A method, system and apparatus for improving the performance of a thermopile sensor

Abstract

The application discloses a thermoelectric sensor performance improvement method, system and device, relates to the field of device performance improvement, and aims to solve the problems that device performance improvement and device testing cannot be simultaneously performed in the prior art and the problem that a device performance improvement method is complex. The application comprises a dotter, a testing device, a thermoelectric sensor and a position moving controller. The position moving controller comprises a first position moving controller and a second position moving controller. The first position moving controller is provided with the dotter and the testing device and moves in the horizontal direction and the vertical direction. The second position moving controller is provided with a stage, and the thermoelectric sensor is placed on the stage. The thermoelectric sensor moves in the horizontal direction and the vertical direction. The dotter covers ink dots on the surface of a device meeting preset conditions in the thermoelectric sensor, and the performance improvement of the thermoelectric sensor is completed. The testing device tests the thermoelectric sensor, and the diameter and thickness of the ink dots are adjustable.

Description

Technical Field

[0001] This invention relates to the field of device performance improvement technology, and in particular to a method, system and device for improving the performance of thermopile sensors. Background Technology

[0002] Thermopile sensors have wide applications in medical, military, and industrial fields. Improving the performance of thermopile sensors can enhance their responsivity, detectivity, and sensitivity, thereby reducing the difficulty and cost of subsequent signal processing, which is of significant practical importance. One effective method for improving the performance of thermopile sensors is to integrate high-absorption materials or structures onto the absorption layer of the thermopile sensor, thereby increasing the absorption of the sensor and thus improving its performance.

[0003] Current research has explored integrating high-absorption materials or structures into the absorption layer of thermopile sensors, such as black silicon, composite nanoforests, and pyramidal dielectric films. However, these methods cannot simultaneously improve device performance and perform testing, requiring separate processes. Furthermore, these high-absorption structures or materials often require complex microfabrication steps or expensive equipment for integration with the thermopile sensor, increasing manufacturing costs and potentially damaging the sensor's structure. Therefore, a simple and feasible method is needed to integrate high-absorption materials or structures onto thermopile sensors, improving sensor performance while maintaining a simple and cost-effective integration process. Summary of the Invention

[0004] The purpose of this invention is to provide a method, system, and apparatus for improving the performance of thermopile sensors, which solves the problems in the prior art where device performance improvement and testing cannot be performed simultaneously, requiring performance improvement and testing to be performed separately, resulting in complex processes, as well as the complexity of existing methods for improving the performance of thermopile infrared sensors.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] In a first aspect, the present invention provides a thermopile sensor performance improvement system, the system comprising:

[0007] Dot generator, testing equipment, thermopile sensor, and position movement controller;

[0008] The position movement controller includes a first position movement controller and a second position movement controller; the first position movement controller is equipped with a dotting device and a testing device to control the dotting device and the testing device to move in the horizontal and vertical directions; the second position movement controller is equipped with a platform, and the thermopile sensor is placed on the platform; the second position movement controller controls the thermopile sensor to move in the horizontal and vertical directions.

[0009] The dotting device covers the surface of the thermopile sensor with ink dots that meet preset conditions, thereby improving the performance of the thermopile sensor; the testing equipment is used to test the thermopile sensor; the diameter and thickness of the ink dots are adjustable.

[0010] Compared with existing technologies, the thermopile sensor performance improvement system provided by this invention includes: a dotting device, a testing device, and a position movement controller; the position movement controller includes a first position movement controller and a second position movement controller; the first position movement controller is equipped with the dotting device and the testing device to control the movement of the dotting device and the testing device in the horizontal and vertical directions; the second position movement controller is equipped with a stage on which the thermopile sensor is placed; the second position movement controller controls the movement of the thermopile sensor in the horizontal and vertical directions; the dotting device covers the surface of the thermopile sensor with ink dots that meet preset conditions, thereby improving the performance of the thermopile sensor; the testing device is used to test the thermopile sensor, and the diameter and thickness of the ink dots are adjustable. This system covers the thermopile sensor with ink dots on qualified devices, which can increase the absorption of the thermopile sensor and thus increase its output. Simultaneously, the device covered with ink dots can be used to perform performance testing using this system.

[0011] Secondly, the present invention provides a method for improving the performance of a thermopile sensor, the method being applied to a thermopile sensor performance improvement system, the method comprising:

[0012] The testing equipment for thermopile sensors

[0013] Perform performance testing and obtain the test results;

[0014] The dotting device and thermopile sensor are controlled by a position movement controller so that the dotting device covers ink dots on the surface of the thermopile sensor that meets the requirements.

[0015] By adjusting the diameter or thickness of the ink dots, a thermopile sensor covered by ink dots can be obtained;

[0016] The testing equipment performs performance tests on the thermopile sensor after ink dots are applied, and the test results are obtained.

[0017] Based on the test results, the device performance improvement process and device sorting process of the thermopile sensor are completed.

[0018] The method provided by this invention utilizes a dotting device in a testing system and ordinary ink to improve the performance of thermopile sensors. The diameter and thickness of the ink can be adjusted, thereby controlling the device performance. The testing system prints ink dots or other solutions with high absorption rates onto devices in the thermopile sensor that meet preset conditions to complete the performance improvement process. Subsequently, the testing system is used to perform device performance testing, thereby completing the device sorting process. Both performance improvement and performance testing can be completed through the testing system, which is simple, convenient, low-cost, and suitable for mass production of thermopile sensor improvement methods.

[0019] Thirdly, the present invention provides a thermopile sensor performance enhancement device, wherein the performance enhancement device is applied to a thermopile sensor performance enhancement system, and the device includes:

[0020] The ink dot covering module is used to control the dotting device via a position movement controller so that the dotting device covers ink dots on the surface of the thermopile sensor.

[0021] The ink dot control module is used to control the diameter or thickness of the ink dots to obtain the thermopile sensor covered by ink dots.

[0022] The performance testing module is used to test the performance of the thermopile sensor before and after ink dot coverage and obtain the test results.

[0023] The device sorting module is used to sort the thermopile sensor based on the test results.

[0024] The technical effects of device-based solutions are the same as those of method-based solutions, and will not be elaborated here. Attached Figure Description

[0025] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0026] Figure 1 This is a schematic diagram of the thermopile sensor performance improvement system provided by the present invention;

[0027] Figure 2 This is a schematic diagram of the thermopile sensor structure after ink dots have covered it.

[0028] Figure 3 This is a schematic diagram of the structure of ink dots and nanoforests integrated on the surface of a thermopile sensor.

[0029] Figure 4A flowchart illustrating the method for improving the performance of a thermopile sensor provided by this invention;

[0030] Figure 5 A schematic diagram of the device structure integrating ink dots and thermopile for nanoforests;

[0031] Figure 6 A comparison of the absorption rate test results of the thermopile sensor with ink dots and the ordinary thermopile sensor in the 2.5-14.5μm band.

[0032] Figure 7 A comparison of the output of a thermopile sensor with ink dots and a regular thermopile sensor in the 606nm-1550nm short-wavelength range at 100mW laser power.

[0033] Figure 8 This is a schematic diagram of the thermopile sensor performance improvement device provided by the present invention.

[0034] Figure label:

[0035] 1-Ignition dot, 2-Testing equipment, 3-Thermopile sensor, 4-First position movement controller, 5-Probe component, 6-Substrate, 7-Thermocouple, 8-Metal connecting wire, 9-Device absorption layer, 10-Ink dot, 11-Support layer, 12-Cavity, 13-Nanoforest structure, 14-Second position movement controller. Detailed Implementation

[0036] To facilitate a clear description of the technical solutions in the embodiments of the present invention, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. For example, the first threshold and the second threshold are merely used to distinguish different thresholds and do not limit their order. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" are not necessarily different.

[0037] It should be noted that in this invention, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0038] In this invention, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, a combination of a and b, a combination of a and c, a combination of b and c, or a, b, and c, where a, b, and c can be single or multiple.

[0039] For the semiconductor industry, CP (ChipProbe) testing is an essential step between wafer-level testing and classification and individual chip packaging. CP testing prevents the packaging of non-compliant thermopile devices, thereby reducing packaging costs and final product testing costs. For thermopile sensors, the CP testing process involves using CP testing equipment to perform performance tests on each device on the thermopile wafer, and marking non-compliant devices with ink dots to prevent them from being packaged.

[0040] Current thermopile sensors suffer from low absorption and low output. Existing solutions often require additional microfabrication steps, which can damage the device's structure. Furthermore, the microfabrication processes and materials are complex, expensive, difficult to control in terms of uniformity, and unsuitable for mass production. Therefore, a simple, convenient, low-cost method suitable for mass production of thermopile sensors is currently lacking.

[0041] The solutions provided in the embodiments of this specification will be described in conjunction with the accompanying drawings:

[0042] Example 1

[0043] Figure 1 This is a schematic diagram of the thermopile sensor performance enhancement system, such as... Figure 1 As shown, the system includes:

[0044] 1. Dot generator; 2. Test equipment; 3. Thermopile sensor; and 4. Position movement controller.

[0045] The position movement controller includes a first position movement controller 4 and a second position movement controller 14. The first position movement controller 4 is equipped with a dotting device 1 and a testing device 2 to control the movement of the dotting device 1 and the testing device 2 in the horizontal and vertical directions. The second position movement controller 14 is equipped with a stage on which the thermopile sensor 3 is placed. The second position movement controller 14 controls the movement of the thermopile sensor 3 in the horizontal and vertical directions. The dotting device 1 covers the surface of the thermopile sensor 3 with ink dots 10 that meet preset conditions, thereby improving the performance of the thermopile sensor 3. The testing device 2 is used to test the thermopile sensor 3. The diameter and thickness of the ink dots 10 are adjustable, and the performance of the device can be adjusted by regulating the diameter and thickness of the ink dots 10. The printing time can be adjusted in milliseconds (e.g., 20ms, 40ms, 60ms, 80ms, 100ms), and the diameter of the ink dots 10 changes with the printing time. Furthermore, the thickness of the ink dots 10 can also be adjusted by regulating the ink concentration.

[0046] In this system, the thermopile sensor 3 can be at the wafer level, such as a thermopile wafer, and the thermopile sensor specifically is a thermopile infrared sensor. The testing system can be a CP testing system. CP testing is located between wafer fabrication and packaging in the entire chip manufacturing process. The testing object is every DIE (die) in the entire wafer, and the purpose is to ensure that each DIE in the entire wafer basically meets the characteristics or design specifications of the device, usually including verification of voltage, current, timing, and function. The specific operation of CP testing is as follows: after the wafer fabrication is completed, thousands of bare DIEs (unpackaged chips) are regularly distributed throughout the wafer. Since dicing and packaging have not yet been performed, it is only necessary to connect these exposed chip pins to the tester through probes to perform chip testing, which is CP testing.

[0047] Ink dots 10 are applied to the device using this equipment; the test equipment 2 can be a component for enhancing the performance of the thermopile sensor, or a component that can excite the device to work, such as a laser; specifically, the test equipment can be a laser, a blackbody, or other equipment that can excite the thermopile sensor to work. The position movement controller enables device positioning.

[0048] Figure 1In the system, dotting device 1 covers the surface of the thermopile sensor 3 with ink dots 10 that meet preset conditions, thereby improving the performance of the thermopile sensor 3. Testing device 2 is used to test the thermopile sensor 3; the diameter and thickness of the ink dots 10 are adjustable. This system covers qualified devices on the thermopile sensor 3 with ink dots 10. The covered devices can increase the absorption of the thermopile sensor, thus increasing its output. Simultaneously, the covered devices can be used to complete performance testing using this system.

[0049] Figure 2 This is a schematic diagram of the thermopile sensor structure after ink dots have been applied. Figure 2 As shown, the thermopile sensor 3 covered by ink dots 10 includes a substrate 6, thermocouples 7, metal connecting wires 8, a device absorption layer 9, ink dots 10, a support layer 11, and a cavity 12. The support layer 11 is deposited on the substrate 6, and the thermocouples 7 are deposited on the support layer 11. The thermocouples 7 are stacked. The hot and cold ends of the thermocouples 7 are respectively connected to the metal connecting wires 8. The device absorption layer 9 is covered on the support layer 11. Ink dots 10 are covered on the device absorption layer 9. The device back cavity is etched to form a suspended structure. The support layer 11 can be an insulating layer. First, the support layer 11 is deposited on the substrate 6. In the prior art, the support layer is composed of SiO2+Si3N4+SiO2. In this scheme, thermocouples 7, such as N-poly and P-poly, are deposited on the substrate and support layer. The thermocouples 7 are stacked, i.e., N-poly+SiO2+P-poly+SiO2. Then, metal connecting vias are etched and metal is deposited. The hot and cold ends of the thermocouples 7 are connected to metal leads 8 respectively. Then, SiO2 is deposited for isolation and insulation. Then, the absorption layer Si3N4 is covered. Finally, the device back cavity is etched to form a suspended structure - cavity 12. Thus, the fabrication of the thermopile device is completed. The ink dots 10 are covered on the absorption layer of the device. The ink dots 10 are black circles covering the surface of the device. The black color also indicates that it has a high absorption rate in the visible light band. The ink dot material is uniform, so the ink dots are stable, which is also beneficial to the performance stability of the device covered with ink dots.

[0050] Figure 3 This is a schematic diagram of the structure of ink dots and nanoforests integrated on the surface of a thermopile sensor, as shown in the image. Figure 3 As shown, the surface of the thermopile sensor 3 is also covered with a nanostructure possessing both light absorption and hydrophilic properties. This nanostructure is positioned between the surface of the thermopile sensor 3 and the ink dots 10. Utilizing the broad-spectrum high absorption and hydrophilic properties of the nanoforest, the ink dots 10 are covered after the nanoforest is integrated onto the thermopile using a CP testing system. This further enhances the light absorption properties while the hydrophilic properties of the nanoforest help the ink spread rapidly on the device surface. A schematic diagram of the device structure integrating the nanoforest with ink dots and the thermopile is shown below. Figure 5 As shown. The solution provided by this invention can also be combined with nanostructures that can increase light absorption properties, such as pyramid-shaped dielectric films, black silicon, and nanoforests. Nanoforests, in addition to having broad-spectrum high absorption properties, are also hydrophilic. While further increasing the light absorption of the device, their hydrophilicity helps the ink spread and solidify on the surface. For other high-absorption but non-hydrophilic structures, a hydrophilic coating can be applied to facilitate ink spreading and solidification.

[0051] Additionally, it should be noted that the dotting device in the thermopile sensor performance enhancement system covers the surface of the thermopile sensor with ink or a solution whose absorption rate meets preset conditions, such as graphene oxide solution or graphene solution.

[0052] In this solution, it can be combined with nanoforests that have broad-spectrum high absorption and hydrophilic properties, which can further increase the light absorption of the device while helping the ink droplets to spread and solidify quickly.

[0053] The test device 2 includes a laser and an electrical test device; the position movement controller controls the devices covered with ink dots 10 on the thermopile sensor 3 to be irradiated one by one under the laser of the laser, and the electrical signals output by the devices are obtained through the electrical test device.

[0054] In practice, the thermopile wafer is placed on a stage, and each device is individually irradiated with laser light to activate it. The electrical signals output by the devices are obtained through electrical testing equipment, which classifies the devices based on their quality and performance. Finally, based on the performance evaluation test results, a device location file is generated across the entire wafer, classifying the devices by their performance. The ink dot printing section consists of ink and a printer. In practice, based on the device performance classification location file, a position movement controller prints ink dots 10 on the devices of the corresponding category. The ink concentration and printing time are controllable and adjustable.

[0055] Optionally, the thermopile sensor performance enhancement system may further include: a probe component 5; the probe component 5 is placed on the stage and disposed on both sides of the thermopile sensor 3 for fixing the thermopile sensor 3; the thermopile sensor 3 is wafer-level.

[0056] Example 2

[0057] like Figure 4 As shown, the test method is applied to the thermopile sensor performance improvement system of Example 1, and the process may include the following steps:

[0058] Step 410: Control the dotting device and the thermopile sensor by the position movement controller so that the dotting device covers the surface of the thermopile sensor with ink dots.

[0059] Step 420: Adjust the diameter or thickness of the ink dots to obtain the thermopile sensor covered by ink dots.

[0060] Step 430: The testing equipment performs performance tests on the thermopile sensor after ink dots are applied, and the test results are obtained.

[0061] Step 440: Based on the test results, complete the device sorting of the thermopile sensor.

[0062] For ease of explanation, the CP testing system can include three functional modules. The first functional module is for functional evaluation based on the chip's photoelectric response, thus obtaining the output signal of the thermopile chip under laser irradiation. The second functional module is for ink dot injection using a printhead. The third functional module is a 3D motion controller, which is used to align the dotting device, testing equipment, and thermopile sensor during the evaluation and printing process.

[0063] After the thermopile wafer is placed on the stage, the state of these wafer-level sensors is estimated using the first functional module of the CP testing system. Following functional evaluation, a mapping file containing the location information of qualified chips across the entire wafer is generated. Subsequently, using a 3D positional movement controller and the mapping file, ink dots can be precisely printed onto the qualified chips. In this case, the size of the ink dots can be well controlled by the printhead diameter, injection speed, and injection time; the thickness of the ink dots can be controlled by the ink concentration. Furthermore, after ink dot printing is complete, the voltage signal of the new device is tested a second time using the functional evaluation module to check the new state and performance of the thermopile with ink dots. Device sorting is then performed based on this new state and performance.

[0064] Figure 4 The proposed method utilizes a dotting device in a testing system and ordinary ink to enhance the performance of thermopile sensors. The diameter and thickness of the ink can be adjusted, thereby controlling the device performance. The testing system prints ink dots or other solutions with high absorption rates onto thermopile sensors that meet preset conditions to complete the performance enhancement process. Subsequently, the testing system is used to perform device performance testing, thus completing the device sorting process. Both performance enhancement and performance testing can be completed through the testing system, making it simple, convenient, low-cost, and suitable for mass production of thermopile sensors.

[0065] based on Figure 4 In addition to the method described herein, this specification also provides some specific implementation methods of this method, which will be described below.

[0066] Optionally, the position movement controller includes a first position movement controller and a second position movement controller;

[0067] The dotting device and the thermopile sensor are controlled by a position movement controller so that the dotting device covers ink dots on the surface of the thermopile sensor. Specifically, this may include:

[0068] The first position movement controller controls the dotting device and the test equipment to align with the device on the thermopile sensor that meets the preset conditions.

[0069] After alignment, ink is injected onto the device that meets the preset conditions using the dotting device to form ink dots.

[0070] Optionally, the method may also include:

[0071] After the thermopile sensor under test is placed on the stage, the state of the thermopile sensor under test is estimated using the thermopile sensor performance enhancement system.

[0072] After functional evaluation, a mapping file containing qualified devices and their positions that meet the preset conditions on the entire thermopile sensor is generated.

[0073] Based on the position movement controller and the mapping file, ink dots are printed on qualified devices.

[0074] Among them, when adjusting the characteristics of ink dots to control the performance of the device, it can be based on Figure 5 To explain, Figure 5 This diagram illustrates the relationship between the diameter of the ink droplets and the device's output at different printing times. (Example:) Figure 5 As shown, the diameter of the ink droplets increases with the increase of printing time, and the device output also increases with the increase of ink droplet diameter under irradiation by a 660nm laser at a power of 400mW. This also indicates that the diameter of the ink droplets and the degree of performance improvement are controllable.

[0075] The method provided by this invention combines the performance of a thermopile sensor covered with ink dots with that of a thermopile sensor not covered with ink dots. Figure 6 as well as Figure 7 To explain, Figure 6 This is a comparison of the absorbance test results of the thermopile sensor with ink dots and the ordinary thermopile sensor in the 2.5-14.5μm wavelength range. Figure 7 A comparison of the output of a thermopile sensor with ink dots and a conventional thermopile sensor at 100mW laser power in the 606nm-1550nm short-wavelength range. (See attached image.) Figure 6 As shown, the absorption rate of the infrared thermopile device covered with ink dots was improved across the entire 2.5–14.5 μm wavelength range, especially in the 2.5–8 μm range. Furthermore, as... Figure 7As shown, the thermopile sensor covered with ink dots exhibits a significant performance improvement compared to the thermopile sensor without ink dot coverage, with a performance improvement of over 200% in the 606nm-1550nm range. Figure 6 and Figure 7 The results show that the output of the thermopile sensor covered with ink dots is improved compared to the thermopile sensor without ink dots. Furthermore, the percentage improvement in output increases with increasing temperature. Moreover, the solution provided by this invention exhibits good consistency in output performance, demonstrating excellent consistency during the ink dot printing process, and allowing for batch production of ink dots.

[0076] The schemes in Embodiments 1 and 2 above increase the absorption of the sensor and thus the output of the device by covering the surface of the thermopile with ink dots. In this process, the performance of the device can be controlled by adjusting the diameter and thickness of the ink dots. Then, the performance of the enhanced device is tested by the CP test system to verify the performance improvement results and complete the device sorting process.

[0077] Furthermore, conventional CP testing systems, when performing CP testing on thermopile wafers, first test the performance of each thermopile device on the entire wafer, resulting in a location mapping file categorizing chip performance. The ink dot printing system then uses this location mapping file to apply ink dots to thermopile devices that do not meet the requirements before subsequent packaging. This allows for identification of devices to be packaged (i.e., those without ink dots) during packaging, thus reducing packaging costs. In this invention, the high absorption properties of ink dots are utilized, employing a method opposite to conventional CP testing ink dot printing: ink dots are printed on compliant devices, while compliant devices are left unmarked. In practical applications, the packaging process can identify which devices require packaging and which do not. After ink dot printing, device performance evaluation testing is performed to verify performance improvement results, integrating device performance improvement and device performance testing. More specifically, devices covered with ink dots can increase the absorption of the thermopile sensor, thereby increasing the sensor's output. Simultaneously, the device covered with ink dots can undergo performance testing using the same CP testing system, merging the performance improvement steps of the thermopile sensor with the CP testing steps. Furthermore, the device performance can be adjusted by regulating the diameter of the ink dots during this process. This invention is simple, convenient, does not easily damage the original structure of the device, is low in cost, and is easy to mass-produce.

[0078] Based on the same idea, the present invention also provides a device for improving the performance of thermopile sensors, such as... Figure 8 As shown, the device may include:

[0079] The ink dot covering module 810 is used to control the dot generator and the thermopile sensor via a position movement controller, so that the dot generator covers ink dots on the surface of the thermopile sensor.

[0080] The ink dot control module 820 is used to control the diameter or thickness of the ink dots to obtain the thermopile sensor covered by ink dots.

[0081] The performance testing module 830 is used to test the performance of the thermopile sensor after ink dots are applied, and to obtain the test results.

[0082] The device sorting module 840 is used to sort the thermopile sensor based on the test results.

[0083] based on Figure 8 The device may also include specific implementation units:

[0084] Optionally, the position movement controller may include a first position movement controller and a second position movement controller;

[0085] The ink dot coverage module 810 can be used specifically for:

[0086] The first position movement controller controls the dotting device and the test equipment to align with the device on the thermopile sensor that meets the preset conditions.

[0087] After alignment, ink is injected onto the device that meets the preset conditions using the dotting device to form ink dots.

[0088] Optionally, the device may also include:

[0089] The state estimation module is used to estimate the state of the thermopile sensor under test after it is placed on the stage, using the thermopile sensor performance enhancement system.

[0090] The mapping file generation module is used to generate a mapping file containing the qualified devices and position information that meet the preset conditions on the entire thermopile sensor after functional evaluation.

[0091] Based on the position movement controller and the mapping file, ink dots are printed on qualified devices.

[0092] Optional, the performance testing module 830 can be used for:

[0093] After printing ink dots on qualified devices, the thermopile sensor performance improvement system is used to perform a secondary test on the thermopile sensor covered with ink dots to check the new state and performance of the thermopile sensor with ink dots.

[0094] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer programs or instructions. When the computer program or instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present invention are performed entirely or partially. The computer can be a general-purpose computer, a special-purpose computer, a computer network, a terminal, a user equipment, or other programmable device. The computer program or instructions can be stored in a computer-readable storage medium or transferred from one computer-readable storage medium to another. For example, the computer program or instructions can be transferred from one website, computer, server, or data center to another website, computer, server, or data center via wired or wireless means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium, such as a floppy disk, hard disk, or magnetic tape; it can also be an optical medium, such as a digital video disc (DVD); or it can be a semiconductor medium, such as a solid-state drive (SSD).

[0095] Although the invention has been described herein in conjunction with various embodiments, those skilled in the art will understand and implement other variations of the disclosed embodiments by reviewing the accompanying drawings, the disclosure, and the appended claims in carrying out the claimed invention. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit can implement several functions listed in the claims. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce good results.

[0096] Although the invention has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made therein without departing from the spirit and scope of the invention. Accordingly, this specification and drawings are merely exemplary descriptions of the invention as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. Clearly, those skilled in the art can make various alterations and modifications to the invention without departing from its spirit and scope. Thus, if such modifications and modifications of the invention fall within the scope of the claims and their equivalents, the invention is also intended to include such modifications and modifications.

Claims

1. A thermopile sensor performance enhancement system, characterized in that, The system includes: Dot generator, testing equipment, thermopile sensor, and position movement controller; The position movement controller includes a first position movement controller and a second position movement controller; the first position movement controller is equipped with a dotting device and a testing device to control the dotting device and the testing device to move in the horizontal and vertical directions; the second position movement controller is equipped with a platform, and the thermopile sensor is placed on the platform; the second position movement controller controls the thermopile sensor to move in the horizontal and vertical directions. The dotting device covers the surface of the thermopile sensor with ink dots that meet preset conditions, thereby improving the performance of the thermopile sensor; the testing equipment is used to test the thermopile sensor; the diameter and thickness of the ink dots are adjustable.

2. The system according to claim 1, characterized in that, The thermopile sensor covered with ink dots includes a substrate, cavity, support layer, thermocouple, metal connecting wire, device absorption layer, and ink dots. The support layer is deposited on the substrate, and thermocouples are deposited on the support layer. The thermocouples are in a stacked structure. The hot and cold ends of the thermocouples are respectively connected to metal leads. The support layer is covered with a device absorption layer; The back cavity of the device is etched to form a suspended structure; ink dots are coated on the absorption layer of the device.

3. The system according to claim 2, characterized in that, The surface of the thermopile sensor is also covered with a nanostructure that has light absorption and hydrophilic properties; the nanostructure is disposed between the absorption layer of the thermopile sensor and the ink droplet.

4. The system according to claim 2, characterized in that, The testing equipment includes a laser and an electrical testing device; the position movement controller controls the devices covered with ink dots on the thermopile sensor to be irradiated one by one by the laser, and the electrical signals output by the devices are obtained through the electrical testing device.

5. The system according to claim 1, characterized in that, The thermopile sensor performance enhancement system also includes: Probe component; the probe component is placed on the stage and positioned on both sides of the thermopile sensor for connecting to the thermopile sensor and extracting its electrical signal; the thermopile sensor is wafer-level; In the thermopile sensor performance enhancement system, the dotting device covers the surface of the thermopile sensor with ink or a solution whose absorption rate meets preset conditions.

6. A method for improving the performance of a thermopile sensor, characterized in that, The performance improvement method is applied to the thermopile sensor performance improvement system according to any one of claims 1-5, and the method includes: The dotting device and the thermopile sensor are controlled by a position movement controller so that the dotting device covers ink dots on the surface of the thermopile sensor. By adjusting the diameter or thickness of the ink dots, a thermopile sensor covered by ink dots can be obtained; The testing equipment performs performance tests on the thermopile sensor after ink dots are applied, and the test results are obtained. Based on the test results, the thermopile sensor was sorted into components.

7. The method according to claim 6, characterized in that, The position movement controller includes a first position movement controller and a second position movement controller; The dotting device and the thermopile sensor are controlled by a position movement controller so that the dotting device covers ink dots on the surface of the thermopile sensor, specifically including: The first position movement controller controls the dotting device and the test equipment to align with the device on the thermopile sensor that meets the preset conditions. After alignment, the dotting device is used to inject ink or a solution with an absorption rate that meets the preset conditions onto the device to form ink dots.

8. The method according to claim 6, characterized in that, The method also includes: After the thermopile sensor under test is placed on the stage, the state of the thermopile sensor under test is estimated using the thermopile sensor performance enhancement system. After functional evaluation, a mapping file containing qualified devices and their positions that meet the preset conditions on the entire thermopile sensor is generated. Based on the position movement controller and the mapping file, ink dots are printed on qualified devices.

9. The method according to claim 8, characterized in that, The testing equipment performs performance tests on the thermopile sensor after it has been covered with ink dots, and the test results are as follows: After printing ink dots on qualified devices, the thermopile sensor performance improvement system is used to perform a secondary test on the thermopile sensor covered with ink dots to check the new state and performance of the thermopile sensor with ink dots.

10. A device for improving the performance of a thermopile sensor, characterized in that, The performance enhancement device is applied to the thermopile sensor performance enhancement system according to any one of claims 1-5, and the device comprises: The ink dot covering module is used to control the dotting device and the thermopile sensor via a position movement controller, so that the dotting device covers ink dots on the surface of the thermopile sensor. The ink dot control module is used to control the diameter or thickness of the ink dots to obtain the thermopile sensor covered by ink dots. The performance testing module is used to test the performance of the thermopile sensor after ink dots are applied, and to obtain the test results. The device sorting module is used to sort the thermopile sensors based on the test results.

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