Flexible printed board cable layout method for microsatellite platforms

Abstract

The application provides a flexible printed board cable layout method for a micro-satellite platform, which comprises: arranging a trace in a three-dimensional model of the satellite to electrically interconnect each single machine on the satellite platform at a low frequency; confirming the trace and length information of the flexible printed board cable; and the following points need to be followed when arranging the flexible printed board cable assembly: the power line and the signal line are arranged separately in the same path, the flexible printed board cable of the whole satellite is designed to provide cable paths for each single machine of the whole satellite, and reliable transmission of power and signals is ensured; reliable grounding of the whole satellite is ensured to optimize the trace of the flexible printed board cable; when the cable wiring needs to be bent, the bending radius requirement of the cable is met to optimize the trace of the flexible printed board cable; and the connection between the single machines is as short as possible, and the current of the whole satellite does not form a large loop to optimize the trace of the flexible printed board cable.

Description

Technical Field

[0001] This invention relates to the field of aerospace technology, and in particular to a method for laying out flexible printed circuit board cables for a microsatellite platform. Background Technology

[0002] Currently, satellite development projects are evolving from single-satellite development to multi-satellite parallel development, and from single-satellite mission execution to constellation-based mission execution. For low-Earth orbit (LEO) internet satellite constellations, broadband internet access services are provided to the ground using satellites operating at altitudes of 200km-2000km, achieving global coverage through multi-satellite networking. The development of satellite constellation models and the continuous expansion of satellite functions have presented numerous challenges to satellite development, including tight deadlines and heavy workloads, placing higher demands on the satellite development process and installation.

[0003] Compared to previous platform satellites, the most significant characteristic of satellite constellations is the need to meet specific requirements such as small size, light weight, low cost, and mass production capability. Conventional wire and cable solutions for electrical interconnections between individual satellite units are no longer adequate for these new demands. Furthermore, the limited space for cable layout in microsatellites necessitates the development of such systems. Therefore, a new technology for low-frequency electrical interconnections between individual units in mass-produced satellite platforms and between individual units in microsatellite platforms is urgently needed. Summary of the Invention

[0004] The purpose of this invention is to provide a flexible printed circuit board cable layout method for microsatellite platforms, so as to solve the problem that existing conventional wires and cables cannot meet the narrow layout space of microsatellites.

[0005] To address the aforementioned technical problems, this invention provides a method for laying out cables on a flexible printed circuit board for a microsatellite platform, comprising:

[0006] The wiring is laid out in the satellite 3D model to enable low-frequency electrical interconnection between the various units on the satellite platform;

[0007] Confirm the cable routing and length information for the flexible printed circuit board;

[0008] The following points should be followed when laying out flexible printed circuit board cable assemblies:

[0009] Within the same path, power lines and signal lines are routed separately to ensure that the flexible printed circuit board cable design of the entire satellite provides cable paths for each individual unit, guaranteeing reliable power and signal transmission; and ensuring reliable grounding of the entire satellite, in order to optimize the routing of the flexible printed circuit board cable.

[0010] When cable routing requires bending, it should meet the bending radius requirements of the cable to optimize the routing of flexible printed circuit board cables.

[0011] The wiring between individual units should be kept as short as possible, and the total current of the satellite should not form a large loop, so as to optimize the routing of the flexible printed circuit board cable.

[0012] Optionally, the flexible printed circuit board cable layout method for the microsatellite platform further includes:

[0013] Determine the signal types and signal connection relationships of the flexible printed circuit board cable, and design the interface data sheet for the connection relationship between individual units;

[0014] After determining the routing path of the flexible printed circuit board (PCB) cable between individual units on the satellite, the length of the PCB cable is determined.

[0015] Optionally, in the aforementioned flexible printed circuit board cable layout method for microsatellite platforms, the layout and wiring on the satellite platform using flexible printed circuit board cables includes:

[0016] Based on the interface data sheet showing the connection relationships between individual machines, design the fabrication diagram for the flexible printed circuit board cable assembly and put it into production;

[0017] Based on the interface data sheet showing the connection relationship between individual machines, the software is used to design the processing drawings for flexible printed circuit board cable assemblies. After verification, production begins.

[0018] Before designing flexible printed circuit board cable assemblies, refer to the current technological capabilities achievable by manufacturers, including:

[0019] The minimum line spacing is 4mil, the minimum line width is 4mil, the minimum pad size is 8mil, the minimum length of the cover film window is ≥5mm, the minimum hole diameter is 0.2mm, the hole diameter tolerance is ±1mil, and the hole position tolerance is ±0.1mm, in order to ensure the manufacturability of the flexible printed circuit board cable assembly.

[0020] Optionally, in the aforementioned flexible printed circuit board cable layout method for microsatellite platforms, one or more flexible printed circuit board cable assemblies provide low-frequency electrical interconnection between the various individual units on the satellite platform; wherein:

[0021] Low-frequency electrical interconnection between individual units on the satellite platform includes the transmission of CAN bus signals, RS422 signals, analog signals, digital signals, LVDS signals, TLK2711 signals, and power signals between the individual units.

[0022] Optionally, in the described flexible printed circuit board cable layout method for microsatellite platforms,

[0023] The flexible printed circuit board cable assembly is made of polyester film or polyimide as a substrate to embed circuits and precision components on a flexible, thin plastic sheet to form a flexible circuit.

[0024] The flexible printed circuit board cable assembly transmits signals and current through copper plating. Both ends of the flexible printed circuit board cable assembly have end connectors, which are printed circuit board type connectors.

[0025] When designing flexible printed circuit board cable assemblies, based on a flexible printed circuit board cable assembly thickness of 0.4mm, and according to the principle that the bending radius should not be less than 10 times the thickness of the flexible printed circuit board cable assembly, the bending radius is set to 4mm.

[0026] Optionally, in the aforementioned flexible printed circuit board cable layout method for microsatellite platforms, the flexible printed circuit board cable assembly also meets the following requirements based on the harsh environmental requirements of aerospace applications:

[0027] The maximum withstand voltage of the flexible printed circuit board cable assembly is 1000V DC.

[0028] The high voltage withstand standard of the end connectors at both ends of the flexible printed circuit board cable assembly is 250V, 600V or 1500V.

[0029] Optionally, in the aforementioned flexible printed circuit board cable layout method for microsatellite platforms, the flexible printed circuit board cables also meet the following requirements based on the stringent environmental requirements of aerospace applications:

[0030] The tolerance to space electron radiation dose is ≥5 mgy (5 × 10). 8 rad);

[0031] Flexible printed circuit board cable assemblies, used as components for interconnecting individual units within the satellite, undergo radiation-resistant hardening treatment.

[0032] Capability to withstand vacuum atomic oxygen irradiation in a specific space environment for a given time; vacuum atomic oxygen irradiation dose tolerance: under atomic oxygen irradiation with an energy of 5 eV, its ablation rate Ey≤5×10 -29 m 3 .

[0033] Optionally, in the aforementioned flexible printed circuit board cable layout method for microsatellite platforms, the flexible printed circuit board cables also meet the following requirements based on the stringent environmental requirements of aerospace applications:

[0034] Vacuum gas escape: Total mass loss (TML) of insulating materials ≤ 1%, condensable volatile matter (CVCM) ≤ 0.1%, so that non-metallic materials and adhesives remain stable in a vacuum environment, preventing the escape of low molecular weight materials and ensuring vacuum gas escape.

[0035] Optionally, in the aforementioned flexible printed circuit board cable layout method for microsatellite platforms, the flexible printed circuit board cables also meet the following requirements based on the stringent environmental requirements of aerospace applications:

[0036] Flexible printed circuit board cables have shielding and anti-interference capabilities, and EMI and EMC electromagnetic interference resistance, so as to reduce interference signals entering the satellite when electrostatic discharge occurs.

[0037] When flexible printed circuit board cable assemblies are used for signal transmission, the transmitted signals include not only conventional ordinary signals, but also high-speed low-voltage differential signals such as LVDS.

[0038] When designing its shielding performance, its flexibility and crack resistance are also designed to prevent tearing and cracking due to external tension.

[0039] In the flexible printed circuit board (PCB) cable layout method for microsatellite platforms provided by this invention, flexible PCB cable assemblies with free bending, winding, and folding characteristics are used to achieve electrical interconnection between individual satellite platform components, including low-speed signal transmission, high-speed signal transmission, and power signal transmission. The flexible PCB cable assemblies can be arbitrarily arranged according to spatial layout requirements and can move and extend arbitrarily in three-dimensional space, thereby achieving integration of component assembly and wire connection, while also possessing flexibility, shielding, and anti-interference performance. This technology can effectively reduce the required volume and solve the problem of cable layout and assembly in the limited three-dimensional space inside a satellite. The application of flexible PCB cable assembly technology can effectively reduce the required volume and weight of spacecraft, which is of great significance for payload control of spacecraft models. Attached Figure Description

[0040] Figure 1 The existing conventional wires and cables cannot meet the spatial requirements of the microsatellite layout;

[0041] Figure 2 This is a schematic diagram of existing conventional wires and cables;

[0042] Figure 3 This is a schematic diagram of a satellite platform single-unit electrical interconnection cable assembly according to an embodiment of the present invention. Detailed Implementation

[0043] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0044] It should be noted that the components in the various figures may be shown exaggeratedly for illustrative purposes and are not necessarily to scale. In each figure, the same reference numerals are used for components that are identical or have the same function.

[0045] In this invention, the various embodiments are merely intended to illustrate the solutions of the invention and should not be construed as limiting.

[0046] In this invention, unless otherwise specified, the quantifiers “a” and “one” do not exclude scenarios involving multiple elements.

[0047] It should also be noted that, in the embodiments of the present invention, only a portion of the components or parts may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of the present invention, necessary components or parts can be added as needed for specific scenarios. Furthermore, unless otherwise stated, features in different embodiments of the present invention can be combined with each other. For example, a feature in the second embodiment can replace a corresponding or functionally identical or similar feature in the first embodiment, and the resulting embodiment will also fall within the scope of disclosure or description of this application.

[0048] It should also be noted that within the scope of this invention, the terms "same", "equal", and "equal to" do not mean that the two values ​​are absolutely equal, but allow for a certain reasonable error. In other words, the terms also cover "substantially the same", "substantially equal", and "substantially equal to".

[0049] Furthermore, the numbering of the steps in the methods of the present invention does not limit the execution order of the method steps. Unless otherwise specified, the method steps may be executed in different orders.

[0050] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, further illustrates the flexible printed circuit board cable layout method for microsatellite platforms proposed in this invention. The advantages and features of this invention will become clearer from the following description and claims. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this invention.

[0051] The purpose of this invention is to provide a flexible printed circuit board cable layout method for microsatellite platforms, so as to solve the problem that existing conventional cables cannot meet the narrow layout space of microsatellites.

[0052] To achieve the above objectives, the present invention provides a flexible printed circuit board cable layout method for a microsatellite platform, comprising: one or more flexible printed circuit board cable assemblies configured to perform low-frequency electrical interconnection between individual units on the satellite platform; wherein: the low-frequency electrical interconnection between individual units on the satellite platform includes: transmission of CAN bus signals, RS422 signals, analog signals, digital signals, LVDS signals, TLK2711 signals and power signals between the individual units.

[0053] After the individual units are installed within the satellite, electrical interconnection between the various subsystem units is usually achieved by laying cables. Commonly used low-frequency cables are silver-plated copper core cross-linked ethylene-tetrafluoroethylene copolymer insulated wires, as detailed in Table 1. The wires in Table 1 all have good resistance to high and low temperatures and radiation resistance.

[0054] Table 1. Main technical specifications of commonly used 22# / 26# low-frequency cables

[0055]

[0056]

[0057] Currently, traditional cable laying, both domestically and internationally, takes place inside satellites, such as... Figure 1 As shown. From Figure 1 It can be clearly seen in the middle:

[0058] (1) Conventional wire and cable bundles are relatively thick after being bundled, with a diameter of about 10mm to 30mm. Moreover, since each wire has an outer insulation layer or even a shielding layer, the mass per unit length is very large, making it difficult to reduce the overall weight of the satellite.

[0059] (2) The total weight of conventional wires and cables accounts for about 3% to 5% of the total weight of the satellite. Since the total weight of the satellite is limited by the launch vehicle's capabilities, the increase in cable weight will not only increase the launch cost of the launch vehicle, but also reduce the weight of the satellite's payload.

[0060] (3) Laying thicker cable bundles in the three-dimensional space inside a satellite presents various unfavorable limitations, especially for microsatellites where the space for cable layout inside the satellite is limited.

[0061] (4) The installation and fixation of thicker cable bundles inside the satellite body has various limitations, which is not conducive to the rapid and mass assembly of the satellite, increases the research and development and production cycle, and makes it impossible to reduce the cost of the satellite on a large scale. It is also very unfavorable for competing with foreign projects in the international market.

[0062] This invention designs a technology for electrical interconnection between individual satellite platform units, namely, using flexible printed circuit board cable assemblies, and in particular, designs an application of flexible printed circuit board cable assemblies on satellite platforms.

[0063] The solution proposed in this invention addresses the following problems of the prior art:

[0064] (1) To address the issue that conventional wire and cable bundles are relatively thick and have a large mass per unit length after bundling, flexible printed circuit board cable assemblies have thin and flat conductor cross-sections, reducing wire dimensions and making the overall system structure more compact and reasonable, thus reducing the assembly volume. Under the same current carrying capacity, its weight can be reduced, thereby reducing the weight of the electrical transmission medium between individual subsystems;

[0065] (2) There are limitations to the conventional laying of wires and cables in the three-dimensional space inside a satellite, such as... Figure 1As shown, especially for microsatellites with numerous individual components and limited cable routing space, flexible printed circuit board cable assemblies can achieve free bending, winding, and folding of circuits. They can be arranged arbitrarily according to spatial layout requirements and can move and stretch arbitrarily in three-dimensional space, thereby achieving the integration of component assembly and wire connection. This technology can effectively reduce the required volume and weight.

[0066] (3) Conventional wire and cable bundles have various limitations when installed and fixed within a satellite, such as limited wiring locations and insufficient bending radius of thicker cable bundles due to limited local space. These issues hinder rapid and mass production of satellites, increase the R&D and production cycle, and prevent significant cost reduction. Compared to wire and cable, flexible printed circuit board (PCB) cables have thinner and flatter cross-sections, making the single-unit system structure more compact and rational, and reducing assembly volume. Furthermore, once the processing drawings of flexible PCB cable assemblies are approved, all subsequent produced flexible circuits are identical, eliminating errors and rework that often occur during cable assembly, thereby saving development time and costs.

[0067] The flexible printed circuit board (PCB) cable assembly proposed in this invention is used for low-frequency electrical interconnection between individual subsystems on a satellite platform. The low-frequency electrical interconnection between individual units in mass-produced satellites and micro / nano satellite platforms mainly realizes low-speed signal transmission (including CAN bus signals, RS422 signals, analog signals, digital signals, etc.), high-speed signal transmission (including LVDS signals, TLK2711 signals, etc.), and power signal transmission (power supply and distribution) between individual units. The flexible PCB cable is a highly reliable and highly flexible printed circuit made with polyester film or polyimide as the substrate. By embedding circuitry into a flexible, thin plastic sheet, a large number of precision components can be embedded in narrow and limited spaces, thus forming a flexible circuit. The termination connector uses a PCB connector, which can be selected from off-the-shelf products or customized according to specific model requirements.

[0068] Flexible printed circuit board (PCB) cables transmit signals and current through copper plating, the width and thickness of which determine the current carrying capacity. PCB cables offer advantages such as good heat dissipation, solderability, ease of assembly, and lower overall cost. The combination of rigid and flexible design also compensates for the slight limitation of flexible substrates in component load-bearing capacity. Currently, flexible PCB cables are widely used in mobile communications, laptops, computer peripherals, PDAs, digital cameras, and other fields and products.

[0069] When designing flexible printed circuit board (PCB) cables, abrupt changes such as right angles and acute angles are not permitted to prevent internal stress from causing breakage or tearing during bending. The bending radius that a flexible PCB cable can withstand is related to the thickness and number of copper layers. The bending radius is an important performance indicator, especially when bending multi-layer cables. If the bending radius is too small, tensile stress will occur at the outer diameter of the bend, while compressive stress will occur at the inner diameter. If the installation space is confined and the bending angle is large, the multi-layer cable will experience excessive internal stress and be prone to breakage. Therefore, to reduce stress at the bend, based on a design thickness of 0.4mm for the flexible PCB cable, and ensuring that the bending radius is not less than 10 times the cable thickness, a bending radius of 4mm is adopted.

[0070] In response to the stringent environmental requirements of aerospace applications, in addition to the requirement of a small bending radius, flexible printed circuit board cable assemblies also meet the following requirements:

[0071] High voltage withstand: According to GJB7548-2012, the high voltage withstand of printed circuit boards is 1000V DC voltage. For flexible printed circuit board cable assemblies, the high voltage withstand index of connectors also needs to be considered. For example, the high voltage withstand standard of the J29 series printed circuit board connectors from Hangzhou 825 Factory is 1500V (under normal atmospheric conditions), the high voltage withstand standard of the J30J series printed circuit board micro rectangular connectors is 600V (under normal atmospheric conditions), and the high voltage withstand standard of the J63 series printed circuit board ultra-micro rectangular connectors is 250V (under normal atmospheric conditions).

[0072] Tolerance to space electron radiation dose: ≥5 mgy (5 × 10) 8 (rad). As a component for interconnecting individual units within the satellite, flexible printed circuit board cable assemblies should prioritize the selection of devices with strong radiation resistance, and devices with poor radiation resistance should be hardened for radiation resistance when necessary.

[0073] Vacuum gas escape performance: Total mass loss (TML) of insulating materials ≤1%, condensable volatile matter (CVCM) ≤0.1%. In vacuum applications, non-metallic materials, especially adhesives, should remain stable, preventing the escape of low-molecular-weight materials to ensure vacuum gas escape performance.

[0074] Capability to withstand vacuum atomic oxygen irradiation in a specific space environment for a given time; vacuum atomic oxygen irradiation dose tolerance: under atomic oxygen irradiation with an energy of 5 eV, its ablation rate Ey≤5×10 -29 m 3 .

[0075] Shielding and Interference Immunity: It possesses excellent EMI and EMC electromagnetic interference immunity. Good shielding can reduce interference signals entering the satellite's interior when electrostatic discharge occurs. When flexible printed circuit board cable assemblies are used for signal transmission, the transmitted signals include not only conventional signals but also high-speed, low-voltage differential signals such as LVDS. When considering its shielding performance, its flexibility and crack resistance must also be taken into account to prevent tearing and cracking due to external tension.

[0076] The layout and cabling of flexible printed circuit board cable assemblies on satellite platforms mainly involves the following three steps:

[0077] (1) Lay out the wiring in the satellite 3D model and confirm the wiring and length information of the flexible printed circuit board cable.

[0078] The rationality of flexible printed circuit board (PCB) cable routing on a satellite directly impacts the overall weight and assembly operability. Therefore, a reasonable and feasible routing scheme is crucial in the design of flexible PCB cable assemblies. To optimize the routing of flexible PCB cables, the following points should be followed when laying out flexible PCB cable assemblies:

[0079] a) Power lines should be routed separately from signal lines along the same path. Where possible, the flexible printed circuit board cable design of the entire satellite should primarily provide cable paths for each individual unit of the satellite to ensure reliable power and signal transmission and reliable grounding of the entire satellite.

[0080] b) When cable routing encounters bends or other bending requirements, the bending radius of the cable must be fully considered;

[0081] c) Keep the connections between individual units as short as possible and ensure that the total current of the satellite does not form a large loop.

[0082] (2) Determine the signal types and signal connection relationships, and design the interface data sheet for the connection relationship between individual machines.

[0083] After determining the flexible printed circuit board cable routing paths between individual units on the satellite, the cable lengths can be determined. Then, based on the signal types and connection relationships, the interface data sheets for the connections between the individual units can be designed, as shown in Table 2.

[0084] Table 2. Definitions of Signal Transmission Between Partial Units

[0085]

[0086]

[0087] Among them, Y03-X72, W01-X04, W01-X74, F03-X05, F03-X03, and F06-X02, Y03, W01, F03, and F06 are different unit codes, while X72, X04, X74, X05, X03, and X02 are connector codes on the unit. The connectors used in the flexible printed circuit board cable assemblies are printed circuit board type, and can be selected from shelf products or modified and customized according to specific needs.

[0088] (3) Based on the interface data sheet of the connection relationship between individual machines, design the processing diagram of flexible printed circuit board cable assembly and put it into production.

[0089] Based on the interface data sheet showing the connection relationships between individual machines, the processing drawings for flexible printed circuit board (PCB) cable assemblies are designed using software. After verification, production begins. The design of flexible PCB cable assemblies must consider the current technological capabilities achievable by manufacturers, such as minimum line spacing (4mil), minimum line width (4mil), minimum pad size (8mil), minimum cover film window size (length ≥ 5mm), minimum hole diameter (0.2mm), hole diameter tolerance (±1mil), and hole position tolerance (±0.1mm). The manufacturability of the flexible PCB cable assembly should not be neglected in the pursuit of thinness, small size, and lightness.

[0090] The innovation and intended protection points of this invention lie in the use of flexible printed circuit board (PCB) cable assemblies with free bending, winding, and folding characteristics to achieve electrical interconnection between individual satellite platform components, including low-speed signal transmission, high-speed signal transmission, and power signal transmission. The flexible PCB cable assemblies can be arbitrarily arranged according to spatial layout requirements and can move and extend arbitrarily in three-dimensional space, thereby achieving integration of component assembly and wire connection, while also possessing flexibility, shielding, and anti-interference performance. This technology can effectively reduce the required volume and solve the problem of cable layout and assembly in the limited three-dimensional space inside a satellite. The application of flexible PCB cable assembly technology can effectively reduce the required volume and weight of spacecraft, which is of great significance for payload control of spacecraft models.

[0091] In summary, the above embodiments have provided detailed descriptions of different configurations for the flexible printed circuit board cable layout method for microsatellite platforms. Of course, this invention includes, but is not limited to, the configurations listed in the above embodiments. Any modifications made based on the configurations provided in the above embodiments are within the scope of protection of this invention. Those skilled in the art can apply the principles described in the above embodiments to other similar applications.

[0092] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the systems disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple; relevant parts can be referred to the method section.

[0093] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A method of flexible printed board cable layout for a microsatellite platform, characterized in that, Comprise: Layout the cable in the satellite three-dimensional model to connect the low frequency electrical interconnection between the single machine on the satellite platform; Confirm the flexible printed board cable layout and length information; The following points should be followed when the flexible printed board cable assembly layout is carried out: In the same path, the power line and the signal line are separated, and the flexible printed board cable design is kept as much as possible to provide cable passage for each single machine of the whole satellite, to ensure the reliable transmission of power and signal, and to ensure the reliable grounding of the whole satellite, so as to optimize the design of the flexible printed board cable layout; When the cable layout meets the need of bending, the bending radius requirement of the cable is met, so as to optimize the design of the flexible printed board cable layout; The connection between the single machines is as short as possible, and the whole satellite current does not form a large loop, so as to optimize the design of the flexible printed board cable layout; The flexible printed board cable assembly is made of polyester film or polyimide as the base material, and the circuit and precision components are embedded on the bendable and thin plastic sheet to form a bendable flexible circuit; The flexible printed board cable assembly transmits signals and currents through copper cladding, and the two ends of the flexible printed board cable assembly have terminal connectors which adopt printed board connectors; When designing the flexible printed board cable assembly, based on the thickness of the flexible printed board cable assembly being 0.4mm, according to the bending radius being not less than 10 times the thickness of the flexible printed board cable assembly, the bending radius is set to 4mm; According to the harsh environment requirements of spaceflight, the flexible printed board cable assembly also has the following requirements: The maximum withstand voltage of the flexible printed board cable assembly is 1000V DC voltage, The terminal connector at the two ends of the flexible printed board cable assembly has a high voltage resistance standard of 250V, 600V or 1500V; According to the harsh environment requirements of spaceflight, the flexible printed board cable also has the following requirements: The space electronic radiation dose resistance is ≥5MGy; The flexible printed board cable assembly is subjected to anti-radiation reinforcement treatment as a single machine interconnection component in the satellite; The vacuum atomic oxygen irradiation capacity of the space environment in a specific time is the vacuum atomic oxygen irradiation dose: under the atomic oxygen irradiation of 5eV energy, the ablation rate Ey≤5╳10-29m 3 .

2. The microsatellite platform flexible printed board cable layout method of claim 1, wherein, Also include: Determine the signal type and signal connection relationship of the flexible printed board cable, and design the interface data sheet of the single machine connection relationship; After determining the flexible printed board cable layout path between the single machines on the satellite, determine the length of the flexible printed board cable.

3. The microsatellite platform flexible printed board cable layout method of claim 1, wherein, The layout and wiring of the flexible printed board cable on the satellite platform include: According to the interface data sheet of the single machine connection relationship, design the flexible printed board cable assembly processing diagram, and put into production; According to the interface data sheet of the single machine connection relationship, use software to design the flexible printed board cable assembly processing diagram, and after checking that there is no error, put into production; Before designing the flexible printed board cable assembly, refer to the current process level that the manufacturers can achieve, including: The minimum line distance is 4mil, the minimum line width is 4mil, the minimum pad size is 8mil, the minimum size length of the cover film window is ≥5mm, the minimum aperture is 0.2mm, the aperture tolerance is ±1mil, and the hole position tolerance is ±0.1mm, to ensure the manufacturability of the flexible printed board cable assembly.

Images