Liquid ejecting head, and liquid ejecting apparatus

Abstract

The present application provides a liquid ejection head and a liquid ejection apparatus capable of being manufactured at low cost and having a dummy flow path blocked. The liquid ejection head is characterized by comprising: a liquid flow path including a plurality of nozzles constituting a nozzle row that ejects liquid; a dummy flow path including a plurality of dummy nozzles constituting a dummy nozzle row that does not eject liquid; and a blocking portion constituted by an adhesive and blocking the dummy flow path.

Description

Technical Field

[0001] This disclosure relates to a liquid injection head and a liquid injection device. Background Technology

[0002] Regarding liquid ejection heads installed in liquid ejection devices such as printers, Patent Document 1 discloses a liquid ejection head having a flow channel used in liquid ejection and a dummy flow channel not used in liquid ejection. The liquid ejection head has a nozzle plate with nozzles formed communicating with the flow channel. In this nozzle plate, no dummy nozzles corresponding to the dummy flow channel are formed, and the dummy flow channel is blocked by the nozzle plate.

[0003] There is a desire to manufacture a liquid injection head that reduces the number of nozzles used, based on the specifications of the liquid injection device, at a low cost. In this case, the possibility of converting a portion of the flow channel of an existing liquid injection head that lacks a dummy flow channel into a dummy flow channel, and then sealing that dummy flow channel, is considered. However, in Patent Document 1, since sealing the dummy flow channel requires manufacturing a new nozzle plate with a portion that does not have nozzle orifices formed, there is a possibility of increased cost for this part.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2020-82412 Summary of the Invention

[0005] According to a first aspect of this disclosure, a liquid injection head is provided. The liquid injection head is characterized by comprising: a liquid flow channel including a plurality of nozzles constituting a nozzle array for injecting liquid; a dummy flow channel including a plurality of dummy nozzles constituting a dummy nozzle array that does not inject liquid; and a sealing portion made of an adhesive that seals the dummy flow channel.

[0006] According to a second aspect of this disclosure, a liquid injection device is provided. This liquid injection device is characterized by comprising: a liquid injection head as described above; and a liquid storage section for storing liquid supplied to the liquid injection head. Attached Figure Description

[0007] Figure 1 This is a schematic diagram showing the general structure of a liquid injection device.

[0008] Figure 2 An exploded perspective view showing the general structure of a liquid jet nozzle.

[0009] Figure 3 A cross-sectional view schematically illustrating the general structure of the liquid injection head in the first embodiment.

[0010] Figure 4 An exploded 3D view showing the structure of the head chip.

[0011] Figure 5 for Figure 4 VV cross-sectional view of the head chip.

[0012] Figure 6 This is a schematic diagram illustrating the scanning of a liquid jet head.

[0013] Figure 7 A cross-sectional view schematically illustrating the outline structure of the liquid injection head in the second embodiment.

[0014] Figure 8 A cross-sectional view schematically illustrating the outline structure of the liquid injection head in the third embodiment.

[0015] Figure 9 A cross-sectional view schematically illustrating the outline structure of the liquid injection head in the fourth embodiment.

[0016] Figure 10 A cross-sectional view schematically illustrating the outline structure of the liquid injection head in the fifth embodiment. Detailed Implementation

[0017] A. First implementation method:

[0018] Figure 1 This is a schematic diagram showing the general structure of a liquid injection device 300 equipped with a liquid injection head 100 as described in the first embodiment of this disclosure. Figure 1 The diagram shows arrows along the mutually orthogonal X, Y, and Z directions. The X, Y, and Z directions are along the X-axis, Y-axis, and Z-axis, which are three mutually orthogonal spatial axes, and each includes both directions along one side of the X-axis, Y-axis, and Z-axis and their opposite directions. Specifically, the positive directions along the X-axis, Y-axis, and Z-axis are +X, +Y, and +Z, respectively, and the negative directions are -X, -Y, and -Z, respectively. Figure 1 In the diagram, the directions from the base of each arrow marker representing the X, Y, and Z directions towards the top are along the positive directions of the X, Y, and Z axes, respectively. Additionally, in... Figure 1 In this diagram, the X and Y axes are axes along the horizontal plane, and the Z axis is an axis along the vertical line. Therefore, in this embodiment, the -Z direction is the direction of gravity. Arrow markings along the X, Y, and Z directions are appropriately shown in other figures. Figure 1 The X, Y, and Z directions in this diagram represent the same directions as those in other accompanying figures. In the following text, the +Z direction will also be referred to as "up" and the -Z direction as "down". Furthermore, in this specification, the term "orthogonal" includes a range of 90° ± 10°.

[0019] The liquid jetting apparatus 300 is an inkjet printer that prints images on a medium P by jetting ink as a liquid. The liquid jetting apparatus 300 prints images on the medium P by jetting ink onto a medium such as paper and forming dots at various locations on the medium P based on printing data indicating the opening or closing of dots on the medium P. The medium P can be any material capable of holding liquid, such as plastic, film, fiber, cloth, leather, metal, glass, wood, or ceramic, in addition to paper. The liquid used in the liquid jetting apparatus 300 can be any liquid, in addition to ink, such as various color materials, electrode materials, samples of biological, organic, or inorganic substances, lubricating oil, resin liquid, etching solution, etc.

[0020] The liquid injection device 300 includes a liquid injection head 100 with multiple nozzle holes 21, a cover 110, a suction pump 130, a liquid storage section 310, a head moving mechanism 320, a conveying mechanism 330 for delivering medium P, and a control section 500.

[0021] The liquid reservoir 310 stores the ink ejected from the liquid ejector head 100. The ink stored in the liquid reservoir 310 can be of one type or multiple types. For example, the liquid reservoir 310 can be a bag-shaped liquid bag formed of a flexible film, or a box or ink can that can be attached and detached from the liquid ejector device 300. In this embodiment, the liquid reservoir 310 is mounted on the carriage 323 together with the liquid ejector head 100.

[0022] The control unit 500 is configured as a computer equipped with one or more processors, main storage devices, and input / output interfaces for implementing signals to and from the outside. The control unit 500 controls the various mechanisms installed in the liquid jetting device 300 according to printing data, thereby jetting ink from the liquid jetting head 100 onto the medium P, and then printing an image on the medium P. In other words, the control unit 500 controls the liquid jetting action of the liquid jetting head 100.

[0023] The head movement mechanism 320 includes a drive motor 321, a drive belt 322, and a carriage 323 for housing the liquid injection head 100. The head movement mechanism 320 transmits the driving force generated by the drive motor 321 to the carriage 323 via the drive belt 322, causing the carriage 323 to reciprocate along the main scanning direction together with the liquid injection head 100. In this embodiment, the main scanning direction is along the Y direction.

[0024] The liquid injection head 100 has a nozzle array 25 for injecting liquid and a dummy nozzle array 26 for not injecting liquid. The nozzle array 25 consists of multiple nozzles 22. A nozzle 22 refers to a nozzle in a nozzle orifice 21 that injects liquid. For example... Figure 1 As shown, in this embodiment, a nozzle array 25 consists of a plurality of nozzles 22 arranged along the X direction. A dummy nozzle array 26 consists of a plurality of dummy nozzles 23. A dummy nozzle 23 refers to a nozzle in the nozzle orifice 21 that does not eject liquid. A dummy nozzle array 26 consists of a plurality of dummy nozzles 23 arranged along the X direction. In the following text, without distinguishing between nozzle array 25 and dummy nozzle array 26, both may sometimes be referred to as nozzle orifice array 24.

[0025] The openings of nozzle 22 and dummy nozzle 23 are formed on the spray surface 19 of liquid injection head 100. The spray surface 19 in this embodiment is described later. Figure 2 The lower surface of the nozzle plate 160 and the lower surface of the fixing plate 250, as shown, are formed.

[0026] While the liquid jet head 100 reciprocates in the main scanning direction via the head moving mechanism 320, it jets liquid supplied from the liquid reservoir 310 in a droplet form through the nozzle 22 onto the medium P being transported by the transport mechanism 330 along a sub-scanning direction that intersects the main scanning direction. In this embodiment, the sub-scanning direction is the X direction, which is orthogonal to the main scanning direction. In other embodiments, the main scanning direction and the sub-scanning direction may not be orthogonal to each other. Furthermore, although the liquid jetting device 300 of this embodiment is a serial printer in which the liquid jet head 100 is transported in the Y direction, in other embodiments, it may be a line printer in which the liquid jet head 100 is fixed and the nozzles 22 are arranged across the entire width of the medium P. The number of liquid jet heads 100 provided in the liquid jetting device 300 may be one or more than two.

[0027] The cover 110 and the suction pump 130 are positioned at an initial position H in a non-printing area, which is a region in the liquid injection device 300 where no medium P is disposed. In this embodiment, the cover 110 has a concave shape with an opening in the +Z direction. The cover 110 is configured to move up and down via a cover moving mechanism (not shown). The cover 110 has a liquid-absorbing material 116 disposed on its bottom within its opening. The liquid-absorbing material 116 is made of, for example, a hydrophilic foaming resin, and absorbs liquid discharged from the nozzle 22 to the outside.

[0028] The cover 110 is configured to cover the openings of the nozzle 22 and the dummy nozzle 23. Covering means forming a closed space between the cover and the spray surface 19, thus creating the openings of the nozzle 22 and the dummy nozzle 23. More specifically, the cover 110 moves in the +Z direction toward the spray surface 19 of the liquid injection head 100 located at the initial position H via a cover moving mechanism, and its upper edge abuts against the spray surface 19, thereby forming a closed space between the cover 110 and the spray surface 19. Thus, the openings of the nozzle 22 and the dummy nozzle 23 are covered. In the following text, the state in which the openings of the nozzle 22 and the dummy nozzle 23 are covered is sometimes referred to as the covered state.

[0029] The suction pump 130 draws liquid from the enclosed space formed by the capping via a suction pipe (not shown). The liquid drawn by the suction pump 130 is discharged into a waste liquid tank (not shown). The control unit 500 appropriately drives the suction pump 130 to perform suction cleaning when printing images on the medium P, or drives the suction pump 130 to perform suction cleaning according to a user-preset operation. Suction cleaning refers to the action of creating a negative pressure in the enclosed space under capping conditions and drawing air bubbles or foreign matter contained in the liquid along with the liquid through the liquid spray head 100 via the nozzle 22.

[0030] Figure 2 This is an exploded perspective view showing the outline structure of the liquid injection head 100. Figure 3 This is a schematic cross-sectional view showing the outline structure of the liquid injection head 100. Additionally, in Figure 3 In addition to the liquid injection head 100, the cover 110 described above and the enclosed space CL formed between the cover 110 and the injection surface 19 are also schematically shown. The liquid injection head 100 in this embodiment includes a plurality of head chips 150, a holder 200 for holding the plurality of head chips 150, and a fixing plate 250.

[0031] like Figure 3As shown, the liquid injection head 100 includes a liquid flow channel 50, a dummy flow channel 56, and a sealing portion 101. The liquid flow channel 50 refers to a flow channel containing a plurality of nozzles 22 constituting the nozzle array 25. Liquid supplied from the liquid reservoir 310 flows within the liquid flow channel 50. The dummy flow channel 56 refers to a flow channel containing a plurality of dummy nozzles 23 constituting the dummy nozzle array 26. In this embodiment, liquid from the liquid reservoir 310 is not supplied to the dummy flow channel 56. Therefore, in this embodiment, no liquid flows within the dummy flow channel 56. The liquid injection head 100 in this embodiment includes six liquid flow channels 50 and two dummy flow channels 56 arranged along the Y direction. The two dummy flow channels 56 are arranged in the +Y direction relative to the six adjacent liquid flow channels 50, and are arranged adjacent to each other.

[0032] The dummy flow channel 56 is blocked by the blocking portion 101. The blocking portion 101 is a part made of adhesive that blocks the dummy flow channel 56. In this embodiment, the blocking portion 101 is formed by a first adhesive portion 102. The first adhesive portion 102 is a part made of adhesive that joins the first flow channel component and the second flow channel component together. The first flow channel component is a component that has a first dummy portion 53 formed as part of the dummy flow channel 56. The second flow channel component is a component that has a second dummy portion 54 formed as part of the dummy flow channel 56 and is stacked on the first flow channel component. The second dummy portion 54 is the upstream portion of the dummy flow channel 56 compared to the first dummy portion 53. The upstream portion of the dummy flow channel 56 refers to the side of the dummy flow channel 56 opposite to the downstream dummy nozzle array 26; in this embodiment, it refers to the side of the connection portion 241 of the retainer 200, which will be described later. In other words, it can be said that the second dummy portion 54 is the portion of the dummy flow channel 56 that is farther away from the dummy nozzle array 26 compared to the first dummy portion 53.

[0033] In this embodiment, the first housing portion 194 of the first chip 151, described later, corresponds to the first flow channel component, and the flow channel forming portion 245 of the retainer 200, described later, corresponds to the second flow channel component. In the first housing portion 194, a portion of each of the two dummy flow channels 56 described above, namely two first dummy portions 53, is formed. In the flow channel forming portion 245, which is stacked on the first housing portion 194, a portion of each of the two dummy flow channels 56, namely two second dummy portions 54, is formed. Furthermore, in this embodiment, two first adhesive portions 102 are respectively disposed between the first housing portion 194 and the flow channel forming portion 245. Each first adhesive portion 102 forms a sealing portion 101 between each of the first dummy portions 53 formed in the first housing portion 194 and each of the second dummy portions 54 formed in the flow channel forming portion 245, sealing each dummy flow channel 56. In this embodiment, the first adhesive portions 102 and the sealing portions 101 are constructed using a silicone adhesive. In other embodiments, the first adhesive portion 102 or the sealing portion 101 may also be constructed using other adhesives, such as epoxy adhesives.

[0034] In the following text, the direction in which the second flow channel component is stacked on the first flow channel component is sometimes referred to as the stacking direction. In this embodiment, the direction in which the flow channel forming portion 245 is stacked on the first housing portion 194 corresponds to the stacking direction. The stacking direction includes both a direction along one side of the same axis and its opposite direction; in this embodiment, it is a direction along the Z direction.

[0035] In this embodiment, the second flow channel component is not only stacked on the first flow channel component described above, but also stacked on the third flow channel component. The third flow channel component refers to the component that forms a first portion 51, which is part of the liquid flow channel 50. Furthermore, in this embodiment, the second flow channel component, in addition to the second dummy portion 54 described above, also forms a second portion 52, which is part of the liquid flow channel 50. The second portion 52 is a portion of the liquid flow channel 50 that is farther from the nozzle array 25 than the first portion 51. A third adhesive portion 104 is provided between the second flow channel component and the third flow channel component. The third adhesive portion 104 is made of an adhesive and joins the second and third flow channel components together. The third adhesive portion 104 forms a second connecting flow channel 62 that connects the first portion 51 and the second portion 52. In this embodiment, the third adhesive portion 104, like the first adhesive portion 102, is made of a silicone adhesive. In other embodiments, the third adhesive portion 104 may also be made of an epoxy adhesive, for example.

[0036] In this embodiment, the second outer shell portion 195 of the second head chip 152 and each of the third outer shell portions 196 of the two third head chips 153, as described later, correspond to third flow channel components. In the second outer shell portion 195 and the two third outer shell portions 196, two first portions 51 of the liquid flow channels 50 described above are formed respectively. In the flow channel forming portion 245, a total of six second portions 52 are formed. Furthermore, in this embodiment, two third adhesive portions 104, totaling six, are provided between the second outer shell portion 195 and the flow channel forming portion 245, and between each of the third outer shell portions 196 and the flow channel forming portion 245. Each third adhesive portion 104 forms a second connecting flow channel 62 that connects the first portions 51 formed in the second outer shell portion 195 and the two third outer shell portions 196 and the second portions 52 formed in the flow channel forming portion 245.

[0037] like Figure 2 as well as Figure 3 As shown, the liquid injection head 100 in this embodiment includes four head chips 150 arranged along the Y direction. The first head chip 151 mentioned above refers to the head chip 150 located furthest along the +Y direction. The second head chip 152 refers to the head chip 150 located furthest along the -Y direction. The third head chip 153 refers to each of the two head chips 150 disposed between the first head chip 151 and the second head chip 152. In this embodiment, the structure of the third head chip 153 is the same as that of the second head chip 152. In the following text, without distinguishing between the first head chip 151, the second head chip 152, and the third head chip 153, they may sometimes be simply referred to as head chips 150.

[0038] Each head chip 150 has a common structure and includes a wiring substrate 121, a nozzle plate 160, and a chip body 170. The chip body 170 has a housing portion 193. Additionally, in... Figure 3 The wiring board 121 is omitted in the text. Furthermore, Figure 2 as well as Figure 3 The structure of the chip body 170 is shown in a simplified manner. The first housing portion 194 mentioned above refers to the housing portion 193 of the first chip 151. Similarly, the second housing portion 195 and the third housing portion 196 refer to the housing portions 193 of the second chip 152 and the third chip 153, respectively.

[0039] In this embodiment, the nozzle plate 160 is made of a single-crystal silicon substrate and has a flat, elongated shape in the X direction. In other embodiments, the nozzle plate 160 may also be formed of, for example, a metal material such as stainless steel, a resin material such as polyimide resin, or the like. The nozzle plate 160 is fixed to the lower surface of the chip body portion 170 by an adhesive. Hereinafter, the nozzle plate 160 provided on the first chip 151 will also be referred to as the first nozzle plate 161. The nozzle plate 160 provided on the second chip 152 will also be referred to as the second nozzle plate 162.

[0040] like Figure 3 As shown, at least one of a nozzle array 25 and a dummy nozzle array 26 is formed on each nozzle plate 160. In this embodiment, a nozzle orifice array 24 is provided relative to a liquid flow channel 50 or a dummy flow channel 56. More specifically, in the first nozzle plate 161, only two adjacent dummy nozzle arrays 26 are formed corresponding to the two first dummy portions 53 formed in the first housing portion 194. In the second nozzle plate 162, only two adjacent nozzle arrays 25 are formed corresponding to the two first portions 51 formed in the second housing portion 195. Furthermore, as described above, since the structure of the third head chip 153 in this embodiment is the same as that of the second head chip 152, only two adjacent nozzle arrays 25 are also formed in the nozzle plates 160 provided in each third head chip 153, similarly to the second nozzle plate 162. Therefore, in this embodiment, the total number of nozzle rows 25 and dummy nozzle rows 26 formed in each nozzle plate 160 is a common number of rows, and each is two rows.

[0041] Each of the housing portions 193 has two first flow channels 31 formed. The first flow channel 31 formed in the first housing portion 194 corresponds to the first dummy portion 53 described above. The first flow channel 31 formed in the second housing portion 195 and the third housing portion 196 corresponds to the first portion 51 described above. In this embodiment, the structure of the first dummy portion 53 is the same as the structure of the first portion 51. In the following text, the first dummy portion 53 and the first portion 51 are sometimes not distinguished, and both are simply referred to as the first flow channel 31. Details regarding the structure of the chip body portion 170 and the first flow channels 31 will be described later.

[0042] In this embodiment, the retainer 200 holds the four head chips 150 described above. The retainer 200 has a first layer 210 and a flow channel forming portion 245. In this embodiment, the flow channel forming portion 245 has a second layer 220, a third layer 230, and a fourth layer 240. In other embodiments, the retainer 200 can be constructed as a single component, or it can be constructed by stacking two, three, or five or more components. For example, the first layer 210 and the second layer 220 can also be integrally formed.

[0043] The first layer 210, the second layer 220, the third layer 230, and the fourth layer 240 are stacked sequentially from bottom to top. The first layer 210 and the layers constituting the channel forming portion 245 are formed, for example, from resin materials such as Zylon (registered trademark) or liquid crystal polymers. Alternatively, the first layer 210 and the layers constituting the channel forming portion 245 may also be formed from stainless steel, metals such as titanium or aluminum, or ceramics. In this embodiment, the first layer 210 and the channel forming portion 245, as well as the layers constituting the channel forming portion 245, are bonded together by a silicone-based adhesive. In other embodiments, these components may be bonded together using, for example, an epoxy-based adhesive, or fixed together by screws or clamps.

[0044] In the first layer 210, four storage spaces 211 are formed. Each storage space 211 is formed by extending through the first layer 210 in the Z direction, and houses the four head chips 150 described above. Hereinafter, the storage space 211 housing the first head chip 151 will also be specifically referred to as the first storage space 212. In this embodiment, the first storage space 212 is located furthest from the four storage spaces 211 in the +Y direction.

[0045] In the flow channel forming section 245 of this embodiment, eight second flow channels 32 are formed side by side along the Y direction, corresponding to the total of eight first flow channels 31 described above. In this embodiment, the two second flow channels 32 located closest to the +Y direction are respectively equivalent to the second dummy portion 54 described above. Furthermore, the second flow channels 32 other than the second dummy portion 54 are respectively equivalent to the second portion 52 described above. In the following text, the second dummy portion 54 and the second portion 52 are sometimes not distinguished, and both are simply referred to as the second flow channel 32. In addition, the flow channel length or flow channel cross-sectional area of ​​each second flow channel 32 may be the same or different.

[0046] The second layer 220 is stacked on the upper surface of the first layer 210 and on the upper surface of the outer shell portion 193 of each head chip 150 housed in the housing space 211. In the second layer 220, a first retainer channel 33 is formed, which is part of the second channel 32 and communicates with the first channel 31. In this embodiment, eight first retainer channels 33 are formed in the second layer 220, each communicating with one of the eight first channels 31. The first retainer channels 33 are formed extending along the Z direction, which is the stacking direction. A first space 41 is formed at the upper end of each first retainer channel 33 on the side away from the first channel 31. The first space 41 has a larger channel cross-sectional area than the portion of the first retainer channel 33 excluding the first space 41, and opens toward each of the second spaces 42 formed in the third layer 230, as described later.

[0047] The aforementioned first adhesive portions 102 bond the first housing portion 194 and the second layer 220 together. The aforementioned third adhesive portions 104 bond the second housing portion 195 and the second layer 220 together, respectively, between the second housing portion 195 and the second housing portion 196 and the second layer 220. For the first chip 151 and the second layer 220, in addition to the aforementioned first adhesive portions 102, they can also be fixed together by other adhesive portions made of adhesive, screws, or clamps. Similarly, for the second chip 152 or the third chip 153 and the second layer 220, in addition to the third adhesive portion 104, they can also be fixed together by other adhesive portions, screws, or clamps. The first adhesive portion 102 or the third adhesive portion 104, and other adhesive portions can also be formed as a single unit.

[0048] The third layer 230 is stacked on the upper surface of the second layer 220. In the third layer 230, a second cage flow channel 34 is formed, which is part of the second flow channel 32 and communicates with the first cage flow channel 33. In this embodiment, eight second cage flow channels 34 are formed in the third layer 230, each communicating with one of the eight first cage flow channels 33. The second cage flow channels 34 are formed in a manner extending along the Z direction, which is the stacking direction. At the lower end of each second cage flow channel 34, near the side closest to the first cage flow channel 33, a second space 42 is formed. The second space 42 has a larger flow channel cross-sectional area compared to other portions of the second cage flow channel 34, and opens toward each first space 41.

[0049] A filter chamber 40 is formed by passing through the first space 41 and the second space 42. A filter 43 is provided in the filter chamber 40 to remove air bubbles or foreign matter contained in the liquid. The filter 43 is arranged between the first space 41 and the second space 42 such that it covers the openings of the first space 41 and the second space 42. Liquid flowing in the liquid flow channel 50 passes through the filter 43 in the filter chamber 40, thereby removing air bubbles or foreign matter. Furthermore, in this embodiment, no liquid flows in the filter chamber 40 formed in the dummy flow channel 56. Hereinafter, the filter chamber 40 formed in the dummy flow channel 56 is sometimes referred to as a dummy filter chamber 44. In this embodiment, the dummy filter chamber 44 is disposed upstream of the blocking portion 101 in the dummy flow channel 56.

[0050] A fourth layer 240 is stacked on the upper surface of the third layer 230. The fourth layer 240 has a connecting portion 241. In this embodiment, the connecting portion 241 is formed as a needle protruding in the +Z direction. Furthermore, in the fourth layer 240, a third cage flow channel 35, which is part of the second flow channel 32 and communicates with the second cage flow channel 34, and a fourth cage flow channel 36, which communicates with the third cage flow channel 35, are formed. In this embodiment, in the fourth layer 240, eight third cage flow channels 35, which communicate with each of the eight second cage flow channels 34, and eight fourth cage flow channels 36, which communicate with each of the eight third cage flow channels 35, are formed. The fourth cage flow channels 36 are formed such that they extend from the top of the connecting portion 241 toward the lower surface of the third layer 230 along the Z direction, which is the stacking direction. The third cage flow channel 35 is formed in a direction perpendicular to the Z direction, which is the stacking direction, and communicates with the fourth cage flow channel 36 and the second cage flow channel 34. In this embodiment, the third cage flow channel 35 is formed extending in the Y direction. Alternatively, in other embodiments, the second flow channel 32 may not be configured through the first cage flow channel 33 to the fourth cage flow channel 36, or it may be configured as a flow channel in other ways.

[0051] The connecting portion 241 is configured to connect to the liquid reservoir 310 described above. The liquid reservoir 310 can be directly connected to the connecting portion 241, or indirectly connected to the connecting portion 241 via a hose, for example, when the liquid reservoir 310 is not mounted on the carriage 323. For example, protrusions or recesses may be formed on the upper surface of the connecting portion 241 to position the liquid reservoir 310 or the hose. Liquid in the liquid reservoir 310 connected to the connecting portion 241 flows into the liquid injection head 100 via the fourth retainer flow channel 36 and is supplied to the liquid flow channel 50 within the liquid injection head 100. Furthermore, in this embodiment, the two connecting portions 241 corresponding to the dummy flow channel 56 in the connecting portion 241 are not connected to the liquid reservoir 310.

[0052] In this embodiment, the fixing plate 250 is made of stainless steel. Four openings 255 are formed in the fixing plate 250, arranged side-by-side along the Y direction, corresponding to each head chip 150. The fixing plate 250 is fixed to the lower surface of the retainer 200 and the lower surface of each head chip 150 by adhesive, such that each nozzle plate 160 is located within each opening 255 when viewed along the Z direction. Thus, the lower surface of the nozzle plate 160 and each nozzle orifice array 24 are exposed downwards through the openings 255. As described above, in this embodiment, the lower surface of the nozzle plate 160 and the lower surface of the fixing plate 250 form a spray surface 19.

[0053] Figure 4 An exploded perspective view showing the structure of head chip 150. Figure 5 for Figure 4 VV cross-sectional view of the head chip 150. (See image.) Figure 4 as well as Figure 5 As shown, the nozzle plate 160 and the chip body 170 of the head chip 150 are stacked together sequentially from bottom to top along the Z direction. The chip body 170 is constructed by stacking together sequentially from bottom to top along the Z direction via a malleable substrate 175, a connecting plate 180, a flow channel forming substrate 185, a protective substrate 190, and the aforementioned outer shell 193. Figure 5 As shown, in this embodiment, the nozzle plate 160 and the chip body 170 are configured in a symmetrical manner in the Y direction, separated by the center plane O.

[0054] like Figure 5As shown, in the head chip 150 of this embodiment, two chip flow channels 30 are formed. The chip flow channel 30 in this embodiment is constructed by sequentially connecting the following components: a nozzle orifice array 24, a nozzle communication channel 181, a pressure generating chamber 187, a supply communication channel 184, a second manifold portion 183, a first manifold portion 182, a liquid chamber portion 197, and a connection port 199. In this embodiment, the liquid chamber portion 197 and the connection port 199 are formed in the outer casing portion 193 and constitute the first flow channel 31. That is, the liquid chamber portion 197 and the connection port 199 in the first head chip 151 correspond to the first dummy portion 53 described above, and the nozzle orifice array 24, the nozzle communication channel 181, the pressure generating chamber 187, the supply communication channel 184, the second manifold portion 183, and the first manifold portion 182 correspond to the downstream portion of the dummy flow channel 56 compared to the first dummy portion 53. Furthermore, the liquid chamber 197 and the connection port 199 in the second head chip 152 and the third head chip 153 correspond to the first part 51 mentioned above, and the nozzle orifice 24, the nozzle communication channel 181, the pressure generating chamber 187, the supply communication channel 184, the second manifold 183, and the first manifold 182 correspond to the part of the liquid flow channel 50 that is closer to the nozzle orifice 25 than the first part 51.

[0055] In this embodiment, the flow channel forming substrate 185 is a flat plate-shaped component made of a single-crystal silicon substrate. In the flow channel forming substrate 185, anisotropic etching is performed from one side, thereby forming pressure generating chambers 187, divided by multiple partitions, arranged side-by-side along the X direction. In this embodiment, in the flow channel forming substrate 185, two rows of pressure generating chambers 187 arranged side-by-side along the X direction are provided in the Y direction, separated by a center plane O. In other embodiments, the flow channel forming substrate 185 may be formed, for example, from metals such as stainless steel (SUS) or nickel (Ni), ceramic materials such as zirconium oxide (ZrO2) or aluminum oxide (Al2O3), glass ceramic materials, oxides such as magnesium oxide (MgO) or lanthanum aluminate (LaAlO3), etc.

[0056] In this embodiment, the connecting plate 180 is a flat plate-shaped component made of a single-crystal silicon substrate. In other embodiments, the connecting plate 180 may also be formed of, for example, a metal such as stainless steel or nickel, or a ceramic such as zirconium oxide. Figure 5As shown, in the connecting plate 180, the nozzle connecting channel 181, the first manifold 182, the second manifold 183, and the supply connecting channel 184 described above are each provided in pairs across the center surface O. In the following text, the virtual nozzle 23 constituting the virtual nozzle array 26, and the group consisting of the nozzle connecting channel 181, the pressure generating chamber 187, and the supply connecting channel 184 communicating with the virtual nozzle 23, are sometimes referred to as virtual independent flow channels.

[0057] The first manifold section 182 and the second manifold section 183 are jointly provided with respect to the plurality of pressure generating chambers 187 constituting a row, and together with the liquid chamber section 197 of the housing section 193, form a common liquid chamber section 60 as part of the chip flow channel 30. The nozzle communication channel 181 and the supply communication channel 184 are provided in a plurality of parallel arrangements along the X direction, each corresponding to a pressure generating chamber 187.

[0058] Each nozzle communication channel 181 connects each pressure generating chamber 187 and each nozzle orifice 21 in the Z direction. Each supply communication channel 184 connects the common liquid chamber 60 to each pressure generating chamber 187 in the Z direction. That is, the common liquid chamber 60 of the second head chip 152 is connected to the plurality of nozzles 22 constituting the nozzle array 25 via the supply communication channel 184, the pressure generating chamber 187, and the nozzle communication channel 181. Similarly, the common liquid chamber 60 of the first head chip 151 is connected to the plurality of dummy nozzles 23 constituting the dummy nozzle array 26. In the following text, the common liquid chamber 60, which is connected to the plurality of dummy nozzles 23 constituting the dummy nozzle array 26 like the common liquid chamber 60 of the first head chip 151, is sometimes referred to as the dummy common liquid chamber 63. Figure 3 As shown, in this embodiment, the sealing portion 101 described above is positioned upstream of the dummy common liquid chamber 63. Furthermore, in this embodiment, a portion of the dummy common liquid chamber 63 is defined by a first outer casing portion 194, which corresponds to the first flow channel component.

[0059] The malleable substrate 175 is bonded to the -Z direction side of the connecting plate 180 via an adhesive. In this embodiment, the malleable substrate 175 includes a sealing film 176 made of a flexible thin film and a flat frame member 177 formed of a rigid material such as metal. Figure 4 as well as Figure 5As shown, at the central portion of the sealing film 176 and the frame member 177, where they overlap with the nozzle plate 160 when viewed along the Z direction, an opening penetrating through each of the sealing film 176 and the frame member 177 in the Z direction is provided. Furthermore, the frame member 177 also has an opening penetrating through it in the Z direction at the position where it overlaps with each of the first manifold sections 182 when viewed along the Z direction. Therefore, the lower surface of each of the first manifold sections 182 is sealed only by the sealing film 176.

[0060] A vibrating plate 188 is disposed on the +Z direction side surface of the flow channel forming substrate 185. In this embodiment, the vibrating plate 188 includes an elastic film made of silicon dioxide (SiO2) and an insulating film made of zirconium oxide disposed on the elastic film. The -Z direction side surface of the elastic film of the vibrating plate 188 constitutes the wall surface of the +Z direction side of the pressure generating chamber 187 described above.

[0061] A piezoelectric actuator 280 is disposed on the +Z direction side of the vibrating plate 188. The piezoelectric actuator 280 is formed by stacking a first electrode, a piezoelectric layer, and a second electrode layer. In this embodiment, the first and second electrodes are formed of platinum. The piezoelectric layer in this embodiment is formed of lead zirconate titanate (PZT). The piezoelectric actuator 280 vibrates the vibrating plate 188 by the piezoelectric deformation of the piezoelectric layer generated by the application of a voltage from the drive circuit 120 disposed on the wiring board 121 to the two electrodes. The vibration of the vibrating plate 188, which corresponds to the pressure generating chamber 187 included in the liquid flow channel 50, namely the vibrating plate 188 of the second head chip 152 and the third head chip 153 in this embodiment, causes a pressure change in the liquid inside the pressure generating chamber 187. This pressure change reaches the nozzle 22 via the nozzle communication channel 181, thereby causing the liquid to be ejected from the nozzle 22.

[0062] In other embodiments, the first or second electrode of the piezoelectric actuator 280 may be formed, for example, from various metals such as platinum, iridium, titanium, tungsten, and tantalum, or conductive metal oxides such as lanthanum nickelate (LaNiO3). The piezoelectric layer may also replace PZT and be formed from other types of ceramic materials having a so-called perovskite structure represented by the ABO3 type, such as barium titanate, lead titanate, potassium niobate, lithium niobate, lithium tantalate, sodium tantalate, zinc oxide, barium strontium tantalate (BST), bismuth strontium tantalate (SBT), lead formate, zinc lead niobate, and scandium lead niobate. Furthermore, the piezoelectric layer is not limited to ceramic materials and may also be formed from any material with a piezoelectric effect, such as polyvinylidene fluoride or quartz.

[0063] A protective substrate 190 is bonded to the surface of the flow channel forming substrate 185 on the side of the piezoelectric actuator 280. The protective substrate 190, when viewed along the Z-direction, has approximately the same area as the flow channel forming substrate 185. The protective substrate 190 has a through hole 192 and a pair of retaining portions 191 disposed across a center surface O. The through hole 192 is a hole that penetrates the protective substrate 190 in the Z-direction. A wiring substrate 121 is inserted into the through hole 192. The retaining portion 191 is a recess provided on the Z-direction side of the protective substrate 190 and opening towards the Z-direction. The piezoelectric actuator 280 is disposed within the opening of the retaining portion 191.

[0064] The outer casing 193 is formed of, for example, a material such as resin or metal. Figure 4 as well as Figure 5 As shown, the outer casing 193 is the portion constituting the upper surface of the chip body 170, and is the portion bonded to the second layer 220 of the channel forming portion 245 via the first adhesive portion 102 or the third adhesive portion 104 described above. The outer casing 193 is stacked on the connecting plate 180 and the protective substrate 190, and is bonded to both via an adhesive. More specifically, the outer casing 193 has a recess Dp on its lower surface that can accommodate the channel forming substrate 185 and the protective substrate 190, and is stacked on the connecting plate 180 and the protective substrate 190 while accommodating the channel forming substrate 185 and the protective substrate 190 within the recess Dp.

[0065] The outer casing 193 is provided with a liquid chamber 197, an insertion port 198, and a connection port 199. A pair of liquid chambers 197 and a pair of connection ports 199 are each provided across the center surface O. The connection port 199 is the portion of the chip flow channel 30 that forms the end portion farther from the nozzle orifice array 24. In this embodiment, the connection port 199 opens in the +Z direction. The liquid chamber 197 communicates with the second flow channel 32 formed on the holder 200 in the Z direction, which is the stacking direction, via the connection port 199. As described above, the liquid chamber 197 is the portion that forms a common liquid chamber 60 together with the first manifold portion 182 and the second manifold portion 183. The insertion port 198 is a hole that penetrates the outer casing 193 in the Z direction and communicates with the through hole 192 of the protective substrate 190. The wiring board 121 described above is inserted into the through hole 192 via the insertion port 198 and connected to the piezoelectric actuator 280.

[0066] In this embodiment, the first adhesive portion 102 described above is formed by an adhesive applied to the openings of each connection port 199 of the first housing portion 194 and the openings of the head chip 150 side of each first retainer flow channel 33 corresponding to each connection port 199 formed in the retainer 200. Furthermore, this first adhesive portion 102 forms a sealing portion 101 that blocks the openings of the connection ports 199 and the openings of the first retainer flow channels 33 of the first housing portion 194. Therefore, in this embodiment, the sealing portion 101 is provided in the dummy flow channel 56 at the portion extending along the Z direction, which is the lamination direction, formed by the connection ports 199 and the first retainer flow channels 33. In this embodiment, the sealing portion 101 and the first adhesive portion 102 are formed, for example, by applying adhesive between the second layer 220 and the first outer shell portion 194 when viewed along the Z direction, which is the lamination direction, in a manner that overlaps with the opening of the connection port 199 and the opening of the first retainer flow channel 33, for example, when the second layer 220 is laminated onto the first outer shell portion 194 and the two are joined.

[0067] Furthermore, the third adhesive portion 104 described above is constructed by an adhesive applied between the edge of the opening of each connection port 199 in the second housing portion 195 and the third housing portion 196 and the edge of the opening of each first retainer channel 33 on the head chip 150 side corresponding to the connection port 199 formed in the retainer 200. Moreover, the third adhesive portion 104 forms a second connection channel 62 that liquid-tightly connects the opening of the connection port 199 formed on the second housing portion 195 or the third housing portion 196 with the opening of the first retainer channel 33. In this embodiment, the third adhesive portion 104 and the second connecting channel 62 are formed, for example, by applying adhesive between the second layer 220 and the second outer shell portion 195 or the third outer shell portion 196 when viewed along the Z direction, which is the lamination direction, in a manner that surrounds the opening of the connecting port 199 and the opening of the first retainer channel 33.

[0068] In this embodiment, the connection port 199 of the second housing portion 195, which corresponds to the third flow channel component, functions as an inlet for guiding liquid supplied from the liquid reservoir 310 to the liquid injection head 100 into the chip body portion 170 via the second portion 52 and the second connecting flow channel 62 described above. Furthermore, liquid is supplied to the common liquid chamber portion 60 of the second head chip 152 via the connection port 199. On the other hand, as described above, in this embodiment, no liquid is supplied to the dummy flow channel 56. Therefore, no liquid flows within the connection port 199 and the common liquid chamber portion 60 of the first head chip 151.

[0069] As another method of manufacturing a liquid jet head that reduces the number of nozzle rows 25 used, the case of reducing the number of head chips 150 itself is considered. As described above, in this embodiment, the number of dummy nozzle rows 26 in the entire liquid jet head 100 is two rows, which is more than the common number of rows described above. Therefore, although it is possible to construct a head chip 150 that does not have nozzle rows 25 but only dummy nozzle rows 26, as with the first head chip 151, the case of reducing the number of head chips 150 by not providing such a head chip 150 is also considered. However, for example, in the case of reducing the first head chip 151, the fixing plate 250 is not fixed to the head chip 150 near the first storage space 212. Therefore, the portion of the fixing plate 250 located near the first storage space 212 is more prone to deformation such as dents compared to the portion located near other storage spaces 211, for example, due to external forces caused by collisions with the medium P in the transport blockage, or negative pressure generated by suction cleaning. Furthermore, when the first chip 151 is cut off, since a space with a volume equivalent to that of the first chip 151 is formed in the first storage space 212, during suction cleaning performed in the capped state implemented by the cover 110, the negative pressure generated in the enclosed space CL will act on the first storage space 212 by drawing in air from outside the liquid jet head through the connection 241 which is open to the atmosphere. Therefore, there is a possibility that liquid cannot be properly drawn from the second chip 152 or the third chip 153, thus reducing the effectiveness of suction cleaning. Therefore, when the first chip 151 is cut off, for example, it is necessary to remanufacture a fixing plate that does not have an opening 255 corresponding to the first storage space 212, or to cover only the second chip 152 and each of the third chips 153 without covering the first storage space 212 in order to prevent the negative pressure generated by suction cleaning from acting in the first storage space 212, thus increasing manufacturing costs. In this embodiment, since a first head chip 151 is provided, and a blocking part 101 is provided to block the dummy flow channel 56, even when using a fixing plate 250 or a cover 110, the deformation of the fixing plate 250 or the reduction of the suction cleaning effect can be suppressed.

[0070] Figure 6 This is a schematic diagram illustrating the scanning of the liquid injection head 100 in this embodiment. Figure 6As shown, when the liquid jet head 100 performs printing within the printing area R, in order for the entire nozzle array 25 to scan from the -Y direction end to the +Y direction end of the printing area R, the liquid jet head 100 needs to move at least a distance A along the Y direction. Distance A is the sum of the width W of the printing area R in the Y direction and the distance D1 between the nozzle array 25 closest to the -Y direction and the nozzle array 25 closest to the +Y direction. The width W is, for example, the same as the width of the medium P in the Y direction. Distance D1 is smaller in the case where two dummy nozzle arrays 26 are arranged adjacent to the first nozzle plate 161, as in this embodiment, compared to the case where the two dummy nozzle arrays 26 are not adjacent and are arranged in the Y direction to sandwich a total of six nozzle arrays 25. This is because, generally, the distance between adjacent nozzle arrays 24 on a nozzle plate 160 is smaller than the distance between adjacent nozzle arrays 24 formed on adjacent nozzle plates 160. Therefore, the movement distance of the liquid jet head 100 in the Y direction during printing in the printing area R can be reduced, thereby increasing the possibility of printing images more efficiently. Furthermore, in this embodiment, since no nozzle array 25 is formed on the first nozzle plate 161, the possibility of printing images more efficiently can be increased.

[0071] The liquid jet head 100 of this embodiment described above includes: a liquid flow channel 50, which includes a plurality of nozzles 22 constituting a nozzle array 25; a dummy flow channel 56, which includes a plurality of dummy nozzles 23 constituting a dummy nozzle array 26; and a sealing portion 101, which is made of an adhesive and seals the dummy flow channel 56. Therefore, since the sealing portion 101 can be formed by an adhesive, the liquid jet head 100 having the sealed dummy flow channel 56 can be manufactured at a low cost.

[0072] Furthermore, in this embodiment, the sealing section 101 is positioned upstream of the dummy common liquid chamber 63. Therefore, the dummy flow channel 56 can be sealed without having the sealing section 101 individually installed to correspond to multiple dummy independent flow channels positioned downstream of the dummy common liquid chamber 63.

[0073] Furthermore, in this embodiment, a first adhesive portion 102 is provided between the first flow channel component having the first dummy portion 53 and the second flow channel component having the second dummy portion 54, to join the first flow channel component and the second flow channel component together, and the first adhesive portion 102 forms a sealing portion 101. Therefore, when manufacturing the liquid injection head 100, the first flow channel component and the second flow channel component can be joined together by an adhesive, and the sealing portion 101 can be easily formed between the first flow channel component and the second flow channel component.

[0074] Furthermore, in this embodiment, a portion of the dummy common liquid chamber 63 is defined by the first flow channel component. In this manner, for example, compared to the case where the dummy common liquid chamber 63 is defined only by a component separate from the first flow channel component, the volume of the dummy flow channel 56 from the dummy nozzle 23 to the sealing portion 101 can be reduced. Therefore, since negative pressure is less likely to be generated in the dummy flow channel 56 during suction cleaning, liquid can be effectively drawn from the liquid flow channel 50, thus improving the suction cleaning effect. Additionally, for example, even if the entire dummy common liquid chamber 63 is defined by the first flow channel component, the volume of the dummy flow channel 56 from the dummy nozzle 23 to the sealing portion 101 can still be reduced. In other words, if at least a portion of the dummy common liquid chamber 63 is defined by the first flow channel component, the volume of the dummy flow channel 56 from the dummy nozzle 23 to the sealing portion 101 can be reduced, thereby improving the suction cleaning effect.

[0075] Furthermore, in this embodiment, the sealing portion 101 is provided in the portion of the dummy flow channel 56 that extends along the Z direction, which is the lamination direction. Therefore, compared to the case where the sealing portion 101 is provided in the portion of the dummy flow channel 56 that extends along a direction intersecting the lamination direction, the amount of adhesive required to seal the dummy flow channel 56 can be reduced. Thus, the time or cost required for sealing the dummy flow channel 56 during the manufacture of the liquid injection head 100 can be reduced.

[0076] Furthermore, in this embodiment, a third adhesive portion 104, made of an adhesive, is provided to join the second and third flow channel components together between the third flow channel component having the first portion 51 and the second flow channel component having the second portion 52. The third adhesive portion 104 forms a second connecting flow channel 62 that connects the first portion 51 and the second portion 52 together. Therefore, when manufacturing the liquid injection head 100, the third adhesive portion 104, the second connecting flow channel 62, the first adhesive portion 102, and the sealing portion 101 can be formed together using an adhesive. Thus, the third adhesive portion 104, the second connecting flow channel 62, the first adhesive portion 102, and the sealing portion 101 can be formed using substantially the same process as with an adhesive, simplifying the process for forming the sealing portion 101. For example, if the process of forming the first adhesive portion 102 and the sealing portion 101 by applying adhesive between the first flow channel component and the second flow channel component is designated as the first process, and the process of forming the third adhesive portion 104 and the second connecting flow channel 62 by applying adhesive between the second flow channel component and the third flow channel component is designated as the second process, then the first process can be designed as a process in which the amount of adhesive applied is increased compared to the second process in order to form the sealing portion 10 by applying adhesive between the flow channel corresponding to the first dummy portion 53 and the flow channel corresponding to the second dummy portion 54. In this way, the first and second processes can be designed as substantially the same processes, and the process for forming the sealing portion 101 can be simplified.

[0077] Furthermore, in this embodiment, a plurality of head chips 150 and a holder 200 holding the plurality of head chips 150 and having a second flow channel component are included. Each head chip 150 includes at least a head chip 150 having a first flow channel component and a nozzle plate 160 with a dummy nozzle array 26, and a head chip 150 having a third flow channel component and a nozzle plate 160 with a nozzle array 25. Therefore, when manufacturing the liquid injection head 100, the holder 200 and each head chip 150 can be bonded together by an adhesive, forming a sealing portion 101 or a second connecting flow channel 62.

[0078] Furthermore, in this embodiment, a plurality of dummy nozzle rows 26 are formed adjacent to each other in the nozzle plate 160 of the head chip 150 having the first flow channel component. Therefore, the possibility of effectively performing printing using the liquid jet head 100 can be increased.

[0079] Furthermore, in this embodiment, no nozzle array 25 is formed in the nozzle plate 160 of the head chip 150 having the first flow channel component. Therefore, the possibility of effectively performing printing using the liquid jet head 100 can be increased.

[0080] Furthermore, in this embodiment, the total number of nozzle hole rows 24 formed in the nozzle plates 160 of each head chip 150 is a common number, and the liquid injection head 100 as a whole has more than one common number of dummy nozzle rows 26. Therefore, compared to the case where the number of nozzle rows 25 is reduced by decreasing the number of head chips 150, it is easier to make individual components such as the fixing plate 250 or the cover 110 common to the individual components of a liquid injection head that does not have dummy flow channels 56. Therefore, the liquid injection head 100 can be manufactured at a low cost.

[0081] Furthermore, in this embodiment, the multiple head chips 150 each have a common structure. Therefore, the cost required to manufacture the multiple head chips 150 can be reduced.

[0082] Furthermore, in this embodiment, the dummy flow channel 56 includes a dummy filter chamber 44 disposed upstream of the sealing section 101. In this manner, compared to the case where the dummy filter chamber 44 is disposed downstream of the sealing section 101, the volume of the dummy flow channel 56 from the dummy nozzle 23 to the sealing section 101 can be reduced. Therefore, since negative pressure is less likely to be generated in the dummy flow channel 56 during suction cleaning and liquid can be effectively drawn from the liquid flow channel 50, the suction cleaning effect can be improved.

[0083] Furthermore, the liquid jetting device 300 in this embodiment includes a cover 110, which is configured to cover at least a portion of the jetting surface 19, thereby forming a closed space CL between the cover 110 and the jetting surface 19, opening to both the nozzle 22 and the dummy nozzle 23. Therefore, even when the cover 110, which is used instead of a liquid jetting head without the dummy flow channel 56, covers both the nozzle 22 and the dummy nozzle 23 openings through the common closed space CL, the dummy flow channel 56 is blocked by the blocking portion 101, thus preventing negative pressure from being generated in the dummy flow channel 56 during suction cleaning via the blocking space CL. Therefore, suction cleaning of the liquid flow channel 50 can be effectively performed without remanufacturing a cover 110 that only covers the nozzle 22 and not the dummy nozzle 23.

[0084] B. Second implementation method:

[0085] Figure 7This is a schematic cross-sectional view illustrating the general structure of the liquid injection head 100b in the second embodiment. In this embodiment, unlike the first embodiment, a first portion 51 is formed in the first housing portion 194b, which corresponds to the first flow channel component, in addition to the first dummy portion 53. Furthermore, the liquid injection head 100b includes a second adhesive portion 103, which will be described later. The parts of the structure of the liquid injection device 300 and the liquid injection head 100b in the second embodiment that are not specifically described are the same as in the first embodiment.

[0086] In this embodiment, the chip channel 30 located in the +Y direction among the two chip channels 30 formed on the first head chip 151b corresponds to a portion of the dummy channel 56, and the chip channel 30 located in the -Y direction corresponds to a portion of the liquid channel 50. Similarly, the chip channel 30 located in the +Y direction in the first channel 31 formed in the first housing portion 194b, which corresponds to the first channel component, corresponds to the first dummy portion 53, and the chip channel 30 located in the -Y direction corresponds to the first portion 51. In the first nozzle plate 161b of the first head chip 151b in this embodiment, unlike the first embodiment, a dummy nozzle array 26 and a nozzle array 25 communicating with the first portion 51 formed in the first housing portion 194b are formed. In this embodiment, the dummy nozzle array 26 and the nozzle array 25 are each formed in one row in the first nozzle plate 161b. In the first nozzle plate 161b, the dummy nozzle array 26 is formed in the +Y direction of the nozzle array 25.

[0087] In this embodiment, the second head chip 152b has the same structure as the first head chip 151b. More specifically, the second head chip 152b is a structure obtained by swapping the configurations of the chip flow channel 30, which corresponds to a part of the dummy flow channel 56, and the chip flow channel 30, which corresponds to a part of the liquid flow channel 50, in the first head chip 151b. That is, similarly to the first housing portion 194b, the second housing portion 195b corresponds to the first flow channel component. Furthermore, a dummy nozzle array 26 and a nozzle array 25 are formed in the second nozzle plate 162b. The structure of the third head chip 153 is the same as in the first embodiment. Therefore, in this embodiment, one dummy nozzle array 26 is provided in each of the nozzle orifice arrays 24 in the -Y direction and the +Y direction.

[0088] The second adhesive portion 103 is a portion made of adhesive that joins the first flow channel component and the second flow channel component together. The second adhesive portion 103 forms a first connecting flow channel 61 connecting the first portion 51 and the second portion 52 formed in the first flow channel component. Similar to the first adhesive portion 102, the second adhesive portion 103 is made of, for example, a silicone-based adhesive or an epoxy-based adhesive.

[0089] In this embodiment, one second adhesive portion 103 is provided between the first outer shell portion 194b, which corresponds to the first flow channel component, and the second outer shell portion 195b, which also corresponds to the first flow channel component, and the flow channel forming portion 245, which corresponds to the second flow channel component. Each second adhesive portion 103 forms a first connecting flow channel 61 that connects the respective first portions 51 formed in the first outer shell portion 194b and the second outer shell portion 195b and the respective second portions 52 formed in the flow channel forming portion 245. In this embodiment, the second adhesive portion 103 and the first connecting flow channel 61 are formed, for example, by the same method as the method for forming the third adhesive portion 104 and the second connecting flow channel 62 described in the first embodiment, when the second layer 220 is laminated onto the first outer shell portion 194b or the second outer shell portion 195b and the two are joined.

[0090] Even with the liquid jet head 100b according to the second embodiment described above, since the sealing portion 101 can be formed by an adhesive, the liquid jet head 100 having the sealed dummy flow channel 56 can be manufactured at low cost. In particular, in this embodiment, a second adhesive portion 103 is provided, which is formed by an adhesive and joins the first flow channel component and the second flow channel component, where a first portion 51 is formed and a second flow channel component is formed, to form a first connecting flow channel 61 that connects the first portion 51 formed in the first flow channel component and the second portion 52 formed in the second flow channel component. Thus, when manufacturing the liquid jet head 100b, the second adhesive portion 103, the first connecting flow channel 61, the first adhesive portion 102, and the sealing portion 101 can be formed together by an adhesive. Therefore, even when the first dummy portion 53 and the first portion 51 are formed in the first flow channel component, the second adhesive portion 103, the first connecting flow channel 61, the first adhesive portion 102, and the sealing portion 101 can be formed using substantially the same process as the adhesive, and the process for forming the sealing portion 101 can be simplified. For example, if the process of forming the first adhesive portion 102 and the sealing portion 101 by applying adhesive between the first flow channel component and the second flow channel component is designated as the first process, and the process of forming the second adhesive portion 103 and the first connecting flow channel 61 by similarly applying adhesive is designated as the third process, then the first process can be designated as a process in which the amount of adhesive applied is increased compared to the third process in order to form the sealing portion 101 by applying adhesive between the flow channel corresponding to the first dummy portion 53 and the flow channel corresponding to the second dummy portion 54. In this way, the first process and the third process can be designated as substantially the same process, and the process for forming the sealing portion 101 can be simplified.

[0091] Furthermore, in this embodiment, a plurality of head chips 150 and a holder 200 for holding the plurality of head chips 150 and having a second flow channel component are included. Each head chip 150 has at least a first flow channel component and a nozzle plate 160 having a nozzle array 25 and a dummy nozzle array 26 formed thereon. Therefore, when manufacturing the liquid injection head 100b, the holder 200 and each head chip 150 can be bonded together by an adhesive to form a sealing portion 101 or a first connecting flow channel 61.

[0092] C. Third implementation method:

[0093] Figure 8This is a schematic cross-sectional view illustrating the general structure of the liquid injection head 100c in the third embodiment. In this embodiment, unlike the first embodiment, the liquid injection head 100c has a first confluence portion where two dummy flow channels converge. In this embodiment, the dummy filter chamber 44b corresponds to the first confluence portion. The parts of the structure of the liquid injection device 300 and the liquid injection head 100c in the third embodiment that are not specifically described are the same as in the first embodiment.

[0094] In the liquid injection head 100c of this embodiment, a first dummy flow channel 57 and a second dummy flow channel 58 are provided as dummy flow channels. The first dummy flow channel 57 refers to a dummy flow channel including a plurality of dummy nozzles 23 constituting a first dummy nozzle array 27 as a dummy nozzle array. The second dummy flow channel 58 refers to a dummy flow channel including a plurality of dummy nozzles 23 constituting a second dummy nozzle array 28 as a dummy nozzle array.

[0095] In the liquid injection head 100c of this embodiment, eight first flow channels 31 are provided, similar to those in the first embodiment. However, in this embodiment, the second flow channels 32b are not provided in a one-to-one correspondence with the first flow channels 31; instead, one second flow channel 32b is provided for every two first flow channels 31. More specifically, in the flow channel forming portion 245b of the retainer 200b in this embodiment, four second flow channels 32b that branch off midway are provided. Each second flow channel 32b communicates with its corresponding two first flow channels 31. In this embodiment, the second flow channel 32b located most towards the +Y direction corresponds to the second dummy portion 54 in the first dummy flow channel 57 and the second dummy portion 58. Furthermore, the three second flow channels 32b other than the second dummy portion 54 correspond to the second portion 52 in the liquid flow channel 50.

[0096] In the fourth layer 240b of the flow channel forming section 245b in this embodiment, each pair of first flow channels 31 is provided with a connecting section 241, a fourth retainer flow channel 36, and a third retainer flow channel 35. In the third layer 230b, each pair of first flow channels 31 is provided with a second retainer flow channel 34. In the second layer 220b, a branching flow channel 37 is provided to connect the second retainer flow channel 34 and the two first flow channels 31. The branching flow channel 37 is branched into two branches within a first space 41b formed at the upper end of the branching flow channel 37, and each branched flow channel is connected to a first flow channel 31. Similar to the first embodiment, the second space 42 of the first space 41b and the second retainer flow channel 34b forms a filter chamber 40b.

[0097] In this embodiment, the chip channel 30 located in the +Y direction, which is disposed in the chip channel 30 on the first head chip 151c, corresponds to a portion of the first dummy channel 57, and the chip channel 30 located in the -Y direction corresponds to a portion of the second dummy channel 58. In this embodiment, a first dummy nozzle array 27 and a second dummy nozzle array 28 are formed as dummy nozzle arrays in the first nozzle plate 161c of the first head chip 151c. Furthermore, a first dummy portion 53A of the first dummy channel 57 and a first dummy portion 53B of the second dummy channel 58 are formed in the first housing portion 194c, which corresponds to the first channel component. Furthermore, the structures of the second head chip 152 and the third head chip 153 in this embodiment are the same as in the first embodiment.

[0098] The first dummy flow channel 57 and the second dummy flow channel 58 converge in the dummy filter chamber 44b, which corresponds to the first confluence section described above. In this embodiment, the filter chamber 40b in the second flow channel 32b, which communicates with the first dummy nozzle array 27 and the second dummy nozzle array 28, and the portion located upstream of the filter chamber 40b, are common to both the first dummy flow channel 57 and the second dummy flow channel 58. That is, the portion of the first dummy flow channel 57 and the second dummy flow channel 58 located upstream of the first confluence section is part of both the first dummy flow channel 57 and the second dummy flow channel 58.

[0099] In the liquid injection head 100c, a first sealing part 106 for sealing the first dummy flow channel 57 and a second sealing part 107 for sealing the second dummy flow channel 58 are provided as sealing parts. Similar to the sealing part 101 in the first embodiment, the first sealing part 106 and the second sealing part 107 in this embodiment are formed by a first adhesive part 102. Figure 8 As shown, the first blocking part 106 and the second blocking part 107 are respectively arranged in the first dummy flow channel 57 and the second dummy flow channel 58 at a downstream position compared to the dummy filter chamber 44b, which is the first confluence part.

[0100] According to the liquid jet head 100c of the third embodiment described above, the first blocking part 106 that blocks the first dummy flow channel 57 and the second blocking part 107 that blocks the second dummy flow channel 58 are disposed downstream of the first confluence part where the first dummy flow channel 57 and the second dummy flow channel 58 converge. In this manner, compared to the case where each blocking part is disposed upstream of the first confluence part, the flow channel length of the dummy flow channel from each blocking part to each dummy nozzle array can be shortened. Therefore, since negative pressure is less likely to be generated in each dummy flow channel during suction cleaning, and liquid can be effectively drawn from the liquid flow channel 50, the suction cleaning effect can be improved.

[0101] D. Fourth Implementation Method:

[0102] Figure 9 This is a schematic cross-sectional view illustrating the general structure of the liquid injection head 100d in the fourth embodiment. In this embodiment, unlike the third embodiment, the first dummy portion 53B of the second dummy flow channel 58 is not provided in the first housing portion 194d of the first head chip 151d, but is provided in the first dummy portion 53B of the second dummy flow channel 58 in the second housing portion 195c of the second head chip 152c. The first housing portion 194d and the second housing portion 195c each correspond to a first flow channel component. Furthermore, the second dummy nozzle array 28 is not formed in the first nozzle plate 161d, but rather in the second nozzle plate 162c. The parts of the liquid injection device 300 and the liquid injection head 100d in the fourth embodiment that are not specifically described are the same as in the third embodiment.

[0103] In this embodiment, the chip channel 30 located in the +Y direction within the chip channel 30 on the first head chip 151d corresponds to a portion of the first dummy channel 57, and the chip channel 30 located in the -Y direction corresponds to a portion of the liquid channel 50. Furthermore, the chip channel 30 located in the +Y direction within the chip channel 30 on the second head chip 152c corresponds to a portion of the liquid channel 50, and the chip channel 30 located in the -Y direction corresponds to a portion of the second dummy channel 58. In the first nozzle plate 161d and the second nozzle plate 162c, in addition to the first dummy nozzle array 27 or the second dummy nozzle array 28 described above, a nozzle array 25 is also formed. Furthermore, in the first housing portion 194d and the second housing portion 195c, in addition to the first dummy portion 53A or the first dummy portion 53B, a first portion 51 of the liquid channel 50 is also formed.

[0104] In this embodiment, the retainer 200c has a flow channel forming portion 245c. Unlike the third embodiment, the bifurcated flow channel 37b formed in the second layer 220c of the flow channel forming portion 245c does not bifurcate at the filter chamber 40, but rather at a bifurcation point 38. The bifurcation point 38 is located in the second flow channel 32c, closer to the nozzle orifice row 24 than the first space 41. Furthermore, although in Figure 9In this embodiment, a portion of the second flow channel 32c, excluding the second flow channel 32c connected to the first dummy nozzle array 27 and the second dummy nozzle array 28, is omitted, but each second flow channel 32c is connected to any first flow channel 31. In this embodiment, the bifurcation point 38 in the second flow channel 32c connected to the first dummy nozzle array 27 and the second dummy nozzle array 28 corresponds to the first confluence portion. In this embodiment, the second flow channel 32c connected to the first dummy nozzle array 27 and the second dummy nozzle array 28 corresponds to the second dummy portion 54. The first blocking portion 106 and the second blocking portion 107 are respectively arranged downstream of the bifurcation point 38, which is the first confluence portion, in the same manner as in the third embodiment.

[0105] Even with the liquid jet head 100d according to the fourth embodiment described above, compared to the case where each sealing part is positioned upstream of the first confluence part, the flow path length of the dummy flow path from each sealing part to each dummy nozzle array 26 can be shortened. Therefore, since negative pressure is less likely to be generated in each dummy flow path during suction cleaning, and liquid can be effectively drawn from the liquid flow path 50, the suction cleaning effect can be improved.

[0106] E. Fifth implementation method:

[0107] Figure 10 This is a schematic cross-sectional view illustrating the general structure of the liquid injection head 100e in the fifth embodiment. In this embodiment, unlike the third embodiment, the liquid injection head 100e does not have a first confluence section, but instead has a second confluence section where a dummy flow channel 56 and a liquid flow channel 50 converge. The parts of the liquid injection device 300 and the liquid injection head 100e in the fifth embodiment that are not specifically described are the same as in the third embodiment.

[0108] The structure and configuration of each head chip 150 in this embodiment are the same as in the second embodiment. In this embodiment, the filter chamber 40b of the second flow channel 32b, which communicates with the nozzle array 25 and the dummy nozzle array 26, corresponds to the second confluence section described above. The sealing section 101 is disposed downstream of the second confluence section in the dummy flow channel 56. In addition, in this embodiment, the liquid reservoir 310 is connected to all four connecting sections 241 provided in the fourth layer 240b. Therefore, liquid flows in the portion of the dummy flow channel 56 upstream of the sealing section 101. Furthermore, the filter chamber 40b in the second flow channel 32b, which communicates with the nozzle array 25 and the dummy nozzle array 26, and the portion located upstream of the filter chamber 40b, are common to the liquid flow channel 50 and the dummy flow channel 56 where the liquid converges within the filter chamber 40b. The filter chamber 40b, which serves as the second confluence section, functions as a dummy filter chamber in the dummy flow channel 56.

[0109] According to the liquid jet head 100e of the fifth embodiment described above, the blocking part 101 is disposed downstream of the second confluence part where the dummy flow channel 56 and the liquid flow channel 50 converge. Therefore, by using the blocking part 101 to block a portion of the multiple confluenced flow channels, it is possible to manufacture a liquid jet head 100e having the dummy flow channel 56.

[0110] F. Other implementation methods:

[0111] (F-1) In the above embodiment, the first housing portion 194 of the first head chip 151 corresponds to the first flow channel component, and the flow channel forming portion 245 of the holder 200 corresponds to the second flow channel component. Conversely, the components corresponding to the first flow channel component and the second flow channel component may not be the first housing portion 194 and the flow channel forming portion 245, respectively. For example, the first nozzle plate 161 may be the component corresponding to the first flow channel component, and the connecting plate 180 stacked on the first nozzle plate 161 may be the component corresponding to the second flow channel component. In this case, the dummy nozzle 23 of the first nozzle plate 161 corresponds to the first dummy portion, the nozzle connecting channel 181 of the first head chip 151 corresponds to the second dummy portion, the nozzle 22 of the second nozzle plate 162 corresponds to the first portion, and the nozzle connecting channel 181 of the second head chip 152 corresponds to the second portion. Furthermore, the first adhesive portion 102 and the sealing portion 101 are disposed between the first nozzle plate 161 and the connecting plate 180. Furthermore, for example, the second layer 220 of the flow channel forming portion 245 may be a component corresponding to the first flow channel component, and the third layer 230 may be a component corresponding to the second flow channel component. In this case, the first cage flow channel 33 communicating with the dummy nozzle 23 corresponds to the first dummy portion, and the second cage flow channel 34 communicating with the first cage flow channel 33 communicating with the dummy nozzle 23 corresponds to the second dummy portion. Additionally, in this case, the first cage flow channel 33 communicating with the nozzle 22 corresponds to the first portion 51, and the second cage flow channel 34 communicating with the first cage flow channel 33 communicating with the nozzle 22 corresponds to the second portion. Furthermore, the first adhesive portion 102 and the sealing portion 101 are disposed between the second layer 220 and the third layer 230.

[0112] (F-2) In the above embodiment, the first adhesive portion 102 is formed into a sealing portion 101. In contrast, the first adhesive portion 102 may not be formed into a sealing portion 101. For example, the sealing portion 101 may be provided in a portion other than between the stacked components, or it may be provided on the lower surface of the nozzle plate 160, or in the nozzle orifice 21, the pressure generating chamber 187, the second manifold portion 183, the liquid chamber portion 197, the first retainer flow channel 33, etc.

[0113] (F-3) In the above embodiment, the blocking portion 101 is provided in the portion of the dummy flow channel 56 that extends along the Z direction, which is the stacking direction. In contrast, the blocking portion 101 may not be provided in the portion of the dummy flow channel 56 that extends along the stacking direction, for example, it may be provided in the portion that extends along the X or Y direction, which is a direction perpendicular to the stacking direction.

[0114] (F-4) In the above embodiment, the sealing part 101 is disposed upstream of the virtual common liquid chamber 63 in the virtual flow channel 56. In contrast, the sealing part 101 may not be disposed upstream of the virtual common liquid chamber 63; for example, it may be disposed either in the virtual common liquid chamber 63 or downstream of the virtual common liquid chamber 63.

[0115] (F-5) In the above embodiment, at least a portion of the dummy common liquid chamber 63 is defined by the first flow channel component. In contrast, the dummy common liquid chamber 63 may also be defined without the first flow channel component. For example, the first outer shell portion 194, which corresponds to the first flow channel component, may not define the dummy common liquid chamber 63, but rather the common liquid chamber portion 60 may be defined only by the connecting plate 180, which has a portion of the dummy flow channel 56 that is downstream of the first dummy portion 53.

[0116] (F-6) In the above embodiment, the liquid injection head 100 has a number of dummy nozzle rows 26 formed in the nozzle orifice rows 24 of each nozzle plate 160, which is more than the common number of rows. In contrast, the number of dummy nozzle rows 26 provided by the liquid injection head 100 may be more than one and less than the common number of rows.

[0117] (F-7) In the above embodiment, each head chip 150 has a common structure. In contrast, the head chips 150 may not have a common structure with each other.

[0118] (F-8) In the above embodiment, the dummy filter chamber 44 is disposed upstream of the blocking portion 101 in the dummy flow channel 56. Conversely, the dummy filter chamber 44 may not be disposed upstream of the blocking portion 101; for example, it may be disposed downstream of the blocking portion 101, or the blocking portion 101 may be disposed within the dummy filter chamber 44. Furthermore, the dummy flow channel 56 may not have the dummy filter chamber 44.

[0119] (F-9) In the above embodiment, in the first confluence section, two dummy channels 56 converge. Conversely, in the first confluence section, for example, three or more dummy channels 56, or two or more dummy channels 56 and one or more liquid channels 50 may converge. Furthermore, similarly, in the second confluence section, for example, in addition to one liquid channel 50 and one dummy channel 56, there may be further other liquid channels 50 or dummy channels 56 confluencing.

[0120] (F-10) In the above embodiment, two rows of nozzle holes 24 are formed in each nozzle plate 160. In contrast, each nozzle plate 160 may have only one row of nozzle holes 24 or more rows of nozzle holes 24.

[0121] (F-11) In the above embodiment, the liquid injection head 100 has four head chips 150. In contrast, the liquid injection head 100 may have three or fewer head chips 150 or more head chips 150.

[0122] (F-12) In the above embodiment, a nozzle orifice array 24 is provided for one liquid flow channel 50 or dummy flow channel 56. Conversely, for example, a nozzle orifice array 24 may be provided for multiple liquid flow channels 50 or multiple dummy flow channels 56. In this case, for example, some of these multiple liquid flow channels 50 may function as supply channels for supplying liquid to the nozzle array 25, and other liquid flow channels 50 may function as recovery channels for recovering liquid from the nozzle array 25 toward the liquid reservoir 310. That is, a circulation channel for circulating liquid may also be formed using multiple liquid flow channels 50.

[0123] G. Other methods:

[0124] This disclosure is not limited to the embodiments described above, and can be implemented in various ways without departing from its spirit. For example, this disclosure can also be implemented in the following ways. In order to solve part or all of the problems of this disclosure, or in order to achieve part or all of the effects of this disclosure, the technical features in the above embodiments corresponding to the technical features in the various methods described below can be appropriately replaced or combined. Furthermore, as long as the technical feature is not described as an essential feature in this specification, it can be appropriately deleted.

[0125] (1) According to a first aspect of the present disclosure, a liquid injection head is provided. The liquid injection head includes: a liquid flow channel including a plurality of nozzles constituting a nozzle array for injecting liquid; a dummy flow channel including a plurality of dummy nozzles constituting a dummy nozzle array for not injecting liquid; and a sealing portion made of an adhesive for sealing the dummy flow channel.

[0126] In this way, since the sealing part can be formed by adhesive, it is possible to manufacture liquid jet heads with sealed dummy flow channels at low cost.

[0127] (2) In the liquid injection head described above, the following arrangement can also be adopted: the dummy flow channel has a dummy common liquid chamber, which is connected to the plurality of dummy nozzles constituting the dummy nozzle array, and the sealing portion is disposed upstream of the dummy common liquid chamber. According to this arrangement, the dummy flow channel can be sealed even when a sealing portion is separately provided downstream of the dummy common liquid chamber without corresponding to the plurality of dummy nozzle arrays.

[0128] (3) In the liquid injection head described above, it may also be constructed as follows: a first flow channel component having a first dummy portion formed as part of the dummy flow channel; a second flow channel component having a second dummy portion formed as part of the dummy flow channel and located upstream of the first dummy portion, and stacked on the first flow channel component; and a first adhesive portion made of an adhesive, which joins the first flow channel component and the second flow channel component together, the first adhesive portion forming the sealing portion. According to this method, when manufacturing the liquid injection head, the first flow channel component and the second flow channel component can be joined together by an adhesive, and a sealing portion can be easily formed between the first flow channel component and the second flow channel component.

[0129] (4) In the liquid jet head described above, at least a portion of the dummy common liquid chamber can be defined by the first flow channel component. According to this method, for example, compared to the case where the dummy common liquid chamber is defined only by a component separate from the first flow channel component, the volume of the dummy flow channel from the dummy nozzle to the sealing portion can be reduced. Therefore, since negative pressure is less likely to be generated in the dummy flow channel during suction cleaning, and liquid can be effectively drawn from the liquid flow channel, the suction cleaning effect can be improved.

[0130] (5) In the liquid jet head described above, the sealing portion can also be provided at a portion extending along the stacking direction of the first and second flow channel components within the dummy flow channel. According to this method, compared to providing the sealing portion at a portion extending along a direction intersecting the stacking direction within the dummy flow channel, the amount of adhesive required to seal the dummy flow channel can be reduced. Therefore, the time or cost required for sealing the dummy flow channel during the manufacture of the liquid jet head can be reduced.

[0131] (6) In the liquid injection head described above, it is also possible to employ the following method: a first portion is formed in the first flow channel component, the first portion being a part of the liquid flow channel; a second portion is formed in the second flow channel component, the second portion being a part of the liquid flow channel and located further away from the nozzle array than the first portion in the liquid flow channel; the liquid injection head further includes a second adhesive portion, the second adhesive portion being made of an adhesive, which joins the first flow channel component and the second flow channel component together; the second adhesive portion forms a first connecting flow channel connecting the first portion and the second portion. According to this method, when manufacturing the liquid injection head, the second adhesive portion, the first connecting flow channel, and the first adhesive portion and the sealing portion can be formed together using an adhesive. Therefore, even when a first dummy portion and the first portion are formed in the first flow channel component, the second adhesive portion, the first connecting flow channel, and the first adhesive portion and the sealing portion can be formed using approximately the same process as the adhesive, and the process for forming the sealing portion can be simplified.

[0132] (7) In the liquid injection head described above, it is also possible to employ a third flow channel component, which has a first portion formed as part of the liquid flow channel. A second flow channel component is stacked on the first and third flow channel components. A second portion is formed in the second flow channel component, which is part of the liquid flow channel and is located further away from the nozzle array than the first portion in the liquid flow channel. The liquid injection head also includes a third adhesive portion, which is made of an adhesive and joins the second and third flow channel components together. The third adhesive portion forms a second connecting flow channel that connects the first and second portions. According to this method, when manufacturing the liquid injection head, the third adhesive portion, the second connecting flow channel, the first adhesive portion, and the sealing portion can be formed together using an adhesive. Therefore, the third adhesive portion, the second connecting flow channel, the first adhesive portion, and the sealing portion can be formed using approximately the same process as the adhesive, and the process for forming the sealing portion can be simplified.

[0133] (8) In the liquid injection head described above, it is also possible to employ the following configuration: a plurality of head chips, each having a nozzle plate on which at least one of the nozzle array and the dummy nozzle array is formed; a retainer holding the plurality of head chips and having a second flow channel component, wherein the head chip has at least the first flow channel component and the nozzle plate on which the nozzle array communicating with the first portion and the dummy nozzle array communicating with the first dummy portion are formed. According to this configuration, when manufacturing the liquid injection head, the retainer and the individual head chips can be bonded together by an adhesive to form a sealing portion or a first connecting flow channel.

[0134] (9) In the liquid jet head of the above manner, it is also possible to employ the following method: a plurality of head chips, each having a nozzle plate on which at least one of the nozzle array and the dummy nozzle array is formed; a retainer holding the plurality of head chips and having a second flow channel component, wherein the head chip has at least one head chip having the first flow channel component and the nozzle plate on which the dummy nozzle array is formed communicating with the first dummy portion, and a head chip having the third flow channel component and the nozzle plate on which the nozzle array is formed communicating with the first portion. According to this method, when manufacturing the liquid jet head, the retainer and each head chip can be joined together by an adhesive to form a sealing portion or a second connecting flow channel.

[0135] (10) In the liquid jet head described above, it is also possible to employ a plurality of dummy flow channels, wherein a plurality of dummy nozzle arrays are formed adjacent to each other in the nozzle plate of the head chip having the first flow channel component. According to this method, the possibility of effectively printing images using the liquid jet head can be increased.

[0136] (11) In the liquid jet head described above, it is also possible to employ an arrangement in which the nozzle array is not formed in the nozzle plate of the head chip having the first flow channel component. This arrangement increases the possibility of effectively printing images using the liquid jet head.

[0137] (12) In the liquid injection head described above, it is also possible to employ a configuration where the total number of nozzle rows and dummy nozzle rows formed in the nozzle plates of each of the head chips is a common number, and the liquid injection head includes more than the common number of dummy nozzle rows. According to this configuration, compared to the case where the number of nozzle rows is reduced by decreasing the number of head chips, it is easier to standardize the components constituting a liquid injection head without dummy flow channels and the components constituting a liquid injection head with dummy flow channels. Therefore, it is possible to manufacture the liquid injection head at a low cost.

[0138] (13) In the liquid injection head described above, it is also possible to adopt an arrangement in which multiple head chips each have a common structure. This arrangement reduces the cost required to manufacture multiple head chips.

[0139] (14) In the liquid jet head described above, the dummy flow channel may also include a dummy filter chamber located upstream of the sealing section and containing a filter. This configuration allows for efficient liquid extraction from the liquid flow channel during suction cleaning, thus improving the cleaning effect.

[0140] (15) In the liquid jet head described above, it is also possible to employ a configuration whereby a first dummy flow channel and a second dummy flow channel are provided as the dummy flow channels. The first dummy flow channel includes a plurality of dummy nozzles constituting a first dummy nozzle array, and the second dummy flow channel includes a plurality of dummy nozzles constituting a second dummy nozzle array. The sealing portion includes a first sealing portion for sealing the first dummy flow channel and a second sealing portion for sealing the second dummy flow channel. The liquid jet head also includes a first confluence portion where the first dummy flow channel and the second dummy flow channel converge. The first sealing portion and the second sealing portion are positioned downstream of the first confluence portion. According to this configuration, compared to the case where each sealing portion is positioned upstream of the first confluence portion, the flow channel length of the dummy flow channel from each sealing portion to each dummy nozzle array can be shortened. Therefore, since negative pressure is not easily generated in each virtual flow channel during suction cleaning, and liquid can be effectively drawn from the liquid flow channel, the suction cleaning effect can be improved.

[0141] (16) In the liquid jet head of the above-described manner, it is also possible to employ a second confluence section that includes the dummy flow channel and the liquid flow channel converging, with the blocking section disposed downstream of the second confluence section. According to this method, a liquid jet head having a dummy flow channel can be manufactured by blocking a portion of the multiple converging flow channels using the blocking section.

[0142] (17) According to a second aspect of the present disclosure, a liquid injection device is provided. The liquid injection device includes: a liquid injection head of the first aspect described above; and a liquid storage section for storing liquid supplied to the liquid injection head.

[0143] (18) In the liquid jetting device described above, the liquid jetting head may also be configured such that the liquid jetting head has a nozzle surface on which openings for each of the nozzles constituting the nozzle array and openings for each of the dummy nozzles constituting the dummy nozzle array are formed. The liquid jetting device further includes a cover configured to cover at least a portion of the jetting surface, thereby forming a closed space between the cover and the jetting surface through which the openings of each of the nozzles and the dummy nozzles open. According to this configuration, even when a cover transferred from a liquid jetting head without a dummy flow channel covers the openings of the nozzles and the dummy nozzles through a common sealing space, the dummy flow channel is blocked by the sealing portion, thus preventing negative pressure from being generated in the dummy flow channel during suction cleaning. Therefore, suction cleaning of the liquid flow channel can be effectively performed without remanufacturing a cover that only covers the nozzles and not the dummy nozzles.

[0144] Symbol Explanation

[0145] 19…Spray surface; 21…Nozzle orifice; 22…Nozzle; 23…Dummy nozzle; 24…Nozzle orifice array; 25…Nozzle array; 26…Dummy nozzle array; 27…First dummy nozzle array; 28…Second dummy nozzle array; 30…Chip flow channel; 31…First flow channel; 32, 32b, 32c…Second flow channel; 33…First cage flow channel; 34…Second cage flow channel; 35…Third cage flow channel; 36…Fourth cage flow channel; 37, 37b…Bifurcation flow channel; 38…Bifurcation point; 40, 40b…Filter chamber; 41, 41b…First space; 42…Second space; 43…Filter; 44, 44b…Dummy filter chamber; 50…Liquid flow channel; 51…First section; 52…Second section; 53… 53A, 53B… First dummy part; 54… Second dummy part; 56… Dummy flow channel; 57… First dummy flow channel; 58… Second dummy flow channel; 60… Common liquid chamber section; 61… First connecting flow channel; 62… Second connecting flow channel; 63… Dummy common liquid chamber; 100, 100b, 100c, 100d, 100e… Liquid injection head; 101… Sealing part; 102… First adhesive part; 103… Second adhesive part; 104… Third adhesive part; 106… First sealing part; 107… Second sealing part; 110… Cover; 116… Liquid absorbent material; 120… Drive circuit; 121… Wiring board; 130… Suction pump; 150… Head chip; 151, 151b, 151c, 151… d…First head chip; 152, 152b, 152c…Second head chip; 153…Third head chip; 160…Nozzle plate; 161, 161b, 161d…First nozzle plate; 162, 162b, 162c…Second nozzle plate; 170…Chip body; 175…Moldable substrate; 176…Sealing film; 177…Frame component; 180…Connecting plate; 181…Nozzle connecting channel; 182…First manifold; 183…Second manifold; 184…Supply connecting channel; 185…Flow channel forming substrate; 187…Pressure generating chamber; 188…Vibrating plate; 190…Protective substrate; 191…Holding part; 192…Through hole; 193…Outer shell; 194, 194b, 194c… 194d…First outer shell section; 195, 195b, 195c…Second outer shell section; 196…Third outer shell section; 197…Liquid chamber section; 198…Through-in port; 199…Connection port; 200, 200b, 200c…Retainer; 210…First layer; 211…Reservoir space; 212…First storage space; 220, 220b, 220c…Second layer; 230, 230b…Third layer; 240, 240b…Fourth layer; 241…Connection section; 245, 245b, 245c…Flow channel forming section; 250…Fixing plate; 255…Opening section; 280…Piezoelectric actuator; 300…Liquid injection device; 310…Liquid storage section; 320…Head moving mechanism; 321…Drive motor;322…Drive belt; 323…Carriage; 330…Conveying mechanism; 500…Control unit.

Claims

1. A liquid injection head, characterized in that, have: A liquid flow channel, which includes multiple nozzles constituting a nozzle array for injecting liquid; A dummy flow path, which includes multiple dummy nozzles constituting a dummy nozzle array that does not eject liquid; The sealing part, which is made of adhesive, seals the dummy flow channel; A first flow channel component, which has a first dummy portion that is part of the dummy flow channel; A second flow channel component is formed as part of the dummy flow channel and is located upstream of the first dummy portion, and is stacked on the first flow channel component; A first adhesive portion, which is made of adhesive, joins the first flow channel component and the second flow channel component together. The first adhesive portion forms the sealing portion.

2. The liquid injection head as described in claim 1, characterized in that, The virtual flow channel includes a virtual common liquid chamber, which is connected to the plurality of virtual nozzles constituting the virtual nozzle array. The sealing part is positioned upstream of the dummy common liquid chamber.

3. The liquid injection head as described in claim 2, characterized in that, At least a portion of the dummy common liquid chamber is defined by the first flow channel component.

4. The liquid injection head as described in claim 1, characterized in that, The blocking portion is disposed in the portion of the dummy flow channel that extends along the stacking direction of the first flow channel component and the second flow channel component.

5. The liquid injection head as described in claim 1, characterized in that, A first portion is formed in the first flow channel component, and the first portion is part of the liquid flow channel. A second portion is formed in the second flow channel component, the second portion being a part of the liquid flow channel and being located further away from the nozzle array than the first portion within the liquid flow channel. The liquid injection head also includes a second adhesive portion, which is made of adhesive and joins the first flow channel component and the second flow channel component together. The second adhesive portion forms a first connecting channel that connects the first portion and the second portion.

6. The liquid injection head as described in claim 1, characterized in that, It includes a third flow channel component, which has a first portion that is part of the liquid flow channel. The second flow channel component is stacked on top of the first flow channel component and the third flow channel component. A second portion is formed in the second flow channel component, the second portion being a part of the liquid flow channel and being located further away from the nozzle array than the first portion within the liquid flow channel. The liquid injection head also includes a third adhesive portion, which is made of adhesive and joins the second flow channel component and the third flow channel component together. The third adhesive portion forms a second connecting channel that connects the first portion and the second portion.

7. The liquid injection head as described in claim 5, characterized in that, have: Multiple head chips, each having a nozzle plate formed with at least one of the nozzle array and the dummy nozzle array; A retainer that holds the plurality of head chips and has the second flow channel component. As the head chip, the head chip at least includes a nozzle plate having the first flow channel component and a nozzle array formed with the nozzle array communicating with the first portion and the dummy nozzle array communicating with the first dummy portion.

8. The liquid injection head as described in claim 6, characterized in that, have: Multiple head chips, each having a nozzle plate formed with at least one of the nozzle array and the dummy nozzle array; A retainer that holds the plurality of head chips and has the second flow channel component. As the head chip, there are at least two types of head chips: one having a first flow channel component and a nozzle plate having a dummy nozzle array that communicates with the first dummy portion, and the other having a third flow channel component and a nozzle plate having a nozzle array that communicates with the first portion.

9. The liquid injection head as described in claim 8, characterized in that, It has multiple virtual flow channels, In the nozzle plate of the head chip having the first flow channel component, a plurality of dummy nozzle rows are formed adjacent to each other.

10. The liquid injection head as described in claim 8 or 9, characterized in that, The nozzle array is not formed in the nozzle plate of the head chip having the first flow channel component.

11. The liquid injection head as claimed in claim 8, characterized in that, The total number of columns of the nozzle columns and the dummy nozzle columns formed in the nozzle plates of each of the head chips is the common number of columns. The liquid injection head has more than one of the common number of dummy nozzle rows.

12. The liquid injection head as claimed in claim 7, characterized in that, The multiple head chips each have a common structure.

13. The liquid injection head as claimed in claim 1, characterized in that, The dummy flow channel has a dummy filter chamber, which is located upstream of the blocking part and has a filter inside.

14. The liquid injection head as claimed in claim 1, characterized in that, The system comprises a first virtual flow channel and a second virtual flow channel, wherein the first virtual flow channel includes a plurality of virtual nozzles constituting a first virtual nozzle array, and the second virtual flow channel includes a plurality of virtual nozzles constituting a second virtual nozzle array. The blocking unit comprises a first blocking unit for blocking the first dummy flow channel and a second blocking unit for blocking the second dummy flow channel. The liquid injection head also includes a first confluence section where the first dummy flow channel and the second dummy flow channel converge. The first blocking part and the second blocking part are positioned downstream of the first confluence part.

15. The liquid injection head as claimed in claim 1, characterized in that, A second confluence section comprising the dummy flow channel and the liquid flow channel. The blocking part is positioned downstream of the second confluence part.

16. A liquid injection device, characterized in that, have: The liquid injection head according to any one of claims 1 to 15; A liquid storage section for storing the liquid supplied to the liquid jet head.

17. The liquid injection device as claimed in claim 16, characterized in that, The liquid injection head has an injection surface, on which openings for each of the nozzles constituting the nozzle array and openings for each of the dummy nozzles constituting the dummy nozzle array are formed. The liquid injection device also includes a cover, which is configured to cover at least a portion of the injection surface, thereby forming a closed space between the cover and the injection surface for the openings of each of the nozzles and the openings of each of the dummy nozzles.

Images