Block valve for a substrate processing apparatus and substrate processing apparatus
By using a shut-off valve in the substrate processing equipment, the problem of reduced gas flow caused by stagnant space was solved, resulting in more efficient gas supply and processing, and improved substrate quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- JUSUNG ENG
- Filing Date
- 2021-05-25
- Publication Date
- 2026-05-29
AI Technical Summary
In existing substrate processing equipment, the presence of stagnant space leads to a decrease in gas flow, which affects the processing effect and may generate particles. The problem is exacerbated as the flow path length increases.
A shut-off valve is adopted, which includes a shut-off body, a valve unit and an actuator. The shut-off body connects the gas supply unit and the substrate processing unit, reducing stagnant space, and the valve unit selectively controls the gas flow path.
It reduces stagnant space, improves gas flow, enhances substrate quality in the processing, and enables miniaturization of the shut-off valve, reducing its footprint.
Smart Images

Figure CN115917199B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a substrate processing apparatus that performs processing processes such as deposition and etching on a substrate. Background Technology
[0002] Generally, to manufacture solar cells, semiconductor devices, flat panel displays, etc., thin film layers, thin film circuit patterns, or optical patterns need to be formed on a substrate. For this purpose, processing techniques are performed on the substrate, and examples of these techniques include deposition processes that deposit thin films containing specific materials onto the substrate, exposure processes that selectively expose a portion of the thin film using a photosensitive material, and etching processes that remove the selectively exposed portions of the thin film to form patterns. These processing techniques are performed on the substrate using substrate processing equipment.
[0003] Figure 1 This is a schematic diagram of the structure of a substrate processing device according to the prior art.
[0004] Please see Figure 1 According to the prior art, the substrate processing apparatus 100 includes a substrate processing unit 110, a gas supply unit 120, a gas base 130, and a valve unit 140.
[0005] The substrate processing unit 110 uses gas supplied by the gas supply unit 120 to perform processing on the substrate.
[0006] The gas supply unit 120 supplies the gas to be used in the processing. The gas supply unit 120 is connected to the substrate processing unit 110 via the gas base 130 and the valve unit 140.
[0007] Gas base 130 is connected to each of gas supply unit 120, valve unit 140, and substrate processing unit 110. Gas base 130 is connected to gas supply unit 120 and valve unit 140 via supply flow path 131. The inlet of supply flow path 131 is connected to gas supply unit 120 via a pipe, and the outlet of supply flow path 131 is connected to valve unit 140 via a pipe. Gas base 130 is connected to valve unit 140 and substrate processing unit 110 via discharge flow path 132. The inlet of discharge flow path 132 is connected to valve unit 140 via a pipe, and the outlet of discharge flow path 132 is connected to substrate processing unit 110 via a pipe.
[0008] Valve unit 140 is connected to gas base 130 via a pipeline. Valve unit 140 includes an opening / closing flow path 141 connected to each of supply flow path 131 and discharge flow path 132, a valve body 142 formed with the opening / closing flow path 141, and an opening / closing mechanism 143 for opening / closing the opening / closing flow path 141.
[0009] When the opening / closing mechanism 143 opens the opening / closing flow path 141, the gas supplied by the gas supply unit 120 is supplied to the substrate processing unit 110 via the supply flow path 131 of the gas base 130, the opening / closing flow path 141 of the valve unit 140, and the discharge flow path 132 of the gas base 130. When the opening / closing mechanism 143 closes the opening / closing flow path 141, the gas supplied by the gas supply unit 120 is supplied to the opening / closing flow path 141 of the valve unit 140 via the supply flow path 131 of the gas base 130, and is then blocked by the opening / closing mechanism 143 from being supplied to the discharge flow path 132 of the gas base 130. The opening / closing mechanism 143 opens / closes the opening / closing flow path 141 according to preset process information; therefore, in the substrate processing unit 110, the processing is performed on the substrate according to the process information.
[0010] As described above, an on / off flow path 141 is provided for selectively supplying gas, and a supply flow path 131 and an exhaust flow path 132 are provided for connecting to each of the gas supply unit 120 and the substrate processing unit 110. Therefore, in the prior art substrate processing apparatus 100, the selective supply of gas is essentially performed by the on / off flow path 141 and the on / off mechanism 143, thus creating undesirable dead space in the supply flow path 131 and the exhaust flow path 132. Consequently, in the prior art substrate processing apparatus 100, gas flowability is reduced due to the dead space, leading to problems where side effects are applied to the processing processes performed on the substrate. Furthermore, as the length of the flow path connecting the gas supply unit 120 to the substrate processing unit 110 increases, particulate matter may be generated in the supply flow path 131 and the exhaust flow path 132. Furthermore, as the lengths of the supply flow path 131 and the discharge flow path 132 are further extended, the problems of reduced gas flow, side effects being applied to the processing on the substrate, and more of the top space of the substrate processing unit 110 cavity being occupied will become more severe. Summary of the Invention
[0011] Technical issues
[0012] The present invention aims to solve the above-mentioned problems and provide a shut-off valve and a substrate processing device that can reduce stagnant space when selectively supplying gas.
[0013] Technical solution
[0014] To achieve the above objectives, the present invention may include the following elements.
[0015] A blocking valve for a substrate processing apparatus according to the present invention includes a valve unit, an actuator, and a blocking body. The valve unit includes an opening / closing unit that retracts and extends. The actuator drives the opening / closing unit. The blocking body includes a receiving unit, and the opening / closing unit is received within the receiving unit. The blocking body may include a gas inlet connected to the receiving unit and a gas outlet connected to the receiving unit. The opening / closing unit can open or close the gas inlet or gas outlet within the receiving unit.
[0016] According to the present invention, a shut-off valve for a substrate processing apparatus is used to selectively supply gas supplied by a gas supply unit to a substrate processing unit performing processing on a substrate. The shut-off valve may include a shut-off body, a valve unit, and an actuator. The shut-off body is connected to each of the gas supply unit and the substrate processing unit. The valve unit is coupled to the shut-off body. The actuator drives an opening / closing unit. The shut-off body may include a gas inlet, a gas outlet, and a receiving unit. The gas inlet is connected to the gas supply unit. The gas outlet is connected to the substrate processing unit. The receiving unit is connected between the gas inlet and the gas outlet to each of the gas inlet and the gas outlet. The valve unit includes an opening / closing unit and a valve body. The opening / closing unit opens or closes one of the gas inlet and the gas outlet. The valve body is movably coupled to the opening / closing unit. The valve body may be inserted into and coupled to the shut-off body such that the opening / closing unit moves within the receiving unit to open or close one of the gas inlet and the gas outlet.
[0017] According to a substrate processing apparatus of the present invention, a cavity, a support unit, a gas injection unit, a gas supply unit, and a shut-off valve are included. The cavity provides processing space. The support unit supports at least one substrate. The gas injection unit injects gas toward the support unit. The gas supply unit supplies gas to the gas injection unit. The shut-off valve is connected to each of the gas supply unit and the gas injection unit. The shut-off valve may include a shut-off body, a valve unit, and an actuator. The shut-off body is connected to each of the gas supply unit and the gas injection unit. The valve unit is coupled to the shut-off body. The actuator drives the valve unit. The shut-off body may include a gas inlet, a gas outlet, and a receiving unit. The gas inlet is connected to the gas supply unit. The gas outlet is connected to the gas injection unit. The receiving unit is connected between the gas inlet and the gas outlet to each of the gas inlet and the gas outlet. The valve unit may include an opening / closing unit and a valve body. The opening / closing unit opens or closes one of the gas inlet and the gas outlet. The valve body is movably coupled to the opening / closing unit. The valve body can be inserted into and coupled to the blocking body, so that the opening / closing unit can move within the receiving unit to open or close one of the gas inlet and the gas outlet.
[0018] Beneficial effects
[0019] According to the present invention, the following effects can be obtained.
[0020] This invention features the ability to make all connections to both the gas supply unit and the substrate processing unit using a blocking body, as well as a selective gas supply function. Therefore, this invention reduces the stagnant space (i.e., the top space of the cavity) in the gas flow path for gas to flow into the blocking body. Consequently, this invention improves gas flowability, thereby improving the quality of the substrate on which processing is performed.
[0021] In this invention, because no independent flow path is provided for the gas to flow into the valve unit, the overall size of the valve unit can be reduced. Furthermore, in this invention, the valve unit can be inserted into the shut-off body, thus further reducing the overall size of the shut-off valve. Therefore, in this invention, the shut-off valve can be miniaturized, reducing the area it occupies in the installation space. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the structure of a substrate processing device according to the prior art.
[0023] Figure 2 This is a schematic diagram of the structure of the substrate processing apparatus according to the present invention.
[0024] Figure 3 and Figure 4This is a side cross-sectional view of the substrate processing apparatus according to the present invention.
[0025] Figure 5 This is an exploded side view of the substrate processing apparatus according to the present invention.
[0026] Figure 6 To present Figure 4 A side section view of a partially enlarged view of region A in the diagram.
[0027] Figure 7 This is a side cross-sectional view of an embodiment of the substrate processing apparatus according to the present invention, which includes a connector.
[0028] Figure 8 This is a side cross-sectional schematic diagram of an embodiment of a blocking body in a substrate processing apparatus according to the present invention, which includes multiple gas emission ports. Detailed Implementation
[0029] Hereinafter, embodiments of the substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings. The blocking valve according to the present invention may be included in the substrate processing apparatus according to the present invention and will therefore be described together with the description of the substrate processing apparatus according to the present invention.
[0030] Please see Figure 2 and Figure 3 According to the present invention, the substrate processing apparatus 1 performs processing on a substrate S. The substrate S may be a glass substrate, a silicon substrate, a metal substrate, or a similar substrate. The substrate processing apparatus 1 according to the present invention can perform a deposition process to deposit a thin film on the substrate S, and an etching process to remove a portion of the thin film deposited on the substrate S. Hereinafter, embodiments of the deposition process performed by the substrate processing apparatus 1 according to the present invention will be described, but it will be apparent to those skilled in the art that embodiments of another process, such as an etching process, can also be implemented using the substrate processing apparatus 1 according to the present invention.
[0031] The substrate processing apparatus 1 according to the present invention may include a substrate processing unit 2, a gas supply unit 3, and a shut-off valve 4.
[0032] <Substrate Processing Unit>
[0033] Please see Figure 2 The substrate processing unit 2 performs processing on the substrate. The substrate processing unit 2 can use gas supplied from the gas supply unit 3 to perform the processing. The substrate processing unit 2 may include a cavity 21, a support unit 22, and a gas injection unit 23.
[0034] Cavity 21 provides processing space 21a. Processing processes such as deposition and etching on the substrate can be performed in processing space 21a. Processing space 21a can be disposed in cavity 21. Exhaust port (not shown) for discharging gas from processing space 21a can be coupled to cavity 21. Support unit 22 and gas injection unit 23 can be installed in cavity 21.
[0035] Support unit 22 supports a substrate. Support unit 22 may support one substrate or multiple substrates. When multiple substrates are supported by support unit 22, processing can be performed on these substrates simultaneously. Support unit 22 may be coupled to cavity 21. Support unit 22 may be disposed within cavity 21.
[0036] Gas injection unit 23 injects gas toward support unit 22. Gas injection unit 23 may be coupled to cavity 21. Gas injection unit 23 may be configured relative to support unit 22. Processing space 21a may be disposed between gas injection unit 23 and support unit 22. Gas injection unit 23 may be coupled to cover 21b. Cover 21b is coupled to cavity 21 to cover the top of cavity 21.
[0037] <Gas Supply Unit>
[0038] Please see Figure 2 Gas supply unit 3 supplies gas. The gas supplied by gas supply unit 3 can be injected into processing space 21a through gas injection unit 23, and thus can be used for processing on the substrate. Gas supply unit 3 can supply source gas containing a thin film to be deposited on the substrate, a reaction gas that reacts with the source gas, and a purge gas for purging gas located in processing space 21a. Gas supply unit 3 may include at least one storage tank (not shown) for storing gas. Gas supply unit 3 can be connected to substrate processing unit 2 through shut-off valve 4. Therefore, gas supplied by gas supply unit 3 can be supplied to substrate processing unit 2 through shut-off valve 4.
[0039] <Valve Unit>
[0040] Please see Figures 2 to 5The shut-off valve 4 selectively supplies gas supplied by the gas supply unit 3 to the substrate processing unit 2. The shut-off valve 4 can be implemented as a shut-off valve 4 for a substrate processing apparatus according to the present invention. The shut-off valve 4 can be connected to both the gas supply unit 3 and the substrate processing unit 2. In this case, the shut-off valve 4 can be connected to the gas injection unit 23 of the substrate processing unit 2. When the shut-off valve 4 allows gas to pass through, the gas supplied by the gas supply unit 3 can pass through the shut-off valve 4 and be supplied to the substrate processing unit 2, and can then be injected into the processing space 21a through the gas injection unit 23. When the shut-off valve 4 blocks the flow of gas, the gas supplied by the gas supply unit 3 cannot pass through the shut-off valve 4 and therefore cannot be supplied to the substrate processing unit 2. The shut-off valve 4 can selectively deliver the gas supplied by the gas supply unit 3 according to preset process information. The process information may include gas flow rate, gas injection time, and gas injection sequence based on the process information and can be preset by the operator. The process information can be stored in a control unit (not shown). In this case, the shut-off valve 4 can selectively deliver the gas supplied by the gas supply unit 3 according to the control of the control unit.
[0041] The shut-off valve 4 may include a shut-off body 41, a valve unit 42, and an actuator 43.
[0042] The blocking body 41 is connected to each of the gas supply unit 3 and the substrate processing unit 2. The valve unit 42 may be coupled to the blocking body 41. Therefore, the blocking body 41 implements a gas flow path that allows gas to be supplied from the gas supply unit 3 to the substrate processing unit 2 and allows the corresponding gas flow path to be selectively opened or closed by the valve unit 42. In other words, the blocking body 41 is provided for implementing all connections made to each of the gas supply unit 3 and the substrate processing unit 2, as well as selective gas supply. Therefore, the substrate processing apparatus 1 according to the present invention achieves the following effects.
[0043] First, such as Figure 1As shown, in a comparative example where a valve body 142, including an on / off flow path 141 for selectively supplying gas, and a gas base 130, including a supply flow path 131 and an exhaust flow path 132 for connecting the gas supply unit 120 to the substrate processing unit 110, are provided independently, the flow paths performing the repetitive function are located in two blocks, thus creating an undesirable stagnant space. In the comparative example, gas flowability decreases due to the stagnant space, negatively impacting the processing on the substrate. Furthermore, as the length of the flow path connecting the gas supply unit 120 to the substrate processing unit 110 increases, the stagnant space further expands in the supply flow path 131 and the exhaust flow path 132, further exacerbating the problems of reduced gas flowability and negatively impacting the processing on the substrate.
[0044] On the other hand, in the substrate processing apparatus 1 according to the present invention, the blocking body 41 is implemented to have the function of making all connections on each of the gas supply unit 3 and the substrate processing unit 2, and the selective supply function of selectively supplying gas. Therefore, compared with the comparative example, the substrate processing apparatus 1 according to the present invention can reduce the stagnant space, thereby improving the gas flow. Therefore, the substrate processing apparatus 1 according to the present invention can improve the quality of the substrate on which the processing process is completed. Therefore, in the substrate processing apparatus 1 according to the present invention, even when the length of the flow path for connecting the gas supply unit 3 to the substrate processing unit 2 increases, the flow path can still be replaced by the blocking body 41, which is formed so that its length matches the increased length of the flow path, thereby improving the measures for dealing with changes in the length of the flow path connecting the gas supply unit 3 to the substrate processing unit 2.
[0045] The blocking body 41 can be coupled to the substrate processing unit 2. For example, the blocking body 41 can be coupled to the cover 21b. In this case, the blocking body 41 can be positioned separately from the gas supply unit 3. The blocking body 41 can be connected to the gas supply unit 3 via a pipe or the like. The blocking body 41 can be positioned separately from the substrate processing unit 2. In this case, the blocking body 41 can be connected to the gas injection unit 23 via a pipe or the like.
[0046] The blocking body 41 may include a gas inlet 411, a gas outlet 412, and a accommodating unit 413.
[0047] Gas inlet 411 is connected to gas supply unit 3. Gas inlet 411 serves as an inflow path allowing gas supplied by gas supply unit 3 to flow in. Gas inlet 411 can be formed by drilling a hole in the blocking body 41.
[0048] Gas outlet 412 is connected to substrate processing unit 2. Gas outlet 412 serves as an outlet path allowing gas flowing in from gas inlet 411 to flow out to substrate processing unit 2. Gas outlet 412 can be formed by drilling a hole in blocking body 41. Gas outlet 412 can be provided on the bottom surface of receiving unit 413. In this case, gas inlet 411 can be provided on the side surface of receiving unit 413. Gas outlet 412 can be provided on the side surface of receiving unit 413. In this case, gas inlet 411 can be provided on the bottom surface of receiving unit 413.
[0049] The receiving unit 413 connects to each of the gas inlet 411 and the gas outlet 412. The receiving unit 413 can serve as a connection path connecting the gas inlet 411 to the gas outlet 412. The receiving unit 413 can be formed by drilling a hole in the blocking body 41.
[0050] Please see Figures 2 to 6 Valve unit 42 opens or closes the gas inlet 411 or the gas outlet 412. Figures 3 to 8 The illustration shows an embodiment in which a valve unit 42 is configured to open or close a gas outlet 412. It will be apparent to those skilled in the art that an embodiment in which the valve unit 42 is configured to open or close a gas inlet 411 can also be implemented. Hereinafter, an embodiment in which the valve unit 42 is configured to open or close a gas outlet 412 will be described, but it will be apparent to those skilled in the art that an embodiment in which the valve unit 42 is configured to open or close a gas inlet 411 can also be implemented.
[0051] like Figure 3 As shown, when the valve unit 42 opens the gas outlet 412, the gas supplied by the gas supply unit 3 can be supplied to the substrate processing unit 2 via the gas inlet 411, the accommodating unit 413 and the gas outlet 412.
[0052] like Figure 4 As shown, when the valve unit 42 closes the gas outlet 412, the gas supplied by the gas supply unit 3 is prevented from flowing out through the gas outlet 412. Therefore, the gas supplied by the gas supply unit 3 may not be supplied to the substrate processing unit 2.
[0053] As described above, depending on whether the valve unit 42 opens or closes the gas outlet 412, the gas supplied by the gas supply unit 3 can be selectively supplied to the substrate processing unit 2.
[0054] Valve unit 42 can be coupled to blocking body 41. In this case, valve unit 42 can be inserted into receiving unit 413. Therefore, with valve unit 42 inserted into blocking body 41 via receiving unit 413, valve unit 42 can open or close gas outlet 412. Therefore, the substrate processing apparatus 1 according to the present invention can achieve the following effects.
[0055] First, the substrate processing apparatus 1 according to the present invention is implemented to have the function of making all connections to each of the gas supply unit 3 and the substrate processing unit 2 using the blocking body 41 and the valve unit 42, and the selective supply function of selectively supplying gas. Therefore, the substrate processing apparatus 1 according to the present invention can reduce the stagnant space of the gas flow path for allowing gas to flow into the blocking body 41, thereby improving the gas flowability. Therefore, the substrate processing apparatus 1 according to the present invention can improve the quality of the substrate on which the processing process is completed.
[0056] Secondly, in the substrate processing apparatus 1 according to the present invention, since no independent flow path is provided for the gas to flow into the valve unit 42, the overall size of the valve unit 42 can be reduced. Furthermore, in the substrate processing apparatus 1 according to the present invention, the valve unit 42 can be inserted into the blocking body 41 via the receiving unit 413, thus further reducing the overall size of the blocking valve 4. Therefore, in the substrate processing apparatus 1 according to the present invention, the blocking valve 4 can be miniaturized, thereby reducing the area occupied in the installation space.
[0057] Valve unit 42 may include opening / closing unit 421 and valve body 422.
[0058] The opening / closing unit 421 is movably coupled to the valve body 422. With the opening / closing unit 421 coupled to the valve body 422, the opening / closing unit 421 can simultaneously open or close the gas outlet 412. The opening / closing unit 421 can retract and extend to open or close the gas outlet 412. When the valve body 422 is inserted into and coupled to the blocking body 41, the opening / closing unit 421 can move within the receiving unit 413 to open or close the gas outlet 412.
[0059] The opening / closing unit 421 may include an opening / closing element 4211, an opening / closing flange 4212, and a stop element 4213.
[0060] The opening / closing element 4211 can be movably coupled to the valve body 422. One side of the opening / closing element 4211 can protrude from the valve body 422, and the other side of the opening / closing element 4211 can be disposed within the valve body 422. One side of the opening / closing element 4211 can be used to open or close the gas outlet 412. The other side of the opening / closing element 4211 can be moved to open or close the gas outlet 412. In this case, the actuator 43 can move the other side of the opening / closing element 4211, thereby moving the opening / closing element 4211.
[0061] The opening / closing flange 4212 protrudes to the outer side of the opening / closing member 4211. When the opening / closing unit 421 closes the gas outlet 412, the opening / closing flange 4212 can contact the inner wall of the blocking body 41 and is therefore positioned above the gas outlet 412. Thus, the gas outlet 412 can be closed. When the opening / closing unit 421 opens the gas outlet 412, the opening / closing flange 4212 can separate from the inner wall of the blocking body 41. Thus, the gas outlet 412 can be opened. The opening / closing flange 4212 and the opening / closing member 4211 can be provided as a single piece.
[0062] A stop 4213 is coupled to the opening / closing flange 4212. When the opening / closing unit 421 closes the gas outlet 412, the stop 4213 can be disposed between the opening / closing flange 4212 and the blocking body 41 to block the flow of gas. Therefore, the stop 4213 can strengthen the closing force corresponding to the gas outlet 412. The stop 4213 can be implemented using a sealing ring.
[0063] The opening / closing unit 421 may include an elastic element 4214.
[0064] The elastic element 4214 provides an elastic force to the opening / closing element 4211, causing the opening / closing element 4211 to move elastically. The elastic element 4214 may be disposed between the opening / closing flange 4212 and the valve body 422. When the opening / closing element 4211 moves close to the gas outlet 412, the elastic element 4214 can stretch and have a restoring force. In this case, the restoring force of the elastic element 4214 can be used when the opening / closing element 4211 moves to open the gas outlet 412. The elastic element 4214 may be configured to surround the opening / closing element 4211. In this case, the opening / closing element 4211 may be disposed within the elastic element 4214. The elastic element 4214 may be implemented as a bellows.
[0065] The on / off unit 421 may include a guide 4215.
[0066] A guide member 4215 protrudes from the opening / closing member 4211. The guide member 4215 may protrude from the opening / closing member 4211 in a direction from the opening / closing member 4211 toward the gas outlet 412. The guide member 4215 may be formed such that its dimensions gradually decrease as it protrudes from the opening / closing member 4211. For example, the guide member 4215 may be implemented such that its diameter gradually decreases as it protrudes from the opening / closing member 4211. During the movement of the opening / closing unit 421 to close the gas outlet 412, the guide member 4215 may be inserted into the gas outlet 412 before the opening / closing member 4211. Therefore, the guide member 4215 may have the function of guiding the opening / closing unit 421 so that the opening / closing unit 421 accurately closes the gas outlet 412. The guide member 4215 and the opening / closing member 4211 may be provided as a single piece.
[0067] Please see Figures 2 to 6 Valve body 422 is coupled to blocking body 41. Opening / closing element 4211 may be movably coupled to valve body 422. Valve body 422 may be inserted into or coupled to blocking body 41 such that opening / closing element 4211 moves within receiving unit 413 to open or close gas outlet 412.
[0068] The valve body 422 can be inserted into a slot 414 formed in the blocking body 41. The slot 414 is formed to connect to the receiving unit 413. The receiving unit 413 can be disposed between the gas outlet 412 and the slot 414, relative to the direction of movement of the opening / closing member 4211. The slot 414 can be formed to have a size larger than that of the receiving unit 413. When both the slot 414 and the receiving unit 413 are circular, the slot 414 can be formed to have a diameter larger than that of the receiving unit 413. Therefore, the step height can be formed in the blocking body 41 at the portion of the receiving unit 413 connected to the slot 414.
[0069] The valve body 422 may include a first valve flange 4221.
[0070] The first valve flange 4221 can be inserted into the slot 414. The first valve flange 4221 can protrude to the outer side of the valve body 422. The first valve flange 4221 can be supported by the inner wall of the blocking body 41 with the slot 414 formed therein. The closing element 422a can be disposed in the slot 414 between the first valve flange 4221 and the blocking body 41. The closing element 422a can block between the first valve flange 4221 and the blocking body 41, thus preventing gas leakage through the area between the first valve flange 4221 and the blocking body 41. The closing element 422a can be implemented with a metal gasket. The closing element 422a can be implemented with a sealing ring. When the valve body 422 is coupled to the blocking body 41, the first valve flange 4221 can press against the closing element 422a. Therefore, the closing force of the closing element 422a can be further strengthened.
[0071] Please see Figures 2 to 6 The actuator 43 drives the valve unit 42. The actuator 43 can also drive the opening / closing unit 421. Therefore, the opening / closing unit 421 can be moved by the actuator 43 to open or close the gas outlet 412. For example, the actuator 43 can use pneumatic pressure to drive the valve unit 42. The actuator 43 can supply gas to or discharge gas from the valve body 422, thus moving a portion of the opening / closing element 4211 disposed in the valve body 422. Therefore, the opening / closing element 4211 can open or close the gas outlet 412 when moved. The actuator 43 can be configured to connect to the internal space of the valve body 422. The actuator 43 can be connected to the internal space of the valve body 422 via a pipeline. The actuator 43 can use hydraulic pressure to drive the valve unit 42.
[0072] Please see Figures 2 to 6 The shut-off valve 4 may include a fixed unit 44.
[0073] A fixing unit 44 is inserted into the blocking body 41. The fixing unit 44 can be inserted into the slot 414 and can press against the first valve flange 4221. Therefore, the closing member 422a disposed between the first valve flange 4221 and the blocking body 41 can be forcibly blocked between the first valve flange 4221 and the blocking body 41 using pressure based on the first valve flange 4221 and pressure based on the fixing unit 44. Therefore, the substrate processing apparatus 1 according to the present invention can use the closing member 422a to prevent gas from the gas supply unit 3 from leaking into the substrate processing unit 2. A perforation can be formed in the fixing unit 44. The valve body 422 can be inserted into this perforation.
[0074] In the case where a fixing unit 44 is provided, the valve body 422 may include a second valve flange 4222. The second valve flange 4222 may be disposed separately from the first valve flange 4221. The fixing unit 44 may be disposed between the second valve flange 4222 and the first valve flange 4221. Therefore, the second valve flange 4222 may press against the fixing unit 44 to press against the first valve flange 4221, and may press against the first valve flange 4221 to press against the closing member 422a. Therefore, the substrate processing apparatus 1 according to the present invention can use the second valve flange 4222, the fixing unit 44 and the first valve flange 4221 to press against the closing member 422a, and thus the pressure corresponding to the closing member 422a can be increased to further strengthen the blocking force against gas leakage. The second valve flange 4222 may protrude to the outer side of the valve body 422.
[0075] Please see Figure 7 The shut-off valve 4 may include a connector 45 and a seal 46.
[0076] The connector 45 is detachably coupled to the blocking body 41. The connector 45 may include a connecting flow path 451 connected to either the gas inlet 411 or the gas outlet 412. When the connecting flow path 451 is connected to the gas inlet 411 due to the connector 45 being coupled to the blocking body 41, the connecting flow path 451 can be used as a flow path allowing gas supplied from the gas supply unit 3 to be supplied to the gas inlet 411. When the connecting flow path 451 is connected to the gas outlet 412 due to the connector 45 being coupled to the blocking body 41, the connecting flow path 451 can be used as a flow path allowing gas flowing out of the gas outlet 412 to be supplied to the substrate processing unit 2.
[0077] As described above, the substrate processing apparatus 1 according to the present invention is implemented to extend the length of the gas flow path through the block using a connector 45. Therefore, the substrate processing apparatus 1 according to the present invention enhances the ease of operation in extending the length of the gas flow path according to actual conditions. The connector 45 can be detachably coupled to the blocking body 41 using a fastening device such as a bolt.
[0078] A seal 46 may be disposed between the connector 45 and the blocking body 41. The seal 46 prevents gas flowing along the connection flow path 451 from leaking between the connector 45 and the blocking body 41. The seal 46 may be implemented using a sealing ring.
[0079] Please see Figure 8The blocking body 41 may include multiple gas outlets 412. In this case, a gas inlet 411 may be formed in the blocking body 41 to connect to each gas outlet 412. The blocking valve 4 may include multiple valve units 42. Each valve unit 42 may be coupled to the blocking body 41 to individually open or close the gas outlet 412. Therefore, gas flowing along the gas inlet 411 may be supplied to the substrate processing unit 2 through the area opened by the valve unit 42 in the gas outlet 412. As described above, the substrate processing apparatus 1 according to the present invention may be implemented as a branch pipe in which gas is selectively discharged through multiple gas outlets 412 by a blocking body 41. The outlet portion for connecting the gas outlets 412 to the substrate processing unit 2 may be provided in the receiving unit 413. Therefore, when the valve unit 42 opens the gas outlet 412, the gas supplied by the gas supply unit 3 can be supplied to the accommodating unit 413 through the gas inlet 411 and the gas outlet 412, and then supplied to the substrate processing unit 2 through the outflow portion 412a of the gas outlet 412.
[0080] exist Figure 8 The diagram illustrates three gas outlets 412, 412', and 412" formed in the blocking body 41, and three valve units 42, 42', and 42" coupled to the blocking body 41. However, the invention is not limited thereto, and two, four, or more gas outlets 412 may be formed in the blocking body 41, and two, four, or more valve units 42, 42', and 42" may be coupled to the blocking body 41. In this case, the number of gas outlets 412 and the number of valve units 42 may be implemented as the same.
[0081] The blocking body 41 may include multiple receiving units 413. In this case, the receiving units 413 may be respectively connected to the gas outlet 412. The outlet portion of the gas outlet 412 connected to the substrate processing unit 2 may be respectively provided in the receiving unit 413. The blocking valve 4 may include multiple valve units 42. The valve units 42 may be coupled to the blocking body 41 to be inserted into each receiving unit 413.
[0082] At Figure 8 The diagram illustrates three receiving units 413, 413', and 413" formed in the blocking body 41, and three valve units 42, 42', and 42" coupled to the blocking body 41. However, the invention is not limited thereto, and two, four, or more receiving units 413 may be formed in the blocking body 41, and two, four, or more valve units 42 may be coupled to the blocking body 41. In this case, the number of receiving units 413 and the number of valve units 42 may be implemented as the same.
[0083] The present invention described above is not limited to the embodiments and drawings described above. Those skilled in the art will clearly recognize that various modifications, variations and substitutions can be made without departing from the spirit and scope of the present invention.
Claims
1. A shut-off valve for a substrate processing apparatus, for selectively supplying gas supplied by a gas supply unit to a substrate processing unit performing a processing procedure on a substrate, the shut-off valve comprising: The blocking body is connected to each of the gas supply unit and the substrate processing unit; Valve unit, coupled to the blocking body; and The driver drives the valve unit. in The blocking body includes a gas inlet, a gas outlet, and a receiving unit. The gas inlet is connected to the gas supply unit, the gas outlet is connected to the substrate processing unit, and the receiving unit is connected between the gas inlet and the gas outlet to each of the gas inlet and the gas outlet. The valve unit includes an on / off unit and a valve body. The on / off unit opens or closes one of the gas inlet and the gas outlet. The valve body is movably coupled to the on / off unit. The valve body is inserted into and coupled to the blocking body, such that the opening / closing unit moves within the receiving unit to open or close one of the gas inlet and the gas outlet. The opening / closing unit includes an opening / closing element, an opening / closing flange, and a guide. The opening / closing element is movably coupled to the valve body. The opening / closing flange protrudes to the outer side of the opening / closing element. The opening / closing flange and the opening / closing element are provided as a single piece and cover the gas outlet. The guide protrudes from the opening / closing element toward the gas inlet or the gas outlet. The guide and the opening / closing element are provided as a single piece. The blocking body includes a slot formed to connect to the receiving unit, the slot having a diameter larger than that of the receiving unit and having a step formed in the portion connecting to the receiving unit. The valve body includes a first valve flange and a second valve flange. The first valve flange is inserted into the slot and supported by the inner wall of the blocking body forming the slot. The second valve flange is separately disposed from the first valve flange. A closing element is provided in the slot between the first valve flange and the blocking body. A fixing unit is provided in the slot between the first valve flange and the second valve flange. The fixing unit has a through hole, and the valve body is inserted into the through hole. The second valve flange presses against the fixing unit to press against the first valve flange, and the first valve flange presses against the closing member.
2. The shut-off valve as claimed in claim 1, wherein... The opening / closing unit includes an opening / closing element, an opening / closing flange, and a stop element. The opening / closing element is movably coupled to the valve body. The opening / closing flange protrudes to the outer side of the opening / closing element. The stop element is coupled to the opening / closing flange. When the opening / closing unit closes the gas inlet or the gas outlet, the stop is disposed between the opening / closing flange and the blocking body to block the flow of gas.
3. The shut-off valve as claimed in claim 1, wherein... The opening / closing unit includes an opening / closing element and a resilient element. The opening / closing element is movably coupled to the valve body, and the resilient element provides an elastic force to the opening / closing element, causing the opening / closing element to move elastically. The elastic element is disposed between the first valve flange of the valve body and the opening / closing flange of the opening / closing element.
4. The shut-off valve as claimed in claim 1, wherein The opening / closing unit includes an opening / closing element and a guide element. The opening / closing element is movably coupled to the valve body, and the guide element protrudes from the opening / closing element in a direction from the opening / closing element to the gas inlet or the gas outlet. The guide is formed such that its size gradually decreases as it protrudes from the opening / closing member, and the guide is inserted into the gas inlet or gas outlet before the opening / closing member moves to close the gas inlet or gas outlet.
5. The shut-off valve of claim 1, further comprising a connector detachably coupled to the shut-off body and a sealing element disposed between the connector and the shut-off body. The connector includes a connecting flow path that connects to the gas inlet or the gas outlet.
6. The shut-off valve as claimed in claim 1, wherein The blocking body includes multiple gas outlets, and Multiple valve units are coupled to the blocking body to individually open or close each gas outlet.
7. The shut-off valve as claimed in claim 1, wherein The blocking body comprises multiple accommodating units, and Multiple valve units are coupled to the blocking body and respectively inserted into the multiple receiving units.
8. A substrate processing apparatus, comprising: The cavity provides processing space; Support unit, supporting at least one substrate; A gas injection unit injects gas toward the support unit; A gas supply unit supplies the gas to the gas injection unit; and A shut-off valve is connected to each of the gas supply unit and the gas injection unit, wherein... The shut-off valve includes: The blocking body is connected to each of the gas supply unit and the gas injection unit; Valve unit, coupled to the blocking body; and The driver drives the valve unit. The blocking body includes a gas inlet, a gas outlet, and a receiving unit. The gas inlet is connected to the gas supply unit, the gas outlet is connected to the gas injection unit, and the receiving unit is connected between the gas inlet and the gas outlet to each of the gas inlet and the gas outlet. The valve unit includes an on / off unit and a valve body. The on / off unit opens or closes one of the gas inlet and the gas outlet. The valve body is movably coupled to the on / off unit. The valve body is inserted into and coupled to the blocking body, such that the opening / closing unit moves within the receiving unit to open or close one of the gas inlet and the gas outlet. The opening / closing unit includes an opening / closing element, an opening / closing flange, and a guide. The opening / closing element is movably coupled to the valve body. The opening / closing flange protrudes to the outer side of the opening / closing element. The opening / closing flange and the opening / closing element are provided as a single piece and cover the gas outlet. The guide protrudes from the opening / closing element toward the gas inlet or the gas outlet. The guide and the opening / closing element are provided as a single piece. The blocking body includes a slot formed to connect to the receiving unit, the slot having a diameter larger than that of the receiving unit and having a step formed in the portion connecting to the receiving unit. The valve body includes a first valve flange and a second valve flange. The first valve flange is inserted into the slot and supported by the inner wall of the blocking body forming the slot. The second valve flange is separately disposed from the first valve flange. A closing element is provided in the slot between the first valve flange and the blocking body. A fixing unit is provided in the slot between the first valve flange and the second valve flange. The fixing unit has a through hole, and the valve body is inserted into the through hole. The second valve flange presses against the fixing unit to press against the first valve flange, and the first valve flange presses against the closing member.