Cleaning device

Abstract

The present application provides a kind of cleaning device capable of reducing cleaning liquid re-attachment to substrate and maintaining substrate cleaning. The cleaning device (1) of embodiment has: a plurality of rollers (100), including transmission part (101) and base part (102), the transmission part (101) is in contact with substrate (W) and makes substrate (W) rotate, the diameter of the base part (102) expands from the transmission part (101), the base part (102) includes the upper surface (102a) located below substrate (W);Cleaning liquid spray part (40) sprays cleaning liquid (L) relative to substrate (W);And cleaning part, by making brush (25) contact at least one face of rotating substrate (W), clean the face of substrate (W), groove (103) is formed on the upper surface (102a) of base part (102) from the rotation center side of roller (100) to the outer periphery.

Description

TECHNICAL FIELD

[0001] The present application relates to a cleaning device. BACKGROUND

[0002] In a manufacturing process of a semiconductor device, it is sometimes required to clean the surface of a wafer of a semiconductor as a substrate with high cleanliness. For example, after chemical mechanical polishing (CMP) is performed in order to planarize the surface of the substrate, fine particles (hereinafter, referred to as contaminants) such as sludge of polishing chips including organic matter, metal, slurry, and the like are attached to the surface of the substrate.

[0003] The contaminants hinder planar film formation and cause short circuit of a circuit pattern, and thus cause product failure. Therefore, it is necessary to remove the contaminants by cleaning the substrate with a cleaning liquid. As a device for performing such cleaning, a cleaning device using a rotating brush is known (see Patent Literature 1).

[0004] The cleaning device rotationally drives the substrate, and makes the rotating brush contact the surface of the substrate through a cleaning liquid, and moves the brush in a direction parallel to the substrate. Thereby, the contaminants attached to the surface of the substrate are floated by the cleaning liquid, and the contaminants are discharged to the outside of the substrate by the brush, and thus the substrate is cleaned as a whole.

[0005] The outer periphery of the substrate is held by a plurality of circular rollers, and the substrate is rotated by driving the rollers to rotate in the same direction. The rollers are provided with a large-diameter base portion below a transmission portion that contacts the substrate to rotate the substrate. The upper surface of the base portion is provided with a tapered surface that is inclined so as to be higher as it goes from the outer periphery toward the center of rotation. When the rollers that are waiting in a state of being separated from the substrate are moved in a direction to contact the substrate, the outer periphery of the back surface side of the substrate is brought into contact with the tapered surface and is guided upward, and reaches a position to contact the transmission portion, thereby holding the substrate.

[0006] PRIOR ART DOCUMENTS

[0007] PATENT LITERATURE

[0008] Patent Literature 1: Japanese Patent Application Laid-Open No. 2013-089797 SUMMARY

[0009] PROBLEMS TO BE SOLVED BY THE INVENTION

[0010] In this case, the cleaning liquid adhering to the rotating roller is discharged to the outside by the centrifugal force in the cleaning. However, the outer periphery of the back surface side of the substrate in contact with the transmission portion of the tapered surface is located at a close position, and a very narrow space is generated between the both. Therefore, the cleaning liquid entering the space between the outer periphery of the back surface side of the substrate and the tapered surface of the roller is easily left in the space by the surface tension to become a liquid pool. Moreover, this portion always becomes a state where the liquid pool is generated, and thus the discharge property of the cleaning liquid is poor. Therefore, the cleaning liquid is not discharged little by little by the centrifugal force, but is scattered to the outside when the amount of the liquid pool that cannot be left any more is accumulated, and thus the substrate is again adhered.

[0011] Moreover, since the transmission portion of the roller is rotated while being in contact with the outer peripheral end surface of the substrate, the portion of the roller in contact with the substrate is ground to generate dust (hereinafter, referred to as a particle). The particle is accumulated in the liquid pool of the tapered surface of the roller as described above together with the cleaning liquid. Then, when the cleaning liquid is scattered to the outside, the particle is also scattered to adhere to the back surface side of the substrate, and thus the cleanliness of the substrate is deteriorated.

[0012] The technical solution of the present application is made in order to solve the above-mentioned problems, and the object is to provide a cleaning device capable of reducing the re-adhesion of the cleaning liquid to the substrate and maintaining the cleanliness of the substrate.

[0013] Solution for solving the problem

[0014] In order to solve the above-mentioned problems, the technical solution of the present application provides a cleaning device characterized in that the cleaning device is provided with: a plurality of rollers including a transmission portion in contact with a substrate and rotating the substrate, and a base portion whose diameter is expanded from the transmission portion, the base portion including an upper surface located below the substrate; a cleaning liquid ejection portion ejecting a cleaning liquid with respect to the substrate; and a cleaning portion cleaning a surface of the substrate by contacting a brush to at least one surface of the rotating substrate, a groove reaching the outer periphery from the rotation center side of the roller is formed in the upper surface.

[0015] Effect of the invention

[0016] The technical solution of the present application can provide a cleaning device capable of reducing the re-adhesion of the cleaning liquid to the substrate and maintaining the cleanliness of the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a perspective view showing the schematic structure of the cleaning device of the embodiment.

[0018] Figure 2 (A) of is a plan view showing the shape of the roller, Figure 2 (B) of is a side view showing the shape of the roller.

[0019] Figure 3 (A) of FIG. 1 is a diagram showing a state in which the roll of the embodiment contacts a substrate, Figure 3 (B) of FIG. 1 is a diagram showing a state in which the roll without a groove contacts the outer periphery of the substrate, the right drawing is a plan view, and the left drawing is a D-D direction view of the right drawing.

[0020] Figure 4 (A) of FIG. 2 is a side view showing the roll in a release position, Figure 4 (B) of FIG. 2 is a side view showing the roll in a holding position.

[0021] Figure 5 (A) of FIG. 3 is a plan view showing the roll in the release position, Figure 5 (B) of FIG. 3 is a plan view showing the roll in the holding position.

[0022] Figure 6 is a side view showing the cleaning section.

[0023] Figure 7 (A) of FIG. 4 is a plan view showing the cleaning section in a start position of cleaning, Figure 7 (B) of FIG. 4 is a plan view showing the cleaning section in the middle of cleaning, Figure 7 (C) of FIG. 4 is a plan view showing the cleaning section in an end position of cleaning.

[0024] Figure 8 (A) of FIG. 5 is a plan view showing a modification example of the roll of the embodiment, Figure 8 (B) of FIG. 5 is a side view showing the modification example of the roll of the embodiment.

[0025] Explanation of Reference Numerals

[0026] 1, cleaning device; 10, rotation driving section; 11, first holding section; 12, second holding section; 13, first driving section; 14, second driving section; 20, cleaning section; 21, main body section; 23, brush holding member; 24, support body; 25, brush; 30, brush driving section; 31, arm; 32, driving mechanism; 40, cleaning liquid ejecting section; 41, nozzle; 41a, ejection port; 100, roll; 101, transmission section; 102, base section; 102a, upper surface; 102b, side surface; 103, groove. DETAILED DESCRIPTION

[0027] Hereinafter, an embodiment of the present application will be described with reference to the drawings. As shown in FIG. 1, the present embodiment is a cleaning device 1 which rotates a substrate W while cleaning the substrate W with a cleaning liquid L and a brush 25 (refer to FIG. 2). Figure 1 Figure 4 Figure 6 ​​The cleaning device 1 for cleaning. The substrate W to be cleaned is typically a semiconductor wafer, but it can also be a substrate for a display device or the like. The substrate W is circular, and chamfering is performed on its outer periphery (Japanese: bevel processing). That is, chamfering is performed by diagonal grinding.

[0028] [Structure]

[0029] As Figure 1 shown, the cleaning device 1 includes a rotation drive unit 10, a cleaning unit 20, a brush drive unit 30, and a cleaning liquid ejection unit 40.

[0030] (Rotation drive unit)

[0031] The rotation drive unit 10 rotationally drives the substrate W by rotating a plurality of rollers 100 that hold the outer periphery of the substrate W. The rotation drive unit 10 includes a first holding unit 11, a second holding unit 12, a first drive unit 13, and a second drive unit 14. The first holding unit 11 and the second holding unit 12 are arranged at positions facing each other across the substrate W.

[0032] Both the first holding unit 11 and the second holding unit 12 include a pair of rollers 100. The rollers 100 are provided so as to be able to rotate about an axis orthogonal to the substrate W. As Figure 2 shown in (A) of Figure 2 and (B) of Figure 3 , each roller 100 in the first holding unit 11 and the second holding unit 12 includes a transfer portion 101 and a base portion 102. The transfer portion 101 contacts the substrate W and rotates it (refer to

[0033] (A) of

[0034] Figure 3 . The transfer portion 101 has a cylindrical shape, and its side surface holds the substrate W by abutting against the outer periphery of the substrate W.

[0033] The base portion 102 is concentric with the transfer portion 101, and the base portion 102 has a cylindrical shape whose diameter expands from the transfer portion 101. The upper surface 102a of the base portion 102 forms an inclined surface located below the substrate W held by the transfer portion 101. The upper surface 102a is formed in a conical side surface shape like an umbrella, that is, a tapered surface, so as to become higher as it goes from the outer peripheral side toward the transfer portion 101 over the entire circumference. The side surface 102b of the base portion 102 is parallel to the rotation axis and is continuous with the upper surface 102a through a curved surface.

[0034] A plurality of grooves 103 are formed on the upper surface 102a, extending from the rotation center side of the roller 100 to the outer periphery. The grooves 103 are arranged at equal intervals along the circumference. For example, in this embodiment, the number of grooves 103 is 18. The width of the grooves 103 increases from the rotation center side toward the outer periphery. Furthermore, the grooves 103 are curved. More specifically, the grooves 103 are curved into a vortex shape along the rotation direction (curving in a direction not opposite to the rotation direction). Therefore, the inner wall of each groove 103 becomes a curved surface that bulges in the rotation direction from the rotation center side of the roller 100 toward the outer periphery. In each groove 103, the width may increase toward the outer periphery by making the curvature of the rear inner wall in the rotation direction greater than the curvature of the front inner wall. Furthermore, the grooves 103 are continuously formed from the upper surface 102a to the side surface 102b. As the groove 103 is thus formed, the upper surface 102a (the surface other than the groove 103) also widens as it moves from the center of rotation toward the outer periphery, and the boundary between it and the groove 103 is curved.

[0035] Furthermore, the roller 100 is formed of a material such as PCTFE or PEEK that is resistant to the cleaning solution L. More preferably, PCTFE, which has excellent abrasion resistance and is less likely to generate particles upon contact with the substrate W, is used.

[0036] like Figure 1 As shown, the first drive unit 13 supports the first holding unit 11, and the second drive unit 14 supports the second holding unit 12. The first drive unit 13 and the second drive unit 14 cause the roller 100 to rotate around its axis and move in the direction of approaching or moving away from the substrate W. A rotation mechanism (not shown) for driving the roller 100 is housed in the first drive unit 13 and the second drive unit 14.

[0037] The rotation mechanism is, for example, a belt drive mechanism. That is, by stretching belts that transmit driving force between the pulleys on the drive shaft of the motor that serves as the drive source and the pulleys on the drive shaft of one roller 100, and between the pulleys on the drive shafts of a pair of rollers 100, a pair of rollers 100 is configured to be able to rotate by a drive source. However, the rotation mechanism is not limited to this; for example, it may be configured to rotate each roller 100 by a motor separately provided on each roller 100.

[0038] Further, as described above, the first drive section 13 and the second drive section 14 are configured to be movable in a direction of approach or retreat with respect to the substrate W. That is, a drive mechanism, not shown, is provided at the lower end of each of the first drive section 13 and the second drive section 14, and the first drive section 13 and the second drive section 14 are moved in the direction of approach or retreat with respect to the substrate W by the drive mechanism. Thus, the first holding section 11 and the second holding section 12 are also moved in the direction of approach or retreat with respect to the substrate W. As the drive mechanism, for example, a rotary cylinder that moves drive shafts respectively provided at the lower end of the first drive section 13 and the lower end of the second drive section 14 in directions opposite to each other in a direction parallel to the surface of the substrate W can be used.

[0039] By the drive mechanism, the first holding section 11 and the second holding section 12 are moved in a direction away from each other, and thus, as shown in (A) of FIG. 10, Figure 4 Figure 5 the transfer section 101 of the roller 100 becomes a release position in which the roller 100 is separated from the substrate W. By the drive mechanism, the first holding section 11 and the second holding section 12 are moved in a direction close to each other, and thus, as shown in (B) of FIG. 10, Figure 4 Figure 5 the transfer section 101 of the roller 100 becomes a holding position in which the roller 100 is in contact with and holds the substrate W. Further, in Figure 4 , a state in which a pair of rollers 100 located in a position facing each other is arranged along the left-right direction in the figure is shown, and the illustration of the other rollers 100 is omitted.

[0040] (Washing section)

[0041] The washing section 20 washes the surface of the substrate W by bringing the rotating brush 25 into contact with the surface of the rotating substrate W. Further, the contact herein includes not only a case in which the brush 25 directly contacts, but also a case in which the brush 25 contacts through the cleaning liquid L. As shown in the side view of FIG. 11, Figure 6 the washing section 20 includes a main body section 21, a brush holding member 23, a support body 24, and a brush 25. The main body section 21 is a cylindrical container that houses a motor (not shown) in the inside. The motor is a drive source that rotates the brush 25.

[0042] The brush holding member 23 is a disc-shaped member that is attached to the drive shaft of the motor and on which the support body 24 is detachably provided. The brush holding member 23 is configured to be rotatable independently of the main body section 21. The support body 24 is a disc-shaped member that is fixed with the brush 25 and is detachable with respect to the brush holding member 23 by a chuck mechanism or the like.

[0043] ​​The brush 25 is a cylindrical component formed from a material that incorporates softness and elasticity. In this embodiment, the brush 25 uses a sponge-like resin such as PVA (nylon-based resin) or PTFE (fluoropolymer resin). Alternatively, a brush made of the same resin can also be used. That is, the brush 25 in this embodiment includes both brushes with sponge-like blocks and brushes composed of numerous densely packed bristles. Furthermore, the brush 25 consisting of sponge-like blocks also includes brushes composed of numerous densely packed fibers. Additionally, the number of brushes 25 provided on the support 24 can be single or multiple.

[0044] (Brush Driver Department)

[0045] like Figure 1 As shown, the brush drive unit 30 moves the cleaning unit 20 in a direction parallel to the surface of the substrate W. The brush drive unit 30 includes an arm 31 and a drive mechanism 32. The arm 31 is a member in a direction parallel to the substrate W, and the cleaning unit 20 is mounted at one end. The drive mechanism 32 includes a swing mechanism and a lifting mechanism.

[0046] like Figure 7 (A) Figure 7 As shown in (C), the swing mechanism causes the arm 31 to reciprocate parallel to the substrate W along an arc trajectory with the end opposite to the cleaning section 20 as its axis, moving from the outer periphery of the substrate W to the opposite outer periphery. Additionally, the swing mechanism causes the arm 31 to reciprocate from a standby position to the outer periphery of the substrate W. The swing mechanism includes a support shaft extending from the arm 31 in a direction orthogonal to the surface of the substrate W, and a motor (not shown) serving as a drive source for swinging the support shaft. When the substrate W is not being cleaned, the arm 31 is positioned in a standby position (not shown) located outside the substrate W.

[0047] like Figure 4 (A) Figure 4 As shown in (B), the lifting mechanism moves the arm 31 in the direction that the cleaning section 20 approaches or moves away from the substrate W. As the lifting mechanism, a ball screw mechanism, a working cylinder, or the like that can be used to raise and lower the support shaft of the arm 31 can be applied.

[0048] (Cleaning fluid spray section)

[0049] The cleaning fluid ejection section 40 ejects cleaning fluid L relative to the substrate W. The cleaning fluid ejection section 40 includes a nozzle 41, and the cleaning fluid L is ejected from the ejection outlet 41a at the front end of the nozzle 41 toward both sides of the rotating substrate W (see reference). Figure 7 (A) Figure 7(C)). The cleaning solution L in this embodiment is ozone water, pure water, SC-1 (a cleaning solution made by mixing ammonia water and hydrogen peroxide water), or an acidic solution (hydrofluoric acid, nitric acid, hydrochloric acid, etc.). For example, when the brush 25 is PVA, pure water is used for cleaning. In addition, when the brush 25 is PTFE, ozone water, SC-1, or an acidic solution is used. PTFE has liquid resistance, so cleaning solutions L such as ozone water, SC-1, and acidic solutions can be used together.

[0050] The nozzle 41 is a pair of cylindrical bodies that clamp the substrate W vertically. One end of the nozzle 41 is bent at, for example, 45° relative to the surface of the substrate W, and includes an outlet 41a that sprays cleaning liquid L toward the surface of the substrate W. Furthermore, the nozzle 41 sprays the cleaning liquid L from the outside of the substrate W toward the vicinity of the center of the surface of the substrate W, that is, in the middle of the moving path toward the brush 25.

[0051] The other end of nozzle 41 is connected via piping to a supply device for cleaning fluid L (not shown). The supply device includes a delivery device, valves, etc., connected to a pure water production device (pure water storage tank), an ozone water production device (ozone water storage tank), and an SC-1 supply device or an acid-based solution supply device, and can switchably supply pure water, ozone water, and any one of SC-1 or an acid-based solution. Furthermore, one nozzle 41 may be provided relative to each side of the substrate W, or multiple nozzles may be provided relative to each side of the substrate W. Additionally, the number of nozzles provided relative to one side of the substrate W may differ from the number provided relative to the other side of the substrate W.

[0052] like Figure 4 As shown, the cleaning unit 20, brush drive unit 30, and cleaning fluid spraying unit 40 described above are arranged in a pair, clamping the substrate W vertically, in a manner capable of cleaning the upper and lower surfaces (also referred to as the surface and back surfaces) of the substrate W. That is, the pair of arms 31 of the brush drive unit 30 are positioned above and below the substrate W such that the brushes 25 and spray nozzles 41a of each pair of cleaning units 20 face the substrate W. The drive mechanism 32 positions the pair of arms 31 at the contact position where the pair of brushes 25 contact the substrate W. Figure 4 (B)) and the separation position from the substrate W Figure 4 Move between (A)).

[0053] Additionally, the drive mechanism 32 causes a pair of arms 31 to swing, thereby, as Figure 7 (A) Figure 7 As shown in (C), the pair of brushes 25 located at the contact position move along an arc-shaped trajectory. When viewed from above, the contact position is as follows... Figure 7 As shown in (A), this is the starting point of the brush 25's oscillation, and the separation position is as follows. Figure 7The contact position is on the outer periphery of the substrate W, and the separation position is on the outer periphery of the substrate W opposite the contact position.

[0054] [Operation]

[0055] The operation of the cleaning device 1 having the above-described configuration will be described.

[0056] (Input of substrate)

[0057] First, the input operation of the substrate W will be described. That is, in the preceding process, the surface of the substrate W after processing is sprayed with ozone water, and an oxide film is formed, thereby performing hydrophilization. The surface of the substrate W on which the oxide film is formed is in a state in which organic contaminants (slurry, etc.), metal contaminants, and the like remaining in the CMP process as the preceding two processes are attached. This means that it is in a state in which ozone water is supplied in a state in which contaminants are attached to the front and back surfaces of the substrate W, that is, the oxide film is formed in a state in which contaminants are attached. The ozone water includes the ability to remove organic matter, but the preceding process is not a process for removing organic matter, and is ultimately a process for hydrophilizing the front and back surfaces of the substrate W.

[0058] The conveyance robot outputs the substrate W from the preceding process, and conveys it to the cleaning device 1, as shown in Figure 4 (A) of FIG. 1, Figure 5 (A) of FIG. 1, the substrate W is input to between the rollers 100 of the first holding section 11 and the rollers 100 of the second holding section 12. The input substrate W is placed on the upper surfaces 102a of the rollers 100. As shown in Figure 4 (B) of FIG. 1, Figure 5 (B) of FIG. 1, the first holding section 11 and the second holding section 12 are moved in a direction in which they approach each other. Then, the four rollers 100 are moved toward the substrate W, and thus the inclined portions of the upper surfaces 102a of the base sections 102 push up the outer periphery of the substrate W, and the side surfaces of the transmission sections 101 come into contact with the outer periphery of the substrate W, thereby holding the substrate W.

[0059] (Cleaning of substrate)

[0060] Next, the cleaning operation of the substrate W will be described. As shown in Figure 2 (A) of FIG. 2, Figure 5 (B) of FIG. 2, the rollers 100 are rotated clockwise in the drawing, and thus the substrate W is rotated counterclockwise. For example, the rotation is performed at a low speed of 20 rpm to 60 rpm. As shown in Figure 2 (A) of FIG. 2, in a case in which the side surfaces of the transmission sections 101 of the rollers 100 are in contact with the outer periphery of the substrate W, the rotation of the rollers 100 is transmitted to the substrate W, and the rotation of the substrate W is maintained.

[0061] The upper and lower arms 31 are initially in a standby position located outside the substrate W. While in the standby position, the upper and lower arms 31 rotate the brush 25 via a motor, and... Figure 7 As shown in (A), the brush 25 of the cleaning section 20 swings to the outer periphery of the substrate W and stops temporarily. Then, by moving the upper and lower arms 31 toward each other in a direction closer to the substrate W, the brush 25 of the upper and lower cleaning section 20 moves as shown in (A). Figure 4 As shown in (B), it contacts the surface and back of the substrate W, thereby clamping the substrate W. Furthermore, the blackened arrows in the figure indicate the direction of rotation of the substrate W.

[0062] Then, by rotating the upper and lower arms 31, the upper and lower brushes 25 move horizontally. At this time, since the cleaning fluid L is sprayed out from the nozzle 41 outlet 41a, the cleaning fluid L flows between the brushes 25 and the substrate W. That is, as Figure 7 (A) Figure 7 As shown in (B), the brush 25, moving from one side of the outer periphery of the substrate W, moves along an arc trajectory indicated by the white arrow in the figure, extruding contaminants along with the cleaning fluid L towards the outer periphery of the substrate W. Figure 7 As shown in (C), when the brush 25 moves past the other side of the outer periphery of the substrate W and detaches from the substrate W, the brush 25 stops rotating, stops spraying the cleaning liquid L from the spray nozzle 41a, and ends the cleaning process.

[0063] Then, the upper and lower arms 31 are moved away from each other, thereby separating the upper and lower brushes 25, and the arms 31 swing back to a standby position outside the outer periphery of the substrate W. Furthermore, the brushes 25 can be used for multiple cleaning cycles by repeating the above actions. In this case, after each cleaning cycle, the arms 31 return to the starting cleaning position (see reference). Figure 4 (A) Figure 7 (A)).

[0064] A groove, not shown, is provided on the side of the transfer section 101 for the end face of the substrate W to enter. Therefore, when the end face of the substrate W contacts and is held by the rotating transfer section 101, the end face of the substrate W enters the groove, thereby... Figure 3 As shown in (A), the substrate W is slightly raised from the upper surface 102a. Furthermore, on the upper surface 102a of the base portion 102 of the roller 100, the groove 103, which serves as the path for the cleaning fluid L, reaches the side surface 102b. Therefore, the cleaning fluid L flowing between the substrate W and the upper surface 102a falls from the upper surface 102a into the groove 103 and moves towards the side surface 102b to be discharged. As a result, compared to a conventional roller 100 without the groove 103, the amount of cleaning fluid L (which is stretched due to surface tension) present between the substrate W and the upper surface 102a is extremely small.

[0065] In addition, by providing the groove 103 in the upper surface 102a, the area of the upper surface 102a is narrower than in the case where the groove 103 is not provided, and thus the amount of the cleaning liquid L originally adhering to the upper surface 102a is less than in the past. That is, the cleaning liquid L adhering to the portion of the upper surface 102a of the roller 100 exposed from the substrate W is discharged from the groove 103 by the centrifugal force generated by the rotation of the roller 100. Thus, the cleaning liquid L is not left but is substantially discharged, and thus the amount of the cleaning liquid L adhering to the upper surface 102a is less when the upper surface 102a of the roller 100 enters the back surface of the substrate W. Therefore, even if the substrate W is together with the cleaning liquid L flowing into the upper surface 102a, the amount of the liquid scattered toward the substrate W is less because the amount of the liquid is originally small.

[0066] In addition, the gap between the groove 103 portion and the back surface of the substrate W is larger than the gap between the upper surface 102a and the back surface of the substrate W, and thus the cleaning liquid L flowing into the groove 103 is easily discharged by the centrifugal force generated by the rotation of the roller 100. That is, as described above, the area of the upper surface 102a of the present embodiment including the groove 103 is smaller than the area of the upper surface 102a of the conventional roller 100 not including the groove 103. Therefore, the portion (area) of the upper surface 102a in contact with the outer circumferential surface of the back surface side of the substrate W is less than in the past. If the area of the upper surface 102a is small, the amount of the cleaning liquid L flowing into and remaining between the upper surface 102a and the back surface of the substrate W is extremely small compared to the past. Thus, even if the cleaning liquid L flows between the upper surface 102a and the back surface of the substrate W, the amount of the cleaning liquid L remaining is small by being discharged from between the upper surface 102a and the back surface of the substrate W to the groove 103. Therefore, there is no case where the fine particles generated by the grinding of the portion of the roller 100 in contact with the end surface of the substrate W, that is, the transfer portion 101, and the accumulated liquid are continuously accumulated between the upper surface 102a and the back surface of the substrate W, and the amount of the cleaning liquid L scattered from the roller 100 can be suppressed, and thus the cleaning liquid L scattered toward the substrate W is less, and reattachment to the substrate W is reduced.

[0067] Here, as described above, Figure 3In the case where the groove 103 is not present, as shown in (B), a pool of the cleaning liquid L is always generated in a narrow space between the upper surface 102a and the back surface of the substrate W, and fine particles generated by the polishing of the transmission portion 101 in contact with the end surface of the substrate W are accumulated in this pool. Therefore, when the cleaning liquid L accumulated in an amount that cannot be retained is suddenly scattered to the outside, the cleaning liquid L is again attached to the substrate W. Further, it is also considered that the pool is less likely to be generated by making the angle of the inclined surface of the upper surface 102a steeper. However, in this case, during the holding operation of the substrate W, the outer periphery of the substrate W is difficult to move along the inclined surface. That is, since the angle of the inclined surface of the upper surface 102a must be gentle, the space between the upper surface 102a and the substrate W is narrowed, and the pool is easily generated.

[0068] (EFFECTS)

[0069] (1) The cleaning device 1 of the present embodiment as described above is provided with: a plurality of rollers 100 including a transmission portion 101 that comes into contact with the substrate W and rotates the substrate W, and a base portion 102 whose diameter expands from the transmission portion 101, the base portion 102 including an upper surface 102a located below the substrate W; a cleaning liquid ejection portion 40 that ejects the cleaning liquid L with respect to the substrate W; and a cleaning portion 20 that cleans the surface of the substrate W by bringing a brush 25 into contact with at least one surface of the rotating substrate W, a groove 103 that reaches the outer periphery from the rotation center side of the roller 100 is formed in the upper surface 102a of the base portion 102.

[0070] Therefore, the generation of a pool between the substrate W due to the cleaning liquid L attached to the rotating roller 100 can be suppressed, the cleaning liquid L can be efficiently discharged along with the fine particles by means of the groove 103, and thus the reattachment to the substrate W can be reduced, and the substrate W can be maintained clean.

[0071] (2) The groove 103 is provided with a plurality of grooves. Therefore, by providing a plurality of grooves 103, the area of the upper surface 102a is narrowed, and the portion where the space between the back surface of the substrate W is large is increased, and thus the pool is less likely to be generated.

[0072] (3) The width of the groove 103 is widened as it goes from the rotation center side toward the outer periphery. In addition, the groove 103 is curved. Furthermore, the groove 103 is expanded in a state of being curved in a spiral shape along the rotation direction (curved in a direction opposite to the rotation direction). Thus, the cleaning liquid L flowing into the groove 103 is smoothly discharged without being opposite to the rotation direction of the roller 100. Furthermore, by making the curved surface a steeper curved surface, the discharge property of the cleaning liquid L into the groove 103 can be made good. In addition, by widening the width of the groove 103 from the rotation center side toward the outer periphery, and making the groove 103 curved, the distance is made longer than when made straight, and the area of the upper surface 102a is narrowed, and the pool is less likely to be generated.

[0073] Furthermore, reducing the area of ​​the upper surface 102a provides a greater effect in preventing liquid accumulation, but it also reduces the contact area between the outer peripheral surface of the back side of the substrate W and the upper surface 102a. Consequently, the resistance relative to the upper surface 102a increases, making it difficult for the substrate W to slide on the upper surface 102a while being held. Due to friction between the upper surface 102a and the substrate W, the upper surface 102a is ground, easily generating cutting chips. Therefore, the optimal width of the upper surface 102a, the number of upper surfaces 102a or grooves 103, and the curvature of the curve are preferably determined through experiments, etc.

[0074] (5) The substrate 102 includes a side surface 102b that is continuous with the outer periphery of the upper surface 102a, and a groove 103 is formed continuously from the upper surface 102a to the side surface 102b. Therefore, the cleaning liquid L flowing in the groove 103 of the side surface 102b is discharged from a position away from the substrate W, thus preventing the cleaning liquid L from re-adhering to the substrate W.

[0075] (Modified Example)

[0076] This embodiment is not limited to the above solution, and can also be modified as follows.

[0077] (1) The number of slots 103 can be more than one. For example, such as Figure 8 (A) Figure 8 As shown in (B), it can also be set to 4. In addition, the more grooves 103 there are, the more free space under the substrate W can be increased, which can suppress liquid accumulation and further promote the discharge of cleaning liquid L.

[0078] (2) The shape of the groove 103 can also be straight. In this case, it is also possible to create an empty space below the substrate W and generate outward flow. However, by making the groove 103 curved, especially by bending multiple grooves 103 into a vortex shape along the direction of rotation, it is possible to promote outward flow, which is more preferable.

[0079] (3) The number of rollers 100 is not limited to the above-described scheme. In addition, the structure of the cleaning unit 20 is not limited to the above-described scheme. For example, it can also be a structure that uses a brush 25 to clean only one side of the substrate W. It can also be a structure in which a cylindrical brush 25 with an axis parallel to the surface of the substrate W is used to clean the substrate W by contacting the side of the brush 25 with the substrate W.

[0080] [Other Implementation Methods]

[0081] The above describes the embodiment of the present application and the modification of each part, but the embodiment and the modification of each part are presented as an example and are not intended to limit the scope of the application. The above new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made within the scope of the gist of the application. The embodiments and the modifications thereof are included in the scope and gist of the application and are included in the technical solution described in the claims.

Claims

1. A cleaning apparatus characterized by comprising: a plurality of rollers including a transmission portion and a base portion, the transmission portion being in a cylindrical shape, a side surface of the transmission portion being in contact with a substrate and rotating the substrate, the base portion being in a cylindrical shape in which a diameter is expanded from the transmission portion, the base portion including an upper surface positioned below the substrate and capable of placing the substrate, an outer periphery of the upper surface of the base portion being continuous with a side surface of the base portion through a curved surface; a cleaning liquid ejection portion ejecting a cleaning liquid with respect to the substrate; and a cleaning portion cleaning a surface of the substrate by bringing a brush into contact with at least one surface of the rotating substrate, a plurality of grooves reaching the outer periphery from a rotation center side of the roller are formed in the upper surface.

2. The cleaning apparatus according to claim 1, characterized in that a width of the groove is widened as going from the rotation center side of the roller toward the outer periphery.

3. The cleaning apparatus according to claim 1 or 2, characterized in that the groove is in a curved line shape.

4. The cleaning apparatus according to claim 1 or 2, characterized in that the groove is continuously formed from the upper surface of the base portion to the side surface of the base portion. ​ ​

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