Apparatus for processing a substrate and method for processing a substrate

Abstract

Provided is a technology for suppressing an increase in footprint of an installed device and transporting a substrate using magnetic levitation. A device for processing a substrate uses a substrate transport module including a stage on which the substrate is placed, a traveling plate, and a second magnet that acts with repulsive force between a first magnet, the substrate transport module being configured to be movable within a substrate transport chamber having a floor portion provided with the first magnet using magnetic levitation, to be moved upward relative to a substrate processing chamber provided on a top surface side of the substrate transport chamber and having an opening portion opened toward the substrate transport chamber, to insert the stage on which the substrate is placed into the substrate processing chamber via the opening portion, to close the opening portion using the traveling plate, and to process the substrate in this state.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to an apparatus for processing a substrate and a method for processing a substrate. BACKGROUND

[0002] For example, in an apparatus for processing a semiconductor wafer (hereinafter, also referred to as "wafer") as a substrate, a wafer is transported between a carrier that accommodates the wafer and a wafer processing chamber that performs processing. When the wafer is transported, a wafer transport mechanism of various structures is used.

[0003] For example, Patent Literature 1 describes a magnetic levitation transport apparatus including a transport table that levitates and travels in a transport path while maintaining a non-contact state with respect to a track and a partition wall under the action of a magnetic force from a magnetic pole, and transports a transported object such as a semiconductor wafer.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Application Laid-Open No. 7-117849 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] The present disclosure provides a technology that suppresses an increase in the footprint of an apparatus configured and transports a substrate using magnetic levitation.

[0009] SOLUTION TO PROBLEM

[0010] The apparatus for processing a substrate of the present disclosure is an apparatus for processing a substrate, in which

[0011] The apparatus for processing a substrate has:

[0012] a substrate transport chamber having a floor portion provided with a first magnet;

[0013] a substrate transport module including a stage that places the substrate, a traveling plate that is provided on a lower side of the stage, and a second magnet that acts with repulsive force with the first magnet, the substrate transport module being configured to be able to move in the substrate transport chamber by magnetic levitation using the repulsive force; and

[0014] a substrate processing chamber that is provided on an upper surface side of the substrate transport chamber to process the substrate, the substrate processing chamber being provided with an opening portion of a size that allows at least a part of the stage on which the substrate is placed to pass therethrough toward the substrate transport chamber,

[0015] The substrate transport module is moved upward to insert the stage on which the substrate is placed into the substrate processing chamber through the opening, the opening is closed by the traveling plate, and the substrate is processed in this state.

[0016] Effects of the Invention

[0017] According to the present disclosure, it is possible to suppress an increase in the footprint of the apparatus and transport a substrate using magnetic levitation. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a plan view of a wafer processing apparatus of the present disclosure.

[0019] Figure 2 is a longitudinal sectional side view of the wafer processing apparatus.

[0020] Figure 3 is a longitudinal sectional front view of the wafer processing apparatus.

[0021] Figure 4 is a schematic view of a floor portion of a vacuum transport chamber and a wafer transport module.

[0022] Figure 5 is an enlarged longitudinal sectional side view of the vacuum transport chamber.

[0023] Figure 6 is a first action diagram of the operation of the wafer transport module.

[0024] Figure 7 is a second action diagram of the operation of the wafer transport module.

[0025] Figure 8 is a first action diagram of the operation of the wafer transport module of another embodiment.

[0026] Figure 9 is a second action diagram of the operation of the wafer transport module of another embodiment.

[0027] Figure 10 is an explanatory view of an integrated wafer transport module. DETAILED DESCRIPTION

[0028] Hereinafter, the overall structure of a wafer processing apparatus 100 as a device for processing a substrate will be described with reference to Figures 1-3 The overall structure of a wafer processing apparatus 100 as a device for processing a substrate according to the present embodiment will be described.

[0029] In Figures 1-3 A multi-chamber type wafer processing apparatus 100 provided with a plurality of wafer processing chambers 110 as substrate processing chambers for processing a wafer W is shown. As shown in Figure 1As shown, the wafer processing apparatus 100 includes a loading port 141, an atmospheric transport chamber 140, a loading interlock chamber 130, a vacuum transport chamber 120, and a plurality of wafer processing chambers 110. In the following description, the direction in which the loading port 141 is provided will be referred to as the forward side.

[0030] In the wafer processing apparatus 100, the loading port 141, the atmospheric transport chamber 140, the loading interlock chamber 130, and the vacuum transport chamber 120 are arranged sequentially in the front-rear direction from the front side. In addition, a plurality of wafer processing chambers 110 are arranged on the upper surface side of the vacuum transport chamber 120.

[0031] The loading port 141 is configured as a mounting stage for holding a carrier C that accommodates a wafer W to be processed. As the carrier C, for example, a FOUP (Front Opening Unified Pod) or the like can be used.

[0032] The atmospheric transport chamber 140 is set to an atmospheric pressure atmosphere, for example, forming a downward flow of clean air. Furthermore, a wafer transport mechanism (not shown) for transporting the wafer W is provided inside the atmospheric transport chamber 140. The wafer transport mechanism within the atmospheric transport chamber 140 transports the wafer W between the carrier C and the loading interlock chamber 130.

[0033] A loading interlock chamber 130 is located between a vacuum transport chamber 120 and an atmospheric transport chamber 140. The loading interlock chamber 130 has a stage 131 for holding the fed wafer W. The loading interlock chamber 130 is configured to switch between atmospheric pressure and vacuum atmospheres. The loading interlock chamber 130 and the atmospheric transport chamber 140 are connected via a gate valve 133. Furthermore, the loading interlock chamber 130 and the vacuum transport chamber 120 are connected via a gate valve 132. Moreover, a wafer transport mechanism 160 is provided in the loading interlock chamber 130 for transporting the wafer W between it and the vacuum transport chamber 120; its structure will be described later.

[0034] The vacuum transport chamber 120 is depressurized to a vacuum atmosphere using a vacuum exhaust mechanism (not shown). Furthermore, a wafer transport module 20 for transporting wafers W between the stage 131 and each wafer processing chamber 110 is provided inside the vacuum transport chamber 120. The detailed structure of the wafer transport module 20 will be described later. The vacuum transport chamber 120 corresponds to the substrate transport chamber of this embodiment.

[0035] like Figures 1-3 As shown, the vacuum transport chamber 120 is constructed from a shell that is relatively long in the front-to-back direction and rectangular when viewed from above. In the wafer processing apparatus 100 of this example, a total of eight wafer processing chambers 110 are provided on the upper surface of the vacuum transport chamber 120. These wafer processing chambers 110 are arranged in two rows, left and right, with four chambers in each row when viewed from the front.

[0036] Each of the wafer processing chambers 110 is depressurized to a vacuum atmosphere by a vacuum exhaust mechanism not shown, and performs a prescribed process on a wafer W inside. As the process performed on the wafer W, an etching process, a film forming process, a cleaning process, an ashing process, and the like can be exemplified. In a case where the process performed on the wafer W uses a processing gas, a processing gas supply section 112 composed of a shower head or the like is provided in the wafer processing chamber 110. Figure 2 , Figure 3 ).

[0037] Further, a circular opening portion 111 that penetrates the top of the vacuum transfer chamber 120 and communicates with the internal space of the vacuum transfer chamber 120 is formed on the lower surface side of the position where each of the wafer processing chambers 110 is connected to the upper surface of the vacuum transfer chamber 120. On the other hand, a gate valve or the like for opening and closing the opening portion 111 is not provided between each of the wafer processing chambers 110 and the vacuum transfer chamber 120. The wafer processing chamber 110 corresponds to the substrate processing chamber of the present embodiment.

[0038] In the wafer processing apparatus 100 having the above-described outline structure, the wafer transfer module 20 is configured to be movable within the vacuum transfer chamber 120 by magnetic levitation. Further, the wafer transfer module 20 not only performs the transfer of the wafer W, but also has a function of supporting the wafer W that is transferred into the wafer processing chamber 110 during the processing of the wafer W in connection with the wafer processing chamber 110.

[0039] Hereinafter, the structure of the apparatus related to the transfer and processing of the wafer W using the wafer transfer module 20 will be described in detail.

[0040] As shown in Figs. 1 and 2, the wafer transfer module 20 includes a stage 21 that places the wafer W, and a traveling plate 22 that is disposed on the lower side of the stage 21. Figure 2 , Figure 3 The stage 21 is formed in a flat circular plate shape, and its upper surface becomes a placement surface for placing the wafer W that is the object of transfer and processing. The diameter of the stage 21 is smaller than the diameter of the opening portion 111 formed on the wafer processing chamber 110 side, and the stage 21 can be inserted into the inside of the wafer processing chamber 110 via the opening portion 111.

[0041] Further, as long as the diameter of the opening portion 111 is larger than the diameter of the wafer W, and as long as the part of the stage 21 on which the wafer W is placed is of a size that can be inserted into the opening portion 111.

[0042] Further, as long as the diameter of the opening portion 111 is larger than the diameter of the wafer W, and as long as the part of the stage 21 on which the wafer W is placed is of a size that can be inserted into the opening portion 111.

[0043] As shown in Figs. 1 and 2, the wafer transfer module 20 includes a stage 21 that places the wafer W, and a traveling plate 22 that is disposed on the lower side of the stage 21. Figure 6As shown, a heating unit 31 may also be provided inside the stage 21 to heat the wafer W placed on the stage 21 during processing. The heating unit 31 is powered by a battery 32, which is a heating power supply unit provided in the wafer transport module 20, thereby heating the stage 21.

[0044] For example, battery 32 uses a power supply control unit (not shown) provided in wafer transport module 20 to control the increase, decrease, supply, and stop of power supplied to heating unit 31. Alternatively, the power supply control unit may be configured to obtain control signals for power supply control via wireless communication with control unit 150, which will be described later.

[0045] Alternatively, when heating the wafer W is performed by installing a heating lamp or LED (light emitting diode) on the wafer processing chamber 110 side, the heating unit 31 inside the stage 21 may not be required.

[0046] For example, a circular travel plate 22 is provided on the lower side of the stage 21, which is arranged to support the stage 21 from the lower surface. The diameter of the travel plate 22 is configured to be larger than the diameter of the stage 21, and it is able to close the opening 111 of the wafer processing chamber 110.

[0047] An O-ring 23 is provided on the upper surface of the travel plate 22 in such a way that it surrounds the stage 21 (the opening 111 on the wafer processing chamber 110 side). The O-ring 23 serves to keep the wafer processing chamber 110 airtight when the travel plate 22 closes the opening 111.

[0048] Moreover, such as Figure 6 As shown in the enlarged view, an alignment pin 33 may also be provided on the upper surface of the travel plate 22. In this case, the wafer transport module 20 is aligned by inserting the alignment pin 33 into the alignment hole 34 provided on the top surface side of the vacuum transport chamber 120, and then the stage 21 is inserted into the wafer processing chamber 110. Through this alignment, the wafer W can be processed at the pre-set correct position.

[0049] Furthermore, the travel plate 22 is not limited to an example of being composed of a plate-shaped member that supports the platform 21 from its lower surface. For example, the travel plate 22 may also be composed of an annular member that extends from the lower side peripheral surface of the platform 21 into a flange shape.

[0050] like Figure 4 As schematically shown, a plurality of ground-side coils 15 are arranged within the ground surface 10 of the vacuum delivery chamber 120. The ground-side coils 15 generate a magnetic field by being powered by a power supply unit (not shown). From this viewpoint, the ground-side coils 15 correspond to the first magnet of this embodiment.

[0051] On the other hand, a plurality of module-side coils 35 are arranged inside the wafer transport module 20. With the module-side coils 35, repulsive forces act between the magnetic field generated by the ground-side coils 15. By this action, the wafer transport module 20 can be magnetically levitated with respect to the ground portion 10. Further, by adjusting the strength and position of the magnetic field generated by the ground-side coils 15, the wafer transport module 20 can be moved in a desired direction on the ground portion 10, the levitation amount can be adjusted, and the orientation of the wafer transport module 20 can be adjusted. Alternatively, a permanent magnet can be provided inside the wafer transport module 20 in addition to the plurality of module-side coils 35.

[0052] The module-side coils 35 provided in the wafer transport module 20 correspond to the second magnets of the present embodiment. With the module-side coils 35, power is supplied from the battery 32 provided in the wafer transport module 20 as a magnet power supply portion, and the module-side coils 35 function as electromagnets. For convenience of illustration, in Figure 6 、 Figure 7 , the following structure is adopted: the module-side coils 35 are supplied with power using a member common to the battery 32 that supplies power to the heating portion 31 described above. Alternatively, the heating power supply portion and the magnet power supply portion can be constituted by different batteries 32 from each other.

[0053] Further, instead of the module-side coils 35, a permanent magnet can be provided in the wafer transport module 20 to constitute the second magnets.

[0054] For example, each of the module-side coils 35 is controlled to increase, decrease, supply, or stop the power supplied to the module-side coils 35 by a power supply control portion not shown provided in the wafer transport module 20. At this time, the power supply control portion can be configured to acquire a control signal for power supply control from the control portion 150 described later by wireless communication.

[0055] Further, in the vacuum transport chamber 120, a plurality of lift mechanisms 4 for performing an operation of inserting the object table 21 into the wafer processing chamber 110 through the opening portion 111 are provided corresponding to each of the wafer processing chambers 110.

[0056] As shown in Figure 2 、 Figure 3 , the lift mechanism 4 includes a support plate 41 that supports the wafer transport module 20 from the bottom surface side, a base portion 45 that is disposed on the lower surface side of the ground portion 10 and includes a slide 44 that moves up and down along a track not shown, and a support column portion 42 that supports the support plate 41 and is connected to the slide 44 through the vacuum transport chamber 120.

[0057] By moving the wafer transport module 20 onto the support plate 41, the slider 44 is moved upward, thereby lifting the wafer transport module 20 supported by the support plate 41 toward the wafer processing chamber 110.

[0058] Furthermore, a flexible bellows 43 is provided between the lower surface of the ground surface 10 and the upper surface of the sliding member 44, surrounding the support portion 42 that penetrates the ground surface 10. This bellows 43 suppresses the entry of gases from the external atmosphere, keeping the interior of the vacuum delivery chamber 120 airtight.

[0059] Here, as Figure 2 , Figure 3 As shown, the internal space of the vacuum transport chamber 120 is configured with the following height dimension: when the support plate 41 is raised and the stage 21 is inserted into the wafer processing chamber 110, other wafer transport modules 20 can be moved on its lower side.

[0060] In addition, such as Figure 1 , Figure 2 As shown, for example, a cleaning chamber 123 is connected to the rear end of the vacuum transport chamber 120 via a gate valve 124. The cleaning chamber 123 is structured to accommodate the wafer transport module 20. Furthermore, the wafer transport module 20, which has reaction products or the like attached to the stage 21 during wafer W processing, is moved into the cleaning chamber 123, and cleaning gas is supplied toward the stage 21. As a result, cleaning to remove reaction products is performed. Alternatively, instead of the cleaning chamber 123, a wafer transport module replacement chamber or a stage replacement chamber that stores multiple wafer transport modules 20 and stages 21 may be connected to the vacuum transport chamber 120.

[0061] Furthermore, a locking module 50 is provided inside the vacuum transport chamber 120. This locking module 50 is used to close the opening 111 of the wafer processing chamber 110 during periods when wafer W is not being processed. The locking module 50 is configured similarly to the wafer transport module 20 described above, except that it does not have a stage 21. That is, the locking module 50 includes a module-side coil 35 within the travel plate 22, and is magnetically levitated by the repulsive force acting between it and the ground-side coil 15 of the ground surface 10, thus enabling it to move within the vacuum transport chamber 120.

[0062] The locking module 50 moves upward using the lifting mechanism 4 described above, and the traveling plate 22 abuts against the top surface of the opening 111 of the wafer processing chamber 110 in the vacuum transport chamber 120, thereby locking the opening 111. Alternatively, the O-ring 23 and alignment pin 33 described above can be provided on the upper surface of the traveling plate 22.

[0063] Also, the number of the shut-off modules 50 arranged in the vacuum transfer chamber 120 can be less than the number of the wafer processing chambers 110 provided on the upper surface side of the vacuum transfer chamber 120. In a case where a wafer processing chamber 110 in which the processing of the wafer W is not scheduled is generated on the processing schedule of the wafer W, it is sufficient to arrange the number of the shut-off modules 50 sufficient to cause the opening portion 111 of the wafer processing chamber 110 to be closed.

[0064] Further, as Figure 1 indicated, for example, a retreat chamber 121 for retreating the shut-off module 50 during a period in which the shut-off module 50 is not used can be connected to the rear end side of the vacuum transfer chamber 120. The retreat chamber 121 is only required to have a space for accommodating the retreated shut-off module 50, and the structure thereof is not particularly limited. Further, it is not necessarily required that the internal space of the retreat chamber 121 and the internal space of the vacuum transfer chamber 120 always be in communication, and it is not necessarily required to separate the internal spaces of the two using a gate valve or the like.

[0065] Next, a mechanism for transferring the wafer W between the load lock chamber 130 will be described with reference to Figure 2 , Figure 5 .

[0066] As Figure 2 indicated, the wafer transfer mechanism 160 of the present example is provided with an arm portion 162 configured to be freely rotatable about a center axis, freely liftable, and freely extendable and contractable, and an end effector 163 provided on the top end side of the arm portion 162. A Bernoulli holding disc 161 capable of lifting and transferring the wafer W in a non-contact state is provided on the lower surface of the end effector 163.

[0067] Further, instead of the Bernoulli holding disc 161, an edge chuck not shown can be provided on the end effector 163, and the wafer W can be transferred in a state in which the edge chuck is brought into abutment with the side surface of the wafer W to clamp and hold the wafer W. The wafer transfer mechanism 160 corresponds to a substrate transfer mechanism provided outside the vacuum transfer chamber 120.

[0068] On the other hand, as Figure 5 indicated, a plurality of lift pins 241 configured to be freely protruded and immersed with respect to the upper surface of the stage 21 as a placement surface of the stage 21 are provided on the stage 21 of the wafer transfer module 20 to transfer the wafer W between the wafer transfer mechanism 160. A lift mechanism that lifts the lift pins 241 is provided in the stage 21 to perform the protruding and immersing action.

[0069] The lifting mechanism of the lifting pin 241 includes a lifting coil 242, which serves as a third magnet. This lifting coil 242 exerts a repulsive force with the magnetic field generated by the aforementioned ground-side coil 15 located on the ground surface 10. Furthermore, by changing the levitation amount of the magnetic levitation utilizing this repulsive force, the lifting pin 241 moves up and down. Through this action, the lifting pin 241 protrudes and retracts relative to the stage 21, facilitating the transfer of the wafer W between the stage 21 and the wafer transport mechanism 160. The stage 21 is equipped with a battery (not shown) that supplies power to the lifting coil 242, and a power supply control unit that controls the power supply, similar to the case of the module-side coil 35 described above.

[0070] Furthermore, the method for achieving the lifting action of the lifting pin 241 is not limited to the use of magnetic levitation. For example, a mechanical lifting mechanism can be installed inside the platform 21, and the lifting pin 241 can be raised and lowered using a motor or the like.

[0071] The wafer processing apparatus 100 with the above-described structure includes a control unit 150 that controls various components such as the ground-side coils 15, the lifting mechanism 4, and the wafer processing chamber 110. The control unit 150 is a computer comprising a CPU and a storage unit, and controls the various components of the ground-side coils 10. The storage unit stores a program containing a set of steps (instructions) for controlling the operation of the wafer transport module 20 and the wafer processing chamber 110. This program is stored, for example, on a storage medium such as a hard disk, optical disk, magneto-optical disk, or memory card, and loaded into the computer from there.

[0072] Next, an example of the operation of the wafer processing apparatus 100 will be described. First, when the carrier C containing the wafer W to be processed is placed in the loading port 141, the wafer W is removed from the carrier C using a wafer transport mechanism (not shown) within the atmospheric transport chamber 140. Next, when the gate valve 133 is opened, the wafer transport mechanism enters the loading interlock chamber 130 and places the wafer W on the stage 131. Afterward, when the wafer transport mechanism retracts from the loading interlock chamber 130, the gate valve 133 is closed, switching the atmosphere within the loading interlock chamber 130 from atmospheric pressure to a vacuum atmosphere.

[0073] After a vacuum atmosphere is created within the loading interlock chamber 130, the gate valve 132 is opened, and the wafer W is transported into the vacuum transport chamber 120 using the wafer transport mechanism 160. Inside the vacuum transport chamber 120, near the connection point of the loading interlock chamber 130, a wafer transport module 20 stands by. Then, using the magnetic field generated by the ground-side coil 15 located on the ground surface 10, the lifting pin 241 is raised using magnetic levitation. At this time, the module-side coil 35 is disconnected to avoid being affected by the magnetic field generated to perform the lifting action of the lifting pin 241. Therefore, the wafer transport module 20 is placed on the upper surface of the ground surface 10 of the vacuum transport chamber 120.

[0074] Through the aforementioned actions, the top end of the lifting pin 241 protrudes to a position above the mounting surface of the wafer W, transferring the wafer W from the wafer transport mechanism 160 to the lifting pin 241. Then, the lifting pin 241 is lowered, transferring the wafer W from the lifting pin 241 to the stage 21, thereby placing the wafer W on the designated mounting surface. Then, as the wafer transport mechanism 160 retracts from the vacuum transport chamber 120, the gate valve 132 is closed.

[0075] Furthermore, when using the method of lifting the wafer W by bringing the Bernoulli holding disk 161 close to the upper surface of the wafer W, the transfer of the wafer W by means of the lifting pin 241 is not a necessary element. Alternatively, the transfer of the wafer W can be performed directly between the wafer transport mechanism 160 and the mounting surface of the stage 21.

[0076] After the wafer W is handed over to the wafer transport module 20, the module-side coil 35 of the wafer transport module 20 is turned on, and the wafer transport module 20 is moved toward the wafer processing chamber 110 where the wafer W is processed by magnetic levitation.

[0077] In the wafer processing chamber 110, which serves as the destination for wafer W, when processing of wafer W is being performed following processing of other wafer W, the support plate 41 of the lifting mechanism 4 is lowered, and the other wafer transport module 20 used for the previous wafer W processing is removed from the wafer processing chamber 110. The other wafer transport module 20 transports the processed wafer W to the handover position where it connects with the loading interlock chamber 130.

[0078] Furthermore, in the wafer processing chamber 110, which serves as the destination for transporting wafer W, in a standby state where no previous processing of wafer W has been performed, the support plate 41 is lowered, and the locking module 50 is removed from the wafer processing chamber 110. The locking module 50 is then moved to the retraction chamber 121.

[0079] Through these actions, the wafer transport module 20 and the locking module 50 of the closed opening 111 are removed, and the wafer processing chamber 110 is able to receive a new wafer W.

[0080] On the other hand, the wafer transport module 20, which receives the new wafer W, moves from the position where the wafer W is received in the self-loading interlock chamber 130 to the lower side of the wafer processing chamber 110 where the wafer W is processed. Then, it stops at a predetermined position on the support plate 41, adjusts its orientation, and then disconnects the module-side coil 35. As a result, the magnetic levitation state is released, and the wafer transport module 20 is placed on the support plate 41.

[0081] After that, as Figure 6As shown, the support plate 41 is raised, and the stage 21 is inserted into the wafer processing chamber 110, thereby feeding the wafer W into the wafer processing chamber 110. Accompanying this action, the traveling plate 22 closes the opening 111 of the wafer processing chamber 110, forming an airtight processing space within the wafer processing chamber 110. Figure 7 ).

[0082] After the wafer W is fed in, the stage 21 heats the wafer W to a preset temperature, and processing gas is supplied to the wafer processing chamber 110 from the processing gas supply unit 112. In this way, the desired processing is performed on the wafer W.

[0083] After processing wafer W for a preset period, heating of wafer W is stopped, and the supply of processing gas is also stopped. Alternatively, cooling gas may be supplied to wafer processing chamber 110 as needed to cool wafer W. Afterward, support plate 41 is lowered, and wafer W is removed from wafer processing chamber 110.

[0084] Alternatively, another wafer transport module 20 can be used to feed the next wafer W into the wafer processing chamber 110 after the wafer W has been delivered, and then perform processing. Alternatively, it can be in a standby state where the opening 111 is locked using the latch module 50. Alternatively, cleaning can be performed inside the wafer processing chamber 110 while in standby mode.

[0085] On the other hand, after the support plate 41 descends to the ground surface 10, the wafer transfer module 20 activates the module-side coil 35 and moves using magnetic levitation to the transfer position for transferring the wafer W to the loading interlock chamber 130. Then, the processed wafer W is transferred to the loading interlock chamber 130 and the atmospheric transfer chamber 140 in the reverse order of its initial loading, and then fed into the carrier C used to hold the processed wafer W.

[0086] After the processed wafer W is transferred to the loading interlock chamber 130, the wafer transport module 20 moves to the cleaning chamber 123 after each processing of wafer W or after a predetermined number of processing cycles. In the cleaning chamber 123, cleaning is performed to remove reaction products and other contaminants, bringing the stage 21 to a clean state. The wafer transport module 20 then moves to the vacuum transport chamber 120 to perform wafer W transport again.

[0087] According to the wafer processing apparatus 100 of this embodiment, a wafer processing chamber 110 is provided on the upper surface side of the vacuum transport chamber 120. Therefore, for example, compared with the case where the wafer processing chamber 110 is connected to the side of the vacuum transport chamber 120, the increase in the occupied area of ​​the wafer processing apparatus 100 can be suppressed.

[0088] Furthermore, magnetic levitation is used to transport the wafer W. Therefore, compared with the case where a telescopic arm type wafer transport mechanism is installed in the vacuum transport chamber 120 to transport the wafer W in and out, the increase in the area occupied by the vacuum transport chamber 120 and its larger size can be suppressed.

[0089] Furthermore, in this embodiment, the stage 21 is mounted on the wafer transport module 20, which moves freely using magnetic levitation. Therefore, compared to the case where the stage 21 is fixedly mounted inside the wafer processing chamber 110, the stage 21 can be cleaned separately using the cleanroom 123. As a result, the stage 21, which is in direct contact with the wafer W, is always kept clean, and the generation of contamination on the wafer W due to the generation of particles, etc., can be suppressed.

[0090] Here, the upward movement of the wafer transport module 20 when the stage 21 is inserted into the wafer processing chamber 110 is not limited to the example using the lifting mechanism 4 as described above. For example, it could also be, as... Figure 8 As shown, by increasing the levitation amount of the magnetic levitation, the wafer transport module 20 is moved upward.

[0091] At this time, as described above, after the stage 21 is inserted into the wafer processing chamber 110, the module-side coil 35 of the wafer transport module 20 is disconnected to avoid the influence of the magnetic field of the ground-side coil 15. On the other hand, when the wafer transport module 20 is moved upward using magnetic levitation, if the module-side coil 35 is disconnected, the wafer transport module 20 will fall. Therefore, it is also possible that, as Figure 8 , Figure 9 As shown, a support mechanism 36 is provided on the top surface of the vacuum transport chamber 120 to support the wafer transport module 20.

[0092] The support mechanism 36 is provided with a support position that supports the travel plate 22 from the lower surface side when the stage 21 is inserted into the wafer processing chamber 110. Figure 9 The position shown) and the retreat position from that support position ( Figure 8 A support member 361 that can move freely between the positions shown. Figure 9 In the example shown, the support member 361 enters the notch 362 formed on the lower surface of the travel plate 22, and supports the travel plate 22 from the lower surface side. Alternatively, the structure could be configured such that the function of the support mechanism 36 is located on the wafer transport module 20 side.

[0093] In addition, Figure 2 , Figure 3 In the embodiments shown above, the wafer transport module 20 has the following structure: a circular plate-shaped traveling plate 22 with a diameter larger than that of the stage 21 is disposed on the lower side of the circular plate-shaped stage 21.

[0094] In contrast, for example, the wafer transport module 20a can be constructed by forming the stage 21 and the travel plate 22 as a single unit. In this case, "formed as a single unit" means that it is possible to illustrate the case where the wafer transport module 20a is constructed as a whole without distinguishing between the stage 21 and the travel plate 22.

[0095] In this case, it could also be, such as Figure 10 As shown, an O-ring 23 is provided on the upper surface of the wafer transport module 20a. On the other hand, a recess is provided on the lower surface of the opening 111 on the wafer processing chamber 110 side, allowing the upper part of the wafer transport module 20a to be inserted. By inserting the upper part of the wafer transport module 20a into the recess that constitutes part of the wafer processing chamber 110, the O-ring 23 provided on the upper surface of the wafer transport module 20a abuts against the upper surface of the recess, thereby maintaining the wafer processing chamber 110 as airtight.

[0096] Furthermore, the number and arrangement of the wafer processing chambers 110 disposed on the upper surface of the vacuum transport chamber 120 are not limited to... Figures 1-3 The example shown is an example of this. Alternatively, the number of wafer processing chambers 110 can be increased or decreased as needed. For example, the case where only one wafer processing chamber 110 is provided on the upper surface of the vacuum transport chamber 120 is also included in the technology of this disclosure.

[0097] Furthermore, the configuration of the vacuum delivery chamber 120 is not limited to, for example... Figure 1 As shown, the long side of the rectangular vacuum delivery chamber 120 is arranged in the front-to-back direction. For example, when viewed from the loading port 141 side, the long side of the vacuum delivery chamber 120 may be arranged in the left-to-right direction.

[0098] Furthermore, the planar shape of the vacuum transfer chamber 120 can be varied depending on the shape of the area where the wafer processing apparatus 100 is configured. For example, it can be a square, a polygon with more than one pentagon, a circle, or an ellipse.

[0099] In addition, the substrate transport chamber used by the wafer transport module 20 to transport the wafer W to the wafer processing chamber 110 is not limited to a vacuum transport chamber 120 with an internal vacuum atmosphere. The wafer transport module 20 of this disclosure can also be applied to wafer processing apparatuses with a structure in which the wafer processing chamber 110 is located on the upper surface of the substrate transport chamber with an internal atmospheric pressure atmosphere. In this case, providing a loading interlock chamber 130 in the wafer processing apparatus is not necessary, and the wafer W taken from the carrier C to the atmospheric transport chamber 140 can be directly fed into the substrate transport chamber.

[0100] The embodiments disclosed herein should be considered illustrative rather than restrictive in all respects. The above embodiments may also be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

[0101] Explanation of reference numerals in the attached figures

[0102] C. Carrier; W. Wafer; 10. Ground surface; 15. Ground-side coil; 100. Wafer processing unit; 110. Wafer processing chamber; 111. Opening; 120. Vacuum transport chamber; 20. Wafer transport module; 21. Stage; 22. Traveling plate.

Claims

1. An apparatus for processing a substrate, wherein, The apparatus for processing the substrate includes: A substrate transport chamber having a ground surface portion equipped with a first magnet; A substrate conveying module includes: a stage for holding the substrate; and a traveling plate disposed on the lower side of the stage. and a second magnet, which exerts a repulsive force with the first magnet, the substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force; and A substrate processing chamber, disposed on the upper surface side of the substrate transport chamber for processing the substrate, has an opening in the substrate processing chamber facing into the substrate transport chamber, the opening being large enough to allow at least a portion of the stage holding the substrate to pass through. By moving the substrate transport module upwards, the stage carrying the substrate is inserted into the substrate processing chamber through the opening. The opening is then closed by the traveling plate, and the substrate is processed in this state. The upward movement of the substrate transport module is achieved using magnetic levitation. The top surface of the substrate transport chamber is provided with a support mechanism, which is equipped with a support member that can move freely between a support position that supports the traveling plate from the lower surface side when the stage is inserted into the substrate processing chamber and a retracted position that retracts from the support position.

2. The apparatus for processing a substrate according to claim 1, wherein, A plurality of substrate processing chambers are provided on the upper surface side of the substrate transport chamber, and a plurality of substrate transport modules for processing the substrates in the plurality of substrate processing chambers are provided in the substrate transport chamber.

3. The apparatus for processing a substrate according to claim 2, wherein, The substrate transport chamber is configured at a height such that other substrate transport modules can move below the substrate transport module when the stage is inserted into the substrate processing chamber.

4. The apparatus for processing a substrate according to claim 2, wherein, A locking module is provided in the substrate transport chamber. The locking module includes the traveling plate and the second magnet and is configured to move within the substrate transport chamber. On the other hand, the locking module does not include the stage and is used to close the opening during periods when the substrate is not being processed by using the traveling plate.

5. The apparatus for processing a substrate according to claim 4, wherein, The substrate transport chamber is connected to a retraction chamber that allows the locking module to retract during periods when it is not in use.

6. The apparatus for processing a substrate according to claim 1 or 2, wherein, The substrate conveying module includes: a heating unit disposed on the stage for heating the substrate; and a heating power supply unit for supplying heating power to the heating unit.

7. The apparatus for processing a substrate according to claim 1 or 2, wherein, The second magnet is composed of an electromagnet, and the substrate transport module includes: a magnet power supply unit for supplying power to the second magnet; and a power supply control unit for stopping the supply of power to the second magnet during the period when the stage is inserted into the substrate processing chamber, so as to avoid the influence of the first magnet.

8. The apparatus for processing a substrate according to claim 1 or 2, wherein, The substrate transport chamber is connected to the stage for cleaning the substrate transport module in the substrate transport chamber.

9. The apparatus for processing a substrate according to claim 1 or 2, wherein, A replacement chamber for replacing the substrate transport module and / or the stage is connected to the substrate transport chamber.

10. The apparatus for processing a substrate according to claim 1 or 2, wherein, The substrate transport module has multiple lifting pins configured to protrude and retract freely relative to the mounting surface of the stage on which the substrate is placed, so as to transfer the substrate between the substrate and an external substrate transport mechanism that performs the feeding and unloading of the substrate relative to the substrate transport chamber.

11. The apparatus for processing a substrate according to claim 10, wherein, The lifting pin has a third magnet that exerts a repulsive force with the first magnet, and is configured to move up and down freely by using magnetic levitation through the repulsive force.

12. The apparatus for processing a substrate according to claim 1 or 2, wherein, The substrate is transported in the substrate transport chamber under a vacuum atmosphere, and the substrate is processed in the substrate processing chamber under a vacuum atmosphere. A loading interlock chamber is connected to the substrate transport chamber, which is configured to switch freely between atmospheric pressure and vacuum atmosphere, and the substrate is fed in and out through the loading interlock chamber.

13. An apparatus for processing a substrate, wherein, The apparatus for processing the substrate includes: A substrate transport chamber having a ground surface portion equipped with a first magnet; A substrate transport module includes: a mounting surface for mounting the substrate; and a second magnet, which exerts a repulsive force with the first magnet, the substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force; and A substrate processing chamber, disposed on the upper surface side of the substrate transport chamber for processing the substrate, has an opening in the substrate processing chamber facing into the substrate transport chamber, the size of which allows at least a portion of the substrate transport module, in which the substrate is mounted, to pass through. By moving the substrate transport module upwards, the substrate transport module, carrying the substrate, is inserted into the substrate processing chamber through the opening, and the opening is closed. The substrate is then processed in this state. The upward movement of the substrate transport module is achieved using magnetic levitation. The top surface of the substrate transport chamber is provided with a support mechanism, which is equipped with a support member that can move freely between a support position that supports the substrate transport module from the lower surface side when the substrate transport module is inserted into the substrate processing chamber and a retracted position that is retracted from the support position.

14. A method for processing a substrate, wherein, The method for processing the substrate includes the following steps: A substrate transport module is used to transport the substrate placed on a stage. The substrate transport module is housed in a substrate transport chamber having a ground portion equipped with a first magnet. The module includes: the stage on which the substrate is placed; a travel plate disposed on the lower side of the stage; and a second magnet that exerts a repulsive force with the first magnet. The substrate transport module is configured to move within the substrate transport chamber by means of magnetic levitation using the repulsive force. Next, the substrate transport module is moved upward toward the substrate processing chamber, which is located on the upper surface of the substrate transport chamber for processing the substrate and has an opening that opens into the substrate transport chamber. The stage carrying the substrate is inserted into the substrate processing chamber through the opening, and the opening is closed using the traveling plate. The substrate is then processed within the substrate processing chamber. The upward movement of the substrate conveying module is achieved using magnetic levitation. The top surface of the substrate transport chamber is provided with a support mechanism. This support mechanism has a support member that can move freely between a support position that supports the traveling plate from the lower surface side when the stage is inserted into the substrate processing chamber and a retracted position that is withdrawn from the support position. The support mechanism is used to move the support member to the support position and to support the traveling plate when the opening is closed.

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