Security detection method, chip and electronic device

Abstract

Embodiments of the present application provide a kind of security detection method, chip and electronic equipment, it is related to hardware information security technical field.The method is used to detect chip, the top layer of chip has multiple metal regions of different areas, each metal region is not communicated with each other;The method comprises: obtaining the detection parameter of each metal region, judging whether the detection parameter of each metal region meets preset function, if it meets, it is determined that the chip is not subjected to intrusion type attack, if it does not meet, it is determined that the chip is subjected to intrusion type attack.The present application embodiment solves the problem that existing chip active physical layer protection scheme is easy to be detected by intruder to explore more bottom signal line, and chip security is not high.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of hardware information security, in particular to a security detection method, a chip and an electronic device. BACKGROUND

[0002] There are various security protection methods for existing chips, which can be generally divided into hardware layer protection and software layer protection. In terms of hardware layer, the most intuitive method is to protect the chip by a top active shielding layer. The active shielding lines are compactly routed in a spiral, trapezoidal or parallel shape on the top layer of the chip, and one or more layers of routing can be used to form a strict physical protection layer. The former routing rule, combined with the detection circuit inside the chip, can resist intrusion attacks to some extent, such as preventing the key signal lines inside the chip from being connected to the probe station on the top layer of the chip by FIB machine to be probed, and preventing intruders from performing large-scale destructive behavior on the chip.

[0003] Currently, the existing technologies for active physical layer protection of chips mainly include the following two schemes: scheme one, one or more signal lines are routed on the top layer or multiple layers to form a protection winding for full coverage of the chip; and scheme two, a plurality of groups of signal lines cover the top layer of the chip, a random number generation unit, a control unit and a detection unit are used, random binary numbers are input to the input ends of each group of multiple metal lines of the physical layer protection circuit, and the output signals of the multiple metal lines are detected in the attack detection period and the detection period, respectively. Both of the above two schemes provide the possibility for intruders to detect the signal lines at a deeper layer, and the security of the chip is not high. SUMMARY

[0004] Therefore, the present application aims to provide a security detection method, a chip and an electronic device to solve the problem that the existing active physical layer protection scheme of the chip is easy to be detected by intruders to a deeper layer of signal lines, and the security of the chip is not high.

[0005] To achieve the above-mentioned purpose, the technical solutions adopted by the embodiments of the present application are as follows:

[0006] In a first aspect, the embodiments of the present application provide a security detection method for detecting a chip. The top layer of the chip has a plurality of metal regions with different areas, and each of the metal regions is not conductive to each other.

[0007] The method comprises:

[0008] Obtaining the to-be-detected parameters of each of the metal regions;

[0009] Determining whether the to-be-detected parameters of each of the metal regions meet a preset function;

[0010] If yes, it is determined that the chip has not been subjected to an intrusion attack;

[0011] If not, it is determined that the chip is subjected to an invasive attack.

[0012] In an optional embodiment, the step of acquiring the to-be-detected parameter of each metal region comprises:

[0013] Collecting a region physical parameter of each metal region;

[0014] Converting the collected region physical parameter into a corresponding analog quantity;

[0015] Amplifying the converted analog quantity;

[0016] Converting the amplified analog quantity into AD to obtain the to-be-detected parameter.

[0017] In an optional embodiment, the step of collecting a region physical parameter of each metal region comprises:

[0018] Determining the area of each metal region according to a standard region physical parameter of each metal region, wherein the standard region physical parameter of each metal region is obtained according to the preset function;

[0019] Acquiring the region physical parameter of each metal region based on the area of each metal region.

[0020] In an optional embodiment, each region physical parameter comprises an actual resistance value of each metal region acquired.

[0021] In an optional embodiment, the step of judging whether the to-be-detected parameter of each metal region conforms to a preset function comprises:

[0022] In the case of acquiring a preset number of to-be-detected parameters, combining each to-be-detected parameter to obtain a to-be-detected coordinate;

[0023] Judging whether the to-be-detected coordinate conforms to the preset function to determine whether the chip is subjected to an invasive attack.

[0024] In an optional embodiment, the step of, in the case of acquiring a preset number of to-be-detected parameters, combining each to-be-detected parameter to obtain a to-be-detected coordinate comprises:

[0025] For each preset number of continuously acquired to-be-detected parameters, according to the acquisition order of the preset number of to-be-detected parameters, sequentially taking the preset number of to-be-detected parameters as a first coordinate value, a second coordinate value, a third coordinate value, …, and an Nth coordinate value to obtain the to-be-detected coordinate;

[0026] The preset quantity is N, N is a natural number greater than 1, and the preset quantity is not greater than the number of the metal regions.

[0027] In an optional implementation, the step of determining whether the to-be-detected coordinate conforms to a preset detection equation to determine whether the chip is subjected to an invasive attack includes:

[0028] The first coordinate value, the second coordinate value, the third coordinate value,..., and the (N-1)th coordinate value are substituted into the preset function as independent variables.

[0029] It is determined whether a result of the dependent variable of the preset function is consistent with a value of the Nth coordinate.

[0030] If yes, it is determined that the chip is not subjected to an invasive attack, and the step of obtaining the to-be-detected parameters of the metal regions is returned to be executed.

[0031] If no, it is determined that the chip is subjected to an invasive attack.

[0032] In an optional implementation, the method further includes:

[0033] In a case where it is determined that the chip is subjected to an invasive attack, the chip is controlled to perform a preset operation.

[0034] In a second aspect, an embodiment of the present application provides a chip, wherein the security detection method provided in the first aspect and / or some possible implementation manners of the first aspect is applied to the chip.

[0035] In a third aspect, an embodiment of the present application provides an electronic device, wherein the chip provided in the second aspect is included.

[0036] The beneficial effects of the embodiments of the present application include, for example:

[0037] The security detection method, the chip, and the electronic device provided in the embodiments of the present application can effectively detect a physical attack on a top layer of a chip by designing multiple metal regions with different areas on the top layer of the chip, obtaining to-be-detected parameters of the metal regions in a detection process, and determining whether the to-be-detected parameters of the metal regions conform to a preset function. When a metal region on the top layer of the chip is damaged, a corresponding parameter of the metal region changes. Therefore, the to-be-detected parameters of the metal region no longer conform to the preset function, and the physical attack on the top layer of the chip can be effectively detected.

[0038] Further, since each metal region has a corresponding parameter to be detected, if an intruder needs to destroy the metal region on the top layer of the chip to detect the key signal line on the bottom layer, the corresponding parameter of the destroyed metal region will change, making it difficult for the intruder to restore the original parameter, and it is also difficult to obtain the correct signal of the key signal line on the bottom layer. The scheme solves the problem that the existing chip active physical layer protection scheme is easy to be detected by the intruder to detect the signal line on the lower layer, and the chip security is not high.

[0039] In order to make the above objectives, characteristics and advantages of the present application more apparent, the following preferred embodiments are specifically described below, and the accompanying drawings are referred to for detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0041] Figure 1 An exemplary structural block diagram of a chip provided by the embodiments of the present application is shown;

[0042] Figure 2 A flowchart of a security detection method provided by the embodiments of the present application is shown;

[0043] Figure 3 An exemplary structural diagram of each metal region of a chip provided by the embodiments of the present application is shown;

[0044] Figure 4 An exemplary schematic diagram of a detection equation in a security detection method provided by the embodiments of the present application is shown;

[0045] Figure 5 A flowchart of a security detection method provided by the embodiments of the present application is shown;

[0046] Figure 6 An exemplary structural diagram of a reference unit in a chip provided by the embodiments of the present application is shown;

[0047] Figure 7 A flowchart of a security detection method provided by the embodiments of the present application is shown;

[0048] Figure 8 A flowchart of a security detection method provided by the embodiments of the present application is shown;

[0049] Figure 9Fig. 5 shows a flow diagram of a safety detection method according to an embodiment of the present application;

[0050] Figure 10 Fig. 6 shows a flow diagram of a safety detection method according to an embodiment of the present application;

[0051] Figure 11 Fig. 7 shows a flow diagram of a safety detection method according to an embodiment of the present application.

[0052] Fig. 1 shows a schematic diagram of a safety detection system according to an embodiment of the present application. DETAILED DESCRIPTION

[0053] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0054] Therefore, the detailed description of the embodiments of the present application provided in the accompanying drawings below is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0055] It should be noted that the relational terms such as "first" and "second" and the like are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus including a list of elements does not only include those elements, but also includes other elements not explicitly listed, or further includes elements inherent in such a process, method, article or apparatus. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, method, article or apparatus including the element.

[0056] It should be noted that the features in the embodiments of the present application can be combined with each other without conflict.

[0057] The existing chip active physical layer protection technology mainly has the following two schemes: scheme one, a signal line or multiple signal lines are used to form a protection winding on the top layer or multiple layers to completely cover the chip, the winding is part of the physical protection layer and part of the sensor of the chip detection circuit; the detection sensor circuit gives an input signal to the input end of the protection winding, the detection circuit compares the consistency of the output end signal of the winding with the input end signal, and when the inconsistency is detected, it is determined that the chip is subjected to physical attack, and the chip enters an abnormal working state. The cracking method of the physical layer protection of this mode: the output end and the input end of the winding can be directly short-circuited by chip circuit modification technology, so that the detection result of the detection circuit is always passed. The invader can randomly damage the winding area except the input and output ends, and then can detect the signal lines in the lower layer.

[0058] Scheme two, multiple groups of signal lines cover the top layer of the chip, cooperate with a random number generation unit, a control unit and a detection unit, input a random binary number to the input end of each group of multiple metal lines of the physical layer protection circuit, respectively detect the output signals of the multiple metal lines in the attack detection period and the detection period, detect that the output of the metal line is the same as the input in the attack detection period, and detect that the output is different from the input in the detection period, then it is judged that the chip is subjected to short-circuit or cutting attack. This scheme improves the situation that only the cutting of the chip can be detected, effectively increases the difficulty of the invader attacking the chip. If the invader does not use the short-circuit processing method, but uses the FIB technology to repair the original protection line in the cutting area, the detection result of the detection unit is normal. Although the processing time of the invader on the original protection line is increased, it still provides the possibility of detecting the signal lines in the lower layer.

[0059] Based on this, the embodiment of the present application provides a safety detection method and a chip to solve the above problems.

[0060] Please refer to Figure 1 , Figure 1 An exemplary structure block diagram of a chip 100 is shown, which can include a reference unit 101, an amplification unit 102, a detection unit 103, an arbitration unit 104 and a control unit 105.

[0061] Among them, the top layer of the chip 100 has multiple metal regions (for example, metal regions A, B, C, D and E in Figure 3 The multiple metal regions are not conductive to each other, and the multiple metal regions as a whole can completely cover the top layer of the chip 100.

[0062] Reference unit 101 is combined with amplification unit 102 for collecting and processing area parameters of each metal region, for example, reference unit 101 can include a DA converter (Digital to Analog converter, referred to as DAC or DA converter, which is a device for converting digital quantity into analog quantity) or other circuits that can convert digital quantity into analog quantity, and amplification unit 102 can include a high-precision amplifier and an AD converter (Analog to Digital converter, referred to as ADC or AD converter, which is a device for converting analog quantity into digital quantity). The area parameter can be the resistance value of each metal region, and reference unit 101 collects the resistance value of each metal region and converts the resistance value into an analog signal, then amplifies the signal through amplification unit 102, and finally converts the amplified analog signal into a digital signal through the AD converter for detection by detection unit 103.

[0063] Detection unit 103 is used for detecting the parameters to be detected processed by amplification unit 102, and the detection process can be based on a preset rule for detection. For example, a preset detection equation is used to combine each parameter to be detected to obtain a coordinate to be detected, and the coordinate to be detected is substituted into the detection equation for the arbitration unit 104 to judge the detection result.

[0064] Arbitration unit 104 is used to determine whether the chip 100 is subjected to an intrusion attack based on the detection result of the detection unit 103, and if the chip 100 is subjected to an intrusion attack, an alarm signal can be sent to the control unit 105 for the control unit 105 to perform a corresponding action.

[0065] Control unit 105 is used to control other units of chip 100 (such as controlling the internal clock frequency change of the clock unit or controlling the chip reset unit to reset the chip) to perform a preset operation according to the alarm signal of arbitration unit 104, so that the chip 100 takes corresponding action to prevent the intruder from stealing the data inside the chip 100 when the intruder intrudes.

[0066] Further, the embodiment of the present application also provides a security detection method, which prevents the intruder from spying on the key signals inside the chip 100 and detects the intrusion state of the chip 100 in time for corresponding processing.

[0067] Please refer to Figure 2 , Figure 2 A flowchart of a security detection method provided by the embodiment of the present application is shown in the figure, and the detection method is used for detecting the chip 100, and the top layer of the chip 100 has a plurality of metal regions with different areas, and each metal region is not conductive to each other. As shown in Figure 2 The detection method includes the following steps:

[0068] S210, obtaining a to-be-detected parameter of each metal region.

[0069] S220, judging whether the to-be-detected parameter of each metal region meets a preset function.

[0070] If yes, it is determined that the chip is not subjected to an invasive attack.

[0071] If no, it is determined that the chip is subjected to an invasive attack.

[0072] The above steps realize a process of detecting whether the chip is subjected to an invasive attack in time.

[0073] The step S210 is a process of obtaining the to-be-detected parameter of each metal region.

[0074] Exemplarily, as shown in FIG. 1, Figure 3 Figure 3 FIG. 1 shows an exemplary structural diagram of each metal region of a chip 100 provided by an embodiment of the present application. Five metal regions can be set according to the specification of the chip 100, and are labeled as A, B, C, D and E. The areas of the metal regions A, B, C, D and E are in descending order and are not conductive to each other. The same kind of metal is used to cover each metal region, and a barrier is formed on the top layer of the chip 100 to protect the signal lines below.

[0075] Based on the above setting, the to-be-detected parameter of each metal region is obtained. The to-be-detected parameter will change the corresponding value due to the destruction of the intruder.

[0076] For example, the process can be obtaining the resistance values of the metal regions A, B, C, D and E, and for another example, obtaining the voltage values of the metal regions A, B, C, D and E. The to-be-detected parameter is the regional physical parameter of each metal region, which is not specifically limited here, and only needs to ensure that the to-be-detected parameter will change the corresponding value due to the destruction of the intruder.

[0077] After obtaining the to-be-detected parameter of each metal region, for example, the to-be-detected parameter of the metal region A and the to-be-detected parameter of the metal region B, the step S220 is continued to be executed.

[0078] The step S220 is a process of judging whether the to-be-detected parameter meets a preset function. The preset function can be a preset detection equation, for example. Therefore, the to-be-detected parameters need to be combined to obtain a to-be-detected coordinate.

[0079] For example, if the preset function is a two-dimensional equation, and based on Figure 3 ​Five metal regions A, B, C, D, and E are identified. If the resistance values ​​R1' and R2' of metal regions A and B are obtained through step S110, then these resistance values ​​R1' and R2' can be used as coordinate values ​​X1 and X2, respectively. These coordinates are then combined based on a two-dimensional equation to obtain the coordinates to be detected. For example, after combination, the coordinates to be detected are (X1, X2), where X1 is the first coordinate value and X2 is the second coordinate value.

[0080] It is understood that if the preset function is a two-dimensional equation and the coordinates to be detected are two-dimensional coordinates, the first coordinate value is equivalent to the horizontal coordinate in the two-dimensional coordinates, and the second coordinate value is equivalent to the vertical coordinate in the two-dimensional coordinates.

[0081] Furthermore, the process of determining whether the parameters to be detected in each metal region conform to the preset function is the process of determining whether chip 100 has been subjected to an intrusive attack.

[0082] For example, the preset function can be a preset detection equation, such as... Figure 4 The regression line equation shown is y = kx + b. The preset function is a two-dimensional equation, based on... Figure 3 Five metal regions A, B, C, D, and E are given. If the parameters to be detected based on metal region A and metal region B are obtained through step S210 as the actual resistance values ​​R1' and R2' of metal region A and metal region B, and in step S220, the parameters to be detected R1' and R2' of metal region A and metal region B are used as the first coordinate value X1 and the second coordinate value X2, and X1 and X2 are combined into the coordinates to be detected (X1, X2), then X1 can be substituted into x in the regression line equation to compare the calculated y value with the actual obtained X2.

[0083] It should be noted that before determining whether the parameters to be detected in each metal region conform to the preset function, it is also necessary to pre-set the standard region physical parameters of each metal region. The standard region physical parameters are set based on the preset function. Therefore, under this premise, the parameters to be detected in each metal region of chip 100 can be used to determine whether chip 100 has been subjected to an intrusion attack based on the preset function.

[0084] For example, it can be based on, such as Figure 4 The regression line equation shown is y = kx + b, which pre-sets the standard resistance values ​​(i.e., the physical parameters of the standard regions) for each metal region. Figure 3The standard resistance value R2 of the metal region B can be k*R1+b, and the standard resistance values R3, R4 and R5 of the metal regions C, D and E can be k*R2+b, k*R3+b and k*R4+b respectively according to the equation, wherein k and b are integers.

[0085] According to the foregoing description, since the standard resistance value R2 of the metal region B is obtained by substituting the standard resistance value R1 of the metal region A into the regression straight line equation y=kx+b, the calculated y value can be compared with the actual X2 obtained by substituting X1 into the regression straight line equation, and if the calculated y value is the same as the actual X2, it indicates that the actual detected resistance values R1' and R2' conform to the regression straight line equation, and further indicates that the actual detected resistance values R1' and R2' have not changed, and the chip 100 has not been subjected to an invasive attack.

[0086] If the process resistance values R1' and R2' do not conform to the regression straight line equation, it indicates that the chip 100 has been subjected to an invasive attack.

[0087] The security detection method provided by the embodiment of the application can detect the parameters of the metal regions with different areas on the top layer of the chip, and determine whether the parameters conform to the preset function. When a metal region on the top layer of the chip is damaged, the corresponding parameter of the metal region will change. Therefore, the detected parameter of the metal region will not conform to the preset function, and the physical attack on the top layer of the chip can be effectively detected.

[0088] Further, since each metal region has a corresponding detected parameter, if an invader needs to damage the metal region on the top layer of the chip to detect the key signal line on the bottom layer, the corresponding parameter of the damaged metal region will change, making it difficult for the invader to restore the original parameter and obtain the correct signal of the key signal line on the bottom layer. The scheme solves the problem that the existing chip active physical layer protection scheme is easy to be detected by the invader to obtain the signal of a deeper layer, and the security of the chip is not high.

[0089] Optionally, the step S210 of obtaining the detected parameters of the metal regions can include the process of processing the detected parameters to obtain the processed detected parameters. For example, when the detected parameters of the metal regions are resistance values of the metal regions, the resistance values can be converted into digital signals, and then amplified to obtain the processed detected parameters. This process can make the subsequent judgment based on the detected parameters more accurate, and the process can be implemented by the following steps:

[0090] Please refer to Figure 5 ,Figure 5 Fig. 2 is a flowchart of a second embodiment of a safety detection method according to the present application, wherein S210 is a step of obtaining the to-be-detected parameters of each metal region, including:

[0091] S211, collecting the region physical parameters of each metal region.

[0092] S212, converting the collected region physical parameters into corresponding analog quantities.

[0093] S213, amplifying the converted analog quantities.

[0094] S214, AD converting the amplified analog quantities to obtain the to-be-detected parameters.

[0095] The above steps realize the process of amplifying and outputting the collected region physical parameters.

[0096] In S211, the region physical parameters of each metal region include but are not limited to the resistance value of each metal region or the voltage value of each metal region.

[0097] After collecting the region physical parameters of a metal region, S212 to S214 are performed to process the region physical parameters.

[0098] It should be noted that S212 can be realized by a DA converter in the chip 100 or by a reference unit 101 in the chip 100. The structure of the reference unit 101 can be as shown in Fig. 1. Figure 6

[0099] For example, as shown in Fig. 1, the reference unit 101 can include a data selector MUX, a reference resistor, and a reference device. If the conversion is based on the five metal regions A, B, C, D, and E, the data selector will select the metal regions A to E one by one in the conversion process, and the selected metal region will be turned on and thus connected to the reference device. Figure 6 Figure 3 The reference device is used to compare the resistance of the selected metal region with the reference resistance. If the resistance of the selected metal region is greater than the reference resistance, the reference device outputs an analog quantity corresponding to the resistance of the metal region (for example, Vo or Io in Fig. 1, where Vo is the voltage value of the metal region and Io is the current value of the metal region). The reference resistance is the smallest resistance value collected from the metal regions A to E. If the resistance of the selected metal region is equal to the reference resistance, the reference device outputs an analog quantity corresponding to the reference resistance.

[0100] Figure 6 ​​​​

[0101] Furthermore, the amplification process in step S213 can be implemented by a high-precision amplifier within chip 100, and the AD conversion in step S214 can be implemented by an AD converter.

[0102] The specific examples of steps S212 to S214 are described below:

[0103] If the regional physical parameters of each metal region collected in step S211 are resistance values, then the resistance values ​​are converted into corresponding current or voltage values ​​in step S212. Then, the current or voltage values ​​are amplified by a high-precision amplifier in step S213. The amplified current or voltage values ​​are converted into corresponding digital signals by an AD converter in step S214 to obtain the parameters to be detected.

[0104] Optionally, the process of collecting regional physical parameters of each metal region in step S211 above can be achieved through the following steps:

[0105] Please see Figure 7 , Figure 7 This is a schematic flowchart of a security detection method provided in an embodiment of the present invention. Step S211, which involves collecting regional physical parameters of each metal region, includes:

[0106] S2111, determine the area of ​​each metal region according to the standard region physical parameters of each metal region, wherein the standard region physical parameters are obtained according to a preset function.

[0107] S2112, based on the area of ​​each metal region, obtain the regional physical parameters of each metal region one by one.

[0108] The above steps realize the process of determining the area of ​​each metal region and obtaining the physical parameters of each region one by one based on the area of ​​each metal region.

[0109] In step S2111, the standard physical parameters of each metal region can be the standard resistance value or other physical parameters of each metal region obtained according to a preset function. The physical parameters of each standard region are obtained according to the preset function, and the area of ​​each metal region can be obtained by calculating the least common multiple of the physical parameters of each standard region.

[0110] The above step S2111 is based on Figure 3 The five metal regions A, B, C, D, and E are illustrated with specific examples below:

[0111] If the preset function is Figure 4 The regression line equation shown is y = kx + b, where k and b are integers, and the standard region parameters for each metal region are set as the standard resistance values ​​for each metal region.

[0112] Therefore, the standard resistance of each metal region can be set according to y=kx+b, if the standard resistance of metal region A is set as R1, the standard resistance of metal region B can be set as kR1+b, and the standard resistance of C, D and E can be set as kR2+b, kR3+b and kR4+b respectively according to the equation.

[0113] The least common multiple T of the standard resistance of each metal region is calculated, that is, T=[R1, R2, R3, R4, R5], and thus the area of each metal region is (S1, S2, S3, S4, S5)=(T / R1, T / R2, T / R3, T / R4, T / R5).

[0114] In the case that the k and b values of the regression straight line equation y=kx+b are different, the areas of the five metal regions A, B, C, D and E under each regression straight line equation are shown in the following table:

[0115]

[0116]

[0117] In the case that the k and b values of the regression straight line equation y=kx+b are different, the areas of the five metal regions A, B, C, D and E under each regression straight line equation are shown in the following table:

[0118] After the area of each metal region is determined according to the standard area physical parameters of each metal region, the step S2112 is continued to obtain the area physical parameters of each metal region one by one based on the area of each metal region. Further, obtaining the area physical parameters of each metal region one by one based on the area of each metal region can include obtaining the area physical parameters of each metal region one by one in the order of the area of each metal region from large to small.

[0119] Optionally, the area physical parameters include the actual resistance values of each metal region collected. The area physical parameters can also be other parameters that change due to the damage of the intruder, such as actual voltage values, actual current values, etc.

[0120] Optionally, after obtaining the to-be-detected parameters of each metal region one by one, it is necessary to determine whether the to-be-detected parameters meet the preset function, and the above specific process can be realized by the following steps:

[0121] Please refer to Figure 8 , Figure 8 Fig. 4 shows a flowchart of a security detection method provided by an embodiment of the present application, and step S220 of determining whether the to-be-detected parameters of each metal region meet the preset function includes:

[0122] S221, in the case that a preset number of to-be-detected parameters are obtained, the to-be-detected parameters are combined to obtain to-be-detected coordinates.

[0123] S222, determine whether the coordinates to be detected conform to a preset function, in order to determine whether the chip has been subjected to an intrusive attack.

[0124] The above steps realize the process of combining the various parameters to be detected into coordinates to be detected, and using the coordinates to be detected in combination with a preset function to determine whether the chip has been subjected to an intrusive attack.

[0125] Optionally, step S221 can be implemented through the following steps:

[0126] Please see Figure 9 , Figure 9 The fifth step of the flowchart of a security detection method provided by an embodiment of the present invention is shown. Step S221, which involves combining the parameters to be detected to obtain the coordinates to be detected after obtaining a preset number of parameters to be detected, includes:

[0127] S2211, for each preset number of continuously acquired parameters to be detected, according to the acquisition order of the preset number of parameters to be detected, the preset number of parameters to be detected are respectively used as the first coordinate value, the second coordinate value, the third coordinate value, ..., the Nth coordinate value, so as to obtain the coordinates to be detected.

[0128] Wherein, the preset quantity is N, where N is a natural number greater than 1, and the preset quantity is not greater than the number of each metal region.

[0129] The above steps realize the process of combining the preset number of continuously acquired parameters to be detected into coordinates to be detected.

[0130] The above steps can be illustrated with the following example:

[0131] For example, if the preset function is a two-dimensional equation (e.g., Figure 4 The regression line equation in the model is y = kx + b. In this case, the preset number of continuously acquired parameters is 2, meaning that every two consecutively acquired parameters are used to determine the regression line. Figure 3 Five metal regions A, B, C, D, and E are defined. After continuously acquiring the parameters to be detected for metal regions A and B (i.e., continuously acquiring the actual resistance values ​​R1' and R2' based on metal regions A and B), R1' and R2' are assigned the first coordinate value X1 and the second coordinate value X2, respectively. Then, X1 and X2 are combined to obtain the coordinates to be detected (X1, X2).

[0132] For example, if the preset function is a three-dimensional equation, then the preset number of continuously acquired detection parameters is 3, meaning that every three consecutive detection parameters need to be acquired. Based on... Figure 3Five metal regions A, B, C, D, and E are identified. After continuously acquiring the parameters to be detected for metal regions A, B, and C (i.e., continuously acquiring the actual resistance values ​​R1', R2', and R3' based on metal regions A, B, and C), R1', R2', and R3' are assigned the first coordinate value X1, the second coordinate value X2, and the third coordinate value X3, respectively. Then, X1, X2, and X3 are combined to obtain the coordinates to be detected (X1, X2, X3).

[0133] Optionally, after obtaining the coordinates to be detected, step S222 needs to be executed to determine whether the coordinates to be detected conform to a preset function, in order to determine whether chip 100 has been subjected to an intrusion attack. The above process can be specifically described as follows:

[0134] Please see Figure 10 , Figure 10 This illustration shows a sixth flowchart of a chip physical layer security detection method provided by an embodiment of the present invention. Step S222, which involves determining whether the coordinates to be detected conform to a preset function to determine whether the chip has been subjected to an intrusive attack, includes:

[0135] S2221, substitute the first coordinate value, the second coordinate value, the third coordinate value, ..., the (N-1)th coordinate value as independent variables into the preset function.

[0136] S2222, determine whether the result of the dependent variable, which is a preset function, is consistent with the value of the Nth coordinate.

[0137] If so, it is determined that the chip has not been subjected to an intrusive attack, and the process returns to the step of obtaining the parameters to be detected for each metal region.

[0138] If not, then the chip has been subjected to an intrusive attack.

[0139] The above steps realize the process of determining whether chip 100 has been subjected to an intrusive attack through a preset function.

[0140] Specifically, the preset function in step S2221 can be a two-dimensional equation, i.e. Figure 4 The regression line equation shown is y = kx + b. Therefore, based on this regression line equation, the process of determining whether chip 100 has been subjected to an intrusive attack can be illustrated as follows:

[0141] For example, based on Figure 3 The five metal regions A, B, C, D, and E, and Figure 4 In the case of the detection equation y=kx+b, if the standard physical parameters of the metal region A are preset to be the standard resistance value R1, and the standard physical parameters of the metal region B are preset to be the standard resistance value R2, and R2 is k·R1+b.

[0142] The parameters to be detected obtained in step S210 are actual resistance values R1' of the metal region A and actual resistance values R2' of the metal region B, and the R1' and R2' are respectively assigned to the first coordinate value X1 and the second coordinate value X2, and thus the to-be-detected coordinate is (X1, X2).

[0143] The first coordinate value X1 is substituted into the regression straight line equation y=kx+b to obtain y'=kX1+b, and the calculated y' value (i.e., the dependent variable of the preset function y=kx+b) is compared with the actually obtained X2. If the calculated y' value is the same as the actually obtained X2, it is indicated that the actually detected resistance values R1' and R2' conform to the regression straight line equation, and further, it is indicated that the actually detected resistance values R1' and R2' have not changed, and thus the chip 100 has not been subjected to an invasive attack.

[0144] If the resistance values R1' and R2' do not conform to the regression straight line equation in the above judgment process, it is indicated that the chip 100 has been subjected to an invasive attack, and an alarm signal can be sent based on this situation.

[0145] Optionally, in the case where it is determined that the chip 100 has been subjected to an invasive attack, the chip 100 needs to be controlled to perform a corresponding operation for alarm, and this process is implemented by the following steps.

[0146] Please refer to Figure 11 , Figure 11 Fig. 7 shows a flowchart of a security detection method according to an embodiment of the present application, and the security detection method further includes the following steps.

[0147] S230, in the case where it is determined that the chip has been subjected to an invasive attack, controlling the chip to perform a preset operation.

[0148] The above steps implement the process of controlling the chip 100 to perform a preset operation in the case where it is determined that the chip 100 has been subjected to an invasive attack.

[0149] For example, in the case where it is detected that the chip 100 has been subjected to an invasive attack, an alarm signal can be sent, and then other units of the chip 100 (for example, a clock unit is controlled to change the internal clock frequency, or a reset unit is controlled to reset the chip 100) are controlled, so that the chip 100 takes corresponding actions to prevent the intruder from stealing the data inside the chip 100 when the intruder intrudes.

[0150] Based on the above security detection method, an embodiment of the present application further provides a chip 100, and the flow steps in the above various implementation manners are applied to the chip 100, and corresponding technical effects are achieved.

[0151] Based on the above security detection method, the embodiment of the application further provides an electronic device, which comprises the chip 100 in the above implementation.

[0152] On the basis of the above steps, the whole detection process of the chip 100 is as follows:

[0153] Firstly, based on the five metal regions A, B, C, D and E in the chip 100 and the preset function in the chip 100 being a regression straight line equation y=kx+b, the standard resistance value of the metal region A is R1, the standard resistance value R2 of the metal region B is kR1+b, and the standard resistance values R3, R4 and R5 of the metal regions C, D and E respectively set according to the equation are kR2+b, kR3+b and kR4+b. Figure 3 Figure 4 According to the above setting, the standard resistance values corresponding to the metal regions are collected by the detection unit, and the areas of the metal regions A, B, C, D and E are calculated as S1, S2, S3, S4 and S5 respectively, and S1>S2>S3>S4>S5.

[0154] The detection process can be divided into five periods:

[0155] The first period: the reference unit 101 and the amplification unit 102 process the actual resistance value R1' of the metal region A as the first coordinate value X1, the detection unit 103 acquires the first coordinate value X1 and temporarily stores it, and then enters the second period;

[0156] The second period: the reference unit 101 and the amplification unit 102 process the actual resistance value R2' of the metal region B as the second coordinate value X2, the detection unit 103 acquires the second coordinate value X2 and also temporarily stores it, then the coordinate (X1, X2) is composed of X1 and X2, the coordinate (X1, X2) is substituted into the regression equation y=kx+b in the detection circuit, and the calculation result is sent to the arbitration unit 104 for arbitration; if the coordinate value does not conform to the regression equation, it is determined that the top metal region of the chip 100 is subjected to an invasive attack, a warning signal is sent to the control unit 105 to control the chip 100 to enter an abnormal state; if the detection is normal, the third period is entered;

[0157] The third period: the reference unit 101 and the amplification unit 102 process the actual resistance value R3' of the metal region C as the third coordinate value X3, the detection unit 103 acquires the third coordinate value X3 and also temporarily stores it, then the coordinate (X1, X2, X3) is composed of X1, X2 and X3, the coordinate (X1, X2, X3) is substituted into the regression equation y=kx+b in the detection circuit, and the calculation result is sent to the arbitration unit 104 for arbitration; if the coordinate value does not conform to the regression equation, it is determined that the top metal region of the chip 100 is subjected to an invasive attack, a warning signal is sent to the control unit 105 to control the chip 100 to enter an abnormal state; if the detection is normal, the fourth period is entered;

[0158] ​Third cycle: the reference unit 101 and the amplification unit 102 process the actual resistance value R3' of the C metal region as the second coordinate value X3, the detection unit 103 obtains the second coordinate value X3 and temporarily stores it, then takes X2 as the first coordinate value, and the second coordinate value X3 forms the coordinate (X2, X3) and is substituted into the regression equation y=kx+b, and the arbitration unit 104 and the control unit 105 make corresponding arbitration and control, if the chip 100 is detected to be attacked, the chip enters an abnormal state; if it is normal, it enters the fourth cycle;

[0159] Fourth cycle: the reference unit 101 and the amplification unit 102 process the actual resistance value R4' of the D metal region as the second coordinate value X4, the detection unit 103 obtains the second coordinate value X4 and temporarily stores it, then takes X3 as the first coordinate value, and the second coordinate value X4 forms the coordinate (X3, X4) and is substituted into the regression equation y=kx+b, and the arbitration unit 104 and the control unit 105 make corresponding arbitration and control, if the chip 100 is detected to be attacked, the chip 100 enters an abnormal state; if it is normal, it enters the fifth cycle;

[0160] Fifth cycle: the reference unit 101 and the amplification unit 102 process the actual resistance value R5' of the E metal region as the second coordinate value X5, the detection unit 103 obtains the second coordinate value X5 and temporarily stores it, then takes X4 as the first coordinate value, and the second coordinate value X5 forms the coordinate (X4, X5) and is substituted into the regression equation y=kx+b, and the arbitration unit 104 and the control unit 105 make corresponding arbitration and control, if the chip 100 is detected to be attacked, the chip 100 enters an abnormal state, otherwise the chip 100 works normally.

[0161] The detection process verifies the actual resistance values of five adjacent top metal regions, that is, the metal regions adjacent to each other A and B, B and C, C and D, and D and E are converted into digital signals, then the corresponding coordinates (x, y) are formed and substituted into the regression straight line equation adopted during design, if the coordinates of any one of the four groups of coordinates do not conform to the regression equation, it is determined that the chip 100 has been physically attacked, and the chip 100 is immediately controlled to enter an abnormal preset operation.

[0162] In several embodiments provided by the present application, it should be understood that the disclosed apparatus and method can also be implemented in other manners. The described apparatus embodiments are merely exemplary, and the implementation manners of the apparatus, method and computer program product according to the embodiments of the present application are shown in the flowcharts and block diagrams in the drawings. In this regard, each block in the flowcharts or block diagrams can represent a module, a program segment or a part of code, which comprises one or more executable instructions for implementing the specified logic function. It should also be noted that in some alternative implementations, the functions noted in the blocks can occur in a different order than that noted in the flowcharts. For example, two consecutive blocks can actually be executed substantially in parallel, or they can be executed in reverse order according to the functions involved. It should also be noted that each block in the flowcharts and / or block diagrams, and the combination of blocks in the flowcharts and / or block diagrams, can be implemented by a dedicated hardware-based system, or by a combination of special-purpose hardware and computer instructions.

[0163] In addition, each functional module in the various embodiments of the present application can be integrated together to form a separate part, or each module can exist independently, or two or more modules can be integrated to form a separate part.

[0164] The above description is merely illustrative of the preferred embodiments of the present application and is not used to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall fall within the protection scope of the present application.

Claims

1. A security detection method, characterized in that, Used for testing chips, the top layer of the chip has multiple metal regions of different areas, and the metal regions are not electrically connected to each other; The method includes: Obtain the parameters to be detected for each of the metal regions; Determine whether the parameters to be detected in each of the metal regions conform to a preset function, wherein the preset function is used to describe the relationship between the regional physical parameters of the metal regions; If the conditions are met, it is determined that the chip has not been subjected to an intrusive attack; If the condition is not met, it is determined that the chip has been subjected to an intrusive attack. The step of determining whether the parameters to be detected in each of the metal regions conform to a preset function includes: When a preset number of the parameters to be detected are obtained, for each preset number of consecutively obtained parameters to be detected, according to the acquisition order of the preset number of parameters to be detected, the preset number of parameters to be detected are sequentially used as the first coordinate value, the second coordinate value, the third coordinate value, ..., the Nth coordinate value to obtain the coordinates to be detected; wherein, the preset number is N, N is a natural number greater than 1, and the preset number is not greater than the number of each metal region; Determine whether the coordinates to be detected conform to the preset function to determine whether the chip has been subjected to an intrusive attack.

2. The security detection method according to claim 1, characterized in that, The step of obtaining the parameters to be detected for each of the metal regions includes: Collect the regional physical parameters of each of the aforementioned metal regions; The collected physical parameters of the area are converted into corresponding analog quantities; The converted analog quantity is then amplified. The amplified analog quantity is subjected to AD conversion to obtain the parameter to be detected.

3. The security detection method according to claim 2, characterized in that, The step of collecting the regional physical parameters of each of the metal regions includes: The area of ​​each metal region is determined according to the standard region physical parameters of each metal region, wherein the standard region physical parameters are obtained according to the preset function; The physical parameters of each metal region are obtained one by one based on the area of ​​each metal region.

4. The security detection method according to claim 2, characterized in that, The physical parameters of each region include the actual resistance values ​​of each metal region obtained.

5. The security detection method according to claim 1, characterized in that, The step of determining whether the coordinates to be detected conform to the preset function to determine whether the chip has been subjected to an intrusive attack includes: Substitute the first coordinate value, the second coordinate value, the third coordinate value, ..., the (N-1)th coordinate value as independent variables into the preset function; Determine whether the result of the dependent variable, which is the preset function, is consistent with the value of the Nth coordinate; If so, it is determined that the chip has not been subjected to an intrusive attack, and the process returns to the step of obtaining the parameters to be detected for each of the metal regions; If not, then the chip has been subjected to an intrusive attack.

6. The security detection method according to claim 1, characterized in that, The method further includes: If it is determined that the chip has been subjected to an intrusive attack, the chip is controlled to perform a preset operation.

7. A chip, characterized in that, The security detection method as described in any one of claims 1-6 is applied to the chip.

8. An electronic device, characterized in that, The electronic device includes the chip as described in claim 7.

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