Memory devices

Abstract

A memory device comprises: a first shell; a second shell on the first shell; a memory module in an internal space between the first shell and the second shell; a plate between the first shell and the second shell, wherein the plate comprises an air hole and a wing, and wherein the wing comprises: a first section close to the outside of the first shell and the second shell; a second section close to the internal space, wherein the first section is located at a level different from that of the second section.

Description

[0001] This application is a divisional application based on the Chinese patent application filed on May 20, 2019, with application number 201910417724.9 and invention name “Memory Device”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This application claims the benefit of Korean Patent Application No. 10-2018-0057062 filed on May 18, 2018 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0004] The inventive concept relates to a memory device, and more particularly, to a solid state drive (SSD) memory device. Background Art

[0005] A solid-state drive or solid-state disk (SSD) is a data storage device that uses an integrated circuit assembly as memory (e.g., flash memory) to store data persistently. SSDs are used as replacements for hard disk drives (HDDs). Compared to HDDs, SSDs have no moving mechanical components. Compared to HDDs, SSDs have faster access times and lower latency.

[0006] Typically, an SSD is provided in the form of a package in which a memory chip is mounted on a printed circuit board. The SSD package is typically built into a closed housing or an open housing. Summary of the invention

[0007] According to an exemplary embodiment of the inventive concept, a memory device may include: a first housing; a second housing on the first housing; a memory module in an inner space between the first housing and the second housing; a plate between the first housing and the second housing, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first section close to the outside of the first housing and the second housing;

[0008] A second section is proximate to the interior space, wherein the first section is located at a level different from a level of the second section.

[0009] According to an exemplary embodiment of the present invention, a memory device may include: a first shell; a second shell on the first shell; a memory module arranged in an internal space between the first shell and the second shell; a plate arranged along an outer edge of the first shell, wherein the plate includes an air hole between a first wing and a second wing, and wherein each wing includes: a first portion located at an outer edge of the first shell; a second portion protruding toward the internal space between the first shell and the second shell, wherein the first portion and the second portion form an angle at their intersection.

[0010] According to an exemplary embodiment of the present invention, a memory device may include: a first shell; a second shell on the first shell; a memory module arranged in an internal space between the first shell and the second shell; a plate arranged along an outer edge of the first shell, wherein the plate includes an air hole between a first wing and a second wing, and wherein each wing includes: a first segment extending longitudinally along the outer edge of the first shell; a second segment connected to the first segment, the second segment forming an angle with the first segment, wherein the first segment is closer to the bottom of the first shell than the second segment. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1A A top perspective view illustrating a memory device according to an exemplary embodiment of the inventive concept is shown.

[0012] Figure 1B An exemplary embodiment according to the inventive concept is shown. Figure 1A Exploded perspective view of.

[0013] Figure 2A A bottom perspective view showing a memory device according to an exemplary embodiment of the inventive concept is shown.

[0014] Figure 2B An exemplary embodiment according to the inventive concept is shown. Figure 2A Exploded perspective view of.

[0015] Figure 3 An exemplary embodiment according to the inventive concept is shown. Figure 1B 0 is a perspective view of a broken plate of the third recess of the first housing shown in FIG.

[0016] Figure 4A An exemplary embodiment according to the present inventive concept is shown. Figure 3 A perspective view of a cross section of the plate shown in FIG.

[0017] Figure 4B An exemplary embodiment according to the present inventive concept is shown. Figure 1B A perspective view of a cross section of the first housing is shown in FIG.

[0018] Figure 5 A perspective view showing a frame of a memory module according to an exemplary embodiment of the inventive concept is shown.

[0019] Figure 6 A perspective view illustrating a memory module according to an exemplary embodiment of the inventive concept is shown, in which a frame is connected to a first memory package and a second memory package.

[0020] Figure 7 A side view illustrating a memory module according to an exemplary embodiment of the inventive concept is shown.

[0021] Figure 8 A perspective view showing a frame of a memory module according to an exemplary embodiment of the inventive concept is shown. DETAILED DESCRIPTION

[0022] Figure 1A A top perspective view illustrating a memory device according to an exemplary embodiment of the inventive concept is shown. Figure 1B An exemplary embodiment according to the inventive concept is shown. Figure 1A Exploded perspective view of. Figure 2A A bottom perspective view showing a memory device according to an exemplary embodiment of the inventive concept is shown. Figure 2B An exemplary embodiment according to the inventive concept is shown. Figure 2A Exploded perspective view of.

[0023] Reference Figure 1A , Figure 1B , Figure 2A and Figure 2B , a memory device according to an exemplary embodiment of the inventive concept may include a first housing CAS1, a plate PL associated with the first housing CAS1, a second housing CAS2 on the first housing CAS1, and a memory module MM disposed in an inner space between the first housing CAS1 and the second housing CAS2. Each of the first housing CAS1 and the second housing CAS2 may include metal, such as aluminum.

[0024] The first case CAS1 may include a panel type bottom BOP having four sides and a side wall portion SWP vertically extending from the four sides of the bottom BOP. For example, the side wall portion SWP may extend from the bottom BOP in a third direction D3.

[0025] The bottom BOP of the first housing CAS1 may include a first recess RS1 (or first recess) recessed at one side of the bottom BOP. The connector CNE discussed below may be exposed outwardly through the first recess RS1 of the first housing CAS1. In other words, the connector CNE may be accessed from the outside of the memory device.

[0026] The side wall portion SWP of the first housing CAS1 may include a second recess RS2 (or second recess) that is recessed toward the first recess RS1. For example, the second recess RS2 may be recessed from the top surface of the side wall portion SWP toward the bottom BOP. The second recess RS2 may engage with the protruding side wall PSW of the second housing CAS2, which will be discussed below.

[0027] The side wall portion SWP of the first housing CAS1 may further include a third recess RS3 (or a third recess) that is recessed from the top surface of the side wall portion SWP toward the bottom BOP. For example, the third recess RS3 may be provided on a side opposite to the side on which the first recess RS1 and the second recess RS2 are provided. Figure 1B , one of the third recesses RS3 is shown without the plate PL disposed therein, while the other of the third recesses RS3 is shown with the plate PL disposed therein.

[0028] The pad PAD may be disposed on the bottom BOP of the first case CAS1. The capacitor CAP of the memory module MM may be disposed on the pad PAD. The pad PAD may be used as a buffer to protect the capacitor CAP.

[0029] Figure 3 An exemplary embodiment according to the inventive concept is shown. Figure 1B The third recess of the first housing shown in FIG. Figure 4A An exemplary embodiment according to the present inventive concept is shown. Figure 3 A perspective view of a cross section of the plate shown in FIG. Figure 4B An exemplary embodiment according to the present inventive concept is shown. Figure 1B A perspective view of a cross section of the first housing is shown in FIG.

[0030] Reference Figure 3 , Figure 4A and Figure 4B As shown, the guide portion GP may be disposed in each third recess RS3. The guide portion GP may be a groove. The guide portion GP may include a locking portion EP recessed from the guide portion GP. The guide portion GP may also include a hole HOL recessed downward from the guide portion GP. For example, the hole HOL may be recessed into the first housing CAS1.

[0031] The bottom BOP of the first housing CAS1 may include a first fastening portion FAP1 protruding vertically. The first fastening portion FAP1 may contact the side wall portion SWP of the first housing CAS1. Each of the first fastening portions FAP1 may include a base BSP and a column PIP on the base BSP. The column PIP may include a screw hole SCH into which a screw SC is inserted. For example, the column PIP may have a hollow cylindrical shape.

[0032] The first shell CAS1 can be configured so that at least one of the plates PL is associated with the third recess RS3 of the side wall portion SWP. For example, two plates PL can be associated with the side wall portion SWP of the first shell CAS1. In other words, the two plates PL can be arranged in adjacent third recesses RS3 of the side wall portion SWP. The two plates PL can be spaced apart from each other in the first direction D1.

[0033] Each plate PL may include a wing WP that defines an air hole AH. The air hole AH may fluidly connect the interior and the exterior of the memory device. For example, the air hole AH may allow air to flow between the interior and the exterior of the memory device.

[0034] Each wing WP may extend in the second direction D2 from the outside of the first shell CAS1 toward the inside of the first shell CAS 1. The wing WP may extend obliquely. For example, the wing WP may include a first section PO1 close to the outside of the first shell CAS 1 and a second section PO2 close to the inside of the first shell CAS 1. The first section PO1 may be located at a first level LV1 perpendicular to the bottom BOP of the first shell CAS1. The second section PO2 may be located at a second level LV2 perpendicular to the bottom BOP of the first shell CAS1. The first level LV1 and the second level LV2 may be different from each other. For example, the second level LV2 may be higher than the first level LV1. The first section PO1 and the second section PO2 form an angle at their intersection.

[0035] The wing WP may have a bent-shaped cross section in the second direction D2. Alternatively, the wing WP may have a curved-shaped cross section in the second direction D2. Since each wing WP is bent or curved, the memory module MM in the memory device may not be visible from outside the memory device.

[0036] Each plate PL may include a protrusion PP extending along its opposite sidewalls and bottom surface. The protrusion PP may engage with the guide portion GP of the first shell CAS1. For example, the guide portion GP of the first shell CAS1 may guide the protrusion PP of the plate PL so that the plate PL may be slidably engaged with the first shell CAS1.

[0037] The protrusion PP may include a first hook HO1 protruding from the protrusion PP. The first hook HO1 may be provided on the protrusion PP on the side wall of the plate PL. The first hook HO1 and the locking portion EP may engage with each other to fix the plate PL to the first shell CAS1. For example, the first hook HO1 of the plate PL and the locking portion EP of the first shell CAS1 may be connected to each other in a snap-fit ​​manner.

[0038] The protrusion PP may further include a sub-protrusion SPP protruding downward from the protrusion PP. The sub-protrusion SPP may be disposed on the protrusion PP on the bottom surface of the plate PL. The sub-protrusion SPP may engage with the hole HOL of the guide portion GP. For example, the sub-protrusion SPP and the hole HOL may engage with each other to precisely align the plate PL within the third recess RS3 of the first case CAS1.

[0039] The plate PL may be formed of a material different from that of the first case CAS1. For example, the plate PL may include plastic such as polyethylene (PE), polypropylene (PP), polystyrene (PS), or polyvinyl chloride (PVC).

[0040] In the case where the wing WP is formed to have a bent or curved shape using the side wall portion SWP of the first case CAS1 instead of the plate PL, the wing WP may not have a desired shape because the side wall portion SWP is made of metal. However, when the plate PL is formed of plastic and is not formed integrally with the SWP portion of the first case CAS1, it is easier to form the wing WP having a bent or curved shape. As a result, the plate PL can be easily mass-produced at low cost.

[0041] The bottom BOP of the first case CAS1 may have a first thickness T1. The sidewall portion SWP of the first case CAS1 may have a second thickness T2. The first thickness T1 may be greater than the second thickness T2.

[0042] Figure 5 A perspective view illustrating a frame of a memory module according to an exemplary embodiment of the inventive concept. Figure 6 A perspective view illustrating a memory module according to an exemplary embodiment of the inventive concept is shown, in which a frame is connected to a first memory package and a second memory package. Figure 7 A side view of a memory module according to an exemplary embodiment of the inventive concept is shown.

[0043] Reference Figure 5 , Figure 6 and Figure 7 As shown, the memory module MM may be disposed on the first housing CAS1. The memory module MM may be disposed in an internal space between the first housing CAS1 and the second housing CAS2. The memory module MM may include a first memory package MPK1, a second memory package MPK2, a frame FR sandwiched between the first memory package MPK1 and the second memory package MPK2, a capacitor CAP, and a connector (refer to Figure 2B of CNE).

[0044] The first memory package MPK1 may include a first package substrate PS1 and a first memory chip MC1 mounted on the first package substrate PS1. The first memory chip MC1 may be disposed on the top surface and the bottom surface of the first package substrate PS1. The second memory package MPK2 may include a second package substrate PS2 and a second memory chip MC2 mounted on the second package substrate PS2. The second memory chip MC2 may be disposed on the top surface and the bottom surface of the second package substrate PS2. Each of the first package substrate PS1 and the second package substrate PS2 may be a printed circuit board (PCB). For example, each of the first memory package MPK1 and the second memory package MPK2 may be a solid state drive (SSD) package.

[0045] The capacitor CAP may be disposed on one side of the frame FR and electrically connected to the first memory package MPK1 and the second memory package MPK2. The capacitor CAP may have a cylindrical shape. The connector CNE may be combined with the first package substrate PS1. The connector CNE may be exposed to the outside through the first recess RS1 of the first case CAS1.

[0046] A flexible printed circuit film FPC may be provided to electrically connect the first memory package MPK1 and the second memory package MPK2 to each other. The flexible printed circuit film FPC may include a conductive line through which the first memory package MPK1 and the second memory package MPK2 are electrically connected to each other.

[0047] The frame FR may include a first frame FR1 and a second frame FR2. The first frame FR1 and the second frame FR2 may include materials different from each other. For example, the first frame FR1 may include a metal (e.g., aluminum), and the second frame FR2 may include a plastic (e.g., PE, PP, PS, or PVC). However, the inventive concept is not limited to the materials discussed above. For example, the first frame FR1 and the second frame FR2 may be formed of the same plastic as each other to constitute a single frame FR.

[0048] The first frame FR1 may include a first extension portion EP1 and a second extension portion EP2 extending parallel to the second direction D2. The first frame FR1 may include a third extension portion EP3 and a fourth extension portion EP4 extending parallel to the first direction D1. The third extension portion EP3 may connect a first end of the first extension portion EP1 to a first end of the second extension portion EP2. The fourth extension portion EP4 may connect a second end of the first extension portion EP1 to a second end of the second extension portion EP2. The second end of the first extension portion EP1 may be opposite to the first end of the first extension portion EP1, and the second end of the second extension portion EP2 may be opposite to the first end of the second extension portion EP2. When viewed in a plan view, the first frame FR1 may have a quadrilateral including four sides.

[0049] The first extension portion EP1 may have an outer sidewall SWe whose shape is curved. The flexible printed circuit film FPC may cover the outer sidewall SWe of the first extension portion EP1. For example, the flexible printed circuit film FPC may be bent along the outer sidewall SWe of the first extension portion EP1.

[0050] The first extension portion EP1 may have a first height H1 in the third direction D3, and the second extension portion EP2 may have a second height H2 in the third direction D3. The first height H1 and the second height H2 may be substantially the same as each other. For example, the top surface TO1 of the first extension portion EP1 may be at a level substantially the same as the top surface TO2 of the second extension portion EP2. In addition, the bottom surface BO1 of the first extension portion EP1 may be at a level substantially the same as the bottom surface BO2 of the second extension portion EP2.

[0051] The third extension portion EP3 may have a third height H3 in the third direction D3, and the fourth extension portion EP4 may have a fourth height H4 in the third direction D3. The third height H3 and the fourth height H4 may be substantially the same as each other. Each of the third height H3 and the fourth height H4 may be less than each of the first height H1 and the second height H2. The level at which the bottom surfaces BO3 and BO4 of the third extension portion EP3 and the fourth extension portion EP4 are located may be substantially the same as the level of the bottom surfaces BO1 and BO2 of the first extension portion EP1 and the second extension portion EP2. The top surfaces TO3 and TO4 of the third extension portion EP3 and the fourth extension portion EP4 may be lower than the top surfaces TO1 and TO2 of the first extension portion EP1 and the second extension portion EP2. For example, the third extension portion EP3 and the fourth extension portion EP4 may connect the bottom surface BO1 of the first extension portion EP1 to the bottom surface BO2 of the second extension portion EP2.

[0052] The first package substrate PS1 may be disposed on and in contact with the bottom surfaces BO1, BO2, BO3, and BO4 of the first extension EP1, the second extension EP2, the third extension EP3, and the fourth extension EP4. The second package substrate PS2 may be disposed on and in contact with the top surfaces TO1 and TO2 of the first extension EP1 and the second extension EP2. Since the height (e.g., H3 and H4) of each of the third extension EP3 and the fourth extension EP4 is less than the height (e.g., H1 and H2) of each of the first extension EP1 and the second extension EP2, the second package substrate PS2 may be vertically spaced apart from the top surfaces TO3 and TO4 of the third extension EP3 and the fourth extension EP4.

[0053] The first opening OP1 may be defined by the first extension EP1, the second extension EP2, the third extension EP3, and the second package substrate PS2. The second opening OP2 may be defined by the first extension EP1, the second extension EP2, the fourth extension EP4, and the second package substrate PS2. For example, since the second package substrate PS2 is vertically spaced apart from the third extension EP3 and the fourth extension EP4, the first opening OP1 and the second opening OP2 may exist.

[0054] The first opening OP1 and the second opening OP2 may expose the first memory chip MC1 mounted on the first package substrate PS1, and may also expose the second memory chip MC2 mounted on the second package substrate PS2. Since the first memory chip MC1 and the second memory chip MC2 are exposed, airflow may allow heat to radiate from the first memory chip MC1 and the second memory chip MC2. For example, the first opening OP1 may be adjacent to the plate PL formed with the air hole AH, and the second opening OP2 may be adjacent to the first recess RS1. Air may flow unidirectionally between the first recess RS1 and the air hole AH. Air may flow between the first opening OP1 and the second opening OP2. The first opening OP1 and the second opening OP2 may receive and discharge heat generated from the first memory chip MC1 and the second memory chip MC2 to the outside. In other words, heat may be dissipated to the outside of the memory device via the first opening OP1 and the second opening OP2.

[0055] The second frame FR2 may include second hooks HO2 protruding vertically. One or more second hooks HO2 may be coupled to the first package substrate PS1, and thus the first package substrate PS1 may be fixed to the frame FR. The remaining second hooks HO2 may be coupled to the second package substrate PS2, and thus the second package substrate PS2 may be fixed to the frame FR.

[0056] As described above, the second frame FR2 may be formed of elastic plastic. Therefore, when the first package substrate PS1 and the second package substrate PS2 are fixed on the frame FR, the second hook HO2 may be elastically deformed to be easily coupled to the first package substrate PS1 and the second package substrate PS2. The first frame FR1 may be formed of a metal having excellent thermal conductivity. Therefore, heat may be discharged outwardly from the first memory chip MC1 and the second memory chip MC2 at high speed.

[0057] The first frame FR1 may include a recessed fourth recess RS4 (or fourth recess), and the second frame FR2 may include a recessed fifth recess RS5 (or fifth recess). The fourth recess RS4 and the fifth recess RS5 may engage with the column PIP of the first fastening part FAP1. The first package substrate PS1 may be disposed on the top surface of the base BSP of the first fastening part FAP1. Therefore, the first package substrate PS1 may directly contact the base BSP of the first fastening part FAP1. As described above, the capacitor CAP may be disposed on and in direct contact with the pad PAD on the bottom BOP of the first housing CAS1. The pad PAD may include a buffer material that protects the capacitor CAP from external influences.

[0058] Return to reference Figure 2B As shown, the second housing CAS2 may have a panel shape including four sides. The second housing CAS2 may have a bottom surface including a recessed portion DR. The recessed portion DR may be disposed at a position corresponding to the position of the capacitor CAP. The second housing CAS2 may be disposed on the first housing CAS1, and the capacitor CAP of the memory module MM may have an upper portion inserted into the recessed portion DR of the second housing CAS2.

[0059] The second housing CAS2 may include a protruding side wall PSW protruding vertically from one side of the second housing CAS2. The protruding side wall PSW may engage with the second recess RS2 of the first housing CAS1. When the protruding side wall PSW engages with the second recess RS2, the first recess RS2 of the first housing CAS1 may expose the connector CNE to the outside.

[0060] The second shell CAS2 may include a second fastening part FAP2. The second fastening part FAP2 may be located at a position corresponding to the position of the first fastening part FAP1. Each second fastening part FAP2 may include a through hole TH through which a screw SC passes. The through hole TH may be spatially connected to a screw hole SCH in a column PIP of the first fastening part FAP1. When the screw SC is inserted into the through hole TH of the second fastening part FAP2 and into the screw hole SCH of the first fastening part FAP1, the second shell CAS2 may be fixed to the first shell CAS1.

[0061] Figure 8 A perspective view of a frame of a memory module according to an exemplary embodiment of the present invention is shown. Figure 5 , Figure 6 and Figure 7 Detailed description of elements similar to those discussed.

[0062] Reference Figure 6 , Figure 7 and Figure 8 , the frame FR may include a board structure (board) BOA connected to the upper portion of the second extension portion EP2 and a thermal interface film TIM on one surface of the board structure BOA. For example, the thermal interface film TIM may contact the first memory chip MC1 of the first memory package MPK1 disposed on the frame FR. In this case, the thermal interface film TIM may be disposed between the board structure BOA and the bottom surface of the frame FR.

[0063] The thermal interface film TIM may have a relatively high thermal conductivity. For example, the thermal interface film TIM may include particles with high thermal conductivity. The thermal interface film TIM may discharge heat from the first memory chip MC1 to the outside at a high speed.

[0064] According to an exemplary embodiment of the inventive concept, the memory device can be configured so that the housing can be coupled to a plate having an air hole through which heat is discharged from the inside of the housing to the outside. In this case, a wing having a curved or curved shape defining an air hole can be easily provided.

[0065] According to another exemplary embodiment of the inventive concept, a frame between memory packages may define an opening exposing the memory chip. The opening may allow heat to be radiated outward from the memory chip.

[0066] While the inventive concept has been described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the inventive concept as set forth in the following claims.

Claims

1. A solid state drive comprising: a first shell; a second housing, which is on the first housing; a memory module in the interior space between the first housing and the second housing; as well as a plate between the first shell and the second shell and disposed in the recess of the first shell and including protrusions extending along opposite side walls and a bottom surface thereof, wherein the side wall portion of the first shell is recessed toward the bottom of the first shell to define the recess, the first shell includes a guide portion formed along the recess, the guide portion is configured to receive the protrusion of the plate, so that the plate is slidably engaged with the first shell, wherein the plate comprises an air hole between the first wing and the second wing, Wherein, the memory module comprises: a first flash memory package; a second flash memory package on the first flash memory package; and a frame between the first flash memory package and the second flash memory package, The framework includes: A first extending portion extending along a first direction; and a second extending portion extending in a second direction intersecting the first direction, and Wherein, the height of the first extending portion is greater than the height of the second extending portion.

2. The solid-state drive according to claim 1, wherein: Each of the first flash memory package and the second flash memory package comprises: a package substrate; and a flash memory chip mounted on the package substrate, wherein the package substrate of the first flash memory package is disposed on the first extension portion and the second extension portion, and The package substrate of the second flash memory package is disposed on the first extension portion and is spaced apart from the second extension portion.

3. The solid-state drive according to claim 2, wherein: The flash memory chips of the first flash memory package and the flash memory chips of the second flash memory package are exposed through an opening between the second extension and a package substrate of the second flash memory package.

4. The solid-state drive according to claim 3, wherein: The air hole is adjacent to the opening.

5. The solid-state drive according to claim 1, wherein: The first extending portion includes a pair of first extending portions extending parallel to the first direction, the second extending portion includes a pair of second extending portions extending parallel to the second direction, and each of the pair of second extending portions connects the pair of first extending portions to each other.

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