A soft and hard combined circuit board and a processing technology thereof

Abstract

The application discloses a soft-hard combined circuit board convenient for heat dissipation and a processing technology thereof, and relates to the technical field of circuit board processing. The soft-hard combined circuit board convenient for heat dissipation comprises a soft-hard combined circuit board, a center hard circuit board and a positioning assembly. The soft-hard combined circuit board comprises the center hard circuit board, a first flexible circuit board, a first hard circuit board, a second flexible circuit board and a second hard circuit board. The soft-hard combined circuit board convenient for heat dissipation and the processing technology thereof increase the heat dissipation surface area of the circuit board through the heat dissipation groove, and the heat of the circuit board is conducted out through the heat conduction needle, so that the heat dissipation effect is enhanced. Meanwhile, the heat dissipation assembly is arranged, the heat dissipation assembly comprises an electric control sliding block and a Maxwell demon pipe, cold air is discharged by the Maxwell demon pipe to help the electronic components to dissipate heat quickly when the electronic components are overheated, so that the electronic components are prevented from being damaged due to overheating. In addition, the positioning assembly is used to assist the soft-hard combined circuit board in edge and corner fixation, so that the fixation effect is enhanced, and the circuit board is not prone to displacement after being fixed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing, in particular to a soft and hard combined circuit board convenient for heat dissipation and a processing technology thereof. BACKGROUND

[0002] The circuit board, also known as a printed wiring board or a printed circuit board, is an important electronic component, is a support body of electronic components, and is a carrier for electrical interconnection of electronic components. With the development of FPC circuit boards and PCB circuit boards, a new product, a soft and hard combined circuit board, is born. The soft and hard combined circuit board is a flexible circuit board and a rigid circuit board combined together through pressing and other processes according to relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. Because the soft and hard combined circuit board combines the excellent characteristics of FPC circuit boards and PCB circuit boards, it is gradually becoming the mainstream of circuit boards and is widely used in various industries. However, the existing circuit boards still have the following disadvantages.

[0003] Firstly, the existing circuit boards generally have poor heat dissipation effect. If they are used continuously for a long time, the circuit boards are prone to heat accumulation. Therefore, after being used for a period of time, they usually need to be paused for heat dissipation to avoid overheat damage to the electronic components carried on the circuit boards, which has obvious use limitations and brings inconvenience to the continuous use of the circuit boards.

[0004] Secondly, the existing circuit boards are generally fixed directly to the board body. However, because the existing circuit boards are formed by combining flexible circuit boards and rigid circuit boards, the traditional fixing method has poor fixing effect. After installation, the position of the circuit board still has the possibility of deviation, which will affect the use effect of the circuit board.

[0005] Therefore, it is urgent to improve this defect. The present application is aimed at researching and improving the existing structure and deficiencies to provide a soft and hard combined circuit board convenient for heat dissipation and a processing technology thereof. SUMMARY

[0006] The present application aims to provide a soft and hard combined circuit board convenient for heat dissipation and a processing technology thereof to solve the problems raised in the background.

[0007] In order to achieve the above object, the present application provides the following technical scheme: a soft and hard combined circuit board and its processing technology, comprising a soft and hard combined circuit board, a center hard circuit board and a positioning assembly, the soft and hard combined circuit board comprises a center hard circuit board, a first flexible circuit board, a first hard circuit board, a second flexible circuit board and a second hard circuit board, the left side of the center hard circuit board is fixedly connected with the first flexible circuit board, the end of the first flexible circuit board is fixedly connected with the first hard circuit board, the right side of the center hard circuit board is fixedly connected with the second flexible circuit board, and the end of the second flexible circuit board is fixedly connected with the second hard circuit board, the center hard circuit board comprises a main board body, a positioning hole and an electronic component, the top of the main board body is provided with a heat dissipation assembly, the bottom of the main board body is provided with a heat dissipation groove, the inner side of the heat dissipation groove is fixedly provided with a heat conduction needle, and the bottom of the main board body is provided with a composite film, and the positioning assembly is installed at the corner of the soft and hard combined circuit board.

[0008] Further, the center hard circuit board is connected with the first hard circuit board through the first flexible circuit board, and the center hard circuit board is connected with the second hard circuit board through the second flexible circuit board, and the center hard circuit board, the first flexible circuit board, the first hard circuit board, the second flexible circuit board and the second hard circuit board form an integrated structure.

[0009] Further, the heat dissipation assembly comprises a limiting slide rail, a temperature sensing element, a temperature sensing pointer and a temperature display screen, the outer wall of the limiting slide rail is fixedly connected with the temperature sensing element, the outer wall of the temperature sensing element is fixedly connected with the temperature sensing pointer, and the outer wall of the limiting slide rail is fixedly provided with the temperature display screen.

[0010] Further, the heat dissipation assembly further comprises an electric control sliding block, a mounting frame and a Maxwell demon pipe, the electric control sliding block is movably installed on the inner side of the limiting slide rail, the top of the electric control sliding block is fixedly connected with the mounting frame, and the inner side of the mounting frame is connected with the Maxwell demon pipe.

[0011] Further, the limiting slide rail and the electric control sliding block form a sliding structure, the electric control sliding block slides along the inner wall of the limiting slide rail, and the size of the limiting slide rail and the size of the electric control sliding block are matched with each other.

[0012] Further, the Maxwell demon pipe is installed on the top of the electric control sliding block through the mounting frame, the inner surface of the mounting frame is fixedly connected with and abuts against the outer surface of the Maxwell demon pipe, and the inner size of the mounting frame and the outer size of the Maxwell demon pipe are completely matched.

[0013] Furthermore, the composite film includes an anti-wear coating, an adhesive layer and an antistatic surface film, and the anti-wear coating is arranged at the bottom of the main body, and the bottom of the anti-wear coating is provided with an adhesive layer, and the bottom of the anti-wear coating is fixedly connected to the antistatic surface film through the adhesive layer.

[0014] Furthermore, the positioning assembly includes a positioning frame, a heat dissipation hole, an upper limit piece and a lower limit piece, and the inner side of the positioning frame is provided with a heat dissipation hole, and the inner surface of the positioning frame is fixedly connected to the upper limit piece, and the inner surface of the positioning frame is fixedly connected to the lower limit piece, and the upper limit piece and the lower limit piece are arranged in a one-to-one correspondence.

[0015] Furthermore, the positioning assembly also includes a positioning plate and a fastening screw, and the outer surface of the positioning frame is fixedly connected to the positioning plate, and the top of the positioning plate is penetrated and connected with the fastening screw.

[0016] Furthermore, the processing technology includes the following specific steps:

[0017] A. Use precision welding equipment to weld the two ends of the first flexible circuit board to the bottom of the central rigid circuit board and the bottom of the first rigid circuit board, and weld the two ends of the second flexible circuit board to the bottom of the central rigid circuit board and the bottom of the second rigid circuit board, so that the central rigid circuit board, the first flexible circuit board, the first rigid circuit board, the second flexible circuit board, and the second rigid circuit board are connected to form a whole, i.e., a rigid-flexible circuit board.

[0018] B. Use a slotting instrument to create evenly spaced heat sinks on the bottom of the rigid-flex PCB, and install heat conducting pins evenly spaced inside the heat sinks. One end of the heat conducting pins is fixedly connected to the main board using a laser welding process.

[0019] C. Encapsulate the electronic components on the upper surface of the rigid-flexible circuit board, then install the heat dissipation assembly next to the electronic components that are prone to overheating and burning, and ensure that the end of the temperature-sensing pointer can detect the temperature of the electronic components;

[0020] D. Install each positioning assembly on the corner of the rigid-flexible circuit board by inserting the corners of the rigid-flexible circuit board between the upper and lower limit members of each positioning assembly in sequence. Then, use fixing parts to install the rigid-flexible circuit board in the position to be installed, and fix the positioning assembly as a whole by tightening screws. After the positioning assembly is fixed, the clamping effect of the upper and lower limit members on the corners of the rigid-flexible circuit board plays an auxiliary fixing role on the rigid-flexible circuit board.

[0021] The application provides a soft and hard combined circuit board convenient for heat dissipation and a processing technology thereof, which has the following beneficial effects: the soft and hard combined circuit board convenient for heat dissipation and the processing technology thereof increase the heat dissipation surface area of the circuit board through the heat dissipation groove, and the heat of the circuit board is conducted out through the heat conduction needle, so that the heat dissipation effect is enhanced; meanwhile, the heat dissipation assembly is arranged, the heat dissipation assembly comprises an electric control sliding block and a Maxwell demon pipe, and the Maxwell demon pipe is used for discharging cold air to help the electronic components to dissipate heat quickly when the electronic components are overheated, so that the electronic components are prevented from being damaged due to overheating; in addition, the positioning assembly is used for assisting the soft and hard combined circuit board to be fixed at the corners, so that the fixing effect is enhanced, the circuit board is not prone to displacement after being fixed, and the use effect of the circuit board is guaranteed.

[0022] 1、The application is provided with a heat dissipation groove, which increases the heat dissipation surface area of the circuit board and conducts the heat of the circuit board out through the heat conduction needle, so that the heat is conveniently dissipated, the improved circuit board has good heat dissipation effect, the heat accumulation of the circuit board itself can be effectively reduced, the circuit board is not prone to overheating even if it is used for a long time, the heat accumulation is reduced from the root, and the long-time use of the circuit board is facilitated.

[0023] 2、The application is provided with a heat dissipation assembly, which detects the temperature of the electronic components in real time through the temperature sensing pointer, when the temperature of the electronic components exceeds the set value, the temperature sensing part controls the electric control sliding block to drive the Maxwell demon pipe to reciprocate through an electric signal, and since the cold air outlet of the Maxwell demon pipe faces the electronic components, with the movement of the Maxwell demon pipe, the electronic components can be quickly cooled, the improved circuit board has an overheating protection function, important electronic components on the circuit board can be effectively prevented from being damaged due to overheating, and thus the service life of the circuit board is prolonged.

[0024] 3、The application is provided with a positioning assembly, which clamps and limits the corners of the soft and hard combined circuit board through the upper limiting part and the lower limiting part, and then realizes the fixation of the whole positioning assembly through the fastening screw, the positioning assembly is used for assisting the positioning of the soft and hard combined circuit board, the fixing effect of the soft and hard combined circuit board is enhanced, the improved circuit board has good fixing effect, the position is not prone to deviation after installation, and thus the use effect is not affected by the displacement. DETAILED DESCRIPTION

[0025] Figure 1 It is a top view structural schematic diagram of the soft and hard combined circuit board convenient for heat dissipation of the application;

[0026] Figure 2 It is a top view structural schematic diagram of the soft and hard combined circuit board convenient for heat dissipation of the application; Figure 1 It is an enlarged schematic diagram of structure A in the circuit board;

[0027] Figure 3 It is a top view structural schematic diagram of the limiting slide rail-electric control sliding block of the soft and hard combined circuit board convenient for heat dissipation of the application;

[0028] Figure 4 Figure 1 is a schematic view of the bottom structure of the main board body of the soft and hard combined circuit board of the present application;

[0029] Figure 5 Figure 2 is a schematic view of the structure of the main board body-heat conducting needle connection of the soft and hard combined circuit board of the present application;

[0030] Figure 6 Figure 3 is a schematic view of the composite film of the soft and hard combined circuit board of the present application;

[0031] Figure 7 Figure 4 is a schematic view of the positioning frame-positioning plate of the soft and hard combined circuit board of the present application.

[0032] In the figure: 1, soft and hard combined circuit board; 101, central hard circuit board; 1011, main board body; 1012, positioning hole; 1013, electronic component; 102, first flexible circuit board; 103, first hard circuit board; 104, second flexible circuit board; 105, second hard circuit board; 2, heat dissipation assembly; 201, limiting slide rail; 202, temperature sensing element; 203, temperature sensing pointer; 204, temperature display screen; 205, electric control slide block; 206, mounting frame; 207, Maxwell demon pipe; 3, heat dissipation groove; 4, heat conducting needle; 5, composite film; 501, wear-resistant plating layer; 502, adhesive layer; 503, antistatic film; 6, positioning assembly; 601, positioning frame; 602, heat dissipation hole; 603, upper limiting element; 604, lower limiting element; 605, positioning plate; 606, fastening screw. DETAILED DESCRIPTION

[0033] The embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application, but cannot be used to limit the scope of the present application.

[0034] As Figure 1 , Figure 4 , Figure 5 and Figure 6As shown, a kind of soft and hard combination and convenient heat dissipation circuit board and its processing technology, including soft and hard combination circuit board 1, center hard line board 101 and positioning assembly 6, soft and hard combination circuit board 1 includes center hard line board 101, first flexible line board 102, first hard line board 103, second flexible line board 104 and second hard line board 105, and the left side of center hard line board 101 is fixedly connected with first flexible line board 102, and the end of first flexible line board 102 is fixedly connected with first hard line board 103, and the right side of center hard line board 101 is fixedly connected with second flexible line board 104, and the end of second flexible line board 104 is fixedly connected with second hard line board 105, center hard line board 101 is connected with first hard line board 103 by first flexible line board 102, and center hard line board 101 is connected with second hard line board 105 by second flexible line board 104, and center hard line board 101, first flexible line board 102, first hard line board 103, second flexible line board 104 and second hard line board 105 constitute integrated structure, integrated design makes the connection between structure more closely, and each structure connection position is not prone to appear to separate, break, and the bottom of mainboard body 1011 is provided with heat dissipation groove 3, and the inner side of heat dissipation groove 3 is fixedly installed with heat-conducting needle 4, and the bottom of mainboard body 1011 is provided with composite film 5, composite film 5 includes wear-resistant plating layer 501, adhesive layer 502 and antistatic film 503, wear-resistant plating layer 501 is arranged at the bottom of mainboard body 1011, and the bottom of wear-resistant plating layer 501 is provided with adhesive layer 502, and the bottom of wear-resistant plating layer 501 is fixedly connected with antistatic film 503 by adhesive layer 502, by the setting antistatic film 503, the antistatic performance of the bottom of soft and hard combination circuit board 1 can be enhanced, to avoid the influence of static to soft and hard combination circuit board 1.

[0035] As Figure 1 And Figure 3As shown, the center rigid circuit board 101 includes a main board body 1011, a positioning hole 1012 and electronic components 1013, and the top of the main board body 1011 is provided with a heat dissipation assembly 2. The heat dissipation assembly 2 includes a limiting slide rail 201, a temperature sensing element 202, a temperature sensing pointer 203 and a temperature display screen 204. The outer wall of the limiting slide rail 201 is fixedly connected with the temperature sensing element 202, and the outer wall of the temperature sensing element 202 is fixedly connected with the temperature sensing pointer 203. The outer wall of the limiting slide rail 201 is fixedly connected with the temperature display screen 204. The temperature sensing pointer 203 can detect the temperature of the electronic components 1013 in real time, and the temperature display screen 204 can display the detected temperature. The heat dissipation assembly 2 further includes an electric control sliding block 205, a mounting frame 206 and a Maxwell demon pipe 207. The electric control sliding block 205 is movably mounted on the inner side of the limiting slide rail 201. The top of the electric control sliding block 205 is fixedly connected with the mounting frame 206, and the inner side of the mounting frame 206 is connected with the Maxwell demon pipe 207. The Maxwell demon pipe 207 can separate cold air and blow it to the electronic components 1013, so as to achieve good heat dissipation effect. The limiting slide rail 201 and the electric control sliding block 205 form a sliding structure. The electric control sliding block 205 slides along the inner wall of the limiting slide rail 201. The size of the limiting slide rail 201 and the size of the electric control sliding block 205 are matched with each other. The limiting slide rail 201 and the electric control sliding block 205 can drive the Maxwell demon pipe 207 to move back and forth, so as to achieve uniform heat dissipation and improve heat dissipation effect. The Maxwell demon pipe 207 is mounted on the top of the electric control sliding block 205 through the mounting frame 206. The inner surface of the mounting frame 206 is fixedly connected with and adheres to the outer surface of the Maxwell demon pipe 207. The inner size of the mounting frame 206 is completely consistent with the outer size of the Maxwell demon pipe 207. The mounting frame 206 can fix the Maxwell demon pipe 207 on the top of the electric control sliding block 205 and move together with the electric control sliding block 205.

[0036] As Figure 1 , Figure 2 and Figure 7As shown, the positioning assembly 6 is mounted at the corner of the PCB 1, and the inner surface of the positioning assembly 6 is in contact with the edge of the PCB 1. The positioning assembly 6 comprises a positioning frame 601, heat dissipation holes 602, an upper limiting piece 603 and a lower limiting piece 604. The inner side of the positioning frame 601 is provided with the heat dissipation holes 602. The inner surface of the positioning frame 601 is fixedly connected with the upper limiting piece 603 and the lower limiting piece 604. The upper limiting piece 603 and the lower limiting piece 604 are correspondingly arranged. The upper limiting piece 603 and the lower limiting piece 604 can clamp and connect the corner of the PCB 1. The positioning assembly 6 further comprises a positioning plate 605 and a fastening screw 606. The outer surface of the positioning frame 601 is fixedly connected with the positioning plate 605. The top of the positioning plate 605 is connected with the fastening screw 606. The fastening screw 606 can connect the positioning assembly 6 with other components, so as to fix the corner of the PCB 1.

[0037] The processing technology of the circuit board comprises the following specific steps:

[0038] A. The two ends of the first flexible circuit board 102 are respectively welded with the bottom of the center rigid circuit board 101 and the bottom of the first rigid circuit board 103 by using a precision welding device. The two ends of the second flexible circuit board 104 are respectively welded with the bottom of the center rigid circuit board 101 and the bottom of the second rigid circuit board 105, so that the center rigid circuit board 101, the first flexible circuit board 102, the first rigid circuit board 103, the second flexible circuit board 104 and the second rigid circuit board 105 are connected to form an integral whole, i.e. the PCB 1.

[0039] B. The heat dissipation grooves 3 are equidistantly formed in the bottom of the PCB 1 by using a slotting instrument. The heat conduction needles 4 are equidistantly mounted in the heat dissipation grooves 3. One end of the heat conduction needle 4 is fixedly connected with the main plate body 1011 by using a laser welding process.

[0040] C. The electronic components 1013 are packaged on the upper surface of the PCB 1. The heat dissipation assembly 2 is mounted beside the electronic component 1013 which is easy to overheat and burn out. The end of the temperature sensing pointer 203 can detect the temperature of the electronic component 1013.

[0041] D, by inserting the corners of the soft and hard combined circuit board 1 into the upper and lower limit components 603 and 604 of each positioning assembly 6 in turn, the positioning assembly 6 is installed on the corners of the soft and hard combined circuit board 1, then the soft and hard combined circuit board 1 is installed at the installation position by using the fixing part, and the positioning assembly 6 is fixed and installed as a whole by the fastening screw 606, after the positioning assembly 6 is fixed, the clamping effect of the upper and lower limit components 603 and 604 on the corners of the soft and hard combined circuit board 1 plays an auxiliary fixing role on the soft and hard combined circuit board 1.

[0042] In summary, in combination with Figures 1-7 As shown in the figure, the working principle of the soft and hard combined circuit board and its processing technology is as follows: first, the soft and hard combined circuit board 1 is installed in the specified area by using the fixing part, and then the positioning plate 605 is also fixed in the specified area by the fastening screw 606, so as to realize the fixed installation of the positioning assembly 6, and because the upper and lower limit components 603 and 604 play a clamping and limiting role on the corners of the soft and hard combined circuit board 1, the positioning assembly 6 plays an auxiliary positioning effect on the soft and hard combined circuit board 1, when in use, the soft and hard combined circuit board 1 generates heat, the heat dissipation groove 3 at the bottom of the soft and hard combined circuit board 1 increases the heat dissipation surface area of the circuit board, and the heat conduction needle 4 arranged in the heat dissipation groove 3 can guide the heat of the soft and hard combined circuit board 1 out, so as to accelerate heat dissipation, at the same time, the temperature sensing pointer 203 can detect the temperature of the electronic component 1013 in real time, when the temperature sensing pointer 203 detects that the temperature of the electronic component 1013 exceeds the set value, the temperature sensing part 202 will control the electric control sliding block 205 and the Maxwell demon pipe 207 to start through the electric signal, the electric control sliding block 205 drives the Maxwell demon pipe 207 to reciprocate along the track of the limiting sliding rail 201, and the Maxwell demon pipe 207 separates the cold air and blows the cold air to the electronic component 1013 uniformly along with the movement of the electric control sliding block 205, until the temperature of the electronic component 1013 decreases to the normal use temperature range.

[0043] Embodiments of the application are presented by way of example and description, and are not exhaustive or limiting of the application. Many modifications and variations will occur to those of ordinary skill in the art. The embodiments are chosen and described in order to best explain the principles of the application and its practical application, and to enable others skilled in the art to understand the application for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. A circuit board with a combination of soft and hard components and convenient heat dissipation, comprising a circuit board with a combination of soft and hard components (1), a central rigid circuit board (101) and a positioning component (6), characterized in that: The rigid-flexible circuit board (1) comprises a central rigid circuit board (101), a first flexible circuit board (102), a first rigid circuit board (103), a second flexible circuit board (104) and a second rigid circuit board (105), wherein the left side of the central rigid circuit board (101) is fixedly connected to the first flexible circuit board (102), and the end of the first flexible circuit board (102) is fixedly connected to the first rigid circuit board (103), and the right side of the central rigid circuit board (101) is fixedly connected to the second flexible circuit board (104), and the end of the second flexible circuit board (104) is fixedly connected to the second rigid circuit board (105). The central rigid circuit board (101) includes a main board body (1011), positioning holes (1012) and electronic components (1013), and a heat dissipation component (2) is installed on the top of the main board body (1011), and a heat dissipation groove (3) is opened at the bottom of the main board body (1011), and a heat conduction pin (4) is fixedly installed on the inner side of the heat dissipation groove (3), and a composite film (5) is provided at the bottom of the main board body (1011), and the positioning component (6) is installed at the corner of the soft and hard combined circuit board (1), and the inner surface of the positioning component (6) is in contact with the edge of the soft and hard combined circuit board (1), and the heat dissipation component (2) includes a limited position slide rail (201) , a temperature sensing element (202), a temperature sensing pointer (203) and a temperature display screen (204), and the outer wall of the limiting slide rail (201) is fixedly connected with the temperature sensing element (202), and the outer wall of the temperature sensing element (202) is fixedly connected with the temperature sensing pointer (203), and the outer wall of the limiting slide rail (201) is fixedly connected with the temperature display screen (204), the heat dissipation component (2) also includes an electric control slider (205), a mounting frame (206) and a Maxwell demon tube (207), and the electric control slider (205) is movably mounted on the inner side of the limiting slide rail (201), and the top of the electric control slider (205) is fixedly connected with the mounting frame (206), and the mounting frame (206) is fixedly mounted on the outer wall of the limiting slide rail (201). A Maxwell demon tube (207) is connected to the inner side, the limiting slide rail (201) and the electric control slider (205) form a sliding structure, and the electric control slider (205) slides along the inner wall of the limiting slide rail (201), and the shape and size of the limiting slide rail (201) match the shape and size of the electric control slider (205), and the Maxwell demon tube (207) is installed on the top of the electric control slider (205) through the mounting frame (206), and the inner surface of the mounting frame (206) is fixedly connected and fitted with the outer surface of the Maxwell demon tube (207), and the inner size of the mounting frame (206) is completely consistent with the outer size of the Maxwell demon tube (207).

2. A circuit board with a combination of rigidity and flexibility and convenient heat dissipation according to claim 1, characterized in that: The central rigid circuit board (101) is connected to the first rigid circuit board (103) via the first flexible circuit board (102), and the central rigid circuit board (101) is connected to the second rigid circuit board (105) via the second flexible circuit board (104), and the central rigid circuit board (101), the first flexible circuit board (102), the first rigid circuit board (103), the second flexible circuit board (104), and the second rigid circuit board (105) form an integrated structure.

3. A circuit board with a combination of rigidity and flexibility and convenient heat dissipation according to claim 2, characterized in that: The composite film (5) comprises an anti-wear coating (501), an adhesive layer (502) and an antistatic surface film (503), wherein the anti-wear coating (501) is arranged at the bottom of the main body (1011), and the adhesive layer (502) is arranged at the bottom of the anti-wear coating (501), and the anti-static surface film (503) is fixedly connected to the bottom of the anti-wear coating (501) via the adhesive layer (502).

4. The circuit board with a combination of rigidity and flexibility and convenient heat dissipation according to claim 3, characterized in that: The positioning assembly (6) comprises a positioning frame (601), a heat dissipation hole (602), an upper limit piece (603) and a lower limit piece (604), wherein the heat dissipation hole (602) is provided on the inner side of the positioning frame (601), the upper limit piece (603) is fixedly connected to the inner surface of the positioning frame (601), and the lower limit piece (604) is fixedly connected to the inner surface of the positioning frame (601), and the upper limit piece (603) and the lower limit piece (604) are arranged in a one-to-one correspondence.

5. The circuit board with a combination of rigidity and flexibility and convenient heat dissipation according to claim 4, characterized in that: The positioning assembly (6) further comprises a positioning plate (605) and a fastening screw (606), and the outer surface of the positioning frame (601) is fixedly connected with the positioning plate (605), and the top of the positioning plate (605) is penetrated and connected with the fastening screw (606).

6. The process for manufacturing a circuit board that combines softness and hardness and facilitates heat dissipation according to claim 5, characterized in that: The processing technology includes the following specific steps: A. Using precision welding equipment, the two ends of the first flexible circuit board (102) are welded to the bottom of the central rigid circuit board (101) and the bottom of the first rigid circuit board (103), and the two ends of the second flexible circuit board (104) are welded to the bottom of the central rigid circuit board (101) and the bottom of the second rigid circuit board (105), so that the central rigid circuit board (101), the first flexible circuit board (102), the first rigid circuit board (103), the second flexible circuit board (104) and the second rigid circuit board (105) are connected to form a whole, i.e., a rigid-flexible circuit board (1); B. Using a slotting instrument, heat dissipation slots (3) are opened at equal intervals on the bottom of the rigid-flexible circuit board (1), and heat conduction pins (4) are installed at equal intervals inside the heat dissipation slots (3). One end of the heat conduction pin (4) is fixedly connected to the main board body (1011) using a laser welding process; C. Encapsulating each electronic component (1013) on the upper surface of the rigid-flexible circuit board (1), and then installing the heat dissipation assembly (2) next to the electronic component (1013) that is prone to overheating and burning, and ensuring that the end of the temperature-sensing pointer (203) can detect the temperature of the electronic component (1013); D. By sequentially inserting the corners of the rigid-flexible circuit board (1) between the upper limit member (603) and the lower limit member (604) of each positioning member (6), each positioning member (6) is installed on the corners of the rigid-flexible circuit board (1). Then, the rigid-flexible circuit board (1) is installed at the position to be installed using the fixing parts, and the positioning member (6) is fixedly installed as a whole by tightening the screws (606). After the positioning member (6) is fixed, the clamping effect of the upper limit member (603) and the lower limit member (604) on the corners of the rigid-flexible circuit board (1) plays an auxiliary role in fixing the rigid-flexible circuit board (1).

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