A high-temperature selective melting device based on laser powder printing

Abstract

This invention relates to a high-temperature selective melting device based on laser powder-lay printing, comprising a forming chamber, a forming cylinder, a powder supply cylinder, a water chiller, an air chiller, a dust removal system, and an electrical control cabinet. The forming cylinder includes a forming cylinder barrel, a forming substrate, a heating module, a heat insulation module, a cooling module, a transmission module, and a mounting base. The heating module is located around the forming cylinder barrel. The heat insulation module is located between the forming cylinder barrel and the cooling module. The transmission module is located inside the cooling module. The mounting base is connected and fixed to the heat insulation module and the cooling module, and supports the heat insulation module and the cooling module. The heat insulation module separates the heating module from the cooling module, the transmission module, and the mounting base, thereby separating the forming substrate from the transmission module. The cooling module is equipped with a spiral single-channel high-flow-rate water-cooling channel. This invention achieves preheating of the forming cylinder barrel and the forming substrate up to 500°C. After printing, the substrate is retracted into the forming cylinder barrel for direct heating, effectively improving the cracking of printed parts.

Description

Technical Field

[0001] This invention belongs to the technical field of selective melting equipment, and in particular relates to a high-temperature selective melting equipment based on laser powder spreading printing. Background Technology

[0002] In the selective laser melting process, the powder needs to be preheated. The required preheating temperature is material-dependent; the closer the temperature is to the metal's melting point, the less spatter will occur during printing, effectively reducing the likelihood of part cracking. Furthermore, after printing, the entire part requires heat treatment to further reduce cracking. Preheating the molding substrate is crucial for reducing thermal stress during the forming process, suppressing crack formation, and minimizing warping deformation of the sample and the molding substrate. Therefore, molding substrate preheating has a significant and widespread application in the laser powder-layout printing industry.

[0003] Current selective melting equipment mostly heats the forming substrate and powder through electric heating plates. However, the printed parts cannot be heat-treated in time. They must be removed after all printing is completed before heat treatment, which poses a risk of cracking.

[0004] However, the current mainstream preheating temperature for molding substrates is between 200℃ and 300℃, with a maximum of only 300℃, which cannot adequately meet the heating requirements of all powders. To obtain workpieces with better mechanical properties and internal structure, further heat treatment is required after the workpiece is printed. However, this significantly increases the time required to obtain the final part and also increases the risk of workpiece cracking and deformation of the workpiece and substrate during cooling and post-heat treatment. In addition, how to achieve continuous, stable, and reliable printing at high temperatures has always been a challenge for the industry. Summary of the Invention

[0005] To address the problems existing in the prior art, this invention provides a high-temperature selective melting device based on laser powder-laying printing. This device can preheat the forming cylinder and forming substrate to a maximum of 500°C during the printing process, enabling layer-by-layer printing. After printing, the device retracts into the forming cylinder for direct heating, thereby obtaining the desired workpiece. Simultaneously, during the printing process, the transmission module is insulated and cooled by heat insulation and cooling modules, ensuring a continuous, stable, and reliable printing process and effectively improving the cracking situation of printed parts.

[0006] The present invention is implemented as follows: a high-temperature selective melting device based on laser powder printing, comprising seven parts: a forming chamber, a forming cylinder, a powder supply cylinder, a water chiller, an air chiller, a dust removal system, and an electrical control cabinet.

[0007] The molding cylinder includes a molding cylinder barrel, a molding substrate, a heating module, a heat insulation module, a cooling module, a transmission module, and a mounting base. The molding substrate is located inside the molding cylinder barrel, and its bottom is connected to the transmission module. The heating module is located around the molding cylinder barrel, and its heating temperature is adjustable to provide a stable heat source for the molding substrate. The heat insulation module is located between the molding cylinder barrel and the cooling module, and the transmission module is located inside the cooling module. The mounting base is connected and fixed to the heat insulation module and the cooling module, and supports them. The heat insulation module separates the heating module from the cooling module, the transmission module, and the mounting base, thereby separating the molding substrate from the transmission module. The cooling module is equipped with a spiral single-channel high-flow-rate water cooling channel.

[0008] In the above technical solution, preferably, the heating module includes a ceramic electric heater and a high-temperature detector. The heating module has an adjustable heating temperature function and can provide a stable heat source for the molding substrate. The ceramic electric heater is arranged around the molding cylinder, and the high-temperature detector is fixed to the ceramic electric heater by a threaded connection and extends into the outer wall of the molding cylinder to detect the temperature of the surface of the molding cylinder.

[0009] In the above technical solution, preferably, the heat insulation module is located below the forming cylinder and is disposed around the cooling module. The heat insulation module includes a heat insulation plate and a central insert. The central insert is embedded inside the heat insulation plate. The top end of the central insert is connected to the bottom end of the forming cylinder, and the bottom end of the central insert is connected to the top surface of the mounting base, so that the heat insulation module is located between the forming cylinder and the mounting base and is connected to the forming cylinder and the mounting base respectively.

[0010] In the above technical solution, preferably, the cooling module includes a cooling cylinder, a cooling cylinder inner core, and a lower cover plate. The cooling cylinder inner core is located inside the cooling cylinder, and a spiral groove is formed on the outer wall of the cooling cylinder inner core, so that a spiral single-channel high-flow water cooling channel is formed between the cooling cylinder inner core and the cooling cylinder. The lower cover plate covers the bottom of the cooling cylinder and the cooling cylinder inner core.

[0011] In the above technical solution, a further preferred embodiment is that the upper part of the spiral single-channel high-flow water cooling channel is provided with an inlet and the lower part is provided with an outlet. The inlet is inserted through the heat insulation plate of the heat insulation module, and the outlet is inserted through the mounting base.

[0012] In the above technical solution, a further preferred embodiment is provided with an upper seal between the top surface of the cooling cylinder and the inner core of the cooling cylinder, a lower seal one between the bottom surface of the cooling cylinder and the lower cover plate, and a lower seal two between the bottom surface of the inner core of the cooling cylinder and the lower cover plate.

[0013] In the above technical solution, more preferably, the top surface of the cooling cylinder is provided with an upper sealing groove, the bottom surface of the cooling cylinder is provided with a lower sealing groove one, and the bottom surface of the inner core of the cooling cylinder is provided with a lower sealing groove two. O-rings are respectively provided in the upper sealing groove, the lower sealing groove one, and the lower sealing groove two.

[0014] In the above technical solution, preferably, the transmission module includes a transmission servo motor, a first adapter plate, a second adapter plate, a connecting rod, a piston base plate, and a base plate mounting plate. The output end of the transmission servo motor is connected to the second adapter plate, the second adapter plate is connected to the first adapter plate, the first adapter plate is connected to the bottom end of the connecting rod, the top end of the connecting rod is connected to the piston base plate, the top surface of the piston base plate is connected to the base plate mounting plate, and the top surface of the base plate mounting plate is connected to the molded base plate.

[0015] In the above technical solution, preferably, the water chiller is connected to the cooling module of the forming cylinder, the laser, the galvanometer water cooling base, and the beam expander.

[0016] In the above technical solution, preferably, the air intake of the molding chamber is connected to the air inlet of the dust removal system, the air outlet of the dust removal system is connected to the air inlet of the air cooler, and the air outlet of the air cooler is connected to the air inlet of the molding chamber.

[0017] The advantages and positive effects of the present invention are:

[0018] 1. This invention can preheat the forming cylinder and forming substrate to a maximum of 500°C during the printing process, enabling layer-by-layer printing and simultaneous printing and heating. After printing, the parts are moved back into the forming cylinder for direct heating, thereby obtaining the desired workpiece. At the same time, during the printing process, the transmission module is insulated and cooled by the heat insulation module and the cooling module, ensuring the continuous stability and reliability of the printing process and effectively improving the cracking of printed parts.

[0019] 2. This invention greatly improves the problems caused by insufficient heat preservation temperature during preheating and cooling by preheating and heat preservation of the forming cylinder; it has the characteristics of high preheating temperature and continuous stable and reliable transmission during printing, and solves the problems of workpiece cracking during cooling after printing and difficulty in continuous stable and reliable transmission at high temperature caused by insufficient preheating temperature in the existing laser powder-spreading printing process. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the high-temperature selective melting equipment based on laser powder laying printing provided in an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the molding cylinder provided in an embodiment of the present invention;

[0022] Figure 3This is an AA cross-sectional view of the molding cylinder provided in an embodiment of the present invention;

[0023] Figure 4 This is a block diagram illustrating the connection principle between the molding chamber, the air cooler, and the dust removal system provided in this embodiment of the invention.

[0024] Figure 5 This is a block diagram of the water chiller principle provided in an embodiment of the present invention.

[0025] In the diagram: 10. Molding chamber; 20. Molding cylinder; 210. Molding cylinder barrel; 220. Molding substrate; 230. Heating module; 231. Ceramic electric heater; 232. High temperature detector; 240. Heat insulation module; 241. Heat insulation plate; 242. Central separator; 250. Cooling module; 251. Cooling cylinder barrel; 252. Cooling cylinder inner core; 253. Lower cover plate; 254. Water inlet; 255. Water outlet; 25 6. Upper sealing groove; 257. Lower sealing groove one; 258. Lower sealing groove two; 259. Spiral single-channel high-flow water-cooled channel; 260. Transmission module; 261. Transmission servo motor; 262. Adapter plate one; 263. Adapter plate two; 264. Connecting rod; 265. Piston base plate; 266. Base plate mounting plate; 270. Mounting seat; 30. Powder supply cylinder; 40. Water chiller; 50. Air chiller; 60. Dust removal system. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments and accompanying drawings. Those skilled in the art should understand that the specific embodiments or implementation methods described below are a series of optimized configurations listed to further explain the specific content of the invention. These configuration methods can be combined or used in conjunction with each other, unless explicitly stated in this invention that some or a specific embodiment or implementation method cannot be associated with or used in conjunction with other embodiments or implementation methods. Furthermore, the specific embodiments or implementation methods described below are only considered as optimized configurations and are not intended to limit the scope of protection of this invention.

[0027] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0028] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0029] Please see Figures 1-5 This embodiment provides a high-temperature selective melting device based on laser powder printing, comprising seven parts: a forming chamber 10, a forming cylinder 20, a powder supply cylinder 30, a water chiller 40, an air chiller 50, a dust removal system 60, and an electrical control cabinet.

[0030] The air intake of the molding chamber 10 is connected to the air inlet of the dust removal system 60, the air outlet of the dust removal system 60 is connected to the air inlet of the air cooler 50, and the air outlet of the air cooler 50 is connected to the air inlet of the molding chamber 10.

[0031] The forming chamber 10 comprises four parts: the forming chamber frame, the scraper module, the top plate optical components, and the airflow components. It primarily performs the printing operation. Since the printing process generates smoke and dust, which needs to be filtered and removed by the dust removal system 60, and because the forming cylinder 20 is heated to a temperature that can reach 500℃, the overall temperature of the forming chamber 10 will rise, affecting the use of internal components and damaging the filter element of the dust removal system 60. Therefore, a temperature sensor is installed on the top plate of the forming chamber 10 to monitor its temperature, and an air cooler 50 is included to participate in the dust removal cycle. The air cooler 50 is started and stopped in real time according to the temperature to cool the forming chamber 10 as a whole, protecting the filter element of the dust removal system 60. This forms a closed-loop system to control the temperature of the forming chamber 10.

[0032] The molding cylinder 20 includes a molding cylinder barrel 210, a molding substrate 220, a heating module 230, a heat insulation module 240, a cooling module 250, a transmission module 260, and a mounting base 270. The molding substrate 220 is located inside the molding cylinder barrel 210, and its bottom is connected to the transmission module 260. The heating module 230 is located around the molding cylinder barrel 210, and its heating temperature is adjustable to provide a stable heat source for the molding substrate 220. The heat insulation module 240 is located within the molding cylinder barrel. Between heating module 210 and cooling module 250, transmission module 260 is located inside cooling module 250. Mounting base 270 is connected and fixed to heat insulation module 240 and cooling module 250, and supports heat insulation module 240 and cooling module 250. Heat insulation module 240 is used to separate heating module 230 from cooling module 250, transmission module 260 and mounting base 270, thereby separating molding substrate 220 from transmission module 260. A spiral single-channel high-flow water cooling channel 259 is provided inside cooling module 250.

[0033] The molding substrate 220 of the molding cylinder 20 is driven by the drive servo motor of the transmission module 260, achieving vertical linear motion. During printing, it lowers layer by layer, allowing the printed portion to enter the molding cylinder 210 for further heating. After printing, the product is ejected and removed. Due to the excessively high temperature of the molding cylinder 210, a cooling module 250 is added at the connection between the molding cylinder 210 and the equipment frame. This cooling module 250 is a spiral single-channel high-flow water-cooled component, improving cooling efficiency.

[0034] The heating module 230 includes a ceramic electric heater 231 and a high-temperature detector 232. The heating module 230 has an adjustable heating temperature function and can provide a stable heat source for the molding substrate 220. The ceramic electric heater 231 is arranged around the molding cylinder 210, and the high-temperature detector 232 is fixed to the ceramic electric heater 231 by a threaded connection and extends into the outer wall of the molding cylinder 210 to detect the surface temperature of the molding cylinder 210.

[0035] The heat insulation module 240 is located below the molding cylinder 210 and is disposed around the cooling module 250. The heat insulation module 240 includes a heat insulation plate 241 and a central insert 242. The central insert 242 is embedded in the inner side of the heat insulation plate 241. In this embodiment, a total of 6 central inserts 242 are embedded in the circumference of the heat insulation plate 241. The top end of the central insert 242 is connected to the bottom end of the molding cylinder 210, and the bottom end of the central insert 242 is connected to the top surface of the mounting base 270, so that the heat insulation module 240 is located between the molding cylinder 210 and the mounting base 270 and is connected to the molding cylinder 210 and the mounting base 270 respectively.

[0036] The cooling module 250 separates the transmission module 260 from the molding substrate 220 and cools it. The cooling module 250 includes a cooling cylinder 251, a cooling cylinder core 252, and a lower cover plate 253. The cooling cylinder core 252 is located inside the cooling cylinder 251. A spiral groove is formed on the outer wall of the cooling cylinder core 252, so that a spiral single-channel high-flow water cooling channel 259 is formed between the cooling cylinder core 252 and the cooling cylinder 251. The lower cover plate 253 covers the bottom of the cooling cylinder 251 and the cooling cylinder core 252.

[0037] The spiral single-channel high-flow water cooling channel 259 has an inlet 254 at the top and an outlet 255 at the bottom. The inlet 254 is inserted through the heat insulation plate 241 of the heat insulation module 240, and the outlet 255 is inserted through the mounting base 270.

[0038] An upper seal is provided between the top surface of the cooling cylinder 251 and the inner core 252 of the cooling cylinder, a lower seal is provided between the bottom surface of the cooling cylinder 251 and the lower cover plate 253, and a lower seal is provided between the bottom surface of the inner core 252 and the lower cover plate 253. Specifically, an upper sealing groove 256 is formed on the top surface of the cooling cylinder 251, a lower sealing groove 257 is formed on the bottom surface of the cooling cylinder 251, and a lower sealing groove 258 is formed on the bottom surface of the inner core 252. O-rings are respectively provided in the upper sealing groove 256, the lower sealing groove 257, and the lower sealing groove 258.

[0039] Since the cooling module 250 is in direct contact with the molded cylinder 210, the cooling module 250 needs to withstand a high temperature of 500℃, which leads to a sealing problem for the cooling module 250. Conventional seals (such as O-rings and oil seals, which are made of rubber and can generally withstand a maximum temperature of 300℃, with laboratory data showing up to 400℃, but not for extended periods) cannot meet this temperature requirement and are prone to failure. This invention uses a high-temperature resistant O-ring (capable of withstanding up to 650℃), and when tightened with the corresponding torque, it ensures both high-temperature resistance and sealing performance, and allows for long-term use (it can be used continuously without disrupting disassembly). This avoids the drawback of traditional rubber seals failing easily after prolonged use, thus achieving a seal for the cooling module 250 at high temperatures.

[0040] The transmission module 260 provides precise motion control for the molding substrate 220. It includes a transmission servo motor 261, a first adapter plate 262, a second adapter plate 263, a connecting rod 264, a piston base plate 265, and a substrate mounting plate 266. The output end of the transmission servo motor 261 is connected to the second adapter plate 263, the second adapter plate 263 is connected to the first adapter plate 262, the first adapter plate 262 is connected to the bottom end of the connecting rod 264, the top end of the connecting rod 264 is connected to the piston base plate 265, the top surface of the piston base plate 265 is connected to the substrate mounting plate 266, and the top surface of the substrate mounting plate 266 is connected to the molding substrate 220.

[0041] The powder supply cylinder 30 is used to supply the powder required for printing. The bottom is driven by a powder supply servo motor to eject the powder layer by layer, and the powder is evenly spread to the forming cylinder 20 by a scraper.

[0042] The water chiller 40 is connected to the cooling module 250 of the forming cylinder 20, the laser, the galvanometer water-cooled base, and the beam expander. The water chiller 40 is a dual-temperature, dual-control water chiller used to cool the optical system and the forming cylinder cooling module 250. One high-flow-rate channel cools the forming cylinder cooling module 250 and the laser, with flow splitting and controllable by a water distribution manifold; the other low-flow-rate channel cools other optical components (such as the galvanometer water-cooled base and the beam expander).

[0043] The electrical control cabinet is the control system for the entire equipment.

[0044] The equipment uses a powder supply cylinder 30 to gradually top the powder layer by layer, and then a unidirectional powder spreading scraper evenly spreads the powder onto the forming cylinder 210. The forming cylinder 210 can be heated to 500°C, and then the optical system performs selective melting. During the printing process, an air cooler 50 is connected in series with a built-in dust removal system 60 to cool the inside of the forming chamber 10 while filtering the dust. A water cooler 40 is used to cool the optical system and the forming cylinder cooling module 250.

[0045] The specific implementation process of heating, transmission, heat insulation and cooling of the forming cylinder 20 during laser powder-laying printing is as follows:

[0046] Before printing, the heating module 230 preheats the molding substrate 220: the molding cylinder 210 is heated by the ceramic electric heater 231, and the heat is conducted to the piston base plate 265 through the molding cylinder 210, which then conducts the heat to the substrate mounting plate 266, and finally to the molding substrate 220. During the heating process, the high temperature detector 232 monitors in real time to ensure that the preheating temperature of the molding substrate 220 is stable and reliable. After the temperature of the molding substrate 220 stabilizes, it starts printing layer by layer in conjunction with the powder spreading mechanism and beam expander. After each layer is printed, the molding substrate 220 moves downward layer by layer under the drive of the transmission module 260. Through layer-by-layer printing, the desired workpiece is finally obtained. After the workpiece is printed, the heating module 230 continues to heat it and keep it warm until it gradually cools down.

[0047] During printing, to prevent energy from the heating module 230 from being transferred to the transmission module 260, the heat insulation module 240 separates the heating module 230 from the cooling module 250 and the transmission module 260. Simultaneously, the cooling module 250 cools the transmission module 260, ensuring its temperature remains constant for stable and reliable output. The heat insulation plate 241 (made of mica, withstanding temperatures up to 700℃ under continuous use) separates the forming cylinder 210 from the mounting base 270. The cooling module 250 gradually cools the first adapter plate 262 and the second adapter plate 263. Inside the cooling module 250, a spiral single-channel high-flow-rate water cooling channel 259 is used, with water entering from the top and exiting from the bottom, ensuring water circulation and effective cooling.

[0048] This invention heats the entire forming cylinder to a maximum temperature of 500℃, while simultaneously preheating the powder layer by layer and heating it while printing. After printing, the powder is returned to the forming cylinder for direct heating. This equipment effectively reduces cracking during printing by preheating the powder layer by layer at high temperatures and heating it while printing, thus improving the quality of the finished product.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-temperature selective melting device based on laser powder-laying printing, comprising seven parts: a forming chamber, a forming cylinder, a powder supply cylinder, a water cooler, an air cooler, a dust removal system, and an electrical control cabinet; characterized in that: The molding cylinder includes a molding cylinder barrel, a molding substrate, a heating module, a heat insulation module, a cooling module, a transmission module, and a mounting base. The molding substrate is located inside the molding cylinder barrel, and its bottom is connected to the transmission module. The heating module is located around the molding cylinder barrel, and its heating temperature is adjustable to provide a stable heat source for the molding substrate. The heat insulation module is located between the molding cylinder barrel and the cooling module, and the transmission module is located inside the cooling module. The mounting base is connected and fixed to the heat insulation module and the cooling module, and supports them. The heat insulation module separates the heating module from the cooling module, the transmission module, and the mounting base, thereby separating the molding substrate from the transmission module. The cooling module is equipped with a spiral single-channel high-flow-rate water-cooling channel. The heat insulation module is located below the forming cylinder and is arranged around the cooling module. The heat insulation module includes a heat insulation plate and a central mediator. The central mediator is embedded in the inner side of the heat insulation plate. The top end of the central mediator is connected to the bottom end of the forming cylinder, and the bottom end of the central mediator is connected to the top surface of the mounting base, so that the heat insulation module is located between the forming cylinder and the mounting base and is connected to the forming cylinder and the mounting base respectively. The cooling module includes a cooling cylinder, a cooling cylinder inner core, and a lower cover plate. The cooling cylinder inner core is located inside the cooling cylinder. A spiral groove is formed on the outer wall of the cooling cylinder inner core, so that a spiral single-channel high-flow water cooling channel is formed between the cooling cylinder inner core and the cooling cylinder. The lower cover plate covers the bottom of the cooling cylinder and the cooling cylinder inner core.

2. The high-temperature selective melting equipment based on laser powder laying printing according to claim 1, characterized in that, The heating module includes a ceramic electric heater and a high-temperature detector. The heating module has an adjustable heating temperature function and can provide a stable heat source for the molding substrate. The ceramic electric heater is arranged around the molding cylinder. The high-temperature detector is fixed to the ceramic electric heater by a threaded connection and extends into the outer wall of the molding cylinder to detect the temperature of the surface of the molding cylinder.

3. The high-temperature selective melting equipment based on laser powder laying printing according to claim 1, characterized in that, The spiral single-channel high-flow water cooling channel has an inlet at the top and an outlet at the bottom. The inlet is inserted through the heat insulation plate of the heat insulation module, and the outlet is inserted through the mounting base.

4. The high-temperature selective melting equipment based on laser powder laying printing according to claim 1, characterized in that, An upper seal is provided between the top surface of the cooling cylinder and the inner core of the cooling cylinder, a lower seal is provided between the bottom surface of the cooling cylinder and the lower cover plate, and a lower seal is provided between the bottom surface of the inner core of the cooling cylinder and the lower cover plate.

5. The high-temperature selective melting equipment based on laser powder laying printing according to claim 4, characterized in that, The top surface of the cooling cylinder is provided with an upper sealing groove, the bottom surface of the cooling cylinder is provided with a lower sealing groove one, and the bottom surface of the inner core of the cooling cylinder is provided with a lower sealing groove two. O-rings are respectively provided in the upper sealing groove, the lower sealing groove one, and the lower sealing groove two.

6. The high-temperature selective melting equipment based on laser powder laying printing according to claim 1, characterized in that, The transmission module includes a transmission servo motor, a first adapter plate, a second adapter plate, a connecting rod, a piston base plate, and a base plate mounting plate. The output end of the transmission servo motor is connected to the second adapter plate, the second adapter plate is connected to the first adapter plate, the first adapter plate is connected to the bottom end of the connecting rod, the top end of the connecting rod is connected to the piston base plate, the top surface of the piston base plate is connected to the base plate mounting plate, and the top surface of the base plate mounting plate is connected to the molded base plate.

7. The high-temperature selective melting equipment based on laser powder laying printing according to claim 1, characterized in that, The water chiller is connected to the cooling module of the forming cylinder, the laser, the water-cooled galvanometer base, and the beam expander.

8. The high-temperature selective melting equipment based on laser powder spreading printing according to claim 1, characterized in that, The air intake of the molding chamber is connected to the air inlet of the dust removal system, the air outlet of the dust removal system is connected to the air inlet of the air cooler, and the air outlet of the air cooler is connected to the air inlet of the molding chamber.

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