastic part respectively, and the feeding part and the antenna circuit are electrically connected. Generally, the plastic part can be provided with a communication hole, and a conductive medium can be injected into the communication hole to realize the electrical connection of the antenna circuit and the feeding part. The processing technology of the antenna circuit and the feeding part is one or more of a spraying process, a printing process and a 3D printing process.

[0007] Different from the conventional LDS process, the antenna circuit and the feeding part in the embodiment of the present application can be prepared by one or more of a spraying process, a printing process and a 3D printing process. These processes do not have requirements for the material of the plastic part. That is, the plastic material used to form the plastic part can not contain an organic metal compound, which makes the conventional plastic material also meet the use requirements, the acquisition of the plastic material can be simple, and the processing cost of the plastic part can be reduced.

[0008] More importantly, compared with the traditional LDS process, the preparation method of the mainboard antenna support provided in the embodiment of the present application can greatly shorten the process, and the involved process steps are less. Therefore, the links that may cause problems are relatively less, and the yield of the product can be improved. In addition, since there is no cleaning process of strong acid and strong base corrosive solution, and no chemical copper plating process with strong pollution, the harm to the environment and the life and health of the on-site workers in the preparation process of the mainboard antenna support can be reduced.

[0009] It should be pointed out that the preparation method of the mainboard antenna support provided in the embodiment of the present application makes it possible to use the plastic material without an organic metal compound, but this does not mean that the plastic material without an organic metal compound must be used in the specific implementation. Actually, the material of the plastic part and the metal frame part is not limited in the above preparation method. That is, the material selection of the plastic part and the metal frame part cannot be used as a limitation on the implementation range of the mainboard antenna support provided in the embodiment of the present application.

[0010] Based on the first aspect, the first aspect of the first embodiment of the present application further comprises the following steps before step S1: step S0, configuring a metal raw material; at this time, step S1 can be specifically: processing the metal raw material to form the metal frame part.

[0011] The metal frame part can be a prefabricated part, so that when the preparation method provided by the embodiments of the present application is performed, the metal frame part can be directly taken and used.

[0012] In addition, the metal frame part can also be formed by machining, so that the shape of the metal frame part can be more conveniently adjusted according to needs. In this case, before the metal frame part is used, a metal raw material is first configured. The metal raw material can be a metal coil, a sheet, etc., and the configuration of the metal frame part in step S1 can be machining the metal raw material to form the metal frame part. The machining of the metal frame part can involve cutting, cutting, stamping, etc., which is specifically related to the type of metal raw material used and the modeling requirements of the final metal frame part, etc.

[0013] Based on the first embodiment of the first aspect, the embodiments of the present application also provide a second embodiment of the first aspect: the metal raw material can be a lightweight metal with a density of 3.0g / cm 3 The following lightweight metal.

[0014] As mentioned above, the preparation method provided by the embodiments of the present application does not involve a cleaning process of a strong acid or a strong base corrosive solution and a chemical copper plating process, so in the embodiments of the present application, a lightweight metal with a density less than 3.0g / cm 3 , such as aluminum alloy, magnesium alloy, aluminum-magnesium alloy, etc., which has relatively poor corrosion resistance. Compared with traditional steel or titanium metal frame parts (generally with a density of 4.5g / cm 3 ), these lightweight metals can greatly reduce the weight under the same volume, and can meet the lightweight design requirements of the mainboard antenna support and terminal equipment.

[0015] In addition, the thermal conductivity of the above-mentioned lightweight metal is generally large (for example, the thermal conductivity of aluminum alloy is generally above 100w / mk, and the thermal conductivity of magnesium alloy is generally above 50w / mk), and when the lightweight metal is used to prepare the metal frame part, the heat dissipation performance of the mainboard antenna support provided by the embodiments of the present application can also be improved.

[0016] Based on the first or second embodiment of the first aspect, the embodiments of the present application also provide a third embodiment of the first aspect: one important function of the mainboard antenna support is to press the BTB connector, and the area of the pressed BTB connector is usually located in the metal frame part. For the convenience of description, the area of the metal frame part used for pressing the BTB connector can be referred to as the pressing area, and the foregoing machining of the metal raw material can specifically include: machining the above-mentioned pressing area and configuring a reinforcing structure and / or a reinforcing member in the pressing area.

[0017] The reinforcing structure herein refers to a structure formed by the metal frame part after local structure optimization of the metal frame part, and the reinforcing member is an external structural member which can be installed on the metal frame part by mechanical connection such as bonding, welding, riveting, etc. By configuring the reinforcing structure and / or the reinforcing member in the crimping area, the structural strength of the crimping area can be improved, and the technical purpose of reliably crimping the BTB connector can be better met.

[0018] This scheme is particularly suitable for metal frame parts prepared from light metal, and can better compensate for the relatively low structural strength of light metal itself. Of course, when light metal is not used, the reinforcing structure and / or the reinforcing member described above can also be configured.

[0019] Based on the third implementation of the first aspect, the embodiments of the present application further provide a fourth implementation of the first aspect: the reinforcing structure described above can include at least one of a bent structure, a multi-layer plate structure, the bent structure being a bent portion provided in the crimping area, and the multi-layer plate structure being a plate-shaped structure provided in the crimping area by folding; and / or, the reinforcing member can include at least one of a plastic layer, a reinforcing plate, and a reinforcing plating layer, which can be installed on the crimping area by mechanical connection such as bonding, welding, riveting, etc., to reinforce the strength of the metal frame part.

[0020] Based on any one of the first implementation to the fourth implementation of the first aspect, the embodiments of the present application further provide a fifth implementation of the first aspect: the metal frame part can have a stamping area, and the processed metal raw material includes: processing the stamping area by a multi-stage stamping manner to form multi-stage stamping sections, wherein a lower-stage stamping section is formed by stamping a bottom wall of an adjacent upper-stage stamping section, and a transition step surface is formed between the two adjacent stamping sections.

[0021] When performing the stamping operation, especially for the metal frame part prepared from light metal with relatively poor ductility, the stamping can be performed by a step-by-step stamping manner to disperse the relatively large stamping depth into each stage of the stamping process, so that the depth of each stamping is not large, and the cracking problem caused by excessive stamping depth at a time can be avoided to a large extent. In specific operation, the stamping can be performed step by step, the upper-stage stamping section is first stamped, and then the adjacent lower-stage stamping section is stamped on the bottom wall of the upper-stage stamping section. The portion of the bottom wall of the upper-stage stamping section which is not stamped can form a transition step surface between the two adjacent stamping sections.

[0022] Based on any one of the first implementation to the fifth implementation of the first aspect, the embodiments of the present application further provide a sixth implementation of the first aspect: the metal frame part has a folded plate area, and the processed metal raw material includes: processing the folded plate area by a folding process.

[0023] In addition to the above-mentioned multi-stage stamping scheme, a folding plate area can be arranged on the metal frame part, so that the cracking problem caused by insufficient ductility of the metal frame part and over-deep single stamping can be avoided.

[0024] Based on any one of the embodiments of the first aspect, the embodiments of the present application further provide a seventh embodiment of the first aspect. Step S2 can specifically include: step S21, configuring a plastic mold; step S22, implanting the metal frame part into the plastic mold; and step S23, injecting the molten plastic material into the plastic mold, and after the plastic material cools, demolding can be performed to obtain the metal frame part and the plastic part integrally connected as one.

[0025] Based on any one of the embodiments of the first aspect, the embodiments of the present application further provide an eighth embodiment of the first aspect. After step S3, step S4 can be further included, which is an edge processing process for finishing the antenna circuit.

[0026] When the antenna circuit is processed by a spraying process, a printing process or a 3D printing process, a certain allowance can be preset, the size of the allowance can be determined in combination with the actual situation, and then the edge processing process is used to finish the antenna circuit to remove the excess part, thereby forming the final antenna circuit. In this way, the tolerance size of the antenna circuit can be controlled within ±0.1mm, or even within ±0.07mm, so that the precision of the antenna circuit can be greatly improved.

[0027] The edge processing process here is an edge finishing process, which is used for fine processing of the edge of the edge circuit. Generally, the edge processing process can be a laser engraving process.

[0028] Based on any one of the embodiments of the first aspect, the embodiments of the present application further provide a ninth embodiment of the first aspect. The feed part and the antenna circuit can each include a plurality of layers, and each layer can be spaced apart in a direction away from the plastic part. In this way, the aforementioned step S3 can be: layer by layer processing the antenna circuit and the feed part on opposite sides of the plastic part.

[0029] The layer-by-layer processing scheme is more conducive to obtaining an antenna circuit and a feed part with a three-dimensional structure, which can better ensure the structure of the antenna circuit and the feed part, and can greatly avoid defects such as disconnection, thereby ensuring the processing quality of the antenna circuit and the feed part.

[0030] More importantly, when the above-mentioned design scheme of layer-by-layer processing is adopted, the same material or different materials can be used for each layer; when different materials are used, the main functions of each layer can be different, and the performance parameters of the antenna circuit and the feeding part, such as conductivity and wear resistance, can be conveniently adjusted; at the same time, the thickness of the antenna circuit and the feeding part can be increased, which can also ensure the service life of the antenna circuit and the feeding part to a certain extent.

[0031] Based on any of the embodiments of the first aspect, the embodiments of the present application further provide a tenth embodiment of the first aspect: after step S3, step S5 of arranging a shielding layer outside the antenna circuit can be further included.

[0032] The shielding layer can protect the antenna circuit, thereby reducing the risk of damage to the antenna circuit caused by scratching, wear, scratches, and other damage from other components during installation and use, thereby ensuring the reliable and stable operation of the antenna circuit for a relatively long period of time. In specific practice, the shielding layer can be made of insulating material, which can also avoid electrical connection between the antenna circuit and unnecessary components, thereby affecting the normal operation of the antenna circuit.

[0033] The second aspect of the embodiments of the present application provides a mainboard antenna support, which is usually arranged inside the shell of a terminal device and is mainly used to realize the functions of arranging an antenna circuit, fixedly connecting a mainboard, and crimping a BTB connector; the mainboard antenna support can include a metal frame part and a plastic part, and the metal frame part and the plastic part can be fixedly connected. Generally, the plastic part can be fixedly connected with the metal frame part by means of one-piece injection molding. Opposite surfaces of the plastic part are respectively provided with an antenna circuit and a feeding part, and the feeding part and the antenna circuit are electrically connected, wherein the processing technology of the antenna circuit and the feeding part is one or more of a spraying process, a printing process, and a 3D printing process.

[0034] The mainboard antenna support provided in the second aspect of the embodiments of the present application corresponds to the preparation method of the mainboard antenna support provided in the first aspect, and therefore, the technical effects mentioned in the preparation method are also possessed by the mainboard antenna support provided in the embodiments of the present application, which will not be repeated here.

[0035] Based on the second aspect, the embodiments of the present application provide a first embodiment of the second aspect: the material of the metal frame part can be a lightweight metal with a density of 3.0 g / cm 3 The following lightweight metals.

[0036] Based on the second aspect or the first embodiment of the second aspect, the embodiments of the present application further provide a second embodiment of the second aspect: the metal frame part can have a crimping area for crimping a BTB connector, and the crimping area can be provided with a reinforcing structure and / or a reinforcing member.

[0037] Based on the second implementation of the second aspect, the embodiments of the present application further provide a third implementation of the second aspect: the reinforcing structure can include at least one of a bending structure and a multi-layer board structure; and / or the reinforcing member can include at least one of a plastic layer, a reinforcing plate, and a reinforcing plating layer.

[0038] Based on the third implementation of the second aspect, the embodiments of the present application further provide a fourth implementation of the second aspect: an adhesion-increasing layer can be further arranged between the reinforcing plating layer and the metal frame portion. The adhesion-increasing layer can increase the surface roughness of the metal frame portion, so as to facilitate reliable installation of the reinforcing plating layer.

[0039] Based on any of the implementations of the second aspect, the embodiments of the present application further provide a fifth implementation of the second aspect: the metal frame portion can have a stamping region, and the stamping region can include multiple levels of stamping sections, wherein a lower level of stamping sections is formed by stamping a bottom wall of an adjacent upper level of stamping sections, and a transition step surface is formed between adjacent two levels of stamping sections.

[0040] Based on any of the implementations of the second aspect, the embodiments of the present application further provide a sixth implementation of the second aspect: the metal frame portion can have a folded plate region.

[0041] Based on any of the implementations of the second aspect, the embodiments of the present application further provide a seventh implementation of the second aspect: the plastic portion can be made of a material that does not contain an organic metal compound.

[0042] The antenna circuit and the feed portion in the embodiments of the present application can be processed and formed by one or more of a spraying process, a printing process, and a 3D printing process, and these processes do not have requirements on the material of the plastic portion. Therefore, the plastic material used to form the plastic portion in the embodiments of the present application can not contain an organic metal compound, so that the plastic material can be easily obtained, and the processing cost of the plastic portion can be reduced.

[0043] In specific practice, the plastic material used to prepare the plastic portion can be any one or a combination of several of ABS, PP, PC, PE, PA+GF, PC+GF, and the like.

[0044] Based on any of the implementations of the second aspect, the embodiments of the present application further provide an eighth implementation of the second aspect: the plastic portion and the antenna circuit can each include a plurality of layers.

[0045] Based on the eighth embodiment of the second aspect, this application also provides a ninth embodiment of the second aspect: in each layer of the feed section, the wear resistance of the outermost layer is greater than that of the other layers of the feed section; and / or, in each layer of the antenna circuit, the wear resistance of the outermost layer is greater than that of the other layers of the antenna circuit.

[0046] The outermost layer here refers to the layer furthest from the plastic part. The outermost layer of both the antenna circuit and the feed part is designed to have high wear resistance, which can reduce the wear of the antenna circuit and the feed part during use, so that the antenna circuit and the feed part can maintain reliable and stable operation for a relatively long time, thereby improving the service life of the antenna circuit and the feed part.

[0047] Based on the eighth or ninth embodiment of the second aspect, this application also provides a tenth embodiment of the second aspect: the wear resistance of each layer of the feed section gradually decreases from the outside to the inside; and / or, the wear resistance of each layer of the antenna circuit gradually decreases from the outside to the inside.

[0048] In practice, the wear resistance of each layer of the antenna circuit and the feed section can be set to gradually decrease from the outside to the inside. This can also ensure the reliable and stable operation of the antenna circuit and the feed section for a longer period of time, thereby improving the service life of the antenna circuit and the feed section.

[0049] Based on the eighth, ninth, or tenth embodiment of the second aspect, this application also provides an eleventh embodiment of the second aspect: the conductivity of each layer of the feed section can gradually increase from the outside to the inside; and / or, the conductivity of each layer of the antenna circuit can gradually increase from the outside to the inside. This makes the electrical connection between the antenna circuit and the feed section more reliable; at the same time, it avoids using materials with high conductivity such as silver paste throughout, and also reduces the processing cost of the antenna circuit and the feed section.

[0050] Based on any of the embodiments of the second aspect, this application also provides a twelfth embodiment of the second aspect: a shielding layer may be provided on the outer side of the antenna circuit.

[0051] The third aspect of this application also provides a terminal device, including a housing, a motherboard, and a motherboard antenna bracket, wherein the motherboard and the motherboard antenna bracket are both installed inside the housing, and the motherboard antenna bracket is any of the motherboard antenna brackets involved in the various embodiments of the second aspect.

[0052] Since the motherboard antenna bracket in the second aspect already has the above-mentioned technical effects, the terminal device with the motherboard antenna bracket should also have similar technical effects, so it will not be elaborated here. Attached Figure Description

[0053] Figure 1 A structural schematic diagram of one specific embodiment of the terminal device provided by the embodiment of the present application;

[0054] Figure 2 A structural schematic diagram of one specific embodiment of the terminal device provided by the embodiment of the present application; Figure 1

[0055] Figure 3 A flowchart of one specific embodiment of the preparation method of the mainboard antenna support provided by the embodiment of the present application;

[0056] Figure 4 A schematic diagram of the preparation process of the mainboard antenna support provided by the embodiment of the present application;

[0057] Figure 5 A flowchart of one specific embodiment of the preparation method of the mainboard antenna support provided by the embodiment of the present application;

[0058] Figure 6 A schematic diagram of the mainboard antenna support provided by the embodiment of the present application;

[0059] Figure 7 A sectional view of the plastic part, the antenna circuit and the feeding part;

[0060] Figure 8 A connection structure diagram of the crimping area, the BTB connector 105, the mainboard and the middle frame;

[0061] Figure 9 A structural schematic diagram of the crimping area;

[0062] Figure 10 A structural schematic diagram of one specific embodiment of the crimping area shown in Figure 9 A sectional view in the A-A direction of some embodiments of the crimping area shown in

[0063] Figure 11 A structural schematic diagram of one specific embodiment of the crimping area shown in Figure 9 A sectional view in the A-A direction of some embodiments of the crimping area shown in

[0064] Figure 12 A structural schematic diagram of one specific embodiment of the crimping area shown in Figure 9 A sectional view in the A-A direction of some embodiments of the crimping area shown in

[0065] Figure 13 A structural schematic diagram of one specific embodiment of the crimping area shown in Figure 9 A sectional view in the A-A direction of some embodiments of the crimping area shown in

[0066] Figure 14 A structural schematic diagram of one specific embodiment of the crimping area shown in Figure 9 ​A third implementation of some other embodiments of the crimping region shown in the middle is a cross-sectional view in the A-A direction;

[0067] Figure 15 A structure diagram of the metal frame part in the prior art and the embodiments of the present application.

[0068] Figures 1-15 The reference signs in the drawings are explained as follows:

[0069] 100-terminal device, 101-display screen, 102-housing, 102a-middle frame, 102b-back cover, 103-mainboard antenna support, 104-mainboard, 105-BTB connector, 106-lock screw;

[0070] 1-metal coil stock;

[0071] 2-metal frame part, 21-crimping region, 211-bending structure, 212-multilayer plate structure, 213-plastic layer, 214-reinforcing plate, 215-reinforced plating layer, 216-adhesion increasing layer, 217-connection hole, 22-first stage stamping section, 23-second stage stamping section, 24-transition step surface, 25-folded plate region, 201-high tensile protrusion region, 202-high tensile recess region;

[0072] 3-plastic part, 31-conductive part;

[0073] 4-antenna circuit, 41-first sublayer, 42-second sublayer, 43-third sublayer;

[0074] 5-feeding part, 51-fourth sublayer, 52-fifth sublayer, 53-sixth sublayer, 54-seventh sublayer, 55-eighth sublayer;

[0075] 6-shielding layer;

[0076] M-plastic mold. DETAILED DESCRIPTION

[0077] In order for those skilled in the art to better understand the technical solutions of the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0078] Please refer to Figure 1 , Figure 1 A structure diagram of one specific implementation of the terminal device provided by the embodiments of the present application, Figure 2 is Figure 1 a split view.

[0079] The terminal device 100 involved in the embodiments of the present application can include a handheld device, a vehicle-mounted device, a wearable device, a computing device, or other processing devices connected to a wireless modem. It can also include a cellular phone, a smartphone, a personal digital assistant computer, a tablet computer, a handheld computer, a laptop computer, a video camera, a video recorder, a camera, a smart watch, a smart bracelet, a vehicle-mounted computer, and other terminal devices 100 with imaging functions. The embodiments of the present application do not specially limit the specific form of the terminal device 100, and for the convenience of understanding, the following is described by taking the terminal device 100 as a mobile phone as an example.

[0080] As shown in Figure 1 , Figure 2 , the terminal device 100 can generally include a housing 102 and a display screen 101. The housing 102 can have an accommodation cavity formed inside, and various components of the terminal device 100 can be arranged in the accommodation cavity. The specific components can include a battery, a mainboard 104, a mainboard antenna support 103, a camera assembly, etc., and the arrangement position and mounting manner of these components are not limited here.

[0081] The housing 102, as an external frame, can play a role in protecting the terminal device 100. The display screen 101 can be mounted on the housing 102. In some embodiments, in combination with Figure 2 , the housing 102 can include a middle frame 102a and a back cover 102b, and the aforementioned display screen 101 can be fixedly mounted on the middle frame 102a. The material of the housing 102 is not limited here, and in specific practice, a person skilled in the art can select it according to actual needs; for example, it can be a metal material, a plastic material, a ceramic material, or a glass material, etc.

[0082] The display screen 101 can be an organic light-emitting diode display screen or a liquid crystal display screen, etc. The display screen can be a flexible display screen or a hard display screen, wherein the flexible display screen gives a foldable function, which can realize the folding operation of the terminal device 100 in cooperation with the structural design of the housing 102. The display screen 101 can be a normal regular screen or an irregular screen, for example, the outer edge of the display screen 101 can be set as an arc shape to form a curved screen.

[0083] The display screen 101 can be arranged on the front face of the terminal device 100, or on the back face of the terminal device 100, or on both the front face and the back face of the terminal device 100. The front face of the terminal device 100 can be understood as the face facing the user when the user uses the terminal device 100, that is, the face marked with the number 101 as shown in Figure 1 . The back face of the terminal device 100 can be understood as the face away from the user when the user uses the terminal device 100.

[0084] Taking the front surface of the terminal device 100 as an example, the display screen 101 can cover all areas of the front surface of the terminal device 100 in terms of arrangement range, that is, the terminal device 100 can form a full-screen, at this time, the display screen 101 not only has a display function, but also usually has a touch function, that is, the terminal device 100 can be operated by clicking the display screen 101; or the display screen 101 can only cover a partial area of the front surface of the terminal device 100, which is also a selection that can be used in specific practice, at this time, the display screen 101 can have a touch function or only have a display function. It can be understood that when only having a display function, the area of the shell 102 where the display screen 101 is not arranged can be configured with corresponding human-computer operation components such as keys, so as to operate the terminal device 100. These human-computer operation components can be arranged at any position of the front surface, back surface or side surface of the terminal device 100.

[0085] The mainboard antenna support 103 is arranged inside the shell 102, and is mainly used to realize the functions of arranging the antenna circuit 4, fixedly connecting the mainboard 104, and pressing the BTB (Board To Board, that is, board-to-board) connector. As described in the background, the antenna circuit 4 of the existing mainboard antenna support 103 is generally processed and prepared by using the LDS process, but the LDS process has problems such as high requirement for the molding material of the plastic part 3, long process, low product yield, and high product manufacturing cost caused by the fact that the metal frame part 2 must be prepared from a corrosion-resistant material such as stainless steel or at least needs to be coated with a corrosion-resistant shielding coating.

[0086] Please refer to Figures 3-6 , Figure 3 A flowchart of one specific embodiment of the preparation method of the mainboard antenna support provided in the embodiments of the present application is shown in Figure 4 A schematic diagram of the preparation process of the mainboard antenna support provided in the embodiments of the present application is shown in Figure 5 A flowchart of the process of taking the metal frame part as the base and injecting the plastic part is shown in Figure 6 A schematic diagram of the side where the feed part of the mainboard antenna support provided in the embodiments of the present application is shown in.

[0087] In view of the above technical problems, as shown in Figures 3-6 The embodiments of the present application provide a new preparation method of a mainboard antenna support, which can at least include the following steps S1-S3.

[0088] Step S1, arranging a metal frame part 2.

[0089] The metal frame part 2 can be prepared in advance, such as an intermediate element prepared by outsourcing or other processes, at this time, step S1 only needs to prepare the metal frame part 2 ready for use. Alternatively, the metal frame part 2 can be processed in real time, at this time, before step S1, step S0 can also be included: configuring metal raw materials, which can be metal coil 1, sheet metal and the like, and step S1 can be processing metal raw materials to form the metal frame part 2; The processing of the metal frame part 2 can involve cutting, cutting, stamping and other processes, which is related to the type of metal raw material used.

[0090] In some embodiments, as shown in Figure 4 The metal raw material can be a metal coil 1. At this time, the metal coil 1 can be cut and cut first to obtain a base material for processing the metal frame part 2, which can be a square or rectangular plate; Then, the base material is further cut and cut to process the corresponding hollow area on the base material as needed, thereby forming an intermediate material that basically meets the shape requirements, which is still a flat plate; Then, the intermediate material can be stamped to obtain the corresponding concave-convex shape, and the final metal frame part 2 can be obtained. The specific cutting process, cutting process and stamping process are not specified and limited here.

[0091] Step S2, configure the plastic material, and integrate the plastic part 3 on the metal frame part 2.

[0092] As shown in detail, Figure 5 The required plastic mold M can be configured first; Then, the metal frame part 2 in step S1 can be implanted into the plastic mold M, and the specific structure of the plastic mold M can be determined according to actual needs; Then, the plastic material can be heated to a molten state, and the molten plastic material is injected into the cavity of the plastic mold M. The plastic material can form a plastic part 3 after condensation and solidification, and the plastic part 3 and the metal frame part 2 can have good joint effect to ensure the connection reliability of the two. The position of the plastic part 3 relative to the metal frame part 2 is not limited here, and in specific practice, those skilled in the art can set it according to actual needs.

[0093] Step S3, the antenna circuit 4 and the feeding part 5 are formed on the opposite two surfaces of the plastic part 3 respectively by using a spraying process, and the feeding part 5 and the antenna circuit 4 can be electrically connected. The antenna circuit 4 is a device for radiating and receiving radio waves (energy), which functions to transmit digital signals modulated to radio frequency to a space wireless channel, or receive digital signals modulated to radio frequency from a space wireless channel. In an exemplary scheme, the antenna circuit 4 can radiate and receive two 5G frequency bands of N78 (supporting 3400MHz-3600MHz) and N79 (supporting 4800MHz-5000MHz), which can truly realize full-network access. The feeding part 5 is a connecting part of the antenna circuit 4 and the mainboard 104. Generally, the mainboard 104 is welded with a spring or pasted with a conductive foam or other forms of conductive contact pieces, which can be in contact with the feeding part 5 to realize electrical connection and impedance matching. In this way, the electrical connection between the antenna circuit 4 and the mainboard 104 can be realized.

[0094] Different from the conventional design, the antenna circuit 4 and the feeding part 5 in the embodiment of the application are both formed by using a spraying process, which has no requirement for the material of the plastic part 3, that is, the plastic material used to form the plastic part 3 can not contain organic metal compounds. This makes the conventional plastic material also meet the use requirements, the acquisition of the plastic material becomes simple, and the processing cost of the plastic part 3 can be reduced.

[0095] In addition to the spraying process, the antenna circuit 4 and the feeding part 5 can also be prepared by using a printing process or a 3D printing process, which also has no requirement for the material of the plastic part 3. It should be noted that the antenna circuit 4 and the feeding part 5 can not be formed by using the same process, that is, the antenna circuit 4 and the feeding part 5 can be prepared by using any one or several of the spraying process, the printing process, and the 3D printing process. These are all applicable. The structure of the equipment required by the spraying process, the printing process, and the 3D printing process, the specific operation process of the spraying process, the printing process, and the 3D printing process, and the like are not limited herein, as long as the antenna circuit 4 and the feeding part 5 in the embodiment of the application can be obtained.

[0096] The type of the conventional plastic material is not limited herein, and in actual implementation, a person skilled in the art can determine according to actual conditions. As an exemplary description, the plastic material used for preparing the plastic part 3 in the embodiment of the application can be any one or a combination of several of the following materials: ABS (Acrylonitrile Butadiene Styrene), PP (polypropylene), PVC (Polyvinyl chloride), PC (Polycarbonate), PA (polyamide), PE (polyethene), PA+GF (Glass Fiber), PC+GF, etc.; when the plastic part 3 is prepared by mixing multiple materials (such as PA+GF), the proportion of each material is not limited herein, and in actual implementation, a person skilled in the art can adjust the combination according to the relevant properties of different materials.

[0097] More importantly, compared with the traditional LDS process, the preparation method of the mainboard antenna support provided in the embodiment of the application can greatly shorten the process, involve fewer process steps, and thus have relatively fewer possible problems, so that the yield of the product can be improved; and since there is no cleaning process of corrosive solutions such as strong acid and strong base, and no process with strong pollution such as chemical copper plating, the harm to the environment and the health of the on-site workers during the preparation of the mainboard antenna support 103 can be reduced.

[0098] Please refer to Figure 7 , Figure 7 is a sectional view of the plastic part, the antenna circuit, and the feeding part.

[0099] As shown in Figure 7 , the electrical connection between the antenna circuit 4 and the feeding part 5 is mainly realized through the conductive part 31 provided in the plastic part 3.

[0100] In detail, the plastic part 3 can be provided with a communication hole (not labeled in the figure), at least a part of the communication hole can be designed as a tapered section to facilitate the filling and flow of the conductive medium therein, and the type of the conductive medium is not limited herein, and in actual implementation, a person skilled in the art can determine according to actual conditions, or can also be set according to the content in the following. The tapered section can include a large neck end and a small neck end, and in the embodiment of the drawing, the large neck end is relatively closer to the antenna circuit 4, so that the conductive medium can be injected into the communication hole when the antenna circuit 4 is prepared, to facilitate the filling and flow of the conductive medium in the communication hole; in addition, the large neck end of the tapered section can also be arranged close to the feeding part 5, that is, the small neck end of the tapered section can be arranged close to the antenna circuit 4. Figure 7The conductive medium can be injected into the through hole when the feeding part 5 is prepared, so as to facilitate the flow of the conductive medium in the through hole.

[0101] In fact, the through hole is not limited to the design of the tapered hole, and can also be designed as other hole types, such as a stepped hole. In detail, the stepped hole can include a plurality of hole segments with different flow areas, and the flow areas of the hole segments can be gradually arranged along the axial direction of the through hole, that is, arranged in an increasing or decreasing manner from top to bottom (with reference to the orientation relationship in Figure 7 The adjacent two hole segments can form a stepped surface, so that the filling and flow of the conductive medium can be easily realized. If the filling difficulty is not considered, the through hole can also be designed as an axial hole with the same flow area, such as an equal-diameter circular hole. The plurality of hole segments specifically refers to two or more.

[0102] Further, the antenna circuit 4 and the feeding part 5 in the step S3 can be formed by multiple spraying, multiple printing or multiple printing, so as to form the antenna circuit 4 and the feeding part 5 with a three-dimensional structure. In this way, the structure of the antenna circuit 4 and the feeding part 5 can be more easily ensured, and defects such as disconnection can be avoided to a large extent, so as to ensure the processing quality of the antenna circuit 4 and the feeding part 5. Moreover, the antenna circuit 4 and the feeding part 5 actually include a plurality of layers, which can be made of the same material or different materials. When the different materials are used, the functions of the layers can be different, and the conductivity, wear resistance and other performance parameters of the antenna circuit 4 and the feeding part 5 can be easily adjusted.

[0103] Taking the feeding part 5 as an example, in the layers, the layer relatively close to the plastic part 3 can be made of a material with relatively good conductivity, such as silver paste, silver-coated copper paste, copper paste, etc., so as to ensure the conductivity. The layer relatively far from the plastic part 3, especially the outermost layer, can be made of a material with high hardness, such as wear-resistant silver paste added with wear-resistant materials, so as to improve the wear resistance of the feeding part 5, thereby ensuring that the feeding part 5 is not damaged for a relatively long time, and the service life of the feeding part 5 is improved. The outermost layer in this paper refers to the layer farthest from the plastic part 3, in combination with Figure 7 That is, the uppermost layer of the antenna circuit 4 and the lowermost layer of the feeding part 5.

[0104] The antenna circuit 4 can adopt a similar structure to the feeding part 5, that is, the layer relatively far from the plastic part 3 or at least the outermost layer can be made of a material with high hardness, so as to reduce the damage caused by other components to the antenna circuit 4, thereby ensuring the reliable and stable operation of the antenna circuit 4 for a relatively long time, and the service life of the antenna circuit 4 is improved.

[0105] Alternatively, in addition to the above scheme, the embodiment of the present application can further comprise a step S5 after step S3: coating a shielding layer 6 on the antenna circuit 4. The shielding layer 6 can also serve to protect the antenna circuit 4, so as to reduce the risk of partial detachment of the antenna circuit 4 due to scratching, abrasion, scratching and other damages of the antenna circuit 4 by other components during installation and use, and thus to ensure reliable and stable operation of the antenna circuit 4 for a relatively long period of time. The shielding layer 6 described above can be made of ink, paint, film or Mylar, and the paint can be PU (polyurethane) paint, which can be cured at low temperature or high temperature, has strong adhesion and high elongation at break, and is not prone to breakage. Further, the shielding layer 6 described above can be made of insulating material, so as to avoid electrical connection between the antenna circuit 4 and unnecessary components and affect the normal operation of the antenna circuit 4.

[0106] Please continue to refer to Figure 7 In the embodiment of the drawings, the antenna circuit 4 can include three layers, which can be named as a first layer 41, a second layer 42 and a third layer 43 in the direction away from the plastic part 3 for ease of description, and the outer side (i.e. the side away from the second layer 42) of the third layer 43 can be provided with a shielding layer 6; the feed part 5 can include five layers, which can be named as a fourth layer 51, a fifth layer 52, a sixth layer 53, a seventh layer 54 and an eighth layer 55 in the direction away from the plastic part 3 for ease of description, and at least the eighth layer 55 of these layers can be made of high-hardness material to improve the abrasion resistance of the feed part 5; the first layer 41 and the fourth layer 51 can be electrically connected through the conductive part 31.

[0107] Table 1 Material selection table of each layer of the antenna circuit and the feed part, the shielding layer and the conductive part

[0108]

[0109] In detail, the material of each layer of the antenna circuit 4 and the feeding part 5, the shielding layer 6 and the conductive part 31 can be selected according to the examples in Table 1. In the three schemes A, B and C shown in Table 1, the C scheme is a comparative scheme (also an implementable scheme), in which the three layers of the antenna circuit 4 and the conductive part 31 all use low-impedance silver paste to ensure the conductive performance, and each layer of the feeding part 5 uses wear-resistant silver paste to ensure the wear resistance. In the configuration process of the antenna circuit 4, the A and B schemes introduce silver-coated copper paste or copper paste to replace expensive silver paste, which can greatly reduce the cost. In the configuration process of the feeding part 5, the material of the fourth layer 51 to the sixth layer 53 relatively close to the plastic part 3 in the A and B schemes still uses silver-coated copper paste or copper paste, which has relatively good conductive performance, so that the conductive performance of the feeding part 5 can be ensured, and the stability of the electrical connection between the antenna circuit 4 and the main board 104 can be greatly improved. In the configuration process of the feeding part 5, the material of the seventh layer 54 and the eighth layer 55 relatively far from the plastic part 3 in the A and B schemes can use wear-resistant silver paste to ensure the wear resistance. It can be seen that the cost of the A and B schemes can be greatly reduced compared with the C scheme, the conductivity of the feeding part 5 can be improved, and the wear resistance of the feeding part 5 can also be considered, which is the preferred scheme of the present application.

[0110] It can be understood that the selection of the material of each layer of the antenna circuit 4 and the feeding part 5, the shielding layer 6 and the conductive part 31 in Table 1 is only an exemplary description of the present application, and cannot be regarded as a limitation on the implementation range of the main board antenna support and the preparation method thereof provided by the present application. In specific practice, those skilled in the art can also use other materials to process each layer of the antenna circuit 4 and the feeding part 5, the shielding layer 6 and the conductive part 31, as long as the requirements can be met.

[0111] Further, the step S3 can further include a step S4 of performing precision machining on the antenna circuit 4 by using a laser engraving process to ensure the dimensional tolerance of the antenna circuit 4. In fact, as shown in the figure, the step S4 is between the step S3 and the aforementioned step S5. Figure 3

[0112] Specifically, when the antenna circuit 4 is processed by using a spraying process, a printing process or a 3D printing process, a certain allowance can be preset, and the size of the allowance can be determined according to the actual situation. In some embodiments, the area of the printed antenna circuit 4 can be increased by about 0.1 mm on one side, and then the excess part is removed by using a laser engraving process, thereby forming the final antenna circuit 4. In this way, the tolerance size of the antenna circuit 4 can be controlled within ±0.1 mm, or even within ±0.07 mm, so that the precision of the antenna circuit 4 can be greatly improved. ​

[0113] In addition, since the preparation method of the mainboard antenna support provided in the embodiment of the present application does not need to use a strong acid and a strong base and other corrosive solutions in the LDS process for cleaning process, the material of the metal frame part 2 can also have more choices, which can use the material such as stainless steel in the prior art, or can use other materials, as long as it can meet the processing and preparation requirements of the specific structure form of the metal frame part 2, so that the metal frame part 2 can be relatively simple. Moreover, even if the metal frame part 2 does not use stainless steel and other metals that have corrosion resistance, it is also unnecessary to set a corrosion-resistant shielding coating, and the processing process of the metal frame part 2 can also be simplified.

[0114] Since the performance requirements of corrosion resistance do not need to be considered, in the embodiment of the present application, a light metal with a density less than 3.0 g / cm 3 , such as an aluminum alloy, a magnesium alloy, an aluminum-magnesium alloy, etc., can be preferably used. Compared with the traditional steel material type or titanium material type metal frame part 2 (the density is generally 4.5 g / cm 3 ), the use of light metal can also reduce the weight of the mainboard antenna support to meet the design requirements of the current terminal device 100 lightweight.

[0115] In addition, the thermal conductivity coefficient of the traditional steel material type metal frame part 2 is generally around 16.3 w / mk, the thermal conductivity coefficient of the traditional titanium material type metal frame part 2 is generally around 15 w / mk, and the thermal conductivity coefficient of the above light metal can be relatively large (such as the thermal conductivity coefficient of the aluminum alloy is generally more than 100 w / mk, and the thermal conductivity coefficient of the magnesium alloy is generally more than 50 w / mk), which can also improve the heat dissipation performance of the mainboard antenna support 103 provided in the embodiment of the present application.

[0116] Please refer to Figures 8-14 , Figure 8 for the connection structure diagram of the crimping area, the BTB connector 105, the mainboard and the middle frame, Figure 9 for the structure diagram of the crimping area, Figure 10 for Figure 9 the first embodiment of some embodiments of the crimping area shown in FIG. 8 in the A-A direction, Figure 11 for Figure 9 the second embodiment of some embodiments of the crimping area shown in FIG. 8 in the A-A direction, Figure 12 for Figure 9 the first embodiment of some other embodiments of the crimping area shown in FIG. 9 in the A-A direction, Figure 13 for Figure 9 the second embodiment of some other embodiments of the crimping area shown in FIG. 9 in the A-A direction, Figure 14 for Figure 9A third implementation of another embodiment of the crimping region shown in the cross-sectional view in the A-A direction.

[0117] As mentioned above, one important function of the mainboard antenna support is to crimp the BTB connector 105, specifically by the metal frame part 2 crimping the BTB connector 105, which requires that at least the crimping region 21 of the metal frame part 2 has a certain strength. However, the strength of light metal is relatively low, and in order to adapt to the crimping of the BTB connector 105, the crimping region 21 of the metal frame part 2 can also be appropriately structurally optimized or reinforced.

[0118] As shown in Figure 8 and Figure 9 , the crimping region 21 can be provided with a connecting hole 217 on each side in the first direction, for mounting a locking screw 106 that can pass through the connecting hole 217 and be connected to the mainboard 104 and the middle frame 102a, to fix and connect the mainboard antenna support 103 provided by the embodiments of the present application to the mainboard 104 and the middle frame 102a of the terminal device 100.

[0119] In some embodiments, the strength of the crimping region 21 can be enhanced by structural optimization.

[0120] As shown in Figure 10 , in the first implementation, the specific optimization method can be to provide a bending structure 211 at at least one of the two ends of the crimping region 21 in the second direction. The second direction here refers to the direction perpendicular to the first direction within the crimping surface of the crimping region 21 and the BTB connector 105. Due to the design of the bending structure 211, the structural strength of the crimping region 21 of the metal frame part 2 is improved, thereby being able to meet the crimping requirements of the BTB connector 105.

[0121] In the embodiment of the drawings, as shown in Figure 10 -a, the bending structure 211 can be a U-shaped bending with the opening facing the BTB connector 105. In addition, the bending structure 211 can also be provided in other structural forms. For example, as shown in Figure 10 -b, the bending structure 211 can also be a U-shaped bending with the opening facing away from the BTB connector 105, Figure 10 -a and Figure 10 -b both show a U-shaped bending, which can form three bends compared to a flat plate component, and can better improve the strength of the crimping region 21; or, as shown in Figure 10 -c and Figure 10As shown in -d, the bending structure 211 can also be a V-shaped bend with the opening facing or away from the BTB connector 105. Compared to a U-shaped bend, a V-shaped bend forms two bends, which is relatively simple in structure, easier to process, and can also achieve a better technical effect of improving strength; or, as... Figure 10 -e and Figure 10 As shown in -f, the bending structure 211 can also be a bent plate in the form of a flange, wherein... Figure 10 In the embodiment of -e, the folding direction of the flange can be towards the BTB connector 105. Figure 11 In the embodiment of -f, the folding direction of the flange can be away from the direction of the BTB connector 105. Compared with U-shaped bends and V-shaped bends, the flanged bending plate only has one bend, which makes its structure simpler, easier to process, and occupies less space in the second direction.

[0122] In the second embodiment, the pressing area 21 can adopt a multi-layer board structure 212 to compensate for the relatively limited strength of a single board. The specific number of layers in the multi-layer board structure 212 can be designed according to actual needs, as shown in the attached embodiment. Figure 12 As shown, the pressing area 21 can adopt a double-layer plate structure, which can be formed by folding the metal frame part 2, and there can be a gap between the double-layer plates.

[0123] In other embodiments, the strength of the crimped area 21 can also be enhanced by providing reinforcing members.

[0124] In the first implementation, such as Figure 13 As shown, the reinforcing member can be a plastic layer 213, which can be disposed on the surface of the crimping area 21 to compensate for the insufficient strength of the crimping area 21. The plastic layer 213 can be located on the surface of the crimping area 21 facing the BTB connector 105, in which case the crimping area 21 can crimp the BTB connector 105 using the plastic layer 213; alternatively, the plastic layer 213 can be located on the surface of the crimping area 21 away from the BTB connector 105; or, the plastic layer 213 can be simultaneously located on both the surfaces of the crimping area 21 facing and away from the BTB connector 105, in which case the crimping area 21 also crimps the BTB connector 105 using the plastic layer 213.

[0125] The material of the plastic layer 213 is not limited here, and can be selected according to the material of the plastic part 3. The plastic layer 213 can be a modified plastic containing an organic metal compound, or a common plastic, as long as it can strengthen the crimping area 21. Similarly, the thickness of the plastic layer 213 is not limited here. It can be understood that, when the material of the plastic layer 213 is determined, the greater the thickness of the plastic layer 213, the better the strengthening effect. In actual practice, the thickness of the plastic layer 213 can be determined by a person skilled in the art according to the material of the plastic layer 213 and the strengthening requirement. Similarly, the arrangement area of the plastic layer 213 is not limited, as long as it can achieve the corresponding strengthening effect. Considering the ease of controlling the arrangement area of the plastic layer 213, a groove (not labeled in the figure) can be arranged at the position of the crimping area 21 where the plastic layer 213 is arranged, and the plastic layer 213 can be directly arranged in the groove.

[0126] In the second embodiment, as shown in Figure 14 , the reinforcing member can also be a reinforcing plate 214 arranged at the crimping area 21 to improve the strength of the crimping area 21 through the reinforcing plate 214. The reinforcing plate 214 can be a metal material or a non-metal material, as long as it can achieve the corresponding reinforcing effect. It should be noted that, if the reinforcing plate 214 is a metal material, the type of the metal material can be consistent with or inconsistent with the metal frame part 2, which can be selected in actual practice.

[0127] The fixing method of the reinforcing plate 214 and the metal frame part 2 can have many choices, such as welding process, riveting process, threaded connection process, in-mold injection process, etc., as long as the connection reliability of the reinforcing plate 214 and the metal frame part 2 can be ensured. The reinforcing plate 214 can be located on the surface of the crimping area 21 facing the BTB connector 105, so that the crimping area 21 can crimp the BTB connector 105 through the reinforcing plate 214. Alternatively, the reinforcing plate 214 can be located on the surface of the crimping area 21 away from the BTB connector 105. Alternatively, the reinforcing plate 214 can be located on both surfaces of the crimping area 21 facing and away from the BTB connector 105, so that the crimping area 21 also crimps the BTB connector 105 through the reinforcing plate 214.

[0128] In the third embodiment, as shown in Figure 15As shown, the reinforcing member can also be a reinforcing plating layer 215 arranged at the crimping region 21 to reinforce the crimping region 21 through the reinforcing plating layer 215. The reinforcing plating layer 215 can be of a metal material or a non-metal material, as long as it can achieve the corresponding reinforcing effect; it should be noted that if the reinforcing plating layer 215 is of a metal material, the type of the metal material can be consistent with or inconsistent with the metal frame part 2, which can be selected in actual practice.

[0129] In specific processing, the reinforcing plating layer 215 can be located at the surface of the crimping region 21 facing the BTB connector 105, at this time, the crimping region 21 can crimp the BTB connector 105 through the reinforcing plating layer 215; or the reinforcing plating layer 215 can also be located at the surface of the crimping region 21 away from the BTB connector 105; or the reinforcing plating layer 215 can also be located at both surfaces of the crimping region 21 facing and away from the BTB connector 105, at this time, the crimping region 21 also crimps the BTB connector 105 through the reinforcing plating layer 215.

[0130] Further, to improve the bonding of the reinforcing plating layer 215 and the metal frame part 2, an adhesion increasing layer 216 can also be arranged between the reinforcing plating layer 215 and the metal frame part 2, which can increase the surface roughness of the metal frame part 2 to facilitate the reliable installation of the reinforcing plating layer 215.

[0131] It should be noted that the above three embodiments are only several exemplary descriptions of the specific structure of the reinforcing member shown in the embodiments of the present application, and cannot be regarded as a limitation on the implementation scope of the mainboard antenna support and the preparation method thereof provided by the present application. The reinforcing member described above can also adopt other structural forms under the condition of meeting the reinforcing requirement; for example, the reinforcing member can also be a reinforcing rib, etc.; in addition, the scheme of arranging the reinforcing member and the scheme of optimizing the structure described above can also exist simultaneously to better ensure the structural strength of the crimping region 21.

[0132] Please refer to Figure 15 , Figure 15 for the structural schematic diagram of the metal frame part in the prior art and the embodiments of the present application.

[0133] In a terminal device, taking a mobile phone as an example, the motherboard antenna bracket is located between the motherboard 104 and the rear camera bracket. The metal frame 2 needs to simultaneously ground both the camera bracket and the motherboard 104 to reduce or avoid RSE (Radiated Spurious Emission, which refers to emissions outside the operating frequency radiated by the mobile station through the mobile station housing, power supply, control equipment, and audio cables when the mobile station is connected to a non-radiative purely resistive load or in receiving mode). To address this, during the fabrication of the metal frame 2, a localized area of ​​the metal frame 2 is typically stamped to form areas electrically connected to both the motherboard 104 and the rear camera bracket. Since the distance between the motherboard 104 and the rear camera bracket in the thickness direction (Z-direction) of the terminal device is relatively large, the stamping depth is generally substantial. Figure 15 -a contains the high-strength raised region 201 and the high-strength recessed region 202. However, for lightweight metals, their ductility is relatively poor, and excessive stamping depth may cause stamping cracks in the metal frame 2, which will also affect the yield of the metal frame 2.

[0134] Therefore, embodiments of this application can employ a multi-stage stamping scheme, such as... Figure 15 As shown in -b, specifically, a primary stamping section 22 can be punched out first in the metal frame section 2, and then the bottom wall of the primary stamping section 22 can be further stamped to form a secondary stamping section 23. A transition step surface 24 (i.e., the unstamped portion of the bottom wall of the primary stamping section 22) can be formed between the primary stamping section 22 and the secondary stamping section 23. With this arrangement, the depth of each stamping is relatively small, which can effectively disperse the stamping stress and thus alleviate the cracking problem caused by excessively deep single stamping of lightweight metals.

[0135] The specific number of stamping passes depends on the ductility of the lightweight metal and the total depth of stamping required, and is not specified in detail here. (See appendix) Figure 15 In the -b scheme, the number of stamping operations can be two, and in this case, the number of transition step surfaces 24 can be one.

[0136] Alternatively, stamping can be changed to bending, such as Figure 7 The high-tension indentation region 202 in -a can be directly passed through Figure 8 The folded plate area 25 in -b is replaced, which can better avoid problems such as stamping cracks caused by the relatively poor ductility of lightweight metals.

[0137] In this way, in step S1, that is, in the process of configuring the metal frame part 2, the metal frame part 2 can also be processed according to the above-mentioned processing process, so that the folding area 21 of the metal frame part 2 can meet the strength requirement, and the area to be punched of the metal frame part 2 can be avoided from being punched and cracked, so as to ensure the yield and performance of the product.

[0138] The embodiment of the present application can also provide a mainboard antenna support, which is related to the preparation method of the aforementioned mainboard antenna support. The parts not mentioned in the following description of the structure of the mainboard antenna support can be understood with reference to the aforementioned content. In detail, the mainboard antenna support can include a metal frame part 2 and a plastic part 3. The opposite surfaces of the plastic part 3 are respectively provided with an antenna circuit 4 and a feed part 5. The antenna circuit 4 and the feed part 5 can be processed and prepared by using any one or several of the spraying process, the printing process, and the 3D printing process.

[0139] In this way, since the antenna circuit 4 and the feed part 5 are both processed and formed by using the spraying process, this process has no requirement for the material of the plastic part 3, that is, the plastic material used to form the plastic part 3 can not contain organic metal compounds. This makes the conventional plastic material also meet the requirement of use, the acquisition of the plastic material can become simple, and the processing cost of the plastic part 3 can be reduced. The selection of the type of the conventional plastic material can be referred to the aforementioned content, and will not be repeated here.

[0140] More importantly, the mainboard antenna support 103 provided by the embodiment of the present application has a preparation process that can be greatly shortened compared with the traditional LDS process, and involves fewer process steps. Therefore, there are relatively fewer links that may cause problems, and the yield of the product can be improved. In addition, since there is no cleaning process of strong acid and strong base corrosive solution, and no chemical copper plating process with strong pollution, the harm to the environment and the life and health of the on-site workers during the preparation process of the mainboard antenna support 103 can be reduced.

[0141] The electrical connection between the antenna circuit 4 and the feed part 5 can be realized by the conductive part 31 provided in the plastic part 3. In detail, as shown in Figure 9 The plastic part 3 can be provided with a communication hole for filling a conductive medium to form the conductive part 31.

[0142] Further, the antenna circuit 4 and the feeding portion 5 can each be a multi-layer structure including a plurality of layers, each of which can be formed by any one of a spraying process, a printing process or a 3D printing process, so as to obtain the antenna circuit 4 and the feeding portion 5 with a three-dimensional structure. In this way, the structure of the antenna circuit 4 and the feeding portion 5 can be more easily ensured, and defects such as disconnection can be avoided to a greater extent, thereby ensuring the processing quality of the antenna circuit 4 and the feeding portion 5. Moreover, when the above multi-layer design is adopted, the layers can be made of the same material or different materials, and when different materials are used, the roles played by the layers can be different, and the conductivity, wear resistance and other performance parameters of the antenna circuit 4 and the feeding portion 5 can be conveniently adjusted. Meanwhile, the thickness of the antenna circuit 4 and the feeding portion 5 can be increased, which can also ensure the service life of the antenna circuit 4 and the feeding portion 5 to a certain extent.

[0143] The material selection of each layer of the antenna circuit 4 and the feeding portion 5 and the technical effects that can be achieved can be referred to the foregoing content, and no repetitive description is made herein.

[0144] Further, the outer side of the antenna circuit 4 can also be provided with a shielding layer 6. The shielding layer 6 can protect the antenna circuit 4, thereby reducing the risk of damage to the antenna circuit 4 caused by scratching, wear and tear and scratches of other components during installation and use, and thereby ensuring the reliable and stable operation of the antenna circuit 4 for a relatively long period of time.

[0145] In addition, since the mainboard antenna support provided by the embodiment of the present application does not need to use a strong acid or a strong alkali corrosive solution for cleaning in the LDS process, the material of the metal frame portion 2 can have more options, which can use the material such as stainless steel in the prior art, or other materials, as long as it can meet the processing and preparation requirements of the specific structure of the metal frame portion 2, so that the metal frame portion 2 can be relatively simple to obtain. Moreover, even if the metal frame portion 2 does not use stainless steel or other metals with inherent corrosion resistance, it is not necessary to set a corrosion-resistant shielding coating, and the processing process of the metal frame portion 2 can also be simplified.

[0146] Since the performance requirements of corrosion resistance do not need to be considered, in the embodiment of the present application, a lightweight metal with a density less than 3.0 g / cm 3 , such as an aluminum alloy, a magnesium alloy, an aluminum-magnesium alloy, etc., can be preferably used. Compared with the traditional steel material or titanium material metal frame portion 2 (the density is generally 4.5 g / cm 3 ), the use of lightweight metal can also reduce the weight of the mainboard antenna support, so as to meet the design requirements of the current terminal device 100 lightweight; and the lightweight metal has a high thermal conductivity, which can also improve the heat exchange performance of the mainboard antenna support 103.

[0147] Furthermore, the metal frame portion 2 includes a crimping area 21 for crimping and securing the BTB connector 105. Specifically, as... Figure 15 and ​ As shown, the crimping area 21 may be provided with connecting holes 217 on both sides of the first direction for installing locking screws 106. The locking screws 106 can pass through the connecting holes 217 and be connected to the motherboard 104 and the middle frame 102a to fix the motherboard antenna bracket 103 provided in this application embodiment to the motherboard 104 and the middle frame 102a of the terminal device 100.

[0148] To improve the strength of the crimping area 21, measures can be taken from multiple aspects, such as structural optimization and the addition of reinforcing components, to ensure that the crimping area 21 can reliably press the BTB connector 105. Specific structural optimization methods and the structural forms of the reinforcing components can be found in the foregoing descriptions and will not be repeated here.

[0149] Furthermore, the metal frame may include a stamping area, which can be a stepped structure comprising multiple stamping sections. Along the stamping direction, a lower stamping section can be punched out from the bottom wall of an adjacent upper stamping section. The stamping area of ​​the lower stamping section is smaller than that of the adjacent upper stamping section, and a transition step surface 24 can be formed between adjacent stamping sections. With this configuration, the depth of each stamping section in the stamping direction can be relatively small, effectively dispersing the stamping stress and thus mitigating the cracking problem caused by excessive single-stamping depth of lightweight metals.

[0150] The number of stamping sections depends on the ductility of the specific lightweight metal and the total stamping depth, and is not specified in detail here. (See Appendix) ​ In the -b scheme, there can be two stamping sections, namely a primary stamping section 22 and a secondary stamping section 23. During stamping, the primary stamping section 22 can be stamped first, and then a stamping head with a relatively small stamping area can be used to stamp the secondary stamping section 23 on the bottom wall of the primary stamping section 22. A transition step surface 24 can be formed between the primary stamping section 22 and the secondary stamping section 23. The transition step surface 24 here actually refers to the part of the bottom wall of the primary stamping section 22 that has not been stamped a second time.

[0151] Furthermore, the metal frame portion 2 may also include a folded plate region 25, replacing the stamping region with the folded portion region 25. This can also better avoid problems such as stamping cracking caused by the relatively poor ductility of lightweight metals.

[0152] The aforementioned stamping area or folding plate area 25 can form protrusions or recesses on the metal frame part 2 for electrical connection with the motherboard 104 and the rear camera bracket.

[0153] The above merely preferred embodiments of the present application, it should be noted that for those of ordinary skill in the art, without departing from the principles of the present application, can also make a number of improvements and refinements, these improvements and refinements should also be considered as the scope of protection of the present application.

Claims

1. A motherboard antenna bracket, characterized in that, The motherboard antenna bracket includes a metal frame and a plastic part that are fixedly connected. Antenna circuit and feed part are respectively provided on two opposite sides of the plastic part, and the feed part and the antenna circuit are electrically connected. The antenna circuit and the feed part are manufactured by one or more of the following processes: spraying, printing, and 3D printing. The antenna circuit is used to radiate and receive radio waves. The plastic part is made of a material that does not contain organometallic compounds; the metal frame part is made of a material with a density of 3.0 g / cm³. 3 The following lightweight metal; the metal frame has a crimping area for crimping a BTB connector, the crimping area being configured with a reinforcing structure and / or reinforcing members; The reinforcing structure includes at least one of a bent structure and a multi-layer board structure; and / or, the reinforcing member includes at least one of a plastic layer, a reinforcing plate, and a reinforcing coating.

2. The motherboard antenna bracket according to claim 1, characterized in that, An adhesion-enhancing layer is also provided between the reinforcing plating layer and the metal frame.

3. The motherboard antenna bracket according to claim 1 or 2, characterized in that, The metal frame has a stamping area, which includes multiple stamping sections, wherein the lower stamping section is formed by stamping the bottom wall of the adjacent upper stamping section, and a transition step surface is formed between two adjacent stamping sections.

4. The motherboard antenna bracket according to claim 1 or 2, characterized in that, The metal frame section has a folding plate area.

5. The motherboard antenna bracket according to claim 1 or 2, characterized in that, Both the power supply section and the antenna circuit comprise several layers.

6. The motherboard antenna bracket according to claim 5, characterized in that, Of the layers in the power supply section, the outermost layer has greater wear resistance than the other layers in the power supply section. And / or, Of the layers in the antenna circuit, the outermost layer has greater wear resistance than the other layers in the antenna circuit.

7. The motherboard antenna bracket according to claim 6, characterized in that, The wear resistance of each layer of the power supply section gradually decreases from the outside to the inside; and / or, The wear resistance of each layer of the antenna circuit gradually decreases from the outside to the inside.

8. The motherboard antenna bracket according to claim 5, characterized in that, The conductivity of each layer in the power supply section gradually increases from the outside to the inside; and / or, The conductivity of each layer of the antenna circuit gradually increases from the outside to the inside.

9. The motherboard antenna bracket according to claim 1 or 2, characterized in that, A shielding layer is provided on the outside of the antenna circuit.

10. A method for manufacturing a motherboard antenna bracket, characterized in that, The motherboard antenna bracket includes a metal frame and a plastic part, and the manufacturing method includes the following steps: Configured with a metal frame; A plastic part is integrally injection molded onto the metal frame portion using a plastic material as a base. An antenna circuit and a feed section are respectively processed on two opposite sides of the plastic part, and the feed section and the antenna circuit are electrically connected. The antenna circuit and the feed section are manufactured using one or more of the following processes: spraying, printing, and 3D printing. The antenna circuit is used to radiate and receive radio waves. The plastic part is made of a material that does not contain organometallic compounds. The metal frame part is made of a material with a density of 3.0 g / cm³. 3 The following lightweight metal; the metal frame has a crimping area for crimping BTB connectors, and the processing of the metal raw material includes: processing the crimping area and configuring a reinforcing structure and / or reinforcing member in the crimping area; the reinforcing structure includes at least one of a bending structure and a multilayer board structure; and / or, the reinforcing member includes at least one of a plastic layer, a reinforcing plate, and a reinforcing plating layer.

11. The method for manufacturing the motherboard antenna bracket according to claim 10, characterized in that, Before configuring the metal frame, the process also includes: configuring metal raw materials; The configuration of the metal frame specifically involves processing the metal raw material to form the metal frame.

12. The method for manufacturing the motherboard antenna bracket according to claim 10 or 11, characterized in that, The metal frame has a stamping area, and the processing of the metal raw material includes: processing the stamping area using a multi-stage stamping method to form a multi-stage stamping section, wherein the lower-stage stamping section is formed by stamping the bottom wall of the adjacent upper-stage stamping section, and a transition step surface is formed between two adjacent stamping sections.

13. The method for manufacturing the motherboard antenna bracket according to claim 10 or 11, characterized in that, The metal frame has a folding plate area, and the processing of the metal raw material includes processing the folding plate area using a folding process.

14. The method for manufacturing the motherboard antenna bracket according to claim 10 or 11, characterized in that, The integral injection molding of the plastic part onto the metal frame includes: Configure plastic molds; The metal frame is inserted into the plastic mold; Molten plastic material is injected into the plastic mold to integrally form a plastic part on the metal frame.

15. The method for manufacturing the motherboard antenna bracket according to claim 10 or 11, characterized in that, After processing the antenna circuit and the feed section on opposite sides of the plastic part, the process further includes: The antenna circuit is precision-machined using edge processing technology.

16. The method for manufacturing the motherboard antenna bracket according to claim 10 or 11, characterized in that, Both the power supply section and the antenna circuit include several layers. The process of processing the antenna circuit and the power supply section on opposite sides of the plastic part specifically involves processing the antenna circuit and the power supply section layer by layer on opposite sides of the plastic part.

17. The method for manufacturing the motherboard antenna bracket according to claim 10 or 11, characterized in that, After processing the antenna circuit and the feed section on opposite sides of the plastic part, the process further includes: A shielding layer is provided on the outside of the antenna circuit.

18. A terminal device, comprising a housing, a motherboard, and a motherboard antenna bracket, wherein the motherboard and the motherboard antenna bracket are both mounted within the housing, characterized in that, The motherboard antenna bracket is the motherboard antenna bracket described in any one of claims 1-9.

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