Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and recording medium

Abstract

Provided is a substrate processing apparatus, a method of manufacturing a semiconductor device, and a recording medium, which improve processing capacity by achieving suppression of stagnation of a preceding substrate in a transfer chamber or the like and reduction of unused time of a processing chamber. Provided is a technology that includes: a plurality of processing chambers that process a substrate; a transfer chamber that has a transfer mechanism that transfers the substrate; and a control section that calculates a transferable substrate time in which the substrate can be transferred to each of the processing chambers, selects a substrate transfer path to the processing chamber that is the shortest time among the calculated transferable substrate times to each of the processing chambers, and performs control of the transfer mechanism based on the selected substrate transfer path.

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