An apparatus for processing electronic component leads

Abstract

The application relates to the technical field of electronic product processing, in particular to an electronic component pin processing device, which comprises a shaping mechanism arranged on a main base and used for shaping the pins, a pre-bending mechanism used for taking and pre-bending the pins, and a transfer mechanism used for clamping the electronic components to transfer the work stations, the shaping mechanism is arranged on a primary shaping work station and a secondary shaping work station respectively, the pre-bending mechanism is arranged on a pre-bending work station, and the pre-bending work station is arranged on the front end process of the primary shaping work station; the device has the advantages that the feeding mechanism, the pre-bending mechanism, the shaping mechanism, the trimming mechanism, the leveling mechanism and the transfer mechanism are arranged, the automation degree of processing the electronic component pins is improved, the waste product rate and the labor intensity of manual or semi-automatic shaping are remarkably reduced, the production time limit and the production cost of the pin processing process are reduced, and the product profit is remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of electronic product processing technology, and more particularly to an apparatus for processing electronic component pins. Background Technology

[0002] When electronic components are assembled with circuit boards or other electronic components, their pins usually need to be reshaped and designed according to the circuit board or other electronic components. However, the existing methods for shaping the pins of electronic components are manual or semi-automatic processing, which have many problems such as low production timeliness and efficiency, inability to control the pin quality of the produced products, numerous steps for changing the shape of the pins and the impact of change time on production, and heavy production and labor costs. Therefore, there is a need to develop and upgrade the product processing technology. Summary of the Invention

[0003] The purpose of this invention is to provide an apparatus for processing electronic component pins, designed to solve at least one technical problem in the background art.

[0004] To achieve the above objectives, the present invention adopts the following solution: an electronic component pin processing device, comprising a shaping mechanism disposed on a main body for shaping pins, a pre-bending mechanism for picking up and pre-bending pins, and a transfer mechanism for clamping the electronic component and transferring it to a workstation. The shaping mechanism is respectively placed on a primary shaping workstation and a secondary shaping workstation, and the pre-bending mechanism is placed on a pre-bending workstation. The pre-bending workstation is located at the front end of the primary shaping workstation.

[0005] The trimming station, located between the primary and secondary shaping stations, is equipped with a trimming mechanism for trimming the pins after the primary shaping.

[0006] Among them, the leveling station, located on the side of the secondary shaping station away from the trimming station, is equipped with a leveling mechanism for leveling the pins.

[0007] Among them, the feeding station corresponding to the feeding position of the pre-bending mechanism is equipped with a feeding mechanism for feeding and cutting the pins, and the discharge position of the feeding mechanism is set to correspond to the feeding position of the pre-bending mechanism.

[0008] The shaping mechanism includes an inner mold assembly, one end of which is provided with an inner mold portion for internally shaping the pins of electronic components; an outer mold assembly, the inner side of which has an outer mold portion that matches the inner mold portion and externally shapes the pins of electronic components, and the outer mold assembly is disposed on both sides of the inner mold assembly; the shaping mechanism includes a pressing mold assembly, which is used to press and shape the pins of electronic components.

[0009] The pre-bending mechanism includes a material-picking slider and a bending foot card. The material-picking slider slides back and forth between the material-picking position and the material-lifting position, and the bending foot card is set on the upper side of the material-lifting position.

[0010] The feeding mechanism includes a feeding guide rail, a feeding gear, and a cutting roller for cutting the pins. The dropping port of the feeding guide rail is corresponding to the teeth of the feeding gear. The cutting rollers are respectively arranged on both sides of the feeding gear. The dropping position of the feeding gear is corresponding to the picking position of the picking slider.

[0011] The trimming mechanism includes an inner trimming block and an outer trimming block for trimming the pins after one shaping. The inner trimming block is driven by a trimming drive cylinder to move back and forth toward the outer trimming block.

[0012] The transfer mechanism mounted on the main unit is equipped with grippers corresponding to each workstation. The grippers pick up electronic components and are driven by a lateral transfer drive cylinder to move back and forth between adjacent workstations.

[0013] The leveling mechanism includes a leveling clamp block that moves relative to the pin, driven by a leveling drive cylinder. The leveling clamp block levels the pin.

[0014] The advantages of this invention are: by setting up a feeding mechanism, a pre-bending mechanism, a shaping mechanism, a trimming mechanism, a leveling mechanism, and a transfer mechanism, the automation level of processing electronic component pins is improved, significantly reducing the scrap rate and labor intensity of manual or semi-automatic shaping, reducing the production time and cost of pin processing, and thus significantly improving product profits. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a device for processing electronic component pins.

[0016] Figure 2 This is a schematic diagram of a device for processing electronic component pins.

[0017] Figure 3 This is a partial structural diagram of an electronic component pin processing device;

[0018] Figure 4 This is a schematic diagram of the transfer mechanism in an electronic component pin processing device;

[0019] Figure 5 This is a schematic diagram of a pre-bending mechanism in an electronic component pin processing device.

[0020] Figure 6 This is a schematic diagram of the feeding mechanism in an electronic component pin processing device;

[0021] Figure 7 This is a schematic diagram of a trimming mechanism in an electronic component pin processing device;

[0022] Figure 8 This is a schematic diagram of the leveling mechanism in an electronic component pin processing device. Detailed Implementation

[0023] This section will describe in detail specific embodiments of the present invention. Preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so as to intuitively and vividly understand each technical feature and overall technical solution of the present invention, but they should not be construed as limiting the scope of protection of the present invention.

[0024] In the description of this invention, if directional descriptions are involved, such as "up," "down," "front," "back," "left," "right," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, it is only for the convenience of describing the invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. When a feature is referred to as "set," "fixed," or "connected" to another feature, it can be directly set, fixed, or connected to the other feature, or it can be indirectly set, fixed, or connected to the other feature.

[0025] In the description of this invention, the term "several" means one or more; "multiple" means two or more; "greater than," "less than," or "exceeding" are all understood to exclude the stated number; and "above," "below," or "within" are all understood to include the stated number. The terms "first" and "second" are understood to distinguish technical features and not to indicate or imply relative importance, the quantity of indicated technical features, or the order of the indicated technical features.

[0026] Furthermore, unless otherwise defined, the technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this invention is for the purpose of describing particular embodiments only and not for limiting the invention. It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or collections thereof.

[0027] Example: Figure 1-8As shown, an electronic component pin processing device includes a shaping mechanism 1 disposed on a main unit for shaping pins, a pre-bending mechanism 6 for picking up and pre-bending pins, and a transfer mechanism 5 for clamping the electronic component and transferring it to another workstation. The shaping mechanism 1 is respectively placed on a primary shaping workstation 1002 and a secondary shaping workstation 1004. The pre-bending mechanism 6 is placed on a pre-bending workstation 1001, which is located at the front end of the primary shaping workstation 1002.

[0028] Among them, the trimming station 1003, located between the primary shaping station 1002 and the secondary shaping station 1004, is equipped with a trimming mechanism 8 for trimming the pins after the primary shaping.

[0029] Among them, the leveling station 1005, located on the side of the secondary shaping station 1004 away from the trimming station 1003, is equipped with a leveling mechanism 9 for leveling the pins.

[0030] Among them, the feeding station 1006 corresponding to the feeding position of the pre-bending mechanism 6 is provided with a feeding mechanism 7 for feeding and cutting the pins, and the discharge position of the feeding mechanism 7 is set to correspond to the feeding position of the pre-bending mechanism 6.

[0031] The shaping mechanism 1 includes an inner mold assembly, one end of which is provided with an inner mold portion for internally shaping the pins of electronic components; an outer mold assembly, the inner side of which has an outer mold portion that matches the inner mold portion and externally shapes the pins of electronic components, and the outer mold assembly is disposed on both sides of the inner mold assembly; the shaping mechanism includes a pressing mold assembly, which is used to press and shape the pins of electronic components.

[0032] The pre-bending mechanism 6 includes a material picking slider 601 and a bending foot card 602. The material picking slider 601 slides back and forth between the material picking position and the material lifting position, and the bending foot card 602 is set on the upper side of the material lifting position.

[0033] The feeding mechanism 7 includes a feeding guide rail 701, a feeding gear 702, and a cutting roller 703 for cutting the pins. The material drop opening of the feeding guide rail 701 is correspondingly arranged with the teeth of the feeding gear 702. The cutting roller 703 is respectively arranged on both sides of the feeding gear. The material discharge position of the feeding gear 702 is correspondingly arranged with the material pick-up position of the material pick-up slider 601.

[0034] The trimming mechanism 8 includes an inner trimming block 801 and an outer trimming block 802 for trimming the pins after one shaping. The inner trimming block 802 is driven by a trimming drive cylinder 803 to move back and forth toward the outer trimming block 802.

[0035] The transfer mechanism 5 mounted on the main unit is equipped with grippers 501 corresponding to each workstation. The grippers 501 grip electronic components and are driven by the lateral transfer drive cylinder 502 to move back and forth between adjacent workstations.

[0036] The leveling mechanism 9 includes a leveling clamp 901 that is driven by a leveling drive cylinder 902 and moves relative to the pin. The leveling clamp 901 levels the pin.

[0037] Structure 1: An electronic component pin shaping mechanism, including an inner mold assembly, one end of which is provided with an inner mold part for internal shaping of electronic component pins;

[0038] An outer jig assembly has an inner mold portion that matches the inner mold portion and shapes the pins of an electronic component. The outer jig assembly is disposed on both sides of the inner jig assembly. When the electronic component is at the front end of the inner jig assembly and at a position corresponding to the inner mold portion, the inner jig assembly moves toward the electronic component and the inner mold portion is located inside the pins. The outer jig assembly then moves toward the pins, so that the outer mold portion shapes the pins of the electronic component and pre-bends the pins of the electronic component.

[0039] The shaping mechanism includes a pressing fixture assembly for pressing and shaping the pins of electronic components. The direction of its movement is intersected with the direction of movement of the inner mold assembly. The pressing fixture assembly has a pressing mold part corresponding to the inner mold part. The pressing mold part on the pressing fixture assembly moves toward the pins of the electronic components to press and shape the pins of the electronic components.

[0040] The inner mold assembly includes a first cylinder and an inner mold push block. One end of the inner mold push block is connected to the drive push rod of the first cylinder. The inner mold part is disposed on the side of the inner mold push block opposite to the first cylinder. The first cylinder pushes the inner mold push block and moves it together with the inner mold part on the inner mold push block toward the direction of the electronic component pin, so that the electronic component pin is located outside the inner mold part, providing a model for shaping the electronic component pin.

[0041] The forming fixture assembly includes a second cylinder and a forming module. The forming die is positioned at a location corresponding to the forming module and the inner mold. The second cylinder drives the forming die to move back and forth toward the inner mold. The second cylinder also drives the forming module and the forming die together to move toward the pins of the electronic components to shape them.

[0042] The outer jig assembly includes grippers and a third cylinder. The grippers are disposed on the two outer sides of the inner mold portion, and the outer mold portion is disposed on the surface of the grippers facing the inner mold portion. The third cylinder drives the outer mold portion to move back and forth toward the inner mold portion. The third cylinder drives the grippers on both sides and the outer mold portion to move toward the inner mold portion for shaping the pins of electronic components.

[0043] The forming mechanism includes a first support, which is disposed between the forming fixture assembly and the inner forming fixture assembly. The forming fixture assembly is mounted on the side of the first support away from the first cylinder. The first support allows the forming fixture assembly to move more stably.

[0044] The gripper is rotatably connected to the left and right sides of the first support, and the second cylinder pushes the gripper to move closer to the inner mold part.

[0045] The inner mold assembly includes a slide block with a sliding cavity, and the inner mold push block is disposed in the sliding cavity. The first cylinder pushes the inner mold push block to slide back and forth along the sliding cavity.

[0046] The inner mold assembly includes a second support 501, which is connected to the inward-facing side of the first support. The inner push block and the first cylinder are positioned above the second support 501.

[0047] The inner mold assembly includes a pressure plate, which is detachably mounted on the slide block on the side with the slide cavity, so that the inner push block can slide back and forth along the slide cavity more smoothly and stably.

[0048] The pressure plate has a clearance groove on one end face near the inner mold to provide clearance space for the pins. This groove protects the electronic components from being stuck and collided with the pressure plate when the first cylinder drives the inner mold push block to retract after the shaping process is completed.

[0049] The inner mold assembly includes a support plate, which is mounted on the second support 501 and one end face of the support plate is connected to the slide block. The first cylinder is mounted on the support plate and the drive end of the first cylinder passes through the support plate and is connected to the inner push block.

[0050] The first support includes a fixed base and a clamping base. The clamping base is disposed on the side of the fixed base facing the slide. The clamping hand is clamped on the clamping base. The second cylinder is assembled on the fixed base.

[0051] The forming module is T-shaped, and the forming die is located at both ends of the vertical end of the forming module.

[0052] The gripper includes an outer gripper block and an inner gripper block. The outer gripper block is rotatably mounted on the gripper base. The inner gripper block is mounted on the inward-facing end face of the outer gripper block, and the outer mold portion is located on the inward-facing top corner of the inner gripper block. When it is necessary to change the shape of the electronic component pins, the inner gripper block can be replaced to change the shape of the inner mold portion.

[0053] The molding module includes an upper molding block and a lower molding block. The second cylinder is located below the lower molding block. The upper molding block is mounted on top of the lower molding block. The molding part is located on the upper molding block at a position corresponding to the inner molding part. This allows the upper molding block to be replaced separately when the electronic component needs to change its model shape, reducing the replacement time caused by changing the model shape and increasing the breadth and flexibility of the molding mechanism for the electronic component pin model shapes.

[0054] The lower die block is provided with a die groove facing the upper die block. The upper die block is clamped in the die groove, so that when the lower die block is assembled, the upper die block is limited and stabilized by the interaction between the groove shape of the die groove and the outer shape of the upper die block. This improves the shaping accuracy of the upper die block and the die part, reduces the deviation of the electronic component pin shaping, and improves the shaping precision.

[0055] Structure 2: The transfer mechanism 5 includes a transfer support 503 mounted on the main base, and multiple grippers 501 on the transfer support 503. A longitudinal transfer drive cylinder 504 is provided directly above the pre-bending station 1001 to push the grippers 501 located at the pre-bending station to move up and down. The grippers 501 are driven by a transverse transfer drive cylinder 502 mounted transversely on the transfer support 503 and move back and forth along the driving direction of the transverse transfer drive cylinder 502.

[0056] The transfer mechanism 5 includes a material gripper suspension component 505, with grippers 501 mounted on the material gripper suspension component 505 for each workstation, and the drive end of the lateral transfer drive cylinder 502 connected to the material gripper suspension component 505 and driving the material gripper suspension component 505 to move laterally back and forth.

[0057] The transfer mechanism 5 includes a transfer reinforcing rib 506. One end of the transfer reinforcing rib 506 is connected to the lower end of the transfer support 503, and the other end of the transfer reinforcing rib 506 is connected to the top end of the transfer support 503. Multiple sets of transfer reinforcing ribs 506 are distributed at intervals on the transfer support 503.

[0058] Structure 3: The pre-bending mechanism 6 includes a pre-bending support 603 mounted on the main body and a material picking drive cylinder 604 placed on the pre-bending support 603. The drive end of the material picking drive cylinder 604 is set towards the material dropping position of the feeding mechanism 7. The material picking slider 601 is driven by the material picking drive cylinder 604 to move back and forth between the material dropping position of the feeding mechanism 7 and the material lifting position of the pre-bending mechanism 6.

[0059] The material-picking slider 601 has a material-picking notch 605 that is recessed from top to bottom and used to pick up electronic components falling from the discharge position of the material-picking mechanism 7 at one end facing the material-feeding mechanism 7.

[0060] The pre-bending support 603 is equipped with pre-bending side brackets 606 on both sides. The bending foot cards 602 are respectively arranged facing each other and detachably mounted on the pre-bending side brackets 606. The gripper 501 corresponding to the pre-bending station 1001 picks up the electronic component on the lifting position. The longitudinal transfer drive cylinder 504 drives the gripper 501 to pick up the electronic component from the picking notch 605 located at the lifting position. The bending foot cards 602 apply a downward force to the pins of the electronic component to pre-bend the electronic component.

[0061] Structure 4: The feeding mechanism 7 includes a feeding support 704 mounted on the main body. The feeding gear 702 is driven to rotate by the feeding drive cylinder 705. The cutting rollers 703 located on both sides of the feeding gear 702 are close to the edge of the teeth of the feeding gear 702, so that the pins of the electronic components and the outer packaging can be cut by the cutting rollers at the inlet, so that each tooth on the feeding gear can be placed with an electronic component.

[0062] Structure 5: The trimming mechanism 8 includes a trimming support 804 mounted on the main unit. A trimming slide cavity 805 is provided on the upward-facing side of the trimming support 804. The inner punching block 801 placed in the trimming slide cavity 805 is driven by the trimming drive cylinder 803 to move back and forth to the outer punching block 802 fixed on the other side of the trimming support 804, so as to trim the electronic component pins located between the inner punching block 802 and the outer punching block 801.

[0063] Among them, a residual material guide rail 806 is installed on the outer punching block 802 at a position away from the inner punching block 801, and the residual material of the pins after punching by the inner punching block 801 is collected through the residual material guide rail 806.

[0064] This process allows the leads of electronic components, after being shaped once, to be trimmed by the action of the inner and outer punching blocks, further reducing the length difference between the leads at both ends of the electronic components and improving product quality and standardization.

[0065] Structure 6: The leveling mechanism 9 includes a leveling support 903 mounted on the main base. At opposite ends of the leveling support 903, leveling clamps 901 are respectively driven by leveling drive cylinders 902. The leveling clamps 901 are driven by leveling drive cylinders 902 and move relative to each other to level the pins of electronic components after secondary shaping.

[0066] Below the leveling clamp 901, there is a finished product discharge pipe 904. After the leveling drive cylinder 902 drives the leveling clamp 901 to clamp and level the pins of the electronic components, the leveling drive cylinder 902 pulls the leveling clamp 901 to move in the opposite direction, so that the leveling clamp 901 changes from a clamped state to an open state, and the electronic components in the leveling clamp fall freely into the finished product discharge pipe for transfer and collection.

[0067] After the trimming station, the electronic components are picked up by the grippers on the transfer mechanism and transferred to the shaping mechanism at the secondary shaping station for secondary shaping, so that the electronic components reach the preset shaping state of the product. Then, they are picked up by the grippers and transferred to the flattening mechanism for pin flattening or leveling, thereby improving the quality of the product.

[0068] The material taking position is the position when the material taking notch on the material taking slider moves to the position corresponding to the feeding gear; the material lifting position is the position when the material taking notch on the material taking slider moves to the position corresponding to the clamp; and the material discharging position is the position when the tooth of the discharging gear moves to the position corresponding to the material taking position.

[0069] By setting up feeding mechanisms, pre-bending mechanisms, shaping mechanisms, trimming mechanisms, leveling mechanisms, and transfer mechanisms, the automation level of electronic component pin processing is improved, significantly reducing the scrap rate and labor intensity of manual or semi-automatic shaping, reducing production time and costs in the pin processing process, and thus significantly increasing product profits.

[0070] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An electronic component pin processing apparatus, characterized in that: The system includes a shaping mechanism mounted on a main unit for shaping pins, a pre-bending mechanism for picking up and pre-bending pins, and a transfer mechanism for clamping and transferring the electronic component. The shaping mechanism is positioned at a primary shaping station and a secondary shaping station, respectively. The pre-bending mechanism is positioned at a pre-bending station, which is located at the front end of the primary shaping station. The shaping mechanism includes an inner mold assembly, one end of which is provided with an inner mold part for internally shaping the electronic component pins; and an outer mold assembly, the inner side of which has an outer mold part that matches the inner mold part and externally shapes the electronic component pins. The outer mold assembly is located on both sides of the inner mold assembly. The shaping mechanism also includes a pressing mold assembly, which is a pressing mold part for bending and forming the electronic component pins.

2. The electronic component pin processing apparatus according to claim 1, characterized in that: A trimming mechanism is provided at the trimming station located between the primary and secondary shaping stations for trimming the pins after the primary shaping.

3. An electronic component pin processing apparatus according to claim 1 or 2, characterized in that: A leveling mechanism for leveling pins is installed on the leveling station located on the side of the secondary shaping station away from the trimming station.

4. The electronic component pin processing apparatus according to claim 1, characterized in that: A feeding mechanism for supplying and cutting leads is provided at the feeding station corresponding to the material taking position of the pre-bending mechanism. The material output position of the feeding mechanism is set to correspond to the material taking position of the pre-bending mechanism.

5. The electronic component pin processing apparatus according to claim 4, characterized in that: The pre-bending mechanism includes a material picking slider and a bending foot card. The material picking slider slides back and forth between the material picking position and the material lifting position, and the bending foot card is set on the upper side of the material lifting position.

6. The electronic component pin processing apparatus according to claim 5, characterized in that: The feeding mechanism includes a feeding guide rail, a feeding gear, and a cutting roller for cutting the pins. The dropping port of the feeding guide rail is corresponding to the teeth of the feeding gear. The cutting rollers are respectively arranged on both sides of the feeding gear. The dropping position of the feeding gear is corresponding to the picking position of the picking slider.

7. The electronic component pin processing apparatus according to claim 2, characterized in that: The trimming mechanism includes an inner trimming block and an outer trimming block for trimming the pins after one shaping. The inner trimming block is driven by a trimming drive cylinder to move back and forth toward the outer trimming block.

8. The electronic component pin processing apparatus according to claim 1, characterized in that: The transfer mechanism mounted on the main unit is equipped with grippers corresponding to each workstation. The grippers pick up electronic components and are driven by a lateral transfer drive cylinder to move back and forth between adjacent workstations.

9. The electronic component pin processing apparatus according to claim 3, characterized in that: The leveling mechanism includes a leveling clamp block that moves relative to the pin, driven by a leveling drive cylinder. The leveling clamp block levels the pin.

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