Display panel and display device

Abstract

The application relates to a display panel and a display device, wherein the display panel comprises a substrate, a plurality of first pads arranged on one side of the substrate, the first pad comprises a main body part and an extension part arranged around the main body part, and the maximum thickness dimension of the extension part is smaller than the maximum thickness dimension of the main body part in the thickness direction of the display panel. The display panel provided by the application can avoid the short circuit problem of the welding area when the welding area is subjected to external force.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] In existing display panels, when electrical connections are required between the screen and the circuit board, or between the circuit board and the chip, soldering is typically performed using pads. This involves placing the pads of the two components to be connected opposite each other and soldering them together. When multiple pads are used, a filler material is usually placed between the solder of adjacent pads. When the display panel is heated, the solder joints expand at different rates due to the different materials of the filler material and solder. This can cause stress concentration in the substrate layer or base material layer, leading to layer structure cracking. This cracking can further cause short circuits, severely impacting the reliability of the display panel.

[0003] Therefore, there is an urgent need for a display panel and corresponding display device that can avoid the problem of layer structure cracking and short circuit caused by stress concentration or uneven distribution in the welding area. For example, at high temperatures, the different materials of the film layer structure will cause different degrees of thermal expansion, resulting in layer structure cracking and short circuit. Summary of the Invention

[0004] This application provides a display panel and a display device, wherein the display panel can prevent short circuits between traces caused by stress concentration or uneven stress distribution in the substrate layer of the welding area.

[0005] In a first aspect, according to an embodiment of this application, a display panel is provided, comprising: a substrate; a plurality of first pads disposed on one side of the substrate, each first pad comprising a main body portion and an extension portion disposed around the main body portion, wherein the maximum thickness dimension of the extension portion is smaller than the maximum thickness dimension of the main body portion along the thickness direction of the display panel.

[0006] According to one aspect of the present application, along the thickness direction and in the direction from the first pad to the substrate, the main body includes a first segment and a second segment, and an extension starts from the second segment and protrudes in a direction parallel to the plane of the substrate.

[0007] According to one aspect of the present application, the dimension of the extension gradually decreases in the thickness direction along the direction away from the main body in the plane where the substrate is located.

[0008] According to one aspect of the embodiments of this application, the cross-sectional shape of the second section and the extension as a whole along the thickness direction includes an isosceles trapezoid.

[0009] According to one aspect of the present application, the dimension of the extension in the thickness direction remains unchanged along the direction away from the main body in the plane where the substrate is located.

[0010] According to one aspect of the embodiments of this application, the dimension of the extension in the thickness direction is greater than or equal to 3 μm.

[0011] According to one aspect of the embodiments of this application, the dimension of the extension in the thickness direction tends to increase along the direction away from the main body in the plane where the substrate is located.

[0012] According to one aspect of the embodiments of this application, the difference between the dimension in the thickness direction of the end of the extension that is connected to the main body and the dimension in the thickness direction of the main body is greater than or equal to 10 μm.

[0013] According to one aspect of the present application, along the direction away from the main body in the plane where the substrate is located, the dimension of the extension in the thickness direction first increases and then decreases.

[0014] According to one aspect of the present application, the side surface of the extension away from the substrate includes a first annular surface and a second annular surface that are intersected. The first annular surface is connected between the main body and the second annular surface, and the end of the second annular surface away from the first annular surface extends to the substrate.

[0015] According to one aspect of the present application, the size of the extension portion is greater than or equal to 5 μm along the direction away from the main body portion in the plane where the substrate is located.

[0016] According to one aspect of the embodiments of this application, the size of the main body portion is greater than or equal to 160 μm along a direction parallel to the plane of the substrate.

[0017] According to one aspect of the embodiments of this application, the display panel further includes a solder layer and a chip. The solder layer is disposed on the side of the first pad away from the substrate. The solder layer includes a plurality of solder portions and a plurality of fill portions. One solder portion is correspondingly disposed and electrically connected to one first pad. The fill portions fill the spaces between adjacent solder portions. The chip is stacked on the side of the solder layer away from the substrate and is electrically connected to the solder portions.

[0018] According to one aspect of the present application, the substrate includes a substrate layer and a conductive layer disposed on the side of the substrate layer opposite to the first pad. The substrate layer has a through hole extending in the thickness direction, and the first pad and the conductive layer are electrically connected through the through hole.

[0019] According to one aspect of the embodiments of this application, a plurality of second pads are provided on the side surface of the chip near the solder layer, and each second pad is correspondingly provided with and electrically connected to a solder part.

[0020] According to one aspect of the embodiments of this application, ink layers are provided on both opposite sides of the solder layer along the thickness direction, and each ink layer is provided with an opening. The orthographic projection of the opening on the substrate is located within the outline of the orthographic projection of the first solder pad or the second solder pad on the substrate. The solder part is electrically connected to the first solder pad and the second solder pad respectively through the opening.

[0021] Secondly, according to embodiments of this application, a display device is provided, including the display panel in any embodiment of the first aspect.

[0022] In the display panel provided in this application embodiment, the first pad disposed on one side of the substrate has a main body and an extension portion protruding outwards from the main body. This increases the contact area between the first pad and the substrate, facilitating heat exchange and stress release. Furthermore, the thickness of the extension portion is less than that of the main body, making it more prone to deformation. Based on this, when the display panel is heated, causing expansion or external pressure or bending forces, the first pad and the substrate can deform simultaneously, preventing stress concentration caused by expansion or pressure that could lead to substrate cracking. Attached Figure Description

[0023] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0024] Figure 1 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application;

[0025] Figure 2 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0026] Figure 3 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0027] Figure 4 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0028] Figure 5 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0029] Figure 6 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application;

[0030] Figure 7 This is a schematic diagram of the structure of a display device provided in one embodiment of this application.

[0031] in:

[0032] 100 - Display panel; 200 - Display device;

[0033] 10-Substrate; 20-First pad; 30-Solder layer; 40-Chip; 50-Ink layer; 60-Cover film layer; 70-Conductive adhesive layer; 80-Support layer;

[0034] 11-Substrate layer; 12-Wire layer; 21-Main body; 22-Extension; 23-First section; 24-Second section; 31-Soldering part; 32-Filling part; 41-Second pad; 51-Opening;

[0035] 111 - Connecting hole; 221 - First annular surface; 222 - Second annular surface;

[0036] X - Thickness direction.

[0037] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0038] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0040] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0041] The features and exemplary embodiments of various aspects of this application will now be described in detail. Furthermore, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0042] In existing display panels, the screen and the chip are typically electrically connected via a flexible circuit board. This connection usually involves soldering pads onto the component surface, such as a substrate or base layer. After soldering, two pads are formed opposite each other in the thickness direction, along with solder between them. A filler, typically adhesive, is also placed in the same layer as the solder to provide support and fill the gaps. Each pad can be electrically connected to a corresponding trace via a via. However, in the thickness direction, the orthogonal projection of each pad onto the substrate layer can overlap with multiple different traces.

[0043] Based on this, the applicant discovered that during routine "dual 85" reliability testing of the display panel, the filler adhesive undergoes significant volume expansion at temperatures exceeding its own glass transition temperature. At this point, the filler adhesive may be flanked by a chip and a substrate layer, respectively. The chip, primarily made of high-crystalline silicon, is less affected by stress, while the softer substrate layer experiences greater shear stress, potentially leading to cracking and penetrating cracks along its thickness. Furthermore, in an 85% humidity environment, moisture seeping into these cracks can form ion migration channels, causing short circuits between adjacent traces or between pads and traces that were not originally electrically connected, severely impacting the reliability of the display panel.

[0044] To address the aforementioned issues, this application proposes a display panel comprising a substrate, a first pad, a solder layer, and a chip stacked sequentially. The substrate includes a conductive layer and a substrate layer stacked together. The first pad is disposed on the side of the substrate layer opposite to the conductive layer and electrically connected to the conductive layer through a through-hole in the substrate layer. In this embodiment, the first pad has a main body and an extension surrounding the main body. The thickness of the extension is less than the thickness of the main body. By providing a thinner and more flexible extension relative to the main body, the contact area between the first pad and the substrate layer can be increased, improving heat exchange efficiency. Furthermore, the deformation of the extension can reduce stress concentration, thereby effectively reducing the possibility of substrate cracking and improving the reliability of the display panel.

[0045] It is understood that the following embodiments of this application are only described using touch traces and touch chips as examples to form a welding relationship, but the display panel provided in this application is not limited to this and can also be applied to other welding areas for protection.

[0046] To better understand this application, the following will be combined with... Figures 1 to 7 The display panel and display device provided in the embodiments of this application will be described in detail.

[0047] Please refer to the following: Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application. Figure 2 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application. Figure 3 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application.

[0048] In a first aspect, according to an embodiment of this application, a display panel 100 is provided, including: a substrate 10 and a plurality of first pads 20. The first pads 20 are disposed on one side of the substrate 10. The first pads 20 include a main body portion 21 and an extension portion 22 disposed around the main body portion 21. Along the thickness direction X of the display panel 100, the maximum thickness dimension of the extension portion 22 is smaller than the maximum thickness dimension of the main body portion 21.

[0049] This application provides a display panel 100, including a substrate 10 stacked together and first pads 20. The first pads 20 are disposed on one side surface of the substrate 10, and multiple first pads 20 can be arranged at intervals. Optionally, to save space and facilitate processing, the first pads 20 can be rectangular. Each first pad 20 has a main body 21 and an extension 22 surrounding the main body 21 and protruding from the main body 21 in a direction parallel to the plane of the substrate 10. Along the thickness direction of the display panel 100, i.e., the direction of film layer stacking in the display panel 100, the maximum thickness of the extension 22 is less than the maximum thickness of the main body 21, forming a thickness step between the main body 21 and the extension 22, so that the extension 22 maintains a small extension dimension in the thickness direction X, facilitating deformation.

[0050] It is understood that, in the direction parallel to the plane of the substrate 10, the extension 22 in this embodiment can maintain the same extension size around the main body 21. That is, the orthographic projection of the first pad 20 in the thickness direction X can be obtained by proportionally magnifying the orthographic projection of the main body 21 in the thickness direction X. This allows the first pad 20 to maintain uniform load-bearing strength when subjected to external stress, thereby causing more uniform deformation and avoiding the formation of new stress concentration points in a certain place due to uneven shape after deformation. This further reduces the possibility of substrate 10 cracking and short circuit in the soldering area.

[0051] Furthermore, in the plurality of first pads 20, the extensions 22 in each first pad 20 can all have the same extension dimension in the thickness direction X, so that each extension 22 has the same shape and size, so as to further make the force uniform and facilitate the processing.

[0052] In this embodiment, the first pad 20 has a main body 21 and an extension 22 that is thinner than the main body 21. On the one hand, the extension 22, which protrudes from the main body 21, can effectively increase the area of ​​the surface of the first pad 20 that contacts the substrate 10, thereby improving the heat exchange efficiency between the first pad 20 and the substrate 10. This allows both to thermally expand as simultaneously as possible when the display panel 100 is heated, reducing the degree of stress concentration. On the other hand, the extension 22 is thinner and more prone to deformation compared to the main body 21 used to form the solder joint. Furthermore, the metal material constituting the extension 22 has good ductility. Therefore, when the filling portion 32 expands due to heat, the deformation of the extension 22 can disperse the stress, preventing stress concentration on the substrate 10 and causing cracking of the substrate 10.

[0053] In summary, the arrangement of the first pad 20 in this embodiment can effectively prevent the substrate 10 from cracking, thereby avoiding short circuits caused by heat in the soldering area and improving the reliability of the display panel 100.

[0054] like Figure 2 As shown, in some optional embodiments, along the thickness direction X, the main body 21 includes a first section 23 and a second section 24, and the extension 22 starts from the second section 24 and protrudes in a direction parallel to the plane of the substrate 10.

[0055] In this embodiment, the first pad 20 has a main body 21 and an extension 22 surrounding the main body 21. In the thickness direction X, the first pad 20 can be further divided into a first segment 23 and a second segment 24, with the extension 22 disposed in the second segment 24. The thickness of the extension 22 is such that the difference between the thickness of the extension 22 and the extension dimension of the main body 21 is the same as the thickness of the first segment 23, thus maintaining a thickness that allows for easier deformation of the extension 22. Furthermore, setting the extension 22 at a certain distance from the surface of the first pad 20 near the chip 40 prevents the soldering part 31 from connecting to the extension 22, thus avoiding any impact on the deformation of the extension 22 due to this connection.

[0056] In some alternative embodiments, the extension dimension of the extension 22 in the thickness direction X gradually decreases along the direction away from the main body 21 in the plane of the substrate 10, or in the direction from the main body 21 to the edge of the substrate 10, and the cross-sectional shape of the second segment 24 and the extension 22 as a whole in the thickness direction X includes an isosceles trapezoid. Alternatively, the extension dimension of the extension in the thickness direction X remains unchanged along the direction away from the main body 21 in the plane of the substrate 10, or in the direction from the main body 21 to the edge of the substrate 10, and the extension dimension of the extension 22 in the thickness direction X is greater than or equal to 3 μm.

[0057] In this embodiment, the first pad 20 has a main body 21 and an extension 22. The extension 22 is disposed around the main body 21 and protrudes from the side of the main body 21 in a direction away from the main body 21. It can be understood that the bottom surface of the extension 22 in this embodiment can be coplanar with the bottom surface of the main body 21, or the shape of the bottom surface of the extension 22, i.e., the side surface near the substrate 10, can be changed by changing the shape of the underlying layer structure or by setting other components. Making the bottom surface of the extension 22 coplanar with the bottom surface of the main body 21 facilitates the processing and shaping of the first pad 20 and ensures that the first pad 20 has the largest possible contact area with the substrate layer 11.

[0058] Optionally, along the direction away from the main body 21 in the plane where the substrate 10 is located, the thickness of the extension 22 in this embodiment can be gradually reduced to form a sloping surface that makes the first pad 20 easier to process and shape. At this time, in the orthographic projection of the first pad 20 in a plane parallel to the thickness direction X, the orthographic projection formed by the first segment 23 can be a rectangle, and the orthographic projection formed by the second segment 24 can be an isosceles trapezoid.

[0059] Alternatively, as Figure 3 As shown, along the direction away from the main body 21 in the plane where the substrate 10 is located, the extension 22 in this embodiment can maintain the same thickness, that is, together with the main body 21, it forms a platform-type structure with a first step. At this time, in the orthographic projection formed in the plane parallel to the thickness direction X, the orthographic projection of the first segment 23 and the orthographic projection of the second segment 24 are stacked rectangles with different lengths.

[0060] Please refer to the following: Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application. Figure 5This is a schematic diagram of the structure of a display panel provided in another embodiment of this application. In some optional embodiments, along the direction from the main body 21 to the edge of the substrate 10, the extension dimension of the extension 22 in the thickness direction X tends to increase, and the difference between the extension dimension of the end of the extension 22 connected to the main body 21 in the thickness direction X and the extension dimension of the main body 21 in the thickness direction X is greater than or equal to 10 μm.

[0061] In this embodiment, the first pad 20 has a main body 21 and an extension 22 surrounding the main body 21. Corresponding to the aforementioned ramp structure or platform structure, the thickness of the extension 22 in this embodiment can increase along the direction away from the main body 21 in the plane of the substrate 10. That is, the part of the extension 22 connected to the main body 21 can be the thinnest part of the extension 22. Optionally, as the distance protruding from the main body 21 gradually increases, the thickness of the extension 22 can also gradually increase, forming a ramp structure with a direction opposite to that of the aforementioned embodiment.

[0062] In embodiments where the thickness of the extension 22 tends to increase, the position where the extension 22 connects to the main body 21 forms a weak point in terms of structural strength due to its smaller thickness. This allows for the occurrence of corresponding bending or fracture at the weak point when subjected to stress, thereby releasing the stress caused by thermal expansion in the welding area through active fracture and avoiding cracking of the substrate layer 11 caused by stress concentration.

[0063] Based on this, the difference between the extension dimension of the extension portion 22 on the side connected to the main body portion 21 in the thickness direction X and the extension dimension of the main body portion 21 in the thickness direction X should exceed a preset value, that is, to form a more obvious drop, so as to facilitate deformation or fracture at the structure. Optionally, the drop can be greater than or equal to 10 μm.

[0064] In some alternative embodiments, along the direction away from the main body 21 in the plane of the substrate 10, the extension dimension of the extension 22 in the thickness direction X first increases and then decreases. The side surface of the extension 22 away from the substrate 10 includes a first annular surface 221 and a second annular surface 222 that intersect each other. The first annular surface 221 connects the main body 21 and the second annular surface 222, and the end of the second annular surface 222 away from the first annular surface 221 extends to the substrate 10.

[0065] While keeping the portion where the extension 22 connects to the main body 21 as the thinnest point, the thickness of the extension 22 can be increased and then decreased along the direction away from the main body 21 in the plane of the substrate 10. At this time, the surface of the extension 22 away from the substrate 10 can include at least a first annular surface 221 and a second annular surface 222 that intersect. Both surfaces are arranged around the main body 21, and the inner side of the first annular surface 221 extends to the main body 21, while the outer side connects to the second annular surface 222. The inner side of the second annular surface 222 is in contact with the first annular surface 221, while the outer side extends to the surface of the substrate 10. The first annular surface 221 and the second annular surface 222 intersect and form a certain angle. At this time, the cross-sectional shape of the extension 22 along the thickness direction X is approximately triangular.

[0066] Optionally, the widths of the first annular surface 221 and the second annular surface 222 can be the same or similar, and the included angle between them can be greater than or equal to 90°. Setting the extension 22 to first increase and then decrease can form a structure that is easy to break and easy to release stress.

[0067] In some alternative embodiments, the extension dimension of the extension 22 is greater than or equal to 5 μm in the direction away from the main body 21.

[0068] In order to ensure that the first pad 20 after the extension 22 is provided has a sufficiently large contact area with the substrate 11, the present application embodiment may have certain requirements on the extension dimension of the extension 22 in the direction parallel to the plane of the substrate 10. Specifically, the extension dimension of the extension 22 in this direction may be greater than or equal to 5 μm.

[0069] It is understood that the multiple first pads 20 in the embodiments of this application are spaced apart, and adjacent first pads 20 are insulated from each other. Therefore, a certain spacing is required between the first pads 20. Given the limited overall area of ​​the soldering area of ​​the display panel 100, the size of the first pad 20 itself is also limited. Therefore, the size of the first pad 20 can be designed according to parameters such as the number of pads and the size of the soldering area. This application does not impose specific limitations on this. In some optional embodiments, the extension dimension of the main body 21 along the direction parallel to the plane of the substrate 10 is greater than or equal to 160 μm.

[0070] In this embodiment, the main body 21 of the first pad 20 is used for welding connection. Therefore, in order to ensure that there is a certain contact area between the main body 21 and the welding part 31, the main body 21 itself needs to have a certain surface area to provide the space required for welding. For example, the extension dimension of at least one edge of the main body 21 can be greater than or equal to 160μm. The specific value can be set by the user according to the design and usage requirements of the display panel 100.

[0071] In some optional embodiments, the display panel 100 further includes a solder layer 30 and a chip 40. The solder layer 30 is disposed on the side of the first pad 20 away from the substrate 10. The solder layer 30 includes a plurality of solder portions 31 and a plurality of fill portions 32. One solder portion 31 is correspondingly disposed with and electrically connected to one first pad 20. The fill portions 32 fill the spaces between adjacent solder portions 31. The chip 40 is stacked on the side of the solder layer 30 away from the substrate 10 and is electrically connected to the solder portions 31. The substrate 10 includes a substrate layer 11 and a conductive layer 12 disposed on the side of the substrate layer 11 away from the first pad 20. The substrate layer 11 has a connecting hole 111 extending through the thickness direction X. The first pad 20 and the conductive layer 12 are electrically connected through the connecting hole 111.

[0072] The display panel 100 provided in this application embodiment may include a substrate 10, a first pad 20, a solder layer 30 and a chip 40 stacked sequentially. The substrate 10 includes a substrate layer 11 and a conductive layer 12 stacked together. The substrate layer 11 may be a PI substrate layer made of PI (Polyimide) material, and the conductive layer 12 may be a circuit trace made of a metal material such as copper. Optionally, the conductive layer 12 may be a ground trace.

[0073] The first pad 20 in the display panel 100 is disposed on the surface of the substrate 11 facing away from the conductive layer 12. Multiple first pads 20 can be arranged at intervals, with each first pad 20 corresponding to at least one conductive line in the conductive layer 12, so that the conductive line can be electrically connected to other circuit components via the first pad 20 through subsequent soldering. Thus, the orthographic projection of the first pad 20 along the thickness direction X overlaps with at least one conductive line in the conductive layer 12, enabling electrical connection through the connection holes 111 provided in the substrate 11.

[0074] A solder layer 30 is provided on the side of the first pad 20 facing away from the substrate 10. The solder layer 30 is composed of a solder portion 31 and a filler portion 32 disposed in the same layer. The solder portion 31 is the solder material left after the soldering process and is made of a conductive material, such as solder. In the embodiments of this application, a solder portion 31 is correspondingly disposed with a first pad 20 in the thickness direction X and is electrically connected to it. Optionally, the part of the solder portion 31 that contacts the first pad 20 is located within the outline of the main body portion 21, that is, the solder portion 31 is connected to the main body portion 21 and is spaced apart from the extension portion 22. This can avoid the solder portion 31 from causing adverse effects on the bending and heat exchange of the extension portion 22.

[0075] A filler portion 32 is provided between adjacent welded portions 31. The filler portion 32 can be a filler adhesive. The filler adhesive is provided in the same layer between the solder pads after welding to disperse the stress of the welding point and provide a certain degree of protection for the welded portion 31, thereby improving the drop resistance.

[0076] The display panel 100 in this embodiment of the application also includes a chip 40, which is disposed on the side of the solder layer 30 away from the substrate 10. The chip 40 is electrically connected to the first solder pad 20 through the solder part 31, and then electrically connected to the conductor layer 12 through the connection hole 111, thereby electrically connecting the chip 40 to the circuit elements connected to the conductor layer 12, and driving or controlling the screen through the chip 40.

[0077] Optionally, the chip 40 in this embodiment can be a touch chip, and is electrically connected to the circuit traces in the conductor layer 12 through the soldering part 31 and the first solder pad 20, thereby connecting the traces of the relevant parts in the screen to the chip, and controlling the touch function of the screen through the chip.

[0078] In some optional embodiments, a plurality of second pads 41 are provided on the side surface of the chip 40 near the solder layer 30, and each second pad 41 is correspondingly provided with and electrically connected to one of the solder parts 31.

[0079] Corresponding to the first pad 20, the chip 40 in this embodiment has a plurality of second pads 41 on its surface near the solder layer 30. These second pads 41 can be arranged one-to-one with the first pads 20 in the thickness direction X. Each pair of oppositely arranged first pads 20 and second pads 41 are electrically connected via a soldering part 31. That is, by soldering the first pads 20 and second pads 41 together, the chip 40 can control the corresponding functions of the screen. Optionally, in this embodiment, the second pads 41 and the main body 21 of the first pads 20 can have the same shape and area to facilitate alignment soldering.

[0080] In some optional embodiments, ink layers 50 are provided on both opposite surfaces of the solder layer 30 along the thickness direction X. Each ink layer 50 is provided with an opening 51. The orthographic projection of the opening 51 in the thickness direction X is located within the outline of the first solder pad 20 and the second solder pad 41. The solder part 31 is electrically connected to the first solder pad 20 and the second solder pad 41 through the opening 51.

[0081] In this embodiment, the solder layer 30 is sandwiched between the substrate 10 and the chip 40. The solder portion 31 has a first solder pad 20 and a second solder pad 41 respectively disposed on both sides of the solder portion 31 in the thickness direction X, which are electrically connected to each other to achieve chip 40 control over the circuit connected to the conductor layer 12. To protect the layer structure on both sides of the solder layer 30 and limit the contact range of the solder portion 31, an ink layer 50 can be disposed on both sides of the solder layer 30. The lower ink layer 50 covers at least a portion of the substrate 10 and the first solder pad 20, while the upper ink layer 50 covers at least a portion of the solder layer 30. The uncovered areas form multiple openings 51 for forming electrical connections through these openings 51.

[0082] It is understandable that, along the thickness direction X, the first pad 20, the opening 51, the welding part 31 and the second pad 52 can be arranged in groups to form a complete electrical connection channel, and a complete filling and protection is formed around the channel to make the structure stable and reliable.

[0083] Optionally, when multiple conductors with different layers need to be set, the substrate 10 in this embodiment may include multiple conductor layers 12. In this case, an insulating layer is provided between adjacent conductor layers 12, and the required electrical connection can be made through vias in the insulating layer. Specifically, in an embodiment with multiple conductor layers 12, the first pad 20 is connected to one of the conductor layers 12 through a connection hole 111 provided in the substrate layer 11. Other conductor layers 12 may be provided on the side of the conductor layer 12 electrically connected to the first pad 20 away from the first pad 20, so as to ensure the contact relationship between the first pad 20 and the substrate layer 11 and avoid cracking of the substrate layer 11.

[0084] Please see Figure 6 , Figure 6 This is a schematic diagram of the structure of a display panel provided in another embodiment of this application. Optionally, the substrate 10 may further include a cover film layer 60, a conductive adhesive layer 70 and a support layer 80 stacked sequentially, wherein the cover film layer 60 is disposed adjacent to the conductive layer 12 and can provide corresponding insulation, protection and anti-oxidation functions for the conductive layer 12, and the conductive adhesive layer 70 and the support layer 80 are used to provide corresponding bonding, buffering and support functions.

[0085] Please see Figure 7 , Figure 7This is a schematic diagram of the structure of a display device provided in one embodiment of this application. In a second aspect, according to an embodiment of this application, a display device 200 is further provided, including the display panel 100 in any embodiment of the first aspect. The display device 200 can be any product or component with display function, such as a mobile phone, tablet computer, digital photo frame, or electronic paper. The display device 200 provided in this application embodiment has all the beneficial effects of the display panel 100 provided in the embodiments of this application. For details, please refer to the specific descriptions of the display panel 100 in the above embodiments; these descriptions will not be repeated here.

[0086] It is understood that the above description and details are merely exemplary and explanatory, and do not constitute a limitation on this application. Those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Thus, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A display panel, characterized in that, include: substrate; Multiple first pads are disposed on one side of the substrate. Each first pad includes a main body and an extension disposed around the main body. Along the thickness direction of the display panel, the maximum thickness of the extension is smaller than the maximum thickness of the main body. The display panel further includes a solder layer and a chip. The solder layer is disposed on the side of the first pad away from the substrate. The solder layer includes multiple solder portions and multiple fill portions. The chip has multiple second pads on its surface near the solder layer. Each second pad is correspondingly disposed with and electrically connected to one of the solder portions. Both sides of the solder layer along the thickness direction are provided with ink layers. Each ink layer has an opening. The orthographic projection of the opening on the substrate is located within the outline of the orthographic projection of the main body on the substrate. The solder portions are electrically connected to the first pad and the second pad respectively through the openings. In particular, along the direction away from the main body portion in the plane where the substrate is located, the dimension of the extension portion in the thickness direction tends to increase.

2. The display panel according to claim 1, characterized in that, Along the thickness direction and in the direction from the first pad to the substrate, the main body includes a first section and a second section, and the extension starts from the second section and protrudes in a direction parallel to the plane of the substrate.

3. The display panel according to claim 1, characterized in that, The difference between the dimension of the end of the extension that is connected to the main body in the thickness direction and the dimension of the main body in the thickness direction is greater than or equal to 10 μm.

4. The display panel according to claim 1, characterized in that, Along the direction away from the main body in the plane where the substrate is located, the dimension of the extension in the thickness direction first increases and then decreases.

5. The display panel according to claim 4, characterized in that, The side surface of the extension away from the substrate includes a first annular surface and a second annular surface that intersect each other. The first annular surface is connected between the main body and the second annular surface, and the end of the second annular surface away from the first annular surface extends to the substrate.

6. The display panel according to claim 1, characterized in that, Along the direction away from the main body in the plane of the substrate, the size of the extension is greater than or equal to 5 μm.

7. The display panel according to claim 1, characterized in that, Along a direction parallel to the plane of the substrate, the size of the main body is greater than or equal to 160 μm.

8. The display panel according to claim 1, characterized in that, One of the soldering portions is correspondingly disposed and electrically connected to one of the first solder pads, the filling portion fills the space between adjacent soldering portions, the chip layer is stacked on the side of the solder layer away from the substrate, and is electrically connected to the soldering portion.

9. The display panel according to claim 1, characterized in that, The substrate includes a substrate layer and a conductive layer disposed on the side of the substrate layer opposite to the first pad. The substrate layer has a connecting hole that extends through the thickness direction, and the first pad and the conductive layer are electrically connected through the connecting hole.

10. A display device, characterized in that, The display panel includes any one of claims 1 to 9.

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