Headphone heat dissipation structure and wearable headphones

Abstract

The earphone heat dissipation structure comprises an earphone body, an ear sleeve and a clamping piece type heat dissipation frame. The earphone body comprises a bottom shell, a face shell and a sound generating component. The ear sleeve has a filling part and a protective outer cover. The clamping piece type heat dissipation frame comprises a first annular inclined piece, an annular exposed plate and a second annular inclined piece. The first annular inclined piece, the annular exposed plate and the second annular inclined piece are respectively provided with a closed cavity in communication with each other, and the closed cavity is used for accommodating liquid refrigerant. The first annular inclined piece is accommodated in the filling part, and the second annular inclined piece is arranged in the face shell. The annular exposed plate is connected with the first annular inclined piece and the second annular inclined piece respectively, forming a double circulation channel for heat transfer and release. The path of the liquid refrigerant carrying heat is optimized, so that the face shell and the ear sleeve are simultaneously cooled, and the heat dissipation effect of the earphone heat dissipation structure is better.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of earphones, in particular to an earphone heat dissipation structure and a wearable earphone. BACKGROUND

[0002] Nowadays, although good sound insulation sponge is used in the head-mounted earphone to ensure wearing comfort and good sound insulation performance, when the user wears the head-mounted earphone for a long time, the poor air permeability of the ear sleeve sponge of the head-mounted earphone can easily cause ear sweating, resulting in poor wearing experience of the head-mounted earphone.

[0003] In order to solve the above problems, a head-mounted earphone with pulsating heat pipes is proposed in patent publication CN207612397U, which improves the heat dissipation efficiency of the ear pad by winding a plurality of pulsating heat pipes on the ear pad (i.e. ear sleeve), thereby enhancing the wearing comfort of the user. Specifically, the pulsating heat pipes are wound in the form of spiral turns on the filler of the ear sleeve, or in other words, an annular heat dissipation frame similar to a spiral spring pipe is made in advance during the manufacture of the ear sleeve, and then the heat dissipation frame is built into the filler to form an inner container of the ear sleeve, and finally a protective outer sleeve such as leather, leather sleeve, etc. is provided outside the inner container. Although the above technical solution arranges the heat pipes in the form of spiral hollowing in the ear sleeve, its working principle is to bring the heat of the contact surface of the leather sleeve or leather, which directly contacts the human ear, to the side and back of the ear sleeve through the heat dissipation frame for heat dissipation, that is, the contact surface of the leather sleeve and leather with the ear is used as the liquid coolant evaporation zone, and the side and back of the ear sleeve are used as the liquid coolant condensation zone, so as to realize the effect of dissipating the heat accumulated at the contact position of the human ear and the ear sleeve.

[0004] However, the above patent still has the following problems:

[0005] 1. Firstly, the heat dissipation frame of the above patent is fully wrapped around the ear sleeve, and the area distributed on the ear sleeve is also relatively large, and the non-human contact area of the side wall and the back of the ear sleeve is also well utilized. However, since the heat dissipation frame needs to be wrapped in the leather sleeve or leather protective layer of the ear sleeve, the heat dissipation effect of the leather and leather is relatively general in the use process, that is, the temperature difference between the evaporation end and the heat dissipation end of the above patent is relatively small.

[0006] 2. Secondly, since the heat dissipation frame is wound in the form of spiral winding around the filler, but since the filler is considered to be soft in terms of tactile feel for wearing comfort, the structural strength of the pulsating heat pipe itself is poor, and when a large external force is applied, the overall structure of the heat dissipation frame can be deformed, and even the local heat pipe can be broken. SUMMARY

[0007] The earphone heat dissipation structure and the wearing earphone have the advantages that the temperature difference between the evaporation end and the heat dissipation end is large, the path of the liquid refrigerant carrying heat is more optimized, the heat dissipation effect is better, the structural strength of the heat dissipation frame is higher, and the resistance to external impact force is higher.

[0008] The purpose of the present application is achieved by the following technical solutions:

[0009] The earphone heat dissipation structure and the wearing earphone have the advantages that the temperature difference between the evaporation end and the heat dissipation end is large, the path of the liquid refrigerant carrying heat is more optimized, the heat dissipation effect is better, the structural strength of the heat dissipation frame is higher, and the resistance to external impact force is higher.

[0010] In one of the embodiments, the annular exposed plate is provided with a partition plate, and the two sides of the partition plate are connected with the first annular inclined plate and the second annular inclined plate, respectively.

[0011] In one of the embodiments, the first annular inclined plate is formed with a first evaporation area in the sealed cavity, the second annular inclined plate is formed with a second evaporation area in the sealed cavity, and the annular exposed plate is formed with a condensation area in the sealed cavity, and the partition plate is located in the condensation area, so that the condensation area is formed with a first condensation area and a second condensation area, the first condensation area is communicated with the first evaporation area, and the second condensation area is communicated with the second evaporation area.

[0012] In one of the embodiments, the earphone heat dissipation structure has two clamping piece type heat dissipation frames, and the two clamping piece type heat dissipation frames are oppositely arranged.

[0013] In one of the embodiments, the first annular inclined plate, the annular exposed plate and the second annular inclined plate are integrally formed.

[0014] In one of the embodiments, the second annular inclined plate is injection molded in the face shell.

[0015] In one of the embodiments, a plurality of sound holes are formed on the face shell, and the plurality of sound holes are communicated with the mounting cavity.

[0016] In one of the embodiments, an ice-feeling cloth is arranged between the filling part and the protective outer cover.

[0017] In one of the embodiments, the cross section of the clip-type heat dissipation frame is Y-shaped.

[0018] A wearable earphone comprises a headband and two earphone heat dissipation structures according to any one of the above embodiments, and the two ends of the headband are arranged on the two bottom shells respectively.

[0019] Compared with the prior art, the present application has the following advantages, but is not limited to the following:

[0020] 1. Since the annular exposed plate is exposed to the air, the temperature difference between the annular exposed plate and the first and second annular inclined plates is large, i.e. the temperature difference between the heat dissipation end and the evaporation end is large, so that the flow of the liquid refrigerant is faster, thereby improving the heat dissipation efficiency of the clip-type heat dissipation frame, and the heat dissipation effect of the earphone heat dissipation structure is better.

[0021] 2. By connecting the annular exposed plate with the first and second annular inclined plates respectively, a double-circulation channel for heat transfer and release in the earphone is formed, so that the path of the liquid refrigerant carrying heat is more optimized, i.e. the face shell is also cooled while the ear sleeve is cooled, thereby increasing the heat dissipation effect of the earphone heat dissipation structure.

[0022] 3. The first and second annular inclined plates are in the form of a sheet, the annular exposed plate is in the form of a plate, and the clip-type heat dissipation frame formed by the three is in the form of a clip, so that the structural strength of the clip-type heat dissipation frame is high, the resistance to external impact force is also high, thereby prolonging the service life of the clip-type heat dissipation frame. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0024] Figure 1 Fig. 1 is a structural schematic diagram of an earphone heat dissipation structure in an embodiment;

[0025] Figure 2 Fig. 2 is an enlarged view of the earphone heat dissipation structure shown in Fig. 1 at a; Figure 1

[0026] ​Figure 3 FIG. 1 is a schematic view of a structure of a wearable earphone according to an embodiment of the present application; Figure 1 FIG. 2 is a schematic view of a structure of a faceplate of an earphone heat dissipation structure according to an embodiment of the present application;

[0027] Figure 4 FIG. 4 is a schematic view of a structure of a wearable earphone according to another embodiment of the present application;

[0028] Figure 5 FIG. 5 is a schematic view of a structure of an earphone heat dissipation structure according to another embodiment of the present application. DETAILED DESCRIPTION

[0029] In order to facilitate the understanding of the present application, a more complete understanding of the present application can be had by reference to the following description and the accompanying drawings, in which preferred embodiments of the present application are illustrated. The present application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.

[0030] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. The term "comprises" as used herein is intended to include any and all combinations of one or more associated items.

[0031] Unless otherwise defined, all terms used in disclosing the application, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this description, the terms "may" and "can" include any one of, or all of, possible combination of the items that they introduce.

[0032] The present application provides an earphone heat dissipation structure, comprising: an earphone body, an earmuff, and a clip-type heat dissipation frame, wherein the earphone body comprises a bottom shell, a top shell, and a sound-generating component, wherein the top shell is buckled onto the bottom shell, and the bottom shell and the top shell form a mounting cavity, wherein the sound-generating component is mounted within the mounting cavity, and an annular mounting groove is provided on the top shell, and an annular mounting area is further provided on the top shell, wherein the annular mounting groove is arranged around the annular mounting area; the earmuff comprises a filling portion and a protective outer cover, wherein the protective outer cover is connected to the annular mounting area, and ... The filling part is filled and arranged in the protective outer cover; the clip-type heat sink includes a first annular bevel, an annular exposed plate and a second annular bevel, the annular exposed plate is respectively connected to the first annular bevel and the second annular bevel, and the first annular bevel, the annular exposed plate and the second annular bevel are respectively provided with mutually connected closed cavities, and the closed cavities are used to accommodate liquid refrigerant; the first annular bevel is accommodated in the filling part, the annular exposed plate is installed in the annular mounting groove, and the second annular bevel is arranged in the surface shell.

[0033] To better understand the technical solutions and beneficial effects of the present application, the present application is further described in detail below with reference to specific embodiments:

[0034] See also Figures 1 to 3 , which is an earphone heat dissipation structure 10 according to an embodiment of the present invention, comprising: an earphone body 100, an earmuff 200 and a clip-type heat dissipation frame 300, the earphone body 100 comprises a bottom shell 110, a surface shell 120 and a sound-generating component 130, the surface shell 120 is buckled on the bottom shell 110, and the bottom shell 110 and the surface shell 120 form a mounting cavity 101, the sound-generating component 130 is mounted in the mounting cavity 101, the surface shell 120 is provided with an annular mounting groove 1201, the surface shell 120 is further provided with an annular mounting area 1202, the annular mounting groove 1201 is arranged around the annular mounting area 1202; the earmuff 200 has a filling portion 210 and a protective outer cover 220, the protective outer cover 220 and The annular installation area 1202 is connected, and the filling part 210 is filled and set in the protective outer cover 220; the clip-type heat dissipation frame 300 includes a first annular bevel 310, an annular exposed plate 320 and a second annular bevel 330, and the annular exposed plate 320 is respectively connected to the first annular bevel 310 and the second annular bevel 330, and the first annular bevel 310, the annular exposed plate 320 and the second annular bevel 330 are respectively provided with mutually connected closed cavities, and the closed cavities are used to accommodate liquid refrigerant; the first annular bevel 310 is accommodated in the filling part 210, the annular exposed plate 320 is installed in the annular installation groove 1201, and the second annular bevel 330 is set in the surface shell 120.

[0035] In the embodiment, the sound generating component generates heat in the installation cavity 101 during operation, and part of the heat is transferred to the face shell 120 through air flow, causing the face shell 120 to heat up. In addition, when the wearable earphone is worn on the human ear, the ear sleeve 200 in direct contact with the human ear gradually heats up due to the body temperature of the human body. Long-term wearing of the earphone can cause the human ear to sweat, affecting the wearing experience of the earphone. However, through the arrangement of the clamping piece type heat dissipation frame 300, the clamping piece type heat dissipation frame 300 includes a first annular inclined piece 310, an annular exposed plate 320, and a second annular inclined piece 330. The first annular inclined piece 310 is arranged in the filler of the ear sleeve 200, and the second annular inclined piece 330 is arranged in the face shell 120. The face shell 120 is provided with an annular mounting groove 1201, and the annular mounting groove 1201 is provided with the annular exposed plate 320. Therefore, the annular exposed plate 320 is located outside the earphone body 100 and outside the ear sleeve 200, that is, the annular exposed plate 320 is exposed to the air. Specifically, the second annular inclined piece 330 is connected with the annular exposed plate 320. When the face shell 120 heats up, the second annular inclined piece 330 located in the face shell 120 heats up, causing the liquid refrigerant in the sealed cavity of the second annular inclined piece 330 to absorb heat and evaporate. At this time, the temperature of the annular exposed plate 320 is relatively lower than that of the second annular inclined piece 330. Under the influence of the pressure difference, the steam-like refrigerant flows to the sealed cavity of the annular exposed plate 320 with lower temperature. Then, the steam-like refrigerant condenses into liquid state and releases heat to the air outside. In this way, the temperature of the face shell 120 is reduced. Similarly, when the ear sleeve 200 heats up, the first annular inclined piece 310 in the ear sleeve 200 heats up, causing the liquid refrigerant in the sealed cavity of the first annular inclined piece 310 to absorb heat and evaporate. The steam-like refrigerant also flows to the sealed cavity of the annular exposed plate 320 with lower temperature. The steam-like refrigerant condenses into liquid state and releases heat to the air outside. In this way, the temperature of the ear sleeve 200 is reduced, thereby avoiding sweating of the user when wearing the earphone and improving the wearing experience of the user.It can also be understood that, in the initial stage of the user wearing the earphone, at this time the sound generating component just starts to operate, the heat generated by the sound generating component is gradually transferred from the mounting cavity 101 to the face shell 120, and in addition, the face shell 120 is usually made of plastic, so the heat conduction of the face shell 120 is poor, that is, the face shell 120 heats up slowly, while the temperature of the human ear is constant, the ear sleeve 200 in direct contact with the human ear is heated and heated, and the heating speed of the ear sleeve 200 is faster than that of the face shell 120; therefore, in the initial stage of using the earphone, that is, when the temperature of the ear sleeve 200 is greater than that of the face shell 120, the liquid refrigerant in the closed cavity of the first annular inclined plate 310 absorbs heat and evaporates, then the closed cavities of the second annular inclined plate 330 and the annular exposed plate 320 simultaneously act as the condensing end of the refrigerant, that is, the vapor-like refrigerant flows into the closed cavities of the annular exposed plate 320 and the second annular inclined plate 330 in turn, the vapor-like refrigerant condenses into liquid state, and the heat is released to the air outside through the annular exposed plate 320, and the cycle is repeated; with the long-time use of the earphone, the temperature of the face shell 120 gradually rises, and the temperature of the face shell 120 is greater than or equal to the temperature of the ear sleeve 200, at this time, the heat transfer and release in the double-circulation mode are carried out in the clamping-plate heat dissipation frame 300, that is, the heat transfer and release between the first annular inclined plate 310 and the annular exposed plate 320 are completed, and at the same time, the heat transfer and release between the second annular inclined plate 330 and the annular exposed plate 320 are also completed.

[0036] In the embodiment, since the annular exposed plate 320 is exposed to the air, the temperature difference between the annular exposed plate 320 and the first annular inclined plate 310 and the second annular inclined plate 330 is large, that is, the temperature difference between the heat dissipation end and the evaporation end is large, so that the flow of the liquid refrigerant is faster, thereby improving the heat dissipation efficiency of the clamping-plate heat dissipation frame 300, and the heat dissipation effect of the earphone heat dissipation structure 10 is better; by connecting the annular exposed plate 320 with the first annular inclined plate 310 and the second annular inclined plate 330 respectively, a double-circulation channel for heat transfer and release in the earphone is formed, so that the path of the liquid refrigerant carrying heat is more optimized, that is, while the ear sleeve 200 is cooled, the face shell 120 is also cooled, thereby increasing the heat dissipation effect of the earphone heat dissipation structure 10; and the first annular inclined plate and the second annular inclined plate are provided in the form of a plate, and the annular exposed plate 320 is provided in the form of a plate, and the clamping-plate heat dissipation frame 300 formed by the three is in the form of a clamping plate, so that the structural strength of the clamping-plate heat dissipation frame 300 is high, and the resistance to external impact force is also high, thereby prolonging the service life of the clamping-plate heat dissipation frame 300.

[0037] In one of the embodiments, please refer to Figure 2A partition 325 is provided in the annular exposed plate 320, and the two sides of the partition 325 are respectively connected to the first annular bevel 310 and the second annular bevel 330. In this embodiment, the closed cavity of the first annular bevel 310 is isolated from the closed cavity of the second annular bevel 330 by providing the partition 325. It can be understood that the vapor-like refrigerant formed in the closed cavity of the first annular bevel 310 is liquefied in the closed cavity of the annular exposed plate 320, and the transferred heat is released from the annular exposed plate 320. At the same time, the vapor-like refrigerant formed in the closed cavity of the second bevel is also liquefied in the closed cavity of the annular exposed plate 320, and the heat is released from the annular exposed plate 320. In this way, the synchronous heat dissipation of the earmuff 200 and the face shell 120 is ensured, and the heat dissipation effect of the earphone heat dissipation structure 10 is enhanced.

[0038] Further, see Figure 2 A first evaporation zone 3101 is formed in the closed cavity of the first annular oblique plate 310, a second evaporation zone 3301 is formed in the closed cavity of the second annular oblique plate 330, a condensation zone 3201 is formed in the closed cavity of the annular exposed plate 320, and the partition 325 is located in the condensation zone 3201 so that the condensation zone 3201 forms a first condensation zone 3201a and a second condensation zone 3201b. The first condensation zone 3201a is connected to the first evaporation zone 3101, and the second condensation zone 3201b is connected to the second evaporation zone 3301. In this embodiment, the condensation area 3201 is divided into a first condensation area 3201a and a second condensation area 3201b by the partition 325. It can be understood that when the earmuff 200 dissipates heat, the liquid refrigerant absorbs heat and evaporates in the first evaporation area 3101 to form a vapor state, and the vapor state refrigerant flows to the first condensation area 3201a with a lower temperature, and condenses into a liquid state in the first condensation area 3201a, and then releases the heat through the annular exposed plate 320; similarly, when the opposite shell 120 dissipates heat, the liquid refrigerant absorbs heat and evaporates in the second evaporation area 3301 to form a vapor state, and the vapor state refrigerant flows to the second condensation area 3201b with a lower temperature, and condenses into a liquid state in the second condensation area 3201b, and then releases the heat through the annular exposed plate 320.

[0039] Furthermore, both sides of the partition 325 are welded to the inner walls of the annular exposed plate 320. This improves the connection strength between the partition 325 and the inner walls of the annular exposed plate 320, thereby ensuring that the partition 325 reliably divides the condensation area 3201 into the first condensation area 3201a and the second condensation area 3201b, ensuring synchronous heat dissipation of the earmuff 200 and the housing 120, and enhancing the heat dissipation effect of the headphone heat dissipation structure 10.

[0040] In one embodiment, see Figure 1The two clamping heat sinks 300 are oppositely arranged. In the embodiment, the two clamping heat sinks 300 are arranged to increase the heat dissipation channel of the earphone heat dissipation mechanism 10, i.e., to increase the heat dissipation effect of the earphone heat dissipation mechanism 10, so that the heat dissipation of the face shell 120 is faster, and the heat dissipation efficiency of the ear sleeve 200 is also faster, thereby avoiding the user from sweating when using the earphone, and improving the wearing experience of the user.

[0041] In one of the embodiments, referring to Figure 1 The first annular inclined plate 310, the annular exposed plate 320 and the second annular inclined plate 330 are integrally formed. In the embodiment, since the clamping heat sink 300 is integrally formed, the structural strength of the clamping heat sink 300 is higher, so that the first annular inclined plate 310 is stably connected with the annular exposed plate 320, and the second annular inclined plate 330 is also stably connected with the annular exposed plate 320, so that the clamping heat sink 300 has the function of stably transferring and releasing heat.

[0042] In one of the embodiments, referring to Figure 1 The second annular inclined plate 330 is injection molded in the face shell 120. In this way, the second annular inclined plate 330 is firmly connected with the face shell 120 by injection molding the second annular inclined plate 330 in the face shell 120, so that when the face shell 120 is cooled, the liquid coolant in the closed cavity of the second annular inclined plate 330 can be stably used to transport the heat on the face shell 120, so that the clamping heat sink 300 has stable and good heat dissipation performance.

[0043] In one of the embodiments, referring to Figure 1 A plurality of sound holes 1203 are formed on the face shell 120, and the plurality of sound holes 1203 are in communication with the mounting cavity 101. In the embodiment, the heat generated in the mounting cavity 101 can be transmitted to the ear sleeve 200 through the plurality of sound holes 1203 in addition to being transmitted to the face shell 120, and the part of the heat can be transmitted to the annular exposed plate 320 through the first annular inclined plate 310 and released by the annular exposed plate 320. In this way, the release efficiency of the heat generated in the mounting cavity 101 is increased, the heat dissipation load of the face shell 120 is reduced, and the heat dissipation efficiency of the earphone heat dissipation mechanism 10 is improved, thereby avoiding the user from sweating when wearing the earphone, and improving the wearing experience of the user.

[0044] Furthermore, the multiple sound holes are evenly distributed at the center of the housing, and are all positioned opposite the sound-producing component. In this embodiment, when the sound-producing component produces sound, it drives air flow within the mounting cavity. This air, carrying heat, is quickly conducted through the multiple sound holes to the earmuff, where it is then released through the annular exposed plate. This improves the heat dissipation efficiency of the earphone's heat dissipation mechanism.

[0045] In one embodiment, a cooling cloth is provided between the filling portion and the protective outer cover. In this embodiment, the cooling cloth is provided between the protective outer cover and the filling portion, and the protective outer cover is in direct contact with the human ear. When the user wears the headphones, the clip-type heat sink dissipates heat from the earmuffs to prevent sweating in the ears. The cooling cloth also provides a cool sensation to the ears when they come into contact with the protective outer cover, further improving the user's wearing experience.

[0046] In one embodiment, see Figure 1 The cross section of the clip-type heat dissipation frame 300 is Y-shaped.

[0047] In one embodiment, at least a portion of the annular exposed plate is located outside the annular mounting groove. In this embodiment, to improve the heat dissipation performance of the annular exposed plate, at least a portion of the annular exposed plate is located outside the annular mounting groove. This increases the contact area between the annular exposed plate and the air, allowing the annular exposed plate to release heat more quickly, thereby improving the heat dissipation performance of the annular exposed plate.

[0048] Further, see Figure 1 A clearance gap 1101 is provided between the annular exposed plate 320 and the bottom shell 110. In this embodiment, the clearance gap 1101 provided between the annular exposed plate 320 and the bottom shell 110 increases the degree of contact between the annular exposed plate 320 and the air. This allows a greater portion of the annular exposed plate 320 to be exposed to the air. As can be appreciated, when the annular exposed plate 320 collects heat accumulated from the first annular oblique plate 310 and the second annular oblique plate 330, the annular exposed plate 320 can release the heat into the air more quickly, further improving the heat dissipation performance of the annular exposed plate 320.

[0049] Further, see Figure 5The clearance gap 1101 is filled with a cooling copper ring 1102. In this embodiment, the earphones are inevitably impacted by external forces during use, and the presence of the clearance gap 1101 reduces the structural strength of the connection between the annular exposed plate 320 and the housing 120. That is, when impacted by external forces, the annular exposed plate 320 is easily broken, thereby affecting the heat dissipation effect of the clip-type heat dissipation frame 300. Therefore, by filling the avoidance gap 1101 with the cooling copper ring 1102, it can be understood that the thermal conductivity of the cooling copper ring 1102 is better. When the cooling copper ring 1102 abuts the annular exposed plate 320, the heat accumulated by the first annular bevel 310 and the second annular bevel 330 is transferred to the annular exposed plate 320. In addition to releasing part of the heat directly into the air, the annular exposed plate 320 will also transfer part of the heat to the cooling copper ring 1102, and then the cooling copper ring 1102 releases the heat to the outside world. In this way, it is ensured that the annular exposed plate 320 still has good heat dissipation performance. In addition, since the cooling copper ring 1102 fills the avoidance gap 1101, the structural strength of the connection between the annular exposed plate 320 and the face shell 120 is improved. When the earphone is impacted by external force, since the cooling copper ring 1102 is located between the annular exposed plate 320 and the bottom shell 110, it can be better used to protect the annular exposed plate 320. In this way, by disposing the cooling copper ring 1102 , the annular exposed plate 320 has both good heat dissipation performance and high structural strength.

[0050] Furthermore, the cooling copper ring 1102 is welded to the annular exposed plate 320. In this way, the structural strength of the connection between the cooling copper ring 1102 and the annular exposed plate 320 is improved, so that the annular exposed plate 320 is not easily deformed or even damaged by external impact, thereby extending the service life of the annular exposed plate 320, and further ensuring the heat dissipation function of the clip-type heat sink 300. In another embodiment, the cooling copper ring 1102 and the bottom shell 110 are injection molded. In this way, the connection between the cooling copper ring 1102 and the bottom shell 110 is strengthened, and the cooling copper ring 1102 is also welded to the annular exposed plate 320, so that the structural strength of the annular exposed plate 320 is higher, thereby extending the service life of the annular exposed plate 320.

[0051] In one embodiment, the face shell is formed with an annular groove, and the second annular bevel is inserted into the annular groove, so that the second annular bevel is fixedly connected to the face shell, and at the same time, the heat of the face shell can be transferred to the second annular bevel, and even discharged through the second annular bevel. In this embodiment, the second annular bevel is connected to the face shell with an interference fit. In this way, the structural strength of the connection between the second annular bevel and the face shell is ensured, so that the second annular bevel can stably discharge the heat of the face shell. It can be understood that in other embodiments, the face shell and the second annular bevel are not limited to being connected by mechanical fit to achieve heat conduction. For example, the face shell and the second annular bevel are an integral injection molded structure.

[0052] Furthermore, the end of the second annular bevel protrudes from the housing, and the portion of the second annular bevel protruding from the housing is located within the mounting cavity and abuts the heat dissipation substrate of the sound component. This allows heat from the sound component to be quickly dissipated through the second annular bevel. Simultaneously, heat from the sound component can also be dissipated to the housing via airflow within the mounting cavity, increasing the heat conduction path for the sound component and improving the heat dissipation performance of the earphone heat dissipation structure.

[0053] Furthermore, the protective outer cover is connected to the annular mounting area of ​​the face shell, the filling portion is filled within the protective outer cover, and the protective outer cover has a covering rib formed in the inner cavity filled with the filling portion. The covering rib covers the first annular bevel, separating the first annular bevel from the filling portion. In this embodiment, the covering rib is configured as a silicone rib, which has good elasticity and thermal conductivity. This not only facilitates the first annular bevel to dissipate heat from the filling portion, but also improves the connection strength between the protective outer cover and the first annular bevel.

[0054] See also Figure 4 The present application also provides a wearable headset 10a, comprising a headband 20 and two headset heat dissipation structures 10 as described in any of the above embodiments, wherein the two ends of the headband 20 are respectively provided on the two bottom shells 110.

[0055] Compared with the prior art, the present invention includes but is not limited to the following advantages:

[0056] 1. Because the annular exposed plate is exposed to the air, when the earphones are in use, the temperature difference between the annular exposed plate and the first annular bevel plate and the second annular bevel plate is large. In other words, the temperature difference between the heat dissipation end and the evaporation end is large, which makes the liquid refrigerant flow faster, thereby improving the heat dissipation efficiency of the clip-type heat dissipation frame and achieving better heat dissipation effect of the earphone heat dissipation structure.

[0057] 2. By connecting the annular bare board with the first annular oblique sheet and the second annular oblique sheet respectively, a double circulation channel for heat transfer and release in the earphone is formed, so that the path of the liquid coolant carrying heat is more optimized, that is, the ear sleeve is cooled while the face shell is also cooled, thereby increasing the cooling effect of the earphone cooling structure;

[0058] 3. The first annular oblique sheet and the second annular oblique sheet are provided in a sheet shape, the annular bare board is provided in a plate shape, and the clamping sheet type cooling frame formed by the three is provided in a clamping sheet shape, so that the structural strength of the clamping sheet type cooling frame is higher, the resistance to external impact force is also higher, and the service life of the clamping sheet type cooling frame is prolonged.

[0059] The above-mentioned embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the patent. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A headphone heat dissipation structure, characterized in that: include: The earphone body includes a bottom shell, a front shell, and a sound-generating component. The front shell is buckled onto the bottom shell, and the bottom shell and the front shell form a mounting cavity. The sound-generating component is mounted in the mounting cavity. The front shell is provided with an annular mounting groove and an annular mounting area. The annular mounting groove is provided around the annular mounting area. The earmuff comprises a filling portion and a protective outer cover, the protective outer cover is connected to the annular mounting area, and the filling portion is filled and disposed within the protective outer cover; as well as A clip-type heat sink, comprising a first annular bevel, an annular exposed plate, and a second annular bevel, wherein the annular exposed plate is connected to the first annular bevel and the second annular bevel, respectively, and the first annular bevel, the annular exposed plate, and the second annular bevel are respectively provided with mutually communicating closed cavities, wherein the closed cavities are used to accommodate liquid refrigerant; the first annular bevel is accommodated in the filling portion, the annular exposed plate is installed in the annular mounting groove, and the second annular bevel is arranged in the surface shell; a partition is provided in the annular exposed plate, and two sides of the partition are respectively connected to the first annular bevel and the second annular bevel; A first evaporation zone is formed in the closed cavity of the first annular oblique plate, a second evaporation zone is formed in the closed cavity of the second annular oblique plate, and a condensation zone is formed in the closed cavity of the annular exposed plate. The partition is located in the condensation zone so that the condensation zone forms a first condensation zone and a second condensation zone. The first condensation zone is connected to the first evaporation zone, and the second condensation zone is connected to the second evaporation zone.

2. The earphone heat dissipation structure according to claim 1, characterized in that: There are two clip-type heat dissipation frames, and the two clip-type heat dissipation frames are arranged opposite to each other.

3. The earphone heat dissipation structure according to claim 1, characterized in that: The first annular oblique piece, the annular exposed plate and the second annular oblique piece are an integrally formed structure.

4. The earphone heat dissipation structure according to claim 1, characterized in that: The second annular oblique piece is injection-molded in the face shell.

5. The earphone heat dissipation structure according to claim 1, characterized in that: A plurality of sound outlet holes are provided on the surface shell, and the plurality of sound outlet holes are all communicated with the installation cavity.

6. The earphone heat dissipation structure according to claim 1, characterized in that: An ice-sensing cloth is provided between the filling portion and the protective outer cover.

7. The earphone heat dissipation structure according to claim 1, characterized in that: The cross section of the clip-type heat dissipation frame is Y-shaped.

8. A wearable headset, characterized in that: It comprises a headband and two earphone heat dissipation structures according to any one of claims 1 to 7, wherein two ends of the headband are respectively arranged on the two bottom shells.

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