A charging device and a charging system

Abstract

This application provides a charging device and a charging system, relating to the field of energy technology, to solve the technical problem of poor heat dissipation in charging devices. The charging device provided by this application includes an elastic heat-conducting component and at least two stacked power components. Each power component includes a housing, a liquid-cooled plate, and a circuit board assembly. The housing and liquid-cooled plate form a receiving cavity, and the circuit board assembly is disposed within the receiving cavity and thermally connected to the housing and liquid-cooled plate. Each power component's liquid-cooled plate has a first contact surface, and the housing has a second contact surface. In two adjacent power components, the first contact surface of one power component faces the second contact surface of the other power component. The elastic heat-conducting component is located between the first and second contact surfaces and elastically abuts against them. By using the elastic heat-conducting component, the heat dissipation structures of two adjacent power components can be interdependent, which helps to improve the heat dissipation performance of the charging device.

Description

Technical Field

[0001] This application relates to the field of energy technology, and in particular to a charging device and a charging system. Background Technology

[0002] With the widespread adoption of electric vehicles, the industry's demand for charging equipment (such as charging stations) is increasing. Charging equipment typically includes various types of electrical components, some of which generate significant heat during operation. To ensure the charging equipment operates within its normal temperature range, heat dissipation is usually necessary for these electronic components. Currently, air cooling is commonly used for heat dissipation. Air cooling typically employs fans to generate airflow that quickly passes over the surface of the heat-generating components, thus carrying away the heat. However, this method easily leads to the accumulation of dust and other impurities on the surface of the electronic components, affecting their reliability and lifespan. Furthermore, the noise generated by the fan at high speed is relatively loud, impacting the user's charging experience. Summary of the Invention

[0003] This application provides a charging device and charging system with a simple structure and good heat dissipation efficiency.

[0004] In a first aspect, this application provides a charging device, including a resilient thermally conductive element and at least two stacked power components. Each power component includes a housing, a liquid-cooled plate, and a circuit board assembly. The housing and liquid-cooled plate form a receiving cavity, and the circuit board assembly is disposed within the receiving cavity and thermally connected to both the housing and the liquid-cooled plate. Each power component has a first contact surface on its liquid-cooled plate and a second contact surface on its housing, with the first and second contact surfaces facing away from each other. In two adjacent power components, the first contact surface of one power component faces the second contact surface of the other power component, and the resilient thermally conductive element is located between the first and second contact surfaces and elastically abuts against both the first and second contact surfaces.

[0005] In the charging device provided in this application, a liquid cooling plate is used for heat dissipation in the power components. The outer casing, also made of liquid cooling plate, forms a space to house the circuit board components, improving the airtightness of the circuit board components and preventing external dust, moisture, and other impurities from affecting them, thus enhancing the operational safety and reliability of the charging device. Furthermore, the elastic heat-conducting element is in thermal contact with the power components, allowing heat to dissipate through it, thereby improving the heat dissipation performance of the power components. Since the heat dissipation performance of the liquid cooling plate is generally greater than that of the outer casing, in two adjacent power components, heat from the outer casing of one power component can be transferred to the liquid cooling plate of the other power component through the elastic heat-conducting element, thus improving the overall heat dissipation performance of the charging device.

[0006] In a specific configuration, the circuit board assembly may include a circuit board and electronic components mounted on the circuit board. The circuit board includes a first surface and a second surface that are opposite to each other, with the electronic components located on the first surface.

[0007] In a specific configuration, electronic components can be thermally connected to the liquid cooling plate, enabling the liquid cooling plate to dissipate heat from the electronic components efficiently. The second plate can be thermally connected to the outer casing.

[0008] In one example, the elastic thermal conductive element can be a corrugated sheet. Elastic thermal conductive elements are simple in structure, easy to manufacture, and possess good elasticity.

[0009] In addition, a first air duct is provided between the elastic heat-conducting component and the first contact surface, and a second air duct is provided between the elastic heat-conducting component and the first contact surface. The air flowing through the first and second air ducts can quickly remove heat from the first contact surface, the second contact surface, and the elastic heat-conducting component, which helps to improve the heat dissipation performance of the charging device.

[0010] In one example, the surface of the elastic heat-conducting element facing the first contact surface has at least one third contact portion that abuts against the first contact surface, and the third contact portion can be a plane, thereby helping to increase the contact area between the first contact surface and the elastic heat-conducting element.

[0011] In one example, the surface of the elastic heat-conducting element facing the second contact surface has at least one fourth contact portion that abuts against the second contact surface, and the fourth contact portion is planar, thereby improving the contact area between the second contact surface and the elastic heat-conducting element.

[0012] In one example, the elastic thermal conductive element is made of a shape memory alloy. This element tends to increase the contact area with either the first or second contact surface as the temperature rises. This increases the contact area between the elastic thermal conductive element and the first or second contact surface when the temperature of the first contact surface is high, thus improving heat dissipation from the casing.

[0013] In one example, the charging device may also include a chassis, with power components mounted inside the chassis and removable heat-conducting components mounted inside the chassis, thus providing greater flexibility in use.

[0014] In one example, the flexible thermally conductive element is fixedly connected to the housing or liquid cooling plate, thereby improving the ease of assembling the charging device.

[0015] In one example, the charging device includes a tray, to which a flexible thermally conductive element is fixedly connected. The power component can be secured within the chassis via the tray, and thermal contact with the thermally conductive element can be achieved simultaneously, effectively improving ease of assembly.

[0016] In one example, the charging device may also include a heat sink connected to a liquid cooling plate via liquid cooling pipes for dissipating heat from the liquid cooling plate.

[0017] Secondly, this application also provides a charging system, including a charging terminal and any of the aforementioned charging devices. The charging device has an output port, and the charging terminal is connected to the output port. The electrical energy processed by the charging device can be provided to the charging terminal to replenish the electrical energy of the powered device (such as a vehicle).

[0018] In specific installations, the charging device can be installed on the ground or on a wall, etc. This application does not limit the specific installation location and form of the charging device. Attached Figure Description

[0019] Figure 1 This is a schematic diagram illustrating an application scenario of a charging device provided in an embodiment of this application;

[0020] Figure 2 This is a schematic cross-sectional view of a charging device provided in an embodiment of this application;

[0021] Figure 3 A side view of an elastic thermally conductive component provided in an embodiment of this application;

[0022] Figure 4 This is a cross-sectional structural diagram of a charging device provided in an embodiment of this application;

[0023] Figure 5 A cross-sectional structural diagram of a partial structure of another charging device provided in an embodiment of this application;

[0024] Figure 6 This is a schematic cross-sectional view of another charging device provided in an embodiment of this application;

[0025] Figure 7 A cross-sectional structural diagram of a partial structure of another charging device provided in an embodiment of this application;

[0026] Figure 8 A cross-sectional structural diagram of a partial structure of another charging device provided in an embodiment of this application;

[0027] Figure 9 This is a simplified structural diagram of a charging system provided in an embodiment of this application. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0029] To facilitate understanding of the charging device provided in the embodiments of this application, its application scenarios will be introduced first below.

[0030] like Figure 1 As shown, in one example provided in this application, the charging device 10 can be used to charge an electric vehicle 20. Specifically, the charging device 10 can be a charging pile, and it can be installed near a parking space. In practical applications, the input end of the charging device 10 can be connected to the power grid 30, and the output end of the charging device 10 can be connected to the charging gun 50 via a cable 40 to charge the vehicle 20. The electrical energy in the power grid 30 can be industrial electricity (e.g., AC voltage 380V) or residential electricity (e.g., AC voltage 22V), etc.

[0031] In practical applications, the charging device 10 may have functions such as overload protection and power conversion. The charging device 10 typically includes electronic components such as transistors, transformers, inductors, capacitors, or relays. Some of these electronic components generate heat during normal operation; therefore, heat dissipation is necessary to keep the charging device 10 within its normal operating temperature range.

[0032] Currently, most charging devices use air cooling to dissipate heat. Air-cooled devices typically use fans to generate airflow that quickly passes over the surfaces of electronic components, carrying away heat. However, this method can easily lead to the accumulation of dust and other impurities on the surfaces of electronic components, affecting their reliability and lifespan. Furthermore, the noise generated by the fan at high speeds is relatively loud, impacting the user's charging experience.

[0033] In view of this, embodiments of this application provide a charging device 10 with a simple structure, low cost, and high protection level, as well as a charging system using the charging device 10.

[0034] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” and “the” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one” means one, two, or more.

[0036] References to "one embodiment" and similar terms used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," and "in other embodiments" appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "having," and variations thereof mean "including, but not limited to," unless otherwise specifically emphasized.

[0037] like Figure 2 As shown, in one example provided in this application, the charging device 10 may include a first power component 11a, a second power component 11b, and an elastic heat-conducting element 12. The elastic heat-conducting element 12 is located between the first power component 11a and the second power component 11b, and is in thermally conductive contact with both the first power component 11a and the second power component 11b. In some cases, the heat from the first power component 11a can be dissipated through the elastic heat-conducting element 12 and the second power component 11b, thereby improving the heat dissipation efficiency of the charging device 10. Correspondingly, in some cases, the heat from the second power component 11b can be dissipated through the elastic heat-conducting element 12 and the first power component 11a, thereby improving the heat dissipation efficiency of the charging device 10. In summary, the elastic heat-conducting element 12 can not only effectively dissipate the heat generated by the first power component 11a and the second power component 11b, but also facilitate the transfer of heat between the first power component 11a and the second power component 11b, thereby effectively improving the heat dissipation performance of the charging device 10.

[0038] In addition, in the example provided in this application, both the first power component 11a and the second power component 11b adopt liquid cooling heat dissipation, which has advantages such as high heat dissipation efficiency, good reliability and low noise. This is conducive to ensuring the airtightness of electronic devices and can improve the working stability and service life of the charging device 10.

[0039] Specifically, the first power component 11a includes a first housing 111a, a first liquid cooling plate 112a, and a first circuit board assembly 113a. The first housing 111a and the first liquid cooling plate 112a form a receiving cavity (not shown in the figure), and the first circuit board assembly 113a is disposed within the receiving cavity and is thermally connected to the first housing 111a and the first liquid cooling plate 112a. The first liquid cooling plate 112a has a pipe 1121a, through which a cooling medium can flow to remove heat from the first liquid cooling plate 112a. The second power component 11b includes a second housing 111b, a second liquid cooling plate 112b, and a second circuit board assembly 113b. The second housing 111b and the second liquid cooling plate 112b form a receiving cavity (not shown in the figure), and the second circuit board assembly 113b is disposed within the receiving cavity and is thermally connected to the second housing 111b and the second liquid cooling plate 112b. The second liquid cooling plate 112b has a pipe 1121b, in which the cooling medium can flow to remove the heat from the second liquid cooling plate 112b.

[0040] In the example provided in this application, the structures of the first power component 11a and the second power component 11b are basically the same. The first power component 11a will be used as an example for specific explanation below.

[0041] The first circuit board assembly 113a is located within the space enclosed by the first housing 111a and the first liquid cooling plate 112a, which helps to ensure the airtightness of the first circuit board assembly 113a and prevent external dust, moisture and other impurities from corroding the first circuit board assembly 113a.

[0042] In addition, the first circuit board assembly 113a is thermally connected to the first liquid cooling plate 112a and the first housing 111a. The heat generated by the first circuit board assembly 113a can be dissipated through the first liquid cooling plate 112a and the first housing 111a, which can improve the heat dissipation efficiency of the first power component 11a.

[0043] Specifically, in the example provided in this application, the first circuit board assembly 113a includes a first circuit board 1131a and a plurality of (four shown in the figure) electronic devices 1132a. The first circuit board 1131a has a first surface 11311a and a second surface 11312a, which are opposite to each other. The plurality of electronic devices 1132a are all disposed on the first surface 11311a and are thermally connected to the liquid cooling plate 112a via a thermally conductive material such as thermally conductive grease 13. The first surface 11311a of the first circuit board 1131a is thermally connected to the first housing 111a via a thermally conductive material such as thermally conductive grease 14.

[0044] In the example provided in this application, all electronic components 1132a are disposed on the first surface 11311a of the first circuit board 1131a. This improves the manufacturing efficiency of the first circuit board assembly 113a. For example, surface mount technology (SMT) can be used to dispose of all electronic components 1132a on the first surface 11311a of the first circuit board 1131a. Alternatively, it can be understood that if multiple electronic components 1132a are disposed on the first surface 11311a and the second surface 11312a of the first circuit board 1131a respectively, the first circuit board 1131a needs to be flipped or secondary soldering operations need to be performed. Therefore, this increases the manufacturing process and is not conducive to improving manufacturing efficiency.

[0045] In addition, when assembling the first power component 11a, the first surface 11311a of the first circuit board 1131a can be positioned facing the first liquid cooling plate 112a, which is beneficial to achieve thermal conductive connection between multiple electronic devices 1132a and the first liquid cooling plate 112a.

[0046] In practical applications, heat is generated when current flows through the first circuit board 1131a. Therefore, the first circuit board 1131a also has a heat dissipation requirement.

[0047] In the example provided in this application, since the second surface 11312a of the first circuit board 1131a is disposed facing the first housing 111a, it is advantageous to achieve a thermally conductive connection between the first circuit board 1131a and the first housing 111a.

[0048] Understandably, in practical applications, the heat generated by electronic device 1132a is usually greater than that of the first circuit board 1131a; the heat dissipation efficiency of the first liquid cooling plate 112a is greater than that of the first housing 111a. Therefore, the first circuit board 1131a and the first housing 111a can be thermally connected, allowing the first circuit board 1131a to dissipate heat through the first housing 111a. Similarly, the electronic device 1132a can be thermally connected to the first liquid cooling plate 112a, allowing the electronic device 1132a to dissipate heat through the first liquid cooling plate 112a.

[0049] The first outer shell 111a primarily relies on the heat transfer of the material itself for heat dissipation. It can be made of materials with good thermal conductivity, such as steel, copper, or aluminum. The first outer shell 111a has the advantages of being easy to manufacture, having low cost, and high reliability. In addition, it is relatively easy to fabricate structures with complex shapes during manufacturing.

[0050] For the first liquid cooling plate 112a, since it has channels for the cooling medium to circulate inside, it is not conducive to making relatively complex shapes in practical applications, otherwise problems such as low reliability and significantly increased cost will occur.

[0051] Currently, with the continuous increase in the power of the charging device 10, the heat dissipation requirements of the first circuit board 1131a are also constantly increasing. In practical applications, changing the first housing 111a to a liquid-cooled structure (such as a structure similar to the first liquid cooling plate 112a) would significantly increase the cost of the charging device 10. Alternatively, extending the liquid cooling structure in the first liquid cooling plate 112a into the first housing 111a would also increase the modification cost of the cooling pipe 1121a, and at the same time, increase the risk of leakage in the cooling pipe 1121a.

[0052] In the example provided in this application, after the first power component 11a and the second power component 11b are stacked, the heat dissipation effect on the first circuit board 1131a can be improved by the elastic heat conductor 12.

[0053] Specifically, the first liquid cooling plate 112a of the first power component 11a has a first contact surface 101a, and the first housing 111a has a second contact surface 102a. The second liquid cooling plate 112b of the second power component 11b has a first contact surface 101b, and the second housing 111b has a second contact surface 102b. The first contact surface 101b and the second contact surface 102a are arranged facing each other, and the elastic heat-conducting element 12 is located between the first contact surface 101b and the second contact surface 102a, and elastically abuts against the first contact surface 101b and the second contact surface 102a. After the heat generated by the first circuit board 1131a is transferred to the first housing 111a, it can be transferred to the second liquid cooling plate 112b through the elastic heat-conducting element 12. That is, the second liquid cooling plate 112b of the second power component 11b can dissipate heat from the first circuit board 1131a of the first power component 11a, thereby significantly improving the heat dissipation effect of the first circuit board 1131a.

[0054] Alternatively, it can be understood that, in the examples provided in this application, the first contact surface and the second contact surface of each power component are two surfaces that are set in opposite directions.

[0055] For example, in the first power component 11a, the first contact surface 101a and the second contact surface 102a are opposite to each other. When multiple power components are stacked, each power component can be stacked sequentially with substantially the same spatial orientation. Therefore, in two adjacent power components, the first contact surface of one power component can be positioned facing the second contact surface of the other power component.

[0056] In specific applications, the structure and shape of the elastic heat-conducting element 12 can be varied.

[0057] For example, such as Figure 2As shown, in one example provided in this application, the elastic heat-conducting element 12 is a wave-shaped plate structure. Specifically, the crests and troughs of the elastic heat-conducting element 12 are both arc surfaces.

[0058] In its natural state, the height difference between the crests and troughs of the elastic heat-conducting element 12 is greater than the distance between the first contact surface 101b and the second contact surface 102a. After the elastic heat-conducting element 12 is positioned between the first contact surface 101b and the second contact surface 102a, it is subjected to compressive force from both surfaces, resulting in elastic contact with them. Furthermore, the elastic heat-conducting element 12 undergoes elastic deformation under compression, increasing the contact area between it and both the first and second contact surfaces, thus ensuring effective contact between the elastic heat-conducting element 12 and the first and second contact surfaces 101b and 102a.

[0059] Furthermore, in the example provided in this application, a first air duct 121 is formed between the elastic heat-conducting element 12 and the first contact surface 101b, and a second air duct 122 is formed between the elastic heat-conducting element 12 and the second contact surface 102a. When air flows through the first air duct 121, it carries away the heat from the elastic heat-conducting element 12 and the first contact surface 101b. Correspondingly, when air flows through the second air duct 122, it carries away the heat from the elastic heat-conducting element 12 and the second contact surface 102a, which helps to improve the heat dissipation efficiency of the charging device 10.

[0060] In practical applications, a fan can be installed in the charging device 10 to increase the airflow speed through the first air duct 121 or the second air duct 122.

[0061] In summary, by setting the elastic heat-conducting element 12 to a wave shape, not only can the elastic contact between the elastic heat-conducting element 12 and the first contact surface 101b and the second contact surface 102a be guaranteed, but a first air duct 121 can also be formed between the elastic heat-conducting element 12 and the first contact surface 101b, and a second air duct 122 can be formed between the elastic heat-conducting element 12 and the second contact surface 102a, thereby improving the heat dissipation performance of the charging device 10.

[0062] Understandably, in other examples, the elastic heat conductor 12 may also be of other shapes.

[0063] For example, please refer to the following: Figure 2 and Figure 3In another example provided in this application, the surface of the elastic heat-conducting element 12 facing the first contact surface has at least one third contact portion 120a abutting against the first contact surface 101b, and the third contact portion 120a is planar. The surface of the elastic heat-conducting element 12 facing the second contact surface 102a has at least one fourth contact portion 120b abutting against the second contact surface 102a, and the fourth contact surface 120b is also planar. Figure 3 In the example provided, there are six third contact portions 120a and six fourth contact portions 120b. It is understood that in other examples, there may be one, two or more third contact portions 120a and four fourth contact portions 120b, and this application does not limit this.

[0064] Specifically, since the first contact surface 101b is planar, setting the third contact portion 120a, where the elastic heat-conducting element 12 abuts against the first contact surface 101b, as planar can increase the contact area between the elastic heat-conducting element 12 and the first contact surface 101b, which is beneficial to improving the heat exchange efficiency between the elastic heat-conducting element 12 and the first outer shell 111a. Correspondingly, since the second contact surface 102a is planar, setting the fourth contact surface 120b, where the elastic heat-conducting element 12 abuts against the second contact surface 102a, as planar can increase the contact area between the elastic heat-conducting element 12 and the second contact surface 102a, which is beneficial to improving the heat exchange efficiency between the elastic heat-conducting element 12 and the first liquid cooling plate 112a.

[0065] Of course, in practical applications, the first contact surface 101b or the second contact surface 102a can also be curved, and the surface of the elastic heat-conducting element 12 that contacts the first contact surface 101b or the second contact surface 102a can also be curved, which will not be elaborated here.

[0066] In practical applications, the elastic heat-conducting component 12 can be made of materials with high thermal conductivity, such as copper, aluminum and their alloys.

[0067] Alternatively, the material of the elastic heat conductor 12 may also include a shape memory alloy. When the temperature of the elastic heat conductor 12 rises, it tends to increase the contact area with the first contact surface 101b or the second contact surface 102a, thereby increasing the contact area between the elastic heat conductor 12 and the first contact surface 101b or the second contact surface 102a.

[0068] Specifically, in practical applications, the elastic heat-conducting element 12 comes into contact with the first contact surface 101b and the second contact surface 102a. Therefore, when the temperature of the first outer shell 111a is high, it needs to be cooled down efficiently. Thus, when the high temperature of the first outer shell 111a is transferred to the elastic heat-conducting element 12, it will undergo a predetermined deformation. This deformation can increase the contact area between the elastic heat-conducting element 12 and the first contact surface 101b and the second contact surface 102a, thereby improving the heat exchange efficiency between the first contact surface 101b and the second contact surface 102a.

[0069] For example, at lower temperatures, the shape of the elastic heat conductor 12 can be similar to Figure 2 The shape shown is illustrated. At higher temperatures, the shape of the elastic heat conductor 12 can be similar to... Figure 3 The shape shown.

[0070] Of course, in other examples, the relationship between the shape and temperature of the elastic heat-conducting element 12 can be reasonably set according to different needs, which will not be elaborated here.

[0071] In other examples, the elastic thermal conductive element 12 may also be a thermally conductive pad or other structure with elastic compressibility, which will not be elaborated here.

[0072] In practical applications, the elastic thermal conductive element 12 can be an independent structural component, or it can be a component of the power assembly.

[0073] For example, such as Figure 4 As shown, the elastic heat-conducting element 12 can be fixedly connected to the first outer shell 111a.

[0074] Or, such as Figure 5 As shown, the elastic heat-conducting element 12 can be fixedly connected to the second liquid cooling plate 112b.

[0075] It is understood that the above embodiments are described using the example of charging device 10 including two power components. In practical applications, charging device 10 may include three or more power components.

[0076] For example, such as Figure 6 As shown, in one example provided in this application, the charging device 10 also includes a chassis 15, and a plurality of power components 11 are stacked sequentially inside the chassis 15.

[0077] During installation, the power component 11 can be installed in place, and then the elastic heat-conducting element 12 can be inserted into the gap between two adjacent power components 11. Alternatively, the power component 11 and the elastic heat-conducting element 12 can be installed sequentially.

[0078] like Figure 7 As shown, in some examples, the chassis 15 may also include a drawer-type structure such as a tray 16, through which the power components 11 can be installed in the chassis 15 to improve the convenience of installation and maintenance. The tray 16 and the chassis 15 can be connected via commonly used structures such as slide rails, and this application does not limit this connection.

[0079] In addition, such as Figure 8 As shown, in some examples, the flexible thermally conductive element 12 can be fixedly connected to the tray 16. Please refer to [reference needed]. Figure 6 and Figure 8 After the power components 11 located on both sides of the tray 16 are installed inside the housing 15, thermal contact between the power components 11 and the elastic heat-conducting element 12 can be achieved, thus providing high installation convenience.

[0080] In addition, such as Figure 6 As shown, in one example provided in this application, the charging device 10 also includes a heat sink 17, which can be connected to a liquid cooling plate in the power component 11 via a pipe. The cooling medium can circulate between the heat sink 17 and the liquid cooling plate, so that the heat sink 17 can cool the liquid cooling plate.

[0081] In a specific configuration, the fan 17 can be placed on top of the heat sink 17 to accelerate the airflow speed through the heat sink 17, thereby improving the heat dissipation efficiency of the heat sink 17.

[0082] Additionally, in the example provided in this application, the chassis 15 also includes a partition 151, which divides the internal space of the chassis 15 into a power distribution area and an area for installing power components 11. Power distribution equipment 19 can be located in the power distribution area. When installing power distribution equipment 19, it can include commonly used circuit breakers, overload protection circuits, etc. Power distribution equipment 19 can be installed on the inner wall of the chassis 15, or it can be integrated into a cabinet; this application does not limit this.

[0083] It is understood that, in specific applications, the type and quantity of devices included in the power distribution equipment 19 can be flexibly adjusted according to actual needs, and this application does not limit this.

[0084] In addition, such as Figure 9As shown in the illustration, this application also provides a charging system, including a charging terminal 60 and a charging device 10. The charging terminal 60 is connected to the output terminal of the charging device 10 via a cable. In specific applications, the charging device 10 can perform frequency conversion or other processing on the AC power from the power grid, or it can convert AC power into DC power before supplying it to the charging terminal 60. The charging terminal 60 can be connected to a powered device (such as a vehicle) to replenish the power to the powered device. The charging terminal 60 can be in the form of a charging gun or similar device. Furthermore, one charging device 10 can be connected to one charging terminal 60, or it can be connected to multiple charging terminals 60. This application does not limit the number of charging terminals 60 that can be installed.

[0085] In specific installations, the charging device 10 can be installed on the ground, on a wall, or in other locations. This application does not impose any restrictions on the specific installation location or form of the charging device 10.

[0086] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A charging device, characterized in that, Includes a flexible thermal conductive element and at least two stacked power components; The power component includes a housing, a liquid cooling plate, and a circuit board assembly. The housing and the liquid cooling plate form a receiving cavity, and the circuit board assembly is disposed within the receiving cavity and is thermally connected to both the housing and the liquid cooling plate. The liquid cooling plate of each of the power components has a first contact surface, and the housing has a second contact surface, the first contact surface being opposite to the second contact surface; In one of the two adjacent power components, the first contact surface of one power component is disposed facing the second contact surface of the other power component, and the elastic thermal conductive element is located between the first contact surface and the second contact surface, and elastically abuts against the first contact surface and the second contact surface respectively. The circuit board assembly includes a circuit board and electronic components; The circuit board includes a first board surface and a second board surface that are opposite to each other, and the electronic device is located on the first board surface; The electronic device is thermally connected to the liquid cooling plate, and the second plate surface is thermally connected to the outer casing.

2. The charging device according to claim 1, characterized in that, The elastic heat-conducting element is a wavy sheet.

3. The charging device according to claim 1 or 2, characterized in that, A first air duct is formed between the elastic heat-conducting component and the first contact surface, and a second air duct is formed between the elastic heat-conducting component and the second contact surface.

4. The charging device according to any one of claims 1 to 3, characterized in that, The surface of the elastic heat-conducting element facing the first contact surface has at least one third contact portion that abuts against the first contact surface, and the third contact portion is planar.

5. The charging device according to any one of claims 1 to 4, characterized in that, The surface of the elastic heat-conducting element facing the second contact surface has at least one fourth contact portion that abuts against the second contact surface, and the fourth contact portion is planar.

6. The charging device according to any one of claims 1 to 5, characterized in that, The material of the elastic thermal conductive component includes shape memory alloy; The elastic thermally conductive element is used to increase the contact area with the first contact surface or the second contact surface when the temperature rises.

7. The charging device according to any one of claims 1 to 6, characterized in that, It also includes a chassis, in which the power components are mounted; The elastic thermal conductive element is detachably installed inside the chassis.

8. The charging device according to any one of claims 1 to 7, characterized in that, The elastic thermally conductive element is fixedly connected to the outer shell or the liquid cooling plate.

9. The charging device according to any one of claims 1 to 7, characterized in that, The charging device includes a tray, and the elastic heat-conducting element is fixedly connected to the tray.

10. The charging device according to any one of claims 1 to 9, characterized in that, It also includes a radiator, which is connected to the liquid cooling plate via liquid cooling pipes.

11. A charging system, characterized in that, The device includes a charging terminal and a charging device as described in any one of claims 1 to 10, wherein the charging device has an output port and the charging terminal is connected to the output port.

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