A pair of headphones

Abstract

This application mainly relates to a headset. The headset includes a movement module, a switch circuit board, and a button assembly. The movement module includes a movement housing and a transducer device disposed in the accommodation cavity of the movement housing. The switch circuit board is connected to the movement housing. The button assembly is disposed opposite to the switch circuit board in a preset pressing direction, and includes an elastic support member and a rigid gasket. The elastic support member is connected to the movement housing, and the rigid gasket is connected to the elastic support member. The elastic support member triggers the tactile switch on the switch circuit board through the rigid gasket under the action of the pressing force applied by the user. Among them, in the non-pressing state, the gap between the rigid gasket and the tactile switch in the pressing direction is greater than the relative amplitude of the button assembly vibrating relative to the movement housing at 1 kHz, making it difficult for the button assembly to collide with the tactile switch on the switch circuit board, which is beneficial to avoiding noise in the headset.

Description

[0001] This application claims the priority of a Chinese patent application with the application number 2021112326083 and the invention title "A Headphone" filed with the Chinese Patent Office on October 22, 2021, and the relevant content is incorporated herein by reference. Technical Field

[0002] This application relates to the technical field of electronic devices, and more particularly to a headphone. Background Art

[0003] Headphones have been widely used in people's daily lives and can be used in conjunction with electronic devices such as mobile phones and computers to provide users with an auditory feast. Among them, according to the working principle of headphones, they can generally be divided into air-conduction headphones and bone-conduction headphones; according to the way users wear headphones, they can generally be divided into over-ear headphones, ear-hook headphones and in-ear headphones; according to the interaction method between headphones and electronic devices, they can generally be divided into wired headphones and wireless headphones. Summary of the Invention

[0004] An embodiment of the present application provides a headphone, which includes a movement module, a switch circuit board and a button assembly. The movement module includes a movement housing and a transducer disposed in the accommodation cavity of the movement housing. The switch circuit board is connected to the movement housing. The button assembly is disposed opposite to the switch circuit board in a preset pressing direction and includes an elastic support member and a rigid gasket. The elastic support member is connected to the movement housing, and the rigid gasket is connected to the elastic support member. The elastic support member triggers the tactile switch on the switch circuit board through the rigid gasket under the action of the pressing force applied by the user. Wherein, in the non-pressing state, the gap between the rigid gasket and the tactile switch in the pressing direction is greater than the relative amplitude of the button assembly vibrating relative to the movement housing at 1 kHz.

[0005] In some embodiments, the gap between the rigid gasket and the tactile switch in the pressing direction is greater than or equal to 0.05 mm and less than or equal to 0.4 mm.

[0006] In some embodiments, the gap between the rigid gasket and the tactile switch in the pressing direction is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.

[0007] In some embodiments, when observed along the pressing direction, the button assembly is arranged in a non-circular structure.

[0008] In some embodiments, the movement module further includes a first vibration transmission sheet, a vibration panel, and a connecting member. The transducer device is suspended in the accommodating cavity of the movement housing through the first vibration transmission sheet. The movement housing includes an inner cylindrical wall, a first end wall, and a second end wall that are respectively connected to two ends of the inner cylindrical wall. The first end wall and the second end wall are respectively located on opposite sides of the transducer device in the vibration direction of the transducer device, and together with the inner cylindrical wall, they enclose an accommodating cavity. The first end wall is provided with a mounting hole. The vibration panel is located outside the movement housing and is used to contact the user's skin. One end of the connecting member is connected to the vibration panel, and the other end extends into the movement housing through the mounting hole and is connected to the transducer device; wherein, when observed along the vibration direction, the area of the vibration panel is larger than the area of the mounting hole, and the area of the mounting hole is larger than the area of the connecting member.

[0009] In some embodiments, the accommodating cavity is only communicated with the outside of the earphone through a channel, and the channel is the gap between the connecting member and the wall surface of the mounting hole;

[0010] Alternatively, the accommodating cavity is only communicated with the outside of the earphone through a first channel and a second channel. The first channel is the gap between the connecting member and the wall surface of the mounting hole, and the second channel is communicated with the outside of the earphone through a sound filter.

[0011] In some embodiments, when observed along the vibration direction, the ratio between the area of the mounting hole and the area of the first end wall is less than or equal to 0.6.

[0012] In some embodiments, when observed along the vibration direction, the ratio between the difference between the area of the mounting hole and the area of the connecting member and the area of the mounting hole is greater than 0 and less than or equal to 0.5.

[0013] In some embodiments, in the vibration direction, the thickness of the vibration panel is between 0.3 mm and 3 mm; and / or, the gap between the vibration panel and the first end wall is between 0.5 mm and 3 mm; and / or, the distance between the side of the first end wall facing away from the second end wall and the side of the second end wall facing away from the first end wall is between 6 mm and 16 mm.

[0014] In some embodiments, the side of the vibration panel facing away from the transducer device includes a skin contact area for contacting the user's skin and an air conduction enhancement area that at least partially does not contact the user's skin. The vibration panel drives the air outside the earphone to vibrate through the air conduction enhancement area to form sound waves.

[0015] In some embodiments, at least part of the air conduction enhancement area is inclined relative to the skin contact area and extends towards the transducer device, and the inclination angle of the air conduction enhancement area relative to the skin contact area is between 0 and 75°;

[0016] and / or, the width of the positive projection of the air conduction enhancement area along the vibration direction is greater than or equal to 1 mm.

[0017] In the above manner, it is difficult for the button assembly to collide with the tactile switch on the switch circuit board, which helps to avoid noise in the earphone. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 FIG. 9 is a schematic structural diagram of an embodiment of an earphone provided by the present application;

[0020] Figure 2 FIG. 13 is a schematic structural diagram of an embodiment of the relative position relationship between a connecting member and a vibration panel in the earphone provided by the present application;

[0021] Figure 3 FIG. 17 is a schematic structural diagram of an embodiment of an earphone provided by the present application;

[0022] Figure 4 FIG. 21 is a schematic structural diagram of an embodiment of an earphone provided by the present application;

[0023] Figure 5 FIG. 25 is a schematic structural diagram of an embodiment of a vibration panel provided by the present application;

[0024] Figure 6 FIG. 29 is a schematic structural diagram of an embodiment of a vibration panel provided by the present application;

[0025] Figure 7 FIG. 33 is a schematic structural diagram of an embodiment of a vibration panel provided by the present application;

[0026] Figure 8 FIG. 37 is a schematic structural diagram of an embodiment of an earphone provided by the present application; <L

[0027] Figure 9 FIG. 41 is a schematic structural diagram of an embodiment of an earphone provided by the present application;

[0028] Figure 10 FIG. 45 is a schematic structural diagram of an embodiment of an earphone provided by the present application;

[0029] Figure 11 FIG. 49 is a schematic structural diagram of an embodiment of an earphone provided by the present application;

[0030] Figure 12 FIG. 53 is a schematic structural diagram of an embodiment of an earphone provided by the present application;

[0031] Figure 13 FIG. 57 is a schematic structural diagram of an embodiment of the earphone provided by the present application in a worn state;

[0032] Figure 14 It is a schematic structural diagram of an embodiment of the earphone provided by this application in a worn state;

[0033] Figure 15 It is a schematic structural diagram of an embodiment of the earphone provided by this application in a worn state;

[0034] Figure 16 It is a schematic structural diagram of an embodiment of the earphone provided by this application in a worn state;

[0035] Figure 17 It is a schematic structural diagram of an embodiment of the earphone provided by this application in a worn state;

[0036] Figure 18 It is a schematic diagram of the mechanical model of the bending deformation of the cantilever beam provided by the application;

[0037] Figure 19 It is a schematic diagram of the mechanical model of an embodiment of the head beam assembly provided by the application;

[0038] Figure 20 is Figure 12 the exploded structural diagram of an embodiment of the earphone in

[0039] Figure 21 is Figure 20 the exploded structural diagram of the earphone from another perspective in

[0040] Figure 22 is Figure 20 the partial enlarged structural diagram of the adapter E1 area in

[0041] Figure 23 is Figure 12 the exploded structural diagram of an embodiment of the earphone in

[0042] Figure 24 is Figure 12 the exploded structural diagram of an embodiment of the earphone in

[0043] Figure 25 It is a schematic structural diagram of an embodiment of the earphone provided by this application in a worn state;

[0044] Figure 26 It is a schematic structural diagram of an embodiment of the earphone provided by this application in a worn state;

[0045] Figure 27 is Figure 12 the cross-sectional structural diagram of an embodiment of the earphone in

[0046] Figure 28 is Figure 27 the cross-sectional structural diagram of the earphone from another perspective in

[0047] Figure 29 is Figure 27 A schematic cross-sectional structure view of another perspective of the in-ear headphone;

[0048] Figure 30 A schematic cross-sectional structure view of an embodiment of the headphone provided by the present application;

[0049] Figure 31 A schematic cross-sectional structure view of an embodiment of the headphone provided by the present application;

[0050] Figure 32 is Figure 12 A schematic cross-sectional structure view of an embodiment of the in-ear headphone;

[0051] Figure 33 is Figure 32 A schematic cross-sectional structure view of another perspective of the in-ear headphone;

[0052] Figure 34 A schematic structure view of an embodiment of the headphone provided by the present application. Detailed implementation manners

[0053] The following further describes the present application in detail with reference to the drawings and embodiments. It should be specifically noted that the following embodiments are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following embodiments are only partial embodiments of the present application rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0054] When "embodiment" is mentioned in the present application, it means that the specific features, structures or characteristics described in combination with the embodiment may be included in at least one embodiment of the present application. Those skilled in the art explicitly and implicitly understand that the embodiments described in the present application can be combined with other embodiments.

[0055] In the present application, the headphone 10 may include a movement module 11. The movement module 11 is configured to at least generate bone conduction sound and contact the user's skin (such as the cheek) in the worn state to allow the external auditory canal of the user's ear to be "open". In other words, when the external auditory canal of the user's ear is open and not blocked / obstructed by the headphone 10, the headphone 10 can also generate air conduction sound, which will be exemplarily described hereinafter. At this time, the sound generated by the headphone 10 may be mainly bone conduction sound and supplemented by air conduction sound, that is, the air conduction sound enhances the bone conduction sound, thereby improving the sound quality of the headphone 10.

[0056] It should be noted that the bone conduction sound described in this application refers to the mechanical vibration generated by the movement module 11 being mainly transmitted through the user's skull and other media, and the air conduction sound described in this application refers to the mechanical vibration generated by the movement module 11 being mainly transmitted through the air and other media.

[0057] Combine Figure 1 The movement module 11 may include a movement housing 111 and a transducer 112 disposed within the housing 100 of the movement housing 111. The transducer 112 is configured to convert electrical signals into mechanical vibrations. The movement module 11 may primarily transmit the mechanical vibrations generated by the transducer 112 via bone conduction, thereby generating bone-conducted sound.

[0058] In some embodiments, in the wearing state, the movement module 11 can be in direct contact with the user's skin through the movement housing 111, that is, the movement module 11 directly transmits the mechanical vibration generated by the transducer 112 through the movement housing 111. In this way, the earphone 10 may not include the first vibration transmitting plate 113, the vibration panel 114 and other structural parts mentioned later. At the same time, the movement housing 111 will also drive the air outside the earphone 10 to vibrate, thereby generating sound leakage. At this time, in order to reduce the sound leakage of the earphone 10, a through hole (which can be defined as a "leakage reduction hole") connecting the accommodating cavity 100 and the outside of the earphone 10 can be opened on the movement housing 111 to allow the sound waves output to the outside of the earphone 10 through the leakage reduction hole and the sound leakage generated by the vibration of the movement housing 111 with the transducer 112 to cancel each other out of phase in the far field (commonly known as "punching to reduce sound leakage").

[0059] In some other embodiments, the movement module 11 may further include a first vibration transmitting plate 113 and a vibration panel 114. The transducer 112 may be suspended in the accommodating cavity 100 through the first vibration transmitting plate 113, and the vibration panel 114 may be at least partially located outside the accommodating cavity of the movement shell 11 and connected to the transducer 112. At this time, in the wearing state, the movement module 11 can contact the user's skin through the vibration panel 114, that is, the movement module 11 transmits the mechanical vibration generated by the transducer 112 through the vibration panel 114. At the same time, due to the presence of the first vibration transmitting plate 113, the mechanical vibration generated by the transducer 112 can be transmitted less or even not to the movement shell 111, so as to avoid the movement shell 111 from driving the air vibration outside the earphone 10 as much as possible, thereby reducing the sound leakage of the earphone 10. Of course, the sound leakage of the earphone 10 can also be further reduced by punching holes to reduce the sound leakage.

[0060] In other embodiments, for example Figure 1, the movement module 11 also transmits the mechanical vibration generated by the transducer 112 through the vibration panel 114. The difference is that one end of the movement housing 111 close to the vibration panel 114 is not an open structure, that is, except for the mounting holes 1111 mentioned later, other parts can be a closed structure. At this time, the movement housing 111 itself can reduce the sound leakage of the earphone 10 based on the acoustic dipole, and it is less necessary or even unnecessary to additionally provide sound leakage reduction holes on the movement housing 111.

[0061] Exemplarily, the movement module 11 may further include a connecting member 115 connecting the vibration panel 114 and the transducer 112. The movement housing 111 is provided with a mounting hole 1111 for mounting the connecting member 115. At this time, the vibration panel 114 is located outside the movement housing 111 to contact the user's skin; one end of the connecting member 115 is connected to the vibration panel 114, and the other end extends into the movement housing 111 through the mounting hole 1111 and is connected to the transducer 112. In this way, even if part of the mechanical vibration generated by the transducer 112 is transmitted to the movement housing 111 through the first vibration transmission piece 113, the phases of the sound leakage generated by the vibration of the first end wall 1113 and the second end wall 1114 following the vibration of the transducer 112 are opposite, and the two can cancel each other out in the far field, thereby reducing the sound leakage of the earphone 10. Based on this, the movement housing 111 can be provided with fewer or even no sound leakage reduction holes, thereby improving the waterproof and dustproof performance of the earphone 10. Preferably, when observed along the vibration direction of the transducer 112, the area of the vibration panel 114 is larger than the area of the mounting hole 1111, and the area of the mounting hole 1111 is larger than the area of the connecting member 115. In this way, it is possible to prevent the mechanical vibration generated by the transducer 112 from being transmitted to the movement housing 111 through the connecting member 115, thereby further reducing the sound leakage of the earphone 10. At this time, the gap between the connecting member 115 and the wall surface of the mounting hole 1111 and the accommodating cavity 100 cooperate to form a Helmholtz resonance cavity, and the resonance frequency of the Helmholtz resonance cavity can be less than or equal to 4 kHz, preferably less than or equal to 2 kHz.

[0062] Exemplarily, the movement housing 111 may include an inner cylindrical wall 1112, a first end wall 1113 and a second end wall 1114 respectively connected to both ends of the inner cylindrical wall 1112. The inner cylindrical wall 1112 is located around the transducer device 112. The first end wall 1113 and the second end wall 1114 are respectively located on opposite sides of the transducer device 112 in the vibration direction of the transducer device 112, and enclose a receiving cavity 100 with the inner cylindrical wall 1112. Among them, in the wearing state, the first end wall 1113 is closer to the user's skin than the second end wall 1114. At this time, the first end wall 1113 is provided with a mounting hole 1111. Of course, in some other embodiments where the requirement for sound leakage reduction is not strict or the implementation of punching for sound leakage reduction, the movement housing 111 may not include the first end wall 1113 and / or the second end wall 1114, and the side of the transducer device 112 facing away from the vibration panel 114 can be protected by other structural members (such as the adapter housing 13 mentioned later). In some other embodiments where the movement module 11 is not provided with the vibration panel 114, the movement housing 111 can be in direct contact with the user's skin through the first end wall 1113.

[0063] In some embodiments, the receiving cavity 100 may be communicated with the outside of the earphone 10 only through the first channel, and the aforementioned first channel is the gap between the connecting member 115 and the wall surface of the mounting hole 1111. In other words, no sound leakage reduction holes are provided on the movement housing 111. At this time, the sound leakage generated by the earphone 10 through the first end wall 1113 and the second end wall 1114 is cancelled out in the far field by anti-phase cancellation for sound leakage reduction. It should be noted that: combined with Figure 8 , when the movement module 11 is provided with a Helmholtz resonance cavity 200, a through hole communicating the receiving cavity 100 with the Helmholtz resonance cavity 200 may be provided on the movement housing 111, and the through hole may be provided on the inner cylindrical wall 1112 and / or the second end wall 1114. At this time, since the Helmholtz resonance cavity 200 is communicated with the receiving cavity 100 only through the aforementioned through hole and is not communicated with the outside of the earphone 10 through other channels, it can still be regarded that the receiving cavity 100 is communicated with the outside of the earphone 10 only through the first channel.

[0064] In some other embodiments where the movement module 11 is provided with a sound filter 300, combined with Figure 9 , the receiving cavity 100 is communicated with the outside of the earphone 10 only through the first channel and the second channel. The aforementioned first channel is the gap between the connecting member 115 and the wall surface of the mounting hole 1111, and the aforementioned second channel is communicated with the outside of the earphone 10 through the sound filter 300. At this time, in addition to the mounting hole 1111, although there is also a through hole on the movement housing 111 that communicates the receiving cavity 100 with the sound filter 300, the function of this through hole is different from that of the sound leakage reduction hole, and the two should not be confused.

[0065] It should be noted that: compared with the movement module 11 directly contacting the user's skin through the movement housing 111, the movement module 11 contacting the user's skin through the vibration panel 114 can achieve a better fit. This is because the first vibration transmission piece 113 has a certain elasticity, and the transducer device 112, the vibration panel 114, etc. are suspended in the accommodation cavity 100 through the first vibration transmission piece 113. In the wearing state, the first vibration transmission piece 113 allows the vibration panel 114 to deflect at a certain angle relative to the movement housing 111 when contacting the user's skin according to the skin contour, so that the vibration panel 114 can fit the user's skin more closely. This is beneficial to reducing the loss of the mechanical vibration of the transducer device 112 transmitted to the user's skull and other media by the vibration panel 114, thereby enhancing the bone conduction sound. Further, when the vibration panel 114 vibrates with the transducer device 112, it will also drive the air outside the earphone 10 to vibrate. The phases on its opposite sides are opposite, and the two can also cancel each other out in the far field in antiphase, thereby reducing the sound leakage of the earphone 10.

[0066] Generally, the resonant frequency f of a structure, the stiffness K of the structure, and the mass m of the structure satisfy the relationship: f ∝ (K / m). Obviously, with the same mass, the greater the stiffness of the structure, the higher its resonant frequency. In addition, the greater the stiffness of the structure, the fewer the higher-order modes during the vibration of the structure, which is beneficial to improving the sound quality. Among them, the stiffness K of the structure is related to factors such as its material (specifically manifested as Young's modulus E) and specific structural form. Generally, the stiffness K of the structure, the Young's modulus E of the material, the thickness t of the structure, and the area S of the structure satisfy the relationship: K ∝ (E·t) / S. Obviously, the smaller the area S of the structure, the greater the stiffness K of the structure; the greater the thickness t of the structure, the greater the stiffness K of the structure. Therefore, increasing the Young's modulus E of the material, increasing the thickness t of the structure, reducing the area S of the structure, or a combination of these methods is beneficial to increasing the stiffness K of the structure, thereby being beneficial to increasing the resonant frequency of the structure and reducing the higher-order modes during the vibration of the structure. Based on this, the Young's modulus of the first end wall 1113 and the second end wall 1114 can be respectively greater than or equal to 2000 Mpa, preferably greater than or equal to 3000 Mpa; and / or, the thicknesses of the first end wall 1113 and the second end wall 1114 can be respectively between 0.3 mm and 3 mm, preferably between 0.5 mm and 2.5 mm; and / or, the areas of the first end wall 1113 and the second end wall 1114 can be respectively between 200 mm 2 and 500 mm 2 , preferably between 300 mm 2 and 400 mm 2between them so that the stiffness of both can be large enough. In this way, the higher-order modes during the vibration of the first end wall 1113 and the second end wall 1114 can be minimized as much as possible, and the resonance frequencies of the sound leakage generated by the two can also be shifted as much as possible to the high-frequency band, for example, greater than or equal to 4 kHz, making the user less sensitive to the sound leakage. Further, the difference in stiffness between the first end wall 1113 and the second end wall 1114 can be small so that the resonance frequencies of the sound leakage generated by the first end wall 1113 and the second end wall 1114 can be as close as possible, and then the two can better cancel each other out in the far field to reduce the sound leakage of the earphone 10. Similarly, the Young's modulus of the vibrating panel 114 can be greater than or equal to 3000 Mpa, preferably greater than or equal to 4000 Mpa; and / or, the thickness of the vibrating panel 114 can be between 0.3 mm and 3 mm, preferably between 0.5 mm and 2.5 mm; and / or, the area of the vibrating panel 114 can be between 130 mm 2 and 400 mm 2 between, preferably between 140 mm 2 and 300 mm 2 between, so that the stiffness of the vibrating panel 114 is large enough, and thus the higher-order modes during the vibration of the vibrating panel 114 can be minimized as much as possible.

[0067] Exemplarily, when observed along the vibration direction of the transducer device 112, the ratio between the area of the mounting hole 1111 and the area of the first end wall 1113 may be less than or equal to 0.6, preferably less than or equal to 0.5. In this way, when the mounting hole 1111 meets the mounting requirements of the connecting member 115, the stiffness of the first end wall 1113 and the stiffness of the second end wall 1114 are as close as possible, so that the resonance frequencies of the sound leakage generated by the first end wall 1113 and the second end wall 1114 are as close as possible. Further, when observed along the vibration direction of the transducer device 112, the ratio between the difference between the area of the mounting hole 1111 and the area of the connecting member 115 and the area of the mounting hole 1111 may be greater than 0 and less than or equal to 0.5, preferably greater than 0 and less than or equal to 0.4. In this way, when the mounting hole 1111 allows the connecting member 115 and the vibration panel 114 to move relative to the movement of the movement housing 111, the gap between the connecting member 115 and the first end wall 1113 is as small as possible, so as to avoid excessive transmission of the sound wave formed by the vibration of the air in the accommodating cavity 100 along with the transducer device 112 through the mounting hole 1111 to the outside of the earphone 10 to form sound leakage, that is, to suppress the sound cavity effect, thereby reducing the sound leakage of the earphone 10. Of course, since the phase of the sound wave transmitted to the outside of the earphone 10 through the mounting hole 1111 may be opposite to the phase of one of the sound leakage generated by the first end wall 1113 and the second end wall 1114, the sound wave transmitted to the outside of the earphone 10 through the mounting hole 1111 can also further adjust the anti-phase cancellation of the sound leakage generated by the first end wall 1113 and the second end wall 1114 in the far field, thereby reducing the sound leakage of the earphone 10.

[0068] Exemplarily, the opening shape of the mounting hole 1111 and the cross-sectional shape of the connecting member 115 can be the same regular shape. For example: the opening shape of the mounting hole 1111 and the cross-sectional shape of the connecting member 115 are corresponding regular polygons. That is, when the cross-sectional shape of the connecting member 115 is a square, a regular hexagon, etc., the opening shape of the mounting hole 1111 also corresponds to a square, a regular hexagon, etc. For another example: the opening shape of the mounting hole 1111 and the cross-sectional shape of the connecting member 115 are corresponding circles, ellipses, etc. Further, the gap between the connecting member 115 and the first end wall 1113 can be greater than 0 and less than or equal to 2 mm, preferably greater than 0 and less than or equal to 1 mm, so that when the mounting hole 1111 allows the connecting member 115 and the vibration panel 114 to move relative to the movement mechanism housing 111, the gap between the connecting member 115 and the first end wall 1113 is as small as possible. Of course, in some other embodiments, the opening shape of the mounting hole 1111 and the cross-sectional shape of the connecting member 115 can also be different regular shapes. For example: when the cross-sectional shape of the connecting member 115 is a regular polygon such as a square or a regular hexagon, the opening shape of the mounting hole 1111 can also correspond to a circle; conversely, when the cross-sectional shape of the connecting member 115 is a circle, the opening shape of the mounting hole 1111 can also correspond to a regular polygon such as a square or a regular hexagon. In some other other embodiments, the opening shape of the mounting hole 1111 and the cross-sectional shape of the connecting member 115 can also be other irregular structural shapes. Among them, in combination with Figure 2 , this application takes the cross-sectional shape of the connecting member 115 as a circle as an example for exemplary illustration; correspondingly, the opening shape of the mounting hole 1111 is also a circle.

[0069] In some embodiments, for example Figure 2 in (a), the number of the connecting members 115 can be one, and the connecting member 115 can be connected to the central region of the vibration panel 114. At this time, the number of the mounting holes 1111 can also be one, and the connecting member 115 is inserted into the mounting hole 1111. In this way, under the same conditions, the communication area between the mounting hole 1111 and the outside of the movement mechanism housing 111 can be minimized, and further, the sound wave formed by the vibration of the air in the accommodation cavity 100 with the transducer device 112 can be maximally suppressed from being transmitted to the outside of the earphone 10 through the mounting hole 1111 to form sound leakage.

[0070] In some other embodiments, for example Figure 2 in (b), the number of the connecting members 115 can be multiple, such as three, four, etc., and multiple connecting members 115 are arranged around the vibration panel 114 parallel to the center line of the vibration direction of the transducer device 112 (for example Figure 2Spaced as shown by O in (b) of the figure. At this time, the number of mounting holes 1111 can also be multiple, and multiple connecting members 115 are respectively connected to the transducer device 112 through a corresponding one of the mounting holes 1111. In this way, it is beneficial to improve the reliability of the connection between the connecting member 115, the vibration panel 114, and the transducer device 112. Further, the centers of the multiple connecting members 115 can fall on the same circle (i.e., be co-circular), and the center of this circle (e.g., Figure 2 as shown by O in (b) of the figure) can fall on the center line of the vibration panel 114 parallel to the vibration direction of the transducer device 112. Among them, the multiple connecting members 115 can be evenly spaced around the center line of the vibration panel 114 parallel to the vibration direction of the transducer device 112.

[0071] In some other embodiments, for example Figure 2 in (c) of the figure, the number of connecting members 115 can be multiple, such as four, five, etc. One of the connecting members 115 is connected to the central area of the vibration panel 114, and the remaining connecting members 115 are spaced around the connecting member 115 located in the central area of the vibration panel 114. At this time, the number of mounting holes 1111 can also be multiple, and multiple connecting members 115 are respectively connected to the transducer device 112 through a corresponding one of the mounting holes 1111. In this way, it is also beneficial to improve the reliability of the connection between the connecting member 115, the vibration panel 114, and the transducer device 112.

[0072] It should be noted that: Compared with Figure 1 , Figure 2 it can be simply regarded as the orthographic projection of the vibration panel 114 and the connecting member 115 along the vibration direction of the transducer device 112.

[0073] Based on the above related descriptions, during the process of the transducer device 112 generating mechanical vibration, the movement mechanism housing 111 (specifically, the first end wall 1113 and the second end wall 1114) and the vibration panel 114 can further form multiple sets of acoustic dipoles, that is, the two with opposite phases cancel each other out, thereby reducing the sound leakage of the earphone 10. Based on this, the absolute value of the difference between the stiffness of the vibration panel 114 and the stiffness of the first end wall 1113 and the ratio of the larger of the stiffness of the vibration panel 114 and the stiffness of the first end wall 1113 can be between 0 and 0.4, preferably between 0 and 0.3; and / or, the absolute value of the difference between the stiffness of the vibration panel and the stiffness of the second end wall and the ratio of the larger of the stiffness of the vibration panel and the stiffness of the second end wall are between between 0 and 0.4, preferably between 0 and 0.3. In this way, the resonance frequency of the sound leakage generated by the vibration panel 114 and the resonance frequency of the sound leakage generated by the first end wall 1113 and / or the second end wall 1114 can be as close as possible, so that the two can better cancel each other out in the far field, thereby reducing the sound leakage of the earphone 10.

[0074] Exemplarily, when observed along the vibration direction of the transducer device 112, the ratio between the area of the vibration panel 114 and the area of the first end wall 1113 may be between 0.3 and 1.6, preferably between 0.5 and 1.2. In other words, after the structure of the movement housing 111 is determined, the areas of the vibration panel 114 and the first end wall 1113 may not differ much, so that the stiffness of the vibration panel 114 is as close as possible to the stiffness of the first end wall 1113. In addition, if the area of the vibration panel 114 is too small, it may affect the transmission of the mechanical vibration generated by the transducer device 112 by the vibration panel 114, thereby affecting the intensity of the bone conduction sound generated by the earphone 10. It may also cause the contact area between the user's skin and the movement module 11 to be too small, resulting in discomfort during wearing and thus affecting the wearing comfort of the earphone 10. If the area of the vibration panel 114 is too large, it may affect the stiffness of the vibration panel 114, thereby affecting the sound quality of the earphone 10. It may also cause the vibration panel 114 to be too affected by the skin contour and difficult to fit closely with the user's skin, thereby affecting the intensity of the bone conduction sound generated by the earphone 10.

[0075] Generally, for a sound dipole, the smaller the distance between the two monopoles with opposite phases, the more obvious the effect of anti-phase cancellation, that is, the smaller the sound pressure in the far field; correspondingly, for the earphone 10, the leakage sound in the far field is also smaller. Of course, considering the structural strength of the vibration panel 114, the structural interference between the vibration panel 114 and the movement housing 111 during the vibration of the transducer device 112, and the space requirements for arranging structural components such as the transducer device 112 in the movement housing 111, it is also difficult for the distance between the two monopoles to be zero. Therefore, in the vibration direction of the transducer device 112, the thickness of the vibration panel 114 may be between 0.3 mm and 3 mm, preferably between 0.5 mm and 2.5 mm. If the thickness is too small, it is not conducive to the vibration panel 114 having sufficient stiffness; and / or, the gap between the vibration panel 114 and the first end wall 1113 may be between 0.5 mm and 3 mm, preferably between 1 mm and 2 mm. If the gap is too small, it is easy for the vibration panel 114 to collide with the movement housing 111 and cause popping; and / or, the distance between the side of the first end wall 1113 facing away from the second end wall 1114 and the side of the second end wall 1114 facing away from the first end wall 1113 may be between 6 mm and 16 mm.

[0076] Combined with Figure 3, the movement module 11 may further include a border 116 connected to an end of the movement housing 111 close to the vibration panel 114. For example, the border 116 is connected to an end of the inner cylinder wall 1112 away from the second end wall 1114. The border 116 can surround the vibration panel 114 to prevent the vibration panel 114 from falling off. Among them, in the non-wearing state, the border 116 is spaced from the vibration panel 114 in a direction perpendicular to the vibration direction of the transducer 112 to prevent the border 116 from hindering the vibration of the vibration panel 114 with the transducer 112; and at least a part of the side of the vibration panel 114 facing away from the transducer 112 protrudes from the side of the border 116 facing away from the transducer 112 in the vibration direction of the transducer 112 to allow the vibration panel 114 to be in close contact with the user's skin, thereby increasing the intensity of the bone conduction sound generated by the earphone 10. Further, in the wearing state, in addition to the vibration panel 114 contacting the user's skin, the border 116 can also contact the user's skin to share part of the pressing force exerted by the movement module 11 on the user's skin, so that the vibration panel 114 can vibrate with the transducer 112, thereby improving the sound quality of the earphone 10, especially in the low frequency band. In other words, the movement module 11 is provided with the border 116, which is beneficial to taking into account the wearing stability, comfort and sound quality. Therefore, the pressing force of the vibration panel 114 on the user's cheek can be less than the pressing force of the head beam assembly 12 mentioned later pressing the movement module 11 against the user's cheek, and the contact area between the vibration panel 114 and the user's cheek can also be less than the contact area between the movement module 11 and the user's cheek. Among them, when the movement module 11 is provided with the border 116, the pressing force of the movement module 11 pressing against the user's cheek can be equal to the sum of the pressing force of the vibration panel 114 on the user's cheek and the pressing force of the border 116 on the user's cheek, and the contact area between the movement module 11 and the user's cheek can be equal to the sum of the contact area between the vibration panel 114 and the user's cheek and the contact area between the border 116 and the user's cheek; when the movement module 11 is not provided with the border 116 and only contacts the user's cheek through the vibration panel 114, the pressing force of the movement module 11 pressing against the user's cheek can be equal to the pressing force of the vibration panel 114 on the user's cheek, and the contact area between the movement module 11 and the user's cheek can be equal to the contact area between the vibration panel 114 and the user's cheek. Based on this, the head beam assembly 12 mentioned later can apply a pressing force between 0.4 N and 0.8 N to press the movement module 11 against the user's cheek, and the pressing force of the vibration panel 114 on the user's cheek can be between 0.1 N and 0.7 N; the contact area between the movement module 11 and the user's cheek can be between 400 mm 2 and 600 mm 2 preferably between 450 mm 2 and 550 mm 2 preferably between 180 mm 2 and 300 mm2 between, preferably between 160 mm 2 and 280 mm 2 therebetween.

[0077] Furthermore, the peripheral edge 116 may be provided with communication holes 1161 for communicating the gap between the vibration panel 114 and the movement housing 111 (such as the first end wall 1113) with the outside of the earphone 10, so that the leakage sound generated by the first end wall 1113 and the leakage sound generated by the second end wall 1114 cancel each other out in antiphase in the far field, so as to better meet the requirements of the earphone 10 for reducing leakage sound. Wherein, the number of the communication holes 1161 may be multiple, for example, a plurality of communication holes 1161 are arranged at intervals around the connecting member 115. In the wearing state, the opening direction of at least one of the communication holes 1161 may be away from the user's head top. For example, the included angle between the opening direction of the communication hole 1161 and the user's vertical axis is between 0 and 10°, so that liquids such as the user's sweat can also flow out through the communication holes 1161, that is, to avoid the retention of sweat and the like in the movement module 11. Of course, the leakage sound generated by the first end wall 1113 may also be transmitted out through the gap between the peripheral edge 116 and the vibration panel 114 in the direction perpendicular to the vibration direction of the transducer 112, and then cancel out the leakage sound generated by the second end wall 1114 in antiphase in the far field.

[0078] Combined with Figure 4 , a soft gasket 117 may also be provided between the vibration panel 114 and the first end wall 1113, and the Rockwell hardness of the soft gasket 117 is less than that of the first vibration transmission piece 113. In this way, the mechanical vibration generated by the transducer 112 is prevented from being transmitted to the movement housing 111 through the soft gasket 117, thereby further reducing the leakage sound of the earphone 10. Wherein, the soft gasket 117 may have adhesiveness, such as foam glue, to connect the vibration panel 114 and the first end wall 1113, and the vibration panel 114 can also be prevented from falling off.

[0079] It should be noted that: the inventor of the present application has found in long-term research that adding the peripheral edge 116 to the movement module 11 is beneficial to the offset of the leakage sound to the mid-high frequency band; while adding the soft gasket 117 to the movement module 11 is beneficial to the offset of the leakage sound to the mid-low frequency band, both of which are beneficial to improving the leakage sound. Further, in the present application, the frequency range corresponding to the low frequency band may be 20 - 150 Hz, the frequency range corresponding to the middle frequency band may be 150 - 5 kHz, and the frequency range corresponding to the high frequency band may be 5k - 20 kHz. Among them, the frequency range corresponding to the mid-low frequency band may be 150 - 500 Hz, and the frequency range corresponding to the mid-high frequency band may be 500 - 5 kHz.

[0080] Combined with Figures 5 to 7, the side of the vibration panel 114 away from the transducer device 112 may include a skin contact area 1141 for contacting the user's skin and an air conduction enhancement area 1142 that is at least partially not in contact with the user's skin. The vibration panel 114 can drive the air outside the earphone 10 to vibrate through the air conduction enhancement area 1142 to form sound waves. In other words, the movement module 11 generates both bone conduction sound and air conduction sound through the vibration panel 114, and the phases of the two are the same, so as to allow the air conduction sound to enhance the bone conduction sound, thereby improving the sound quality of the earphone 10. Among them, the air conduction enhancement area 1142 can be at least partially inclined relative to the skin contact area 1141 and extend toward the transducer device 112, and the inclination angle of the air conduction enhancement area 1142 relative to the skin contact area 1141 (for example Figure 5 and Figure 6 θ) can be between 0 and 75°, preferably between 0 and 60°; and / or, the width of the positive projection of the air conduction enhancement area 1142 along the vibration direction of the transducer 112 (e.g. Figures 5 to 7 The air conduction enhancement area 1142 can be greater than or equal to 1 mm, preferably greater than or equal to 2 mm. In this way, the size of the air conduction enhancement area 1142 is increased, thereby increasing the enhancement effect of air conduction sound on bone conduction sound. Further, the air conduction enhancement area 1142 can be set to a curved surface (for example Figure 5 As shown), it can also be set as a plane (for example Figure 6 shown).

[0081] In some embodiments, for example Figure 5 The air conduction enhancement area 1142 can be tilted entirely relative to the skin contact area 1141 and extend toward the transducer device 112 .

[0082] In some other embodiments, for example Figure 6 , the air conduction enhancement area 1142 can be partially inclined relative to the skin contact area 1141 (ie, θ≠0) and extend toward the transducer 112, and the other part can be spaced apart from the skin contact area 1141 in the vibration direction of the transducer 112, for example, parallel to the skin contact area 1141 (ie, θ=0). Figure 27 When a border 116 is provided on the movement housing 111, when observed along the vibration direction of the transducer device 112, the border 116 can partially overlap with the air conduction enhancement area 1142 and be staggered with the skin contact area 1141, so as to allow the border 116 to stop the vibration panel 114 in the vibration direction of the transducer device 112.

[0083] In other embodiments, for example Figure 7, in the worn state, the air conduction enhancement area 1142 at least partially points to the entrance of the external auditory canal of the user's ear, so as to allow the sound waves generated by the vibration panel 114 to point to the entrance of the external auditory canal, thereby increasing the enhancement effect of air conduction sound on bone conduction sound. Exemplarily, the vibration panel 114 has a major axis direction and a minor axis direction that are perpendicular to the vibration direction of the transducer device 112 and orthogonal to each other. The size of the vibration panel 114 in the aforementioned major axis direction is greater than the size of the vibration panel 114 in the aforementioned minor axis direction. For example, when observed along the vibration direction, the vibration panel 114 is arranged in an oval shape, or a rounded rectangle shape, or a runway shape. Among them, in the worn state, the aforementioned major axis direction points to the user's head, and the aforementioned minor axis direction points to the entrance of the external auditory canal of the user's ear.

[0084] Combined with Figures 8 to 10 , the movement module 11 can be provided with an acoustic cavity communicating with the accommodation cavity 100, and the acoustic cavity is used to absorb the sound energy of the sound waves formed by the vibration of the air in the accommodation cavity 100 along with the transducer device 112. Among them, the aforementioned sound waves can be output to the outside of the earphone 10 through the mounting hole 1111 to form an air conduction sound.

[0085] In some embodiments, for example Figure 8 , the frequency response curve of the aforementioned sound waves has a resonance peak. The aforementioned acoustic cavity can be a Helmholtz resonance cavity 200 to weaken the peak resonance intensity of the aforementioned resonance peak, that is, to suppress the sudden increase in the peak resonance intensity, so that the sound quality of the earphone 10 is more balanced. Exemplarily, the Helmholtz resonance cavity 200 can be arranged on the movement housing 111, for example, on the side of the second end wall 1114 facing away from the transducer device 112; and / or, the Helmholtz resonance cavity 200 can be arranged on the transducer device 112 (such as its magnetic circuit system). Among them, the peak resonance frequency of the aforementioned resonance peak can be between 500 Hz and 4 kHz, preferably between 1 kHz and 2 kHz. The difference between the peak resonance intensity of the aforementioned resonance peak when the opening of the Helmholtz resonance cavity 200 communicating with the accommodation cavity 100 is in the open state and the peak resonance intensity of the aforementioned resonance peak when the opening of the Helmholtz resonance cavity 200 communicating with the accommodation cavity 100 is in the closed state can be greater than or equal to 3 dB.

[0086] In some other embodiments, for example Figure 9 and Figure 10 , the aforementioned acoustic cavity can be a sound filter 300, and the cut-off frequency of the sound filter 300 can be less than or equal to 5 kHz, preferably less than or equal to 4 kHz, so as to weaken the sound energy of the frequency band greater than the aforementioned cut-off frequency. Exemplarily, combined with Figure 9 , the sound filter 300 can be located on the side of the transducer device 112 facing away from the vibration panel 114, that is, a rear sound filter. Combined with Figure 10, the acoustic filter 300 can be located on the side of the transducer device 112 facing the vibration panel 114, that is, a front acoustic filter. For example: the first end wall 1113 can include a first sub-end wall 11131 and a second sub-end wall 11132 that are spaced apart in the vibration direction of the transducer device 112. The mounting hole 1111 penetrates through the first sub-end wall 11131 and the second sub-end wall 11132 along the vibration direction of the transducer device 112. The first sub-end wall 11131 and the second sub-end wall 11132 cooperate with the inner cylinder wall 1112 to form the acoustic filter 300. Among them, the gap between the first sub-end wall 11131 and the second sub-end wall 11132 in the vibration direction of the transducer device 112 can be between 0.5 mm and 5 mm, preferably between 1 mm and 3 mm.

[0087] Combine Figure 11 , the transducer device 112 can include a bracket 1121, a second vibration transmission piece 1122, a magnetic circuit system, and a coil 1123. The bracket 1121 is connected to the movement housing 111 through the first vibration transmission piece 113. The second vibration transmission piece 1122 connects the bracket 1121 and the magnetic circuit system to suspend the magnetic circuit system in the accommodation cavity 100. The coil 1123 is connected to the bracket 1121 and extends into the magnetic gap of the magnetic circuit system along the vibration direction of the transducer device 112. At this time, the vibration panel 114 can be connected to the bracket 1121 through the connecting piece 115. As an example, the peripheral area of the first vibration transmission piece 113 can be connected to the movement housing 111, and the central area of the first vibration transmission piece 113 can be connected to the bracket; the peripheral area of the second vibration transmission piece 1122 can be connected to the bracket 1121, and the central area of the second vibration transmission piece 1122 can be connected to the magnetic circuit system. Of course, in some other embodiments, the peripheral area of the second vibration transmission piece 1122 can be connected to the magnetic circuit system, and the central area of the second vibration transmission piece 1122 can be connected to the bracket 1121. At this time, the magnetic circuit system can be connected to the peripheral area of the second vibration transmission piece 1122 through a cylindrical connecting piece. Among them, the aforementioned magnetic circuit system can include a magnetic conductive cover 1124 and a magnet 1125 connected to the bottom of the magnetic conductive cover 1124. The magnet 1125 can be connected to the central area of the second vibration transmission piece 1122 and is spaced apart from the magnetic conductive cover 1124 in a direction perpendicular to the vibration direction of the transducer device 112 to form the aforementioned magnetic gap. The coil 1123 extends into the space between the magnet 1125 and the magnetic conductive cover 1124.

[0088] Further, the magnetic shield 1124 may be provided with a communication hole 11241 that communicates the aforementioned magnetic gap with the external space of the magnetic circuit system to weaken the acoustic cavity effect. Of course, the bracket 1121 may also be provided with a communication hole 11211 extending along the vibration direction of the transducer 112 to weaken the acoustic cavity effect. This is because, during the generation of mechanical vibration by the transducer 112, the air on both opposite sides in its vibration direction will be compressed or expanded, that is, positive and negative sound pressures are formed; and the aforementioned communication hole can make the air on both opposite sides of the transducer 112 communicate, and then cancel each other out in antiphase.

[0089] In some embodiments, in the non-wearing state, the frequency response curve of the vibration of the vibration panel 114 has a resonance valley, a first resonance peak, and a second resonance peak in the frequency band range of 80 Hz to 2 kHz. The peak frequencies of the resonance valley, the first resonance peak, and the second resonance peak are defined as f0, f1, and f2 in sequence, and satisfy the relationship: f0 < f1 < f2. Among them, 80 Hz ≤ f0 ≤ 400 Hz, 80 Hz ≤ f1 ≤ 400 Hz, 100 Hz ≤ f2 ≤ 2 kHz.

[0090] In some embodiments, in the non-wearing state, the frequency response curve of the vibration of the vibration panel 114 has only one resonance peak in the frequency band range of 80 Hz to 2 kHz. Among them, the peak frequency of the aforementioned resonance peak is between 100 Hz and 2 kHz.

[0091] In some embodiments, in the non-wearing state, the frequency response curve of the vibration of the vibration panel 114 has a first resonance peak and a second resonance peak in the frequency band range of 80 Hz to 2 kHz, and there is no resonance valley. Among them, the peak frequency of the first resonance peak is between 80 Hz and 400 Hz, and the peak frequency of the second resonance peak is between 100 Hz and 2 kHz.

[0092] In some embodiments, in the non-wearing state, the frequency response curve of the vibration of the vibration panel 114 has a resonance valley, a first resonance peak, and a second resonance peak in the frequency band range of 80 Hz to 200 Hz. The peak frequencies of the resonance valley, the first resonance peak, and the second resonance peak are defined as f0, f1, and f2 in sequence, and satisfy the relationship: f0 < f2, f1 < f2.

[0093] In some embodiments, the mass of the movement housing 111 is greater than or equal to 1.2 g, preferably greater than or equal to 1.5 g; and / or, the stiffness of the first vibration transmission sheet 113 is less than or equal to 2500 N / m. Further, the mass of the magnetic circuit system is greater than or equal to 3 g, preferably greater than or equal to 5 g; and / or, the stiffness of the second vibration transmission sheet 1122 is greater than or equal to 3000 N / m, preferably greater than or equal to 5000 N / m.

[0094] In some embodiments, the mass of the movement housing 111 is less than or equal to 0.5 g, preferably less than or equal to 0.3 g; and / or, the stiffness of the first vibration transmission piece 113 is greater than or equal to 2000 N / m, preferably greater than or equal to 5000 N / m.

[0095] In some embodiments, in the non-wearing state, the frequency response curve of the vibration panel 114 during vibration has a resonance peak, which is strongly related to the stiffness of the bracket 1121, and the peak frequency of the resonance peak is greater than or equal to 4 kHz, preferably greater than or equal to 5 kHz. Among them, the stiffness of the bracket 1121 is greater than or equal to 10 5 N / m, preferably greater than or equal to 5×10 5 N / m.

[0096] Combined Figure 12 , the earphone 10 may further include a head beam assembly 12 connected to the movement module 11. The head beam assembly 12 is used to bypass the user's head and can make the entire movement module 11 located on the front side of the user's ear. Of course, the movement module 11 can also be entirely located on the rear side or other positions of the user's ear, and can also be partially located on the front side or rear side of the user's ear. In some embodiments, for example Figure 34 , the movement module 11 can contact the user's cheek through the movement housing 111 (specifically, the first end wall 1113), that is, the side of the movement housing 111 facing away from the adapter housing 13 forms a contact surface for contacting the user's skin. In some other embodiments, for example Figure 1 , the movement module 11 can contact the user's cheek through the vibration panel 114. In some other embodiments, for example Figure 3 , the movement module 11 can contact the user's cheek through the vibration panel 114 and the border 116.

[0097] Exemplarily, in the wearing state, the head beam assembly 12 and the user's head can form a first contact point (such as Figures 13 to 17 shown as CP1), the movement module 11 and the user's cheek form a second contact point (such as Figures 13 to 17 shown as CP2), and the distance between the second contact point and the first contact point in the direction of the sagittal axis of the human body (such as Figures 13 to 17As shown in the figure, the distance between the second contact point and the first contact point (shown in Figure W) can be between 20 mm and 30 mm, preferably between 22 mm and 28 mm; further, the distance between the second contact point and the first contact point in the direction of the sagittal axis of the human body is preferably 25 mm. When this distance is ensured, the movement module 11 can be naturally worn to the correct position in front of the user's ear. When the movement module 11 vibrates to generate sound waves at this position, the sound waves can be transmitted to the central nerve of the user along the shortest path, making the transmission efficiency of the sound waves higher and the sound loss less. Among them, when observing along the direction of the coronal axis of the human body, the first contact point can be located directly above the user's ear, and the second contact point can be located directly in front of the user's ear. Further, the head beam assembly 12 can include an arc-shaped head beam member 121 and an adapter 122. The arc-shaped head beam member 121 is used to bypass the user's head, and both ends of the adapter 122 are respectively connected to the arc-shaped head beam member 121 and the movement module 11. Among them, the arc-shaped head beam member 121 can be located above the user's ear and form the first contact point with the user's head. As an example, the material of the arc-shaped head beam member 121 can be plastic, and the material of the adapter 122 can be metal; of course, the materials of both can also be the same, either plastic or metal. Among them, when the movement module 11 is set to be able to approach or move away from the arc-shaped head beam member 121 in the extending direction of the head beam assembly 12, for example, one end of the adapter 122 facing away from the movement module 11 (specifically, it can be the first connection segment 1221 mentioned later in the text) can extend out or retract from the arc-shaped head beam member 121, and the part where the arc-shaped head beam member 121 cooperates with the adapter 122 can also be set as a metal part to locally strengthen the wear resistance of both.

[0098] In some embodiments, in combination with Figures 13 to 16 , in the wearing state, and when observing along the direction of the coronal axis of the human body, at least a part of the head beam assembly 12 is inclined relative to the vertical axis of the human body, for example, inclined and extending towards the user's front, so as to facilitate the formation of the first contact point and the second contact point. At this time, the adapter 122 can be set in a rod shape or a sheet shape. For example: in combination with Figure 13 , when observing along the direction of the coronal axis of the human body, the arc-shaped head beam member 121 is inclined relative to the vertical axis of the human body, and the adapter 122 is parallel to the vertical axis of the human body. At this time, the adapter 122 can be connected to the side of the movement module 11 facing the user's head. Another example: in combination with Figure 14 , when observing along the direction of the coronal axis of the human body, the arc-shaped head beam member 121 is inclined relative to the vertical axis of the human body, and the adapter 122 is also inclined relative to the vertical axis of the human body, and the inclination angles of both relative to the vertical axis of the human body are the same. At this time, the adapter 122 can be connected to the side of the movement module 11 facing away from the user's cheek. Another example: in combination with Figure 15, when observed along the direction of the human coronal axis, the arc-shaped head beam member 121 is inclined relative to the human vertical axis, and a part of the adapter member 122 is inclined relative to the human vertical axis while the other part is parallel to the human vertical axis. At this time, the adapter member 122 can be connected to the side of the movement module 11 away from the user's ear. Another example: in combination with Figure 16 , when observed along the direction of the human coronal axis, the arc-shaped head beam member 121 is inclined parallel to the human vertical axis, and a part of the adapter member 122 is inclined relative to the human vertical axis while the other part is parallel to the human vertical axis. At this time, the adapter member 122 can be connected to the side of the movement module 11 facing the user's head.

[0099] In some other embodiments, in combination with Figure 17 , the adapter member 122 can be arranged in a ring shape. At this time, in the wearing state, when observed along the direction of the human coronal axis, the arc-shaped head beam member 121 can be inclined parallel to the human vertical axis, and the adapter member 122 can be sleeved around the periphery of the user's ear, and the first contact point and the second contact point can also be formed. Among them, the adapter member 122 can be in a continuous closed ring shape or a discontinuous ring shape (such as a C-shaped or U-shaped).

[0100] It should be noted that: in the fields of medicine, anatomy, etc., three basic sections of the human body, namely the sagittal plane, the coronal plane, and the horizontal plane, and three basic axes, namely the sagittal axis, the coronal axis, and the vertical axis, can be defined. Among them, the sagittal plane is a vertical section along the anterior-posterior direction of the body and divides the human body into left and right parts; the coronal plane is a vertical section along the left-right direction of the body and divides the human body into anterior and posterior parts; the horizontal plane is a horizontal section along the superior-inferior direction of the body and divides the human body into upper and lower parts. Correspondingly, the sagittal axis is an axis perpendicular to the coronal plane along the anterior-posterior direction of the body, the coronal axis is an axis perpendicular to the sagittal plane along the left-right direction of the body, and the vertical axis is an axis perpendicular to the horizontal plane along the superior-inferior direction of the body.

[0101] As an example, and in combination with Figure 12 、 Figure 16 and Figure 20, the adapter 122 may include a first connection segment 1221, an intermediate transition segment 1222, and a second connection segment 1223. The intermediate transition segment 1222 connects the first connection segment 1221 and the second connection segment 1223. Among them, the first connection segment 1221 and the second connection segment 1223 are respectively bent relative to the intermediate transition segment 1222 and extend in opposite directions. At this time, the first connection segment 1221 can be connected to the arc head beam member 121, and the second connection segment 1223 can be connected to the movement module 11. Among them, when observed along the direction of the human body's coronal axis, the intermediate transition segment 1222 is inclined relative to the human body's vertical axis to facilitate the formation of a first contact point and a second contact point.

[0102] Further, the bending angle of the first connection segment 1221 relative to the intermediate transition segment 1222 (such as Figure 16 shown as θ1 in Figure 16 ) can be greater than or equal to 90° and less than 180°; and / or, the bending angle of the second connection segment 1223 relative to the intermediate transition segment 1222 (such as Figure 16 shown as θ2 in

[0103] ) can be greater than or equal to 90° and less than 180°. In this way, the adapter 122 can be more smoothly transitionally connected to the arc head beam member 121 and the movement module 11. Among them, in the wearing state, when observed along the direction of the human body's coronal axis, the first connection segment 1221 can be parallel to the second connection segment 1223. At this time, the distance between the first connection segment 1221 and the second connection segment 1223 (such as Figure 16 shown as W in

[0103] ) can be between 20 mm and 30 mm, preferably between 22 mm and 28 mm.

[0103] It should be noted that: combined with Figure 19 , the adapter 122 may also have a bending curvature from other perspectives (such as when observed along the direction of the human body's sagittal axis). For example, the adapters 122 at both ends of the arc head beam member 121 extend towards each other in the same direction, so as to facilitate the earphone 10 to better contact the user's head and also facilitate the head beam assembly 12 to provide a pressing force for the movement module 11.

[0104] Further, combined with Figure 20, the first connecting section 1221 and the second connecting section 1223 can be respectively provided with wire routing cavities. For example, both are provided in a hollow tubular shape. The middle transition section 1222 can be provided with a slot 1224 for communicating the wire routing cavities of the first connecting section 1221 and the second connecting section 1223, so as to allow the wire routing of the earphone 10 to extend from the movement module 11 to the arc-shaped head beam member 121 through the adapter 122. Among them, the wire routing of the earphone 10 can be set as a wire, a flexible circuit board, etc. Correspondingly, the head beam assembly 12 can further include a seal embedded in the slot 1224, and the seal covers the wire routing, which is beneficial to improving the waterproof and dustproof performance of the earphone 10 and also beneficial to improving the appearance of the earphone 10. Among them, the seal can be a colloid after curing or a cover plate. Of course, in some other embodiments, the wire routing of the earphone 10 can also be exposed outside the adapter 122; correspondingly, the adapter 122 can be set as a solid structure.

[0105] The inventors of the present application have found in long-term research that: when the head beam assembly 12 applies a pressing force between 0.4 N and 0.8 N to press the movement module 11 against the user's cheek, that is, in the wearing state, the pressing force of the movement module 11 on the user's cheek can be between 0.4 N and 0.8 N, preferably between 0.3 N and 0.6 N, and the user can obtain excellent wearing stability, comfort and good sound quality. Among them, the pressing force can be measured by means of a clamping force testing machine (FL-86161A, Bowen Instruments). Specifically, during measurement, the earphone 10 is clamped on both sides of the parallel plates of the clamping force testing machine and supported on the middle fork of the clamping force testing machine; subsequently, the parallel plates of the clamping force testing machine cause the two movement modules 11 to deviate from each other and have a test spacing (such as the average head width of 145 mm), thereby simulating the user wearing the earphone 10. At this time, the value displayed on the clamping force testing machine can be read to measure the corresponding pressing force. For different users, the sizes of their heads are different (such as "big head" and "small head"). Therefore, the head beam assembly 12 can be set to have an adjustable arc length to meet the wearing requirements of different users for the earphone 10. Further, the present application hopes that when different users wear the earphone 10, they can all obtain a consistent pressing force.

[0106] Exemplarily, the first connecting section 1221 can extend or retract from the arc-shaped head beam member 121 under an external force, so as to allow the movement module 11 to approach or move away from the arc-shaped head beam member 121 in the extending direction of the head beam assembly 12, thereby adjusting the arc length of the head beam assembly 12. Of course, the second connecting section 1223 can also extend or retract from the movement module 11 under an external force, and can also adjust the arc length of the head beam assembly 12.

[0107] Further, in combination with Figure 12, at both ends of the arc-shaped head beam member 121, there may be provided adapter members 122 and movement module 11. Among them, the head beam assembly 12 provides a first pressing force for the movement module 11 in the first use state, and provides a second pressing force for the movement module 11 in the second use state. The absolute value of the difference between the second pressing force and the first pressing force may be between 0 and 0.1 N, preferably between 0 and 0.05 N. In this way, when different users wear the earphone 10, that is, the head beam assembly 12 has different arc lengths and the two movement modules 11 have different spacings, the head beam assembly 12 makes the pressing force exerted by the movement module 11 on the user's cheeks not vary much, thereby increasing the adaptability of the earphone 10 to different users.

[0108] It should be noted that: the first use state can be defined as the use state in which each adapter member 122 has a first extension amount relative to the arc-shaped head beam member 121, and there is a first spacing between the two movement modules 11; the second use state can be defined as the use state in which each adapter member 122 has a second extension amount relative to the arc-shaped head beam member 121, and there is a second spacing between the two movement modules 11. Among them, the second extension amount is greater than the first extension amount, and the second spacing is greater than the first spacing. In short, the first use state can be inclined to small-headed users wearing the earphone 10, and the second use state can be inclined to large-headed users wearing the earphone 10. Therefore, when the movement module 11 is closest to the arc-shaped head beam member 121, the first extension amount can take the minimum value; and when the movement module 11 is farthest from the arc-shaped head beam member 121, the second extension amount can take the maximum value.

[0109] The inventors of the present application found in long-term research that: under the same conditions, parameters such as the stiffness and bending degree of the arc-shaped head beam member 121 and the adapter member 122 have a certain influence on the pressing force that the head beam assembly 12 can provide, and a qualitative analysis is carried out here.

[0110] For a cantilever beam, combined with Figure 18 , the cantilever beam will produce bending deformation under the action of loads such as concentrated force and distributed load, and its maximum deflection w max occurs at the free end of the cantilever beam.

[0111] For a constant cross-section cantilever beam, combined with Figure 18 in (a), and based on mechanics of materials, the deflection at the free end satisfies the following relation (1).

[0112]

[0113] In the formula, EI is the flexural rigidity of the cross-section, and M(x) is the bending moment of the cross-section. Among them, E is the Young's modulus of the material, and I is the moment of inertia of the cross-section.

[0114] For a variable cross-section cantilever beam, combined with Figure 18In Figure (b), since the properties of the cross-section of the variable cross-section beam change, the piecewise stiffness method can be used when analyzing the displacement of its free end. That is, the variable cross-section cantilever beam is regarded as composed of multiple constant cross-section cantilever beams. When calculating the deformation, the remaining cantilever beam segments except the studied cantilever beam segment can be regarded as rigid bodies. Finally, the displacement deformations under the same load conditions are superimposed. This method is often used for overhanging cantilever beams or variable cross-section cantilever beams. Correspondingly, the deflection of the free end satisfies the following relational expression (2).

[0115]

[0116] For a headphone such as Figure 12 shown, the left and right sides of the headphone 10 can be simplified as a symmetric structure. Therefore, it is only necessary to analyze the force on one side. Among them, whether the headphone 10 is in the first use state (such as the retracted state) or the second use state (such as the extended state), it satisfies the moment balance equation, that is, the following relational expression (3).

[0117] M = F·L (3)

[0118] In the formula, M is the bending moment value of the headphone 10 at the head top fulcrum (such as the first contact point CP1), F is the pressing force provided by the head beam assembly 12 for the movement module 11 in a certain use state, and L is the lever arm from the equivalent concentrated action point (such as the second contact point CP2) of the movement module 11 to the head top fulcrum. Among them, combined with Figure 19 , taking the condition of full retraction (such as the minimum extension amount of the adapter 122 relative to the arc head beam member 121) as a reference, assuming that the position of the equivalent concentrated action point on the movement module 11 does not change due to the telescopic adjustment of the head beam assembly 12, then in the condition of full extension (such as the maximum extension amount of the adapter 122 relative to the arc head beam member 121), the lever arm L increases. Based on this, and combined with the above moment balance equation (2), studying the change law of the bending moment M can obtain the change law of the pressing force F.

[0119] Combined with Figure 19 , in two different conditions of full retraction (such as Figure 19 shown as the "contracted state" in Figure 19 and full extension (such as

[0120] shown as the "extended state" in ), the headphone 10 is respectively opened from the initial free state to the final state with the corresponding spacing (such as the average head width of 145 mm); now assuming that in the critical state, the pressing forces of the two are the same, that is, whether in the contracted state or the extended state, the head beam assembly 12 can provide the same or similar pressing force for the movement module 11.For the fully retracted condition, the head beam assembly 12 can be simply regarded as a cantilever beam with a constant cross-section (i.e., the arc segment S1 where the arc-shaped head beam member 121 is located). From the deflection at its free end, that is, formula (1), integrating along the arc segment S1 gives the following relational expression (4).

[0121]

[0122] In the formula, E1I1 is the flexural rigidity of the cross-section of the arc segment S1, and L1(s) is the lever arm function of the concentrated force F on the cross-section of the arc segment S1.

[0123] For the fully extended condition, the beam assembly 12 can be simply regarded as a cantilever beam with a variable cross-section (i.e., the arc segment S1 where the arc-shaped head beam member 121 is located and the arc segment S2 where the adapter 122 is located). From the deflection at its free end, that is, formula (2), integrating along the arc segment S1 and the arc segment S2 respectively and summing them up gives the following relational expression (5).

[0124]

[0125] In the formula, E2I2 is the flexural rigidity of the cross-section of the arc segment S2, and L2(s) is the lever arm function of the concentrated force F on the cross-section of the arc segment S2. Among them, the first two terms on the right side of the equation are the deformation amounts of the arc segment S1, and the third term is the deformation amount of the arc segment S2. l is the vertical component of the arc segment S2.

[0126] Furthermore, combining Figure 19 , the above two conditions satisfy the following relational expression (6).

[0127] Δ2 = Δ1 + h (6)

[0128] In the formula, h is the horizontal component of the arc segment S2. Substitute the relational expressions (4) and (5) into the relational expression (6), and denote the h in the critical state where the pressing forces are the same in the above two conditions as h cr , then the relational expression (7) is obtained.

[0129]

[0130] The relational expression (7) actually gives the variation law of the pressing force of the earphone 10 in the extended state or the contracted state with the same head width. Correspondingly, the actual design value h of the arc segment S2 in the horizontal direction satisfies the following relational expression (8).

[0131]

[0132] From the relational expressions (7) and (8), it can be seen that assuming that the flexural rigidity E1I1 of the cross-section of the arc segment S1 and the arc segment S2 the vertical component l remain unchanged, then there is:

[0133] 1) The smaller the designed flexural rigidity E2I2 of the cross-section of the arc segment S2 (i.e., the larger h cr is), the smaller the pressing force after it extends;

[0134] 2) The smaller the designed radian of the inward bending of the arc segment S2 (e.g., the smaller h is), the smaller the pressing force after it extends.

[0135] Based on the above detailed analysis, a quantitative description is now given. Exemplarily, in the non-wearing state, when each movement module 11 is closest to or farthest from the arc head beam member 121, the adapter members 122 at both ends of the arc head beam member 121 are symmetrically arranged with respect to the first reference plane (e.g., Figure 19 shown as RP1), and the second reference plane (e.g., the plane where the paper surface is located) passes through the connection line between both ends of the arc head beam member 121 (e.g., Figure 19 shown as RP2), and is perpendicularly intersected with the first reference plane. Among them, in the wearing state, the first reference plane can be parallel to the sagittal plane of the human body, and the second reference plane can be parallel to the coronal plane of the human body. Further, in combination with Figure 19 , when the arc head beam member 121 is in the natural state, and the arc head beam member 121 and the adapter member 122 are projected onto the second reference plane, when the movement module 11 is closest to the arc head beam member 121 (e.g., Figure 19 shown as the "contracted state"), the free end (e.g., the second connection segment 1223) of the adapter member 122 for connecting the movement module 11 has a first position (e.g., Figure 19 shown as L1), when the movement module 11 is farthest from the arc head beam member 121 (e.g., Figure 19 shown as the "extended state"), the free end has a second position (e.g., Figure 19 shown as L2). Among them, the connection line between the first position and the second position has a first projection component (e.g., Figure 19 shown as h) in the first reference direction parallel to the connection line between both ends of the arc head beam member 121, and has a second projection component (e.g., Figure 19As shown in [Chinese reference], the ratio of the second projection component to the first projection component can be greater than or equal to 2. Further, the ratio of the sectional flexural rigidity of the adapter 122 to the sectional flexural rigidity of the arc-shaped head beam member 121 can be less than or equal to 0.9. In other words, by designing the adapter 122 to be flexible and straight, it can ensure that when the distances between the two movement modules 11 are the same, the pressing force in the contracted state is greater than that in the extended state; considering the fact that the wider the head width, the greater the pressing force, it can further achieve that the clamping force when the distances between the two movement modules 11 are small and in the contracted state (i.e., when a user with a "small head" wears the earphone 10) is the same as or similar to the clamping force when the distances between the two movement modules 11 are large and in the extended state (i.e., when a user with a "big head" wears the earphone 10).

[0136] Combined with Figure 20 and Figure 21 , the earphone 10 may further include an adapter housing 13 connecting the movement module 11 and the head beam assembly 12. Wherein, the movement housing 111 can rotate relative to the adapter housing 13 about a first axis (such as [[ID=1 shown by the dashed line A1 in [Chinese reference]), and the adapter housing 13 can rotate relative to the head beam assembly 12 about a second axis (such as ​ shown by the dashed line A2 in [Chinese reference]) to increase the degrees of freedom of the movement module 11 relative to the head beam assembly 12 in three-dimensional space. In this way, the movement module 11 and the head beam assembly 12 can better adapt to the contour of the user's head, thereby increasing the wearing stability and comfort of the earphone 10, and the movement module 11 can also better fit the user's skin. As an example, the first axis about which the movement housing 111 rotates relative to the adapter housing 13 intersects with the second axis about which the adapter housing 13 rotates relative to the head beam assembly 12 in a reference plane perpendicular to the vibration direction of the transducer 112. Wherein, the first axis and the second axis can be orthogonal to each other. For example: in the wearing state, the first axis is parallel to the sagittal axis of the human body; and / or the second axis is parallel to the vertical axis of the human body. Wherein, the first axis and the second axis can be coplanar or non-coplanar in three-dimensional space.

[0137] As an example, the adapter housing 13 and the end of the adapter 122 far from the arc-shaped head beam member 121 (such as the second connecting section 1223) can be rotatably connected. Correspondingly, the second connecting section 1223 can extend along the direction of the second axis.

[0138] Combined with ​ and ​ , a rotating shaft cavity 131 is provided on the adapter housing 13, and the adapter 122 is inserted into the rotating shaft cavity 131 along the axial direction of the rotating shaft cavity 131 (such as the direction of the second axis). Further, the head beam assembly 12 may further include a locking member 123 for limiting the adapter 122 along the axial direction of the rotating shaft cavity 131 so that the adapter 122 remains in the rotating shaft cavity 131. For example: Combined with​ , ​ and ​ , a card slot 1225 is provided at the free end of the adapter 122 (such as the second connecting section 1223). After the adapter 122 is inserted into the rotating shaft cavity 131 from one end of the rotating shaft cavity 131, the card slot 1225 is exposed from the other end of the rotating shaft cavity 131. The locking member 123 is clamped in the card slot 1225, and the radial dimension of the locking member 123 is greater than the radial dimension of the rotating shaft cavity 131 to lock in the opposite direction of the insertion direction of the adapter 122 into the rotating shaft cavity 131. Further, a limiting groove 1226 is formed on the outer peripheral wall of the adapter 122 (such as the second connecting section 1223), and a limiting block 132 is provided on the inner peripheral wall of the rotating shaft cavity 131. The limiting block 132 is embedded in the limiting groove 1226 to limit the rotation angle of the adapter 122 relative to the rotating shaft cavity 131. Among them, the rotation angle of the adapter housing 13 relative to the head beam assembly 12 can be between 5° and 15°, which is convenient for the headset 10 to adapt to the contour of the user's head and convenient for the user to wear.

[0139] Combined with ​ and ​ , the headset 10 may further include a battery 14 and a main board 15 coupled to the movement module 11 (specifically, the transducer 112). The battery 14 is configured to supply power to the main board 15, and the main board 15 is configured to control the transducer 112 to convert an electrical signal into mechanical vibration. Among them, the capacity of the battery 14 can be greater than or equal to 200 mAh to increase the battery life of the headset 10. Further, the adapter housing 13 can be used to arrange the battery 14 or the main board 15. For example, the battery 14 and the main board 15 are respectively located in the adapter housings 13 on the left and right sides of the headset 10. In this way, the total weight of the movement module 11 can be reduced to improve the sound quality of the headset 10, and the total weight on the left and right sides of the headset 10 can be shared to improve the wearing stability and comfort of the headset 10.

[0140] Exemplarily, the adapter housing 13 may include a middle plate 133 connected to the adapter 122, a cylindrical side wall 134 surrounding the middle plate 133, and a housing 135 fastened to the cylindrical side wall 134, such that the housing 135 is connected to the middle plate 133, and the three may also enclose to form an accommodation space. In other words, the adapter housing 13 may form an accommodation space for accommodating electronic components, and the electronic components may be the battery 14 or the main board 15, or may be the switch assembly 162 and / or the functional assembly 17, or may also be other light sources such as LEDs or their light guide columns. Among them, the battery 14 or the main board 15 may be supported and fixed by the adapter housing 13 and may be located on the side of the adapter housing 13 facing the transducer device 112. For example, the battery 14 or the main board 15 is disposed between the housing 135 and the middle plate 133. At this time, the movement housing 111 and the housing 135 may be respectively located on opposite sides of the middle plate 133, and the battery 14 or the main board 15 may be spaced apart from the movement housing 111 in the vibration direction of the transducer device 112, that is, the battery 14 or the main board 15 and the movement module 11 are stacked inside and outside. Of course, in some other embodiments such as the adapter housing 13 does not include the housing 135, the battery 14 or the main board 15 and the movement housing 111 may be located on the same side of the middle plate 133. Correspondingly, the rotation shaft cavity 131 may be provided on the cylindrical side wall 134 and the middle plate 133, and the adapter 122 may also be rotatably connected to the middle plate 133; the movement housing 111 may be rotatably connected to the cylindrical side wall 134.

[0141] Further, in combination with ​, the transducer device 112 can be rigidly connected to the movement housing 111, for example, the coil 1123 is rigidly connected to the movement housing 111, and for another example, the coil 1123 is connected to the bracket 1121 and the bracket 1121 is rigidly connected to the movement housing 111, that is, the transducer device 112 is not elastically connected to the movement housing 111 through the first vibration transmitting plate 113. At this time, the coil 1123 drives the movement housing 111 to vibrate, that is, the movement housing 111 vibrates following the transducer device 112, and then transmits the mechanical vibration generated by the transducer device 112 to the user's skin through the movement housing 111. Correspondingly, the movement housing 111 is elastically connected to the adapter housing 13, for example, the movement housing 111 is connected to the cylindrical side wall 134 through the elastic connector 137, and the movement housing 111 or the adapter housing 13 is connected to the headband assembly 12 to reduce the vibration of the adapter housing 13 following the transducer device 112, thereby reducing the sound leakage of the earphone 10. The adapter housing 13 is stacked with the core housing 111 along the vibration direction of the transducer device 112 and is located on the side of the core housing 111 facing away from the vibration panel 114. The adapter housing 13 has a first projected area on a reference plane perpendicular to the vibration direction, such as the area of the middle plate 133. The core housing 111 has a second projected area on the aforementioned reference plane, such as the area of the second end wall 1114. The ratio between the first projected area and the second projected area can be between 0.2 and 1.5, preferably between 0.2 and 1, and more preferably between 0.2 and 0.5, to reduce the baffle effect and thereby reduce sound leakage from the earphone 10. Furthermore, along the vibration direction of the transducer device 112, the gap between the core housing 111 and the adapter housing 13 can be between 1 mm and 10 mm, preferably between 2 mm and 8 mm, to reduce the acoustic cavity effect and thereby reduce sound leakage from the earphone 10. It should be noted that: the baffle effect is that the adapter shell 13 will change the propagation direction of the sound leakage on the side of the movement shell 111 away from the vibration panel 114. This application does not want to have a large sound leakage directly in front of the user when wearing it; the acoustic cavity effect is that the gap between the adapter shell 13 and the movement shell 111 will form an acoustic cavity, and sound leakage will be generated due to the air conduction resonance of the acoustic cavity. This application also does not want to generate a large sound leakage as a result.

[0142] It should be noted that: in some other embodiments, such as when the core module 11 does not rotate relative to the headband assembly 12 or the core module 11 rotates only around one axis (such as the second axis A2), the earphone 10 may also not include the adapter housing 13, for example, the adapter 122 is fixedly connected or rotatably connected to the core housing 111. ​ and ​, the battery 14 or the main board 15 can also be arranged at other positions outside the area where the movement module 11 is located. For example, the headset 10 can further include a support member 124 connected to the head beam assembly 12, and the battery 14 or the main board 15 can be arranged inside the support member 124. Among them, the support member 124 can be part of the structure of the head beam assembly 12. Of course, the battery 14 or the main board 15 can also be directly arranged inside the head beam assembly 12 (such as the arc-shaped head beam member 121). In combination with ​ , in the wearing state, the support member 124 and the movement module 11 are arranged at intervals along the sagittal axis of the human body, that is, the battery 14 or the main board 15 and the movement module 11 are stacked front and back. For example, the movement module 11 is closer to the front side of the user's head relative to the support member 124. In combination with ​ , in the wearing state, the support member 124 and the movement module 11 are arranged at intervals along the vertical axis of the human body. For example, the movement module 11 is farther away from the top of the user's head relative to the support member 124.

[0143] In combination with ​ and ​ , the movement housing 111 can rotate relative to the adapter housing 13 around the first axis A1. The surrounding edge 116 can be connected to one end of the movement housing 111 away from the adapter housing 13, that is, the surrounding edge 116 can be connected to one end of the movement housing 111 close to the vibration panel 114. Among them, the surrounding edge 116 can include a connecting portion 1162 connected to the movement housing 111 and a flange portion 1163 connected to the connecting portion 1162. The flange portion 1163 is at least partially spaced from the adapter housing 13 (such as the cylindrical side wall 134) in the vibration direction of the transducer device 112 to allow the movement module 11 to rotate relative to the adapter housing 13. Among them, when observing along the vibration direction of the transducer device 112, the flange portion 1163 is located on the periphery of the movement housing 111 and overlaps with the adapter housing 13 (such as the cylindrical side wall 134). In this way, the rotation angle of the movement module 11 relative to the adapter housing 13 can be limited within a certain angle range, for example, between 5° and 15°. This is convenient for the headset 10 to adapt to the contour of the user's head and is also convenient for the user to wear. Further, in the non-wearing state, starting from the axis (such as the first axis A1) around which the movement housing 111 rotates relative to the adapter housing 13, the gap between the flange portion 1163 and the adapter housing 13 in the vibration direction of the transducer device 112 (such as ​ and ​ shown as W) gradually increases along a reference direction. The aforementioned reference direction is defined as the direction perpendicular to the vibration direction and the direction where the first axis is located and away from the first axis. Among them, the aforementioned reference direction can be parallel to the second axis direction A2. In this way, it is beneficial to reduce the total size of the movement module 11 and the adapter housing 13 in the vibration direction of the transducer device 112, making the structure of the headset 10 more compact.

[0144] Exemplarily, the maximum gap between the flange portion 1163 and the adapter housing 13 in the vibration direction of the transducer device 112 (e.g., ​ as shown by W in ​ ) can be between 2 mm and 5 mm, preferably between 2.5 mm and 4 mm, and the minimum gap (e.g.,

[0145] as shown by W in

[0146] ) can be zero or close to zero, as long as it allows the movement of the movement housing 111 relative to the adapter housing 13. Further, when observed along the direction of the axis (e.g., the first axis A1) of the rotation of the movement housing 111 relative to the adapter housing 13, the side of the flange portion 11 facing the adapter housing 13 can be arc-shaped to improve the appearance quality of the earphone 10. Among them, the radius of the arc of the side of the flange portion 1163 facing the adapter housing 13 is greater than or equal to 50 mm, so that the bending degree of the flange portion 1163 is not abnormally large, that is, the flange portion 1163 extends smoothly in a curved shape, thereby improving the appearance quality of the earphone 10.

[0147] In some embodiments, the second movement housing 111b may include a first end wall 1113 and a cylindrical side wall 1116 connected to the first end wall 1113. The cylindrical side wall 1116 is located between the inner cylindrical wall 1112 and the first outer cylindrical wall 1115 and is snap-fitted to the inner cylindrical wall 1112. For example, one of the inner cylindrical wall 1112 and the cylindrical side wall 1116 may be provided with a snap groove, and the other may be provided with an undercut that mates with the snap groove, so as to facilitate snap-fitting of the second movement housing 111b with the first movement housing 111a. In other embodiments, the second movement housing 111b may include only the first end wall 1113, which is overlaid on the end surface of the inner cylindrical wall 1112, and the two may be connected via a heat-seal column. Furthermore, when the second movement shell 111b is buckled with the first movement shell 111a, the peripheral area of the first vibration transmission plate 113 can also be pressed against the end face of the inner tube wall 1112. Of course, the first vibration transmission plate 113 itself can also be snapped or glued to the inner tube wall 1112.

[0148] In some embodiments, one of the connection portion 1162 and the first outer tube wall 1115 is provided with a snap groove, and the other is provided with an undercut that mates with the snap groove, so that the edge 116 and the first movement housing 111a can be snapped together. The connection portion 1162 can be cylindrical and located on the periphery of the first outer tube wall 1115; the flange portion 1163 is also located on the periphery of the first outer tube wall 1115.

[0149] Furthermore, the side of the vibration panel 114 facing away from the transducer device 112 may include an edge area 1143 connected to the skin contact area 1141, the edge area 1143 is located on the periphery of the skin contact area 1141, and is spaced apart from the skin contact area 1141 in the vibration direction of the transducer device 112, for example, the plane where the edge area 1143 is located is parallel to the plane where the skin contact area 1141 is located. Correspondingly, the surrounding edge 116 may also include a limiting portion 1164 connected to the connecting portion 1162, and the limiting portion 1164 is located on the side of the vibration panel 114 facing away from the transducer device 112. Among them, when observed along the vibration direction of the transducer device 112, the limiting portion 1164 overlaps with the edge area 1143 and is staggered with the skin contact area 114. In this way, the surrounding edge 116 neither affects the vibration of the vibration panel 114 along with the transducer device 112, nor can it prevent the vibration panel 114 from falling off, thereby increasing the reliability of the earphone 10. Accordingly, in the non-wearing state, the skin contact area 1141 can protrude from the side of the limiting portion 1164 away from the transducer device 112 in the vibration direction of the transducer device 112 .

[0150] Based on the above description, combined with ​, on the side of the vibration panel 114 facing away from the transducer device 112, there may also be an air conduction enhancement area 1142, and the air conduction enhancement area 1142 may be connected between the skin contact area 1141 and the edge area 1143. Among them, since the edge area 1143 may not be in contact with the user's skin either, at least the part of the edge area 1143 not blocked by the limiting part 1164 can also be used as the air conduction enhancement area 1142, thereby increasing the size of the air conduction enhancement area 1142 to improve the enhancement effect of air conduction sound on bone conduction sound.

[0151] Exemplarily, the connecting member 115 may include a first connecting member 1151 connected to the transducer device 112 and a second connecting member 1152 connected to the vibration panel 114. For example, the first connecting member 1151 and the bracket 1121 are integrally formed structural members, and for example, the second connecting member 1152 and the vibration panel 114 are connected as an integrally formed structural member. Among them, one of the first connecting member 1151 and the second connecting member 1152 may be provided with a cylindrical structure, and the other may be provided with a rod-shaped structure, and the rod-shaped structure is embedded in the cylindrical structure so that the connecting member 115 connects the transducer device 112 and the vibration panel 114.

[0152] Further, the first movement housing 111a may further include a second outer cylindrical wall 1117, and the second outer cylindrical wall 1117 is located on the periphery of the inner cylindrical wall 1112 and is spaced from the inner cylindrical wall 1112 in a direction perpendicular to the vibration direction of the transducer device 112. Among them, the second outer cylindrical wall 1117 extends in the opposite direction to the first outer cylindrical wall 1115 to facilitate their respective connections to the adapter housing 13 and the border 116; the second outer cylindrical wall 1117 is located inside the flange portion 1163 to allow the flange portion 1163 and the cylindrical side wall 134 to overlap in the vibration direction of the transducer device 112. Correspondingly, the cylindrical side wall 134 may be located on the periphery of the second outer cylindrical wall 1117, and one of the cylindrical side wall 134 and the second outer cylindrical wall 1117 may be provided with a shaft hole, and the other may be provided with a rotating shaft that cooperates with the shaft hole, and the rotating shaft is embedded in the shaft hole to allow the movement housing 111 to rotate relative to the adapter housing 13. Considering the appearance quality of the earphone 10 and the wall thickness of the cylindrical side wall 134, the shaft hole is preferably opened on the second outer cylindrical wall 1117, and the rotating shaft is correspondingly provided on the cylindrical side wall 134. Further, in order to increase the reliability of the rotational connection between the movement housing 111 and the adapter housing 13, the first movement housing 111a may further include a strengthening post 1118, and the strengthening post 1118 may connect the second outer cylindrical wall 1117 and the inner cylindrical wall 1112, thereby locally strengthening the second outer cylindrical wall 1117 to facilitate the opening of the shaft hole. Exemplarily, a rotating shaft 136 is provided on the cylindrical side wall 134, and a shaft hole is provided on the strengthening post 1118, and the rotating shaft 136 extends into the shaft hole of the strengthening post 1118.

[0153] Based on the above related descriptions and in combination with ​ and​ The movement module 11 may be provided with an acoustic cavity communicating with the accommodating cavity 100. The acoustic cavity is used to absorb the sound energy of the sound wave formed by the vibration of the air in the accommodating cavity 100 along with the transducer device 112. The sound wave may be output to the outside of the earphone 10 through the mounting hole 1111 to form an air-conducted sound. Among them, the second outer cylinder wall 1117, the inner cylinder wall 1112, and the transition wall 1119 may enclose to form the aforementioned acoustic cavity. Based on this, the first movement housing 111a itself may enclose to form an acoustic cavity, such as the Helmholtz resonance cavity 200; the first movement housing 111a may also enclose with the adapter housing 13 to form an acoustic cavity, such as the sound filter 300.

[0154] Exemplarily, the first movement housing 111a may further include a transition wall 1119 and a cover plate 1120 connected between the inner cylinder wall 1112 and the second outer cylinder wall 1117. The transition wall 1119 and the cover plate 1120 are spaced apart in the vibration direction of the transducer device 112 to enclose with the inner cylinder wall 1112 and the second outer cylinder wall 1117 to form the Helmholtz resonance cavity 200. At this time, a communication hole communicating the Helmholtz resonance cavity 200 with the accommodating cavity 100 may be provided on the inner cylinder wall 1112. Among them, the transition wall 1119 may also be connected between the first outer cylinder wall 1115 and the inner cylinder wall 1112, that is, the second outer cylinder wall 1117 and the first outer cylinder wall 1115 are respectively located on opposite sides of the transition wall 1119 and extend in opposite directions.

[0155] Further, the transition wall 1119 and the cover plate 1120 may be away from each other in the vibration direction of the transducer device 112 to increase the volume of the Helmholtz resonance cavity 200, which is beneficial to the Helmholtz resonance cavity 200 absorbing sound energy in a wider frequency band, that is, the frequency response curve is flatter in a wider frequency band, making the sound quality of the earphone 10 more balanced. For this purpose, the cover plate 1120 may be flush with the second end wall 1114 to increase the Helmholtz resonance cavity 200 in the vibration direction of the transducer device 112; the second outer cylinder wall 1117 may be located on the periphery of the first outer cylinder wall 1115 to increase the Helmholtz resonance cavity 200 in the direction perpendicular to the vibration direction of the transducer device 112, so that the structure of the movement module 11 is more compact. Of course, when the Helmholtz resonance cavity 200 meets the corresponding acoustic requirements, the second outer cylinder wall 1117 may also be located inside the first outer cylinder wall 1115, or overlap with the first outer cylinder wall 1115 in the vibration direction of the transducer device 112. Further, in combination with ​, the transition wall 1119 may include a first sub-transition wall 11191 and a second sub-transition wall 11192. The first sub-transition wall 11191 connects the inner cylinder wall 1112 and the first outer cylinder wall 1115, and the second sub-transition wall 11192 connects the first outer cylinder wall 1115 and the second outer cylinder wall 1117. Among them, the second sub-transition wall 11192 and the first sub-transition wall 11191 are spaced apart in the vibration direction of the transducer device 112, and the second sub-transition wall 11192 is farther away from the middle plate 133 than the first sub-transition wall 11191, that is, closer to the vibration panel 114, so as to make full use of the peripheral area where the flange portion 1163 of the border 116 is located and the height difference in the vibration direction of the transducer device 112 between the border 116 and the fastening positions where the second housing 111b and the first housing 111a are respectively clamped, thereby further increasing the Helmholtz resonance cavity 200 in the vibration direction of the transducer device 112.

[0156] It should be noted that: in some other embodiments where the movement housing 111 does not rotate relative to the adapter housing 13, the first movement housing 111a may not include the cover plate 1120, and one end of the Helmholtz resonance cavity 200 close to the second end wall 1114 may be sealed by the middle plate 133. In some other embodiments where the acoustic cavity is provided as the acoustic filter 300, in combination with ​ , the first movement housing 111a may also not include the cover plate 1120 to allow the sound wave formed by the vibration of the air in the accommodation cavity 100 with the transducer device 112 to be transmitted to the outside of the earphone 10 through the gap between the second outer cylinder wall 1117 and the cylindrical side wall 134 or other paths (such as ​The path shown by the dashed line in the figure). In other words, the acoustic filter 300 described in this application can be formed by enclosing the middle plate 133 and the cylindrical side wall 134 with the second end wall 1114, the inner cylindrical wall 1112, the transition wall 1119, and the second outer cylindrical wall 1117. After the sound waves are absorbed by the acoustic filter 300, they are transmitted to the outside of the earphone 10 through the gap between the cylindrical side wall 134 and the second outer cylindrical wall 1117. At this time, a communication hole for communicating the acoustic filter 300 with the accommodation cavity 100 can be provided on the inner cylindrical wall 1112. Correspondingly, the gap between the middle plate 133 and the second end wall 1114 in the vibration direction of the transducer device 112 can be greater than the gap between the cylindrical side wall 134 and the second outer cylindrical wall 1117 in the direction perpendicular to the vibration direction of the transducer device 112, so that the sound waves formed by the vibration of the air in the accommodation cavity 100 with the transducer device 112 are transmitted to the outside of the earphone 10 through the gap between the second outer cylindrical wall 1117 and the cylindrical side wall 134, and the volume of the acoustic filter 300 is increased to absorb sound energy in a wider frequency band. The gap between the second outer cylindrical wall 1117 and the inner cylindrical wall 1112 in the direction perpendicular to the vibration direction of the transducer device 112 can be greater than the gap between the middle plate 133 and the second end wall 1114 in the vibration direction of the transducer device 112, so as to increase the volume of the acoustic filter 300 by using the space outside the inner cylindrical wall 1112. Further, in some other embodiments such as the movement module 11 not being provided with an acoustic cavity or for example the Helmholtz resonance cavity 200 being provided on the transducer device 112, the first movement housing 111a may also not include the cover plate 1120, and the transition wall 1119 may also be a discontinuous structure, as long as the connection between the first outer cylindrical wall 1115, the second outer cylindrical wall 1117, and the inner cylindrical wall 1112 is satisfied. At this time, the second outer cylindrical wall 1117 may also be located inside the first outer cylindrical wall 1115, or overlap with the first outer cylindrical wall 1115 in the vibration direction of the transducer device 112, so that the structure of the movement module 11 is more compact.

[0157] Combined with ​ 、 ​ and ​ , the earphone 10 may further include a stick microphone assembly 16 connected to a housing, and the stick microphone assembly 16 may also rotate relative to the housing. Among them, when the earphone 10 is not provided with the adapter housing 13, the housing may be the movement housing 111; when the earphone 10 is provided with the adapter housing 13, the housing may be the movement housing 111 or the adapter housing 13. In this embodiment, the housing is taken as the outer housing 135 as an example for illustrative purposes, that is, the stick microphone assembly 16 is connected to the outer housing 135 and can rotate relative to it. Further, the stick microphone assembly 16 may include a sound pickup assembly 161 and a switch assembly 162, and the switch assembly 162 may be provided on the sound pickup assembly 161 to expand the functions of the earphone 10.

[0158] Exemplarily, the sound pickup assembly 161 may include a pivot connection block 1611, a connecting rod 1612, and a sound pickup 1613. The pivot connection block 1611 is used for pivotally connecting with the housing (such as the outer shell 135). For example, a part of the pivot connection block 1611 is embedded in the pivot hole of the outer shell 135. One end of the connecting rod 1612 is connected to the pivot connection block 1611. For example, the two are locked by a locking member 1616. The sound pickup 1613 is arranged at the other end of the connecting rod 1612. Among them, the number of sound pickups 1613 can be one, which is used to collect the user's voice; or it can be two, one for collecting the user's voice and the other for noise reduction. Further, a concave area may be provided on the side of the pivot connection block 1611 facing away from the housing, and the switch assembly 162 may be arranged in the concave area, so that the structure of the earphone 10 is more compact. Among them, the side of the switch assembly 162 facing away from the housing may be (approximately) flush with the pivot connection block 1611. Further, the sound pickup assembly 161 may further include a sealing ring 1614. The sealing ring 1614 may be located around the pivot hole of the outer shell 135 and is arranged between the end face of the pivot connection block 1611 facing the outer shell 135 and the end face of the outer shell 135 facing the pivot connection block 1611. When the microphone assembly 16 is assembled and connected to the outer shell 135, the sealing ring 1614 can be pressed tightly, which is simple and reliable.

[0159] Combined with ​ , a boss 1615 is provided at the bottom of the concave area. An annular groove is formed between the outer peripheral wall of the boss 1615 and the side wall of the concave area. Correspondingly, the switch assembly 162 may include a switch circuit board 1621, an elastic support member 1622, and a button 1623. The switch circuit board 1621 is coupled to the main board 15 and may be arranged on the top of the boss 1615. The elastic support member 1622 is connected to the side wall and / or the bottom of the concave area on the pivot connection block 1611 and is used to support the button 1623. The button 1623 may be oppositely arranged with the switch circuit board 1621 (such as the tactile switch thereon) in a preset pressing direction to receive the pressing force applied by the user and trigger the switch circuit board 1621 through the elastic support member 1622. Among them, the elastic support member 1622 may include an annular fixing portion 1624 and an elastic support portion 1625. The annular fixing portion 1624 is fixed in the annular groove. The elastic support portion 1625 is connected to the annular fixing portion 1624 and may be arranged in a dome shape, so that the elastic support portion 1625 can deform relative to the annular fixing portion 1624 under an external force and then approach the switch circuit board 1621 to generate a displacement. At this time, the button 1623 may be arranged on the elastic support portion 1625. Among them, the button 1623 may include a key cap and a key rod connected to the key cap. The key cap is supported on the elastic support portion 1625, and the key rod is embedded in a preset blind hole of the elastic support portion 1625.

[0160] The annular fixing portion 1624 and the elastic support portion 1625 can be integrally provided, such as a silicone member. At this time, the switch assembly 162 can further include a reinforcing ring 1626. The reinforcing ring 1626 is disposed along the circumference of the annular fixing portion 1624 and is fixedly connected to the pivot connection block 1611. For example, the reinforcing ring 1626 is sleeved on the outer periphery of the annular fixing portion 1624, and the outer peripheral wall of the reinforcing ring 1626 is fixedly connected to the side wall of the concave area (such as snap connection). In this way, when the user presses the switch assembly 162, the periphery of the elastic support portion 1625 can deform uniformly relative to the annular fixing portion 1624, thereby increasing the reliability and pressing feel of the switch assembly 162. Among them, the reinforcing ring 1626 can be a metal member or a hard plastic member. In addition, since the volume of the concave area on the pivot connection block 1611 is limited, the area of the bottom of the annular groove is also limited accordingly. The elastic support member 1622 is connected to the pivot connection block 1611 laterally through the reinforcing ring 1626, which is beneficial to improving the reliability of the connection between the two. Of course, if the volume of the concave area on the pivot connection block 1611 is large enough, so that the area of the bottom of the annular groove is also large enough, the elastic support member 1622 can also be directly connected to the bottom of the annular groove without the reinforcing ring 1626.

[0161] It should be noted that in some other embodiments where the stick microphone assembly 16 is not provided in the earphone 10, the switch assembly 162 can also be directly disposed on a housing of the earphone 10 (such as the movement housing 111 or the outer shell 135).

[0162] Furthermore, the switch assembly 162 can further include a hard gasket 1627 connected to the elastic support member 1622. For example, the hard gasket 1627 is a hard plastic member such as PET and is connected to the elastic support portion 1625, so that the elastic support member 1622 triggers the tactile switch through the hard gasket 1627, thereby preventing the tactile switch on the switch circuit board 1621 from piercing the elastic support member 1622 and increasing the reliability of the switch assembly 162.

[0163] In the long-term R & D process, the inventors of the present application found that: during the process of the transducer device 112 generating mechanical vibration, it will drive the elastic support member 1622 connected to the housing (such as the movement housing 111 or the outer shell 135) to vibrate, and then drive the connected button 1623 and the hard gasket 1627, etc. to vibrate together. Generally, it includes various vibration modes such as up-and-down vibration and rocking vibration. Among them, during up-and-down vibration, the hard gasket 1627 may directly collide with the tactile switch on the switch circuit board 1621 to generate noise; during rocking vibration, the hard gasket 1627 may have relative sliding friction with the tactile switch on the switch circuit board 1621, and then trigger up-and-down vibration, generating a harmonic sound that is an integer multiple of the vibration frequency of the transducer device 112, that is, noise. Therefore, the following embodiments are proposed in the present application to improve the noise problem of the earphone 10.

[0164] In some embodiments, in combination with ​ , in the non-pressing state, the gap between the hard gasket 1627 and the tactile switch on the switch circuit board 1621 in the pressing direction (such as ​ shown as W in can be greater than the relative amplitude of the button assembly vibrating relative to the housing (such as the movement housing 111 or the outer shell 135) at 1 kHz. The aforementioned relative amplitude is also the absolute value of the difference between the amplitude of the button assembly vibrating at 1 kHz and the amplitude of the housing (such as the movement housing 111 or the outer shell 135) vibrating at 1 kHz, so as to avoid the hard gasket 1627 colliding with the tactile switch to generate noise, thereby increasing the reliability of the earphone 10. Among them, the button assembly described in the present application may include an elastic support member 1622 and the hard gasket 1627 connected thereto, and may also include the button 1623 connected thereto. Further, the gap between the hard gasket 1627 and the tactile switch in the pressing direction may be between 0.05 mm and 0.4 mm; preferably, the aforementioned gap may be between 0.1 mm and 0.3 mm. In this way, after the button assembly is assembled to the housing (such as the movement housing 111 or the outer shell 135), there is an assembly gap greater than or equal to 0.05 mm between the two.

[0165] It should be noted that: since the button assembly and the housing (such as the movement housing 111 or the outer housing 135) vibrate following the vibration of the transducer device, the relative vibration amplitude described above can be measured in the following manner: 1) Fix the head beam assembly 12 so that the movement module 11 is in a cantilever state. For example, the head beam assembly 12 is fixed on the fixing table of the laser vibrometer, and the movement module 11 is in a cantilever state relative to the fixing point of the head beam assembly 12; 2) In the aforementioned cantilever state, the vibration displacement of the button assembly and the housing (such as the movement housing 111 or the outer housing 135) can be measured based on the laser triangulation method, and then the frequency response curves of the vibrations of the two can be obtained (the abscissa represents the frequency, with the unit of Hz; the ordinate represents the amplitude, with the unit of mm); specifically, the laser vibrometer can emit a first laser signal to a first test point such as the centroid or geometric center on the button assembly (such as the button 1623). The first laser signal can include a swept-frequency signal with a frequency range of 20 - 20000 Hz generated by a distortion analyzer. The first laser signal can be focused on the aforementioned first test point at a first angle (such as 90°). The laser vibrometer can image the laser spot formed on the aforementioned first test point at a second angle, that is, the second laser signal formed after the first laser signal is reflected or scattered by the button assembly (such as the button 1623) can be collected by a laser receiver such as a CCD. Among them, compared with the non-vibrating natural state, the relative position of the aforementioned first test point changes during the vibration of the button assembly (such as the button 1623), that is, the relative position of the laser spot changes, causing the second angle to change accordingly, and the imaging position of the laser spot on the laser receiver changes, and the vibration displacement of the button assembly (such as the button 1623) at different times is calculated, and then the frequency response curve of the vibration of the button assembly (such as the button 1623) is obtained; similarly, the laser vibrometer can emit a first laser signal to any second test point within 2 mm from the edge of the housing (such as the movement housing 111 or the outer housing 135) to the button assembly (such as the button 1623), ……, and calculate the vibration displacement of the housing (such as the movement housing 111 or the outer housing 135) at different times, and then obtain the frequency response curve of the vibration of the housing (such as the movement housing 111 or the outer housing 135). Among them, the frequency response curves of the vibrations of the button assembly (such as the button 1623) and the housing (such as the movement housing 111 or the outer housing 135) can be measured simultaneously or successively. Based on this, read the amplitude corresponding to 1 kHz on the frequency response curves of the two, take the absolute value after taking the difference, and the corresponding relative vibration amplitude can be obtained.

[0166] In some other embodiments, in combination with ​In the non-pressed state, the touch switch on the switch circuit board 1621 can partially extend into the blind hole preset in the hard gasket 1627 to prevent the hard gasket 1627 and the touch switch from sliding relative to each other, thereby avoiding the key assembly from generating noise due to swing vibration, thereby increasing the reliability of the earphone 10. As an example, when the key assembly and the touch switch follow the vibration of the transducer device 112, the touch switch and the key assembly keep moving, that is, the hard gasket 1627 and the touch switch are unlikely to slide relative to each other. Furthermore, the inner surface of the blind hole can be set to a rough surface; and / or, the outer surface of the touch switch that contacts the inner surface of the blind hole can also be set to a rough surface to increase static friction or dynamic friction, which can also improve noise.

[0167] It should be noted that the aforementioned "maintaining tracking" can be defined as: measuring the vibration frequency response curve of the tactile switch and key assembly using the aforementioned laser triangulation method, where the vertical axis of the frequency response curve can be further converted from "mm" to "dB," and determining that the difference in maximum vibration amplitude between the two components is less than or equal to 3dB, and that the phase difference between the two components is less than or equal to 90°. Therefore, in embodiments where the tactile switch on the switch circuit board 1621 extends into the blind hole defined in the hard gasket 1627, during the process of the key assembly and the tactile switch following the vibration of the transducer device 112, there may be a certain frequency point or frequency range where the tactile switch and key assembly do not maintain tracking, such as a relative motion with very small amplitude.

[0168] Furthermore, when viewed along the pressing direction of the switch assembly 162 , the button assembly can be configured as a non-circular structure to prevent the button assembly from swinging and vibrating along with the transducer device 112 .

[0169] Combine ​ 、 ​ and ​ The earphones 10 may further include a functional component 17 connected to the housing, allowing the user to control the earphones 10 via the functional component 17. When the earphones 10 do not include the adapter housing 13, the housing may be the core housing 111; when the earphones 10 include the adapter housing 13, the housing may be either the core housing 111 or the adapter housing 13. This embodiment uses the housing 135 as an example for illustrative description, and the functional component 17 may be mounted within the recessed area of the housing 135.

[0170] Exemplarily, the functional component 17 may include a first circuit board 171, a second circuit board 172, an encoder 173, a tactile switch 174, and a function key 175. The first circuit board 171 and the second circuit board 172 are stacked, and are respectively coupled to the main board 15. The encoder 173 is disposed on the first circuit board 171, and the tactile switch 174 is disposed on the second circuit board 172 and located on the side of the second circuit board 172 facing the first circuit board 171. The function key 175 may include a keycap 1751 and a key rod 1752 connected to the keycap 1751. The keycap 1751 is located on the side of the first circuit board 171 facing away from the second circuit board 172, and the free end of the key rod 1752 away from the keycap 1751 is disposed opposite to the tactile switch 174. The encoder 173 is sleeved on the key rod 1752. Wherein, when the user rotates the key rod 1752 through the keycap 1751, the key rod 1752 drives the encoder 173 to generate a first input signal; and when the user presses the key rod 1752 through the keycap 1751, the key rod 1752 triggers the tactile switch 174 to generate a second input signal. Thus, the user can perform two operations of rotation and pressing through one function key, thereby performing two controls on the earphone 10, which can not only expand the functions of the earphone 10, but also simplify the structure of the earphone 10. Further, the first input signal is used to control the volume increase / decrease of the earphone 10; and / or, the second input signal is used to control any one of play / pause, song skipping, device pairing, power on / off of the earphone 10.

[0171] In combination ​ , the housing (such as the outer shell 135) may include a first cylinder 1351. The first circuit board 171 and the second circuit board 172 are stacked along the axial direction of the first cylinder 1351 (parallel to the preset pressing direction of the function key 175) and disposed in the first cylinder 1351. Wherein, the side of the keycap 1751 facing away from the key rod 1752 may be (approximately) flush with the first cylinder 1351. Further, the functional component 17 may further include an adapter ring 176 sleeved on the periphery of the first cylinder 1351. The adapter ring 176 is axially limited along the first cylinder 1351 and can rotate around the axial direction of the first cylinder 1351. At this time, the keycap 1751 may be fixedly disposed on the adapter ring 176, and the key rod 1752 may be inserted into the first cylinder 1351 along the axial direction of the first cylinder 1351, so as to facilitate the function key 175 to perform two operations of rotation and pressing.

[0172] It should be noted that: A plurality of limit posts may be provided at the bottom of the first cylinder 1351, which are spaced along the rotation direction of the function key 175 (i.e., around the pressing direction of the function key 175). The first circuit board 171 and the second circuit board 172 are sequentially and spacedly sleeved on the limit posts, so as to prevent the user from driving the first circuit board 171 to rotate further when rotating the key rod 1752 through the keycap 1751 and then driving the encoder 173 to rotate, that is, to keep the first circuit board 171 relatively stationary in the rotation direction of the function key 175. Further, the limit post may include a first limit section and a second limit section connected integrally. The first limit section is farther from the bottom of the first cylinder 1351 than the second limit section, and the radial dimension of the first limit section is smaller than that of the second limit section, so as to form a bearing surface on the limit post, and the first circuit board 171 is supported on the bearing surface, so as to prevent the user from driving the first circuit board 171 to move towards the second circuit board 172 when pressing the key rod 1752 through the keycap 1751, that is, to keep the first circuit board 171 relatively stationary in the pressing direction of the function key 175, and further maintain the distance between the first circuit board 171 and the second circuit board 172 in the pressing direction of the function key 175.

[0173] Further, a first buckle 1352 is provided on the outer peripheral wall of the first cylinder 1351. The adapter ring 176 may include a second cylinder 1761, and a second buckle 1762 is provided on the inner peripheral wall of the second cylinder 1761. The first buckle 1352 and the second buckle 1762 are engaged with each other to limit the adapter ring 176 from moving in the opposite direction of the insertion direction of the key rod 1752 relative to the first cylinder 1351, thereby preventing the adapter ring 176 from falling off the first cylinder 1351 and increasing the reliability of the earphone 10.

[0174] It should be noted that: The first cylinder 1351 and the first buckle 1352 thereon are discontinuous in the circumferential direction of the first cylinder 1351, which is shown as ​ and ​ in that a part of the first cylinder 1351 has hatching while the other part and the connected first buckle 1352 do not have hatching. When the adapter ring 176 is engaged with the housing 135, the first buckle 1352 gathers towards the center of the first cylinder 1351 to allow the second buckle 1762 and the first buckle 1352 to cross each other and then be engaged.

[0175] Furthermore, a first flange 1353 may be provided on the outer peripheral wall of the first cylinder 1351, and a second flange 1763 may be provided on the outer peripheral wall of the second cylinder 1761. The first flange 1353 is used to support the second flange 1763 to limit the movement of the adapter ring 176 along the insertion direction of the key rod 1752 relative to the first cylinder 1351, that is, to control the stroke of the user pressing the key rod 1752 through the key cap 1751, thereby preventing the key rod 1752 from crushing the touch switch 174, thereby increasing the reliability of the headset 10.

[0176] Furthermore, the keycap 1751 may include a third barrel 1753 and an end plate 1754 connected to the third barrel 1753. The third barrel 1753 may be sleeved around the outer periphery of the second barrel 1761, with one end of the third barrel 1753 supported on the side of the second flange 1763 facing away from the first flange 1353, thereby increasing the reliability of the connection between the keycap 1751 and the adapter ring 176. In this case, the end plate 1754 is disposed at the other end of the third barrel 1753, and the key rod 1752 is disposed on the end plate 1754.

[0177] The above descriptions are only some embodiments of the present application and do not limit the scope of protection of the present application. Any equivalent device or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the scope of patent protection of this application.

Claims

1. A kind of earphone, characterized in that, The earphone includes a movement module, a switch circuit board, and a button assembly. The movement module includes a movement housing and a transducer disposed in a receiving cavity of the movement housing. The switch circuit board is connected to the movement housing. The button assembly is disposed opposite to the switch circuit board in a preset pressing direction, and includes an elastic support member and a rigid gasket. The elastic support member is connected to the movement housing, and the rigid gasket is connected to the elastic support member. The elastic support member triggers a tactile switch on the switch circuit board through the rigid gasket under the action of a pressing force applied by a user. Wherein, in a non-pressed state, a gap between the rigid gasket and the tactile switch in the pressing direction is greater than a relative amplitude of the button assembly vibrating relative to the movement housing at 1 kHz.

2. The earphone according to claim 1, wherein The gap between the rigid gasket and the tactile switch in the pressing direction is greater than or equal to 0.05 mm and less than or equal to 0.4 mm.

3. The earphone according to claim 2, characterized in that, The gap between the rigid gasket and the tactile switch in the pressing direction is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.

4. The earphone according to claim 1, wherein Viewed along the pressing direction, the button assembly is arranged in a non-circular structure.

5. The earphone according to claim 1, wherein The movement module further includes a first vibration transmission sheet, a vibration panel, and a connecting member. The transducer is suspended in the receiving cavity of the movement housing through the first vibration transmission sheet. The movement housing includes an inner cylindrical wall, a first end wall and a second end wall respectively connected to two ends of the inner cylindrical wall. The first end wall and the second end wall are respectively located on opposite sides of the transducer in the vibration direction of the transducer, and enclose the receiving cavity with the inner cylindrical wall. The first end wall is provided with a mounting hole. The vibration panel is located outside the movement housing and is used for contacting the skin of a user. One end of the connecting member is connected to the vibration panel, and the other end extends into the movement housing through the mounting hole and is connected to the transducer. Wherein, viewed along the vibration direction, an area of the vibration panel is greater than an area of the mounting hole, and the area of the mounting hole is greater than an area of the connecting member.

6. The earphone according to claim 5, characterized in that, The receiving cavity is only communicated with the outside of the earphone through a channel, and the channel is a gap between the connecting member and a wall surface of the mounting hole. Alternatively, the receiving cavity is only communicated with the outside of the earphone through a first channel and a second channel. The first channel is a gap between the connecting member and a wall surface of the mounting hole, and the second channel is communicated with the outside of the earphone through a sound filter.

7. The earphone according to claim 5, wherein Viewed along the vibration direction, a ratio between an area of the mounting hole and an area of the first end wall is less than or equal to 0.

6.

8. The earphone according to claim 5, characterized in that, Viewed along the vibration direction, a ratio between a difference between an area of the mounting hole and an area of the connecting member and the area of the mounting hole is greater than 0 and less than or equal to 0.

5.

9. The earphone according to claim 5, wherein In the vibration direction, the thickness of the vibration panel is between 0.3 mm and 3 mm; and / or, the gap between the vibration panel and the first end wall is between 0.5 mm and 3 mm; and / or, the distance between the side of the first end wall facing away from the second end wall and the side of the second end wall facing away from the first end wall is between 6 mm and 16 mm.

10. The earphone according to claim 5, wherein The side of the vibration panel facing away from the transducer device includes a skin contact area for contacting the skin of the user and an air conduction enhancement area that is at least partially not in contact with the skin of the user. The vibration panel drives the air outside the earphone to vibrate through the air conduction enhancement area to form sound waves.

11. The earphone according to claim 10, characterized in that, At least a part of the air conduction enhancement area is inclined relative to the skin contact area and extends toward the transducer device, and the inclination angle of the air conduction enhancement area relative to the skin contact area is between 0 and 75°; and / or, the width of the orthographic projection of the air conduction enhancement area along the vibration direction is greater than or equal to 1 mm.

Images