A hand-automatic dry adsorption type tail gas processor

By designing a manual/automatic integrated dry adsorption exhaust gas processor, adopting a one-for-one backup packing tank structure and an intelligent switching system, combined with particle circulation and impurity removal mechanisms, the safety and efficiency issues of exhaust gas treatment devices in semiconductor production have been solved, achieving efficient and safe exhaust gas treatment.

CN115970440BActive Publication Date: 2026-02-06ANHUI JANUARY TECH CO LTD
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Patent Information

Application Number
CN202211692566.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-12-28
Publication Date
2026-02-06
Estimated Expiration
2042-12-28

AI Technical Summary

Technical Problem

Existing exhaust gas treatment devices in semiconductor manufacturing have low safety and poor adsorption efficiency, making it difficult to meet the standards for efficient and safe emission of harmful gases.

Method used

Design a manual/automatic integrated dry adsorption exhaust gas processor, which uses two symmetrically arranged packing tanks, one for backup and one for use. Automatic or manual switching is achieved through pressure and temperature sensors. Combined with a particle circulation mechanism and a purification mechanism, it uses adsorbent to treat exhaust gas, and enhances safety through a gas detection module and warning lights.

Benefits of technology

It achieves efficient and safe exhaust gas treatment, meets the emission standards for harmful gases in semiconductor production, improves adsorption efficiency and safety, simplifies the maintenance process, and adapts to the adsorption needs of different gases.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The application provides a hand-automatic dry adsorption type tail gas treater applied to the field of tail gas treatment, wherein two filler tanks are arranged, one is used and one is reserved, waste gas of semiconductor production enters a single filler tank through a branch pipe of a gas inlet pipeline under the control of a gas inlet valve, and reaction is carried out on adsorption filler in the filler tank; the waste gas is treated through adsorption of an adsorbent; maintenance personnel can observe the adsorption state of the adsorption filler in the filler tank through a box body observation window and a tank body observation window in sequence; opening and closing of the gas inlet valve of the branch pipe of the gas inlet pipeline is carried out by a manual input control unit; adsorption is carried out on another filler tank; meanwhile, the application can also automatically switch the filler tanks through air pressure data and temperature data collected by a pressure sensor and a temperature sensor, manual and automatic operations can be realized, adsorption safety is high, harmful gas emission standards of semiconductor production can be met, the application has market prospects, and is suitable for popularization and application.
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Description

TECHNICAL FIELD

[0001] The application relates to the field of tail gas treatment, in particular to a hand-automatic dry adsorption type tail gas treater. BACKGROUND

[0002] The organic waste gas in the semiconductor industry mainly comes from cleaning, uniform gel, gel removal, etching and developing processes, wherein solvents such as cleaning agents, developing agents, photoresists and etching liquids contain a large amount of organic components, mainly including isopropyl alcohol and photoresists, and most of the organic solvents become waste gas emissions through volatilization in the process.

[0003] Volatile organic gas is abbreviated as VOCs. Since VOCs have the effects of penetration, liposolubility and volatilization, they have a great direct impact on the human body. When the human body contacts VOCs or inhales VOCs, the respiratory tract, lungs, kidneys, nervous system and the like of the human body can be harmed. Therefore, VOCs must be treated before being directly discharged into the atmosphere. At the same time, VOCs pollutants are usually organic compounds. When the concentration of VOCs is high and there is a spark or static electricity, flash explosion is likely to occur. Since these waste gases are flammable, explosive, toxic, harmful and insoluble in water, they are difficult to treat.

[0004] In the prior art, the gas that can be treated by the adsorbent in the semiconductor process can be treated by the adsorbent. The existing adsorption treatment device on the market has the defects of low safety and poor adsorption efficiency. The present applicant conceives a tail gas treater to realize the adsorption operation of harmful gas generated in the semiconductor production process. The filler tank can be switched manually and automatically to realize the efficient and safe conversion of one standby and one use. SUMMARY

[0005] The application aims to design a tail gas treater to realize the adsorption operation of harmful gas generated in the semiconductor production process. The filler tank can be switched manually and automatically to realize the efficient and safe conversion of one standby and one use. Compared with the prior art, a hand-automatic dry adsorption type tail gas treater is provided. The tail gas treater comprises a box body and two filler tanks symmetrically arranged in the box body. The bottom of the filler tank is provided with a base. The base is in communication with the filler tank and clamped with a filter screen plate. The filler tank is filled with adsorption filler. The base is filled with an adsorbent pad. The top of the two groups of filler tanks is connected with an air outlet pipeline through a tee pipe group. The bottom of the two groups of bases is connected with an air inlet pipeline through a tee pipe group. An air inlet valve is fixed on the branch pipe of the air inlet pipeline. An air inlet bag is also fixed on the input end of the air inlet pipeline. A plurality of air inlet interfaces are arranged on the air inlet bag. An air outlet control valve is fixed on the branch pipe of the air outlet pipeline.

[0006] The filler tank is further provided with a pressure sensor and a temperature sensor, one side of the filler tank is provided with a tank observation window, the box body is provided with a box body observation window corresponding to the tank observation window, the side door of the box body is further fixed with a control unit, and the top of the box body is fixed with a warning light.

[0007] The two symmetrically arranged filler tanks are provided, one is used and the other is standby, the waste gas of semiconductor production enters the single filler tank through the branch of the gas inlet pipeline under the control of the gas inlet valve, and the reaction is carried out on the adsorption filler in the filler tank, and the tail gas treatment is achieved through the adsorption of the adsorbent. The maintenance personnel can observe the adsorption state of the adsorption filler in the filler tank through the box body observation window and the tank observation window in turn until the color of the adsorption filler reaches the specified color, which indicates that the adsorbent has been completely reacted. The opening and closing of the gas inlet valve of the branch of the gas inlet pipeline can be manually input to the control unit to switch to the other filler tank for adsorption. Meanwhile, the gas pressure data and temperature data collected by the pressure sensor and the temperature sensor can be automatically switched by the control unit to realize manual and automatic operation, high adsorption safety, meet the harmful gas emission standard of semiconductor production, have market prospects, and are suitable for popularization and application.

[0008] Further, the control unit is a PLC control unit, the gas outlet control valve, the gas inlet valve, the warning light, the pressure sensor and the temperature sensor are electrically connected with the control unit through wires, and the gas outlet control valve and the gas inlet valve are electromagnetic valve structures.

[0009] Further, the box body is a closed box body structure, one side of the bottom of the box body is provided with a ventilation hole, the box body absorbs external air from the ventilation hole through a negative pressure fan and keeps the internal air pressure of the box body less than the external air pressure, and a gas detection module is correspondingly arranged on the top of the box body and is electrically connected with the control unit through wires.

[0010] Further, the base is fixedly connected with the filler tank through bolts, a movable seat is arranged in the box body, and sliding wheels are fixed to the bottom of the movable seat.

[0011] Further, the output end of the gas outlet pipeline is further connected with a gas sampling port, and the input end of the gas inlet pipeline is further connected with a gas sampling port.

[0012] Further, the adsorption filler filled in the filler tank includes one or more of HCL, CL2 adsorbent or CH4, C2H4 adsorbent according to the tail gas treatment requirement.

[0013] Further, the filler tank is also provided with a particle circulating mechanism and a impurity removal mechanism, the particle circulating mechanism comprises a circulating inner pipe, the circulating inner pipe is rotatably connected between the filler tank and the base, a driving motor for driving the circulating inner pipe to rotate is also fixed in the base, an outer circulating pipe is sleeved outside the circulating inner pipe, a plurality of inner spiral fins are fixed between the circulating inner pipe and the outer circulating pipe, an outer spiral fin is sleeved outside the outer circulating pipe, and a gas collecting bin is fixed to the top of the circulating inner pipe;

[0014] The impurity removal mechanism comprises an impurity removal inner pipe in communication with the input end of the gas outlet pipeline, an impurity removal outer pipe is sleeved outside the impurity removal inner pipe, a plurality of gas guide pipes are arranged at equal angles and are arranged between the impurity removal outer pipe and the impurity removal inner pipe, one end of the gas guide pipe extends to the gas collecting bin, the other end of the gas guide pipe extends to the bottom of the impurity removal inner pipe through the gap between the impurity removal outer pipe and the impurity removal inner pipe, and the impurity removal outer pipe and the impurity removal inner pipe are filled with impurity removal liquid.

[0015] Further, the spiral directions of the inner spiral fins and the outer spiral fins are mirror-symmetrically arranged, the filler tank and the outer circulating pipe, and the outer circulating pipe and the circulating inner pipe are all filled with saturated adsorption filler, the particles of the adsorption filler are all spherical in structure, and the length of the outer circulating pipe is less than that of the circulating inner pipe.

[0016] Further, a plurality of negative pressure blades are fixed to the inner wall of the gas collecting bin, and the negative pressure blades generate negative pressure adsorption force in the rotating process.

[0017] Further, the outer diameter of the impurity removal outer pipe is less than the inner diameter of the circulating inner pipe, the circulating inner pipe is rotatably sleeved on the outer wall of the impurity removal outer pipe, and the impurity removal liquid is plasma water.

[0018] Compared with the prior art, the application has the following advantages:

[0019] (1) The application is provided with two symmetrically arranged filler tanks, one is used as a spare, and the other is used for adsorption. The waste gas generated in semiconductor production enters the single filler tank through the branch pipe of the gas inlet pipeline under the control of the gas inlet valve, and is reacted in the adsorption filler in the filler tank. The adsorbent is absorbed to achieve the purpose of tail gas treatment. Maintenance personnel can observe the adsorption state of the adsorption filler in the filler tank through the box observation window and the tank observation window in sequence until the color of the adsorption filler reaches the specified color, which indicates that the adsorbent has been completely reacted. The opening and closing of the gas inlet valve of the branch pipe of the gas inlet pipeline can be manually input to the control unit to switch to the other filler tank for adsorption. At the same time, the application can also automatically switch the action of the filler tank through the gas pressure data and temperature data collected by the pressure sensor and the temperature sensor, and the control unit can realize manual and automatic operation. The adsorption safety is high, the harmful gas emission standard of semiconductor production can be met, the application has market prospects, and is suitable for popularization and application.

[0020] (2) Through the box structure design with gas detection module and warning light, in the process of normal operation, the gas in the box is adsorbed from the vent hole by the negative pressure fan and keeps the negative pressure state inside the box to prevent harmful tail gas from leaking and causing harm to the staff, and the harmful gas in the box can be monitored in real time by the gas detection module to avoid the phenomenon of harmful gas leakage, and when the leaked harmful gas reaches the design threshold, the gas detection module can detect and feed back to the control unit, and the control unit controls the warning light to sound and light warning to improve the safety of actual use.

[0021] (3) Through the structure design of the moving seat with pulley and the fixed hoop ring, on the one hand, when installing the filler tank, the bolts of the fixed hoop ring can be fixed to keep the filler tank stable, and on the other hand, when the filler tank needs to be disassembled, the bolts of the fixed hoop ring can be loosened, and the moving seat can be directly towed to realize the transfer and replacement of the filler tank, improving the convenience of maintenance.

[0022] (4) Through the design of different adsorption fillers, the filler tank can adapt to the adsorption of different tail gases generated in different semiconductor production processes, and can meet the adsorption needs of different gases. The adsorption filler is simple to replace, and the adsorption application range is improved.

[0023] (5) The particle circulation mechanism with circulating outer pipe and circulating inner pipe is designed, so that the whole particle circulation mechanism rotates under the drive of the drive motor, the adsorption filler filled on both sides of the circulating outer pipe is circulated and exchanged, that is, it rises under the rotation of the outer spiral piece and descends under the rotation of the inner spiral piece, and the adsorption filler on both sides is exchanged in the gap between the upper and lower ends of the circulating outer pipe. Compared with the traditional fixed stacking scheme, the adsorption filler is mixed and exchanged, the tail gas can be more uniformly contacted with the adsorption filler, and the adsorption efficiency is effectively improved under the condition that the amount of adsorption filler remains unchanged.

[0024] (6) Through the mutual cooperation between the gas collection bin with negative pressure blades and the impurity removal mechanism with plasma water, under the condition of rotation of the particle circulation mechanism, the negative pressure blades generate negative pressure adsorption force on the tail gas in the filler tank, and generate positive pressure to push the gas in the gas collection bin to the impurity removal inner tube through the gas guide pipe. Through the desorption of the plasma water, on the one hand, the adsorption filler particles contained in the treated tail gas are removed, and on the other hand, the treated tail gas is further treated through water washing by the plasma water, improving the degree of harmless treatment. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a structural schematic view of the present application;

[0026] Figure 2 It is a schematic view of the internal structure of the present application;

[0027] Figure 3 Front view of the filler tank proposed in the present application;

[0028] Figure 4 Back view of the filler tank proposed in the present application;

[0029] Figure 5 Flow chart of the operation of the present application;

[0030] Figure 6 Sectional view of the filler tank proposed in the present application;

[0031] Figure 7 Perspective view of the particle circulation mechanism proposed in the present application;

[0032] Figure 8 Exploded view of the particle circulation mechanism proposed in the present application;

[0033] Figure 9 Sectional view of the impurity removal outer pipe proposed in the present application;

[0034] Figure 10 Flow chart of the gas flow in the filler tank proposed in the present application.

[0035] Explanation of the reference numerals in the figures:

[0036] Box 1, box observation window 11, air vent 12, gas outlet pipe 13, gas outlet control valve 131, gas outlet sampling port 132, gas inlet pipe 14, gas inlet bag 141, gas inlet sampling port 142, pressure sensor 143, warning light 15, gas detection module 16, control unit 2, filler tank 3, tank body observation window 31, base 32, adsorbent pad layer 321, temperature sensor 33, moving seat 4, fixing hoop 5, gas inlet valve 6, particle circulation mechanism 7, circulation outer pipe 701, circulation inner pipe 702, outer spiral piece 71, inner spiral piece 72, gas collection bin 73, negative pressure blade 731, drive motor 8, impurity removal mechanism 9, impurity removal outer pipe 91, impurity removal inner pipe 92, gas guide pipe 93. DETAILED DESCRIPTION

[0037] The embodiments will be described in conjunction with the drawings in the specification, and all other embodiments obtained by those skilled in the art based on the embodiments in the present application without creative labor fall within the scope of the present application. EMBODIMENT

[0038] The present application provides a hand-automatic type dry adsorption type tail gas processor, please refer to Figures 1-5, including a box 1 and two symmetrical filler tanks 3 arranged in the box 1, the bottom of the filler tank 3 is provided with a base 32, the base 32 is communicated with the filler tank 3 and clamped with a filter screen plate, the filler tank 3 is filled with adsorption filler, the base 32 is filled with an adsorbent cushion layer 321, the top of the two groups of filler tanks 3 is connected with an air outlet pipeline 13 through a three-way pipe group, the bottom of the two groups of bases 32 is connected with an air inlet pipeline 14 through a three-way pipe group on one side, the branch pipe of the air inlet pipeline 14 is fixed with an air inlet valve 6, and the input end of the air inlet pipeline 14 is also fixed with an air inlet bag 141, a plurality of air inlet interfaces are arranged on the air inlet bag 141, and the branch pipe of the air outlet pipeline 13 is fixed with an air outlet control valve 131;

[0039] The filler tank 3 is also provided with a pressure sensor 143 and a temperature sensor 33, one side of the filler tank 3 is provided with a tank observation window 31, the box 1 is provided with a box observation window 11 corresponding to the tank observation window 31, and the side box door of the box 1 is also fixed with a control unit 2.

[0040] It should be noted that, in the embodiment, the control unit 2 is a PLC control unit, the air outlet control valve 131, the air inlet valve 6, the warning light 15, the pressure sensor 143 and the temperature sensor 33 are electrically connected with the control unit 2 through wires, and the air outlet control valve 131 and the air inlet valve 6 are both electromagnetic valve structures.

[0041] The present application is provided with two symmetrical filler tanks 3, one is used and the other is standby, the waste gas of semiconductor production enters a single filler tank 3 through the branch pipe of the air inlet pipeline 14 under the control of the air inlet valve 6, and reacts in the adsorption filler in the filler tank 3, and is absorbed by the adsorbent, so that the purpose of tail gas treatment is achieved, and the maintenance personnel can observe the adsorption state of the adsorption filler in the filler tank 3 through the box observation window 11 and the tank observation window 31 in turn until the color of the adsorption filler reaches the specified color, which indicates that the adsorbent has been reacted completely, and the opening and closing of the air inlet valve 6 of the branch pipe of the air inlet pipeline 14 can be manually input to the control unit 2 to switch to the other filler tank 3 for adsorption, and the present application can also automatically switch the action of the filler tank 3 by the air pressure data and temperature data collected by the pressure sensor 143 and the temperature sensor 33 through the control unit 2, so that manual and automatic operation can be realized, the adsorption safety is high, the harmful gas emission standard of semiconductor production can be met, the present application has market prospect and is suitable for popularization and application.

[0042] Further, in the embodiment, the box 1 is a closed box structure, one side of the bottom of the box 1 is provided with a ventilation hole 12, the box 1 sucks external air from the ventilation hole 12 through a negative pressure fan and keeps the internal air pressure of the box 1 less than the external air pressure, and a gas detection module 16 is arranged on the top of the box 1, and the gas detection module 16 is electrically connected with the control unit 2 through wires.

[0043] Through the structure design of the box 1 with the gas detection module 16 and the warning light 15, in the process of normal operation, the gas in the box 1 is adsorbed from the vent hole 12 by the negative pressure fan and keeps the negative pressure state inside the box 1, so as to prevent the harmful tail gas from leaking and causing harm to the staff, and meanwhile, the harmful gas in the box 1 can be monitored in real time by the gas detection module 16, so as to avoid the phenomenon of harmful gas leakage, and when the leaked harmful gas reaches the design threshold value, the feedback of the gas detection module 16 can be detected to the control unit 2, and the control unit 2 controls the warning light 15 to give an acoustic and light early warning, so as to improve the safety of actual use.

[0044] Further, in the embodiment, the base 32 is fixedly connected with the filler tank 3 through bolts, the box 1 is provided with a moving seat 4, the bottom of the moving seat 4 is fixed with a pulley at each corner, and the tank body of the filler tank 3 is detachably connected in the box 1 through a fixed hoop 5.

[0045] Through the structure design of the moving seat 4 with the pulley and the fixed hoop 5, on the one hand, when the filler tank 3 is installed, the bolts of the fixed hoop 5 can be fixed to keep the filler tank 3 stable, and on the other hand, when the filler tank 3 needs to be disassembled, the bolts of the fixed hoop 5 can be loosened, and the moving seat 4 can be directly towed, so that the filler tank 3 can be transported and replaced, and the convenience of maintenance is improved.

[0046] Further, in the embodiment, the output end of the gas outlet pipeline 13 is further connected with a gas outlet sampling port 132, the input end of the gas inlet pipeline 14 is further connected with a gas inlet sampling port 142, and the adsorption filler filled in the filler tank (3) includes one or more of HCL, CL2 adsorbent or CH4, C2H4 adsorbent according to the tail gas treatment requirement.

[0047] Through the design of different adsorption fillers, the filler tank (3) can adapt to the adsorption of the tail gas generated in different semiconductor productions, can meet the adsorption requirement of different gases, the adsorption filler is simple to replace, and the adsorption application range is improved. Embodiment

[0048] The application provides a hand-automatic dry adsorption type tail gas processor, please refer to Figures 6-10 The filler tank 3 is further provided with a particle circulation mechanism 7 and an impurity removal mechanism 9, the particle circulation mechanism 7 comprises a circulating inner pipe 702, the circulating inner pipe 702 is rotationally connected between the filler tank 3 and the base 32, the base 32 is further fixed with a driving motor 8 for driving the circulating inner pipe 702 to rotate, the circulating inner pipe 702 is sleeved with a circulating outer pipe 701 outside, the circulating outer pipe 701 and the circulating inner pipe 702 are fixed with an inner spiral piece 72 therebetween, the circulating outer pipe 701 is sleeved with an outer spiral piece 71 outside, and the top of the circulating inner pipe 702 is fixed with a gas collecting bin 73.

[0049] The impurity removal mechanism 9 comprises an inner impurity removal pipe 92 communicated with the input end of the gas outlet pipe 13, and an outer impurity removal pipe 91 sleeved outside the inner impurity removal pipe 92, and a plurality of angle-arranged gas guide pipes 93 arranged between the outer impurity removal pipe 91 and the inner impurity removal pipe 92, one end of the gas guide pipe 93 extending to the gas collection bin 73, and the other end of the gas guide pipe 93 extending to the bottom of the inner impurity removal pipe 92 through the gap between the outer impurity removal pipe 91 and the inner impurity removal pipe 92, and the gap between the outer impurity removal pipe 91 and the inner impurity removal pipe 92 being filled with impurity removal liquid.

[0050] Specifically, in the embodiment, the inner spiral blade 72 and the outer spiral blade 71 are arranged in mirror image symmetry, and the circulating outer pipe 701 and the circulating inner pipe 702 are filled with saturated adsorption filler, and the particles of the adsorption filler are in spherical structure, and the length of the circulating outer pipe 701 is less than that of the circulating inner pipe 702.

[0051] The particles circulating mechanism 7 is designed with the circulating outer pipe 701 and the circulating inner pipe 702, so that the particles circulating mechanism 7 rotates under the driving of the driving motor 8, the adsorption filler filled on both sides of the circulating outer pipe 701 is circulated and exchanged, that is, the adsorption filler is lifted under the rotation of the outer spiral blade 71 and is lowered under the rotation of the inner spiral blade 72, and the adsorption filler on both sides is exchanged in the gap between the upper end and the lower end of the circulating outer pipe 701, compared with the traditional fixed pile scheme, the adsorption filler is mixed and exchanged, the tail gas can be more uniformly contacted with the adsorption filler, and the adsorption efficiency is effectively improved under the condition that the amount of the adsorption filler is unchanged.

[0052] In the embodiment, the inner wall of the gas collection bin 73 is further fixed with a plurality of negative pressure blades 731, and the negative pressure blades 731 generate negative pressure adsorption force in the filler tank 3 during rotation.

[0053] Further, in the embodiment, the outer diameter of the impurity removal outer pipe 91 is less than the inner diameter of the circulating inner pipe 702, the circulating inner pipe 702 is rotatably sleeved on the outer wall of the impurity removal outer pipe 91, and the impurity removal liquid is plasma water.

[0054] Through the cooperation between the gas collection bin 73 with the negative pressure blades 731 and the impurity removal mechanism 9 with the plasma water, under the rotation of the particles circulating mechanism 7, the negative pressure blades 731 generate negative pressure adsorption force on the tail gas in the filler tank 3 and generate positive pressure to push the gas in the gas collection bin 73 to the inner impurity removal pipe 92 through the gas guide pipe 93, and through the desorption of the plasma water, on one hand, the adsorption filler particles contained in the tail gas after treatment are removed, and on the other hand, the tail gas after treatment is further treated through the water washing of the plasma water, and the harmless treatment degree is improved.

[0055] The above is only the best embodiment adopted by the present application in combination with the current actual demand, but the protection scope of the present application is not limited thereto.

Claims

1. A manual / automatic integrated dry adsorption exhaust gas processor, comprising a housing (1) and two packing tanks (3) symmetrically arranged within the housing (1), characterized in that, The bottom of the packing tank (3) is provided with a base (32), the base (32) is connected to the packing tank (3) and a filter screen is clamped therein, the packing tank (3) is filled with adsorbent packing, the base (32) is filled with an adsorbent pad (321), the top of the two sets of packing tanks (3) are connected to an outlet pipe (13) through a three-way pipe group, and the bottom side of the two sets of bases (32) is connected to an inlet pipe (14) through a three-way pipe group. An inlet valve (6) is fixed on the branch pipe of the inlet pipe (14), and an inlet bag (141) is fixed at the input end of the inlet pipe (14). The inlet bag (141) is provided with multiple inlet ports, and an outlet control valve (131) is fixed on the branch pipe of the outlet pipe (13). The packing tank (3) is also equipped with a pressure sensor (143) and a temperature sensor (33). A tank observation window (31) is provided on one side of the packing tank (3). A box observation window (11) corresponding to the tank observation window (31) is provided on the box body (1). A control unit (2) is also fixed on the box door on one side of the box body (1). A warning light (15) is fixed on the top of the box body (1). The packing tank (3) is also provided with a particle circulation mechanism (7) and a cleaning mechanism (9). The particle circulation mechanism (7) includes a circulation inner tube (702). The circulation inner tube (702) is rotatably connected between the packing tank (3) and the base (32). The base (32) is also fixed with a drive motor (8) for driving the circulation inner tube (702) to rotate. A circulation outer tube (701) is sleeved on the outside of the circulation inner tube (702). An inner spiral blade (72) is fixed between the circulation outer tube (701) and the circulation inner tube (702). An outer spiral blade (71) is sleeved on the outer wall of the circulation outer tube (701). A gas collection chamber (73) is fixed on the top of the circulation inner tube (702). The impurity removal mechanism (9) includes an inner impurity removal pipe (92) connected to the input end of the gas outlet pipe (13). An outer impurity removal pipe (91) is sleeved on the outside of the inner impurity removal pipe (92). A number of air guide pipes (93) are evenly distributed at equal angles between the outer impurity removal pipe (91) and the inner impurity removal pipe (92). One end of the air guide pipe (93) extends to the gas collection chamber (73). The other end of the air guide pipe (93) passes through the gap between the outer impurity removal pipe (91) and the inner impurity removal pipe (92) and extends to the bottom of the inner impurity removal pipe (92). The space between the outer impurity removal pipe (91) and the inner impurity removal pipe (92) is filled with impurity removal liquid.

2. The manual / automatic integrated dry adsorption exhaust gas processor according to claim 1, characterized in that, The control unit (2) is a PLC control unit. The exhaust control valve (131), intake valve (6), warning light (15), pressure sensor (143), and temperature sensor (33) are all electrically connected to the control unit (2) through wires. The exhaust control valve (131) and intake valve (6) are both electromagnetic valve structures.

3. The manual / automatic integrated dry adsorption exhaust gas processor according to claim 1, characterized in that, The box (1) is a sealed box structure. A ventilation hole (12) is provided on one side of the bottom of the box (1). The box (1) uses a negative pressure fan to draw in external air from the ventilation hole (12) and keep the internal air pressure of the box (1) lower than the external air pressure. A gas detection module (16) is provided on the top of the box (1). The gas detection module (16) is electrically connected to the control unit (2) through a wire.

4. The manual / automatic integrated dry adsorption exhaust gas processor according to claim 1, characterized in that, The base (32) and the filling tank (3) are fixedly connected by bolts. The box (1) is provided with a movable seat (4). The four corners of the bottom of the movable seat (4) are fixed with pulleys. The filling tank (3) is detachably connected to the box (1) by a fixing hoop (5).

5. The manual / automatic integrated dry adsorption exhaust gas processor according to claim 1, characterized in that, An air outlet sampling port (132) is also connected to the output end of the air outlet pipe (13), and an air inlet sampling port (142) is also connected to the input end of the air inlet pipe (14).

6. The manual / automatic integrated dry adsorption exhaust gas processor according to claim 1, characterized in that, The adsorption packing material filled in the packing tank (3) includes one or more of HCl, CL2 adsorbents or CH4, C2H4 adsorbents, depending on the tail gas treatment requirements.

7. The manual / automatic integrated dry adsorption exhaust gas processor according to claim 1, characterized in that, The inner spiral blade (72) and the outer spiral blade (71) are arranged in a mirror-symmetrical spiral direction. The space between the packing tank (3) and the outer circulation pipe (701) and the space between the outer circulation pipe (701) and the inner circulation pipe (702) are filled with saturated adsorption packing. The particles of the adsorption packing are all spherical. The length of the outer circulation pipe (701) is less than that of the inner circulation pipe (702).

8. The manual / automatic integrated dry adsorption exhaust gas processor according to claim 1, characterized in that, The inner wall of the gas collection chamber (73) is also fixed with several negative pressure blades (731). During the rotation process, the negative pressure blades (731) generate negative pressure adsorption force on the packing tank (3).

9. A manual / automatic integrated dry adsorption exhaust gas processor according to claim 1, characterized in that, The outer diameter of the impurity removal outer tube (91) is smaller than the inner diameter of the circulation inner tube (702). The circulation inner tube (702) is rotatably sleeved on the outer wall of the impurity removal outer tube (91). The impurity removal liquid is plasma water.

Citation Information

Patent Citations

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    CN114471073A

  • Cyclic regeneration tower type waste gas adsorber

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  • Active carbon automatic desorption regeneration adsorption equipment for RCO

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  • Solid waste incineration waste gas treatment device

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