A new precision manufacturing method of an electrode plate of an accelerometer sensitive structure

Abstract

The application provides a precision manufacturing method of a novel accelerometer sensitive structure electrode plate, comprising the following steps: performing contour milling and grinding processing on six base surfaces of a cubic electrode plate blank, and grinding and polishing the six base surfaces to obtain an electrode plate preform; cutting U and D based on the electrode plate preform, cutting U to obtain U1, and grinding and polishing U1 and D; cutting D to obtain D1 and R, and respectively performing grinding and polishing; cutting R to obtain D2 and D3, and respectively performing polishing; repeatedly obtaining two groups of U1, D1, D2 and D3, and performing flat grinding on the two groups of U1, D1, D2 and D3 to obtain eight electrode plate bases; and performing numerical control milling and grinding, punching and groove processing on the electrode plate bases. The precision manufacturing method of the novel accelerometer sensitive structure electrode plate has the advantages of high production efficiency and precision manufacturing of the electrode plate.

Description

Technical Field

[0001] This disclosure generally relates to the field of precision machining technology for parts, and specifically to a precision manufacturing method for a novel accelerometer sensitive structure electrode plate. Background Technology

[0002] Electrostatic levitation accelerometers, as a type of space accelerometer, are a key payload for satellite gravity measurements and space gravitational experiments. They feature a small measurement range and high resolution, simultaneously measuring three translational accelerations and three rotational angular accelerations. The inertial sensing structure of this type of accelerometer is its core component, and its shape and surface accuracy directly affect the functionality and noise levels of the electrostatic levitation accelerometer. Unlike existing sensing structures that are basically composed of symmetrical upper and lower electrode plates and their limiting elements, and a middle electrode frame and its limiting elements, the new accelerometer sensing structure consists of an electrode cage composed of six identical electrode plates. Its advantage is that it uses only one type of complex structural component, avoiding the difficulties of machining and measuring the inner surface of the middle electrode frame. However, the shape and structure of these electrode plates are complex, requiring shape and position accuracy at the micron and sub-micron level. Machining accuracy directly affects the achievement of its performance indicators and the accuracy of the measurement data. Precision grinding, polishing, and molding of the electrode plates are all technical challenges. Summary of the Invention

[0003] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a precision manufacturing method for a novel accelerometer sensitive structure electrode plate to solve the above problems.

[0004] This application provides a precision manufacturing method for a novel accelerometer sensing electrode plate, comprising the following steps:

[0005] S1. Mill the six base surfaces of the cube electrode plate blank and grind and polish the six base surfaces to obtain the electrode plate preform.

[0006] S2. Based on the electrode plate preform, cut out U and D, ensuring the slice thickness of U and D, cut U to obtain U1, place the polished side of U1 and D on the photoresist plate, and grind and polish the side of U1 and D away from the photoresist plate.

[0007] S3. Cut D to obtain D1 and R, ensuring the thickness of D1 and R; ensure the slice thickness of D1 and R, place the polished side of R on the photoresist plate, and grind and polish the side of R away from the photoresist plate.

[0008] S4. Cut R to obtain D2 and D3, ensuring the slice thickness of D2 and D3. Place the polished side of U1, D1, D2, and D3 onto the gloss plate and grind and polish the side of U1, D1, D2, and D3 away from the gloss plate.

[0009] S5. Repeat the above steps to obtain two sets of U1, D1, D2, D3. Place the two sets of U1, D1, D2, D3 side by side on the photoresist plate and grind them flat. After the two sets of U1, D1, D2, D3 are ground, eight electrode plate substrates are obtained.

[0010] S6. Perform CNC milling, drilling, and grooving on the electrode plate substrate, including:

[0011] S61. Bond the electrode plate substrate to the glass auxiliary block. After bonding, the parallelism error is less than 0.005mm. Then clamp it on the equipment worktable.

[0012] S62. Use electroplated diamond round rods of different diameters to rough mill the grooves. In the larger allowance area, use a Φ4 tool to calculate the average allowance profile and program the tool center trajectory. For the remaining part, use a Φ2.3-2.4 tool with a smaller allowance than the narrow groove to complete the rough milling of the electrode surface. The side allowance is 0.004mm and the bottom allowance is 0.002mm.

[0013] S63. Roughly mill a 1.6mm groove using a 1.5mm electroplated diamond round bar abrasive.

[0014] S64. Perform rough and finish milling on a 5mm deep groove. The diameter of the grinding wheel should be adapted to the corner of the groove. Use tool compensation programming.

[0015] S65. Use an electroplated tapered diamond chamfering die to mill and chamfer the mounting holes, the contours of both sides of the electrode surface, the long side, and the straight edge of the 5mm deep groove.

[0016] S66. The bottom surface parallelism accuracy requirement is 0.001mm, and the depth accuracy is 0.002mm. Fine tool compensation contour programming and mold center programming are used together, with tool compensation switched three times during the process. Electroplated diamond molds are used for machining in batches. Each machining is performed in batches. A 0.001mm precision dial indicator is used to measure the relative depth and parallelism. After correcting the data, the bottom surface is machined to meet the requirements.

[0017] S67. Customized chamfering and sidewall integrated processing electroplated diamond abrasive tool, ensuring no interference between tool compensation on the Φ1.6mm narrow groove, precision machining of electrode surface, consistent electrode surface area, without damaging the precision machining state of the contact bottom surface;

[0018] S68, hand-beveling.

[0019] According to the technical solution provided in the embodiments of this application, in step S1, the perpendicularity of the six sides of the milled electrode plate blank is no greater than 0.05mm, and the consistency of the opposite side dimensions is better than 0.05mm.

[0020] According to the technical solution provided in the embodiments of this application, in step S1, the parallelism of the angles between the grinding and polishing surfaces is 90°±2″.

[0021] According to the technical solution provided in the embodiments of this application, in step S2, the parallelism between the cut surfaces U, D, and U1 and the opposite surface is kept at 0.02mm, and the chamfer is 0.1mm.

[0022] According to the technical solution provided in the embodiments of this application, in step S2, when grinding and polishing U1 and D, the parallelism between the top surface of U1 and D and the side that contacts the light adhesive plate is 0.001mm, the surface shape accuracy is low circle N=1.5, △N=0.5, the surface defect V, and the chamfer is 0.1mm.

[0023] According to the technical solution provided in the embodiments of this application, in step S3, the parallelism between the cut surfaces D1 and R and the opposite surface is maintained at 0.02mm, and the chamfer is 0.1mm.

[0024] According to the technical solution provided in the embodiments of this application, in step S3, when grinding and polishing R, the parallelism between the top surface of R and the side that contacts the light foot plate is 0.001mm, and the chamfer is 0.1mm.

[0025] According to the technical solution provided in the embodiments of this application, in step S4, the parallelism between the cut surfaces D2 and D3 and the opposite surface is maintained at 0.02mm, and the chamfer is 0.1mm.

[0026] According to the technical solution provided in the embodiments of this application, when grinding and polishing D2 and D3, the parallelism between the top surface of D2 and D3 and the side in contact with the light adhesive plate is kept at 0.001mm, the surface shape accuracy is low circle N=2, △N=0.5, the surface defect level is V, and the chamfer is 0.1mm.

[0027] Compared with the prior art, the beneficial effects of this application are as follows: on the one hand, this application can realize the precision manufacturing of electrode plate substrate, improve the production speed of electrode plate substrate, and ensure that electrode plate substrate can be mass-produced; on the other hand, it can perform precision machining on electrode plate substrate to meet the design requirements of the new accelerometer sensitive structure. Attached Figure Description

[0028] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0029] Figure 1 A flowchart illustrating the precision manufacturing process of a novel accelerometer sensing structure electrode plate provided in this application;

[0030] Figure 2 This is a schematic diagram of the blank cutting process;

[0031] Figure 3 This is a schematic diagram of the photoresist processing.

[0032] Figure 4This is a schematic diagram of the prefabricated component cutting process;

[0033] Figure 5 This is a schematic diagram of the R-surface grinding and polishing process.

[0034] Figure 6 Diagram of three-stage cutting

[0035] Figure 7 Schematic diagram of the photoresist processing for four prefabricated components;

[0036] Figure 8 This is a schematic diagram of four cuts;

[0037] Figure 9 Schematic diagram of the photoresist processing for eight prefabricated components;

[0038] Figure 10 A schematic diagram showing the final machining of the electrode plate substrate;

[0039] Figure 11 Schematic diagram of the sensitive structure electrode plate;

[0040] Figure 12 This is a schematic diagram of the assembly of the sensitive structure. Detailed Implementation

[0041] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0042] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0043] Please refer to Figure 1-12 This application provides a precision manufacturing method for a novel accelerometer sensing structure electrode plate, comprising the following steps:

[0044] S1. Mill the six base surfaces of the cube electrode plate blank and grind and polish the six base surfaces to obtain the electrode plate preform.

[0045] S2. Based on the electrode plate preform, cut out U and D, ensuring the slice thickness of U and D, cut U to obtain U1, place the polished side of U1 and D on the photoresist plate, and grind and polish the side of U1 and D away from the photoresist plate.

[0046] S3. Cut D to obtain D1 and R, ensuring the thickness of D1 and R; ensure the slice thickness of D1 and R, place the polished side of R on the photoresist plate, and grind and polish the side of R away from the photoresist plate.

[0047] S4. Cut R to obtain D2 and D3, ensuring the slice thickness of D2 and D3. Place the polished side of U1, D1, D2, and D3 onto the gloss plate and grind and polish the side of U1, D1, D2, and D3 away from the gloss plate.

[0048] S5. Repeat the above steps to obtain two sets of U1, D1, D2, D3. Place the two sets of U1, D1, D2, D3 side by side on the photoresist plate and grind them flat. After the two sets of U1, D1, D2, D3 are ground, eight electrode plate substrates are obtained.

[0049] S6. Perform CNC milling, drilling, and grooving on the electrode plate substrate.

[0050] Working principle: On the one hand, this application can realize the precision manufacturing of electrode plate substrate, improve the production speed of electrode plate substrate, and ensure that electrode plate substrate can be mass-produced; on the other hand, it can perform precision machining on electrode plate substrate to meet the design requirements of new accelerometer sensitive structure.

[0051] Specifically, the following steps are included:

[0052] Step 1: Precision optical manufacturing of electrode plate substrate

[0053] 1. Milling and grinding of the outer shape: mill the six sides of the electrode plate blank with dimensions of 73×73×73mm3 until the perpendicularity is no more than 0.05mm and the consistency of the opposite side dimensions is better than 0.05mm;

[0054] 2. Grind and polish the six base surfaces. The surface shape accuracy of each surface is as follows: minimum circle N = 1.5, ΔN = 0.5; surface defect B = V; parallelism of the angles between the surfaces is 90° ± 2″; dimensions in three directions: 72 ± 0.5 mm. Chamfer C0.1.

[0055] 3. Cutting, refer to Figure 2 Cut and polish the electrode plate preform, ensuring the thickness and dimensional tolerances of the slices U and D, with a parallelism of 0.02mm; cut U1, with a parallelism of 0.02mm; chamfer C 0.1mm;

[0056] 4.Reference Figure 3 The adhesives D and U1 are ground and polished on the adhesive board, with one side having a size of 40±0.005mm; the parallelism between the two sides is 0.001mm; the surface shape accuracy is low circle N=1.5, △N=0.5; the surface defect B=V; the chamfer C is 0.1mm.

[0057] 5. Cutting, refer to Figure 4 Cut to ensure the slice thickness of D1; the thickness of R is not less than 48mm; the parallelism between the cut surface and the opposite surface in D1 is 0.02mm, and the parallelism between the cut surface and the opposite surface in R is 0.02mm. Chamfer C0.1;

[0058] 6. Grind and polish the R-surface, refer to... Figure 5 The surface of the substrate is coated with 2 gluing adhesive. After grinding and polishing, the thickness is not less than 47.5mm, the parallelism is 0.001mm, and the chamfer C is 0.1mm.

[0059] 7. Cutting, refer to Figure 6 Cut to thicknesses D2 and D3; the parallelism between two surfaces of D2 and the opposite base surface is 0.02mm. The parallelism between two surfaces of D3 and the opposite base surface is 0.02mm; chamfer C is 0.1mm.

[0060] 8. Grinding and polishing: Refer to Figure 7 The adhesives D1, U1, D2, and D3 are applied to the adhesive board with a thickness of 20 ± 0.005 mm, a parallelism of 0.001 mm, a bottom ring N = 2, and a ΔN = 0.5; the chamfer C is 0.1 mm.

[0061] 9. Cutting, refer to Figure 8 Cutting, taking D11 and D12 as examples, and 8 pieces according to... Figure 9 The surface is smooth, with a uniform thickness of 0.05 mm and a parallelism of 0.02 mm.

[0062] 10. Grinding and polishing, refer to... Figure 10 The final surface of the entire tray is ground and polished. D112 thickness is 10±0.01mm, parallelism is 0.002mm, the bottom ring of the entire tray (8 pieces) is N=2, △N=0.5; surface defect B=V; D113 thickness is 10±0.01mm, parallelism is 0.002mm, the bottom ring of the entire tray is N=2, △N=0.5; surface defect B=V; chamfer C0.1mm.

[0063] Step 2: CNC milling, drilling, and grooving of the precision structure of the electrode plate

[0064] 1. Drilling and milling functional holes: Bond the electrode plate substrate to the glass auxiliary block, ensuring a parallelism error of less than 0.005mm after bonding. Clamp the plate on the equipment's worktable. Drill and mill four holes (Φ1.8×4) and six holes (Φ3.2×2) using an electroplated hollow diamond drill bit. The procedure is as follows:

[0065] 0BEGIN PGM 510DAKUOMM 1TOOL CALL 27S4000

[0066] 2L X-16Y+0F5000 3LBL 1

[0067] 4M3 M28 5L Z+20

[0068] 6L Z+1F1000 7L IZ-1F0.5

[0069] 8L Z-9.5F1.5 9L Z-11F0.5

[0070] 10M5 11L Z+50F1000

[0071] 12M0;quxin 13LBL 0

[0072] 14L X+16Y+0F5000 15CALL LBL 1

[0073] 16M9 17L Z+200F5000

[0074] 18M0 19TOOL CALL 1S4000

[0075] 20L X-7.5Y+7.5F5000 21LBL 2

[0076] 22M3 M28 23L Z+20

[0077] 24L Z+0.5F1000 25L IZ-1F0.5

[0078] 26L Z-9.5F1 27L Z-11F0.5

[0079] 28M5 29L Z+50F1000

[0080] 30M9 31M0;quxin

[0081] 32LBL 0 33L X-7.5Y-7.5F5000

[0082] 34CALL LBL 2 35L X+7.5Y+7.5F5000

[0083] 36CALL LBL 2 37L X+7.5Y-7.5F5000

[0084] 38CALL LBL 2 39L Z+200F5000

[0085] 40M0 41;QU XUN

[0086] 42M0 43TOOL CALL 27S4000

[0087] 44L X+0Y+1F3000 45M3 M28

[0088] 46L Z+50F2000 47L Z+1F1000

[0089] 48L Z-1.5F0.5 49L Z-19.5F1.5

[0090] 50L Z-21F0.5 51M5 M9

[0091] 52L Z+200F2000 53M0

[0092] 54END PGM 510DAKUO MM

[0093] 2. Rough milling of grooves: Refer to Figure 10 The grooves were rough milled using electroplated diamond round rods of different diameters. For the larger allowance areas, a Φ4 tool was used to calculate the average allowance profile, and the tool center trajectory was programmed. For the remaining areas, a Φ2.3-2.4 tool with a smaller allowance than the narrow groove was used to complete the rough milling of the electrode surface. The allowance was 0.004mm on the side and 0.002mm on the bottom. The program is as follows:

[0094] 0BEGIN PGM 510KSCX MM 1TOOL CALL 17S4000

[0095] 2L X-11.6Y+16F3000 3L Z+20

[0096] 4M3 M8 5L Z+0.06

[0097] 6LBL 5 7L IZ-0.5

[0098] 8L X-11.6Y+16F5 9L Y+7.6

[0099] 10L Y+16F10 11L X-8F1000

[0100] 12L Y+7.6F5 13L Y+16F10

[0101] 14L X+8F1000 15L Y+7.6F5

[0102] 16L Y+16F10 17L X+11.6F1000

[0103] 18L Y+7.6F5 19L Y+16F10

[0104] 20L X+26F1000 21L Y-8.1

[0105] 22L X+7.8F5 23L IZ+30F1000

[0106] 24M5 25M4 M8

[0107] 26L X-26 27L IZ-30

[0108] 28L X-7.8F5 29L IZ+30F1000

[0109] 30M5 31L X-11.6Y+16F3000

[0110] 32M3 M8 33L IZ-30F1000

[0111] 34CALL LBL 5REP3 35L Z+150F3000

[0112] 36M5 M9 37M0

[0113] 38 M0 39 M0

[0114] 40 M0 41;JXlunkuo1

[0115] 42 TOOL CALL 21 S6000 43 L X-25 Y+15 F3000 44 L Z+20 45 L Z+0.2 F1000

[0116] 46 LBL 2 47 M3 M8

[0117] 48 L Y+15 F3000 49 L IZ-0.3 F50

[0118] 50 L X-11 51 L X-15.5 RL F5

[0119] 52 L Y+4 53 RND R3 F3

[0120] 54 L X-11.5 F5 55 L Y-3.03

[0121] 56 CC X-7.5 Y-7.5 57 C X-13.31 Y-6 DR+F3 58 L X-25 F5 59 L Y-10 R0 F100

[0122] 60 M5 61 L Y+15 F3000

[0123] 62 M4 63 L X+11

[0124] 64 L X+15.5 RR F5 65 L Y+4

[0125] 66 RND R3 F3 67 L X+11.5 F5

[0126] 68 L Y-3.03 69 CC X+7.5 Y-7.5

[0127] 70 C X+13.31 Y-6 DR-F3 71 L X+25 F5

[0128] 72 L Y+15 R0 F100 73; JXlumkuo2

[0129] 74 M5 75 L Y+15 F3000

[0130] 76 M3 M28 77 L X+5

[0131] 78 L X+0 RL F5 79 L Y+9

[0132] 80 L X+4.1 81 L Y+4.1

[0133] 82 RND R3.4 F3 83 L X+9 F5

[0134] 84 L Y-4.1 85 L X+4.1

[0135] 86 RND R3.4 F3 87 L Y-9 F5

[0136] 88 L X-4.1 89 L Y-4.1

[0137] 90 RND R3.4 F3 91 L X-9 F5

[0138] 92 L Y+4.1 93 L X-4.1

[0139] 94 RND R3.4 F3 95 L Y+9 F5

[0140] 96 L X+3 97 L Y+13

[0141] 98L Y+15R0 F100 99LBL 0

[0142] 100CALL LBL 2REP6 101M5 M9

[0143] 102M0 103END PGM 510KSCX MM

[0144] 3. Milling the groove: Roughly mill the 1.6mm groove using a 1.5mm electroplated diamond round rod. The procedure is as follows:

[0145] 0BEGIN PGM 510KAIFENG MM 1TOOL CALL 23S6000

[0146] 2L X+0Y+15F1000 3L Z+0.15F3000

[0147] 4M8 M3 5LBL 1

[0148] 6L IZ-0.3F500 7L Y-13F5

[0149] 8L IZ-0.3 9L Y+13F5

[0150] 10LBL 0 11CALL LBL 1REP2

[0151] 12L Z-1.95F5 13L Y-15F5

[0152] 14L Z+200F5000 15M5 M9

[0153] 16M0 17END PGM 510KAIFENG MM

[0154] 4. Precision milling of deep grooves: Rough and finish milling of 5mm deep grooves is performed. The grinding wheel diameter must be adapted to the corners of the groove using tool compensation programming. The program is as follows:

[0155] 0BEGIN PGM 510JXshencaoMM 1TOOL CALL 24S6000

[0156] 2L X-10Y+15F5000 3L Z+20

[0157] 4L Z-1.8F500 5LBL 20

[0158] 6M3 M8 7L IZ-0.3F50

[0159] 8L X-15.5RL 9L Y+4F5

[0160] 10RND R3 F3 11L X-10F5

[0161] 12L Y+10.03F5 13RND R1.5 F3

[0162] 14L X-6.9F5 15L Y+15R0 F1000

[0163] 16L X+10F1000 17L X+15.5RR F1000

[0164] 18L Y+4F5 19RND R3 F3

[0165] 20L X+10F5 21L Y+10.03F5

[0166] 22RND R1.5 F3 23L X+6.9F5

[0167] 24L Y+15R0 F1000 25LBL 0

[0168] 26CALL LBL 20REP8 27L X+12.5Y+15F1000

[0169] 28L Z-4.85F100 29L Y+9F5

[0170] 30L Y+15 31L X-12.5F1000

[0171] 32L Y+9F5 33L Y+15

[0172] 34L Z-4.5F100 35L X-10Y+15F5000

[0173] 36CALL LBL 20 37L Z+200F5000

[0174] 38M5 M9 39M0

[0175] 40TOOL CALL 25S6000 41M3 M8

[0176] 42L X+12.5Y+15F1000 43L Z+20

[0177] 44L Z-5F100 45L Y+9F5

[0178] 46L Y+15 47L X-12.5F1000

[0179] 48L Y+9F5 49L Y+15

[0180] 50L X-10Y+15F5000 51M3 M8

[0181] 52L Z-4.7F500 53CALL LBL 20

[0182] 54L Z+200F5000 55M5 M9

[0183] 56M0 57END PGM 510JXshencaoMM

[0184] 5. Chamfering: Using an electroplated tapered diamond chamfering die, mill and chamfer the mounting holes, both sides of the electrode surface, the long side, and the straight edge of the 5mm deep groove. The procedure is as follows:

[0185] 0BEGIN PGM 510daojiao MM 1TOOL CALL 26S8000

[0186] 2L X-16Y+0F5000 3LBL 3

[0187] 4M3 M8 5L Z+20

[0188] 6L Z+0F1000 7L Z-1.6F0.5

[0189] 8L Z+20F1000 9LBL 0

[0190] 10L X+16Y+0F5000 11CALL LBL 3

[0191] 12M5 M9 13L Z+200F5000

[0192] 14TOOL CALL 26S8000 15L X-7.5Y+7.5F5000

[0193] 16LBL 4 17M3 M8

[0194] 18L Z+20 19L Z+0F1000

[0195] 20L Z-1.8F100 21L Z-2.94F0.5

[0196] 22L Z+20F1000 23LBL 0

[0197] 24L X-7.5Y-7.5F5000 25CALL LBL 4

[0198] 26 L X+7.5 Y+7.5 F5000 27 CALL LBL 4

[0199] 28 L X+7.5 Y-7.5 F5000 29 CALL LBL 4

[0200] 30 L Z+200 F5000 31 M5 M9

[0201] 32 L X-25 Y-12 F3000 33 M3 M8

[0202] 34 L Z-4.05 35 L X+25 F10

[0203] 36 L Z+100 F3000 37 L Y+17 F3000

[0204] 38 L X+12.5 39 L Z-4.05

[0205] 40 L Y+12 F500 41 L X-12.5 F10

[0206] 42 L Y+17 F3000 43 M5 M9

[0207] 44 L Z+200 F3000 45 M0

[0208] 46 M30 47 TOOL CALL 26 S8000

[0209] 48 L X-25 Y+15 F3000 49 L Z+20

[0210] 50 M3 M8 51 L Z+0 F1000

[0211] 52 L Z-1 53 L Y+10 RL F50

[0212] 54 L X-15.5 F8 55 L Y+4

[0213] 56 RND R3 F5 57 L X-11.5 F8

[0214] 58 L Y-3.03 59 CC X-7.5 Y-7.5

[0215] 60 C X-13.31 Y-6 DR+F5 61 L X-21 F3

[0216] 62 L Y+15 F10 63 L X+25 R0 F3000

[0217] 64 L Y+10 RR F50 65 L X+15.5 F8

[0218] 66 L Y+4 67 RND R3 F5

[0219] 68 L X+11.5 F8 69 L Y-3.03

[0220] 70 CC X+7.5 Y-7.5 71 C X+13.31 Y-6 DR-F5 72 L X+21 F3 73 L Y+15 F10

[0221] 74 L ​​X+5 R0 F3000 75 L Z+100

[0222] 76 M5 M9 77 M0

[0223] 78 M0 79 L Z-0.9 F20

[0224] 80 M3 M8 81 L Y+15 F3000

[0225] 82 L X+5 83 L X+0 RL F8

[0226] 84 L Y+9 85 L X+4.1

[0227] 86L Y+4.1 87RND R3.4 F5

[0228] 88L X+9F8 89L Y-4.1

[0229] 90L X+4.1 91RND R3.4 F5

[0230] 92L Y-9F8 93L X-4.1

[0231] 94L Y-4.1 95RND R3.4 F5

[0232] 96L X-9F8 97L Y+4.1

[0233] 98L X-4.1 99RND R3.4 F5

[0234] 100L Y+9F8 101L X+2

[0235] 102L Y+15 103L X-25R0 F3000

[0236] 104L Z+20 105M0

[0237] 106L X-25Y-12F3000 107M3 M8

[0238] 108L Z-4.05 109L X+25F10

[0239] 110L Z+100F3000 111L Y+17F3000

[0240] 112L X+12.5 113L Z-4.05

[0241] 114L Y+12F500 115L X-12.5F10

[0242] 116L Y+17F3000 117M5 M9

[0243] 118L Z+200F3000 119M0

[0244] 120END PGM 510daojiao MM

[0245] 6. Precision milling of the bottom surface: The parallelism accuracy requirement for the bottom surface is 0.001mm, and the depth accuracy is 0.002mm. Fine-tuned tool compensation contour programming and mold center programming are used together, switching tool compensation three times during the process. Electroplated diamond molds are used for machining in stages. A 0.001mm precision dial indicator is used to measure the relative depth and parallelism. After correcting the data, the machined bottom surface meets the requirements. A uniform allowance of 0.03-0.05mm is left for the sidewalls of the two electrode surfaces. The on-site conditions are as follows:

[0246] 0BEGIN PGM 510JXdimian MM 1M0

[0247] 2M0 3; GAI DAO BU T22-0

[0248] 4M0 5TOOL CALL 22S6000

[0249] 6M0; GAI DAO BU 0 7M0

[0250] 8L X-10Y+15F3000 9L Z+20

[0251] 10L Z+0.2F1000 11M3 M8

[0252] 12L Z-1.96F100 13L X-8RR F5

[0253] 14 L Y+7.7 15 L X-11.7

[0254] 16 L Y+9.6 17 L X-6.1

[0255] 18 L Y+6.1 19 RND R1.4 F3

[0256] 20 L X-13.5 F500 21 RND R1 F3

[0257] 22 L Y+15 F5 23 L X+8 Y+15 F3000

[0258] 24 L Y+7.7 F5 25 L X+11.7

[0259] 26 L Y+9.6 27 L X+6.1

[0260] 28 L Y+6.1 29 RND R1.4 F3

[0261] 30 L X+13.5 F5 31 RND R1 F3

[0262] 32 L Y+15 F5 33 L X+25 F3000

[0263] 34 L Y-9.6 35 L X+9.7 F5

[0264] 36 L Y-7.7 37 L X+8

[0265] 38 L Y-9.6 39 L X+6.1

[0266] 40 L Y-6.1 41 RND R1.4 F3

[0267] 42 L X+11.4 F5 43 L Y-8

[0268] 44 L X+25 45 L Y-15 F3000

[0269] 46 L X-25 47 L Y-9.6

[0270] 48 L X-9.7 F5 49 L Y-7.7

[0271] 50 L X-8 51 L Y-9.6

[0272] 52 L X-6.1 53 L Y-6.1

[0273] 54 RND R1.4 F3 55 L X-11.4 F5

[0274] 56 L Y-8 57 L X-21

[0275] 58 L X-25 R0 59 M0

[0276] 60 M0 61;GAI DAO BU T22-1.29 64;JXlunkuo1 65 M0

[0277] 66 TOOL CALL 22 S6000 67 L X-25 F3000

[0278] 68 L Y+15 69 L X-6

[0279] 70 M3 M8 71 L X-11.5 RL F5

[0280] 72 L Y-3.03 73 CC X-7.5 Y-7.5

[0281] 74 C X-13.31 Y-6 DR+F3 75 L X-25 F5

[0282] 76L Y-10R0 F100 77M5

[0283] 78M4 79L Y+15F3000

[0284] 80L X+6 81L X+11.5RR F5

[0285] 82L Y-3.03 83CC X+7.5Y-7.5

[0286] 84C X+13.31Y-6DR-F3 85L X+25F5

[0287] 86L Y-10R0 F100 87M5 M9

[0288] / 88;JXlumkuo2 89TOOL CALL 22S6000

[0289] 90M3 M8 91L Y+15F3000

[0290] 92L X+5 93L X+0RL F5

[0291] 94L Y+9 95L X+4.1

[0292] 96L Y+4.1 97RND R3.4 F3

[0293] 98L X+9F5 99L Y-4.1

[0294] 100L X+4.1 101RND R3.4 F3

[0295] 102L Y-9F5 103L X-4.1

[0296] 104L Y-4.1 105RND R3.4 F3

[0297] 106L X-9F5 107L Y+4.1

[0298] 108L X-4.1 109RND R3.4 F3

[0299] 110L Y+9F5 111L X+3

[0300] 112L Y+15 113L X+5R0 F100

[0301] 114M5 M9 115L Z+200F3000

[0302] 116M0 117END PGM 510JXdimian MM

[0303] 7. Precision milling of electrode surfaces: Custom-made electroplated diamond abrasive tools are used for integrated chamfering and sidewall machining. The diameter ensures no interference from tool compensation on the Φ1.6mm narrow groove. The electrode surface is precision machined to achieve a uniform surface area without damaging the contact surface. The procedure is as follows:

[0304] 0BEGIN PGM 510JXdianji MM 1TOOL CALL 29S6000

[0305] 2L X-5Y+15F5000 3L Z+20

[0306] 4L Z-1.97F500 5M3 M8

[0307] 6L X+0RL F500 7L Y+9F5

[0308] 8L X+4.1 9L Y+4.1

[0309] 10RND R3.4 F5 11L X+9F10

[0310] 12L Y-4.1 13L X+4.1

[0311] 14RND R3.4 F5 15L Y-9F10

[0312] 16L X+0.8 17L Y+15

[0313] 18L X-0.8 19L Y-9

[0314] 20L X-4.1 21L Y-4.1

[0315] 22RND R3.4 F5 23L X-9F10

[0316] 24L Y+4.1 25L X-4.1

[0317] 26RND R3.4 F5 27L Y+9F10

[0318] 28L X+0 29L Y+15

[0319] 30L X-5R0 F100 31M5 M9

[0320] 32M0 33TOOL CALL 29S6000

[0321] 34L X-25F3000 35L Y+15

[0322] 36L X-6 37M3 M8

[0323] 38L X-11.5RL F5 39L Y-3.03

[0324] 40CC X-7.5Y-7.5 41C X-13.31Y-6DR+F3

[0325] 42L X-25F5 43L Y-10R0 F100

[0326] 44M0 45L Y+15F3000

[0327] 46M4 47L X+6

[0328] 48L X+11.5RR F5 49L Y-3.03

[0329] 50CC X+7.5Y-7.5 51C X+13.31Y-6DR-F3

[0330] 52L X+25F5 53L Y-10R0 F100

[0331] 54M0 56END PGM 510JXdianji MM

[0332] 8. Hand chamfering.

[0333] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A precision manufacturing method of a novel accelerometer sensitive structure electrode plate, characterized in that, The method comprises the following steps: S1, profile milling and grinding of six base surfaces of a cubic electrode plate blank and polishing of the six base surfaces to obtain an electrode plate preform; S2, based on the electrode plate preform, cutting out U and D to ensure the thickness of the cut pieces of U and D, cutting U to obtain U1, placing the polished side of U1 and D on a light plate, and polishing the side of U1 and D away from the light plate; S3, cutting D to obtain D1 and R, ensuring the thickness of D1 and R; ensuring the thickness of the cut pieces of D1 and R, placing the polished side of R on a light plate, and polishing the side of R away from the light plate; S4, cutting R to obtain D2 and D3, ensuring the thickness of the cut pieces of D2 and D3, placing the polished side of U1, D1, D2 and D3 on a light plate, and polishing the side of U1, D1, D2 and D3 away from the light plate; S5, repeating the above steps to obtain two groups of U1, D1, D2 and D3, placing the two groups of U1, D1, D2 and D3 side by side on a light plate for flat grinding, and obtaining eight electrode plate bases after the flat grinding of the two groups of U1, D1, D2 and D3; S6, numerical control milling, punching and groove processing of the electrode plate base, comprising: S61, bonding the electrode plate base to a glass auxiliary block, the parallelism error after bonding being less than 0.005 mm, and clamping on a device workbench; S62, rough milling of the groove by using electroplated diamond round bar abrasives with different diameters, measuring the average profile of the remaining amount by using a Φ4 tool in the larger remaining amount part, using tool center trajectory programming, rough milling of the electrode surface by using a Φ2.3-2.4 abrasive tool smaller than the narrow groove and leaving remaining amount in the rest part, leaving an amount of 0.004 mm on the side surface and an amount of 0.002 mm on the bottom surface; S63, rough milling of a Φ1.6 mm groove by using a Φ1.5 mm electroplated diamond round bar abrasive; S64, rough and fine milling of a 5 mm deep groove, the abrasive diameter being adapted to the corner of the groove and using tool compensation programming; S65, chamfering of the mounting hole, the profile of the two sides of the electrode surface, the long side and the 5 mm deep groove straight side by using an electroplated tapered diamond chamfering die; S66, the parallelism accuracy of the bottom surface is required to be 0.001 mm, the depth accuracy is 0.002, fine tool compensation profile programming and abrasive center programming are used, and the tool compensation is switched three times during the period, the relative depth and parallelism are measured by using a 0.001 precision dial gauge each time, the data is corrected, and the bottom surface is processed to meet the requirements; S67, customizing an electroplated diamond abrasive for chamfering and side wall integrated processing, ensuring that the diameter is not interfered with the tool compensation on the Φ1.6 mm narrow groove, and fine processing the electrode surface, the surface area of the electrode surface is consistent, and the fine processing state of the contact bottom surface is not damaged; S68, manual chamfering.

2. The method of precision manufacturing of novel accelerometer sensitive structure electrode plates according to claim 1, characterized by, In step S1, the perpendicularity of the six surfaces of the milled electrode plate blank is not greater than 0.05 mm, and the consistency of the side size is better than 0.05 mm.

3. The method of claim 1, wherein the method is characterized by: In step S1, the angle parallelism between the polished surfaces is 90°±2″.

4. The method of claim 1, wherein the method is a method of precision processing of a novel accelerometer sensitive structure electrode plate, characterized by, In step S2, the parallelism of the cut surfaces of U, D and U1 to the opposite surfaces is 0.02 mm, and the chamfer is 0.1 mm.

5. The method of claim 1, wherein the method is a precision machining method of a novel accelerometer sensitive structure electrode plate, characterized by, In step S2, when polishing U1 and D, the parallelism between the top surface of U1 and D and the surface of the contact plate is 0.001 mm, the surface shape accuracy is N=1.5, ΔN=0.5, the surface defect is V, and the chamfer is 0.1 mm.

6. The method of claim 1, wherein the method is a precision machining method of a novel accelerometer sensitive structure electrode plate, characterized by, In step S3, when cutting, the parallelism between the cut surfaces of D1 and R and the opposite surfaces is 0.02 mm, and the chamfer is 0.1 mm.

7. The method of claim 1, wherein the method is a precision machining method of a novel accelerometer sensitive structure electrode plate, characterized by, In step S3, when polishing R, the parallelism between the top surface of R and the surface of the contact plate is 0.001 mm, and the chamfer is 0.1 mm.

8. The method of claim 1, wherein the method is a precision machining method of a novel accelerometer sensitive structure electrode plate, characterized by, In step S4, when cutting, the parallelism between the cut surfaces of D2 and D3 and the opposite surfaces is 0.02 mm, and the chamfer is 0.1 mm.

9. The method of claim 1, wherein the method is a precision machining method of a novel accelerometer sensitive structure electrode plate, characterized by, In step S4, when polishing D2 and D3, the parallelism between the top surfaces of D2 and D3 and the surface of the contact plate is 0.001 mm, the surface shape accuracy is N=2, ΔN=0.5, the surface defect is V, and the chamfer is 0.1 mm.

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