A method for positioning a crystal direction before a crystal bar is bonded

Abstract

The application provides a crystal bar orientation positioning method before crystal bar sticking, comprising the following steps: step S1: providing a crystal bar and placing the crystal bar on a crystal bar sticking machine; step S2: detecting a first crystal orientation deviation angle of the crystal bar to obtain a horizontal crystal orientation deviation angle a and a vertical crystal orientation deviation angle b; step S3: establishing an xy two-dimensional coordinate system, and corresponding (a, b) to a point in the xy two-dimensional coordinate system; step S4: judging a quadrant of (a, b) in the xy two-dimensional coordinate system, if (a, b) is in the first quadrant or the second quadrant, then entering the next step of adjusting the crystal orientation of the crystal bar; if (a, b) is in the third quadrant or the fourth quadrant, then placing the crystal bar upside down and then entering the next step of adjusting the crystal orientation of the crystal bar, which can improve the crystal orientation precision of the crystal bar, reduce the recheck value out-of-tolerance, reduce the number of times of glue removal and redo, and improve the efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of positioning and sticking rod, in particular to a crystal rod orientation positioning method before sticking rod. BACKGROUND

[0002] After the crystal rod is detected, it needs to be sliced. The slicing process has certain requirements for the crystal orientation of the crystal rod. Therefore, when the crystal rod is fixed on the crystal holder of the sticking rod machine, the crystal orientation of the crystal rod needs to be measured first. Then the crystal rod is fixed on the resin plate by glue, the resin plate is fixed on the crystal holder, and the crystal wafer with the required crystal orientation can be obtained after slicing.

[0003] At present, the crystal orientation of the wafer is determined by the sticking rod machine and the slicing machine. For example, the precision of the crystal orientation of the sticking rod machine is ±0.1°, the precision of the crystal orientation of the slicing machine is ±0.05°, and the precision of the crystal orientation of the crystal rod after sticking rod is completed is ±0.05°. Due to the superposition of the precision of the crystal orientation of the sticking rod machine ±0.1° and the precision of the crystal orientation of the crystal rod after sticking rod is completed ±0.05°, the precision of the crystal orientation of the wafer is ±0.15°, which exceeds the required precision ±0.1° of the crystal orientation of the wafer, resulting in the crystal orientation of the wafer being out of tolerance. When the crystal orientation of the wafer is out of tolerance, the crystal rod fixed on the crystal holder needs to be baked with glue and re-fixed on the resin plate, that is, it needs to be reworked. SUMMARY

[0004] The purpose of the present application is to provide a crystal rod orientation positioning method before sticking rod, which can make the crystal orientation of the wafer obtained after slicing meet the precision requirements.

[0005] In order to solve the above problems, the present application provides a crystal rod orientation positioning method before sticking rod, comprising the following steps:

[0006] Step S1: providing a crystal rod and placing the crystal rod on a sticking rod machine;

[0007] Step S2: detecting the first crystal orientation angle of the crystal rod to obtain the horizontal crystal orientation angle a and the vertical crystal orientation angle b;

[0008] Step S3: establishing an xy two-dimensional coordinate system, and corresponding (a, b) to a point in the xy two-dimensional coordinate system;

[0009] Step S4: judging the quadrant of (a, b) in the xy two-dimensional coordinate system. If (a, b) is in the first quadrant or the second quadrant, the crystal orientation of the crystal rod is adjusted in the next step. If (a, b) is in the third quadrant or the fourth quadrant, the crystal rod is placed upside down and then the crystal orientation of the crystal rod is adjusted in the next step.

[0010] Optionally, the step of detecting the crystal orientation deflection of the crystal rod includes:

[0011] The crystal orientation deflection angle of the crystal rod is detected by the angle measuring mechanism of the rod bonding machine.

[0012] Optionally, the crystal rod includes a first end face and a second end face disposed opposite to each other, and the step of detecting the first crystal orientation deflection angle of the crystal rod includes:

[0013] The first crystal orientation deflection angle of the crystal rod is detected from the first end face side.

[0014] Furthermore, if (a, b) is in the first or second quadrant, then the next step is to adjust the crystal orientation of the crystal rod, specifically including:

[0015] If (a, b) is in the first or second quadrant, then the rotation angle of the crystal rod is directly calculated based on the horizontal crystal orientation angle 'a' and the vertical crystal orientation angle 'b'; and

[0016] The crystal orientation of the crystal rod is adjusted according to the rotation angle.

[0017] Furthermore, if (a, b) is located in the third or fourth quadrant, the crystal rod is turned around and placed before proceeding to the next step of adjusting the crystal orientation of the crystal rod. Specifically, this includes:

[0018] If (a, b) is in the third or fourth quadrant, rotate the crystal rod so that the second end face and the first end face are interchanged, and then proceed to the next step to adjust the crystal orientation of the crystal rod.

[0019] Furthermore, if (a, b) is located in the third or fourth quadrant, the crystal rod is turned around and placed before proceeding to the next step of adjusting the crystal orientation of the crystal rod. Specifically, this includes:

[0020] If (a, b) is in the third or fourth quadrant, rotate the crystal rod so that the positions of the second end face and the first end face are interchanged; and

[0021] The second crystal orientation deflection angle of the crystal rod is detected from the second end face side, and the next step is to adjust the crystal orientation of the crystal rod.

[0022] Furthermore, the second crystal orientation deflection is located in the first quadrant or the second quadrant.

[0023] Furthermore, if (a, b) is in the third quadrant, then the second crystal orientation deflection is located in the second quadrant.

[0024] Furthermore, if (a, b) is in the fourth quadrant, then the second crystal orientation deflection is in the first quadrant.

[0025] Optionally, when the specific values ​​of the horizontal crystal orientation angle α and the vertical crystal orientation angle b are both positive, the crystal orientation angle is in the first quadrant;

[0026] When the specific value of the horizontal crystal orientation deflection angle α is negative and the specific value of the vertical crystal orientation deflection angle b is positive, the crystal orientation deflection angle is in the second quadrant.

[0027] When the specific value of the horizontal crystal orientation deflection angle α is negative, and the specific value of the vertical crystal orientation deflection angle b is negative, the crystal orientation deflection angle is in the third quadrant; and

[0028] When the specific value of the horizontal crystal orientation deflection angle α is positive and the specific value of the vertical crystal orientation deflection angle b is negative, the crystal orientation deflection angle is in the fourth quadrant.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] This invention provides a crystal orientation positioning method before crystal rod bonding, comprising the following steps: Step S1: providing a crystal rod and placing the crystal rod on a bonding machine; Step S2: detecting the first crystal orientation deflection angle of the crystal rod to obtain the horizontal crystal orientation deflection angle 'a' and the vertical crystal orientation deflection angle 'b'; Step S3: establishing an xy two-dimensional coordinate system, and assigning (a, b) to a point in the xy two-dimensional coordinate system; Step S4: determining the quadrant in which (a, b) is located in the xy two-dimensional coordinate system. If (a, b) is in the first or second quadrant, proceed to the next step to adjust the crystal orientation of the crystal rod; if (a, b) is in the third or fourth quadrant, turn the crystal rod around and place it before proceeding to the next step to adjust the crystal orientation of the crystal rod. This method can improve the accuracy of the crystal orientation angle of the crystal rod, reduce out-of-tolerance values ​​during re-inspection, reduce the number of times the debonding process needs to be repeated, and improve efficiency. Attached Figure Description

[0031] Figure 1 This is a flowchart illustrating a crystal orientation positioning method before crystal rod bonding according to an embodiment of the present invention.

[0032] Figure 2 This is a partial structural schematic diagram of a stick-on machine provided in an embodiment of the present invention;

[0033] Figure 3 This is a schematic diagram of the structure when adjusting the crystal orientation of the crystal rod according to an embodiment of the present invention.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1-Crystal rod; m-First end face; n-Second end face; 21-Crystal holder; 22-Resin plate; 23-Rotating stage. Detailed Implementation

[0036] The following will provide a more detailed description of a crystal orientation positioning method before crystal rod bonding according to the present invention. The invention will now be described in more detail with reference to the accompanying drawings, which illustrate preferred embodiments of the invention. It should be understood that those skilled in the art can modify the invention described herein while still achieving its advantageous effects. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the invention.

[0037] For clarity, not all features of the actual embodiments are described. In the following description, well-known functions and structures are not detailed in detail, as they would obscure the invention with unnecessary detail. It should be understood that in the development of any actual embodiment, numerous implementation details must be made to achieve the developer's specific objectives, such as changes from one embodiment to another according to limitations related to the system or business. Furthermore, it should be understood that such development work may be complex and time-consuming, but is merely routine work for those skilled in the art.

[0038] To make the objectives and features of the present invention more apparent and understandable, the specific embodiments of the present invention will be further described below with reference to the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise ratios, and are only used to conveniently and clearly assist in illustrating the objectives of the embodiments of the present invention.

[0039] The current method for positioning crystal rods before bonding exhibits fluctuations in crystal orientation data primarily stems from the dynamic accuracy of the bonding machine and variations in the slant of the crystal rod's radial cross-section. Analysis reveals that the main cause of poor crystal orientation accuracy is the out-of-tolerance re-inspection value of the vertical crystal orientation angle, with the secondary cause being the out-of-tolerance re-inspection value of the horizontal crystal orientation angle. The dynamic accuracy of the bonding machine is related to factors such as the eccentricity of the suction cups, the parallelism of the rollers, and the load-bearing capacity of the rollers.

[0040] Currently, after detecting the crystal orientation deflection angle of the crystal rod, the rotation angle of the crystal rod and the oscillation angle of the crystal holder are directly calculated based on the detected deflection angle to adjust the crystal orientation of the crystal rod. However, this single positioning method is not very effective. The crystal orientation deflection angle actually refers to the difference between the actual crystal orientation value of the crystal rod and the Bragg angle corresponding to the standard crystal orientation.

[0041] Figure 1 This is a flowchart illustrating a crystal orientation positioning method before crystal rod bonding provided in this embodiment. Figure 1 As shown, this embodiment provides a crystal orientation positioning method before crystal rod bonding, which can accurately position the crystal orientation of each crystal rod before bonding.

[0042] The crystal orientation positioning method before the crystal rod is attached includes the following steps:

[0043] Step S1: Provide a crystal rod and place the crystal rod on a rod bonding machine;

[0044] Step S2: Detect the first crystal orientation deflection angle of the crystal rod to obtain the horizontal crystal orientation deflection angle a and the vertical crystal orientation deflection angle b;

[0045] Step S3: Establish a two-dimensional xy coordinate system, and assign (a, b) to a point in the two-dimensional xy coordinate system;

[0046] Step S4: Determine the quadrant of (a, b) in the xy two-dimensional coordinate system. If (a, b) is in the first or second quadrant, proceed to the next step to adjust the crystal orientation of the crystal rod. If (a, b) is in the third or fourth quadrant, turn the crystal rod around and then proceed to the next step to adjust the crystal orientation of the crystal rod.

[0047] The following combination Figures 2-3 The crystal orientation positioning method before the crystal rod is attached is described in detail.

[0048] like Figure 2 As shown, step S1 is performed first, a crystal rod 1 is provided, and the crystal rod 1 is placed on the sticking machine.

[0049] The bonding machine includes a crystal holder 21, a resin plate 22, a rotary table 23, rollers, an angle measuring mechanism, and a fixing mechanism. The crystal holder 21 is fixed on the rotary table 23, and the rotary table 23 can drive the crystal holder 21 to rotate in a horizontal plane. The resin plate 22 is fixed on the crystal holder 21 and is used to bond the crystal rod 1. The fixing mechanism fixes the crystal rod 1 from both ends along its length. The fixing mechanism includes two suction cups that are attached to both ends of the crystal rod 1 and can rotate with the crystal rod 1. These suction cups act as position sensors to measure and adjust the vertical crystal orientation angle b of the crystal rod 1 by measuring the rotation angle of the crystal rod 1. The rollers and the angle measuring mechanism are both located outside the crystal rod 1, and the extension direction of the rollers is parallel to the crystal rod 1. The rollers support the crystal rod 1 so that it can rotate axially with the aid of the rollers. The rotary table 23 can drive the crystal holder 21 to rotate. The crystal rod includes a first end face m and a second end face n arranged opposite to each other.

[0050] In this step, the crystal rod 1 is fixed to the fixing mechanism, but not to the crystal holder 21 by the resin plate 22, that is, the crystal rod 1 has not yet undergone the sticking process.

[0051] Next, step S2 is executed to detect the first crystal orientation angle of the crystal rod 1 to obtain the horizontal crystal orientation angle a and the vertical crystal orientation angle b.

[0052] In this step, the angle measuring mechanism of the stick-bonding machine is used to detect the crystal orientation deflection angle of the crystal rod 1. Specifically, the angle measuring mechanism of the stick-bonding machine is used to detect the first crystal orientation deflection angle of the crystal rod 1 from the first end face m side.

[0053] Next, step S3 is executed to establish a two-dimensional xy coordinate system, and (a, b) is assigned as a point in the xy coordinate system. In the xy coordinate system, a corresponds to the x-axis value, and b corresponds to the y-axis value.

[0054] Next, step S4 is executed to determine the quadrant in which (a, b) is located in the xy two-dimensional coordinate system. If (a, b) is in the first quadrant or the second quadrant, the next step is to adjust the crystal orientation of the crystal rod. If (a, b) is in the third quadrant or the fourth quadrant, the crystal rod is turned around and placed before the next step is to adjust the crystal orientation of the crystal rod.

[0055] This step specifically includes:

[0056] Step S41: When both the horizontal crystal orientation angle α and the vertical crystal orientation angle b are positive, the crystal orientation angle is in the first quadrant; when the horizontal crystal orientation angle α is negative and the vertical crystal orientation angle b is positive, the crystal orientation angle is in the second quadrant; when both the horizontal crystal orientation angle α and the vertical crystal orientation angle b are negative, the crystal orientation angle is in the third quadrant; and when both the horizontal crystal orientation angle α and the vertical crystal orientation angle b are positive and the vertical crystal orientation angle b is negative, the crystal orientation angle is in the fourth quadrant. The specific values ​​of the horizontal crystal orientation angle α and the vertical crystal orientation angle b are the deviations between the actual crystal orientation value and the standard crystal orientation value of the crystal rod 1.

[0057] like Figure 3 As shown in step S421, if (a, b) is in the first quadrant or the second quadrant, the rotation angle β of the crystal rod is directly calculated based on the horizontal crystal orientation angle a and the vertical crystal orientation angle b, and the crystal orientation of the crystal rod is adjusted based on the rotation angle β.

[0058] Step S422: If (a, b) is in the third or fourth quadrant, rotate the crystal rod 1 so that the second end face n and the first end face m are interchanged, and then proceed to the next step to adjust the crystal orientation of the crystal rod 1.

[0059] In detail, firstly, if (a, b) is in the third or fourth quadrant, the crystal rod 1 is rotated so that the positions of the second end face n and the first end face m are interchanged. Next, the second crystal orientation angle of the crystal rod 1 is detected from the second end face n side. At this time, the second crystal orientation angle is located in the first or second quadrant. Specifically, if (a, b) is in the third quadrant, the second crystal orientation angle is located in the second quadrant; if (a, b) is in the fourth quadrant, the second crystal orientation angle is located in the first quadrant. Then, the crystal orientation of the crystal rod is adjusted in the next step, that is, the rotation angle β of the crystal rod is calculated directly based on the second crystal orientation angle, and the crystal orientation of the crystal rod is adjusted according to the rotation angle β.

[0060] This embodiment determines whether crystal rod 1 needs to be turned around before crystal orientation adjustment based on the quadrant of the first crystal orientation deviation angle distribution of the crystal rod, so as to improve the crystal orientation accuracy of the crystal rod 1, reduce the deviation value of the crystal orientation deviation angle re-inspection, reduce the number of times debonding and rework, improve efficiency, and also ensure that the crystal orientation angle of the crystal rod 1 meets the accuracy requirements, such as an accuracy of ±0.1°, so that the crystal orientation angle of the crystal rod 1 obtained after slicing meets the accuracy requirements.

[0061] Furthermore, after adopting the crystal orientation positioning method before sticking the crystal rod described in this embodiment, a large amount of actual measurement data showed that the re-inspection value of the vertical crystal orientation deflection angle was likely to fall within ±0.05°.

[0062] In summary, this invention provides a crystal orientation positioning method before crystal rod bonding, comprising the following steps: Step S1: providing a crystal rod and placing the crystal rod on a bonding machine; Step S2: detecting the first crystal orientation deflection angle of the crystal rod to obtain the horizontal crystal orientation deflection angle 'a' and the vertical crystal orientation deflection angle 'b'; Step S3: establishing an xy two-dimensional coordinate system, and assigning (a, b) to a point in the xy two-dimensional coordinate system; Step S4: determining the quadrant in which (a, b) is located in the xy two-dimensional coordinate system. If (a, b) is in the first or second quadrant, proceed to the next step to adjust the crystal orientation of the crystal rod; if (a, b) is in the third or fourth quadrant, turn the crystal rod around and place it before proceeding to the next step to adjust the crystal orientation of the crystal rod. This method can improve the crystal orientation accuracy of the crystal rod, reduce out-of-tolerance values ​​during re-inspection, reduce the number of times the debonding process needs to be repeated, and improve efficiency.

[0063] Furthermore, it should be noted that, unless otherwise specified or indicated, the terms "first" and "second" in the specification are used only to distinguish the various components, elements, steps, etc. in the specification, and are not used to indicate the logical or sequential relationships between the various components, elements, steps, etc.

Claims

1. A method for crystal orientation positioning before crystal rod bonding, characterized in that, Includes the following steps: Step S1: Provide a crystal rod and place the crystal rod on a sticking machine. The crystal rod includes a first end face and a second end face that are disposed opposite to each other. Step S2: Detect the first crystal orientation angle of the crystal rod from the first end face side to obtain the horizontal crystal orientation angle a and the vertical crystal orientation angle b; Step S3: Establish a two-dimensional xy coordinate system, and assign (a, b) to a point in the two-dimensional xy coordinate system; Step S4: Determine the quadrant of (a, b) in the xy two-dimensional coordinate system. If (a, b) is in the first or second quadrant, calculate the rotation angle of the crystal rod directly based on the horizontal crystal orientation angle α and the vertical crystal orientation angle β, and adjust the crystal orientation of the crystal rod according to the rotation angle. If (a, b) is in the third or fourth quadrant, rotate the crystal rod so that the second end face and the first end face are interchanged. Detect the second crystal orientation angle of the crystal rod from the second end face side, calculate the rotation angle β of the crystal rod directly based on the second crystal orientation angle, and adjust the crystal orientation of the crystal rod according to the rotation angle β.

2. The crystal orientation positioning method as described in claim 1, characterized in that, The steps for detecting the crystal orientation deflection of the crystal rod include: The crystal orientation deflection angle of the crystal rod is detected by the angle measuring mechanism of the rod bonding machine.

3. The crystal orientation positioning method as described in claim 1, characterized in that, The second crystal orientation deflection is located in the first quadrant or the second quadrant.

4. The crystal orientation positioning method as described in claim 3, characterized in that, If (a, b) is in the third quadrant, then the second crystal orientation deflection is located in the second quadrant.

5. The crystal orientation positioning method as described in claim 3, characterized in that, If (a, b) is in the fourth quadrant, then the second crystal orientation deflection is in the first quadrant.

6. The crystal orientation positioning method as described in claim 1, characterized in that, When the specific values ​​of the horizontal crystal orientation angle α and the vertical crystal orientation angle b are both positive, the first crystal orientation angle is in the first quadrant. When the specific value of the horizontal crystal orientation deflection angle α is negative and the specific value of the vertical crystal orientation deflection angle b is positive, the first crystal orientation deflection angle is in the second quadrant. When the specific value of the horizontal crystal orientation deflection angle α is negative, and the specific value of the vertical crystal orientation deflection angle b is negative, the first crystal orientation deflection angle is in the third quadrant; and When the specific value of the horizontal crystal orientation deflection angle α is positive and the specific value of the vertical crystal orientation deflection angle b is negative, the first crystal orientation deflection angle is in the fourth quadrant.

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