Display module repair lamp digging method and display module repair method

Abstract

The present invention discloses a method for repairing and removing lamps from a display module. The display module includes a substrate, a plurality of packaging bodies mounted on the substrate, and a packaging glue encapsulated on the packaging bodies. The substrate has a soldering pad, and the packaging body is mounted on the substrate and the electrodes are welded to the soldering pad. The method includes: obtaining preset position information of the packaging body to be removed; cutting at least part of the packaging glue at the location of the packaging body according to the position information to visually reveal the packaging area boundary of the packaging body, and judging the position of the boundary of the packaging area; removing the packaging glue along the packaging area boundary to completely expose the packaging body; and removing the packaging body. Compared with the prior art, the present invention first detects and determines the actual boundary position of the packaging body to be removed in real time, and then digs the packaging glue around the actual boundary position, so that the dug-out gap is small in size and easy to repair, and the optical impact on the display module after repair is small. The present invention also discloses a method for repairing a display module.

Description

Technical Field

[0001] The present invention relates to the manufacture of a display module, and in particular to the repair of a lamp of a display module. Background Art

[0002] LED displays typically consist of a light board, several LED lamps mounted on the board, a transparent encapsulation layer encapsulating the lamps, an ink layer applied to the encapsulation layer, and a transparent protective layer formed on the ink layer. Before an LED display leaves the factory, the LED lamps encapsulated in the transparent encapsulation glue on the light board are inspected for compliance, including whether they are too dim or misaligned. If any defects are found, the display will require repair.

[0003] In the prior art, when repairing a display module, the location of the defective pixel is first detected, the original encapsulant is then removed, and the LED chip at the defective pixel location is dug out. After removal, a new chip is placed in its place, soldered, and then re-encapsulated with encapsulant. In this method, because the encapsulant on the lamp itself and the encapsulant on the lamp are generally made of the same material, it is difficult to remove the encapsulant. Therefore, a display module repair method that solves this problem is needed. Summary of the Invention

[0004] The purpose of the present invention is to provide a display module repair lamp digging method and a display module repair method, wherein the gap dug out of the packaging glue before digging out the lamp beads is small in size and easy to repair.

[0005] In order to achieve the above-mentioned objectives, the present invention discloses a method for repairing and removing lamps from a display module, wherein the display module includes a substrate, a plurality of packaging bodies mounted on the substrate, and packaging glue encapsulated on the packaging bodies, the substrate having a soldering pad, the packaging body being mounted on the substrate and the electrode being welded to the soldering pad, comprising: step one, obtaining preset position information of the packaging body to be removed; step two, cutting at least part of the packaging glue at the position of the packaging body according to the position information to visually reveal the packaging area boundary of the packaging body, and determining the position of the packaging area boundary; step three, removing the packaging glue along the packaging area boundary to completely expose the packaging body; and step four, removing the packaging body.

[0006] Compared with the prior art, the present invention first detects and determines the actual boundary position of the package to be dug in real time, and then digs the packaging glue around the actual boundary position, so that the dug gap is small in size and easy to repair, and the optical impact on the display module after repair is small.

[0007] Preferably, the packaging glue includes a transparent glue layer located at the bottom layer and a black glue layer provided above the transparent glue layer, the step one also includes: obtaining preset position information of the packaging body to be dug, the step two includes: determining a first cutting range based on the position information of the packaging body, the first cutting range being larger than the packaging area of ​​the packaging body, cutting the black glue layer according to the first cutting range to expose the transparent glue layer within the first cutting range, and the boundary of the packaging area being visually revealed at the first cutting range, and using a camera to scan the first cutting range to determine the boundary position of the packaging area of ​​the packaging body.

[0008] Preferably, a silk screen pattern is formed around the pad, and in the step 2: a camera is used to scan an image containing the pad position, and the position covered by the silk screen is determined based on the silk screen pattern in the image to calculate the boundary position of the packaging area of ​​the package body.

[0009] Preferably, the packaging glue is packaging black glue, and the step 2 includes: controlling the cutting device to cut the packaging black glue at the position of the main body of the packaging body according to the position information of the packaging body to expose a portion of the packaging body, cutting the packaging glue along a preset direction according to the position information, and simultaneously using a camera to scan the cut image to search for the packaging area boundary of the packaging body, thereby obtaining the packaging area boundary position.

[0010] Specifically, the preset direction is determined according to the position of the pad on the substrate relative to the position of the package body.

[0011] Preferably, the laser cutting device burns the packaging glue on the display module through a laser head to cut or eliminate the packaging glue.

[0012] Preferably, the step four comprises: heating the solder on the four pads of the package body, and removing the package body after the solder is melted.

[0013] Specifically, the four pads are heated simultaneously to melt the solder.

[0014] Specifically, a heating head is used to align with one of the pads, and the heating head is used to heat to melt the solder on the pad. After heating for a preset time to melt the solder on the pad, the package body or the heating head is controlled to rotate around the center of the package body so that the heating head is aligned with the next pad, and the heating head is controlled to heat the next pad to melt the solder on the next pad until the solder on the four pads is melted.

[0015] Specifically, a heating head is used to align with the pads exposed from the periphery of the package body to heat and melt the solder on the pads; or a heating head is used to align with the solder between the package body and the pads from the lower side of the package body to heat and melt the solder.

[0016] The present invention also discloses a display module repair method, wherein the display module includes a substrate, a plurality of packaging bodies mounted on the substrate, and packaging glue encapsulated on the packaging bodies, comprising: detecting a faulty packaging body on the display module, and digging out the faulty packaging body using the display module repair lamp digging method described above; filling the gap formed after removing the packaging glue along the boundary of the packaging area with packaging glue and curing the gap to fill the gap. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 4 is a flow chart of a display module repair method according to a first embodiment of the present invention.

[0018] Figure 2 It is a structural diagram of the display module.

[0019] Figure 3 1 is a schematic diagram of the display module repair method after cutting the first cutting range in step S13 in the first embodiment of the present invention.

[0020] Figure 4 1 is a schematic diagram of the steps of the display module repair method in the first embodiment of the present invention.

[0021] Figure 5 yes Figure 4 A partial enlarged view of .

[0022] Figure 6 FIG. 4 is a flow chart of a display module repair method according to a second embodiment of the present invention.

[0023] Figure 7 1 is a schematic diagram of the steps of a display module repair method according to a second embodiment of the present invention.

[0024] Figure 8 yes Figure 7 A partial enlarged view of .

[0025] Figure 9 FIG. 1 is a schematic diagram of some steps of a display module repair method according to a second embodiment of the present invention. DETAILED DESCRIPTION

[0026] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the embodiments and the accompanying drawings.

[0027] refer to Figure 1 and Figure 4, which is the first embodiment of the present invention, discloses a display module repair method, referring to Figure 2 and Figure 3 The display module includes a substrate 11, a plurality of packaging bodies 12 mounted on the substrate 11, and a packaging glue 13 encapsulated on the packaging bodies 12. Figure 1 and Figure 4 The display module repair method includes steps S11 to S16.

[0028] The package body 12 contains a lamp bead, and the package body 12 is soldered to the solder pad 15 of the substrate through solder 14 .

[0029] refer to Figure 4 In (a), in this embodiment, the packaging glue 13 includes a transparent glue layer 131 located at the bottom and a black glue layer 132 located above the transparent glue layer 131 .

[0030] Step S11 , detecting a faulty package on the display module.

[0031] Step S12: obtaining the preset position information of the package body 12 to be excavated.

[0032] Step S13, reference Figure 3 and Figure 4 In (b), at least a portion of the packaging adhesive at the location of the packaging body 12 is cut according to the position information to visually reveal the packaging area boundary of the packaging body 12 and determine the location of the packaging area boundary.

[0033] Preferably, in one embodiment, the preset position information and size information of the package 12 to be excavated are obtained in step S12. In step S13, the first cutting range 133 (such as Figure 4 b and Figure 3 As shown, the first cutting range 133 is larger than the packaging area of ​​the package body 12. The black adhesive layer 132 is cut according to the first cutting range 133 to expose the transparent adhesive layer 131 within the first cutting range 133. The boundary of the packaging area is then visually revealed at the first cutting range 133. The first cutting range 133 is scanned with a camera to determine the boundary of the packaging area of ​​the package body 12. The first cutting range 133 is fixed in size and is determined based on the size of the package body 12, with the position of the package body 12 to be excavated as the center. The first cutting range 133 is larger than the size of the package body 12. In this embodiment, the size of the first cutting range 133 can be determined by adding a preset value to the size of the package body 12. The preset value is determined by a technician based on experience or based on a preset spacing between adjacent package bodies 12.

[0034] Without limitation, when the size of the package body in the display module is fixed, in another embodiment, in step 12, only the preset position information of the package body 12 to be excavated is obtained. In step S13, the size and position of the first cutting range 133 are obtained only based on the preset position information of the package body 12 and the size pre-stored in the system: the first cutting range 133 of a fixed size is directly determined with the package body 12 to be excavated as the center. The first cutting range 133 is larger than the size of the package body 12. The size of the first cutting range 133 can be determined directly by technicians based on the size of the package body 12 in the display module and the spacing between adjacent packages, or it can be a safe and relatively small cutting range directly determined by technicians based on their experience.

[0035] Preferably, in another preferred embodiment, in step S12, the preset position information of the package 12 to be dug, the position of the adjacent package and the size information of the package to be dug are obtained. In step S13, the first cutting range is determined by the position of the package to be dug, the position of the adjacent package and the size of the package to be dug. For example, the size of the package is 0.62mm*0.68mm, and the distance between the center position of the package to be dug and the center position of the adjacent package is calculated to be 1mm based on the position of the package to be dug and the position of the adjacent package (this distance is the installation position coordinate distance, not the spacing between packages). The first cutting range is a 0.8mm*0.8mm window size centered on the coordinates of the position point of the package to be dug, and the boundary of the window is parallel to the boundary of the ideal package to be dug. This solution makes the window size of the first cutting range 133 more accurate, will not be set too large, and can be used for display modules with different sizes and spacings of packages 12 on the display module. The first cutting range 133 is larger than the size difference of the package bodies 12 and is determined by the preset spacing between adjacent package bodies 12 , preferably the center line of the gap between the ideal installation positions of the adjacent package bodies.

[0036] Better, reference Figure 3 , a silk screen pattern 151 is formed around the pad 15, and in step S13: a camera is used to scan an image containing the position of the pad 15, and the position where the silk screen is covered is determined based on the silk screen pattern 151 in the image to calculate the packaging area boundary of the package 12. Among them, the coordinate point of the position where the silk screen disappears (the area covered by the package body) is obtained, and the adjacent coordinate points are connected in sequence to obtain a connection line within a preset angle (for example, 20 degrees) with one of the preset X-axis direction and Y-axis direction as the packaging area boundary line, and the packaging area boundary line is extended and intersected to obtain the packaging area boundary of the package 12. Of course, the method of calculating the packaging area boundary line based on the coordinate point of the position of the small silk screen error is not limited to this embodiment. In this embodiment, the preset X-axis direction and Y-axis direction are the directions of the ideal packaging area boundary line of the package 12 determined with reference to the silk screen pattern 151.

[0037] In step S14, the packaging glue 13 is removed along the boundary of the packaging area to form a notch 134 to completely expose the packaging body 12. At this time, a notch 134 is formed on the packaging glue 13 to expose the packaging body 12.

[0038] In this embodiment, the laser cutting device burns the packaging glue 13 on the display module through a laser head to cut or eliminate the packaging glue 13 , thereby removing the packaging glue 13 .

[0039] Step S15, reference Figure 4 In (d) and (e), the package body 12 is removed.

[0040] In this embodiment, the gap 134 formed after removing the packaging glue 13 along the edge of the packaging area is slightly larger than the packaging body 12, and the pad 15 is made relatively large. Therefore, after the packaging glue is removed to form the gap 134, part of the pad 15 will be exposed at the gap.

[0041] refer to Figure 5 In (c) and (d), the heating head is controlled to heat the solder 14 on the four pads 15 of the package body 12, and after the solder 14 melts (refer to Figure 5 (d)), remove the package 12 (refer to Figure 5 (e) in the figure).

[0042] In a preferred embodiment, the four solder pads 15 are heated simultaneously to melt the solder 14 .

[0043] In another preferred embodiment, a heating head is used to align with one of the pads 15, and the heating head is used to heat to melt the solder 14 on the pad 15. After heating for a preset time to melt the solder 14 on the pad 15, the package body 12 or the heating head is controlled to rotate around the center of the package body 12 so that the heating head is aligned with the next pad 15, and the heating head is controlled to heat the next pad 15 to melt the solder 14 on the next pad 15 until the solder 14 on the four pads 15 are melted.

[0044] The heating head can be used to align with the pads 15 exposed from around the package body 12 to heat and melt the solder 14 , or the heating head can be used to align with the solder 14 between the package body 12 and the pads 15 from the lower side of the package body 12 to heat and melt the solder 14 .

[0045] In step S13, the position of the uncovered pad 15 is determined based on the silk screen pattern 151 in the image. In step S15, the heating head is controlled to heat the solder at the uncovered and exposed position of the pad.

[0046] Step S16 , filling the gap 134 formed after the packaging glue 13 is removed along the boundary of the packaging area with packaging glue and curing the packaging glue to fill the gap 134 .

[0047] Compared with the prior art, this embodiment digs out the package body 12 on the display module through the above steps S12 to S15 so that the shape of the gap 134 matches the package area boundary of the package body 12 and the area of ​​the gap is not too large.

[0048] refer to Figures 6 to 9 In a second embodiment of the present invention, a display module repair method is disclosed. Figure 7 The display module includes a PC,11, a plurality of packages 12 mounted on the substrate 11, and a packaging glue 23 encapsulated on the packages 12. Figure 6 and Figure 7 The display module repair method includes steps S11 to S16.

[0049] In this embodiment, the packaging glue 23 is a packaging black glue 23 .

[0050] Step S11 , detecting a faulty package on the display module.

[0051] Step S12: obtaining the preset position information of the package body 12 to be excavated.

[0052] The control system can be used to coordinate with the driver ICs of each package within the display module to detect open and broken circuits in the package mounting circuit within the display module, thereby determining the coordinates of the problematic pixel points. This allows the faulty package and its location information to be determined based on the reference points printed on the display module. In another embodiment, the display module can be illuminated and then controlled to illuminate according to a preset program. A camera can be used to scan the corresponding light image to identify missing pixel color, incorrect brightness, or incorrect mounting position, thereby locating the faulty package and then determining the package's location information based on the reference points marked on the display module.

[0053] In step S13a, at least a portion of the packaging adhesive 23 at the location of the packaging body 12 is cut according to the position information to visually reveal the packaging area boundary of the packaging body 23, and a camera is used to scan and determine the location of the packaging area boundary.

[0054] Among them, reference Figure 7 (b) to (c) of Figure 9 Step S13a specifically includes step S131a and step S132a.

[0055] Step S131a: Reference Figure 9Based on the position information of the package body 12, the cutting device is controlled to cut the encapsulating black glue 23 at the position of the main body of the package body 12 to form a small hole 230, and the package body 12 is partially exposed at the small hole 230. In this embodiment, the center position of the package body 12 is obtained based on the pre-stored position information of the package body 12 in the system, and the encapsulating black glue 23 at the center position of the package body 12 is cut to ensure that the package body 12 is exposed at this position.

[0056] Step S132a: Reference Figure 7 (b) and Figure 9 , the packaging glue 23 is cut along a preset direction according to the position information to form a cutting slit 231, and the cutting slit is scanned by a camera to obtain an image after cutting, and the packaging area boundary of the packaging body 12 is searched in the image (the BT substrate of the packaging body 12 will be exposed in the cutting slit. In this embodiment, the packaging area boundary is identified by the BT substrate of the packaging body 12), thereby obtaining the boundary of the packaging area.

[0057] The preset position is based on the X-axis coordinate line and Y-axis coordinate system established along the ideal direction of the package body 12 boundary in the position information pre-stored in the system. In this embodiment, the boundary line of the package body 12 is rectangular. Therefore, when cutting the encapsulation glue 23 along the X-axis coordinate line and the Y-axis coordinate system, the corresponding Y-axis boundary and Y-axis boundary will inevitably be passed. The actual package area boundary of the package body 12 is calculated using the two parallel Y-axis boundary coordinates and the two parallel X-axis boundary coordinates, thereby obtaining the boundary of the package area. The boundary coordinate can be a point coordinate or a line coordinate, depending on the width of the cutting slit 231 and the scanning accuracy of the camera. If the boundary coordinate is a line coordinate, only the line connecting the four line coordinates is calculated to obtain the position information of the package area boundary. If the boundary coordinate is a point coordinate, it is also necessary to calculate the boundary angle of the package body 12 in combination with the preset length and width information of the package body 12 to obtain the position information of the package area boundary.

[0058] Figure 7 and Figure 9 FIG2 is a schematic diagram. In practice, the cutting slit 231 is cut into the package body 12 until the packaging glue of the package body itself is cut through, revealing the BT substrate or other conductive layers in the package body.

[0059] Step S14, reference Figure 7 (c) and Figure 9 The packaging glue 23 is removed along the boundary of the packaging area to completely expose the packaging body 12. At this time, a gap 232 is formed on the packaging glue 23 to expose the packaging body 12.

[0060] In this embodiment, the laser cutting device burns the packaging glue 23 on the display module through a laser head to cut or eliminate the packaging glue 23 , thereby removing the packaging glue 23 .

[0061] In this embodiment, the gap 232 formed after removing the packaging glue 23 along the edge of the packaging area is slightly larger than the package body 12, and the pad 15 is made relatively large. Therefore, after removing the packaging glue to form the gap 232 in this embodiment, a portion of the pad 15 will be exposed at the gap.

[0062] refer to Figure 8 In (c) and (d), the heating head is controlled to heat the solder 14 on the four pads 15 of the package body 12, and after the solder 14 melts (refer to Figure 8 (d)), remove the package 12 (refer to Figure 8 (e) in the figure).

[0063] In a preferred embodiment, the four solder pads 15 are heated simultaneously to melt the solder 14 .

[0064] In another preferred embodiment, a heating head is used to align with one of the pads 15, and the heating head is used to heat to melt the solder 14 on the pad 15. After heating for a preset time to melt the solder 14 on the pad 15, the package body 12 or the heating head is controlled to rotate around the center of the package body 12 so that the heating head is aligned with the next pad 15, and the heating head is controlled to heat the next pad 15 to melt the solder 14 on the next pad 15 until the solder 14 on the four pads 15 are melted.

[0065] The heating head can be used to align with the pads 15 exposed from around the package body 12 to heat and melt the solder 14 , or the heating head can be used to align with the solder 14 between the package body 12 and the pads 15 from the lower side of the package body 12 to heat and melt the solder 14 .

[0066] In which, a silk screen pattern 151 is formed around the soldering pad 15. In step S15, the display module image with the gap 232 dug out is also scanned, and the silk screen pattern is identified in the display module image. The position of the uncovered soldering pad 15 is determined based on the silk screen pattern 151 in the image, and the heating head is controlled to heat the solder at the uncovered and exposed position of the soldering pad.

[0067] Step S16 , filling the gap 232 formed after removing the packaging glue 23 along the boundary of the packaging area with packaging glue and curing the packaging glue to fill the gap 232 .

[0068] Compared with the prior art, this embodiment digs out the package body 12 on the display module through the above steps S12 to S15 so that the shape of the gap 232 matches the package area boundary of the package body 12 and the area of ​​the gap is not too large.

[0069] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope of the present invention.

Claims

1. A method for repairing and removing lamps from a display module, wherein the display module comprises a substrate, a plurality of encapsulation bodies mounted on the substrate, and an encapsulation adhesive encapsulating the encapsulation bodies. The substrate has pads, the encapsulation bodies are mounted on the substrate, and electrodes are welded to the pads. The method is characterized by: include: Step 1: obtaining the preset location information of the package to be excavated; Step 2: cutting at least a portion of the packaging adhesive at the location of the package body according to the position information to visually reveal the package area boundary of the package body and determine the location of the package area boundary; Step 3: removing the packaging glue along the boundary of the packaging area to completely expose the packaging body; Step 4: removing the package; wherein, The packaging glue includes a transparent glue layer at the bottom and a black glue layer provided above the transparent glue layer. The second step includes: determining a first cutting range based on the position information of the packaging body, the first cutting range being larger than the packaging area of ​​the packaging body, cutting the black glue layer based on the first cutting range to expose the transparent glue layer within the first cutting range, with the boundary of the packaging area visually revealed at the first cutting range, and using a camera to scan the first cutting range to determine the boundary position of the packaging area of ​​the packaging body; or The packaging glue is packaging black glue, and the second step includes: controlling the cutting device to cut the packaging black glue at the position of the main body of the packaging body according to the position information of the packaging body to expose a portion of the packaging body, cutting the packaging glue along a preset direction according to the position information, and simultaneously using a camera to scan the cut image to search for the packaging area boundary of the packaging body, thereby obtaining the packaging area boundary position.

2. The display module repair and lamp removal method according to claim 1, wherein: A silk screen pattern is formed around the pad. In the second step: a camera is used to scan an image containing the pad position, and the position covered by the silk screen is determined based on the silk screen pattern in the image to calculate the boundary position of the packaging area of ​​the package.

3. The display module repair and lamp removal method according to claim 1, wherein: The laser cutting device burns the packaging glue on the display module through a laser head to cut or eliminate the packaging glue.

4. The display module repair and lamp removal method according to claim 1, wherein: The fourth step includes: heating the solder on the four pads of the package body, and removing the package body after the solder is melted.

5. The display module repair and lamp removal method according to claim 4, wherein: The four pads are heated simultaneously to melt the solder; or a heating head is used to align with one of the pads, and the heating head is used to heat to melt the solder on the pad. After heating for a preset time to melt the solder on the pad, the package body or the heating head is controlled to rotate around the center of the package body so that the heating head is aligned with the next pad, and the heating head is controlled to heat the next pad to melt the solder on the next pad until the solder on the four pads is melted.

6. The display module repair and lamp removal method according to claim 4, wherein: A heating head is used to align the pads exposed from the periphery of the package body to heat the pads to melt the solder; or a heating head is used to align the solder between the package body and the pads from the side of the lower side of the package body to heat and melt the solder.

7. A display module repair method, wherein the display module includes a substrate, a plurality of packaging bodies mounted on the substrate, and a packaging adhesive encapsulating the packaging bodies, characterized in that: include: Detecting a faulty package on the display module, and digging out the faulty package using the display module repair and lamp digging method according to any one of claims 1 to 6; The gap formed after the packaging glue is removed along the boundary of the packaging area is filled with packaging glue and cured to fill the gap.

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