Integrated capacitor and method for manufacturing the same

Abstract

The integrated capacitor (5A) of the present invention comprises: a plurality of capacitor elements (2), each of which has a first internal electrode (8) and a second internal electrode (9); an outer casing (12) accommodating the plurality of capacitor elements (2); a plurality of first external electrode layers (3) provided on the outer surface of the outer casing (12) and electrically connected to the first internal electrode (8) of each of the plurality of capacitor elements (2); and a plurality of second external electrode layers (4) provided on the outer surface of the outer casing (12) and electrically connected to the second internal electrode (9) of each of the plurality of capacitor elements (2). The first external electrode layer (3) of at least the first capacitor element (2a) of the plurality of capacitor elements (2) has a convex portion (15) protruding outward from a portion of the outer edge or a concave portion (15a) recessed inward from a portion of the outer edge when viewed from above in the thickness direction thereof.

Description

Technical Field

[0001] The present invention relates to an integrated capacitor and a method for manufacturing the integrated capacitor. Background Art

[0002] Patent document 1 discloses a solid electrolytic capacitor, wherein a valve metal porous portion is provided as a first electrode on at least one side of a conductor separated into a plurality of parts by vertical and horizontal grooves, a dielectric film is provided on at least the surface of the valve metal porous portion, a solid electrolyte layer is provided on the dielectric film, a collector layer is provided on the solid electrolyte layer, a through hole with an insulating layer formed on the inner wall is provided in a part of the above-mentioned conductor, a lead electrode as a second electrode electrically connected to the collector layer and exposed on the terminal electrode side of the first electrode is provided in the through hole, and an insulating portion for dividing the first electrode, the dielectric film, the solid electrolyte layer, the collector layer and the lead electrode into separate capacitor elements is provided in the above-mentioned groove.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2003-272957

[0004] In electrolytic capacitors such as solid electrolytic capacitors, it is inevitable that during the manufacturing process, a thinner defective portion is generated in the oxide film (dielectric film) formed on the surface of the anode as the internal electrode. Therefore, leakage current is generated in the defective portion. In the worst case, insulation breakdown occurs starting from the defective portion, and there are cases where the capacitor is destroyed during use. Therefore, in order to repair the defective portion during the manufacturing process of the electrolytic capacitor, an aging treatment at high temperature is required. During the aging treatment, in order to perform self-repair, a voltage needs to be applied to the positive electrode and the negative electrode as the external electrode.

[0005] In this case, for the integrated capacitor described in Patent Document 1 that integrates a plurality of independent capacitor elements, it is necessary to apply voltage to the electrodes of each capacitor element. In the case where the integrated capacitor is built into the substrate of an electronic device, it is required to integrate more capacitor elements. Specifically, in most cases, about 50 to 100 capacitor elements are integrated in an integrated capacitor, and in this case, there are also cases where the voltage application points are one hundred to several hundred.

[0006] The above problem is not limited to the case where the electrolytic capacitor is aged, and also occurs in the case where a voltage is applied to various capacitors to confirm the presence or absence of a short circuit, for example. Therefore, it can be said that this is a common problem for integrated capacitors regardless of the type of capacitor. Summary of the invention

[0007] The present invention is made to solve the above-mentioned problems, and aims to provide an integrated capacitor that can easily apply voltage to electrodes of each capacitor element. In addition, the present invention aims to provide a method for manufacturing an integrated capacitor that can easily apply voltage to electrodes of each capacitor element.

[0008] The integrated capacitor of the present invention comprises: a plurality of capacitor elements, each of which has a first internal electrode and a second internal electrode; an outer casing that accommodates the plurality of capacitor elements; a plurality of first external electrode layers that are disposed on the outer surface of the outer casing and are electrically connected to the first internal electrodes of each of the plurality of capacitor elements; and a plurality of second external electrode layers that are disposed on the outer surface of the outer casing and are electrically connected to the second internal electrodes of each of the plurality of capacitor elements. The first external electrode layer of at least the first capacitor element among the plurality of capacitor elements has a convex portion that protrudes outward from a portion of the outer edge or a concave portion that is recessed inward from a portion of the outer edge when viewed from above in the thickness direction thereof.

[0009] The manufacturing method of the integrated capacitor of the present invention comprises: a step of preparing an assembly of capacitor elements, wherein the assembly of capacitor elements comprises: a plurality of capacitor elements, each of which has a first internal electrode and a second internal electrode; an outer casing, which accommodates the plurality of capacitor elements; a plurality of first external electrode layers, which are arranged on the outer surface of the outer casing and are electrically connected to the first internal electrodes of each of the plurality of capacitor elements; and a plurality of second external electrode layers, which are arranged on the outer surface of the outer casing and are electrically connected to the second internal electrodes of each of the plurality of capacitor elements; A process of electrically connecting the plurality of first external electrode layers to each other via a first wiring disposed on the outer surface of the outer casing; a process of electrically connecting the plurality of second external electrode layers to each other via a second wiring disposed on the outer surface of the outer casing; a process of applying a voltage between any one of the plurality of first external electrode layers and any one of the plurality of second external electrode layers; a process of electrically separating the plurality of first external electrode layers from each other by cutting off the first wiring after the voltage application process; and a process of electrically separating the plurality of second external electrode layers from each other by cutting off the second wiring after the voltage application process.

[0010] According to the present invention, it is possible to provide an integrated capacitor in which a voltage can be easily applied to electrodes of each capacitor element. In addition, according to the present invention, it is possible to provide a method for manufacturing an integrated capacitor in which a voltage can be easily applied to electrodes of each capacitor element. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1FIG. 1 is a plan view schematically showing an example of an integrated capacitor according to the first embodiment of the present invention.

[0012] Figure 2A yes Figure 1 aa' cross-sectional view of the integrated capacitor shown.

[0013] Figure 2B yes Figure 1 bb' cross-sectional view of the integrated capacitor shown.

[0014] Figure 2C yes Figure 1 The c-c' cross-sectional view of the integrated capacitor shown.

[0015] Figure 3 It is a plan view schematically showing an example of the first external electrode layer.

[0016] Figure 4 It is a plan view schematically showing another example of the first external electrode layer.

[0017] Figure 5 is a schematic representation of the process used to manufacture Figure 1 FIG. 1 is a plan view of an example of an assembly of capacitor elements of an integrated capacitor shown in FIG.

[0018] Figure 6 yes Figure 5 A sectional view taken along the line dd' of an assembly of capacitor elements shown.

[0019] Figure 7 FIG. 1 is a plan view schematically showing an example of an integrated capacitor according to a second embodiment of the present invention.

[0020] Figure 8 It is a schematic representation of the process used to manufacture Figure 7 FIG. 1 is a plan view of an example of an assembly of capacitor elements of an integrated capacitor shown in FIG.

[0021] Fig. 9 yes Figure 8 A sectional view taken along the line dd' of an assembly of capacitor elements shown.

[0022] Fig.10 FIG. 1 is a plan view schematically showing an example of an integrated capacitor according to a third embodiment of the present invention.

[0023] Fig.11 is a schematic representation of the process used to manufacture Fig.10 FIG. 1 is a plan view of an example of an assembly of capacitor elements of an integrated capacitor shown in FIG.

[0024] Fig.12 yes Fig.11A sectional view taken along the line dd' of an assembly of capacitor elements shown.

[0025] Fig.13 FIG. 1 is a plan view schematically showing an example of an integrated capacitor according to a fourth embodiment of the present invention.

[0026] Fig.14 yes Fig.13 An example of an e-e' cross-sectional view of an integrated capacitor is shown.

[0027] Fig.15 It is cut off Fig.14 A cross-sectional view of the integrated capacitor before the first wiring is shown.

[0028] Fig.16 FIG. 1 is a plan view schematically showing an example of an integrated capacitor according to a fifth embodiment of the present invention.

[0029] Fig.17 yes Fig.16 An example of an e-e' cross-sectional view of an integrated capacitor is shown.

[0030] Fig.18 yes Fig.16 Another example of an ee' cross-sectional view of an integrated capacitor is shown.

[0031] Fig.19 It is a schematic representation of the manufacturing Fig.17 A cross-sectional view of an example of a method of manufacturing an integrated capacitor is shown.

[0032] Fig. 20 It is a schematic representation of the manufacturing Fig.18 A cross-sectional view of an example of a method of manufacturing an integrated capacitor is shown.

[0033] Fig.21 FIG. 1 is a plan view schematically showing an example of an integrated capacitor according to a sixth embodiment of the present invention.

[0034] Fig. 22 yes Fig.21 An example of an e-e' cross-sectional view of an integrated capacitor is shown.

[0035] Fig.23 It is cut off Fig. 22 A cross-sectional view of the integrated capacitor before the first wiring is shown.

[0036] Fig.24 FIG. 1 is a plan view schematically showing an example of an assembly of integrated capacitors. DETAILED DESCRIPTION

[0037] Hereinafter, an integrated capacitor and a method for manufacturing the integrated capacitor according to the present invention will be described.

[0038] However, the present invention is not limited to the following configurations, and can be appropriately modified and applied within the scope of the gist of the present invention. In addition, a configuration in which two or more of the preferred configurations of the present invention described below are combined is also the present invention.

[0039] The embodiments shown below are illustrative, and it is of course possible to partially replace or combine the structures shown in different embodiments. After the second embodiment, the description of matters shared with the first embodiment is omitted, and only the differences are described. In particular, the same effects played by the same structure are not mentioned in sequence in each embodiment.

[0040] The drawings shown below are schematic and may differ in size, aspect ratio, etc. from actual products.

[0041] [First embodiment]

[0042] Figure 1 FIG. 1 is a plan view schematically showing an example of an integrated capacitor according to the first embodiment of the present invention. Figure 2A yes Figure 1 aa' cross-sectional view of the integrated capacitor shown. Figure 2B yes Figure 1 bb' cross-sectional view of the integrated capacitor shown. Figure 2C yes Figure 1 The c-c' cross-sectional view of the integrated capacitor shown.

[0043] exist Figure 1 , Figure 2A , Figure 2B as well as Figure 2C , an integrated capacitor 5A is shown. The integrated capacitor 5A includes a plurality of capacitor elements 2 inside an outer casing 12 , and first external electrode layers 3 and second external electrode layers 4 of the capacitor elements 2 are provided on the front and back surfaces of the outer casing 12 .

[0044] The number of capacitor elements 2 is not particularly limited, but Figure 1 2 , a first capacitor element 2 a , a second capacitor element 2 b , a third capacitor element 2 c , a fourth capacitor element 2 d , a fifth capacitor element 2 e , and a sixth capacitor element 2 f are shown.

[0045] The first external electrode layer 3 is, for example, an anode pad, and the second external electrode layer 4 is, for example, a cathode pad. The first external electrode layer 3 may be provided on the outer surface of the outer body 12, for example, it may be provided on both the surface and the back surface of the outer body 12, or it may be provided on either side. Similarly, the second external electrode layer 4 may be provided on the outer surface of the outer body 12, for example, it may be provided on both the surface and the back surface of the outer body 12, or it may be provided on either side.

[0046] exist Figure 2B as well as Figure 2C In the embodiment, the first external electrode layer 3 on the front and back sides is electrically connected to the first internal electrode 8 via the connection through hole 10, and the second external electrode layer 4 on the front and back sides is electrically connected to the second internal electrode 9 via the connection through-hole conductor 11. The first internal electrode 8 and the second internal electrode 9 are not limited to the case where the polarities are different from each other, and for example, they may be non-polar.

[0047] As with the first capacitor element 2a and the fourth capacitor element 2d, the third external electrode layer 3a electrically connected to the first internal electrode 8 of at least one capacitor element 2 may be provided on the outer surface of the outer casing 12. The third external electrode layer 3a may be provided on both the surface and the back of the outer casing 12, or on either side. The third external electrode layer 3a is, for example, an anode pad. As with the first external electrode layer 3, the third external electrode layer 3a on the front and back surfaces is electrically connected to the first internal electrode 8 inside through the connection through hole 10.

[0048] Although not shown, a fourth external electrode layer electrically connected to the second internal electrode 9 of at least one capacitor element 2 may be provided on the outer surface of the outer package 12. The fourth external electrode layer may be provided on both the surface and the back of the outer package 12, or on either side. The fourth external electrode layer is, for example, a cathode pad. As with the second external electrode layer 4, the fourth external electrode layer on the front and back sides is electrically connected to the second internal electrode 9 inside through the connecting through-hole conductor 11.

[0049] The capacitor element 2 is, for example, an electrolytic capacitor such as a solid electrolytic capacitor. In this case, the first internal electrode 8 is an anode, for example, made of aluminum. The second internal electrode 9 is a cathode, for example, made of copper. The capacitor element 2 is formed by arranging the conductive polymer layer 22 between the first internal electrode 8 and the second internal electrode 9, and forming an oxide film (dielectric film) not shown between the first internal electrode 8 and the conductive polymer layer 22.

[0050] Furthermore, the capacitor element 2 may be a ceramic capacitor using barium titanate or the like, or a thin film capacitor using silicon nitride (SiN), silicon dioxide (SiO 2 ), hydrogen fluoride (HF) or the like.

[0051] The outer casing 12 is made of resin, for example. In this case, the outer casing 12 is made of insulating material such as epoxy resin, phenolic resin, or polyimide resin, or a mixed material of epoxy resin, phenolic resin, or polyimide resin and inorganic filler such as silica or alumina.

[0052] Figure 3 It is a plan view schematically showing an example of the first external electrode layer.

[0053] exist Figure 3 In the example shown, the first external electrode layer 3 of each capacitor element 2 has a protrusion 15 that protrudes outward from a part of the outer edge when viewed in plan from the thickness direction thereof.

[0054] Figure 4 It is a plan view schematically showing another example of the first external electrode layer.

[0055] exist Figure 4 In the example shown, the first external electrode layer 3 of each capacitor element 2 has a recessed portion 15 a recessed inward from a part of the outer edge when viewed in plan from the thickness direction thereof.

[0056] exist Figure 1 In the integrated capacitor 5A shown in FIG. 1 , the first external electrode layer 3 of the first capacitor element 2a has a protrusion 15. In this case, Figure 2A as well as Figure 2B As shown, the outer surface of the outer casing 12 may have a depressed portion 14 on an extension line of the direction in which the convex portion 15 of the first external electrode layer 3 protrudes. In addition, the first external electrode layer 3 of the first capacitor element 2a may have a depressed portion 15a instead of the convex portion 15. In this case, the outer surface of the outer casing 12 may have a depressed portion 14 on an extension line in the direction opposite to the direction in which the concave portion 15a of the first external electrode layer 3 is depressed.

[0057] exist Figure 1 In the illustrated integrated capacitor 5A, the second external electrode layer 4 of the first capacitor element 2a has a convex portion 15. In this case, the outer surface of the outer casing 12 may also have a depressed portion 14 on an extension line of the direction in which the convex portion 15 of the second external electrode layer 4 protrudes. In addition, the second external electrode layer 4 of the first capacitor element 2a may also have a concave portion 15a instead of the convex portion 15. In this case, the outer surface of the outer casing 12 may also have a depressed portion 14 on an extension line in the direction opposite to the direction in which the concave portion 15a of the second external electrode layer 4 is depressed.

[0058] exist Figure 1In the illustrated integrated capacitor 5A, similarly to the second capacitor element 2b, the third capacitor element 2c, the fourth capacitor element 2d, the fifth capacitor element 2e, and the sixth capacitor element 2f, the first external electrode layer 3 and the second external electrode layer 4 have the protrusions 15.

[0059] In the first embodiment of the present invention, it is characterized in that: the first external electrode layer of at least the first capacitor element among the plurality of capacitor elements has a convex portion or a concave portion. In the first embodiment of the present invention, as long as the first external electrode layer of the first capacitor element has a convex portion or a concave portion, the second external electrode layer of the first capacitor element may have a convex portion or a concave portion, or may not have a convex portion or a concave portion. In addition, among the plurality of capacitor elements, there may be a capacitor element whose first external electrode layer does not have a convex portion or a concave portion, and there may be a capacitor element whose second external electrode layer does not have a convex portion or a concave portion.

[0060] In the first embodiment of the present invention, when the first external electrode layer has a convex portion or a concave portion, the outer surface of the outer casing may also have a concave portion on an extension line of a direction in which the convex portion of the first external electrode layer protrudes or on an extension line in a direction opposite to the direction in which the concave portion of the first external electrode layer is sunken. Similarly, when the second external electrode layer has a convex portion or a concave portion, the outer surface of the outer casing may also have a concave portion on an extension line of a direction in which the convex portion of the second external electrode layer protrudes or on an extension line in a direction opposite to the direction in which the concave portion of the second external electrode layer is sunken.

[0061] As described above, when voltage needs to be applied to the electrodes of the integrated capacitor for aging treatment or to check for short circuit, the more capacitor elements included in the integrated capacitor, the more voltage application points there are.

[0062] As an example of a method for applying voltage to each electrode in such a case, a method for applying voltage when the integrated capacitor is loaded into a socket is proposed. In this method, physical positioning is performed on the outer shape of the integrated capacitor and the inner side of the socket, contact is obtained between the pins of the socket and the electrodes of the capacitor element, and voltage is applied through the substrate on which the socket is installed. However, since a socket having a plurality of pins that match the outer shape and electrode position of the integrated capacitor must be prepared, the manufacturing cost becomes high. In addition, since a socket is required for each type of integrated capacitor according to the outer dimensions, the dimensions of the capacitor element, the configuration of the capacitor element, etc., the manufacturing cost is further increased.

[0063] Therefore, the present inventors have considered the following method: for a collection of capacitor elements constituting an integrated capacitor, a plurality of first external electrode layers are electrically connected to each other via a first wiring, and a plurality of second external electrode layers are electrically connected to each other via a second wiring. In this method, by applying a voltage between any one of the first external electrode layers and any one of the second external electrode layers, a voltage can be applied to the electrodes of all capacitor elements included in the collection of capacitor elements.

[0064] Figure 5 is a schematic representation of the process used to manufacture Figure 1 FIG. 1 is a plan view of an example of an assembly of capacitor elements of an integrated capacitor shown in FIG. Figure 6 yes Figure 5 A sectional view taken along the line dd' of an assembly of capacitor elements shown.

[0065] exist Figure 5 as well as Figure 6 In the example shown, by applying a voltage between the voltage application point 6 of the first external electrode layer 3 of the second capacitor element 2b and the voltage application point 7 of the second external electrode layer 4, after the first external electrode layers 3 are electrically connected to each other via the first wiring 1a and the second external electrode layers 4 are electrically connected to each other via the second wiring 1b, it is possible to apply a voltage to the electrodes of all the capacitor elements 2 included in the capacitor element assembly 5. In addition, the voltage application point 6 of the first external electrode layer 3 and the voltage application point 7 of the second external electrode layer 4 may be the electrodes of the same capacitor element 2 or the electrodes of different capacitor elements 2. In addition, the third external electrode layer may be used as the voltage application point 6 of the first external electrode layer 3, and the fourth external electrode layer may be used as the voltage application point 7 of the second external electrode layer 4.

[0066] After voltage application, the first wiring 1a and the second wiring 1b can be cut by melting with a laser or the like, thereby easily returning to a state where each capacitor element 2 is independent. Such a method for manufacturing an integrated capacitor is also one aspect of the present invention.

[0067] The state after the first wiring 1a and the second wiring 1b are cut is Figure 1 That is, the first external electrode layer 3 and the second external electrode layer 4 have a protrusion 15 (see Figure 3 ) as the remaining portion of the first wiring 1a or the second wiring 1b, or having a concave portion 15a (refer to Figure 4 ) as a trace of the first wiring 1a or the second wiring 1b. In addition, the outer surface of the outer casing 12 may have a depressed portion 14 formed by melting or removal.

[0068] According to the present invention, since the pins of the socket can be only two pins even if a socket is used to apply voltage, the manufacturing cost can be greatly reduced. In addition, unlike the previous method that requires multiple pins, there is no need for high-precision positioning. Moreover, it is also possible to apply voltage in a cheaper way without using an expensive socket. For example, the voltage can be applied by a simple contact fixture provided with two pins. On the other hand, in the present invention, although the first wiring and the second wiring need to be formed, since these wirings can be formed simultaneously during the manufacturing process of the integrated capacitor as the final product, it will not become a factor that increases the manufacturing cost compared to the case where the socket is prepared for each variety.

[0069] In the method for manufacturing an integrated capacitor of the present invention, it is preferred to cut the first wiring and the second wiring using a laser. For example, when the first wiring and the second wiring are made of a copper-based material, they can be easily melted using a UV laser or a green laser.

[0070] [Second embodiment]

[0071] In the second embodiment of the present invention, the first external electrode layers are electrically connected to each other by the first internal electrodes of the capacitor element.

[0072] Figure 7 FIG. 1 is a plan view schematically showing an example of an integrated capacitor according to a second embodiment of the present invention. Figure 8 is a schematic representation of the process used to manufacture Figure 7 FIG. 1 is a plan view of an example of an assembly of capacitor elements of an integrated capacitor shown in FIG. Fig. 9 yes Figure 8 A sectional view taken along the line dd' of an assembly of capacitor elements shown.

[0073] exist Figure 8 and Fig. 9 In the example shown, the first external electrode layer 3 and the third external electrode layer 3a of the first capacitor element 2a are electrically connected via the first internal electrode 8 instead of via the first wiring 1a, and the third external electrode layer 3a of the first capacitor element 2a and the first external electrode layer 3 of the third capacitor element 2c are electrically connected via the first wiring 1a. Fig. 9 The connection paths 16 shown are electrically connected.

[0074] Thus, in the second embodiment of the present invention, a third external electrode layer electrically connected to the first internal electrode of at least one of the multiple capacitor elements is arranged on the outer surface of the outer casing, and the multiple first external electrode layers are electrically connected to each other by electrically connecting the first external electrode layer and the third external electrode layer of the same capacitor element via the first internal electrode instead of the first wiring, and electrically connecting the third external electrode layer of the capacitor element and the first external electrode layer of other capacitor elements via the first wiring.

[0075] In the second embodiment of the present invention, the second external electrode layers may also be electrically connected to each other using the second internal electrode of the capacitor element. That is, the fourth external electrode layer electrically connected to the second internal electrode of at least one of the plurality of capacitor elements may be provided on the outer surface of the outer casing, and the plurality of second external electrode layers may be electrically connected to each other by electrically connecting the second external electrode layer and the fourth external electrode layer of the same capacitor element via the second internal electrode instead of via the second wiring, and electrically connecting the fourth external electrode layer of the capacitor element to the second external electrode layer of other capacitor elements via the second wiring.

[0076] exist Figure 8 and Fig. 9 In the example shown, by applying a voltage between the voltage application point 6 of the first external electrode layer 3 of the second capacitor element 2b and the voltage application point 7 of the second external electrode layer 4, it is possible to apply a voltage to the electrodes of all the capacitor elements 2 included in the capacitor element assembly 5. In addition, the voltage application point 6 of the first external electrode layer 3 and the voltage application point 7 of the second external electrode layer 4 may be electrodes of the same capacitor element 2 or electrodes of different capacitor elements 2. In addition, the third external electrode layer may be used as the voltage application point 6 of the first external electrode layer 3, and the fourth external electrode layer may be used as the voltage application point 7 of the second external electrode layer 4.

[0077] After the voltage is applied, by cutting off the first wiring 1 a and the second wiring 1 b , it is possible to easily return to a state where each capacitor element 2 is independent.

[0078] The state after the first wiring 1a and the second wiring 1b are cut is Figure 7The integrated capacitor 5B shown in FIG. 1 is a capacitor 1B. Since the first wiring 1a is connected to the third external electrode layer 3a, the third external electrode layer 3a has a convex portion 15 protruding outward from a part of the outer edge when viewed from the thickness direction. Alternatively, the third external electrode layer 3a may have a concave portion 15a that is recessed inward from a part of the outer edge when viewed from the thickness direction. In this case, the outer surface of the outer body 12 may have a recessed portion 14 on an extension line of the direction in which the convex portion 15 of the third external electrode layer 3a protrudes or on an extension line in the direction opposite to the direction in which the concave portion 15a of the third external electrode layer 3a is recessed.

[0079] In the second embodiment of the present invention, the same effect as in the first embodiment is obtained. In addition, in the second embodiment, since the first wiring or the second wiring can be reduced, the wiring area becomes smaller. As a result, the degree of freedom in the appearance design of the external electrode layer can be increased, and the size of the integrated capacitor can also be reduced. For example, in Figure 8 and Fig. 9 In the example shown in the figure, since it is not necessary to form the first wiring 1a in the portion 18 where the first wiring is not required and indicated by the dotted line, Figure 1 In contrast, the first wiring 1 a can be cut from the outer surface of the exterior body 12 .

[0080] [Third Embodiment]

[0081] In the third embodiment of the present invention, a dummy electrode layer having the same polarity as the first external electrode layer of the adjacent capacitor element is arranged, and the first external electrode layers are electrically connected to each other by the first internal electrode in the same manner as in the second embodiment.

[0082] Fig.10 FIG. 1 is a plan view schematically showing an example of an integrated capacitor according to a third embodiment of the present invention. Fig.11 is a schematic representation of the process used to manufacture Fig.10 FIG. 1 is a plan view of an example of an assembly of capacitor elements of an integrated capacitor shown in FIG. Fig.12 yes Fig.11 A sectional view taken along the line dd' of an assembly of capacitor elements shown.

[0083] exist Fig.11 and Fig.12 In the example shown, the dummy electrode layer 17 electrically connected to the first internal electrode 8 of the second capacitor element 2b or the third capacitor element 2c is provided on the front and back surfaces of the outer casing 12. The dummy electrode layer 17 may be provided on the outer surface of the outer casing 12, for example, it may be provided on both the front and back surfaces of the outer casing 12, or it may be provided on either side. Similar to the first external electrode layer 3, the dummy electrode layer 17 on the front and back surfaces is electrically connected to the first internal electrode 8 inside through the connection through hole 10.

[0084] The dummy electrode layer 17 of the second capacitor element 2b is adjacent to the first external electrode layer 3 of the first capacitor element 2a adjacent to the second capacitor element 2b. The first external electrode layer 3 of the second capacitor element 2b and the dummy electrode layer 17 are electrically connected via the first internal electrode 8 instead of via the first wiring 1a, and the dummy electrode layer 17 of the second capacitor element 2b and the first external electrode layer 3 of the first capacitor element 2a are electrically connected via the first wiring 1a.

[0085] The dummy electrode layer 17 of the third capacitor element 2c is adjacent to the third external electrode layer 3a of the first capacitor element 2a adjacent to the third capacitor element 2c. The first external electrode layer 3 of the third capacitor element 2c and the dummy electrode layer 17 are electrically connected via the first internal electrode 8 instead of via the first wiring 1a, and the dummy electrode layer 17 of the third capacitor element 2c and the third external electrode layer 3a of the first capacitor element 2a are electrically connected via the first wiring 1a.

[0086] The first external electrode layer 3 and the third external electrode layer 3a of the first capacitor element 2a are electrically connected to each other via the first internal electrode 8 instead of the first wiring 1a. Fig.12 The connection paths 16 shown are electrically connected.

[0087] Thus, in the third embodiment of the present invention, a dummy electrode layer electrically connected to the first internal electrode of at least one capacitor element among the plurality of capacitor elements is disposed on the outer surface of the outer casing, and the dummy electrode layer is adjacent to the first external electrode layer of the capacitor element adjacent to the capacitor element. The plurality of first external electrode layers are electrically connected to each other by electrically connecting the first external electrode layer and the dummy electrode layer of the same capacitor element via the first internal electrode instead of via the first wiring, and electrically connecting the dummy electrode layer of the capacitor element and the first external electrode layer of the adjacent capacitor element via the first wiring.

[0088] In a third embodiment of the present invention, the second external electrode layers may be electrically connected to each other using the second internal electrode of the capacitor element. That is, a dummy electrode layer electrically connected to the second internal electrode of at least one of the plurality of capacitor elements may be provided on the outer surface of the outer casing, the dummy electrode layer being adjacent to the second external electrode layer of the capacitor element adjacent to the capacitor element, and the plurality of second external electrode layers may be electrically connected to each other by electrically connecting the second external electrode layer and the dummy electrode layer of the same capacitor element via the second internal electrode instead of via the second wiring, and electrically connecting the dummy electrode layer of the capacitor element and the second external electrode layer of the adjacent capacitor element via the second wiring.

[0089] exist Fig.11 and Fig.12 In the example shown, by applying a voltage between the voltage application point 6 of the first external electrode layer 3 of the second capacitor element 2b and the voltage application point 7 of the second external electrode layer 4, it is possible to apply a voltage to the electrodes of all the capacitor elements 2 included in the capacitor element assembly 5. In addition, the voltage application point 6 of the first external electrode layer 3 and the voltage application point 7 of the second external electrode layer 4 may be electrodes of the same capacitor element 2 or electrodes of different capacitor elements 2. In addition, the third external electrode layer may be used as the voltage application point 6 of the first external electrode layer 3, and the fourth external electrode layer may be used as the voltage application point 7 of the second external electrode layer 4.

[0090] After the voltage is applied, by cutting off the first wiring 1 a and the second wiring 1 b , it is possible to easily return to a state where each capacitor element 2 is independent.

[0091] The state after the first wiring 1a and the second wiring 1b are cut is Fig.10 The integrated capacitor 5C shown in FIG. 1 is a diagram of an integrated capacitor 5C. Since the first wiring 1a is connected to the dummy electrode layer 17, the dummy electrode layer 17 has a convex portion 15 protruding outward from a portion of the outer edge when viewed from the thickness direction. Alternatively, the dummy electrode layer 17 may have a concave portion recessed inward from a portion of the outer edge when viewed from the thickness direction.

[0092] In the third embodiment of the present invention, the same effect as in the second embodiment is obtained. Compared with the second embodiment, since the first wiring or the second wiring can be further reduced, the wiring area is further reduced. As a result, the degree of freedom in designing the external electrode layer can be further increased, and the size of the integrated capacitor can be further reduced. In addition, since the number of wiring cutting locations 13 based on laser melting or the like can be reduced, the process cost can also be reduced. For example, in Fig.11 and Fig.12In the example shown in FIG. 1 , it can be seen that since the first external electrode layer 3 does not need to be cut at the unnecessary wiring cutting position 23 indicated by the dotted line, the first external electrode layer 3 needs to be cut at five positions, which is similar to the Figure 8 and Fig. 9 The number can be reduced compared to the six in the example shown.

[0093] [Fourth Embodiment]

[0094] In the fourth embodiment of the present invention, a material layer having a low laser absorption rate is arranged at least under the first wiring at the wiring cutting portion by laser melting.

[0095] Fig.13 FIG. 1 is a plan view schematically showing an example of an integrated capacitor according to a fourth embodiment of the present invention. Fig.14 yes Fig.13 An example of an e-e' cross-sectional view of an integrated capacitor is shown. Fig.15 It is cut off Fig.14 A cross-sectional view of the integrated capacitor before the first wiring is shown.

[0096] exist Fig.15 In the example shown, a material layer 19 with a lower laser absorption rate than the first wiring 1a is provided between the first wiring 1a and the outer surface of the outer casing 12. The material layer 19 with a lower laser absorption rate may be provided between the entire first wiring 1a and the outer surface of the outer casing 12, but as long as it is provided at least at the wiring cutting portion 13 (see Fig.14 ) between the first wiring 1a and the outer surface of the outer casing 12. For example, when UV laser or green laser is used, the material layer 19 with low laser absorption rate is composed of aluminum-based material.

[0097] The state after the first wiring 1a and the second wiring 1b are cut is Fig.13 After the first wiring 1a is cut, as shown in FIG. Fig.14 As shown, on the outer surface of the outer casing 12 , a material layer 19 having a lower laser absorption rate than the convex portion 15 is provided on an extension line of the direction in which the convex portion 15 of the first external electrode layer 3 protrudes.

[0098] As described above, in the fourth embodiment of the present invention, before the first wiring is cut, a material layer having a laser absorption rate lower than that of the first wiring is provided between at least a portion of the first wiring and the outer surface of the outer casing. On the other hand, in the integrated capacitor in the state after the first wiring is cut, a material layer having a laser absorption rate lower than that of the convex portion is provided on the outer surface of the outer casing on an extension line in the direction in which the convex portion of the first external electrode layer protrudes. Furthermore, in the integrated capacitor in the state after the first wiring is cut, a material layer having a lower laser absorption rate may also be provided on the outer surface of the outer casing on an extension line in the direction opposite to the direction in which the concave portion of the first external electrode layer is sunken.

[0099] In the fourth embodiment of the present invention, a material layer with a lower laser absorption rate may be arranged at least under the second wiring at the wiring cutting portion based on laser melting. That is, in the state before the second wiring is cut, a material layer with a lower laser absorption rate than the second wiring may be arranged between at least a part of the second wiring and the outer surface of the outer casing. On the other hand, in the integrated capacitor in the state after the second wiring is cut, a material layer with a lower laser absorption rate than the convex portion may be arranged on the outer surface of the outer casing on an extension line in the direction in which the convex portion of the second external electrode layer protrudes. In addition, in the integrated capacitor in the state after the second wiring is cut, a material layer with a lower laser absorption rate may be arranged on the outer surface of the outer casing on an extension line in the direction opposite to the direction in which the concave portion of the second external electrode layer is sunken.

[0100] The melting (sublimation) speed varies depending on the absorption rate of the material irradiated with the laser. For example, when the first wiring 1a and the second wiring 1b are made of a copper-based material and the outer casing 12 is made of a resin, since the laser absorption rate of the first wiring 1a and the second wiring 1b is lower than that of the outer casing 12, if the material layer 19 with a lower laser absorption rate is not configured, the outer casing 12 is easily damaged by a large hole opened by the laser just after the first wiring 1a and the second wiring 1b are melted. Although the damage to the outer casing 12 can be reduced to a certain extent by adjusting the output and irradiation time of the laser, it is difficult to completely eliminate the damage to the outer casing 12 because there is also a difference in the thickness of the first wiring 1a and the second wiring 1b. On the other hand, from the perspective of the purpose and reliability of the product, it is desirable to minimize the damage to the outer casing 12 caused by the laser.

[0101] Therefore, if Fig.15As shown, by configuring a material layer 19 with a low laser absorption rate at least under the first wiring 1a or the second wiring 1b of the wiring cut portion 13 based on laser melting, the laser is reflected by the material layer 19, so that the damage to the outer casing 12 can be reduced. For example, in the case where the material layer 19 with a low laser absorption rate is composed of an aluminum-based material, the laser is reflected by the material layer 19 by about 80%. For example, in the case of UV laser, the laser absorption rate of copper is about 80%, and the laser absorption rate of aluminum is about 20%. Therefore, although there is a case where the material layer 19 with a low laser absorption rate melts, or a part of the outer casing 12 melts due to the deviation tolerance of the laser irradiation position, the damage to the outer casing 12 is greatly reduced.

[0102] [Fifth Embodiment]

[0103] In the fifth embodiment of the present invention, the first internal electrode or the second internal electrode is arranged at least under the first wiring at the wiring cut portion by laser melting.

[0104] Fig.16 It is a plan view schematically showing an example of an integrated capacitor according to a fifth embodiment of the present invention. Fig.17 yes Fig.16 An example of an e-e' cross-sectional view of an integrated capacitor is shown. Fig.18 yes Fig.16 Another example of an ee' cross-sectional view of an integrated capacitor is shown. Fig.19 It is a schematic representation of the manufacturing Fig.17 A cross-sectional view of an example of a method of manufacturing an integrated capacitor is shown. Fig. 20 It is a schematic representation of the manufacturing Fig.18 A cross-sectional view of an example of a method of manufacturing an integrated capacitor is shown.

[0105] For example, the first internal electrode 8 is arranged so as to overlap a portion of the first wiring 1a when viewed from the thickness direction of the first external electrode layer 3. The first internal electrode 8 may be arranged so as to overlap at least the first wiring 1a at the wiring cut-off portion 13 by laser melting. Fig.19 As shown, the first internal electrode 8 may be arranged to overlap a portion of the second wiring 1b when viewed in the thickness direction of the second external electrode layer 4. The first internal electrode 8 may be arranged to overlap at least the second wiring 1b at the wiring cut portion 13 by laser melting.

[0106] Alternatively, the second internal electrode 9 may be arranged so as to overlap a portion of the first wiring 1a when viewed from the thickness direction of the first external electrode layer 3. The second internal electrode 9 may be arranged so as to overlap at least the first wiring 1a at the wiring cut-off portion 13 by laser melting. Fig. 20As shown, the second internal electrode 9 may be arranged to overlap a part of the second wiring 1b when viewed in the thickness direction of the second external electrode layer 4. The second internal electrode 9 may be arranged to overlap at least the second wiring 1b at the wiring cut portion 13 by laser melting.

[0107] The state after the first wiring 1a and the second wiring 1b are cut is Fig.16 After the first wiring 1a is cut, as shown in FIG. Fig.17 As shown, the first internal electrode 8 is arranged to overlap with the depressed portion 14 when viewed from the thickness direction of the first external electrode layer 3, or as shown in FIG. Fig.18 As shown in FIG. 1 , the second internal electrode 9 is arranged so as to overlap the depressed portion 14 when viewed from above in the thickness direction of the first external electrode layer 3. Fig.18 The conductive polymer layer 22 is omitted in the figure. The depressed portion 14 may or may not reach the first internal electrode 8 or the second internal electrode 9.

[0108] As such, in the fifth embodiment of the present invention, in the state before the first wiring is cut, the first internal electrode or the second internal electrode of at least one of the plurality of capacitor elements is configured to overlap with a portion of the first wiring when viewed from above in the thickness direction of the first external electrode layer of the capacitor element. On the other hand, in the integrated capacitor in the state after the first wiring is cut, the outer surface of the outer casing has a depressed portion on an extension line of a direction in which the convex portion of the first external electrode layer protrudes or an extension line in a direction opposite to a direction in which the concave portion of the first external electrode layer is sunken, and the first internal electrode or the second internal electrode of the first capacitor element is configured to overlap with the depressed portion when viewed from above in the thickness direction of the first external electrode layer of the first capacitor element.

[0109] In the fifth embodiment of the present invention, a first internal electrode or a second internal electrode may be arranged at least under the second wiring at the wiring cutting portion based on laser melting. That is, in the state before the second wiring is cut, the first internal electrode or the second internal electrode of at least one of the plurality of capacitor elements may be arranged to overlap with a portion of the second wiring when viewed from above in the thickness direction of the second external electrode layer of the capacitor element. On the other hand, in the integrated capacitor in the state after the second wiring is cut, the outer surface of the outer casing may have a recessed portion on an extension line of a direction in which the protrusion of the protrusion of the second external electrode layer or an extension line in a direction opposite to the direction in which the recess of the second external electrode layer is sunken, and the first internal electrode or the second internal electrode of the first capacitor element may be arranged to overlap with the recessed portion when viewed from above in the thickness direction of the second external electrode layer of the first capacitor element.

[0110] like Fig.19 and Fig. 20 As shown, by configuring the first internal electrode 8 or the second internal electrode 9 at least under the first wiring 1a or the second wiring 1b at the wiring cutting portion 13 by laser melting, the first internal electrode 8 or the second internal electrode 9 can prevent the outer casing 12 from being damaged by the laser even at the longest.

[0111] For example, when the first internal electrode 8 is made of aluminum and the second internal electrode 9 is made of copper, although the laser absorption rate of copper is higher than that of aluminum, it is lower than the laser absorption rate of the resin constituting the outer casing 12, and the difference is large. Therefore, the second internal electrode 9 can prevent the outer casing 12 from being damaged by the laser.

[0112] Furthermore, since the structure of the fifth embodiment of the present invention can be formed simultaneously when manufacturing the integrated capacitor, the manufacturing cost can be reduced compared to the fourth embodiment.

[0113] [Sixth Embodiment]

[0114] In the sixth aspect of the present invention, the outer casing is made of a material having a laser beam transmittance of 90% or more.

[0115] Fig.21 FIG. 1 is a plan view schematically showing an example of an integrated capacitor according to a sixth embodiment of the present invention. Fig. 22 yes Fig.21 An example of an e-e' cross-sectional view of an integrated capacitor is shown. Fig.23 It is cut off Fig. 22 A cross-sectional view of the integrated capacitor before the first wiring is shown.

[0116] exist Fig.23In the example shown, the outer casing 20 is made of a material having a laser transmittance of 90% or more. For example, the outer casing 20 is made of methacrylic resin (MMA) or fiberglass reinforced acrylic resin (FRA) when using UV laser, and is made of glass when using green laser.

[0117] The state after the first wiring 1a and the second wiring 1b are cut is Fig.21 The integrated capacitor shown is 5F.

[0118] like Fig.23 As shown in FIG. 1 , by forming the outer casing 20 with a material having a high laser transmittance such as a glass material, the laser can easily pass through the outer casing 20 after the first wiring 1a or the second wiring 1b is melted. Fig. 22 As shown, the outer casing 20 is unlikely to be damaged, and the first wiring 1a or the second wiring 1b that needs to be melted can be melted.

[0119] [Seventh Embodiment]

[0120] In a seventh embodiment of the present invention, an integrated capacitor assembly is prepared in which an assembly of a plurality of capacitor elements is arranged and accommodated in an exterior body.

[0121] Fig.24 FIG. 1 is a plan view schematically showing an example of an assembly of integrated capacitors.

[0122] exist Fig.24 In the example shown, in the integrated capacitor assembly 21, in a state where a plurality of first external electrode layers 3 are electrically connected to each other and a plurality of second external electrode layers 4 are electrically connected to each other, by applying a voltage between a voltage application point 6 of any one of the first external electrode layers 3 and a voltage application point 7 of any one of the second external electrode layers 4, a voltage can be applied to the electrodes of all the capacitor elements 2 included in the integrated capacitor assembly 21. In addition, the voltage application point 6 of the first external electrode layer 3 and the voltage application point 7 of the second external electrode layer 4 may be electrodes of the same capacitor element 2 or electrodes of different capacitor elements 2. In addition, the third external electrode layer may be used as the voltage application point 6 of the first external electrode layer 3, and the fourth external electrode layer may be used as the voltage application point 7 of the second external electrode layer 4. Furthermore, a dummy electrode layer may be used in the connection between the first external electrode layers 3 or the second external electrode layers 4.

[0123] After applying voltage, the first wiring and the second wiring can be cut by laser melting or the like, so that each capacitor element can be easily returned to an independent state. In addition, by cutting the collection of integrated capacitors, it is possible to monolithically separate the integrated capacitors. Cutting or the like is used in cutting the collection of integrated capacitors. The collection of integrated capacitors can be cut before or after the first wiring and the second wiring are cut.

[0124] In the seventh embodiment of the present invention, since voltage can be applied in a state where a plurality of capacitor elements are arranged as a collection, the voltage application points can be two regardless of the number of capacitor elements included in the integrated capacitor. Therefore, voltage can be applied to all capacitor elements by a simpler fixture and method, thereby further reducing manufacturing costs.

[0125] [Eighth Embodiment]

[0126] In the first to seventh embodiments of the present invention, it is assumed that the first wiring and the second wiring are cut by laser, but the first wiring and the second wiring may be cut mechanically. For example, a micro-diameter drill may be used to cut the first wiring and the second wiring. Even if an expensive device for cutting by laser melting is not used, and a relatively cheap mechanical cutting device is used, the effect described in the first embodiment of the present invention can be obtained.

[0127] The integrated capacitor and the method for manufacturing the integrated capacitor of the present invention are not limited to the above-described embodiments, and various applications and modifications are possible within the scope of the present invention regarding the structure and manufacturing conditions of the integrated capacitor.

[0128] For example, in the case where a plurality of first external electrode layers are provided on the front and back surfaces of the outer casing, the first wiring that electrically connects the first external electrode layers to each other may be provided only on the surface of the outer casing, may be provided only on the back surface, or may be provided on both the surface and the back surface. That is, the first wiring may be provided on the same surface of the outer surface of the outer casing, or may be provided on different surfaces. Similarly, in the case where a plurality of second external electrode layers are provided on the front and back surfaces of the outer casing, the second wiring that electrically connects the second external electrode layers to each other may be provided only on the surface of the outer casing, may be provided only on the back surface, or may be provided on both the surface and the back surface. That is, the second wiring may be provided on the same surface of the outer surface of the outer casing, or may be provided on different surfaces.

[0129] Description of Reference Numerals

[0130] 1a…first wiring; 1b…second wiring; 2…capacitor element; 2a…first capacitor element; 2b…second capacitor element; 2c…third capacitor element; 2d…fourth capacitor element; 2e…fifth capacitor element; 2f…sixth capacitor element; 3…first external electrode layer; 3a…third external electrode layer; 4…second external electrode layer; 5…collection of capacitor elements; 5A, 5B, 5C, 5D, 5E, 5F…integrated capacitor; 6…voltage application point of the first external electrode layer; 7… A voltage application point of the second external electrode layer; 8…the first internal electrode; 9…the second internal electrode; 10…a through hole for connection; 11…a through-hole conductor for connection; 12, 20…an outer casing; 13…a wiring cutting portion; 14…a depressed portion; 15…a convex portion; 15a…a concave portion; 16…a connection path; 17…a virtual electrode layer; 18…a portion where the first wiring is not required; 19…a material layer with a low laser absorption rate; 21…a collection of integrated capacitors; 22…a conductive polymer layer; 23…a portion where no wiring cutting is required.

Claims

1. An integrated capacitor having: a plurality of capacitor elements, each capacitor element having a first internal electrode and a second internal electrode; An outer casing, accommodating the plurality of capacitor elements therein; a plurality of first external electrode layers, provided on the outer surface of the outer casing and electrically connected to the first internal electrodes of each of the plurality of capacitor elements; and A plurality of second external electrode layers are provided on the outer surface of the outer package and are electrically connected to the second internal electrodes of each of the plurality of capacitor elements. The first external electrode layer of at least the first capacitor element among the plurality of capacitor elements has a convex portion protruding outward from a portion of the outer edge or a concave portion recessed inward from a portion of the outer edge when viewed from above in the thickness direction thereof, The integrated capacitor further includes a third external electrode layer, which is provided on the outer surface of the outer package and is electrically connected to the first internal electrode of the first capacitor element.

2. An integrated capacitor having: A plurality of capacitor elements, each capacitor element having a first internal electrode and a second internal electrode, wherein The first internal electrode is an anode electrode; An outer casing, accommodating the plurality of capacitor elements therein; A plurality of first external electrode layers, disposed on the outer surface of the outer casing, and electrically connected to the first internal electrodes of each of the plurality of capacitor elements; as well as A plurality of second external electrode layers are provided on the outer surface of the outer package and are electrically connected to the second internal electrodes of each of the plurality of capacitor elements. The first external electrode layer of at least the first capacitor element among the plurality of capacitor elements has a convex portion protruding outward from a portion of the outer edge or a concave portion recessed inward from a portion of the outer edge when viewed in plan from the thickness direction thereof.

3. The integrated capacitor according to claim 1, wherein: The third external electrode layer of the first capacitor element has a convex portion protruding outward from a part of the outer edge or a concave portion recessed inward from a part of the outer edge when viewed in plan from the thickness direction thereof.

4. The integrated capacitor according to any one of claims 1 to 3, wherein: further comprising a dummy electrode layer, the dummy electrode layer being provided on the outer surface of the outer casing and being electrically connected to the first internal electrode of the second capacitor element adjacent to the first capacitor element, The dummy electrode layer of the second capacitor element is adjacent to the first external electrode layer of the first capacitor element.

5. The integrated capacitor according to any one of claims 1 to 3, wherein: The first external electrode layer of the first capacitor element has the protrusion. A material layer having a lower laser absorption rate than that of the convex portion is provided on the outer surface of the outer casing on an extension line of a direction in which the convex portion of the first external electrode layer protrudes.

6. The integrated capacitor according to any one of claims 1 to 3, wherein: The outer surface of the outer casing has a depressed portion on an extension line of a direction in which the convex portion of the first external electrode layer protrudes or on an extension line in a direction opposite to a direction in which the concave portion of the first external electrode layer is recessed.

7. The integrated capacitor according to claim 6, wherein: The first internal electrode or the second internal electrode of the first capacitor element is arranged to overlap the depressed portion when viewed in plan from a thickness direction of the first external electrode layer of the first capacitor element.

8. The integrated capacitor according to any one of claims 1 to 3, wherein: The outer casing is made of a material having a laser transmittance of 90% or more.

9. The integrated capacitor according to any one of claims 1 to 3, wherein: The outer casing is made of glass.

10. The integrated capacitor according to any one of claims 1 to 3, wherein: The outer casing is made of resin.

11. The integrated capacitor according to any one of claims 1 to 3, wherein: Each of the plurality of capacitor elements is an electrolytic capacitor.

12. A method for manufacturing an integrated capacitor, comprising: A step of preparing an assembly of capacitor elements, the assembly of capacitor elements comprising: a plurality of capacitor elements, each capacitor element having a first internal electrode and a second internal electrode; an outer casing accommodating the plurality of capacitor elements; a plurality of first external electrode layers disposed on an outer surface of the outer casing and electrically connected to the first internal electrodes of each of the plurality of capacitor elements; and a plurality of second external electrode layers disposed on an outer surface of the outer casing and electrically connected to the second internal electrodes of each of the plurality of capacitor elements; A step of electrically connecting the plurality of first external electrode layers to each other via first wiring provided on the outer surface of the outer casing; A step of electrically connecting the plurality of second external electrode layers to each other via a second wiring provided on the outer surface of the outer casing; A step of applying a voltage between any one of the plurality of first external electrode layers and any one of the plurality of second external electrode layers; After the step of applying the voltage, cutting the first wiring to electrically separate the plurality of first external electrode layers from each other; and After the step of applying the voltage, a step of cutting the second wiring to electrically separate the plurality of second external electrode layers from each other is performed.

13. The method for manufacturing an integrated capacitor according to claim 12, wherein: A third external electrode layer is provided on the outer surface of the outer casing and is electrically connected to the first internal electrode of at least one capacitor element among the plurality of capacitor elements. The plurality of first external electrode layers are electrically connected to each other by electrically connecting the first external electrode layer and the third external electrode layer of the same capacitor element via the first internal electrode instead of via the first wiring, and electrically connecting the third external electrode layer of the capacitor element and the first external electrode layer of other capacitor elements via the first wiring.

14. The method for manufacturing an integrated capacitor according to claim 12, wherein: A dummy electrode layer electrically connected to the first internal electrode of at least one capacitor element among the plurality of capacitor elements is provided on the outer surface of the outer casing, The dummy electrode layer is adjacent to the first external electrode layer of the capacitor element adjacent to the capacitor element. The plurality of first external electrode layers are electrically connected to each other by electrically connecting the first external electrode layer and the dummy electrode layer of the same capacitor element via the first internal electrode instead of via the first wiring, and electrically connecting the dummy electrode layer of the capacitor element and the first external electrode layer of the adjacent capacitor element via the first wiring.

15. The method for manufacturing an integrated capacitor according to claim 13, wherein: A dummy electrode layer electrically connected to the first internal electrode of at least one capacitor element among the plurality of capacitor elements is provided on the outer surface of the outer casing, The dummy electrode layer is adjacent to the first external electrode layer of the capacitor element adjacent to the capacitor element. The plurality of first external electrode layers are electrically connected to each other by electrically connecting the first external electrode layer and the dummy electrode layer of the same capacitor element via the first internal electrode instead of via the first wiring, and electrically connecting the dummy electrode layer of the capacitor element and the first external electrode layer of the adjacent capacitor element via the first wiring.

16. The method for manufacturing an integrated capacitor according to any one of claims 12 to 15, wherein: A material layer having a laser absorption rate lower than that of the first wiring is provided between at least a portion of the first wiring and the outer surface of the exterior casing.

17. The method for manufacturing an integrated capacitor according to any one of claims 12 to 15, wherein: The first internal electrode or the second internal electrode of at least one capacitor element among the plurality of capacitor elements is arranged to overlap a portion of the first wiring when viewed in plan from a thickness direction of the first external electrode layer of the capacitor element.

18. The method for manufacturing an integrated capacitor according to any one of claims 12 to 15, wherein: The outer casing is made of a material having a laser transmittance of 90% or more.

19. The method for manufacturing an integrated capacitor according to any one of claims 12 to 15, wherein: The outer casing is made of glass.

20. The method for manufacturing an integrated capacitor according to any one of claims 12 to 15, wherein: The outer casing is made of resin.

21. The method for manufacturing an integrated capacitor according to any one of claims 12 to 15, wherein: Each of the plurality of capacitor elements is an electrolytic capacitor.

22. The method for manufacturing an integrated capacitor according to any one of claims 12 to 15, wherein: preparing an integrated capacitor assembly, wherein the integrated capacitor assembly includes a plurality of capacitor element assemblies and is housed inside the outer casing, In the above-mentioned integrated capacitor assembly, while the above-mentioned multiple first external electrode layers are electrically connected to each other and the above-mentioned multiple second external electrode layers are electrically connected to each other, a voltage is applied between any one of the above-mentioned multiple first external electrode layers and any one of the above-mentioned multiple second external electrode layers.

23. The method for manufacturing an integrated capacitor according to claim 22, wherein: Also available: After the step of applying the voltage, a step of cutting the assembly of the integrated capacitors into individual integrated capacitors is performed.

24. The method for manufacturing an integrated capacitor according to any one of claims 12 to 15, wherein: The first wiring and the second wiring are cut using a laser.

25. The method for manufacturing an integrated capacitor according to any one of claims 12 to 15, wherein: The first wiring and the second wiring are mechanically cut.

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