Multilayer circuit board manufacturing apparatus

Abstract

The present disclosure relates to a multilayer circuit board manufacturing apparatus. The present disclosure includes an uncoiler configured to provide a member, a processing unit configured to perform a process on the member provided from the uncoiler, a coiler configured to wind the member on which the process is completed in the processing unit, and a tension adjustment unit located in at least one of a region between the uncoiler and the processing unit, a region between the processing unit and the coiler, and a region between the uncoiler and the coiler, and adjusting a tension of the member.

Description

[0001] Cross-reference to related applications

[0002] This application is based on and claims priority to Korean Patent Application No. 10-2021-0130304, filed on September 30, 2021, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] One or more embodiments relate to an apparatus, and more specifically, to a multilayer circuit board manufacturing apparatus. Background Technology

[0004] With the development of electronic or communication technologies, electronic / communication devices (e.g., mobile phones) are becoming smaller and more powerful. Therefore, circuit boards embedded in electronic / communication devices are manufactured as multi-layered circuit boards that perform many functions.

[0005] Such multilayer circuit boards can be manufactured using various manufacturing processes. Here, for multilayer circuit boards, the manufacturing equipment can be used for each manufacturing process. Furthermore, in a multilayer circuit board, each component can be manufactured to a certain length and stacked to form multiple layers. In this case, since it is necessary to manufacture one multilayer circuit board and then another, it can take a considerable amount of time. To overcome these limitations, various devices have been developed. Summary of the Invention

[0006] One or more embodiments include a multilayer circuit board manufacturing apparatus that enables continuous manufacturing.

[0007] Additional aspects will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practice of the embodiments of this disclosure presented.

[0008] According to one or more embodiments, a multilayer circuit board manufacturing apparatus includes: an uncoiler configured to provide a component; a processing unit configured to perform processing on the component provided from the uncoiler; a winding machine configured to wind the component processed thereon in the processing unit; and a tension adjustment unit located in at least one of the uncoiler, the winding machine, a region between the uncoiler and the processing unit, and a region between the processing unit and the winding machine, and adjusts the tension of the component.

[0009] In one embodiment, the tension adjustment unit may include: a contact roller that moves in contact with the component; and a load unit connected to the contact roller and adjusting the force applied to the component by the contact roller.

[0010] In one embodiment, the tension adjustment unit may include a powder clutch connected to at least one of the uncoiler and the coiler and maintaining the tension of the member.

[0011] In an embodiment, the tension adjustment unit may include a speed adjustment unit located in at least one of the uncoiler and the coiler and adjusting the speed of at least one of the uncoiler and the coiler.

[0012] In one embodiment, the multilayer circuit board manufacturing equipment may further include a position adjustment unit located between the uncoiler and the coiler and adjusting the position of the components.

[0013] In an embodiment, the multilayer circuit board manufacturing equipment further includes a component connection unit located between the uncoiler and the processing unit and between the coiler and the processing unit, which connects the end of a component to the end of a new component.

[0014] In an embodiment, the multilayer circuit board manufacturing equipment may further include a stop unit located between the uncoiler and the processing unit and between the coiler and the processing unit, which prevents the components from moving.

[0015] In one embodiment, the multilayer circuit board manufacturing equipment may further include transfer rollers located between the uncoiler and the coiler and in contact with the components during transfer.

[0016] In one embodiment, the transfer roller may include: a roller body; and a protrusion located on and protruding from the roller body.

[0017] In an embodiment, the protrusion may include: a pair of first protrusions located at the ends of the roller body; and a second protrusion located between the first protrusions and having a width smaller than the width of each of the first protrusions.

[0018] In an embodiment, a plurality of transfer rollers may be provided, and the plurality of transfer rollers may include: a first transfer roller facing a first surface of the component; and a second transfer roller facing a second surface of the component, and in conjunction with the first transfer roller to block the product area of ​​the component from the outside.

[0019] In one embodiment, the first transfer roller and the second transfer roller may be arranged perpendicular to the ground.

[0020] In an embodiment, the processing unit performs at least one of developing, etching, brown oxide treatment, plating, and stripping processes.

[0021] In an embodiment, the processing unit may include: a liquid chemical supply unit configured to supply liquid chemicals to a component; a plurality of first rollers configured to transfer the component; and a second roller that guides the liquid chemicals supplied from the liquid chemical supply unit while preventing the liquid chemicals supplied from the liquid chemical supply unit from moving, and has a diameter smaller than the diameter of each of the first rollers. Attached Figure Description

[0022] The above and other aspects, features, and advantages of certain embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0023] Figure 1 A front view showing an embodiment of a multilayer circuit board manufacturing apparatus according to an embodiment of the present disclosure.

[0024] Figure 2 To show Figure 1 The image shows a side view of the transfer roller.

[0025] Figure 3 A cross-sectional view of a processing unit of a multilayer circuit board manufacturing apparatus according to an embodiment of the present disclosure is shown.

[0026] Figure 4 A side view of the transfer rollers of a multilayer circuit board manufacturing apparatus according to another embodiment of the present disclosure.

[0027] Figure 5 A side view of the transfer rollers of a multilayer circuit board manufacturing apparatus according to another embodiment of the present disclosure.

[0028] Figures 6A to 6T This is a cross-sectional view illustrating the manufacturing process used to produce multilayer circuit boards.

[0029] Explanation of icon numbers

[0030] 1: Core component;

[0031] 2: First metal layer;

[0032] 3: Carrier membrane;

[0033] 4: Second metal layer;

[0034] 5: First surface treatment layer;

[0035] 6: First protective layer;

[0036] 7: Third metal layer;

[0037] 8: Second surface treatment layer;

[0038] 9: Fourth metal layer;

[0039] 10: Fifth metal layer;

[0040] 11: External protective layer;

[0041] 100: Multilayer circuit board manufacturing equipment;

[0042] 110: Uncoiling machine;

[0043] 111: First uncoiler;

[0044] 112: Second uncoiler;

[0045] 120: Processing unit;

[0046] 121: Processing chamber;

[0047] 122, 123: Processing execution unit;

[0048] 130: Winding machine;

[0049] 131: First roll take-up machine;

[0050] 132: Take out the second roll;

[0051] 140: Bending roller;

[0052] 141: First bending roller;

[0053] 142: Second bending roller;

[0054] 143: Third bending roller;

[0055] 144: Fourth bending roller;

[0056] 150: Transfer roller;

[0057] 150-1: First transfer roller;

[0058] 150-2: Second transfer roller;

[0059] 150a: Roller body;

[0060] 150b: Protrusion;

[0061] 150b-1a: First - First protrusion;

[0062] 150b-2a: Second to First Protrusion;

[0063] 150b-a: First protrusion;

[0064] 150b-1b: First and second protrusions;

[0065] 150b-2b: Second to second protuberance;

[0066] 150b-b: Second protuberance;

[0067] 151: First front transfer roller;

[0068] 152: Second front transfer roller;

[0069] 153: First processing transfer roller;

[0070] 154: Second processing transfer roller;

[0071] 155: Third processing transfer roller;

[0072] 156: Fourth processing transfer roller;

[0073] 157: Fifth processing transfer roller;

[0074] 158: First rear transfer roller;

[0075] 159: Second rear transfer roller;

[0076] 160: Tension maintaining unit;

[0077] 161: First tension maintenance unit;

[0078] 161a: First contact roller;

[0079] 161b: First connecting unit;

[0080] 161c: First load unit;

[0081] 162: Second tension maintenance unit;

[0082] 162a: Second contact roller;

[0083] 162b: Second connecting unit;

[0084] 162c: Second load unit;

[0085] 163: Third tension maintenance unit;

[0086] 164: Fourth tension maintenance unit;

[0087] 165: Fifth tension maintenance unit;

[0088] 166: Sixth tension maintenance unit;

[0089] 167: First speed adjustment unit;

[0090] 168: Second speed adjustment unit;

[0091] 170: Stop unit;

[0092] 171: First stop unit;

[0093] 172: Second stop unit;

[0094] 180: Component connection unit;

[0095] 181: First component connection unit;

[0096] 181a: The first unit;

[0097] 181b: First contact unit;

[0098] 181c: First detection sensor;

[0099] 182: Second component connection unit;

[0100] 200: Position adjustment unit;

[0101] 210: First position adjustment unit;

[0102] 220: Second position adjustment unit;

[0103] 221: Second detection sensor;

[0104] 222: Second path adjustment unit;

[0105] 350: Sensor unit;

[0106] 351: First sensor unit;

[0107] 352: Second sensor unit;

[0108] 353: Third sensor unit;

[0109] 354: Fourth sensor unit;

[0110] BC: Cutting device;

[0111] DA: Virtual area;

[0112] DFR1: First dry film photoresist;

[0113] DFR2: Second dry film photoresist;

[0114] DM: Virtual component;

[0115] H1: First hole;

[0116] H2: Second hole;

[0117] M: Component;

[0118] PA: Processing area;

[0119] SP: Pressing unit. Detailed Implementation

[0120] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein similar reference numerals throughout the text refer to similar elements. In this respect, embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, embodiments are described below with reference to the accompanying drawings to explain various aspects of this specification. As used herein, the term “and / or” encompasses any and all combinations of one or more of the associated listed items. For example, the expression “at least one of” modifies the entire list of elements rather than individual elements of the list when preceding it.

[0121] This disclosure will be illustrated by the following embodiments described in detail with reference to the accompanying drawings. However, this disclosure may be implemented in various forms and should not be construed as limited to the embodiments set forth herein. In fact, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art. Furthermore, this disclosure is defined only by the scope of the claims. Meanwhile, the terminology used in this specification is for explaining the embodiments only and is not intended to limit the disclosure. In this specification, the singular form also includes the plural form unless the context clearly indicates otherwise. The meaning of "comprise / comprising" as used in this specification does not exclude the presence or addition of one or more components, steps, operations, and / or elements other than those mentioned. It should be understood that although the terms "first" and "second" may be used herein to describe various elements, these elements should not be limited by these terms. The terms are used only to distinguish one component from other components.

[0122] Figure 1 A front view showing an embodiment of a multilayer circuit board manufacturing apparatus according to an embodiment of the present disclosure.

[0123] refer to Figure 1 The multilayer circuit board manufacturing equipment 100 may include an uncoiler 110, a processing unit 120, a winding machine 130, a bending roller 140, a transfer roller 150, a tension maintaining unit 160, a stop unit 170, a component connecting unit 180, a position adjusting unit 200, and a sensor unit 350.

[0124] Unwinder 110 can supply a component M wound thereon. Here, unwinder 110 may include manually rotating rollers. In another embodiment, unwinder 110 may include a drive unit, such as a separate motor, that automatically rotates and unwinds the component M. The drive unit provided in unwinder 110 may include a stepper motor, etc. Hereinafter, for ease of description, unwinder 110 including manually rotating rollers without a separate drive unit will be described in detail.

[0125] Multiple uncoilers 110 may be configured. Here, the multiple uncoilers 110 may be spaced apart from each other. Different components may be mounted on the uncoilers 110 and laminated into a single component in the processing unit 120. In another embodiment, the same component M may be mounted on each of the uncoilers 110. Thus, when the component M supplied from one uncoiler 110 is exhausted, component M may be supplied from another uncoiler 110. Hereinafter, for ease of description, the multiple uncoilers 110 supplying the same component M will be described in detail.

[0126] The plurality of uncoilers 110 may include a first uncoiler 111 and a second uncoiler 112. The first uncoiler 111 may initially supply component M. Here, when the component M supplied from the first uncoiler 111 is completely exhausted, processing can be performed continuously by connecting the component M wound around the second uncoiler 112 to the end of the component M supplied from the first uncoiler 111.

[0127] In addition to the above, although not shown in the accompanying drawings, when multiple uncoilers 110 are configured, each uncoiler 110 can supply different components M. In this case, multiple uncoilers 110 can simultaneously supply different components M to the processing unit 120.

[0128] Processing unit 120 can perform various processes. For example, processing unit 120 may include a lamination apparatus for laminating multiple different components. In another embodiment, processing unit 120 may include a developing apparatus for developing dry film photoresist. In another embodiment, processing unit 120 may include a stripping apparatus for removing dry film photoresist. In another embodiment, processing unit 120 may include an etching apparatus for performing an etching process to remove a portion of component M. In another embodiment, processing unit 120 may include an oxidation apparatus for performing a brown oxide treatment on the surface of component M. In another embodiment, processing unit 120 may include a foreign matter removal apparatus for removing foreign matter from the surface of component M. In another embodiment, processing unit 120 may include a plating apparatus for forming a plating layer on component M. Here, processing unit 120 is not limited to the above apparatuses, and apparatus or facilities used in the manufacturing of multilayer circuit boards may be disposed therein.

[0129] The processing unit 120 described above may include: a processing chamber 121 in which processing is performed; and processing execution units 122 and 123 located inside the processing chamber 121 and performing the processing described above. In this case, although not shown in the figures, the processing chamber 121 may have an opening through which the member M passes. The processing execution units 122 and 123 may have various shapes depending on the processing to be performed.

[0130] Processing execution unit 122 and processing execution unit 123 may include a first processing execution unit 122 and a second processing execution unit 123. Here, the first processing execution unit 122 may perform processing on one surface of component M, and the second processing execution unit 123 may perform processing on another surface of component M. In this case, it is possible to perform processing on both surfaces of component M simultaneously.

[0131] The winding machine 130 can wind the member M, wherein the processing has been completed by passing through the processing unit 120. Here, the winding machine 130 may separately include a drive unit for winding the member M.

[0132] Multiple winding machines 130 may be configured. Here, at least one of the multiple winding machines 130 can wind the component M that has been processed therein. In addition, another of the multiple winding machines 130 may be in a standby state and will wind the processed component M when the processed component M reaches a certain diameter in at least one of the multiple winding machines 130.

[0133] The plurality of winding machines 130 may include a first winding machine 131 and a second winding machine 132. Here, the first winding machine 131 may first wind the processed component M, and the second winding machine 132 may be used when the first winding machine 131 is not used.

[0134] The first winding machine 131 and the second winding machine 132 can be connected to the first speed adjustment unit 167 and the second speed adjustment unit 168, respectively. Here, the first speed adjustment unit 167 and the second speed adjustment unit 168 can change their rotational speeds according to the diameter of the component M wound around the first winding machine 131 and the second winding machine 132, respectively. In this case, each of the first speed adjustment unit 167 and the second speed adjustment unit 168 may include a stepper motor.

[0135] The bending roller 140 is bendably connected to a component M of at least one of the uncoiler 110 and the winding machine 130. For example, the bending roller 140 may include: a first bending roller 141 located between the first uncoiler 111 and the processing unit 120; a second bending roller 142 located between the second uncoiler 112 and the processing unit 120; a third bending roller 143 located between the first winding machine 131 and the processing unit 120; and a fourth bending roller 144 located between the second roller 132 and the processing unit 120.

[0136] The bending roller 140 can maintain the tension of component M by bending the path of component M. The first bending roller 141 or the second bending roller 142 can alter the path of component M supplied from the uncoiler 110 and change the movement path of component M so that component M can pass through a flat surface. The third bending roller 143 or the fourth bending roller 144 can alter the path of component M moving to the winding machine 130. Therefore, component M can move in a direction tangential to component M or on the surface of the winding machine 130, the component being wound around the winding machine 130, and thus component M can be wound smoothly around the winding machine 130.

[0137] The transfer roller 150 is located between the uncoiler 110 and the coiler 130, and can support the component M or facilitate the movement of the component M during transfer. Here, multiple transfer rollers 150 can be provided, and the multiple transfer rollers 150 can be arranged spaced apart from each other in the direction of movement of the component M.

[0138] In one embodiment, the plurality of transfer rollers 150 may be arranged to contact only one surface of the component M. Here, the plurality of transfer rollers 150 may be arranged spaced apart from each other in the direction of movement of the component M. In another embodiment, one of the plurality of transfer rollers 150 and another of the plurality of transfer rollers 150 may form a pair and be arranged sequentially on two surfaces of the component M. In this case, as... Figure 1 As shown, a plurality of pairs of processing transfer rollers (e.g., first processing transfer roller 153 and second processing transfer roller 154) facing each other can be provided, and the plurality of pairs of processing transfer rollers can be arranged spaced apart from each other in the direction of movement of component M. In another embodiment, some of the plurality of transfer rollers 150 can be disposed on one surface of component M, and others of the plurality of transfer rollers 150 can be disposed on another surface of component M. For example, refer to Figure 1Some of the multiple transfer rollers 150 may be disposed on the upper surface of the component M, and others may be disposed on the lower surface of the component M. In this case, the multiple transfer rollers 150 are arranged at different locations in a Z-shape. In another embodiment, some of the multiple transfer rollers 150 may be disposed in pairs above and below the component M, and some of the multiple transfer rollers 150 may be disposed only below the component M. The arrangement of the multiple transfer rollers 150 is not limited to those arrangements described above and may vary considering the handling and support of the component M. However, for ease of description, the following will describe in detail as follows: Figure 1 The multiple transfer rollers 150 shown are arranged as illustrated.

[0139] Depending on the position, the plurality of transfer rollers 150 may include a first front transfer roller 151, a second front transfer roller 152, a first processing transfer roller 153, a second processing transfer roller 154, a third processing transfer roller 155, a fourth processing transfer roller 156, a fifth processing transfer roller 157, a first rear transfer roller 158, and a second rear transfer roller 159.

[0140] The first front transfer roller 151 and the second front transfer roller 152 may be located on the side surfaces of the first tension maintaining unit 161, which will be described later, and support the member M. Here, the first front transfer roller 151 and the second front transfer roller 152 may support the point where the member M is bent.

[0141] The first rear transfer roller 158 and the second rear transfer roller 159 may be located on the side surfaces of the second tension maintaining unit 162, which will be described later, and support the member M. The first rear transfer roller 158 and the second rear transfer roller 159 may support the points where the member M is bent.

[0142] At least one processing transfer roller may be located in the processing unit 120 described above. Here, when multiple processing transfer rollers are provided, the multiple processing transfer rollers may be arranged spaced apart from each other in the direction of transfer of component M. The multiple processing transfer rollers may be spaced apart from each other in different ways. Here, the multiple processing transfer rollers may be arranged in the same or similar manner as the multiple transfer rollers 150 described above. In the following, for the sake of description, the multiple processing transfer rollers, including a first processing transfer roller 153, a second processing transfer roller 154, a third processing transfer roller 155, a fourth processing transfer roller 156, and a fifth processing transfer roller 157, will be described in detail.

[0143] The first processing transfer roller 153 and the second processing transfer roller 154 may face each other. Here, the first processing transfer roller 153 and the second processing transfer roller 154 may be respectively mounted on one surface of the component M and the other surface of the component M, and the component M may be movable.

[0144] In the above cases, the diameter of the first processing transfer roller 153 may be equal to or different from the diameter of the second processing transfer roller 154. In one embodiment, the diameter of the first processing transfer roller 153 may be equal to the diameter of the second processing transfer roller 154. In another embodiment, the diameter of the first processing transfer roller 153 may be greater than the diameter of the second processing transfer roller 154. In yet another embodiment, the diameter of the first processing transfer roller 153 may be smaller than the diameter of the second processing transfer roller 154.

[0145] The third processing transfer roller 155 can support the member M that has passed through the first processing transfer roller 153 and the second processing transfer roller 154. Here, at least one third processing transfer roller 155 may be provided. In the following description, for convenience, a plurality of third processing transfer rollers 155 will be described in detail.

[0146] The fourth processing transfer roller 156 and the fifth processing transfer roller 157 can be respectively mounted on one surface of component M and the other surface of component M, similar to the first processing transfer roller 153 and the second processing transfer roller 154. Here, the relationship between the diameter of the fourth processing transfer roller 156 and the diameter of the fifth processing transfer roller 157 can be the same as or similar to the relationship between the diameter of the first processing transfer roller 153 and the diameter of the second processing transfer roller 154 described above.

[0147] When component M is transferred, tension maintaining unit 160 can maintain the tension of component M at a constant value, or can maintain the tension of component M above a certain value. The tension maintaining unit 160 described above can have various shapes. For example, tension maintaining unit 160 may include a first tension maintaining unit 161, a second tension maintaining unit 162, a third tension maintaining unit 163, a fourth tension maintaining unit 164, a fifth tension maintaining unit 165, a sixth tension maintaining unit 166, a first speed adjusting unit 167, and a second speed adjusting unit 168.

[0148] The first tension maintaining unit 161 may be located between the first front transfer roller 151 and the second front transfer roller 152. Here, the first tension maintaining unit 161 can apply force to the component M. Specifically, the first tension maintaining unit 161 may include a first contact roller 161a, a first connecting unit 161b, and a first load unit 161c. The first contact roller 161a contacts the component M and can adjust the force applied to the component M according to the weight of the first load unit 161c. The first connecting unit 161b connects the first contact roller 161a to the first load unit 161c. The first load unit 161c is connected to the first connecting unit 161b and can adjust the force applied to the component M by the first contact roller 161a. In the above case, the first connecting unit 161b may include wires, etc. Furthermore, the first load unit 161c may include weights, etc. In another embodiment, the first load unit 161c may include weights and a device for supplying fluid, etc., to the weights. In the above scenario, the height of the first contact roller 161a can be adjusted via the first connecting unit 161b by changing the weight of the first load unit 161c. In another embodiment, the first tension maintaining unit 161 may include the first contact roller 161a and a first position changing unit (not shown), the first position changing unit being connected to the first contact roller 161a to change the position of the first contact roller 161a. Here, the first position changing unit may include a drive unit, such as a cylinder, motor, rack and pinion, or linear motor.

[0149] The second tension maintaining unit 162 may be located between the first rear transfer roller 158 and the second rear transfer roller 159. Here, the second tension maintaining unit 162 may be the same as or similar to the first tension maintaining unit 161. In the following description, for ease of description, the second tension maintaining unit 162, which includes the second contact roller 162a, the second connecting unit 162b, and the second load unit 162c, will be described in detail.

[0150] The third tension maintaining unit 163 can be connected to the first uncoiler 111, and the fourth tension maintaining unit 164 can be connected to the second uncoiler 112. Furthermore, the fifth tension maintaining unit 165 can be connected to at least one of the first take-up machine 131 and the first speed adjusting unit 167, and the sixth tension maintaining unit 166 can be connected to at least one of the second take-up machine 132 and the second speed adjusting unit 168. Here, the third tension maintaining unit 163, the fourth tension maintaining unit 164, the fifth tension maintaining unit 165, and the sixth tension maintaining unit 166 can be the same as or similar to each other. For ease of description, the third tension maintaining unit 163 will be described in detail below.

[0151] The third tension maintaining unit 163 may be connected to the first uncoiler 111 to change the position of the first uncoiler 111. For example, the third tension maintaining unit 163 may include a cylinder connected to the first uncoiler 111. In another embodiment, the third tension maintaining unit 163 may include a rack connected to the first uncoiler 111 and a motor for linearly moving the rack. In another embodiment, the third tension maintaining unit 163 may include a powder clutch that includes an excitation coil and powder and changes the rotation center of the first uncoiler 111. In another embodiment, the third tension maintaining unit 163 may include a linear motor connected to the first uncoiler 111. Hereinafter, for ease of description, the third tension maintaining unit 163 including the powder clutch will be described in detail.

[0152] The third tension maintaining unit 163 described above can change the position of the first unwinder 111 based on the results measured in the first sensor unit 351.

[0153] A first speed adjustment unit 167 is located in a first winding machine 131 and can change the rotational speed of the first winding machine 131. Here, the first speed adjustment unit 167 can be operated based on the result measured in the third sensor unit 353. A second speed adjustment unit 168 is located in a second winding machine 132 and can change the rotational speed of the second winding machine 132. Here, the second speed adjustment unit 168 can be operated based on the result measured in the fourth sensor unit 354.

[0154] The stop unit 170 can stop the component M supplied from the uncoiler 110 or stop the component M wound around the coiler 130. Here, the stop unit 170 can have various shapes. For example, the stop unit 170 can be provided in the form of a robotic arm and stops the movement of the component M by gripping it. In another embodiment, the stop unit 170 can be raised and lowered and can be positioned facing at least one of the plurality of transfer rollers 150, selectively contacting the component M and preventing the component M from shifting.

[0155] The stop unit 170 described above may include a first stop unit 171 located in the front area and a second stop unit 172 located in the rear area.

[0156] The component connecting unit 180 can be used to connect or cut component M in the uncoiler 110, or to connect or cut component M in the coiler 130. The component connecting unit 180 may include a first component connecting unit 181 and a second component connecting unit 182. Here, the first component connecting unit 181 and the second component connecting unit 182 can be formed and operated in the same or similar manner. Therefore, for ease of description, the first component connecting unit 181 will be described in detail below.

[0157] The first component connecting unit 181 described above may include a first platform 181a for supporting component M and a first contact unit 181b disposed on the first platform 181a and selectively in contact with component M. Here, the first contact unit 181b is disposed facing the first platform 181a and may constrain component M. The first component connecting unit 181 may also include a first detection sensor 181c for sensing cuts in component M, the end of component M, partial damage to component M, etc. The first detection sensor 181c may include a laser sensor, an optical sensor, an ultrasonic sensor, etc. Furthermore, the first detection sensor 181c may be disposed on the lower surface of the first contact unit 181b or spaced apart from the first contact unit 181b.

[0158] The position adjustment unit 200 detects whether the component M moves along a preset path and can adjust the path of the component M based on the detected result. For example, the position adjustment unit 200 can detect the edge of the component M along its moving path and change the position of the component M in the width direction. Here, the position adjustment unit 200 can be located in various zones. For example, the position adjustment unit 200 can be located in at least one of the following: between the uncoiler 110 and the processing unit 120, inside the processing unit 120, and between the winding machine 130 and the processing unit 120. In the following description, for convenience, the position adjustment unit 200 will be described in detail, which includes a first position adjustment unit 210 located between the uncoiler 110 and the processing unit 120 and a second position adjustment unit 220 located between the winding machine 130 and the processing unit 120.

[0159] The first position adjustment unit 210 described above may be located between the uncoiler 110 and the processing unit 120, and senses the movement path of the component M in the width direction. Although not shown in the figure, the first position adjustment unit 210 may change the position of at least one of the plurality of transfer rollers 150 and at least one of the uncoilers 110 based on the position of the component M.

[0160] The second position adjustment unit 220 may include a second detection sensor 221, which senses whether the position of the member M is in the width direction (e.g., ...). Figure 1The edge of the component M is kept constant along the Y-axis direction. For example, the second detection sensor 221 may include a laser sensor, an ultrasonic sensor, an optical sensor, etc., which senses the edge of the component M. In another embodiment, the second detection sensor 221 may include a line sensor, which is disposed facing at least one of the surfaces of the component M and senses the component M. Furthermore, the second position adjustment unit 220 may include a second path adjustment unit 222, which adjusts the position of the edge of the component M based on the result sensed in the second detection sensor 221. Here, the second path adjustment unit 222 may have various shapes. For example, the second path adjustment unit 222 may include a linear guide and a drive unit for linearly moving a block disposed on the linear guide. In this case, the drive unit may be provided in various forms, such as a motor, a cylinder, a linear motor, etc. The second path adjustment unit 222 may be located at various positions. For example, the second path adjustment unit 222 may be located in at least one of the uncoiler 110, the transfer roller 150, and the winding machine 130. For ease of description, the second path adjustment unit 222 located in each of the first speed adjustment unit 167 and the second speed adjustment unit 168 will be described in detail below.

[0161] Sensor unit 350 may be located around at least one of the uncoiler 110 and the winding machine 130, and measures the distance to member M. Hereinafter, for ease of description, sensor units 350 positioned adjacent to all uncoilers 110 and winding machines 130 will be described in detail.

[0162] In this configuration, the first sensor unit 351 may be located around the first uncoiler 111, and the second sensor unit 352 may be located around the second uncoiler 112. Furthermore, the third sensor unit 353 may be located around the first winding machine 131, and the fourth sensor unit 354 may be located around the second winding machine 132.

[0163] Meanwhile, when inspecting the operation of the multilayer circuit board manufacturing equipment 100 described above, the component M used in each process is placed on the first uncoiler 111 and the second uncoiler 112. Then, the end of the component M on the first uncoiler 111 can be... Figure 1 The path shown connects to the first winding machine 131. Subsequently, when the first speed adjustment unit 167 operates, the first winding machine 131 can wind the member M while rotating.

[0164] Processing execution units 122 and 123 can perform processing on the component M passing through the interior of the processing chamber 121. In this case, the first sensor unit 351 can sense the distance around the surface of the component M wound around the first uncoiler 111. In this case, when processing of the component M is performed continuously, the diameter of the component M wound around the first uncoiler 111 can be gradually reduced. Furthermore, whether the component M is being continuously supplied can be sensed by using the distance to the component M measured by the first sensor unit 351.

[0165] In this case, the third tension maintaining unit 163 can change the position of the first uncoiler 111 based on the result sensed by the first sensor unit 351. For example, when component M is unwound from the first uncoiler 111, the distance between the first bending roller 141 and a portion of the component (M) that begins to unwind from the first uncoiler 111 can gradually increase. In this case, the tension of component M between the first uncoiler 111 and the first bending roller 141 can be less than the tension in the initial or previous state. Therefore, when compared with the initial or previous state, the third tension maintaining unit 163 can move the position of the first uncoiler 111 in the direction opposite to the direction of component M transfer (e.g., in the X-axis direction). In addition to the above, it is also possible to further move the first contact roller 161a in the weight direction by adjusting the first load unit 161c to have a weight less than the weight in the previous state.

[0166] When the first speed adjustment unit 167 operates as described above, the processed component M can be continuously wound around the first winding machine 131. In this case, the distance between the third sensor unit 353 and the component M wound around the first winding machine 131 can gradually decrease. Based on this result, the fifth tension maintaining unit 165 can move the first winding machine 131 in the opposite direction to the direction of movement of the component M. In addition to the above, it is also possible to position the second contact roller 162a of the second tension maintaining unit 162 at a position higher than the initial or previous state by increasing the weight of the second load unit 162c of the second tension maintaining unit 162.

[0167] Although the above operations are performed, the multilayer circuit board manufacturing equipment 100 may stop operating if the processing unit 120 is not operated properly, the component M is damaged, or the component M is cut. At this time, the first stop unit 171 and the second stop unit 172 can be operated to fix the position of the component M.

[0168] Furthermore, when performing the above operations, the second detection sensor 221 can sense the edge of the side surface of component M. By comparing the movement path of the edge of the side surface of component M sensed by the second detection sensor 221 with a preset movement path, it is possible to check whether component M is wound around the first winding machine 131 after moving along the same path as the preset movement path. As a result of the check, when the preset movement path is not the same as the movement path of the edge of the side surface of component M, the second path adjustment unit 222 can change the position of the first winding machine 131. That is, the second path adjustment unit 222 can change the position of the first winding machine 131 so that the movement path of the edge of the side surface of component M is the same as the preset path. The above operations can be performed not only in the second position adjustment unit 220 but also in the first position adjustment unit 210 in the same or similar manner.

[0169] Simultaneously, during the operation described above, the component M to be supplied to the first winding machine 131 may be completely depleted, or a damaged or broken component M may be supplied. At this time, when the event described above is sensed by the first detection sensor 181c, the operation of the first speed adjustment unit 167 may cease. Furthermore, the first contact unit 181b may contact the component M and engage with the first unit 181a to restrain the component M. Subsequently, the component M may be connected after the damaged or broken section of the component M described above is removed, or the end of a new component M may be connected to the end of the component M.

[0170] When the new component M is connected to the existing component M as described above, the component M wound around the second uncoiler 112 can be used. In this case, the second sensor unit 352 can sense the distance of the component M wound around the second uncoiler 112.

[0171] Even when component M is supplied from the second uncoiler 112, the multilayer circuit board manufacturing equipment 100 can operate in the same or similar manner as described above when component M is supplied from the first uncoiler 111.

[0172] Simultaneously, when component M is fully wound around the first winding machine 131 or when the value measured by the third sensor unit 353 reaches a preset value, the operation of the multilayer circuit board manufacturing equipment 100 can be stopped, and the second component connecting unit 182 can be operated to restrain component M. Subsequently, component M can be removed, and the end of the proximity processing unit 120 of component M can be connected to the second winding machine 132. When the second speed adjustment unit 168 operates, component M can be wound around the second winding machine 132.

[0173] In this case, component M can be wound around the second winding machine 132 in the same or similar manner as when component M is wound around the first winding machine 131 as described above.

[0174] Therefore, the multilayer circuit board manufacturing equipment 100 can perform operations while continuously supplying components M. Thus, it is possible to manufacture printed circuit boards by processing components M quickly and efficiently. Furthermore, the multilayer circuit board manufacturing equipment 100 can maintain constant tension on components M. Therefore, it is possible to prevent bending, deformation, etc., of components M that may occur during continuous processing.

[0175] Figure 2 To show Figure 1 The image shows a side view of the transfer roller.

[0176] See Figure 2 The transfer roller 150 may include a roller body 150a and a protrusion 150b. The roller body 150a may be made of a rigid synthetic resin material. On the other hand, the protrusion 150b may include an elastic material, such as rubber, silicone, or a soft synthetic resin material.

[0177] The protrusion 150b may include: a pair of first protrusions 150b-a located at the end of the roller body 150a; and a second protrusion 150b-b located between the pair of first protrusions 150b-a. The first protrusions 150b-a and the second protrusions 150b-b may have an annular shape with the same diameter. In another embodiment, the first protrusions 150b-a and the second protrusions 150b-b may be polygons with the same shape and size. In another embodiment, the first protrusions 150b-a and the second protrusions 150b-b may be ellipses with the same shape and size.

[0178] In this case, the width of each of the first protrusions 150b-a and the width of the second protrusion 150b-b can be different from each other, the widths being in the longitudinal direction of the roller body 150a (e.g., in...). Figure 2 (Measured in the X direction). For example, the width of the first protrusion 150b-a may be greater than the width of the second protrusion 150b-b.

[0179] In this configuration, component M may include a processing area PA in which processing is performed to manufacture a product. Here, the processing area PA may include an uneven surface. At least one processing area PA may be provided. When multiple processing areas PA are provided, a dummy area DA, in which no individual processing is performed, may be located between adjacent processing areas PA. This dummy area DA may contact a protrusion 150b. The protrusion 150b may support component M by supporting the dummy area DA. In this configuration, multiple processing areas PA may be located in a first direction (e.g., Figure 2 One of the X-axis direction and the Y-axis direction) and the second direction (e.g., Figure 2 At least one of the X-axis direction and the other of the Y-axis direction is arranged spaced apart from each other.

[0180] Therefore, the transfer roller 150 can avoid damaging the structure placed on the processing area PA of component M and prevent contamination of the processing area PA.

[0181] Figure 3 A cross-sectional view of a processing unit of a multilayer circuit board manufacturing apparatus according to an embodiment of the present disclosure is shown.

[0182] refer to Figure 3 Multilayer circuit board manufacturing equipment (not shown) is similar to Figure 1 The multilayer circuit board manufacturing equipment shown herein, and therefore will be described in detail below, differs from [the equipment described herein]. Figure 1 The processing unit 120 of the processing unit.

[0183] Processing unit 120 may include processing chamber 121, processing execution unit 122, and processing execution unit 123. Here, processing execution unit 122 and processing execution unit 123 may include a first processing execution unit 122 and a second processing execution unit 123. In the following text, the first processing execution unit 122 and the second processing execution unit 123 are the same as or similar to each other, and therefore the first processing execution unit 122 will be described in detail.

[0184] The first processing unit 122 may have a nozzle shape for supplying liquid chemicals. Here, the liquid chemicals may include etching solutions and cleaning solutions.

[0185] In this configuration, the first processing transfer roller 153 can transfer component M. The second processing transfer roller 154 can be positioned facing the first processing transfer roller 153. In this configuration, the second processing transfer roller 154 is located around the first processing execution unit 122 or the second processing execution unit 123, and can reduce the diffusion or splashing of liquid chemicals supplied from the first processing execution unit 122 or the second processing execution unit 123 to undesired locations. Here, the diameter of the second processing transfer roller 154 can be smaller than the diameter of the first processing transfer roller 153.

[0186] The third processing transfer rollers 155 can be configured as a plurality and arranged spaced apart from each other within the processing chamber 121. In this case, when viewed in a front view, the third processing transfer rollers 155 may overlap each other. Here, when the third processing transfer rollers 155 have Figure 2 When the shape shown is such that the first protrusions 150b-a can be arranged so as not to overlap each other, and the second protrusions 150b-b can be arranged alternately with the adjacent third processing transfer rollers 155 so as not to overlap each other.

[0187] The fourth processing transfer roller 156 and the fifth processing transfer roller 157 can be connected with Figure 1 or Figure 3The first processing transfer roller 153 and the second processing transfer roller 154 shown are arranged in the same manner.

[0188] In this case, at least one of the first processing transfer roller 153 and the third processing transfer roller 155 may be provided in multiples on each of one surface and the other surface of the member M.

[0189] In this configuration, the second processing transfer roller 154 is positioned around either the first processing execution unit 122 or the second processing execution unit 123. This allows liquid chemicals supplied from each of the processing execution units 122 and 123 to be kept as close as possible to the processing area of ​​component M, and minimizes movement of liquid chemicals from outside the processing area of ​​component M to portions of component M.

[0190] Figure 4 A side view of the transfer rollers of a multilayer circuit board manufacturing apparatus according to another embodiment of the present disclosure.

[0191] refer to Figure 4 The transfer roller 150 may include a first transfer roller 150-1 and a second transfer roller 150-2 facing each other. Here, the first transfer roller 150-1 may include a first roller body 150a-1, a first protrusion 150b-1a, and a first second protrusion 150b-1b. Here, the second transfer roller 150-2 may include a second roller body 150a-2, a second first protrusion 150b-2a, and a second second protrusion 150b-2b. Here, the first transfer roller 150-1 and the second transfer roller 150-2 are... Figure 2 The transfer roller 150 shown is the same as or similar to that shown, and therefore its detailed description will be omitted.

[0192] In this configuration, the first transfer roller 150-1 and the second transfer roller 150-2 can be positioned on corresponding surfaces of the component M, with the component M positioned between the first and second transfer rollers. Here, the first-first protrusion 150b-1a, the first-second protrusion 150b-1b, the second-first protrusion 150b-2a, the second-second protrusion 150b-2b, and the component M can form a space, allowing the processing area PA to be arranged within it. Furthermore, adjacent first-second protrusions 150b-1b, adjacent second-second protrusions 150b-2b, and the component M can form a space, allowing the processing area PA to be arranged within it. In this configuration, the first transfer roller 150-1 and the second transfer roller 150-2 are arranged such that the processing area PA is arranged between the adjacent first transfer roller 150-1 and second transfer roller 150-2. Therefore, when liquid chemicals are supplied to the processing area PA, the liquid chemicals can be retained for a longer period. In addition, it is possible to reduce defects in manufactured products by preventing liquid chemicals from moving to another adjacent processing area (PA).

[0193] Figure 5 A side view of the transfer rollers of a multilayer circuit board manufacturing apparatus according to another embodiment of the present disclosure.

[0194] refer to Figure 5 Unlike Figure 4 As shown, the transfer roller 150 can be positioned in a direction perpendicular to the ground. Here, in the transfer roller 150, one processing area PA can be distinguished from another processing area PA by the first transfer roller 150-1 and the second transfer roller 150-2.

[0195] Figures 6A to 6T This is a cross-sectional view illustrating the manufacturing process used to produce multilayer circuit boards.

[0196] refer to Figure 6A To manufacture a multilayer circuit board, the first metal layer 2 can be laminated and attached to both surfaces of the core member 1. Here, each of the first metal layers 2 can be laminated onto the core member 1 using a carrier film 3 containing metal. In this case, the carrier film 3 can be disposed on the outer surface of the first metal layer 2. Here, each of the first metal layer 2 and the carrier film 3 can contain a thin film of copper. Furthermore, a separate adhesive layer can be disposed between the first metal layer 2 and the carrier film 3.

[0197] refer to Figure 6B The edges of the core component 1, the first metal layer 2, and the carrier film 3 can be removed using a cutting device BC while the carrier film 3 and the first metal layer 2 are attached to the two surfaces of the core component 1. In this case, the removed edges of the core component 1, the first metal layer 2, and the carrier film 3 can be removed as a dummy component DM.

[0198] refer to Figure 6C After the above processing is completed, the first metal layer 2 can be heated to completely laminate onto the core member 1. Here, the carrier film 3 can be in a removed state or in a retained state. For ease of description, the case where the carrier film 3 is in the removed state will be described in detail below.

[0199] refer to Figure 6D After the above processing is completed, holes are formed in the first metal layer 2 and the core member 1 using a laser. Subsequently, chemical plating is performed on the interior of each hole, and a first dry film photoresist DFR1 is applied to each of the first metal layers 2. Next, the first dry film photoresist DFR1 is exposed and developed to form a pattern. Then, the pattern of the first dry film photoresist DFR1 is metal-plated, and thus, a second metal layer 4 can be formed.

[0200] refer to Figure 6E Once the above treatment is completed, the first dry film photoresist DFR1 can be removed by using stripping chemicals.

[0201] Then refer to Figure 6F A portion of each of the first metal layers 2 can be removed using chemicals. At this point, the first metal layer 2 existing beneath the pattern of the first dry film photoresist DFR1 can be removed.

[0202] refer to Figure 6G After the above processing, a brown oxide treatment is performed on the surface of each of the second metal layers 4. Therefore, a first surface treatment layer 5 can be formed on the second metal layer 4.

[0203] refer to Figure 6H After the first surface treatment layer 5 is formed as described above, the first protective layer 6 and the third metal layer 7 are disposed thereon. Therefore, the first protective layer 6 and the third metal layer 7 can be laminated onto the second metal layer 4. Here, each of the first protective layers 6 may contain the same or similar material as the core member 1.

[0204] refer to Figure 6I After the above processing is completed, a first hole H1 can be formed to connect the pair of outermost third metal layers 7. Through the first hole H1, it is possible to check whether the pattern of the second metal layer 4 formed therein is formed.

[0205] refer to Figure 6J After manufacturing as described above, the edges can be removed again using the cutting device BC to achieve the set dimensional values. Subsequently, individual holes for performing transfers, etc., can be formed on the third metal layer 7. Here, the holes can be formed from the third metal layer 7 to the core member 1, and can be formed in the dummy area DA described above.

[0206] refer to Figure 6K The surface of each of the third metal layers 7 can then be treated with a brown oxide coating again. In this case, a second surface treatment layer 8 can be formed on each of the third metal layers 7.

[0207] refer to Figure 6I A second hole H2 can be formed in each of the third metal layers 7. In this case, the second metal layer 4 can be exposed to the outside through the second hole H2. Here, the second hole H2 is formed by using a laser, and chemicals can be supplied to the second hole H2 to remove foreign matter, burrs, etc. that occur during laser irradiation.

[0208] refer to Figure 6M The fourth metal layer 9 can be deposited on each of the second surface treatment layers 8 by chemical plating. In this case, the fourth metal layer 9 can be located inside the second hole H2.

[0209] refer to Figure 6N The second dry film photoresist DFR2 is applied to each of the fourth metal layers 9 described above, and then a pattern is formed by exposure and development processes.

[0210] refer to Figure 6O A fifth metal layer 10 can be formed on each of the second dry film photoresist DFR2 in which a pattern is formed, by using an electroplating method. In this case, the fifth metal layer 10 can be located inside the pattern of the second dry film photoresist DFR2.

[0211] refer to Figure 6P The second dry film photoresist DFR2 can be removed using stripping chemicals. In this case, the fourth metal layer 9 can be exposed to the outside in the area where the second dry film photoresist DFR2 has been removed.

[0212] refer to Figure 6Q The fourth metal layer 9, exposed to the outside, can be etched using liquid chemicals. Subsequently, it is possible to inspect the pattern of the fifth metal layer 10 for defects by using an optical salt forming agent.

[0213] refer to Figure 6S The outer protective layer 11 can be formed on each of the fifth metal layers 10 and then dried in a hot convection dryer at a temperature of about 80 degrees Celsius. Subsequently, the outer protective layer 11 can be pressed by the pressing unit SP.

[0214] refer to Figure 6T A portion of the outer protective layer 11 is optically cured by irradiating it with ultraviolet light, and the uncured portion of the outer protective layer 11 can be removed by a developing process. Subsequently, the outer protective layer 11 is fully cured by performing thermal curing. Thus, the manufacturing of the multilayer circuit board is completed.

[0215] In this case, the multilayer circuit board may have a structure in which circuit patterns are formed on both surfaces. The operations described above are performed on the two surfaces of the core member 1 in the same manner.

[0216] The multilayer circuit board manufacturing apparatus according to embodiments of the present disclosure makes it possible to continuously manufacture multilayer circuit boards. The multilayer circuit board manufacturing apparatus according to embodiments of the present disclosure can be used in various manufacturing processes of multilayer circuit boards.

[0217] Although this disclosure has been described with reference to the embodiments mentioned above, various modifications or variations are possible without departing from the subject matter and scope of this disclosure. Therefore, the appended claims may include such modifications or variations, provided they fall within the subject matter of this disclosure.

[0218] It should be understood that the embodiments described herein are to be considered descriptive in nature only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer circuit board manufacturing equipment, comprising: An uncoiler, configured to provide components; The processing unit is configured to perform processing on the component provided from the uncoiler; A winding machine configured to wind the component on which the processing is completed in the processing unit; as well as A tension adjustment unit is located in the area between the uncoiler, the winding machine, the processing unit, and the processing unit and the winding machine, and the tension adjustment unit adjusts the tension of the component, wherein the tension adjustment unit includes a powder clutch connected to at least one of the uncoiler and the winding machine and maintains the tension of the component.

2. The multilayer circuit board manufacturing equipment according to claim 1, wherein the tension adjustment unit comprises: The contact roller moves in contact with the component; as well as A load unit is connected to the contact roller and adjusts the force applied to the member by the contact roller.

3. The multilayer circuit board manufacturing equipment according to claim 1, wherein the tension adjustment unit includes a speed adjustment unit, the speed adjustment unit being located in at least one of the uncoiler and the coiler and adjusting the speed of at least one of the uncoiler and the coiler.

4. The multilayer circuit board manufacturing equipment according to claim 1 further includes a position adjustment unit, the position adjustment unit being located between the uncoiler and the coiler and adjusting the position of the component.

5. The multilayer circuit board manufacturing equipment according to claim 1 further includes a component connecting unit, the component connecting unit being located between the uncoiler and the processing unit and between the coiler and the processing unit, and connecting the end of the component to the end of a new component.

6. The multilayer circuit board manufacturing equipment according to claim 1 further includes a stop unit, the stop unit being located between the uncoiler and the processing unit and between the coiler and the processing unit and preventing the component from moving.

7. The multilayer circuit board manufacturing equipment according to claim 1 further includes a transfer roller, the transfer roller being located between the uncoiler and the coiler and contacting the component during the transfer of the component.

8. The multilayer circuit board manufacturing equipment according to claim 7, wherein the transfer roller comprises: Roller body; as well as A protrusion located on and protruding from the roller body.

9. The multilayer circuit board manufacturing equipment according to claim 8, wherein the protrusion comprises: A pair of first protrusions are located at the ends of the roller body; as well as The second protrusion is located between the first protrusions and has a width smaller than that of each of the first protrusions.

10. The multilayer circuit board manufacturing apparatus according to claim 7, wherein the transfer rollers are configured as a plurality, and The plurality of transfer rollers include: A first transfer roller faces the first surface of the component; as well as The second transfer roller faces the second surface of the component, and the second transfer roller, in conjunction with the first transfer roller, blocks the product area of ​​the component from the outside.

11. The multilayer circuit board manufacturing equipment according to claim 10, wherein the first transfer roller and the second transfer roller are arranged perpendicular to the ground.

12. The multilayer circuit board manufacturing apparatus according to claim 1, wherein the processing unit performs at least one of developing process, etching process, brown oxide process, plating process, and stripping process.

13. The multilayer circuit board manufacturing equipment according to claim 1, wherein the processing unit comprises: A liquid chemical supply unit configured to supply liquid chemicals to the component; Multiple first rollers are configured to transfer the component; as well as The second roller guides the liquid chemicals supplied from the liquid chemical supply unit while preventing the liquid chemicals supplied from the liquid chemical supply unit from moving, and the second roller has a diameter smaller than that of each of the first rollers.

Images