A high-low temperature heat exchange device for a wafer supporting table and a radio frequency chip testing system

Abstract

The application relates to the technical field of radio frequency chip testing, in particular to a high-low temperature heat exchange device of a wafer supporting table and a radio frequency chip testing system. The high-low temperature heat exchange device of the wafer supporting table comprises a wafer supporting table, the wafer supporting table comprises a refrigeration cavity, heating pipes are uniformly distributed in the refrigeration cavity, an inlet and outlet for feeding refrigeration working medium into the refrigeration cavity are arranged on the wafer supporting table, inlet and outlet pipe mouths for feeding heating working medium into the heating pipes are arranged on the heating pipes, and the heating pipes are arranged in a meandering mode in the refrigeration cavity. The wafer supporting table can be heated and refrigerated in the range of -70 DEG C to 300 DEG C, the heat exchange demand of the testing temperature in the overlapping temperature interval of the two working media can be quickly met by feeding the double heat-conducting working media, the low-temperature or high-temperature refrigeration and heating demand can be met by separately feeding the working media, and the temperature can be lowered and raised in a wide temperature range.

Description

Technical Field

[0001] This application relates to the field of radio frequency chip testing technology, and more specifically, to a high and low temperature heat exchange device for a wafer stage and a radio frequency chip testing system. Background Technology

[0002] To meet the testing environment requirements of RF chips, the high and low temperature heat exchange device of the test stage needs to provide a test temperature of -70℃ to 300℃. During low temperature testing, the temperature needs to be maintained at around -70℃, and during high temperature testing, the temperature needs to be maintained at around 300℃.

[0003] Existing technologies use a single heat transfer medium for heating and cooling. The operating temperature of a single heat transfer medium is difficult to meet the requirements of the range of -70℃ to 300℃, and it cannot achieve the heating / cooling of a high and low temperature heat exchange device with a large temperature range. Summary of the Invention

[0004] The purpose of this application is to provide a high and low temperature heat exchange device for a wafer stage and an RF chip testing system, which can solve the heating and cooling problems of the wafer stage in the range of -70℃ to 300℃. By using dual heat-conducting working fluids, the low temperature of the high and low temperature heat exchange device for the wafer stage can reach -70℃ and the high temperature can reach 300℃.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a high and low temperature heat exchange device for a plate support platform, comprising: a plate support platform, the plate support platform including a cooling chamber, wherein heating tubes are evenly distributed in the cooling chamber;

[0006] The plate support is provided with an inlet and outlet for introducing refrigerant into the cooling chamber, and the heating tube is provided with an inlet and outlet for introducing heating refrigerant.

[0007] The heating tubes are arranged in a meandering pattern within the cooling chamber.

[0008] In an optional embodiment, the inlet and outlet include a cooling chamber inlet and a cooling chamber outlet, the inlet and outlet pipes include a heating pipe inlet and a heating pipe outlet, the cooling chamber inlet and the cooling chamber outlet are located on the same radial direction of the plate-bearing stage, and the heating pipe inlet and the heating pipe outlet are located on the same radial direction of the plate-bearing stage.

[0009] In an optional embodiment, the heating tube is provided with heat sinks, which are spaced apart on the outer wall of the heating tube.

[0010] In an optional embodiment, the plate-bearing stage is connected to a heating system and a cooling system. A heating medium inlet pipe and a heating medium outlet pipe are connected between the plate-bearing stage and the heating system. A cooling medium inlet pipe and a cooling medium outlet pipe are connected between the cooling system and the plate-bearing stage.

[0011] In an optional embodiment, the heating system includes a heating controller, the heating working fluid inlet pipe and the heating working fluid outlet pipe are respectively connected to a heat pump for heating, and the heating controller is electrically connected to the heat pump.

[0012] In an optional embodiment, a three-way valve for the heating medium is connected between the heating medium inlet pipe and the heating pipe inlet, and a heating medium extraction pipe is connected to the bypass of the three-way valve for the heating medium.

[0013] In an optional embodiment, the refrigeration system includes a refrigeration controller, the refrigerant inlet pipe and the refrigerant outlet pipe are respectively connected to a compressor pump for refrigeration, and the refrigeration controller is electrically connected to the compressor pump.

[0014] In an optional embodiment, a refrigerant three-way valve is connected between the refrigerant inlet pipe and the refrigeration chamber inlet, and a refrigerant extraction pipe is connected to the bypass of the refrigerant three-way valve.

[0015] In an optional embodiment, a control system and a temperature sensor are also included. The temperature sensor is installed on the substrate to sense the temperature of the substrate. The heating system, the cooling system, and the temperature sensor are all electrically connected to the control system.

[0016] Secondly, the present invention provides an RF chip testing system, including the high and low temperature heat exchange device of the wafer stage as described in any of the foregoing embodiments.

[0017] By setting a cooling chamber on the substrate support stage and evenly distributing heating tubes in the cooling chamber, a cooling working medium and a heating working medium can be introduced into the cooling chamber and the heating tubes respectively, realizing the flow of dual heat-conducting working mediums in the substrate support stage.

[0018] By combining the inlet and outlet on the plate support platform for introducing refrigerant into the cooling chamber, and the inlet and outlet on the heating tube for introducing heating medium, the refrigerant and heating medium can be introduced into the cooling chamber and heating tube respectively, realizing the independent flow of the two mediums within the plate support platform.

[0019] By allowing the working fluid to flow independently within the substrate, the substrate can be simultaneously heated by introducing two different working fluids, quickly meeting the heat exchange requirements within the overlapping temperature range of the two working fluids. Alternatively, the working fluids can be introduced separately to meet the cooling and heating requirements at low or high temperatures, achieving cooling and heating over a wide temperature range.

[0020] The arrangement of heating tubes in a uniform and meandering pattern within the cooling chamber effectively increases the heat exchange area and ensures uniform heating.

[0021] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the high and low temperature heat exchange device on the support plate platform in this application;

[0024] Figure 2 This is a schematic diagram showing the connection between the high and low temperature heat exchange device on the support plate stage, the heating system, and the refrigeration system in this application.

[0025] icon:

[0026] 1-Slab receiving stage; 11-Refrigeration chamber; 12-Refrigeration chamber inlet; 13-Refrigeration chamber outlet;

[0027] 2-Heating element; 21-Heating element inlet; 22-Heating element outlet; 23-Heat sink;

[0028] 3-Heating system; 31-Heating medium inlet pipe; 32-Heating medium outlet pipe; 33-Heat pump; 34-Heating medium three-way valve; 35-Heating medium extraction pipe;

[0029] 4-Refrigeration system; 41-Refrigerant inlet pipe; 42-Refrigerant outlet pipe; 43-Compression pump; 44-Refrigerant three-way valve; 45-Refrigerant extraction pipe. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0032] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] See Figures 1-2 The high and low temperature heat exchange device of the wafer stage 1 in this application is mainly used for testing radio frequency chips. Specifically, the temperature of the wafer stage 1 is controlled by introducing two different working fluids, so that the wafer stage 1 is maintained at the test temperature.

[0034] Compared to existing methods that use a single thermally conductive medium to control the temperature of the substrate stage 1, the simultaneous introduction of two thermally conductive mediums can effectively create overlapping temperature ranges for the thermally conductive mediums, thereby enabling the substrate stage 1 to quickly reach the required test temperature.

[0035] Meanwhile, the temperature of the bearing platform 1 can be controlled at extremely cold or hot temperatures by introducing a separate heat transfer medium, so as to achieve heating and cooling of the bearing platform 1 over a wide temperature range, ensuring that the low temperature of the high and low temperature heat exchange device of the bearing platform 1 can reach and be maintained at -70℃, and the high temperature can reach and be maintained at 300℃.

[0036] In this invention, the introduction of two heat transfer media is achieved by changing the structure of the heat exchange system of the heat exchange platform 1. The main structure of the high and low temperature heat exchange device of the heat exchange platform 1 includes the heat exchange platform 1, which has a hollow structure and includes a cooling chamber 11 located inside it. The cooling chamber 11 is mainly used to introduce the refrigerant and cool the heat exchange platform 1 through the refrigerant.

[0037] Heating tubes 2 are evenly distributed in the cooling chamber 11. The heating tubes 2 are mainly used to introduce the heating medium and heat the substrate 1 through the heating medium.

[0038] In this invention, both the refrigerant and the heating medium are heat-conducting oils, preferably heat-conducting silicone oils capable of both heating and cooling. The heating medium has a working range of 50°C to 350°C, and the refrigerant has a working range of -90°C to 250°C. The two mediums are heated and cooled by the heating system 3 and the cooling system 4, respectively, and are introduced into the heating pipe 2 and the cooling chamber 11 by the heat pump 33 and the compressor pump 43, respectively.

[0039] The plate support stage 1 is provided with an inlet and outlet for introducing refrigerant oil into the cooling chamber 11. The inlet and outlet are located on the edge of the plate support stage 1, and the refrigerant oil can be introduced into the cooling chamber 11 through the inlet and outlet.

[0040] The heating tube 2 is provided with an inlet and outlet for introducing heating working oil into the heating tube 2. The tube cavity of the heating tube 2 forms a flow channel for the heating working oil, and the heating working oil can be introduced into the flow channel of the tube cavity of the heating tube 2 through the inlet and outlet.

[0041] The cooling chamber 11, located in the plate-bearing stage 1, combined with the refrigerant oil flowing into the cooling chamber 11, can directly cool the plate-bearing stage 1.

[0042] The heating medium oil introduced into the heating pipe 2 heats the plate support 1 by dissipating heat outward. In order to ensure the heating effect of the heating medium oil on the plate support 1, the heating pipe 2 is arranged in a meandering manner in the cooling chamber 11 and is evenly distributed in the cooling chamber 11, so that the heat in the heating medium oil can be evenly transferred outward, so that the plate support 1 can be evenly heated.

[0043] In one specific embodiment, the inlet and outlet of the refrigerant oil include a refrigeration chamber inlet 12 and a refrigeration chamber outlet 13, and the inlet and outlet of the heating oil include a heating pipe inlet 21 and a heating pipe outlet 22. The refrigerant oil enters the refrigeration chamber 11 through the refrigeration chamber inlet 12, and flows out from the refrigeration chamber outlet 13 after passing through the entire cavity of the refrigeration chamber 11. The heating oil enters the heating pipe 2 through the heating pipe inlet 21, and flows out from the heating pipe outlet 22 after passing through the flow channel in the pipe cavity of the heating pipe 2.

[0044] In order to ensure that the refrigerant oil is effectively filled in the refrigeration chamber 11, the refrigeration chamber inlet 12 and the refrigeration chamber outlet 13 are located on the same radial direction of the plate support 1, so that the refrigerant oil can be discharged from the opposite side after passing through the entire refrigeration chamber 11, effectively ensuring the cooling effect on the plate support 1.

[0045] Meanwhile, from the perspective of increasing the flow path of the heating working oil and improving the heat exchange, the heating tube inlet 21 and the heating tube outlet 22 are set on the same radial direction of the support plate 1. Combined with the uniform distribution and meandering form of the heating tube 2 in the cooling chamber 11, the heating tube 2 can be fully coiled in the cooling chamber 11, ensuring that the heat in the heating working oil is transferred to the outside more completely.

[0046] To further facilitate the outward transfer of heat, heat sinks 23 are provided on the heating tube 2. The heat sinks 23 are evenly distributed on the outer wall of the heating tube 2. In this embodiment, the heating tube 2 is a heat exchange tube with the same diameter, preferably a copper tube with good heat dissipation performance. The heat sinks 23 are preferably copper sheets welded to the outer wall of the heating tube 2, and the heat sinks 23 can contact the support platform 1.

[0047] This configuration provides support for the heat exchange tubes and allows the heat from the heating medium oil to be transferred to the support plate 1 via contact conduction, ensuring the heating effect.

[0048] In another specific embodiment, the heating and cooling of the heating working oil and the cooling working oil are carried out by the heating system 3 and the cooling system 4. The plate support 1 is connected to the heating system 3 and the cooling system 4. Further, the plate support 1 and the heating system 3 are connected by a heating working oil inlet pipe 31 and a heating working oil outlet pipe 32. The heating working oil inlet pipe 31 and the heating working oil outlet pipe 32 are respectively connected to the heating pipe inlet 21 and the heating pipe outlet 22 for the circulation of the heating working oil between the heating system 3 and the plate support 1.

[0049] The plate holder 1 is connected to the refrigeration system 4 by a refrigerant inlet pipe 41 and a refrigerant outlet pipe 42. The refrigerant inlet pipe 41 and the refrigerant outlet pipe 42 are respectively connected to the refrigeration chamber inlet 12 and the refrigeration chamber outlet 13 for the circulation of refrigerant oil between the refrigeration system 4 and the plate holder 1.

[0050] Furthermore, the heating system 3 in this embodiment includes a heating controller, a heating working fluid inlet pipe 31 and a heating working fluid outlet pipe 32 respectively connected to a heat pump 33 for heating the heating working fluid oil, and the heating controller is electrically connected to the heat pump 33.

[0051] The refrigeration system 4 includes a refrigeration controller, a refrigerant inlet pipe 41 and a refrigerant outlet pipe 42, which are respectively connected to a compressor pump 43 used for refrigeration. The refrigeration controller is electrically connected to the compressor pump 43.

[0052] The heat pump 33 is specifically responsible for heating and circulating the working oil. In this embodiment, the working range of the working oil is 50℃~350℃. The heat pump 33 can heat the working oil to the working range.

[0053] The compressor pump 43 is specifically responsible for cooling and circulating the refrigerant oil. In this embodiment, the working range of the refrigerant oil is -90℃ to 250℃. The compressor pump 43 can cool the refrigerant oil to the working range.

[0054] Based on the fact that the two different thermally conductive working fluids have an overlapping temperature range of 50°C to 250°C, the substrate stage 1 can be maintained within the overlapping temperature range by simultaneously introducing heating working fluid oil and cooling working fluid oil, and maintained at a specific temperature point within the overlapping temperature range, so that the substrate stage 1 can test the radio frequency chip at that specific stable point.

[0055] When the test temperature requirement of the substrate stage 1 is below the overlapping temperature range or the extremely cold test temperature requirement, or above the overlapping temperature range or the extremely hot test temperature requirement, the substrate stage 1 can be heated or cooled by introducing a heat-conducting working fluid separately.

[0056] For the above-mentioned working condition where only a heat transfer medium is introduced, it is necessary to extract another heat transfer medium from the heating tube 2 or the cooling chamber 11.

[0057] Preferably, a heating medium three-way valve 34 is connected between the heating medium inlet pipe 31 and the heating pipe inlet 21. The heating medium three-way valve 34 is provided with a main passage that allows the heating medium inlet pipe 31 to be directly connected to the heating pipe inlet 21, and a bypass that allows the heating medium oil to be discharged from the heating pipe 2. Furthermore, the bypass of the heating medium three-way valve 34 is connected to a heating medium extraction pipe 35.

[0058] Based on the same principle and setup, a refrigerant three-way valve 44 is connected between the refrigerant inlet pipe 41 and the refrigeration chamber inlet 12. The refrigerant three-way valve 44 is provided with a main passage that allows the refrigerant inlet pipe 41 to be directly connected to the refrigeration chamber inlet 12, and a bypass that allows the refrigerant oil to be discharged from the refrigeration chamber 11. Furthermore, the bypass of the refrigerant three-way valve 44 is connected to a refrigerant extraction pipe 45.

[0059] Furthermore, the heating working fluid extraction pipe 35 and the refrigerant extraction pipe 45 are respectively connected to the heating working fluid storage tank and the refrigerant storage tank. When it is necessary to extract a specific heat transfer fluid, a vacuum pump connected to the heating working fluid storage tank and the refrigerant storage tank provides negative pressure, and the heating working fluid oil and the refrigerant oil are guided to the corresponding heating working fluid storage tank and the refrigerant storage tank through the heating working fluid extraction pipe 35 and the refrigerant extraction pipe 45.

[0060] The high and low temperature heat exchange device of the plate support 1 in this invention also includes a control system and a temperature sensor. The heating system 3, the cooling system 4 and the temperature sensor are all electrically connected to the control system.

[0061] A temperature sensor is installed on the substrate 1 to sense the temperature of the substrate 1 in real time and transmit the temperature signal to the control system. The control system controls the operation of the heating system 3 and the cooling system 4 according to the received temperature signal.

[0062] Specifically, the control system is electrically connected to the heating controller and the cooling controller respectively, forming an overall control unit for the heat exchange device. It can control the operation of the heat pump 33 and the compressor pump 43 according to the real-time temperature of the plate stage 1 through the heating controller and the cooling controller respectively.

[0063] Furthermore, the heating controller is also electrically connected to the heating medium three-way valve 34 and the vacuum pump, controlling the opening and closing of the main passage and bypass of the heating medium three-way valve 34, and can control the extraction of heating medium oil from the heating tube 2.

[0064] The refrigeration controller is also electrically connected to the refrigerant three-way valve 44 and the vacuum pump, controls the opening and closing of the main passage and bypass of the heating refrigerant three-way valve 34, and can control the extraction of refrigerant oil from the refrigeration chamber 11.

[0065] In the high and low temperature heat exchange device of the plate support 1 in this invention, when the test temperature of the plate support 1 is in the overlapping temperature range of the two heat-conducting working fluids, the heating working fluid oil and the cooling working fluid oil introduced at the same time can assist each other in heating and cooling speed.

[0066] When the cooling controller finishes its cooling task, the heating controller can assist in raising the temperature to return to the target temperature as quickly as possible; when the heating controller finishes its heating task, the cooling controller can assist in lowering the temperature to return to the target temperature as quickly as possible; the cooling controller itself has a heating capacity of 250℃ and can assist in heating.

[0067] When the test temperature of the substrate stage 1 is not within the overlapping temperature range of the two heat-conducting working fluids, the heating working fluid oil or the cooling working fluid oil is extracted. Specifically, when the required heating temperature of the substrate stage 1 is greater than 250°C, the heating working fluid oil heats up, and the cooling controller extracts the cooling working fluid oil from the cooling chamber 11; when the required cooling temperature of the substrate stage 1 is less than 50°C, the cooling working fluid oil cools down, and the heating controller extracts the heating working fluid oil from the heating tube 2.

[0068] It is important to note that the flow channel design of the heating tube 2 and the cooling chamber 11 with dual heat-conducting working fluids allows for switching of the heat-conducting working fluid, enabling the plate support stage 1 to achieve heating and cooling over a wide temperature range.

[0069] Switching between two heat-conducting media within the flow channel can achieve rapid heating or rapid cooling, and can meet lower or higher temperature requirements.

[0070] The present invention also provides an RF chip testing system, including the high and low temperature heat exchange device of the above-mentioned wafer stage 1, which can effectively meet the testing temperature requirements of RF chips, improve testing conditions, and maximize testing efficiency.

[0071] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0072] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A high and low temperature heat exchange device for a plate-supported platform, characterized in that, include: A plate-holding stage, the plate-holding stage including a cooling chamber, wherein heating tubes are evenly distributed in the cooling chamber; The plate support is provided with an inlet and outlet for introducing refrigerant into the cooling chamber, and the heating tube is provided with an inlet and outlet for introducing heating refrigerant. The heating tubes are arranged in a meandering pattern within the cooling cavity; The plate-holding stage is capable of at the same time Introduce heating and cooling working fluids; The plate-bearing platform is connected to a heating system and a cooling system. A heating medium inlet pipe and a heating medium outlet pipe are connected between the plate-bearing platform and the heating system. A cooling medium inlet pipe and a cooling medium outlet pipe are connected between the cooling system and the plate-bearing platform. A heating medium three-way valve is connected between the heating medium inlet pipe and the heating pipe inlet, and a heating medium extraction pipe is connected to the bypass of the heating medium three-way valve. A refrigerant three-way valve is connected between the refrigerant inlet pipe and the refrigeration chamber inlet, and a refrigerant extraction pipe is connected to the bypass of the refrigerant three-way valve. The inlet and outlet include a cooling chamber inlet and a cooling chamber outlet, and the inlet and outlet pipes include a heating pipe inlet and a heating pipe outlet. The cooling chamber inlet and the cooling chamber outlet are located on the same radial direction of the plate support stage, and the heating pipe inlet and the heating pipe outlet are located on the same radial direction of the plate support stage. The heating working fluid extraction pipe and the cooling working fluid extraction pipe are respectively connected to a heating working fluid storage tank and a cooling working fluid storage tank, and the heating working fluid storage tank and the cooling working fluid storage tank are respectively connected to a vacuum pump; The heating system includes a heating controller, and the refrigeration system includes a refrigeration controller; The heating controller is electrically connected to the three-way valve for the heating medium and the vacuum pump. The refrigeration controller is electrically connected to the refrigerant three-way valve and the vacuum pump.

2. The high and low temperature heat exchange device for the plate-supporting platform according to claim 1, characterized in that, The heating tube is provided with heat sinks, which are arranged at intervals on the outer wall of the heating tube.

3. The high and low temperature heat exchange device for the plate-supporting platform according to claim 1, characterized in that, The heating medium inlet pipe and the heating medium outlet pipe are respectively connected to the heat pump used for heating, and the heating controller is electrically connected to the heat pump.

4. The high and low temperature heat exchange device for the plate-supporting platform according to claim 1, characterized in that, The refrigerant inlet pipe and the refrigerant outlet pipe are respectively connected to a compressor pump used for refrigeration, and the refrigeration controller is electrically connected to the compressor pump.

5. The high and low temperature heat exchange device for the plate-supporting platform according to claim 1, characterized in that, It also includes a control system and a temperature sensor. The temperature sensor is installed on the substrate to sense the temperature of the substrate. The heating system, the cooling system, and the temperature sensor are all electrically connected to the control system.

6. A radio frequency chip testing system, characterized in that, The high and low temperature heat exchange device for the plate-bearing platform as described in any one of claims 1-5.

Images