Processing equipment for semiconductor production

Abstract

The present invention discloses a processing equipment for semiconductor production, which relates to the technical field of semiconductor production; the present invention includes a conveying device, which includes a feeding conveyor belt mechanism and a discharging conveyor belt mechanism, and a mold base is fixedly installed on the conveying device. The motor causes the feeding conveyor belt mechanism and the discharging conveyor belt mechanism to rotate synchronously through a synchronous belt, and the driven gear is driven to rotate by the active gear, so that the rocker arm drives the concave frame to slide repeatedly through the pull rod, and then the chip semiconductor is conveyed to the concave block one by one through the concave frame, and the concave frame simultaneously uses a connecting rod mechanism to enable the pressure bar to press multiple pins into an L shape. When the concave frame slides in the opposite direction, it can drive the first gear to rotate through the rack, and drive the push frame to move upward along the cross plate through the screw rod, so that the chip semiconductor can be flipped and removed, and quickly discharged through the discharging conveyor belt mechanism, thereby realizing high-efficiency processing of the chip semiconductor pins.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and in particular to processing equipment for semiconductor production. Background Art

[0002] When processing a packaged chip semiconductor, the pins of the chip semiconductor need to be bent before the chip semiconductor and the substrate are fixed and installed. However, during the current bending process, the pins of the chip semiconductor are usually connected to the mounting socket of the chip semiconductor after being bent, which makes it difficult to discharge the finished chip semiconductor. Therefore, it usually causes the chip semiconductor to be unable to be effectively discharged during the processing process, making it difficult to improve the production efficiency of the chip semiconductor processing. Then, in response to the above problems, the inventor proposed a semiconductor production processing equipment to solve the above problems. Summary of the Invention

[0003] In order to solve the problem that the drainage structure needs to occupy a large space in the fish pond (simple description problem); the purpose of the present invention is to provide a processing equipment for semiconductor production.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions: a processing equipment for semiconductor production, comprising a conveying device, the conveying device comprising a feed conveyor belt mechanism and a discharge conveyor belt mechanism, a mold base is fixedly installed on the conveying device, a chip semiconductor is placed on the mold base, the feed conveyor belt mechanism and the discharge conveyor belt mechanism are transmission-connected with a power component, the power component is transmission-connected with a linkage component, the linkage component is transmission-connected with a feeding component, the feeding component is transmission-connected with a stripping component, the stripping component is transmission-connected with a holding component, the bottom end of the holding component is bonded and connected to the upper surface of the chip semiconductor, the stripping component is bonded and connected to the bottom surface of the chip semiconductor, the chip semiconductor is placed by the feed conveyor belt mechanism, and then the power component works through the transmission feeding component to transport the chip semiconductor to the mold base, and at the same time the feeding component makes the stripping component and the holding component work, so that after the holding component processes the chip semiconductor, it can be stripped by the stripping component, and then the chip semiconductor is transported and discharged by the discharge conveyor belt mechanism.

[0005] Preferably, the feed conveyor belt mechanism and the discharging conveyor belt mechanism are rotatably connected to a mounting frame, the inner walls of the mounting frame are fixedly connected to a mold base, the mounting frame is rotatably connected to a power component, and the power component drives the feed conveyor belt mechanism and the discharging conveyor belt mechanism to rotate in the mounting frame to realize the conveying of chip semiconductors; the mold base includes a concave block, the upper surface of the concave block is placed with chip semiconductors, and the bottom surface of the concave block is fixedly provided with a plurality of L-shaped blocks, the L-shaped block is fixedly connected to the inner wall of the mounting frame, and the chip semiconductor can be conveyed to the concave block. The provision of a plurality of L-shaped blocks can enable the concave block to be fixedly installed, so that the chip semiconductor is pressed and processed; the power component includes a motor, the motor is fixedly connected to the mounting frame, the output end of the motor is rotatably connected to the mounting frame, and the output end of the motor is transmission-connected to a first belt mechanism, and the first belt mechanism One end of the belt mechanism is connected to the second belt mechanism, the first belt mechanism and the second belt mechanism are connected to the feed conveyor belt mechanism and the discharging conveyor belt mechanism, one end of the second belt mechanism is connected to the driving gear, the driving gear is connected to the linkage assembly, the output end of the motor drives the first belt mechanism and the second belt mechanism to rotate, and then the feed conveyor belt mechanism and the discharging conveyor belt mechanism rotate synchronously in the mounting frame; the linkage assembly includes a passive gear, the passive gear is meshed with the active gear, a rotating shaft is fixedly provided in the passive gear, the rotating shaft is rotatably connected to the bracket, the bottom end of the bracket is fixedly connected to the mounting frame, the rotating shaft is fixedly connected to the rocker arm, the rocker arm is connected to the feeding assembly, the driving gear drives the passive gear to rotate, and then the rocker arm is rotated on the bracket through the rotating shaft, and the feeding assembly is operated through the rocker arm.

[0006] Preferably, the feeding assembly includes a pull rod, one end of the pull rod is rotatably connected to the rocker arm, the other end of the pull rod is rotatably connected to a concave frame, the bottom end of the concave frame is slidably connected to the mounting frame, the concave frame is transmission-connected to the stripping assembly, the bottom end of the concave frame is fixedly connected to a concave frame, the bottom surface of the concave frame is fitted and connected to the feeding conveyor belt mechanism, the rotation of the rocker arm can make the pull rod move repeatedly, and then make the concave frame slide repeatedly along the mounting frame, and make the stripping assembly work through the concave frame, and the repeatedly moving concave frame can make the chip semiconductors be transported to the concave block one by one; The stripping assembly includes a strip plate and a rack, one end of the strip plate is transmission-connected to the holding assembly, the other end of the strip plate is rotatably connected to the L-shaped plate, one end of the L-shaped plate is rotatably connected to the concave frame, the rack is fixedly connected to the first slide and the second slide, the first slide is fixedly connected to the concave frame, the second slide is slidably connected to the mounting frame, the rack is meshed with the first gear, the first gear is fixedly connected to the screw rod, the screw rod is rotatably connected to the cross plate, the cross plate is slidably connected to the push frame, and a connecting block is fixedly provided in the push frame, and the connecting block is connected to the screw rod The rod is threadedly connected, and the upper surface of the push frame is fitted and connected with the bottom surface of the chip semiconductor. The repeated movement of the concave frame can make the L-shaped plate drive the strip plate to swing along the bracket, and then make the holding assembly work, and the concave frame simultaneously drives the rack drive first gear to rotate, and then can drive the push frame up and down along the horizontal plate through the screw rod to realize the removal of the pressed chip semiconductor; a plurality of pins are fixed on the chip semiconductor, and the pins are fitted and connected with the holding assembly, and the plurality of pins on the chip semiconductor can be pressed and held in an L shape; the holding assembly includes two connecting rods, one end of the two connecting rods is connected to the bracket The strip plate is rotatably connected, and the shaft in one end of the connecting rod is fixedly connected to the strip plate. The other ends of the two connecting rods are rotatably connected to the vertical plate. The bottom end of the vertical plate is fixedly connected to the pressure plate. The bottom surface of the pressure plate fits the upper surface of the connecting chip semiconductor. A plurality of arc-shaped arms are fixedly provided on both side surfaces of the pressure plate. A pressure strip is fixed at the bottom end of the arc-shaped arm. The bottom surface of the pressure strip fits the connecting pins. The strip plate swings and can make the vertical plate move in an arc shape through the two connecting rods, and the vertical plate can remain in a vertical state, and then the multiple pins on the chip semiconductor are pressed into an L shape at the same time through the two pressure strips on both sides of the pressure plate.

[0007] Compared with the prior art, the present invention has the following beneficial effects:

[0008] 1. The motor drives the feed conveyor belt mechanism and the discharge conveyor belt mechanism to rotate synchronously through the synchronous belt, and drives the driven gear to rotate through the active gear, so that the rocker arm drives the concave frame to slide repeatedly through the pull rod, and then the chip semiconductors are transported to the concave block one by one through the concave frame. At the same time, the concave frame uses the connecting rod mechanism to enable the pressure bar to press multiple pins into an L shape. When the concave frame slides in the opposite direction, it can drive the first gear to rotate through the rack, and the push frame can move upward along the cross plate through the screw drive, so that the chip semiconductor can be flipped and removed, and quickly discharged through the discharge conveyor belt mechanism, realizing high-efficiency processing of chip semiconductor pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0010] Figure 1 It is an overall schematic diagram of the present invention.

[0011] Figure 2 Schematic diagram of the structural power assembly of the present invention.

[0012] Figure 3 Schematic diagram of the structural stripping assembly of the present invention.

[0013] Figure 4 It is a schematic diagram of the structural holding component of the present invention.

[0014] Figure 5 The structure of the present invention Figure 4 Enlarged schematic diagram of point A in the middle.

[0015] In the figure: 1. Conveyor; 11. Mounting frame; 12. Feed conveyor belt mechanism; 13. Discharge conveyor belt mechanism; 2. Die base; 21. Concave block; 22. L-shaped block; 3. Semiconductor chip; 31. Pin; 4. Linkage assembly; 41. Passive gear; 42. Rotating shaft; 43. Rocker arm; 44. Bracket; 5. Feeding assembly; 51. Pull bar; 52. Concave frame; 53. Concave frame; 6. Holding assembly; 61. Vertical Plate; 62, pressure plate; 63, arc-shaped arm; 64, pressure strip; 65, connecting rod; 7, stripping assembly; 71, strip plate; 72, L-shaped plate; 73, first slide; 74, rack; 75, second slide; 76, first gear; 77, screw rod; 78, cross plate; 79, push frame; 791, connecting block; 8, power assembly; 81, motor; 82, first belt mechanism; 83, second belt mechanism; 84, driving gear. DETAILED DESCRIPTION

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0017] like Figure 1-5 As shown, the present invention provides a processing equipment for semiconductor production, including a conveying device 1, the conveying device 1 includes a feed conveyor belt mechanism 12 and a discharge conveyor belt mechanism 13, a mold base 2 is fixedly installed on the conveying device 1, a chip semiconductor 3 is placed on the mold base 2, the feed conveyor belt mechanism 12 and the discharge conveyor belt mechanism 13 are transmission-connected with a power component 8, the power component 8 is transmission-connected with a linkage component 4, the linkage component 4 is transmission-connected with a feeding component 5, the feeding component 5 is transmission-connected with a stripping component 7, the stripping component 7 is transmission-connected with a holding component 6, the bottom end of the holding component 6 is bonded to the upper surface of the chip semiconductor 3, and the stripping component 7 is bonded to the bottom surface of the chip semiconductor 3.

[0018] By adopting the above technical solution, the chip semiconductor 3 is placed by the feed conveyor belt mechanism 12, and then the power component 8 works through the transmission feeding component 5 to transport the chip semiconductor 3 to the mold base 2. At the same time, the feeding component 5 enables the stripping component 7 and the holding component 6 to work, so that after the holding component 6 processes the chip semiconductor 3, it can be stripped by the stripping component 7, and then the chip semiconductor 3 is transported out by the discharge conveyor belt mechanism 13.

[0019] The feed conveyor belt mechanism 12 and the discharge conveyor belt mechanism 13 are rotatably connected to the mounting frame 11 , the inner walls of the mounting frame 11 are fixedly connected to the die base 2 , and the mounting frame 11 is rotatably connected to the power assembly 8 .

[0020] By adopting the above technical solution, the power assembly 8 drives the feed conveyor belt mechanism 12 and the discharge conveyor belt mechanism 13 to rotate in the mounting frame 11 to realize the conveying of the chip semiconductor 3.

[0021] The die holder 2 includes a concave block 21 , the semiconductor chip 3 is placed on the upper surface of the concave block 21 , and a plurality of L-shaped blocks 22 are fixedly provided on the bottom surface of the concave block 21 , and the L-shaped blocks 22 are fixedly connected to the inner wall of the mounting frame 11 .

[0022] By adopting the above technical solution, the chip semiconductor 3 can be transported to the concave block 21 , and the provision of multiple L-shaped blocks 22 can enable the concave block 21 to be fixedly installed, thereby allowing the chip semiconductor 3 to be pressed and processed.

[0023] The power assembly 8 includes a motor 81, which is fixedly connected to the mounting frame 11. The output end of the motor 81 is rotatably connected to the mounting frame 11, and the output end of the motor 81 is transmission-connected to a first belt mechanism 82. One end of the first belt mechanism 82 is transmission-connected to a second belt mechanism 83. The first belt mechanism 82 and the second belt mechanism 83 are transmission-connected to the feed conveyor belt mechanism 12 and the discharge conveyor belt mechanism 13. One end of the second belt mechanism 83 is transmission-connected to a driving gear 84, and the driving gear 84 is transmission-connected to the linkage assembly 4.

[0024] By adopting the above technical solution, the output end of the motor 81 drives the first belt mechanism 82 and the second belt mechanism 83 to rotate, thereby causing the feed conveyor belt mechanism 12 and the discharge conveyor belt mechanism 13 to rotate synchronously in the mounting frame 11 .

[0025] The linkage assembly 4 includes a passive gear 41, which is meshed with the active gear 84. A rotating shaft 42 is fixed inside the passive gear 41. The rotating shaft 42 is rotatably connected to a bracket 44. The bottom end of the bracket 44 is fixedly connected to the mounting frame 11. The rotating shaft 42 is fixedly connected to a rocker arm 43, and the rocker arm 43 is transmission-connected to the feeding assembly 5.

[0026] By adopting the above technical solution, the driving gear 84 drives the driven gear 41 to rotate, and then the rocker arm 43 is rotated on the bracket 44 through the rotating shaft 42, and the feeding assembly 5 is operated through the rocker arm 43.

[0027] The feeding assembly 5 includes a pull rod 51, one end of the pull rod 51 is rotatably connected to the rocker arm 43, the other end of the pull rod 51 is rotatably connected to a concave frame 52, the bottom end of the concave frame 52 is slidably connected to the mounting frame 11, the concave frame 52 is transmission-connected to the stripping assembly 7, the bottom end of the concave frame 52 is fixedly connected to a concave frame 53, and the bottom surface of the concave frame 53 is fitted and connected to the feed conveyor belt mechanism 12.

[0028] By adopting the above technical solution, the rotation of the rocker arm 43 can make the pull bar 51 move repeatedly, and then make the concave frame 52 slide repeatedly along the mounting frame 11, and make the stripping assembly 7 work through the concave frame 52, and the repeatedly moving concave frame 53 can make the chip semiconductor 3 be transported to the concave block 21 one by one.

[0029] The stripping assembly 7 includes a strip plate 71 and a rack 74, one end of the strip plate 71 is transmission-connected to the holding assembly 6, the other end of the strip plate 71 is rotatably connected to an L-shaped plate 72, one end of the L-shaped plate 72 is rotatably connected to the concave frame 52, the rack 74 is fixedly connected to a first slide 73 and a second slide 75, the first slide 73 is fixedly connected to the concave frame 52, the second slide 75 is slidably connected to the mounting frame 11, the rack 74 is meshed with a first gear 76, the first gear 76 is fixedly connected to a screw rod 77, the screw rod 77 is rotatably connected to a cross plate 78, a push frame 79 is slidably connected to the cross plate 78, a connecting block 791 is fixedly provided in the push frame 79, the connecting block 791 is threadedly connected to the screw rod 77, and the upper surface of the push frame 79 is in contact with the bottom surface of the chip semiconductor 3.

[0030] By adopting the above technical solution, the repeated movement of the concave frame 52 can enable the L-shaped plate 72 to drive the strip plate 71 to swing along the bracket 44, and then enable the holding assembly 6 to work, and the concave frame 52 simultaneously drives the rack 74 to drive the first gear 76 to rotate, and then can drive the push frame 79 to move up and down along the horizontal plate 78 through the screw rod 77, so that the pressed chip semiconductor 3 can be removed.

[0031] A plurality of pins 31 are fixedly provided on the chip semiconductor 3 , and the pins 31 are in contact with the holding component 6 .

[0032] By adopting the above technical solution, the plurality of pins 31 on the chip semiconductor 3 can be pressed into an L shape.

[0033] The pressing assembly 6 includes two connecting rods 65, one end of the two connecting rods 65 is rotatably connected to the bracket 44, the axis in one end of one of the connecting rods 65 is fixedly connected to the strip plate 71, and the other end of the two connecting rods 65 is rotatably connected to the vertical plate 61, the bottom end of the vertical plate 61 is fixedly connected to the pressure plate 62, the bottom surface of the pressure plate 62 is in contact with the upper surface of the connecting chip semiconductor 3, and multiple arc arms 63 are fixedly provided on both side surfaces of the pressure plate 62, and a pressure strip 64 is fixedly provided at the bottom end of the arc arm 63, and the bottom surface of the pressure strip 64 is in contact with the connecting pin 31.

[0034] By adopting the above technical solution, the strip plate 71 swings, and the vertical plate 61 can move in an arc through the two connecting rods 65, and the vertical plate 61 can remain in a vertical state, and then the two pressure strips 64 on both sides of the pressure plate 62 can simultaneously press the multiple pins 31 on the chip semiconductor 3 into an L shape.

[0035] Working principle: The output end of the motor 81 drives the first belt mechanism 82 and the second belt mechanism 83 to rotate, so that the feed conveyor belt mechanism 12 and the discharge conveyor belt mechanism 13 rotate synchronously in the mounting frame 11. When the pins 31 of the chip semiconductor 3 are bent, multiple chip semiconductors 3 are placed one by one on the concave frame 53. One end of the second belt mechanism 83 drives the driving gear 84 to drive the driven gear 41 to rotate, and the rocker arm 43 is rotated through the rotating shaft 42, and the pull rod 51 drives the concave frame 52 to slide repeatedly along the mounting frame 11, so that the chip semiconductor 3 is transported to the concave block 21 one by one. When the chip semiconductor 3 is transported to the concave block 21, the concave The concave frame 52 causes the L-shaped plate 72 to drive the strip plate 71 to rotate along the bracket 44, and the vertical plate 61 is moved downward in an arc through the two connecting rods 65, and the vertical plate 61 can remain in a vertical state, and then the two pressure strips 64 on both sides of the pressure plate 62 are used to press the multiple pins 31 into an L shape, and then the concave frame 52 slides in the opposite direction, and can drive the first gear 76 to rotate through the rack 74, and then can drive the push frame 79 to move upward along the cross plate 78 through the screw rod 77, so that the processed chip semiconductor 3 can be removed from the concave block 21 and flipped onto the discharge conveyor belt mechanism 13, and then the finished chip semiconductor 3 is transported out through the discharge conveyor belt mechanism 13.

[0036] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A processing device for semiconductor production, comprising a conveying device (1), characterized in that: The conveying device (1) includes a feeding conveyor belt mechanism (12) and a discharging conveyor belt mechanism (13), a mold base (2) is fixedly mounted on the conveying device (1), a chip semiconductor (3) is placed on the mold base (2), the feeding conveyor belt mechanism (12) and the discharging conveyor belt mechanism (13) are transmission-connected with a power component (8), the power component (8) is transmission-connected with a linkage component (4), the linkage component (4) is transmission-connected with a feeding component (5), the feeding component (5) is transmission-connected with a stripping component (7), the stripping component (7) is transmission-connected with a holding component (6), the bottom end of the holding component (6) is bonded to the upper surface of the chip semiconductor (3), and the stripping component (7) is bonded to the bottom surface of the chip semiconductor (3); The feed conveyor belt mechanism (12) and the discharge conveyor belt mechanism (13) are rotatably connected to a mounting frame (11), the mold base (2) is fixedly connected between the inner walls of the mounting frame (11), and the mounting frame (11) is rotatably connected to the power assembly (8); The power assembly (8) includes a motor (81), the motor (81) is fixedly connected to the mounting frame (11), the output end of the motor (81) is rotatably connected to the mounting frame (11), and the output end of the motor (81) is transmission-connected to a first belt mechanism (82), one end of the first belt mechanism (82) is transmission-connected to a second belt mechanism (83), the first belt mechanism (82) and the second belt mechanism (83) are transmission-connected to a feed conveyor belt mechanism (12) and a discharge conveyor belt mechanism (13), one end of the second belt mechanism (83) is transmission-connected to a driving gear (84), and the driving gear (84) is transmission-connected to the linkage assembly (4); The linkage assembly (4) includes a passive gear (41), the passive gear (41) is meshed with the active gear (84), a rotating shaft (42) is fixedly provided inside the passive gear (41), the rotating shaft (42) is rotatably connected to a bracket (44), the bottom end of the bracket (44) is fixedly connected to the mounting frame (11), the rotating shaft (42) is fixedly connected to a rocker arm (43), and the rocker arm (43) is transmission-connected to the feeding assembly (5); The feeding assembly (5) includes a pull rod (51), one end of the pull rod (51) is rotatably connected to the rocker arm (43), the other end of the pull rod (51) is rotatably connected to a concave frame (52), the bottom end of the concave frame (52) is slidably connected to the mounting frame (11), the concave frame (52) is transmission-connected to the stripping assembly (7), the bottom end of the concave frame (52) is fixedly connected to a concave frame (53), and the bottom surface of the concave frame (53) is in contact with the feed conveyor belt mechanism (12); The stripping assembly (7) includes a strip plate (71) and a rack (74), one end of the strip plate (71) is connected to the holding assembly (6) in a transmission manner, the other end of the strip plate (71) is rotatably connected to an L-shaped plate (72), one end of the L-shaped plate (72) is rotatably connected to a concave frame (52), the rack (74) is fixedly connected to a first slide (73) and a second slide (75), the first slide (73) is fixedly connected to the concave frame (52), the second slide (75) is fixedly connected to the mounting plate (52), and the second slide (75) is fixedly connected to the mounting plate (52). The mounting frame (11) is slidably connected, the rack (74) is meshedly connected to the first gear (76), the first gear (76) is fixedly connected to the screw rod (77), the screw rod (77) is rotatably connected to the cross plate (78), the cross plate (78) is slidably connected to the push frame (79), a connecting block (791) is fixedly provided in the push frame (79), the connecting block (791) is threadedly connected to the screw rod (77), and the upper surface of the push frame (79) is in contact with the bottom surface of the chip semiconductor (3).

2. A semiconductor production processing equipment according to claim 1, characterized in that: The die seat (2) includes a concave block (21), a chip semiconductor (3) is placed on the upper surface of the concave block (21), and a plurality of L-shaped blocks (22) are fixedly provided on the bottom surface of the concave block (21), and the L-shaped blocks (22) are fixedly connected to the inner wall of the mounting frame (11).

3. The semiconductor production processing equipment according to claim 1, characterized in that: A plurality of pins (31) are fixedly provided on the chip semiconductor (3), and the pins (31) are fitted and connected to the pressing component (6).

4. A semiconductor production processing equipment according to claim 3, characterized in that: The holding assembly (6) includes two connecting rods (65), one end of the two connecting rods (65) is rotatably connected to the bracket (44), the shaft in one end of one connecting rod (65) is fixedly connected to the strip plate (71), the other end of the two connecting rods (65) is rotatably connected to the vertical plate (61), the bottom end of the vertical plate (61) is fixedly connected to the pressure plate (62), the bottom surface of the pressure plate (62) is in contact with the upper surface of the connecting chip semiconductor (3), and a plurality of arc arms (63) are fixedly provided on both side surfaces of the pressure plate (62), the bottom end of the arc arm (63) is fixedly provided with a pressure strip (64), and the bottom surface of the pressure strip (64) is in contact with the connecting pin (31).

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