Diagnostic device and diagnostic method for X-pinch point projection imaging

Abstract

The present invention discloses a diagnostic device and method for X-pinch point projection imaging, relating to the technical field of X-pinch point projection imaging. The diagnostic device comprises a reflux assembly, a load assembly, and an imaging assembly. The reflux assembly comprises a reflux hood, a cathode plate, and an anode plate. The load assembly comprises a load to be diagnosed, an X-pinch load assembly, and an insulating support member. The load to be diagnosed is respectively connected to the reflux hood and the cathode plate, the X-pinch load assembly is respectively connected to the reflux hood and the anode plate, and the insulating support member is respectively connected to the reflux hood and the anode plate. The imaging assembly is used for imaging. In the diagnostic device and method of this embodiment, by using the insulating support member as a shunt structure for the X-pinch load assembly, the potential difference across the microdiode structure is reduced, thereby preventing hard X-ray radiation generated by the high-energy electron beam generated by the microdiode structure from bombarding the electrodes, thereby improving the clarity of the final image.

Description

Technical Field

[0001] The present invention relates to the technical field of X-pinch point projection imaging, and in particular to a diagnostic device and a diagnostic method for X-pinch point projection imaging. Background Art

[0002] X-pinch is a method for generating pulsed X-rays proposed in 1982 by the Lebedev Physical Institute in Russia for the study of plasma hot spots. It mainly uses a load installed between the cathode and anode of a pulsed high-current device (dI / dt>1kA / ns). Under specific experimental conditions, it can produce a high-brightness, narrow-pulse (approximately 1ns), small-size (≤10μm) X-ray source. The X-pinch has the characteristics of a basically fixed spatial position of the radiation source (±2mm), a repeatable and empirically adjustable radiation timing (±5ns), and a wide radiation energy spectrum. It can be used for plasma diagnosis and biological imaging.

[0003] The object being photographed is placed between the X-pinch and the recording instrument. X-rays pass through the object and are recorded on X-ray film. This type of photography is called X-pinch point projection photography. Point projection photography produces magnified images, and when used with high-resolution X-ray film, it can achieve extremely high spatial resolution. The image recorded on the film reflects the integrated information of the object along the direction of X-ray propagation over the entire time period during which the X-rays are generated.

[0004] After the X-pinch hot spot collapses, a high-energy electron beam is generated. Bombarding the micro-Z pinch electrode, it can form harder X-rays (>10keV). The radiation source size is about 100μm. This radiation is also called microdiode radiation. Under normal circumstances, this radiation is unavoidable, but due to the large size of its radiation source, its resolution is much lower than that of the X-pinch hot spot radiation, and the resulting image is also relatively blurry, making it impossible to obtain reliable diagnostic results. Since the film image itself obtains integrated information over time, the radiation generated by the microdiode will cause the final image to be superimposed by the hot spot X-ray and microdiode X-ray radiation backlight photography, thereby blurring the clear object boundaries originally obtained by single-point X-ray backlight imaging, affecting the imaging effect and causing key information to be obscured.

[0005] In addition, experimental results conducted on a megaampere pulse source show that although increasing the driving current can increase the X-ray yield and improve the shooting quality, it will also cause an increase in the number of X-pinch hot spots. Usually, there will be at least three X-pinch hot spots, which cannot show the performance of a single hot spot. This restricts the application of point projection photography.

[0006] Currently, plasma diagnostic methods based on X-pinch point projection imaging typically employ an X-filament load mounted in parallel with other return rods. Under the action of a pulsed current, the central plasma load and the X-pinch load evolve independently. At a certain moment, the X-pinch generates nanosecond pulsed X-ray radiation, and an image of the central plasma load's evolution is projected onto X-ray film. This method, in which the X-pinch load is connected in parallel with several metal return rods to distribute current, can result in insufficient current being supplied to the X-pinch load, preventing X-ray radiation generation. Furthermore, this method fails to effectively address the previously mentioned multi-point radiation issue with microdiodes.

[0007] Therefore, it is necessary to optimize the design of the X-pinch load structure to overcome the adverse effects caused by multi-point radiation of microdiodes and obtain diagnostic images with clearer boundaries and more accurate information. Summary of the Invention

[0008] The object of the present invention is to provide a diagnostic device and a diagnostic method for X-pinch point projection imaging, so as to overcome the problem of poor image clarity in the plasma diagnostic method of the traditional X-pinch point projection imaging technology.

[0009] A diagnostic device for X-pinch projection imaging, comprising:

[0010] A reflow assembly, comprising a reflow cover, a cathode plate and an anode plate, wherein the cathode plate and the anode plate are spaced apart from the reflow cover, and the anode plate is arranged parallel to the cathode plate;

[0011] a load assembly, comprising a load to be diagnosed, an X-pinch load, and an insulating support, wherein the load to be diagnosed is respectively connected to the return hood and the cathode plate, the X-pinch load is respectively connected to the return hood and the anode plate, and the insulating support is respectively connected to the return hood and the anode plate; and

[0012] An imaging component is connected to the anode plate and is arranged on a side of the load to be diagnosed away from the X-pinch load member in a direction in which the load to be diagnosed faces the X-pinch load member.

[0013] According to one embodiment of the present invention, there are multiple insulating support members, and the multiple insulating support members are arranged at intervals; wherein, the distance between the insulating support member and the X-pinch load member is greater than the distance between the insulating support member and the load member to be diagnosed.

[0014] According to one embodiment of the present invention, the distance between the insulating support and the central axis of the X-pinch load is d1, and the distance between the insulating support and the load to be diagnosed is d2, and the following formula is satisfied:

[0015] 1.2*d2≤d1≤1.3*d2.

[0016] According to one embodiment of the present invention, the imaging assembly includes a film cassette and an X-ray film, the X-ray film is connected to the film cassette, and the film cassette is connected to the anode plate; the distance between the X-ray film and the X-pinch load is v1, the distance between the load to be diagnosed and the X-pinch load is v2, the magnification of the X-ray film is u, and the following formula is satisfied:

[0017] u=v1 / v2.

[0018] According to one embodiment of the present invention, the insulating support member includes a supporting shaft portion and a plurality of extension portions, the opposite ends of the supporting shaft portion are respectively connected to the return hood and the anode plate, the plurality of extension portions are spaced apart and arranged in parallel along the axial direction of the supporting shaft portion, and the diameter of the extension portion is larger than the diameter of the supporting shaft portion.

[0019] According to one embodiment of the present invention, the X-pinch load element includes a plurality of metal wires, the metal wires are respectively connected to the return hood and the anode plate, and the metal wires are at least partially wound around each other and arranged in a cross pattern.

[0020] The present invention also provides a diagnostic method for X-pinch point projection imaging, comprising the following steps:

[0021] Providing a reflow hood, a cathode plate and an anode plate, wherein the cathode plate and the anode plate are both spaced apart from the reflow hood, and the anode plate is arranged parallel to the cathode plate;

[0022] Providing a load to be diagnosed, and connecting the load to be diagnosed to the reflux hood and the cathode plate respectively;

[0023] Providing an X-pinch load component, and connecting the load component to be diagnosed to the reflux hood and the anode plate respectively;

[0024] Providing at least one insulating support member, and connecting the insulating support member to the return hood and the anode plate respectively;

[0025] An imaging component is provided to be connected to the anode plate, and the imaging component is arranged on a side of the load to be diagnosed away from the X-pinch load.

[0026] According to one embodiment of the present invention, after the step of providing an imaging assembly connected to the anode plate, the step further includes:

[0027] A pulse current is loaded between the anode plate and the cathode plate, and an image signal is acquired through the imaging component to obtain characteristic information of the load component to be diagnosed; the characteristic information at least includes mass density distribution and boundary disturbance development information.

[0028] According to one embodiment of the present invention, the step of providing an X-pinch load element comprises the following steps:

[0029] Providing a plurality of metal wires and two parallel electrode plates, and passing the plurality of metal wires through the two electrode plates respectively;

[0030] straightening the metal wire;

[0031] Rotating the two electrode plates relative to each other by at least 360° so that the plurality of metal wires are wound around each other and arranged in a cross pattern;

[0032] The two electrode plates are connected to the reflow hood and the anode plate respectively.

[0033] According to one embodiment of the present invention, the step of providing at least one insulating support member further comprises:

[0034] The insulating support member includes a supporting shaft portion and multiple extension portions, wherein the opposite ends of the supporting shaft portion are respectively connected to the return hood and the anode plate, and the multiple extension portions are spaced and arranged in parallel along the axial direction of the supporting shaft portion, and the diameter of the extension portion is larger than the diameter of the supporting shaft portion.

[0035] Compared with the prior art, the present invention has the following beneficial technical effects:

[0036] In a diagnostic device and method for X-pinch point projection imaging, an insulating support member serves as a shunt structure for the X-pinch load element, regulating the X-pinch current to a certain extent. Due to the large potential difference between the cathode and anode plates in the microdiode stage, this voltage can break down the insulating support member, causing surface slip. The primary current flows through the broken insulating support member, reducing the potential difference across the microdiode structure. This prevents the hard X-ray radiation generated by the high-energy electron beam bombarding the electrodes from the microdiode structure. This improves the clarity of the resulting image and reduces the overall grayscale deviation on the imaging plate caused by the microdiode's multi-point radiation. Ultimately, reliable mass density distribution information can be obtained through image processing and comparison with the filter scale. Furthermore, the use of a hybrid load assembly further reduces the adverse effects of microdiode and multi-hot spot radiation, enabling more reliable plasma diagnosis and mass density distribution measurements. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1is a schematic structural diagram of a diagnostic device for X-pinch point projection imaging in an embodiment of the present invention;

[0038] Figure 2 is a three-dimensional view of an insulating support member in an embodiment of the present invention;

[0039] Figure 3 2 is a schematic structural diagram of an X-pinch load-bearing member according to an embodiment of the present invention;

[0040] Figure 4 1 is a flow chart of a diagnostic method for X-pinch point projection imaging in an embodiment of the present invention;

[0041] Figure 5 is a flow chart of the step of providing an X-pinch load member in the diagnostic method according to an embodiment of the present invention;

[0042] In the figure, 10, diagnostic equipment; 110, reflux hood; 120, cathode plate; 130, anode plate; 200, load assembly; 210, load member to be diagnosed; 220, X-pinch load member; 221, metal wire; 222, electrode plate; 230, insulating support member; 231, support shaft; 232, extension; 300, imaging assembly; 310, film cassette; 320, X-ray film; 330, X-ray filter. DETAILED DESCRIPTION

[0043] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0044] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0045] See Figures 1 to 3As shown, an embodiment of the present invention provides a diagnostic device 10 for X-pinch point projection imaging, which includes a return assembly, a load assembly 200 and an imaging assembly 300; the return assembly is used to connect with the load assembly 200 to form a current loop; specifically, the return assembly includes a return cover 110, a cathode plate 120 and an anode plate 130, the cathode plate 120 and the anode plate 130 are both spaced apart from the return cover 110, and the anode plate 130 is arranged in parallel with the cathode plate 120; the load assembly 200 includes a load to be diagnosed 210, an X-pinch The X-pinch load member 220 and the insulating support member 230, the load member to be diagnosed 210 are respectively connected to the return cover 110 and the cathode plate 120, the X-pinch load member 220 are respectively connected to the return cover 110 and the anode plate 130, and the insulating support member 230 are respectively connected to the return cover 110 and the anode plate 130; the imaging component 300 is connected to the anode plate 130, and in the direction of the load member to be diagnosed 210 toward the X-pinch load member 220, the imaging component 300 is arranged on the side of the load member to be diagnosed 210 away from the X-pinch load member 220.

[0046] In the diagnostic device 10 and method for X-pinch point projection imaging of this embodiment, the use of an insulating support member 230 as a shunt structure for the X-pinch load member 220 regulates the X-pinch current to a certain extent. Due to the large potential difference between the cathode plate 120 and the anode plate 130 during the microdiode stage, this voltage can break down the insulating support member 230, causing surface slip. The primary current flows through the broken insulating support member 230, reducing the potential difference across the microdiode structure. This prevents the hard X-ray radiation generated by the high-energy electron beam bombarding the electrodes from the microdiode structure. This improves the clarity of the resulting image and reduces the overall grayscale deviation on the imaging plate caused by the multi-point radiation from the microdiode. Ultimately, reliable mass density distribution information can be obtained through image processing and comparison with the filter scale. Furthermore, when combined with a hybrid load assembly 200, the adverse effects of microdiode and multi-hot spot radiation can be further reduced, enabling more reliable plasma diagnosis and mass density distribution measurement.

[0047] Furthermore, there are multiple insulating support members 230 , and the multiple insulating support members 230 are arranged at intervals; wherein, the distance between the insulating support member 230 and the X-pinch load member 220 is greater than the distance between the insulating support member 230 and the load member to be diagnosed 210 .

[0048] The provision of multiple insulating support members 230 can effectively reduce the potential difference of the micro-diode structure, thereby improving the imaging effect of the diagnostic device 10. Specifically, the insulating support member 230 can be made of materials such as high molecular weight polyethylene, polyoxymethylene, etc.

[0049] In one embodiment, the distance between the insulating support 230 and the central axis of the X-pinch load 220 is d1, and the distance between the insulating support 230 and the load to be diagnosed 210 is d2, and the following formula is satisfied: 1.2*d2≤d1≤1.3*d2.

[0050] In this embodiment, by setting the insulating support 230 such that d1 is greater than or equal to d2, the inductance of the current loop within the insulating support 230 can be made larger than the X-pinch load 220, thereby reducing the potential difference across the micro-diode structure.

[0051] Specifically, see Figure 1 As shown, the imaging assembly 300 includes a film cassette 310 and an X-ray film 320. The X-ray film 320 is connected to the film cassette 310, and the film cassette 310 is connected to the anode plate 130. The distance between the X-ray film 320 and the X-pinch load member 220 is v1, the distance between the load member to be diagnosed 210 and the X-pinch load member 220 is v2, and the magnification of the X-ray film 320 is u, and satisfies the following formula: u = v1 / v2.

[0052] With this arrangement, by adjusting the distance between the X-ray film 320 and the load member to be diagnosed 210 and the X-pinch load member 220, the imaging magnification of the imaging assembly 300 is adjusted to amplify the photographs of the imaging assembly 300, thereby improving the display quality of the acquired image.

[0053] Furthermore, the imaging assembly 300 further includes an X-ray filter 330 . The X-ray filter 330 is connected to the film cassette 310 , and the X-ray filter 330 is located between the X-ray film 320 and the load 210 to be diagnosed.

[0054] With this configuration, the point projection image can be recorded using an X-ray film 320. In a specific embodiment, X-ray films 320 of models BASIP TR-2040E and BAS-IP SR-2040E can be used. The two types of X-ray films 320 have different responses to different photon energies, with TR being more sensitive to hard X-rays and SR being more sensitive to soft X-rays. The X-ray film 320 is installed in a film cassette 310, and a 10 μm Ti foil, for example, can be used as an X-ray filter 330 to shield visible light and X-rays with lower energy.

[0055] Because the load 210 is heavy, the shock wave generated by its collapse could damage or even destroy the X-ray film 320 and X-ray filter 330 used for point projection photography. Therefore, there is a lower limit to the distance between the film cassette 310 and the load 210 to minimize the impact. Metal X-ray filter 330 can block most shock and contamination, protecting X-ray film 320 from damage.

[0056] In one embodiment, the distance between the X-pinch support member 220 and the diagnostic support member 210 is approximately 30 mm, the distance to the X-ray film 320 is 200 mm, and the magnification is approximately 7x. After the experiment is completed, the image recorded on the X-ray film 320 is read using a laser imager (e.g., a Typhoon FLA 7000 laser imager). The image resolution of the imager can be 10-20 μm. Finally, image processing is performed on the read image and compared with the X-ray filter 330 of a predetermined thickness to obtain mass density distribution information during the plasma evolution process.

[0057] See Figure 2 As shown, in one embodiment, the insulating support member 230 includes a support shaft portion 231 and a plurality of extension portions 232, the opposite ends of the support shaft portion 231 are respectively connected to the return hood 110 and the anode plate 130, the plurality of extension portions 232 are spaced apart and arranged in parallel along the axial direction of the support shaft portion 231, and the diameter of the extension portion 232 is larger than the diameter of the support shaft portion 231.

[0058] In this embodiment, by providing an extension portion 232 to cooperate with the support shaft portion 231, the insulating support member 230 can form a stepped structure to increase the creepage distance of the insulating support member 230, and then the insulating support member 230 is fixed between the return hood 110 and the anode plate 130. Preferably, the axis of the insulating support member 230 should be located at a position relatively far away from the load member 210 to be diagnosed.

[0059] In existing technical solutions, metal rods such as stainless steel are generally used as the return and support structure of the central plasma load. In the early stage of current flow, a considerable portion of the current will pass through the metal rod instead of the X-pinch load 220, which may reduce the radiation intensity and yield generated by the X-pinch load 220 and reduce the contrast of the captured image. In addition, ordinary metal return rods cannot overcome the multi-point radiation of microdiodes in the X-pinch load 220, and may ultimately produce imaging results with blurred boundaries and multi-layer overlap, which may cause effective information to be obscured and the mass density distribution information to deviate from the actual information.

[0060] In the diagnostic device 10 of the present invention, by using an insulating support member 230 for backflow and support, the insulating support member 230 does not compete with the X-pinch load member 220 for current in the early stage of the experiment. In the later stage, the breakdown and sliding flash due to the potential difference between the anode and cathode suppresses the multi-peak radiation of the microdiode of the X-pinch load member 220, thereby achieving temporal current regulation of the X-pinch load member 220, optimizing the imaging results, effectively improving the success rate of X-pinch point projection imaging, and enhancing the reliability of the diagnostic results.

[0061] Specifically, the X-pinch load element 220 includes a plurality of metal wires 221 . The metal wires 221 are respectively connected to the return hood 110 and the anode plate 130 . The metal wires 221 are at least partially wound around each other and arranged in a cross pattern.

[0062] See Figure 3 In the illustrated embodiment, there are two metal wires 221 arranged in an X-shape. The X-pinch load element 220 also includes electrode plates 222. During processing, the metal wires 221 are first passed from top to bottom through the coaxial holes in the two electrode plates 222. A weight, such as a nut, is then passed through the metal wires 221 to straighten them. This ensures that the metal wires 221 are in close contact with each other when forming the X-wire structure. The metal wires 221 are then passed from bottom to top through the coaxial holes in the other electrode plate 222. Next, the metal wires 221 are bonded to the upper electrode plate 222. The upper and lower electrode plates 222 are then rotated 360 degrees relative to each other to form the X-wire structure, and finally secured. The electrode plates 222 at opposite ends of the X-pinch support member 220 are then connected to the reflow hood 110 and the anode plate 130, respectively, to complete the assembly and formation of the X-pinch support member 220. In other embodiments, the number of metal wires 221 can also be three or more. After being fixed by the electrode plates 222, they are then rotated relative to each other so that the multiple metal wires 221 can twist and cross at least one point, thereby forming the X-pinch support member 220.

[0063] See Figure 4 and Figure 5 As shown, the present invention also provides a diagnostic method for X-pinch point projection imaging, which includes the following steps:

[0064] Step S100, providing a reflow cover 110, a cathode plate 120 and an anode plate 130, wherein the cathode plate 120 and the anode plate 130 are spaced apart from the reflow cover 110, and the anode plate 130 is arranged parallel to the cathode plate 120;

[0065] Step S200: providing a load device 210 to be diagnosed, and connecting the load device 210 to be diagnosed to the reflux cover 110 and the cathode plate 120 respectively;

[0066] Step S300: providing an X-pinch load element 220, and connecting the load element to be diagnosed 210 to the reflux hood 110 and the anode plate 130 respectively;

[0067] Step S400: providing at least one insulating support member 230, and connecting the insulating support member 230 to the reflow hood 110 and the anode plate 130 respectively;

[0068] In step S500 , an imaging assembly 300 is provided and connected to the anode plate 130 , and the imaging assembly 300 is disposed on a side of the load element 210 to be diagnosed away from the X-pinch load element 220 .

[0069] When using the diagnostic method of this embodiment for diagnosis, the diagnostic device 10 of any of the aforementioned embodiments may also be used. By using the diagnostic method of this embodiment, the current front during the diagnostic process is relatively slow, approximately 1 kA / ns, barely reaching the minimum requirement for the generation of an X-pinch hot spot. After the current passes through the load element to be diagnosed 210 and reaches the reflow hood 110, it simultaneously passes through the insulating support 230 and the X-pinch load element 220 to reach the anode plate 130, thereby maximizing the current flow through the X-pinch load element 220 while minimizing or eliminating the current flow through the insulating support 230. This reduces the potential difference across the microdiode structure, thereby improving the clarity of the resulting image.

[0070] Furthermore, after step S500, the diagnostic method also includes the steps of: loading a pulse current between the anode plate 130 and the cathode plate 120, and acquiring an image signal through the imaging component 300 to obtain characteristic information of the load component 210 to be diagnosed; the characteristic information includes at least mass density distribution and boundary disturbance development information.

[0071] Specifically, see Figure 1 and Figure 2 As shown, step S300 of the diagnostic method in this embodiment includes the following steps:

[0072] Step S310: providing a plurality of metal wires 221 and two parallel electrode plates 222, and passing the plurality of metal wires 221 through the two electrode plates 222 respectively;

[0073] Step S320, straightening the metal wire 221;

[0074] Step S330: Rotate the two electrode plates 222 relative to each other by at least 360°, so that the plurality of metal wires 221 are wound around each other and arranged in a cross pattern;

[0075] Step S340 , connecting the two electrode plates 222 to the reflow hood 110 and the anode plate 130 respectively.

[0076] The diagnostic device 10 of this embodiment can use X-pinch point projection photography to diagnose the application scenario of the early plasma of the Z-pinch of the load 210 to be diagnosed. When preparing the X-pinch load 220 of this embodiment,

[0077] First, pass the wire 221 from top to bottom through the coaxial holes on the two electrode plates 222. Then, pass it through a weight, such as a nut, to straighten the wire 221. This ensures that the wires 221 are in close contact when forming the X-wire structure. Then, pass it from bottom to top through the coaxial holes on the other electrode plate 222. Next, adhere the wire 221 to the upper electrode plate 222. The upper and lower electrode plates 222 are then rotated 360 degrees relative to each other to form the X-wire structure, and finally secured. The electrode plates 222 at opposite ends of the X-pinch support member 220 are then connected to the reflow hood 110 and the anode plate 130, respectively, completing the assembly and formation of the X-pinch support member 220. In other embodiments, the number of wires 221 can be three or more. After being secured by the electrode plates 222, they are then rotated relative to each other so that the multiple wires 221 can twist and cross at least one point, thereby forming the X-pinch support member 220.

[0078] Specifically, step S400 also includes: the insulating support member 230 includes a support shaft portion 231 and multiple extension portions 232, the opposite ends of the support shaft portion 231 are respectively connected to the return hood 110 and the anode plate 130, and the multiple extension portions 232 are spaced and arranged in parallel along the axial direction of the support shaft portion 231, and the diameter of the extension portion 232 is larger than the diameter of the support shaft portion 231.

[0079] In this embodiment, by providing an extension portion 232 to cooperate with the support shaft portion 231, the insulating support member 230 can form a stepped structure to increase the creepage distance of the insulating support member 230, and then the insulating support member 230 is fixed between the return hood 110 and the anode plate 130. Preferably, the axis of the insulating support member 230 should be located at a position relatively far away from the load member 210 to be diagnosed.

[0080] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0081] In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; and direct connections or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on the specific circumstances.

[0082] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," or "above" a second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," or "below" a second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0083] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A diagnostic device for X-pinch projection imaging, characterized in that: include: A reflow assembly, comprising a reflow cover, a cathode plate and an anode plate, wherein the cathode plate and the anode plate are spaced apart from the reflow cover, and the anode plate is arranged parallel to the cathode plate; A load assembly, comprising a load to be diagnosed, an X-pinch load, and an insulating support, wherein the load to be diagnosed is connected to the return hood and the cathode plate, respectively; the X-pinch load is connected to the return hood and the anode plate, respectively; and the insulating support is connected to the return hood and the anode plate, respectively. as well as an imaging assembly connected to the anode plate and disposed on a side of the load member to be diagnosed away from the X-pinch load member in a direction in which the load member to be diagnosed faces the X-pinch load member; There are multiple insulating support members, and the multiple insulating support members are arranged at intervals; wherein the distance between the insulating support member and the X-pinch load member is greater than the distance between the insulating support member and the load member to be diagnosed; The insulating support member includes a supporting shaft portion and multiple extension portions, wherein the opposite ends of the supporting shaft portion are respectively connected to the return hood and the anode plate, and the multiple extension portions are spaced and arranged in parallel along the axial direction of the supporting shaft portion, and the diameter of the extension portion is larger than the diameter of the supporting shaft portion.

2. The diagnostic device for X-pinch projection imaging according to claim 1, characterized in that: The distance between the insulating support and the central axis of the X-pinch load is d1, and the distance between the insulating support and the load to be diagnosed is d2, and the following formula is satisfied: 1.2*d2≤d1≤1.3*d2.

3. The diagnostic device for X-pinch projection imaging according to claim 1, characterized in that: The imaging assembly includes a film cassette and an X-ray film, the X-ray film is connected to the film cassette, and the film cassette is connected to the anode plate; the distance between the X-ray film and the X-pinch load is v1, the distance between the load to be diagnosed and the X-pinch load is v2, the magnification of the X-ray film is u, and the following formula is satisfied: u=v1 / v2.

4. The diagnostic device for X-pinch projection imaging according to claim 1, characterized in that: The X-pinch load element includes a plurality of metal wires, which are respectively connected to the reflow hood and the anode plate, and the metal wires are at least partially wound around each other and arranged in a cross pattern.

5. A diagnostic method for X-pinch projection imaging, characterized in that: The steps include: Providing a reflow hood, a cathode plate and an anode plate, wherein the cathode plate and the anode plate are both spaced apart from the reflow hood, and the anode plate is arranged parallel to the cathode plate; Providing a load to be diagnosed, and connecting the load to be diagnosed to the reflux hood and the cathode plate respectively; Providing an X-pinch load component, and connecting the load component to be diagnosed to the reflux hood and the anode plate respectively; Providing at least one insulating support member, and connecting the insulating support member to the return hood and the anode plate respectively; Providing an imaging assembly connected to the anode plate, and arranging the imaging assembly on a side of the load to be diagnosed away from the X-pinch load; The step of providing at least one insulating support member further comprises: The insulating support member includes a supporting shaft portion and multiple extension portions, wherein the opposite ends of the supporting shaft portion are respectively connected to the return hood and the anode plate, and the multiple extension portions are spaced and arranged in parallel along the axial direction of the supporting shaft portion, and the diameter of the extension portion is larger than the diameter of the supporting shaft portion.

6. The diagnostic method for X-pinch projection imaging according to claim 5, characterized in that: After the step of providing an imaging assembly connected to the anode plate, the step further includes: A pulse current is loaded between the anode plate and the cathode plate, and an image signal is acquired through the imaging component to obtain characteristic information of the load component to be diagnosed; the characteristic information at least includes mass density distribution and boundary disturbance development information.

7. The diagnostic method for X-pinch projection imaging according to claim 6, characterized in that: The step of providing an X-pinch load element comprises the following steps: Providing a plurality of metal wires and two parallel electrode plates, and passing the plurality of metal wires through the two electrode plates respectively; straightening the metal wire; Rotating the two electrode plates relative to each other by at least 360° so that the plurality of metal wires are wound around each other and arranged in a cross pattern; The two electrode plates are connected to the reflow hood and the anode plate respectively.

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